JP2012194644A - Manufacturing method of film with one-side conductive film for electrostatic sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a film with a one-side conductive film for an electrostatic sensor, which can give a film with a one-side conductive film for an electrostatic sensor, preventing occurrence of heat wrinkles even in deposition of a conductive layer by high power.SOLUTION: The manufacturing method of a film with a one-side conductive layer for an electrostatic sensor of the present invention comprises: a step of laminating a base film having light transmitting property with a heat wrinkle-preventing film through an adhesive agent to obtain a laminate where the above heat wrinkle-preventing film is temporarily adhered on one-side of the above base film; a step of laminating a conductive film having light transmitting property on the above base film side surface of the above laminate by the physical vapor deposition method; a step of laminating a conductive film having light shielding property on the above conductive film having light transmitting property by the physical vapor deposition method; and a step of peeling the above heat wrinkle-preventing film from the above laminate provided with the above conductive film having light transmitting property and the above conductive film having light shielding property.

Description

  The present invention relates to an electrostatic sensor incorporated in a PDA, a portable information terminal such as a handy terminal, an OA device such as a copy machine and a facsimile, a smartphone, a mobile phone, a portable game device, an electronic dictionary, a car navigation system, a small PC, and various home appliances. It is related with the manufacturing method of the film with a single-sided electrically conductive film used for manufacture.

  2. Description of the Related Art Conventionally, an apparatus in which XY coordinates can be input by bringing an operator's finger into contact with an electrostatic capacity method has been put into practical use. As such a conventional example, for example, in Patent Document 1, a plurality of first electrodes extending in parallel to each other are provided on the surface of the film body, and the back surface of the film body is provided with respect to the first electrode group. A plurality of parallel second electrodes extending in a direction perpendicular to each other and outputting a current value corresponding to the capacitance between the first electrode group and the second electrode group A sensor is disclosed.

  In actual mass production of the capacitance sensor, the first electrode group and the second electrode group are not provided on the front and back surfaces of the film body alone, but are transmitted in advance on one surface of the base film having translucency. Two commercially available films with a single-sided conductive film on which a conductive film having optical properties was prepared, and the first electrode group was formed by patterning the conductive film by etching with respect to the first single-sided conductive film. After forming the second electrode group by patterning the conductive film by etching the two single-sided conductive film, the first and second electrode films were bonded together.

  However, when the first electrode film on which the first electrode group is formed and the second electrode film on which the second electrode group is formed are bonded together by pressing with a pressure roll or a press, Since the base film of each of the first and second electrode films changes in size, there is an error in the dimensions between the electrodes of the first electrode group formed on them and between the electrodes of the second electrode group. There is a problem that it ends up. Further, when an ITO film is used as the first electrode group and the second electrode group, heating is performed for the purpose of crystallization. However, when heating is performed after bonding as described above, the second electrode that is not exposed is used. Since it is necessary to crystallize the electrode group sufficiently, the heating temperature is inevitably increased. As a result, the substrate films of the first and second electrode films also change in size, and the dimensions between the electrodes of the first electrode group and between the electrodes of the second electrode group are distorted. . Further, there is another problem that the bonding accuracy itself between the first electrode film and the second electrode film is extremely low.

  Therefore, when a very fine electrode group is required for the capacitance sensor, it is extremely difficult to manufacture.

  Therefore, as shown in Patent Document 2, the present applicant prepares a set of films with a single-sided conductive film in which a conductive film having a light-transmitting property is formed in advance on one surface of a base film having a light-transmitting property, After laminating the films with single-sided conductive films so that the conductive film is on the outside, the first conductive film is patterned by etching to form a first electrode group consisting of electrodes arranged in parallel. And a method of manufacturing a capacitance sensor comprising a plurality of electrodes arranged in parallel by patterning the other conductive film by etching and forming a second electrode group orthogonal to the first electrode group. Proposed.

