JP2012195526A - Teaching system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problems of a teaching method according to the prior art that a long time is required and the work accompanied by a change in air pressure is inefficient because the operation of adjusting the position, evacuating a process chamber, confirming the misalignment by means of a microscope, returning the process chamber to the atmospheric state, and then adjusting the position again is repeated, and that the error is large in the visual inspection by a user using the microscope.SOLUTION: A CCD camera 31 is used in place of a microscope, a first image marker A corresponding to the reference position of a heater is used, and a second image marker B provided on a corresponding adapter ring adjustment jig 17 is used in place of the center position of a shadow ring 18. The position of the adapter ring adjustment jig 17 is adjusted by measuring these two image markers A and B by means of the CCD camera 31.

Description

  The present invention relates to a teaching system that performs teaching for adjusting the positional relationship between a heater and a shadow ring of a CVD apparatus, and a teaching method using the teaching system.

  As a method for forming a tungsten film on a semiconductor wafer, a CVD (Chemical Vapor Deposition) method is known. For example, in one type of CVD apparatus called “CENTURA-WXZ”, a semiconductor wafer is first transferred onto a heater whose temperature is controlled to 450 ° C. Next, a tungsten film is formed on the semiconductor wafer using a process gas containing SiH4 (silicon hydride), H2 (hydrogen molecules), and WF6 (tungsten hexafluoride).

  At this time, it is preferable not to form a tungsten film on the outermost peripheral portion of the semiconductor wafer. For this purpose, a technique of masking the outermost peripheral portion of the semiconductor wafer using a shadow ring or the like is known.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a CVD apparatus 10 according to the prior art. 1 has a heater 11 that supports and heats a semiconductor wafer 50 from the lower surface, a shadow ring 18 that masks the outermost periphery of the semiconductor wafer 50, and a process gas 52 that is directed toward the upper surface of the semiconductor wafer 50. And a face plate 19 to be blown out. Here, the heater 11, the shadow ring 18, and the face plate 19 are provided inside the process chamber 22.

  In the CVD apparatus 10 of FIG. 1, a tungsten film 51 is formed on a portion of the upper surface of the semiconductor wafer 50 other than the outermost peripheral portion masked by the shadow ring 18. At this time, it is preferable that the center of the semiconductor wafer 50 coincides with the center of the shadow ring 18. Teaching to perform this alignment will be described.

  FIG. 2A is a plan view schematically showing a configuration of a CVD apparatus 10 that performs a teaching method according to the prior art. FIG. 2B is a cross-sectional view taken along a section A-A ′ schematically showing the configuration of the CVD apparatus 10 that performs the teaching method according to the prior art. 2A and 2B also show an adapter ring 15, an adapter ring adjustment block 13, and a pumping plate 12 in addition to the components of the CVD apparatus 10 shown in FIG. However, in FIG. 2A, the heater 11, the semiconductor wafer 50, and the face plate 19 are omitted. In FIG. 2B, the face plate 19 is omitted.

  The shadow ring 18 is held by the adapter ring 15 and the pumping plate 12. The position of the shadow ring 18 is determined by the adapter ring 15.

  A teaching method performed by the CVD apparatus 10 of FIGS. 2A and 2B will be described. First, the adapter ring adjustment jig 17 is placed on the adapter ring 15 before the semiconductor wafer 50 is placed on the heater 11 and with the shadow ring 18 removed. FIG. 3 is a cross-sectional view taken along the section B-B ′ showing a state in which the adapter ring adjustment jig 17 is placed on the adapter ring 15 in the CVD apparatus 10 that performs the teaching method according to the prior art. FIG. 4 is a plan view showing a state in which the adapter ring adjusting jig is placed on the adapter ring in the CVD apparatus 10 that performs the teaching method according to the prior art.

  Next, the inside of the process chamber 22 is evacuated. In this state, the distances L1 to L4 shown in FIG. 3 between the end of the circular portion of the adapter ring adjusting jig 17 viewed from the top and the inner end of the purge ring 21 are measured. This measurement is performed at four locations using, for example, a microscope with a magnification of 20 times. For example, as shown in FIG. 4, these four measurement points are 90 mm in the upper right direction, the lower right direction, the lower left direction, the upper left direction and the like when viewed from the center point of the position where the semiconductor wafer 50 is placed on the heater 11. They are arranged at the same angle every °.

