JP2012186226A - Vacuum processing apparatus and vacuum processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect more accurately the displacement of a mask from a tray.SOLUTION: A vacuum processing apparatus comprises: a vacuum processing chamber in which vacuum processing is performed on a substrate; an assembly made up of the substrate, a tray on which the substrate can be placed, and a mask placed on the tray; a conveyance arm which conveys the assembly into the vacuum processing chamber; a support base which is arranged in the vacuum processing chamber and supports the assembly; and a lifter which is arranged in the vacuum processing chamber and moves the assembly between the conveyance arm and the support base. The vacuum processing apparatus further comprises: a plurality of detection means capable of detecting the state of the assembly; and determination means which determines, based on a plurality of detection results from the detection means, if the mask and the tray are displaced from each other.

Description

  The present invention relates to a vacuum processing apparatus and a vacuum processing method.

  In vacuum processing such as thin film formation and dry etching, vacuum processing may be performed while a substrate to be processed is placed on a tray. In particular, the thickness of the substrate tends to become thinner and thinner, and it is difficult to directly hold and transport such a thin substrate, and the substrate is often transported by placing it on a tray. Furthermore, in order to prevent deviation of the substrate from the tray, a mask may be placed on the substrate (see, for example, Patent Document 1).

  In this case, it is desirable that the substrate be processed without shifting the mask from the tray. For this reason, before the vacuum processing is performed on the substrate, the positional deviation of the mask with respect to the tray may be detected. As a detection method, a method of attaching a laser sensor, a fiber sensor or the like outside the vacuum processing apparatus is common. For example, such an optical sensor is attached to the outside of the vacuum processing apparatus through a window member, and the positional deviation of the mask with respect to the tray is detected.

  However, when an optical sensor is attached outside the vacuum processing apparatus, the degree of freedom of the optical sensor attachment location may be restricted. Further, if the vacuum process is continued for a long time, the window material may become dirty due to the vacuum process, and the positional deviation of the mask with respect to the tray may not be detected accurately. In this case, a shielding mechanism for shielding the window material may be provided in the vacuum processing apparatus during the vacuum processing. However, when such a shielding mechanism is provided, the vacuum processing apparatus becomes complicated and increases the cost.

International Publication No. 2010/026955

  An object of the present invention is to provide a vacuum processing apparatus and a vacuum processing method for more accurately detecting a displacement of a mask with respect to a tray.

  According to one aspect of the present invention, an assembly including a vacuum processing chamber for vacuum processing a substrate, the substrate, a tray on which the substrate can be placed, and a mask placed on the tray; A transfer arm for transferring the assembly into the vacuum processing chamber; a support base installed in the vacuum processing chamber for supporting the assembly; and installed in the vacuum processing chamber between the transfer arm and the support base. A lifter for moving the assembly, and having a plurality of detection means capable of detecting the state of the assembly, and the positions of the mask and the tray are shifted due to a plurality of detection results from the detection means. There is provided a vacuum processing apparatus characterized in that a determination means for determining a state is provided.

  Further, according to one aspect of the present invention, in the above-described vacuum processing apparatus, when the variation in the values of the plurality of detection results is not within an allowable value, the positions of the tray and the mask are shifted. The vacuum processing method is characterized in that the vacuum processing is stopped.

  ADVANTAGE OF THE INVENTION According to this invention, the vacuum processing apparatus and the vacuum processing method which detect more correctly the position shift of the mask with respect to a tray are implement | achieved.