  Further, the applicant of the present invention relates to the double-sided etching performed after the bonding, and when exposing and developing the resist layer provided on the surface on one side to form a pattern, the light beam of the exposure is on the other side. In order to prevent reaching the resist layer provided on the surface, a proposal as shown in Patent Document 3 is also proposed. That is, before the two single-sided conductive film films are bonded together, a light-shielding conductive film is laminated in advance on the light-transmitting conductive film, and a resist layer provided on one side surface is laminated. The light beam to be exposed is shielded before reaching the resist layer provided on the surfaces on the other side. Note that after the first and second electrode groups are formed by etching, the light-shielding conductive film is removed at least in the active area, so that the display on the back surface can be visually recognized.

  By the way, in order to sequentially laminate the light-transmitting conductive film and the light-shielding conductive film on one surface of the light-transmitting base film, a continuous film forming method is used by sputtering or other vacuum film forming methods. For example, in sputtering, a discharge gas (sputtering gas) such as Ar is introduced into a vacuum chamber, a negative voltage of 300 to 700 V is applied to the target, plasma is generated by the generated glow discharge, and Ar ions in the plasma are generated. Is caused to collide with the target with high energy (several hundreds eV) corresponding to the applied voltage to perform sputtering (see FIG. 8). In the film forming apparatus illustrated in FIG. 8, the unwinding unit 32 that continuously feeds the roll-shaped base film 2 into the vacuum chamber 31 and the base film 102 that has been unwound from the unwinding unit 32 are wound up. A winding unit 33 is provided. The base film 102 fed out from the unwinding section 32 is guided to the sputter chamber 34, and in the sputter chamber 34, the base film 102 is wound on the surface of the base film 102 having translucency while being wound around the peripheral surface of the main roller 35. The light-transmitting conductive film 7 and the light-shielding conductive film 8 are sequentially formed.

Japanese Patent No. 3426847 JP 2009-70191 A Japanese Patent No. 4601710

  However, in the sputtering, both Ar atoms reflected on the target surface and negative ions generated on the target surface (particularly observed in sputtering of oxides) all have high energy. For this reason, when these particles collide with the growing film, there is a problem that heat is applied to the base film 102 and contraction causes thermal wrinkles.

  On the other hand, when the film is formed with low power for the purpose of reducing damage to the base film 102, the base film 102 must be formed by reciprocating the sputtering chamber 34 many times, so-called multiple passes must be performed. In addition, there is a problem that the productivity of forming the conductive layer is lowered.

  Further, it is possible to form a film with low power without performing a plurality of passes by increasing the number of target cathodes. However, when the number of cathodes is increased, a large film forming apparatus is required, which increases the equipment cost.

  Accordingly, an object of the present invention is to solve the above-described problems, and an electrostatic sensor capable of obtaining a film with a single-sided conductive film for an electrostatic sensor that does not generate thermal wrinkles even when a conductive layer is formed at high power. It is providing the manufacturing method of the film with a single-sided electrically conductive film.

According to the first aspect of the present invention, a base film having translucency and a thermal wrinkle prevention film are laminated via an adhesive, and the thermal wrinkle prevention film is temporarily bonded to one side of the base film. Obtaining a laminated body,
Laminating a conductive film having translucency by physical vapor deposition on the base film side surface of the laminate;
A step of laminating a light-shielding conductive film by a physical vapor deposition method on the light-transmitting conductive film;
A step of peeling the thermal wrinkle prevention film from the laminate provided with the light-transmitting conductive film and the light-shielding conductive film, and a single-sided conductive layer for an electrostatic sensor Provided is a method for producing an attached film.

  According to the 2nd aspect of this invention, the said physical vapor deposition provides the manufacturing method of the film with the single-sided conductive layer for electrostatic sensors of the 1st aspect which is sputtering.

  According to a third aspect of the present invention, there is provided the method for producing a film with a single-sided conductive layer for an electrostatic sensor according to the first aspect or the second aspect, wherein the translucent conductive film is an ITO film.

  According to the 4th aspect of this invention, the electrically conductive film which has the said light-shielding property provides the manufacturing method of the film with the single-sided conductive layer for electrostatic sensors of any one of the 1st-3rd aspect which is a copper film.