  After the measurement at four locations, the inside of the process chamber 22 is returned to the atmospheric pressure state. In this state, the position of the adapter ring adjustment jig 17 is adjusted. Thereafter, measurement and adjustment are repeated until the standard for each heater is satisfied. The standard includes, for example, that the difference between the minimum value and the maximum value in these four measured values is within 0.075 mm.

  In relation to the above, Patent Document 1 (Japanese Patent Laid-Open No. 8-255760) discloses a description relating to an apparatus for processing a substrate having a certain diameter. The apparatus includes a housing, a susceptor, a susceptor limiting shield, and a susceptor elevator. Here, the housing defines a substrate processing chamber. A susceptor is disposed in the chamber for receiving and supporting a substrate with an exposed surface for processing and has a diameter larger than the diameter of the substrate. The susceptor limiting shield includes a main body and a roof that projects to the annular periphery of the susceptor. The body defines a first susceptor receiving hole formed therein with a dimension to receive the susceptor. The roof defines a second hole having a diameter that is larger than the diameter of the substrate. The susceptor elevator includes a first susceptor along a symmetrical axis perpendicular to the exposed surface of the substrate with respect to the shield such that the substrate supported in the center of the susceptor is exposed to the processing environment through the second hole. Move to the hole and engage the protruding roof.

  Patent Document 2 (Japanese Patent Laid-Open No. 11-80950) discloses a description relating to a method for aligning wafers in a vacuum chamber. The method includes introducing the wafer into a vacuum chamber, increasing the pressure in the vacuum chamber, and then moving and aligning the wafer.

  Patent Document 3 (Japanese Patent Laid-Open No. 2000-183141) discloses a description relating to an apparatus for protecting and aligning a substrate. The apparatus is characterized by comprising a shadow ring and one or more alignment and support members. Here, the shadow ring has an upper protective surface. One or more alignment and support members are disposed below the upper protective surface for alignment at least between the substrate and the shadow ring.

  Patent Document 4 (Japanese Patent Laid-Open No. 2002-9136) discloses a description relating to an alignment device for concentrically aligning a shadow ring on a substrate support member and a substrate in a substrate processing system. . The alignment apparatus includes a support member, one or more common guide members, and a shadow ring. Here, the one or more common guide members are adapted to receive both the edge of the substrate and the guide surrounding portion of the shadow ring. The shadow ring defines one or more lower surfaces for receiving one or more guide members. The guide surrounding portion of the shadow ring is shielded from the process gas guided from above the shadow ring toward the shadow ring.

  Patent Document 5 (Japanese Patent Application Laid-Open No. 2004-50306) discloses a description relating to a transfer robot system. This transfer robot system includes a robot that has a placement unit on which an object having a thin shape is placed, and that transports the object, and a robot controller that controls the robot. The transfer robot system includes a jig, an image processing unit, and a host control unit. Here, the jig is mounted on the placement unit of the robot and has an imaging unit. The image processing unit processes the image captured by the imaging unit. The host control unit controls the robot controller and the image processing unit from the host.

  Patent Document 6 (Japanese Patent Laid-Open No. 2007-527628) discloses a description relating to a method of chemical vapor deposition of a material on a workpiece. The method features a diagonal overhang covering the edge region of the substrate supported in the processing chamber, extending beyond the edge region by a distance between about 0.8 and 2.0 mm, and about 0.0045 inches. Energizing the shadow ring away from the edge region by a gap of ± 0.003 inches, flowing the process gas into the chamber, and the reaction of the process gas results in material deposition outside the edge region. Applying to the chamber and generating a plasma therein.

JP-A-8-255760 Japanese Patent Laid-Open No. 11-80950 JP 2000-183141 A JP 2002-9136 A JP 2004-50306 A JP 2007-527628 A

  When masking the outermost peripheral portion of the semiconductor wafer 50 using the shadow ring 18, it is necessary to perform teaching that matches the center of the shadow ring 18 with the center of the semiconductor wafer 50. Needless to say, this teaching is preferably performed accurately and efficiently.