It is a plane schematic diagram of the vacuum processing apparatus which concerns on 1st Embodiment. It is a cross-sectional schematic diagram of a vacuum processing chamber. It is a plane schematic diagram of a vacuum processing chamber. It is a cross-sectional schematic diagram of a board | substrate, a tray, and a mask, (a) is a general view, (b) is a cross-sectional schematic diagram of the board | substrate, a tray, and a mask in the Y-Y 'cross section of FIG. It is a figure for demonstrating an effect | action of a detection means, (a) is a top view in case an overlap with a mask and a tray is normal, (b) is a top view in case a mask remove | deviates from a tray. It is a schematic diagram of the vacuum processing apparatus which concerns on 2nd Embodiment, (a) is a plane schematic diagram of a vacuum processing chamber, (b) is a cross-sectional schematic diagram in the YY 'position of (a). is there. It is a plane schematic diagram of the vacuum processing apparatus which concerns on 3rd Embodiment. FIG. 8 is a cross-sectional view taken along the line ZZ ′ of FIG. 7, where (a) is a diagram in which the positional relationship between the tray and the mask is in a normal state; FIG. It is a perspective schematic diagram of the vacuum processing apparatus which concerns on 4th Embodiment, (a) is a perspective schematic diagram of the conveyance arm of the vacuum robot provided in the conveyance chamber, (b) is a conveyance arm as a board | substrate, a tray, and It is a perspective schematic diagram of the state which supports the assembly with which the mask became one set.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same members are denoted by the same reference numerals, and description of members once described will be omitted as appropriate.

(First embodiment)
FIG. 1 is a schematic plan view of a vacuum processing apparatus according to the first embodiment.
The vacuum processing apparatus 1 is a so-called multi-chamber type vacuum processing apparatus. The vacuum processing apparatus 1 includes, for example, a back electrode in a discrete semiconductor device (individual semiconductor device) such as a power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) for power control, an IGBT (Insulated Gate Bipolar Transistor), or a light emitting device. Suitable for membranes.

  The vacuum processing apparatus 1 includes, for example, a transfer chamber 10, a load lock chamber 20, a preprocessing chamber 30, and a plurality of vacuum processing chambers 41 to 44. The transfer chamber 10, the load lock chamber 20, the pretreatment chamber 30, and the vacuum processing chambers 41 to 44 are all airtightly shielded from the atmosphere. The transfer chamber 10, the load lock chamber 20, the pretreatment chamber 30, and the vacuum processing chambers 41 to 44 can all be depressurized by a vacuum exhaust system. The load lock chamber 20, the transfer chamber 10, and the pretreatment chamber 30 are not limited to one, and a plurality of load lock chambers 20, transfer chambers 10, and pretreatment chambers 30 may be provided. The number of vacuum processing chambers is not limited to the number illustrated.

  The load lock chamber 20 can carry a substrate as an object to be processed into the load lock chamber 20 by opening and closing the atmospheric gate valve 21. The load lock chamber 20 is connected to the transfer chamber 10 via a vacuum gate valve 22.

  In the transfer chamber 10, there is provided a vacuum robot 50 having a transfer arm 51 that moves in the front-rear direction and having a single transfer arm robot structure that rotates and moves up and down. The transfer arm 51 supports the assembly 60 in which a substrate, a tray on which the substrate can be placed, and a mask placed on the tray are supported, and the assembly 60 is placed in the load lock chamber 20. It is transferred to the pretreatment chamber 30 or the vacuum treatment chambers 41 to 44. The structure of the assembly 60 will be described later.

  The pretreatment chamber 30 is connected to the transfer chamber 10 via a vacuum gate valve 30V. The pretreatment chamber 30 can perform heating, surface treatment, and the like on the substrate before the substrate is vacuum-treated in the vacuum treatment chambers 41 to 44.

  Each of the vacuum processing chambers 41 to 44 is connected to the transfer chamber 10 via each of the vacuum gate valves 41V to 44V. Each of the vacuum processing chambers 41 to 44 includes a sputtering source 45. Each of the vacuum processing chambers 41 to 44 is, for example, a sputtering apparatus. Each form of the vacuum processing chambers 41 to 44 may be the same, and the material of the sputtering source 45 may be changed in each of the vacuum processing chambers 41 to 44.