  According to the 5th aspect of this invention, the manufacturing method of the film with the single-sided conductive layer for electrostatic sensors of the aspect in any one of the 1st-4th whose said base film is a PC film 15-1000 micrometers thick is provided.

  According to the 6th aspect of this invention, the manufacturing method of the film with a single-sided conductive layer for electrostatic sensors of the aspect in any one of the 1st-5th whose said heat wrinkle prevention film is a PET film is provided.

  According to a seventh aspect of the present invention, the electrostatic sensor single-sided surface according to any one of the first to sixth aspects, wherein a photosensitive layer is laminated on the light-shielding conductive film before the thermal wrinkle prevention film is peeled off. A method for producing a film with a conductive layer is provided.

  The method for producing a film with a single-sided conductive film for an electrostatic sensor according to the present invention is configured as described above. Therefore, even when a conductive layer is formed at a high power, the thermal wrinkles in which the shrinkage of the base film is temporarily bonded to the base film Suppressed by the prevention film, no thermal wrinkles are generated. Further, since film formation with high power is possible, the film formation productivity of the conductive layer is improved.

It is a top view of the electrostatic sensor manufactured using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is the elements on larger scale of the electrostatic sensor shown in FIG. It is sectional drawing of the electrostatic sensor shown in FIG. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows the process of manufacturing the electrostatic sensor of FIG. 1 using the film with the single-sided electrically conductive film for electrostatic sensors obtained by this invention. It is a figure which shows one Example of the manufacturing process of the film with the single-sided electrically conductive film for electrostatic sensors which concerns on this invention. It is a figure which shows one Example of the manufacturing process of the film with the single-sided electrically conductive film for electrostatic sensors which concerns on this invention. It is a figure which shows one Example of the manufacturing process of the film with the single-sided electrically conductive film for electrostatic sensors which concerns on this invention. It is the schematic which shows an example of a structure of the film-forming apparatus of the film with the single-sided electrically conductive film for electrostatic sensors. It is a figure which shows one Example of the manufacturing process of the film with the single-sided electrically conductive film for electrostatic sensors which concerns on this invention. It is a figure which shows the other Example of the manufacturing process of the film with the single-sided electrically conductive film for electrostatic sensors which concerns on this invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  First, in order to help the understanding of the present invention, an electrostatic sensor manufactured using the film with a single-sided conductive film of the present invention and a manufacturing method thereof will be briefly described. FIG. 1 is a plan view of an electrostatic sensor manufactured using the film with a single-sided conductive film for an electrostatic sensor obtained by the present invention, FIG. 2 is a partially enlarged view of the electrostatic sensor shown in FIG. 1, and FIG. It is sectional drawing of the electrostatic sensor shown in FIG. 4A to 4I are diagrams showing a process of manufacturing the electrostatic sensor of FIG. 1 using the film with a single-side conductive film for electrostatic sensor obtained in the present invention.

  The electrostatic sensor 1 in FIG. 1 includes two base films 2 and 2 that are light-transmitting and bonded to each other, and each of the central windows 3 on the outer surfaces of the bonded base films 2 and 2. The light-transmitting conductive films 7 and 7 formed so as to have the electrode pattern 4 and the thin line drawing circuit pattern 6 of the outer frame portion 5, and the thin line drawing circuit pattern 6 of the both light-transmitting conductive films 7 and 7. Each of them is provided with light-shielding conductive films 8 and 8 stacked on each other.