  However, in the teaching method according to the conventional technique described above, the following problems occur. That is, in the process of teaching the transfer position of the semiconductor wafer 50 to the center of the heater 11, an error such as a backside pressure error or a deformation of the heater may occur.

  Even with the teaching method according to the prior art, it is possible to surely detect the deviation in the transfer position of the semiconductor wafer. However, the repetition of adjusting the position, making the process chamber in a vacuum state, checking the position shift, returning the process chamber to the atmospheric state, and adjusting the position requires a long time. Work involving changes in atmospheric pressure is inefficient. Further, the visual inspection of the operator using a microscope has a relatively large error.

  The means for solving the problem will be described below using the numbers used in the (DETAILED DESCRIPTION). These numbers are added to clarify the correspondence between the description of (Claims) and (Mode for Carrying Out the Invention). However, these numbers should not be used to interpret the technical scope of the invention described in (Claims).

  A teaching system according to the present invention includes a CVD apparatus (10), a heater unit (11, A), a CVD processing mask unit (17, B), a CCD camera (31), an image teaching unit (40), And adjustment units (13, 14). Here, the CVD apparatus (10) has a heater (11) for placing the semiconductor wafer (50) and an adapter ring (15) for supporting the CVD processing mask (18). In the heater section (11, A), a first position which is a reference point in the heater (11) is indicated by a first image marker (A). In the CVD processing mask portion (17, B), the second position where the CVD processing mask (18) is arranged is indicated by the second image marker (B). The CCD camera (31) individually captures the first image marker (A) arranged at the first position and the second image marker (B) arranged at the second position. The image teaching unit (40) stores the first position and calculates the deviation between the first position and the second position. The adjustment units (13, 14) adjust the position of the adapter ring (15) in a direction to eliminate the deviation when the deviation is deviated from a predetermined reference.

  The teaching method according to the present invention includes a step (S1, S1 ′) in which a first position which is a reference point in the heater (11) of the CVD apparatus (10) is indicated by a first image marker (A), Steps (S2 to S4) for photographing the first image marker (A) arranged at the position with the CCD camera (31), steps for storing the first position (S3), and an adapter for the CVD apparatus (10) A step (S6) indicated by a second image marker (B) showing a second position where the CVD processing mask (18) is arranged connected to the ring (15), and a second position arranged at the second position. A step (S7) of photographing the second image marker (B) with the CCD camera (31), a step (S8) of calculating a deviation between the first position and the second position, and the deviation deviates from a predetermined reference. If you have The position of the-ring (15) comprises a step (S9, S10) for adjusting the direction to eliminate the deviation.

  In the teaching system and the teaching method of the present invention, the CCD camera 31 is used instead of the microscope, the first image marker A that is the reference point of the heater 11 is used, and the adapter ring adjustment corresponding to the center position of the shadow ring 18 is used. A second image marker B provided on the jig 17 is used. By measuring these two image markers A and B with the CCD camera 31 and adjusting the position of the adapter ring adjustment jig 17, the problems of the prior art are solved.

FIG. 1 is a cross-sectional view schematically showing the structure of a conventional CVD apparatus. FIG. 2A is a plan view schematically showing the configuration of a CVD apparatus that performs a teaching method according to the prior art. FIG. 2B is a cross-sectional view taken along a section A-A ′ schematically showing the configuration of a CVD apparatus that performs the teaching method according to the prior art. FIG. 3 is a cross-sectional view taken along a section B-B ′ showing a state in which an adapter ring adjustment jig is placed on the adapter ring in a CVD apparatus that performs the teaching method according to the prior art. FIG. 4 is a plan view showing a state in which an adapter ring adjustment jig is placed on an adapter ring in a CVD apparatus that performs a teaching method according to the prior art. FIG. 5 is an overall view schematically showing the configuration in the first state of the teaching system according to the first embodiment of the present invention. FIG. 6 is a plan view partially showing the configuration in the first state of the CVD apparatus according to the first embodiment of the present invention. FIG. 7 is a front view showing a connection method of the heater 11 and the reference jig in the first embodiment of the present invention. FIG. 8 is an overall view schematically showing a configuration in the second state of the teaching system according to the first embodiment of the present invention. FIG. 9 is a plan view partially showing the configuration of the CVD apparatus according to the first embodiment of the present invention in the second state. FIG. 10A is the first half of a flowchart showing the steps of the teaching method according to the first embodiment of the present invention. FIG. 10B is the second half of the flowchart showing the steps of the teaching method according to the first embodiment of the present invention. FIG. 11 is an image diagram showing a display example of the image display unit according to the first embodiment of the present invention. FIG. 12 is an overall view schematically showing the configuration of the teaching system according to the second embodiment of the present invention in the first state. FIG. 13 is a plan view partially showing the configuration in the first state of the CVD apparatus according to the second embodiment of the present invention. FIG. 14A is the first half of a flowchart showing the steps of the teaching method according to the second embodiment of the present invention. FIG. 14B is the latter half of the flowchart showing the steps of the teaching method according to the second embodiment of the present invention.