  In addition, the vacuum processing apparatus 1 may be provided with a substrate transport mechanism (so-called atmospheric loader unit or the like) for loading and unloading the substrate in the load lock chamber 20.

A vacuum processing chamber 41 as a typical example of the vacuum processing chambers 41 to 44 is shown in FIGS.
FIG. 2 is a schematic cross-sectional view of the vacuum processing chamber.
FIG. 3 is a schematic plan view of the vacuum processing chamber.
FIG. 2 shows an XX ′ arrow view of FIG. FIG. 3 shows a state in which the vicinity of the support base 41 s in the vacuum processing chamber 41 is transmitted.

  The vacuum processing chamber 41 is shut off from the outside by a vacuum wall 41w. Various gases can be introduced into the vacuum processing chamber 41 by a gas introduction system. The inside of the vacuum processing chamber 41 can be evacuated by an exhaust system. By controlling the introduction amount of various gases and the exhaust amount of the atmosphere in the vacuum processing chamber 41, the inside of the vacuum processing chamber 41 can be maintained under a desired pressure with a desired gas.

  A support base 41 s is provided on the bottom surface of the vacuum processing chamber 41. The support base 41s supports the assembly 60. The support base 41s includes a base body 41b and a ceramic plate 41d that functions as an electrostatic chuck. In order to form a film uniformly on the entire surface of the substrate 61, sputtering film formation is performed while rotating the substrate 61 adsorbed and fixed to the support base 41s. The rotation shaft 41ra of the support base 41s is connected to a rotation drive mechanism outside the vacuum processing chamber 41. The support base 41s can rotate around a rotation center indicated by a one-dot chain line C1.

  The ceramic plate 41d provided on the upper side of the support base 41s functions as an electrostatic chuck. The ceramic plate 41d has a disk shape, for example. Internal electrodes are provided in the ceramic plate 41d. The upper surface of the ceramic plate 41d is a circular electrostatic attraction surface 41a. The substrate 61 is electrostatically attracted to the electrostatic adsorption surface 41a. For example, when a voltage is applied to the internal electrode of the ceramic plate 41d from the outside of the vacuum processing chamber 41, the electrostatic adsorption surface 41a is charged with an electrostatic charge, and the substrate 61 is adsorbed and fixed to the electrostatic adsorption surface 41a.

  A cable for supplying power to the internal electrode of the electrostatic chuck is provided outside the vacuum processing chamber 41 through the inside of the rotating shaft 41ra of the support base 41s and through a slip ring at the end of the rotating shaft 41ra. Connected to a power source.

  In addition, on the upper portion of the support base 41s, a tray placement portion 41tr that is located outside the electrostatic attraction surface 41a and below the electrostatic attraction surface 41a is provided.

  Here, the substrate 61 that is electrostatically attracted to the electrostatic attracting surface 41a, the tray 62 that supports the substrate 61, and the mask 63 that covers the tray 62 will be described.

  4A and 4B are schematic cross-sectional views of the substrate, tray, and mask. FIG. 4A is an overall view, and FIG. 4B is a schematic cross-sectional view of the substrate, tray, and mask in the YY ′ cross section of FIG. is there. In FIG. 4B, the support base 41s and the like are also displayed.

  The substrate 61 is, for example, a circular semiconductor wafer and has a thickness of 0.1 mm.

  The tray 62 is formed in a circular ring shape in plan view. The tray 62 includes a substrate support portion 62a that supports the outer edge of the substrate 61, and a mask support portion 62b that is located outside the substrate support portion 62a and above the upper surface of the substrate support portion 62a. The tray 62 is placed on the tray placement portion 41tr of the support base 41s. The substrate support part 62 a and the mask support part 62 b are both provided on the upper surface side of the tray 62. A groove 62t is provided between the substrate support 62a and the mask support 62b.