  Here, the electrode pattern 4 formed on the central window 3 of the electrostatic sensor 1 will be supplementarily described. The electrode pattern 4 has different patterns on the front and back of the electrostatic sensor 1. For example, as shown in FIG. 2, a rhombus electrode 46 having a rhombus shape in plan view and a plurality of rhombus electrodes 46 in the longitudinal direction (Y direction in the figure) are formed on the back surfaces of the bonded base films 2 and 2. ) And a connection wiring 469 penetrating the above. The plurality of rhombus electrodes 46 and the connection wiring 469 are electrically connected to each other. Further, such a connection wiring 469 and a plurality of rhombus electrodes 46 penetrating therethrough are taken as a set, and the set is repeatedly arranged in the horizontal direction (X direction) in the figure. On the other hand, on the surface of the base films 2 and 2 bonded together in the same manner, a plurality of rhombus electrodes 47 and connection wirings 479 penetrating them are provided. However, in this case, the extending direction of the connection wiring 479 is different from that of the connection wiring 469 in the horizontal direction (X direction) in the drawing. Accordingly, the direction in which a set of the connection wiring 479 and the plurality of rhombus electrodes 47 penetrating the connection wiring 479 is repeatedly arranged is the vertical direction (Y direction) in the figure. As is clear from FIG. 2, the rhombus electrode 46 is disposed so as to fill the gaps between the plurality of connection wirings 479, while the rhombus electrode 47 is disposed so as to fill the gaps between the plurality of connection wirings 469. Is done. Further, in FIG. 2, the positional relationship between the diamond electrode 46 and the diamond electrode 47 is complementary. That is, the plurality of rhombus electrodes 47 are arranged so as to fill in the rhombus-shaped gaps that occur when the rhombus electrodes 46 are arranged in a matrix.

  Since the X-direction electrode and the Y-direction electrode are arranged so as to form a lattice in plan view in this way, a user's finger or the like is placed at any position on the lattice via a cover glass that covers the electrostatic sensor 1. (For example, the position of the dotted circle FR), a capacitor is formed between the finger and the X-direction electrode touched by the finger, and between the finger and the Y-direction electrode touched by the capacitor. A capacitor is formed. By forming this capacitor, the capacitance of the X direction electrode and the Y direction electrode increases. The position detector of the external circuit detects the amount of change in capacitance that occurs in such a case, or even the X-direction electrode and Y-direction electrode having the maximum capacitance, and touches anywhere in the central window 3. Can be acquired as a set of an X coordinate value and a Y coordinate value as a specific value.

  In order to manufacture the electrostatic sensor 1 having the above-described configuration, a light-transmitting conductive film 7 and a light-shielding conductive film 8 are sequentially laminated on one surface of the light-transmitting base film 2 in sequence. A set of the single-sided conductive film 9 is prepared, and the single-sided conductive film 9 is bonded to each other so that the light-shielding conductive film 8 is on the outside (see FIG. 4A). First photosensitive layers 10 are respectively formed by coating a photosensitive material using (see FIG. 4B), and then masks 11 and 12 having different patterns are disposed on both first photosensitive layers 10 and 10, respectively. Both first photosensitive layers 10 and 10 are exposed simultaneously (see FIG. 4C), and after development of the exposed first photosensitive layers 10 and 10 (see FIG. 4D), the patterned first photosensitive layers 10 and 10 are used as a mask. Light-shielding conductive film , 8 and the light-transmitting conductive films 7 and 7 are etched so as to leave the electrode pattern 4 in the central window 3 and the thin line drawing circuit pattern 6 in the outer frame 5 (see FIG. 4E). , 10 are peeled and removed, and a second photosensitive layer 13 is formed by coating a photosensitive material on both sides using a coater (see FIG. 4F). The masks 14 and 15 having a pattern are arranged to expose both the second photosensitive layers 13 and 13 simultaneously (see FIG. 4G), and after developing the exposed second photosensitive layers 13 and 13 (see FIG. 4H), the central window With the second photosensitive layers 13 and 13 patterned so as to expose the light-shielding conductive film 8 of the portion 3 as a mask, only the light-shielding conductive films 8 and 8 are removed by etching in the central window portion 3 (FIG. 4I). See also) Obtaining an electrostatic sensor 1 by directly leaving by (see FIG. 3) or the first photosensitive layer 10, 10 to separate and remove the first photosensitive layer 10, 10. 3 and 4A to I, the adhesive for bonding the single-sided conductive film 9 to each other is omitted.

  This invention relates to the manufacturing method of the said film 9 with a single-sided electrically conductive film used for manufacture of the above electrostatic sensors 1. FIG. Hereinafter, it will be described in detail with reference to the drawings.