  With reference to the accompanying drawings, a mode for carrying out a teaching system and a teaching method according to the present invention will be described below.

(First embodiment)
FIG. 5 is an overall view schematically showing the configuration in the first state of the teaching system according to the first embodiment of the present invention. The teaching system shown in FIG. 5 roughly includes a CVD apparatus 10, a CCD camera unit 30, and an image teaching unit 40. The CCD camera unit 30 includes a CCD camera 31 and a camera stand 32. The image teaching unit 40 includes an image display unit 41 and a numerical value display unit 42 as output units. The image teaching unit 40 further includes an input unit, a calculation unit, a storage unit, and the like (not shown).

  FIG. 6 is a plan view partially showing the configuration in the first state of the CVD apparatus 10 according to the first embodiment of the present invention. The CVD apparatus 10 in FIG. 6 includes a pumping plate 12 as a base portion, three adapter ring adjustment blocks 13, three adjustment screws 14, and an adapter ring 15. The CVD apparatus 10 further includes a heater 11, a face plate 19, a process chamber 22, and the like (not shown). The adapter ring 15 includes three convex portions 151. The heater 11 includes four lift pins for moving the semiconductor wafer 50 up and down, and four lift pin holes 112 for moving the four lift pins up and down. In the first state shown in FIG. 6, the reference jig 16 is installed on the heater 11. The reference jig 16 includes four convex portions 161 that can be respectively inserted into the four lift pin holes 112.

  A first image marker A is provided at the center of the reference jig 16. As long as the first image marker A can be optically photographed by the CCD camera 31, the material and shape thereof are not particularly limited.

  Note that the total number of these components is merely an example and does not limit the present invention. However, the total number of the adapter ring adjustment block 13, the convex portion 151 of the adapter ring 15, and the lift pin holes 112 is preferably three or more. The total number of adjusting screws 14 is preferably equal to the total number of adapter ring adjusting blocks 13.

  FIG. 7 is a front view showing a connection method of the heater 11 and the reference jig 16 in the first embodiment of the present invention. When the reference jig 16 is put on the heater 11, the positional relationship of the reference jig 16 with respect to the heater 11 is uniquely determined by fitting the four convex portions 161 into the four lift pin holes 112, respectively. And As a result, the positional relationship between the first image marker A provided on the reference jig 16 and the heater 11 is also uniquely determined. Furthermore, it is guaranteed as a standard of the CVD apparatus that the position of the semiconductor wafer 50 placed on the heater 11 during the CVD process is within a predetermined error range, so that the first image marker A and the semiconductor wafer 50 It is guaranteed that the positional relationship is within another error range. Based on such conditions, in the present embodiment, the first image marker A is used for measurement as a reference point of the heater 11. Note that the center point is preferably used as the reference point of the heater 11.

  The position of the first image marker A is measured by the CCD camera 31. The CCD camera 31 is connected to a camera stand 32, and the camera stand 32 is preferably fixed directly or indirectly to the main body portion of the process chamber 20. Here, it is preferable that the position and photographing direction of the CCD camera 31 are adjustable. However, the position and shooting direction of the CCD camera 31 are fixed with sufficient accuracy until the measurement of the position of the second image marker B, which will be described later, is completed after the measurement of the position of the first image marker A. Shall. The output unit of the CCD camera 31 is connected to the input unit of the image teaching unit 40.