  The outer diameter of the tray 62 is larger than the diameter of the substrate 61, and the inner diameter of the tray 62 is smaller than the diameter of the substrate 61. The mask support part 62b is provided on the outer periphery side larger than the diameter of the substrate 61 in the tray 62, and the substrate support part 62a is provided on the inner periphery side of the mask support part 62b.

  The substrate 61 is supported by the tray 62 by placing the outer edge portion (peripheral edge portion) on the substrate support portion 62 a of the tray 62. The inner diameter of the mask support part 62 b is larger than the diameter of the substrate 61. The substrate 61 is housed inside the inner peripheral surface of the mask support 62b. The positional deviation in the radial direction of the substrate 61 is regulated by the inner peripheral surface of the mask support portion 62b.

  The mask 63 is formed in a circular ring shape like the tray 62. The outer diameter of the mask 63 is larger than the outer diameter of the tray 62. The inner diameter of the mask 63 is smaller than the inner diameter of the tray 62. The mask 63 is superposed while being placed on the mask support portion 62 b of the tray 62. In a state where the mask 63 is superimposed on the mask support portion 62b, the mask 63 covers all of the tray 62 including the substrate support portion 62a. Further, when the substrate 61 is supported by the tray 62, the mask 63 covers the outer edge portion of the substrate 61.

  On the outermost peripheral portion of the mask 63, a circular ring-shaped rib 63r protruding downward is provided. The mask 63 is fitted to the tray 62 in a state where the mask 63 is superimposed on the mask support portion 62 b of the tray 62. Further, since the tray 62 is accommodated on the inner peripheral side of the rib 63r, the positional deviation between the tray 62 and the mask 63 in the radial direction is restricted.

  The upper surface of the substrate support part 62a is configured to be lower than the upper surface of the mask support part 62b. In a state where the substrate 61 is attracted and fixed to the electrostatic attraction surface 41 a, a gap is formed between the surface to be processed of the substrate 61 (the upper surface of the substrate 61) and the lower surface of the mask 63. Further, in a state where the substrate 61 is attracted and fixed to the electrostatic attraction surface 41 a, a gap is formed between the lower surface of the substrate 61 and the upper surface of the substrate support portion 62 a of the tray 62. That is, the tray 62 and the mask 63 do not come into contact with the substrate 61 in a state where the substrate 61 is attracted and fixed to the electrostatic attracting surface 41 a.

  The plurality of pin portions 41p that can come into contact with the lower surface of the tray 62 can be moved up and down by a lifting mechanism. The upper end portion of the pin portion 41p comes into contact with the lower surface of the tray 62, and when the tray 62 is lifted, the substrate 61, the tray 62, and the mask 63 are separated from the support base 41s. At this time, electrostatic attraction by the electrostatic chuck is released.

The structure of the pin portion 41p and the like will be described again with reference to FIGS.
In the vacuum processing chamber 41, a lifter 41lf is installed. The lifter 41lf moves the assembly 60 between the transport arm 51 and the support base 41s. The lifter 41lf allows the tray 62 that supports the substrate 61 and the mask 63 that covers the tray 62 to move up and down. Thereby, the board | substrate 61 raises / lowers with respect to the electrostatic adsorption surface 41a.

  The lifting mechanism 41ma of the lifter 41lf can lift and lower the table portion 41tb and the pin portion 41p connected to the table portion 41tb. The elevating mechanism 41ma penetrates the bottom wall portion of the vacuum wall 41w and is connected to a driving mechanism such as a cylinder device or a motor outside the vacuum processing chamber 41. As the drive mechanism is driven, the elevating mechanism 41ma moves up and down.

  A table portion 41tb is connected to the lifting mechanism 41ma. A through hole through which the rotation shaft 41ra of the support base 41s passes is formed in the center of the table portion 41tb. The table portion 41tb can slide up and down relatively with respect to the rotation shaft 41ra.

  A plurality of pin portions 41p extending upward are provided on the table portion 41tb. Each of the plurality of pin portions 41p is inserted into a guide hole 41h penetrating in the vertical direction of the base body 41b. Each upper end portion of the plurality of pin portions 41p can protrude above the base body 41b.