<First Embodiment>
First, as shown in FIG. 5, a thermal wrinkle prevention film 16 has an adhesive 17 on one side of a base film 2 having translucency as a base material for producing a film 9 with a single-sided conductive film for electrostatic sensors. Then, the laminated body 18 laminated and temporarily bonded is produced. In addition, the obtained laminated body 18 is web shape, and is wound up by a roll.

  As the base film 2 having translucency, a PC film is used because it is excellent in optical isotropy. In the case of a PC film, thermal wrinkles are particularly likely to occur without the thermal wrinkle prevention film 16. The thickness of the base film 2 is 15 to 1000 μm. It is difficult to produce a film having a thickness of less than 15 μm, and conversely, if the thickness exceeds 1000 μm, the translucency is lowered, and when wound on a roll, the winding diameter is increased and the cost is increased.

  The adhesive 17 is formed by spraying or coating either an acrylic adhesive or the like on the base film 2 or the heat wrinkle prevention film 16 having translucency. In the example shown in FIG. 5, the adhesive 17 is provided on the thermal wrinkle prevention film 16 side before laminating.

  As the thermal wrinkle prevention film 16, a resin film having heat resistance at the time of sputtering such as a PET film is used. The thickness of the thermal wrinkle prevention film 16 should just be the thickness from which the heat resistance at the time of film-forming of the electrically conductive film 7 which has translucency in the material, and the electrically conductive film 8 which has light-shielding property, etc. are obtained. The surface of the thermal wrinkle prevention film 16 that is in contact with the adhesive 17 is preferably subjected to a release treatment by spraying or coating a silicon resin, a fluorine resin, or the like. As described above, when the thermal wrinkle prevention film 16 that has been subjected to the release treatment in advance is used, the thermal wrinkle prevention film 16 described later can be easily peeled off from the adhesive 17.

  For example, as shown in FIG. 5, after the thermal wrinkle prevention film 16 is coated with the adhesive 17 by the coating roll 20, the laminate is applied with the adhesive 17 application surface of the thermal wrinkle prevention film 16 and the base film 2. In this state, the base film 2 and the thermal wrinkle prevention film 16 are temporarily bonded by being inserted between the laminating roll 21 and the laminating nip roll 22 and then heated and pinched. Next, a sheet obtained by temporarily adhering the base film 2 and the thermal wrinkle prevention film 16 is gradually cooled by placing the sheet along the outer peripheral surface of the cooling roll 23 to obtain a laminated body 18, which is wound up. Can do.

  Next, the web-like laminate 18 is fed out from the roll, and as shown in FIG. 6, a light-transmitting conductive film 7 is formed on the surface of the drawn laminate 18 on the base film 2 side by sputtering. Is done. The conductive film 7 having translucency is patterned in the electrostatic sensor to constitute an X-direction electrode and a Y-direction electrode having translucency. Therefore, the light-transmitting conductive film 7 preferably exhibits a light transmittance (translucency) of 80% or more and a surface resistance value (conductivity) of several mΩ to several hundred Ω, and includes indium tin oxide, A film is formed using a metal oxide such as zinc oxide. For example, the thickness of the ITO film is about several tens to several hundreds nm.

  In addition, the pretreatment for improving the adhesiveness with the electrically conductive film 7 which has translucency may be previously given to the surface (film-forming surface) by the side of the base film 2 of the laminated body 18. FIG. Specific examples of this pretreatment include physicochemical treatment such as plasma treatment and chemical treatment such as chemical treatment, but plasma treatment that can be performed continuously with formation of the light-transmitting conductive film 7 under vacuum. Is preferred.