  FIG. 8 is an overall view schematically showing a configuration in the second state of the teaching system according to the first embodiment of the present invention. The configuration in the second state shown in FIG. 8 is equal to the configuration in the first state shown in FIG. 5 with the following modifications. That is, instead of the reference jig 16 shown in FIG. 5, an adapter ring adjustment jig 17 is installed in the CVD apparatus 10 in FIG. 8. Since other configurations in the CVD apparatus 10, the CCD camera unit 30, and the image teaching unit 40 in FIG. 8 are the same as those in FIG. 5, further detailed description is omitted.

  FIG. 9 is a plan view partially showing the configuration of the CVD apparatus 10 according to the first embodiment of the present invention in the second state. The CVD apparatus 10 in the second state shown in FIG. 9 is equivalent to the CVD apparatus 10 in the first state shown in FIG. 6 with the following modifications. That is, in FIG. 6, the reference jig 16 is installed on the heater 11, but in FIG. 9, the adapter ring adjustment jig 17 is installed on the adapter ring 15 instead.

  Here, the adapter ring adjustment jig 17 includes three brim-shaped support portions 171 and three hole portions 172. Each of these three hole portions 172 is provided on each of the three brim-shaped support portions 171. The total number of the brim-shaped support portions 171 and the total number of the hole portions 172 are preferably equal to the total number of convex portions in the adapter ring 15, but the present invention is not limited thereto.

  Since the other configuration of the CVD apparatus 10 in FIG. 9 is the same as that in FIG. 6, further detailed description is omitted.

  FIG. 3B is a front view showing a connection method of the adapter ring 15 and the adapter ring adjusting jig 17 in the first embodiment of the present invention. When the adapter ring adjustment jig 17 is placed on the adapter ring 15, the three convex portions 151 are fitted into the three holes 172, respectively, so that the positional relationship of the adapter ring adjustment jig 17 with respect to the adapter ring 15 is unambiguous. Shall be determined automatically. As a result, the positional relationship between the second image marker B provided on the adapter ring adjustment jig 17 and the adapter ring 15 is also uniquely determined.

  In addition, the collar-shaped support part 171 and the hole part 172 in the adapter ring adjustment jig 17 have the same shape as the collar-shaped support part 181 and the hole part 182 in the shadow ring 18 used as a mask during the CVD process, respectively. Is formed. Therefore, the positional relationship between the second image marker B in the second state and the shadow ring 18 during the CVD process is also uniquely determined. Based on such conditions, in this embodiment, the second image marker B is used for measurement instead of the shadow ring 18.

  The operation of the teaching system according to the present embodiment, that is, the teaching method according to the present embodiment will be described. FIG. 10A is the first half of a flowchart showing the steps of the teaching method according to the first embodiment of the present invention. FIG. 10B is the second half of the flowchart showing the steps of the teaching method according to the first embodiment of the present invention. The flowcharts of FIGS. 10A and 10B are connected at point A, and include first to tenth steps S1 to S10.

  First, the first step S1 is executed. In the first step S <b> 1, the reference jig 16 is installed on the heater 50. Here, the reference jig 16 is provided with a first image marker A in advance. In addition, the 1st state shown in FIG.5, FIG6 and FIG.7 respond | corresponds to 1st step S1 and 2nd-4th step S2-S4 mentioned later. Following the first step S1, a second step S2 is performed.

  In the second step S2, the process chamber 22 is evacuated. At this time, the inclination of the heater 11 may fluctuate. Therefore, it is not preferable to omit the step of bringing the process chamber 22 into a vacuum state in order to increase the measurement accuracy of the reference position in the heater 11 during the CVD process. After the second step S2, a third step S3 is executed.

  In the third step S 3, the first image marker A is photographed by the CCD camera 31. At this time, as described above, the position of the CCD camera 31 with respect to the camera stand 32 and the shooting direction are changed until the measurement of the second image marker B is completed, that is, until the teaching method according to the present embodiment is completed. must not. The photographed result is stored in the storage unit of the image teaching unit 40 or the like. Following the third step S3, a fourth step S4 is executed.

  In the fourth step S4, the process chamber 22 is returned to the atmospheric state. After the fourth step S4, a fifth step S5 is executed.

  In the fifth step S5, the reference jig 16 is removed from the heater 11. Following the fifth step S5, a sixth step S6 is executed.