  Further, the vacuum processing chamber 41 has a plurality of detection means capable of detecting the state of the assembly 60. Then, determination means 80 (see FIG. 1) is provided for determining that the positions of the mask 63 and the tray 62 are shifted based on a plurality of detection results from the detection means. For example, a detection means capable of detecting the positional deviation of the mask 63 with respect to the tray 62 is attached. The detection means is a plurality of weighing scales 46a to 46f attached to the surface of the tray mounting portion 41tr of the support base 41s. The determination unit 80 determines that the positions of the tray 62 and the mask 63 are misaligned when variations in the values of the plurality of detection results are not within the allowable values. Then, the vacuum processing on the substrate 61 is stopped.

  The surfaces of the weigh scales 46a to 46f protrude slightly upward from the surface of the tray placing portion 41tr. By installing a plurality of weighing scales 46a to 46f on the tray mounting portion 41tr, the weight balance in a state where the mask 63 covers the tray 62 can be measured.

  For example, a strain gauge is incorporated in each of the weighing scales 46a to 46f. When a load is applied to each of the weighing scales 46a to 46f, a mechanical minute change occurs in the strain gauge. That is, when the tray 62 and the mask 63 are placed on the tray placing portion 41tr, the load applied to each of the weight scales 46a to 46f is measured. In the vacuum processing apparatus 1, a value obtained by converting the strain, which is the minute change amount, into a weight can be detected as an electric signal. A cable for detecting an electric signal is passed through the inside of the rotating shaft 41ra of the support base 41s, and is connected to a measuring instrument provided outside the vacuum processing chamber 41 via a slip ring at the end of the rotating shaft 41ra. It is connected.

  The number of weigh scales is not limited to the number shown. Each of the plurality of weighing scales may be periodically arranged at equal intervals or may be non-periodically arranged.

  In the vacuum processing chamber 41, a sputtering source 45 is provided above the support base 41s. A plurality of (for example, two) sputtering sources 45 are provided in the vacuum processing chamber 41. The sputter source 45 has a target 45t. The target 45t is accommodated in a cup-shaped case 45c. The sputter source 45 is attached to the upper part of the vacuum wall 41w. The case 45c is opened toward the discharge space 41sp of the vacuum processing chamber 41. The target 45t is formed in a disk shape, for example.

  In the vacuum processing chamber 41, the surface to be sputtered of the target 45t is opposed to the electrostatic attraction surface 41a in a non-parallel (or inclined state) state.

  For example, the two targets 45t are disposed symmetrically around the center of the electrostatic attraction surface 41a. Further, the two targets 45t are provided so as to be inclined such that the closer to the electrostatic attraction surface 41a side, the wider the distance between them.

  In the vacuum processing chamber 41, a shutter mechanism 41mb is provided above the vacuum processing chamber 41. The shutter mechanism 41mb is connected to the rotation drive mechanism outside the vacuum processing chamber 41. The shutter mechanism 41mb includes a rotation shaft 41rb that is rotatably provided around a rotation center indicated by a one-dot chain line C2, a shutter plate 41st that is connected to a lower end portion of the rotation shaft 41rb and can shield the opening of the case 45c, Have

  The rotation of the rotation shaft 41rb causes the shutter plate 41st to move to a position facing the opening of one sputter source 45 (position indicated by a solid line in the figure) and a position facing the opening of the other sputter source 45 (see FIG. The position indicated by a two-dot chain line in the middle) can be selected. Since the shutter plate 41st faces the opening of the sputtering source 45, the target 45t mounted on the sputtering source 45 can be shielded from the discharge space 41sp. The shutter mechanism 41mb can also move up and down.

The operation of the vacuum processing apparatus 1 will be described with reference to FIGS.
First, the substrate 61 before film formation is carried into the load lock chamber 20 while being held by the tray 62 and the mask 63. At this time, the inside of the load lock chamber 20 is under atmospheric pressure.