  Next, as shown in FIG. 7, a light-shielding conductive film 8 is formed on the light-transmitting conductive film 7 by sputtering. The light-shielding conductive film 8 is a layer having a light-shielding property to light used for exposure of the first photosensitive layer 10 described above, that is, a layer having a property of not transmitting the exposure light. Therefore, the light from the exposure light source that has passed through the first photosensitive layer 10 on one side in the double-sided exposure step described above reaches the first photosensitive layer 10 on the other side by the conductive film 8 having a light shielding property. Absent. That is, since the first photosensitive layers 10 and 10 on both sides can be simultaneously exposed with a desired pattern with high accuracy, the front and back of the first photosensitive layers 10 and 10 can be easily aligned in a single process. It can be patterned and has excellent productivity. Examples of materials used for the light-shielding conductive film 8 include aluminum, nickel, copper, silver, and tin. The film thickness is sufficient if the exposure light can be blocked, for example, 20 to 1000 nm for copper. More preferably, the thickness is 30 nm or more in terms of light shielding properties. More preferably, it is good to set it as 100-500 nm. This is because a highly conductive film can be obtained by setting the thickness to 100 nm or more, and a film that is easy to handle and excellent in workability can be obtained by setting the thickness to 500 nm or less.

  FIG. 8 is a schematic diagram illustrating an example of a configuration of a film forming apparatus for a film with a single-sided conductive film for an electrostatic sensor. The illustrated film forming apparatus 30 includes an unwinding unit 32 that continuously feeds a laminate 18 of a roll-shaped base film 2 and a thermal wrinkle prevention film 16 into a vacuum chamber 31 that is maintained at a predetermined degree of vacuum. And a winding unit 33 that winds up the laminated body 18 fed out from the unwinding unit 32. The laminated body 18 fed out from the unwinding section 32 is guided to the sputtering chamber 34, and in the sputtering chamber 34, the substrate 18 is wound around the peripheral surface of the main roller 35 with the base film 2 side facing outward. The conductive film 7 having the above-described translucency and the conductive film 8 having a light-shielding property are sequentially formed on the surface of the base film 2 having the light property.

  In the sputter chamber 34, a first sputter chamber 34A, a second sputter chamber 34B, a third sputter chamber 34C, a fourth sputter chamber 34D, and a fifth sputter chamber 34E are formed in this order so as to surround the main roller 35. A first target 36a, a second target 36b, a third target 36c, a fourth target 36d, and a fifth target 36e are arranged. In the present embodiment, the first target 36a is composed of a target for forming a light-transmitting conductive film 7, and the second to fifth targets 36b to 36e are composed of targets for forming a light-shielding conductive film 8. Has been.

  In addition, the 1st target 36a is selected according to the kind of constituent metal of the electrically conductive film 7 which has the translucency mentioned above, For example, if it is an ITO film | membrane, targets, such as an ITO sintered compact, are used.

  Moreover, the 2nd-5th targets 36b-36e are selected according to the kind of constituent metal of the electrically conductive film 8 which has the light-shielding property mentioned above, For example, if it is a copper film, a copper target will be used.

  In each of the sputtering chambers 34A to 34E, sputtering argon (Ar) introduction pipes 37a to 37e are provided, respectively, and the pressure is adjusted to about 0.1 Pa.

  In the film forming apparatus 30 for a single-sided conductive film for an electrostatic sensor having the above-described configuration, the laminate 18 of the base film 2 and the thermal wrinkle prevention film 16 fed out from the unwinding section 32 is placed in the sputtering chamber 34. The conductive film 7 having a light-transmitting property and the conductive film 8 having a light-shielding property are continuously formed and wound around the winding portion 33.

  In the sputtering chamber 34, an ITO film having a predetermined thickness is formed in the first sputtering chamber 34A. Then, continuous film formation of copper of a predetermined thickness is performed in the next second to fifth sputtering chambers 34B to 34E.

  After the film formation of the light-transmitting conductive film 7 and the light-shielding conductive film 8, the laminate 18 wound around the winding portion 33 of the film forming apparatus 30 is then peeled off from the thermal wrinkle prevention film 16. The film 9 with a single-sided conductive film for electrostatic sensors is removed (see FIG. 9). The adhesive force of temporary adhesion of the thermal wrinkle prevention film 16 to the base film 2 is 7 to 9 N / 25 mm. If the adhesive force of temporary adhesion is less than 7 N / 25 mm, the thermal wrinkle prevention film 16 is easily peeled off before or during the formation of the light-transmitting conductive film 7 and the light-shielding conductive film 8. The effect of can not be obtained. Moreover, when the adhesive force of temporary adhesion exceeds 9 N / 25 mm, it becomes difficult to peel off the thermal wrinkle prevention film 16 after the film formation of the light-transmitting conductive film 7 and the light-shielding conductive film 8.