  In the sixth step S <b> 6, the adapter ring adjustment jig 17 is installed on the adapter ring 15. This installation is performed by fitting the hole 172 in the collar-shaped support portion 171 provided in the adapter ring adjusting jig 17 into the convex portion 151 provided in the adapter ring 15. The adapter ring adjustment jig 17 is provided with a second image marker B. The second state shown in FIGS. 8 and 9 corresponds to a sixth step S6 and seventh to tenth steps S7 to S10 described later. After the sixth step S6, a seventh step S7 is executed.

  In the seventh step S 7, the second image marker B is photographed by the CCD camera 31. At this time, as described above, it is assumed that the position of the CCD camera 31 with respect to the camera stand 32 and the shooting direction are maintained under the same conditions as in the third step S3. Image data obtained by photographing is stored in the storage unit of the image teaching unit 40. After the seventh step S7, an eighth step S8 is executed.

  In the eighth step S8, the arithmetic unit of the image teaching unit 40 processes the image data, and calculates the displacement of the positions of the first and second image markers A and B. The calculation of this deviation will be described in detail below.

  FIG. 11 is an image diagram showing a display example of the image display unit 41 according to the first embodiment of the present invention. In the image diagram of FIG. 11, the first image obtained by photographing the first image marker A in the third step S3 and the second image marker B in the seventh step S7 using the same conditions as those in the third step S3. A second photograph taken of the image is superimposed and displayed.

  Here, the first image marker A is a circular shape, and the second image marker B is a combination of a rectangle and a cross at the center. However, these are merely examples, and the present invention is not limited thereto.

  Further, each of the first and second photographs is preferably binarized, for example, binarized, that is, converted into a monochrome 1-bit image or the like, before the superposition process. However, this is merely an example, and different colors may be used, and the present invention is not limited thereto.

  The calculation unit of the image teaching unit 42 according to the present embodiment performs calculation processing based on the image obtained by superimposing the first and second photographs, and automatically performs the first and second image markers A and B. The position shift is calculated.

  In this calculation process, for example, the distance from the left side of the rectangle of the second image marker B to the circumference of the first image marker A on the extended line of the cross portion is set as the first value X1. Similarly, the distance from the right side of the rectangle in the second image marker B to the circumference in the first image marker A is set as the second value X2. Further, the distance from the lower side of the rectangle in the second image marker B to the circumference in the first image marker A is set as a third value Y1. Finally, the distance from the upper side of the rectangle in the second image marker B to the circumference in the first image marker A is set as a fourth value Y2.

  In such a case, the lateral displacement of the first and second image markers A and B can be calculated as the difference ΔX (= X1−X2) between the first and second distances. Similarly, the vertical shift of the first and second image markers A and B can be calculated as the difference ΔY (= Y1−Y2) between the third and fourth distances. If the horizontal and vertical deviations ΔX and ΔY are both zero, it can be considered that the positions of the first and second image markers A and B coincide. This coincidence means that the positional relationship between the heater 11 and the shadow ring 18 is ideal.

  In addition, as described later, it is preferable to convert the information regarding the deviation into a numerical value group that can be directly used in the adjustment step by using a calculation unit of the image teaching unit 40 or the like. After the eighth step S8, a ninth step S9 is executed.

  In the ninth step S9, it is determined whether or not the calculated deviation is within an allowable range by using a calculation unit of the image teaching unit 40 or the like. If the deviation is outside the allowable range (NO), the tenth step S10 is executed. If the deviation is within the allowable range (YES), the eleventh step S11 is executed.

  In the tenth step S10, the position of the adapter ring 15 is adjusted in a direction to eliminate the calculated deviation. This adjustment is performed by appropriately moving the position of the adapter ring adjustment block 13. This movement is performed by loosening or tightening the adjusting screw 14 connected to each adapter ring adjusting block 13.

  At this time, information relating to which adjustment screw 14 is loosened or tightened in which direction is tightened automatically in the eighth step S8 and determined as a unique numerical value group. Is preferred. Such a numerical value group includes a relational expression of the rotation angle and the movement distance in the rotation axis direction of each of the adjustment screws 14, and the calculation unit of the image teaching unit 40 with a simple program if the rotation axis direction is known. It can be calculated by executing. The image teaching unit 40 displays the numerical value group calculated in this way on the numerical value display unit 42. Alternatively, a configuration in which the CVD apparatus 10 receives such a numerical group from the image teaching unit 40 and can automatically perform adjustment using the adjustment screw 14 may be used.