  Next, after the inside of the load lock chamber 20 is evacuated to a desired reduced pressure atmosphere, the vacuum gate valve 22 of the load lock chamber 20 is opened, and the transfer arm 51 of the vacuum robot 50 installed in the transfer chamber 10 is moved. Enter the load lock chamber 20. Further, a tray 62 on which the substrate 61 and the mask 63 are placed and supported is placed on the transfer arm 51 and taken out to the transfer chamber 10 under reduced pressure.

  Subsequently, if necessary, the vacuum gate valve 30V is opened, and the tray 62 on which the substrate 61 and the mask 63 are placed and supported by the transfer arm 51 is carried into the pretreatment chamber 30 under reduced pressure. After carrying in, the vacuum gate valve 30V is closed. Then, pretreatment such as heating and cleaning is performed on the substrate 61.

  Next, the vacuum gate valve 30V of the pretreatment chamber 30 is opened, and the vacuum robot 50 takes out the tray 62 on which the substrate 61 and the mask 63 are placed and supported from the pretreatment chamber 30 to the transfer chamber 10. Thereafter, the vacuum gate valve 41 </ b> V of the vacuum processing chamber 41 is opened, and the transfer arm 51 of the vacuum robot 50 enters the vacuum processing chamber 41. Further, the tray 62 on which the substrate 61 and the mask 63 are placed and supported is carried into the vacuum processing chamber 41 under reduced pressure. After this loading, the vacuum gate valve 41V of the vacuum processing chamber 41 is closed.

  In the vacuum processing chamber 41, the tray 62 is transferred from the transfer arm 51 of the vacuum robot 50 onto the plurality of pin portions 41p of the lifter 41lf. And the pin part 41p falls and the board | substrate 61 is adsorbed and fixed to the electrostatic adsorption surface 41a of the support stand 41s. At this time, the substrate 61 is attracted to the electrostatic attraction surface 41a in a state of being out of support of the tray 62, and the tray 62 and the mask 63 are in contact with the substrate 61 in the state of being attracted to the electrostatic attraction surface 41a. Not.

  A heating mechanism such as a heater is built in the support base 41s in the vacuum processing chamber 41, and the substrate 61 adsorbed on the electrostatic attraction surface 41a is controlled to a desired temperature. In this state, the support base 41 s is rotated, and the sputter film forming process is performed on the substrate 61. Subsequently, in the vacuum processing chambers 42, 43, and 44, the sputter film forming process is performed by the same operation. When the sputter film forming process is completed, the tray 62 on which the substrate 61 and the mask 63 are placed and supported is returned to the load lock chamber 20 via the transfer chamber 10 by the vacuum robot 50.

  In the vacuum processing chambers 41 to 44, detection means capable of detecting the state in which the mask 63 is detached from the tray 62 is attached to the vacuum processing chamber 41. It is detected whether or not the state in which the mask 63 is superimposed on the mask support portion 62b of the tray 62 is normal. The detection means is also attached to the vacuum processing chambers 42 to 44.

  FIGS. 5A and 5B are diagrams for explaining the operation of the detection means, where FIG. 5A is a plan view when the mask and the tray overlap normally, and FIG. 5B is a plan view when the mask is removed from the tray. FIG.

  The detecting means is, for example, a plurality of weighing scales 46a to 46f attached to the surface of the tray mounting portion 41tr of the support base 41s. The detection results obtained by the plurality of detection means are detected by the plurality of weighing scales 46a to 46f attached to the support base 41s after the assembly 60 is placed on the support base 41s.

  The state of the tray 62 and the mask 63 shown in FIG. 5A is the same as the state illustrated in FIG. The mask 63 is fitted to the tray 62 in a state of being superimposed on the mask support portion 62 b of the tray 62. This state is a normal state of the positional relationship between the mask 63 and the tray 62.