  Further, after the thermal wrinkle prevention film 16 is peeled off, the surface of the laminate 18 opposite to the surface on which the conductive film 7 having a light-transmitting property and the conductive film 8 having a light-shielding property are formed is provided with a thermal wrinkle. The adhesive 17 used to temporarily bond the prevention film 16 remains. This adhesive 17 is used to bond the films 9 with single-sided conductive film 9 together when the obtained films 9 with single-sided conductive film are bonded together so that the light-shielding conductive film 8 is on the outside. Reused.

  In addition, this invention is not limited to the said 1st Embodiment, It can implement in another various aspect. For example, in the first embodiment, sputtering is used to form the light-transmitting conductive film 7 and the light-shielding conductive film 8, but other than sputtering, a vacuum deposition method, an ion plating method, etc. Other physical vapor deposition (PVD) methods are also applicable.

  Further, in the first embodiment, the laminating roll 21 and the laminating nip roll 22 are nipped while being heated at the time of laminating. However, if smoothness after application of the adhesive 17 can be obtained, the nipping is performed without heating. But you can.

  In the first embodiment, the thermal wrinkle prevention film 16 is peeled and removed immediately after the formation of the light-transmitting conductive film 7 and the light-shielding conductive film 8 by sputtering. Before peeling, a photosensitive layer 10 (corresponding to the first photosensitive layer 10 shown in FIG. 4B) may be laminated on the light-shielding conductive film 8 (see FIG. 10). In this case, it is not necessary to laminate the first photosensitive layer 10 after the films 9 with single-sided conductive films are bonded together so that the light-shielding conductive film 8 is on the outside. The photosensitive layer 10 is made of an acrylic photoresist material having a thickness of 10 to 20 [mu] m that can be exposed with a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a laser beam or a metal halide lamp and developed with an alkaline solution or the like. Examples of the method for forming the photosensitive layer 10 include general-purpose printing methods such as gravure, screen, and offset, methods using various coaters, methods such as painting and dipping, and various methods such as a dry film resist (DFR) method.

  Further, it is preferable to crystallize the light-transmitting conductive film 7 by a method such as heat treatment after the sputter film formation. This is because crystallization improves the etching resistance and makes it easier to etch only the conductive film 8 having a light shielding property more selectively.

  Moreover, the base film 2 temporarily bonded to the thermal wrinkle prevention film 16 may be provided with various functional layers on one side or both sides in advance. For example, a hard coat layer can be provided on one side or both sides for protecting the base film 2. In addition, an optical adjustment layer can be provided on the surface of the base film 2 on which the conductive film 7 having translucency is formed.

  Further, in the first embodiment, it is described that the surface of the thermal wrinkle prevention film 16 that contacts the adhesive 17 is subjected to mold release treatment, but conversely, the surface of the base film 2 that contacts the adhesive 17 is released from the mold. You may peel the adhesive agent 17 with the heat wrinkle prevention film 16 by giving a process. In addition, when all of the obtained film 9 with a single-sided conductive film are the ones from which the adhesive 17 has been peeled off, it is necessary to newly apply an adhesive to bond the single-sided conductive film 9 with each other. is there. In addition, when only one of the pair of obtained films 9 with a single-sided conductive film is obtained by removing the adhesive 17, the adhesive 17 remaining on the other film 9 with a single-sided conductive film is attached with a single-sided conductive film. It is reused for bonding the films 9 together. Furthermore, as described above, when a hard coat layer is provided on the surface of the base film 2 that is in contact with the adhesive 17, the hard coat layer can also function as a release treatment.