  After the tenth step S10, the process returns to the seventh step S7. The seventh to tenth steps S7 to S10 are repeated until the displacement of the first and second image markers A and B falls within the allowable range.

  In an eleventh step S <b> 11, the adapter ring adjustment jig 17 is removed from the adapter ring 15. When the eleventh step S11 is completed, the teaching method according to the present embodiment is completed. Thereafter, the CVD apparatus 10 performs a CVD process such as the formation of the tungsten film 51 by setting a semiconductor wafer on the heater 11 and further setting a mask such as a shadow ring on the adapter ring 15. I can do it.

  According to the teaching system and teaching method of the present embodiment, the following effects can be obtained. That is, the center of the shadow ring 18 and the center of the heater 11 can be matched with high accuracy and efficiency. This is because the first image marker A as a reference point of the heater 11 is first provided on the heater 11 via the reference jig 16. In addition, the second image marker B may be provided on the adapter ring 15 via the adapter ring adjustment jig 17 instead of the shadow ring 18. Further, there is a configuration and method in which the coordinates of these two image markers A and B are mechanically measured to calculate a difference between the coordinates, and the difference is driven to zero. Finally, it can be mentioned that the measurement performed in the vacuum state of the process chamber 22 need only be performed once, and the remaining measurements can be performed in the atmospheric state of the process chamber 22.

  In order to perform the CVD process, it is necessary to separately align the heater 11 and the semiconductor wafer 50 in addition to the teaching method described above. For this alignment, since a conventional technique can be used, further detailed description is omitted.

(Second Embodiment)
FIG. 12 is an overall view schematically showing the configuration of the teaching system according to the second embodiment of the present invention in the first state. FIG. 13 is a plan view partially showing the configuration in the first state of the CVD apparatus 10 according to the second embodiment of the present invention. The teaching system of FIGS. 12 and 13 is equivalent to the teaching system and the CVD apparatus 10 according to the first embodiment of the present invention shown in FIGS. 5 and 6, respectively, with the following modifications. That is, by removing the reference jig 16 from the teaching system of FIG. 5 and providing the first image marker A on the heater 11, the teaching system of FIG. 12 and the CVD apparatus of FIG. 13 are obtained.

  Other configurations in the teaching system of FIG. 12 are the same as those of the first embodiment of the present invention shown in FIG. Similarly, the other configuration of the CVD apparatus 10 of FIG. 13 is the same as that of the first embodiment of the present invention shown in FIG.

  The configuration of the teaching system according to the present embodiment in the second state is the same as that of the first embodiment of the present invention shown in FIG. Similarly, the configuration of the CVD apparatus 10 according to the present embodiment in the second state is the same as that of the first embodiment of the present invention shown in FIG. 9, and thus further detailed description is omitted.

  The operation of the teaching system according to the present embodiment, that is, the teaching method according to the present embodiment will be described. FIG. 14A is the first half of a flowchart showing the steps of the teaching method according to the second embodiment of the present invention. FIG. 14B is the latter half of the flowchart showing the steps of the teaching method according to the second embodiment of the present invention. The flowcharts of FIGS. 14A and 14B are connected at point B, and are equivalent to the flowchart of the teaching method according to the first embodiment of the present invention shown in FIGS. 10A and 10B with the following modifications. That is, first, the first step S1 in FIG. 10A is replaced with the first step S1 'in FIG. 14A. Next, the fifth step S5 in FIG. 10A is omitted.

  In the first step S <b> 1 ′ according to the present embodiment, the first image marker A is provided on the heater 11 instead of the reference jig 16. It is assumed that the first image marker A provided on the heater 11 does not need to be removed. This is why the fifth step S5 according to the first embodiment of the present invention shown in FIG. 10A is omitted.