"Example"
A thermal wrinkle prevention film made of a PET film (125 μm) obtained by applying a silicone resin to a base film made of a PC film (100 μm) and being subjected to a release treatment is laminated with an acrylic adhesive temporarily. Using the bonded laminate 18, an ITO film (20 nm) was formed by sputtering on the surface of the laminate 18 on the base film side, and a copper film (300 nm) was continuously formed thereon by sputtering. . Thereafter, the thermal wrinkle prevention film was peeled off to obtain a film with a single-sided conductive film for electrostatic sensors.

  The evaluation was performed by observing with the naked eye whether thermal wrinkles were generated by performing sputter film formation at high power (evaluation x) or thermal wrinkles were not generated (evaluation o) (see Table 1). For comparison, an example in which thermal wrinkles are generated in a conventional structure without a thermal wrinkle prevention film and an example in which generation of thermal wrinkles is suppressed by performing sputter film formation at a low power are also shown in the same table.

  As can be seen from Table 1, the temporary adhesion of the thermal wrinkle prevention film (the present invention) prevents the generation of thermal wrinkles at high power compared to the case without the thermal wrinkle prevention film (conventional example). Yes. Further, since the film can be formed with high power by temporary adhesion (the present invention) of the thermal wrinkle prevention film, the film formation productivity of the conductive layer is excellent.

  The present invention is a manufacturing of electrostatic sensors incorporated in PDAs, handheld terminals and other portable information terminals, copiers, facsimile and other office automation equipment, smartphones, mobile phones, portable game devices, electronic dictionaries, car navigation systems, small PCs, various home appliances, etc. The present invention relates to a method for producing a film with a single-sided conductive film used in the manufacturing process.

DESCRIPTION OF SYMBOLS 1 Electrostatic sensor 2 Base film 3 Central window part 4 Electrode pattern 5 Outer frame part 6 Thin wire drawing circuit pattern 7 Light-transmitting conductive film 8 Light-shielding conductive film 9 Single-sided conductive film 10 First photosensitive layer (Photosensitive layer)
DESCRIPTION OF SYMBOLS 11,12 Mask 13 2nd photosensitive layer 14,15 Mask 16 Thermal wrinkle prevention film 17 Adhesive agent 18 Laminated body 19 Terminal part 20 Coating roll 21 Laminating roll 22 Laminating nip roll 23 Cooling roll 24 Backup roll 30 Film-forming apparatus 31 Vacuum chamber 32 Unwinding section 33 Winding section 34 Sputtering chamber 35 Main rollers 34A to 34E First to fifth sputtering chambers 36a to 36e First to fifth targets 37a to 37e Introducing piping 40 Exposure light beam 46, 47 Diamond electrode 469.479 Connection wiring

Claims (7)

Laminating a base film having translucency and a thermal wrinkle prevention film via an adhesive to obtain a laminate in which the thermal wrinkle prevention film is temporarily bonded to one side of the base film;
Laminating a conductive film having translucency by physical vapor deposition on the base film side surface of the laminate;
A step of laminating a light-shielding conductive film by a physical vapor deposition method on the light-transmitting conductive film;
A step of peeling the thermal wrinkle prevention film from the laminate provided with the light-transmitting conductive film and the light-shielding conductive film, and a single-sided conductive layer for an electrostatic sensor A manufacturing method of attached film.   The method for producing a film with a single-sided conductive layer for electrostatic sensors according to claim 1, wherein the physical vapor deposition is sputtering.   The method for producing a film with a single-sided conductive layer for an electrostatic sensor according to claim 1 or 2, wherein the light-transmitting conductive film is an ITO film.   The method for producing a film with a single-sided conductive layer for an electrostatic sensor according to claim 1, wherein the light-shielding conductive film is a copper film.   The method for producing a film with a single-sided conductive layer for an electrostatic sensor according to any one of claims 1 to 4, wherein the substrate film is a PC film having a thickness of 15 to 1000 µm.   The said heat wrinkle prevention film is a PET film, The manufacturing method of the film with a single-sided conductive layer for electrostatic sensors in any one of Claims 1-5.   The method for producing a film with a single-sided conductive layer for an electrostatic sensor according to any one of claims 1 to 6, wherein a photosensitive layer is laminated on the light-shielding conductive film before the thermal wrinkle prevention film is peeled off.

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