  The other second to fourth steps S2 to S4 and the fifth to tenth steps S6 to S11 in FIG. 14A are the second to fourth steps S2 to S4 and the sixth to eleventh steps in FIG. 10A. Since it corresponds to S6 to S11, further detailed description is omitted. However, since the fifth step S5 in the first embodiment of the present invention is omitted in this embodiment, the fifth step S6 is executed after the fourth step S4 in FIG. 14A. Different.

  According to the teaching system and teaching method of the present embodiment, further effects can be obtained in addition to the various effects obtained in the first embodiment of the present invention. That is, it is not necessary to install or remove the reference jig 16.

DESCRIPTION OF SYMBOLS 10 CVD apparatus 11 Heater 112 Lift pin hole 12 Pumping plate 13 Adapter ring adjustment block 14 Adjustment screw 15 Adapter ring 151 Convex part 16 Reference jig 161 Convex part 17 Adapter ring adjustment jig 171 Brim-shaped support part 172 Hole part 173 Marker 18 Shadow ring 181 Collar-shaped support portion 182 Hole portion 19 Face plate 21 Purge ring 22 Process chamber (main body)
DESCRIPTION OF SYMBOLS 30 CCD camera part 31 CCD camera 32 Camera stand 40 Image teaching unit 41 Image display part 42 Numerical display part 50 Semiconductor wafer 51 Tungsten film 52 Process gas 53 Orientation flat A (1st) Image marker B (2nd) Image marker

Claims (9)

A CVD apparatus having a heater for placing a semiconductor wafer and an adapter ring for supporting a mask for CVD processing;
A heater portion in which a first position which is a reference position of the heater is indicated by a first image marker;
A CVD processing mask portion in which the second position where the CVD processing mask is arranged is indicated by a second image marker;
A CCD camera that individually photographs the first image marker disposed at the first position and the second image marker disposed at the second position;
An image teaching unit that stores the first position and calculates a shift between the first position and the second position;
A teaching system comprising: an adjustment unit that adjusts a position of the adapter ring in a direction to eliminate the deviation when the deviation is out of a predetermined reference. The teaching system according to claim 1,
A base portion fixed to the heater;
Further comprising
The CVD processing mask portion is
The adapter ring adjustment jig provided with the second image marker and detachable at a predetermined position of the adapter ring, and the adjustment unit,
An adapter ring adjustment block for supporting the adapter ring;
Between the base part and the adapter ring adjustment block, an adjustment screw for adjusting the connection and positional relationship;
Teaching system. The teaching system according to claim 2,
The heater part is
The heater;
A teaching system further comprising a reference jig provided with the first image marker and detachable at a predetermined position of the heater. The teaching system according to claim 2,
The heater part is
A teaching system comprising the heater provided with the first image marker. In the teaching system according to any one of claims 1 to 4,
The image teaching unit is
An input unit for inputting image data captured by the CCD camera;
A storage unit for storing the image data;
An arithmetic unit that processes the image data and calculates the deviation;
A teaching system comprising: an output unit that displays the deviation. A step of indicating a first position as a reference point in the heater of the CVD apparatus with a first image marker;
Photographing the first image marker arranged at the first position with a CCD camera;
Storing the first position;
A second position at which a CVD processing mask is placed connected to the adapter ring of the CVD apparatus, indicated by a second image marker;
Photographing the second image marker disposed at the second position with the CCD camera;
Calculating a shift between the first position and the second position;
And a step of adjusting the position of the adapter ring in a direction to eliminate the deviation when the deviation deviates from a predetermined reference. The teaching method according to claim 6, wherein
The step of photographing the first image marker includes:
Vacuuming the CVD apparatus prior to the imaging;
Returning the CVD apparatus to an atmospheric state after the imaging,
The step of indicating the second position comprises:
The adapter ring comprises a step of fitting an adapter ring adjustment jig provided with the second image marker,
The teaching method further comprising: photographing the second image marker until the deviation satisfies the predetermined criterion, repeating the step of calculating the deviation, and adjusting the step. In the teaching method according to claim 7,
The step of indicating the first position comprises:
Fitting a reference jig provided with the first image marker to the heater;
A teaching method further comprising the step of removing the reference jig from the heater before the step of indicating the second position. In the teaching method according to claim 7,
The step of indicating the first position comprises:
A teaching method comprising the step of providing the heater with the first image marker.

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