  That is, in FIG. 4 and FIG. 5A, the tray 62 is placed on the tray placement portion 41tr of the support base 41s. The substrate 61 is placed on the substrate support portion 62 a of the tray 62. The positional deviation in the radial direction of the substrate 61 is restricted by the inner peripheral surface of the mask support portion 62b. The mask 63 is superposed while being placed on the mask support portion 62 b of the tray 62. With the mask 63 superimposed on the mask support 62b, the mask 63 covers all of the tray 62 including the substrate support 62a. Further, the mask 63 covers the outer edge portion of the substrate 61. Since the tray 62 is accommodated on the inner peripheral side of the rib 63r, the mutual displacement of the tray 62 and the mask 63 in the radial direction is restricted.

  When the positional relationship between the mask 63 and the tray 62 is normal, the first center point 63c of the mask 63 and the second center point 62c of the tray 62 are in a state where the mask 63 is placed on the tray 62. It is almost overlapping.

  In such a state, substantially the same weight is applied to each of the weighing scales 46a to 46f, and the weight values detected by each of the weighing scales 46a to 46f are substantially the same. In other words, if the weights applied to the weigh scales 46a to 46f are substantially the same and within the allowable value, the positional relationship between the tray 62 and the mask 63 is in a normal state. When the positional relationship between the tray 62 and the mask 63 is in a normal state, a vacuum process is performed on the substrate 61.

  On the other hand, in FIG. 5B, the first center point 63 c of the mask 63 and the second center point 62 c of the tray 62 are shifted. This “deviation” occurs, for example, when the mask 63 is not sufficiently fitted to the tray 62 and the mask 63 is detached from the tray 62.

  In such a state, substantially the same weight is not applied to each of the weighing scales 46a to 46f. For example, the weight value is higher on the side of the weighing scale 46e and lower on the side of the weighing scale 46b. Therefore, the values detected by the weight scales 46a to 46f vary. In other words, if the weights applied to the weigh scales 46a to 46f are substantially the same and are not outside the allowable value, the tray 62 and the mask 63 are in an abnormal state. When the positional relationship between the tray 62 and the mask 63 is not in a normal state, the vacuum processing for the substrate 61 is interrupted. When interrupted, the substrate 61, the tray 62, and the mask 63 are immediately returned to the load lock chamber 20, and the positional relationship between the tray 62 and the mask 63 is restored to a normal state. Or it stops as an error.

  If the substrate 61, the tray 62, and the mask 63 are transferred to the vacuum processing chambers 41 to 44 via the transfer chamber 10 in a state where the positional relationship between the mask 63 and the tray 62 is not in a normal state, There is a possibility that the chip 63 or the mask 63 itself falls in any one of the transfer chamber 10, the vacuum processing chambers 41 to 44, or the vacuum gate valves 41V to 44V.

  If the chip of the substrate 61 adheres to the electrostatic adsorption surface 41a, the substrate 61 adsorbed on the electrostatic adsorption surface 41a may be damaged by the chip. Further, the dropping of the mask 63 in the vacuum processing apparatus 1 may damage members in the vacuum processing apparatus 1. As a result, the manufacturing process is delayed and the manufacturing cost is increased.

  In the vacuum processing apparatus 1, it can be detected in advance in the vacuum processing chambers 41 to 44 whether or not the positional relationship between the tray 62 and the mask 63 is in a normal state. Therefore, chipping of the substrate 61 and dropping of the mask 63 itself can be prevented in advance. Therefore, the delay of the manufacturing process and the increase in manufacturing cost can be suppressed.

  The vacuum processing apparatus 1 can detect whether or not the positional relationship between the tray 62 and the mask 63 is in a normal state in the vacuum processing chambers 41 to 44 while the substrate 61 is being vacuum processed. In a structure in which an optical sensor is attached outside the vacuum processing apparatus as in a conventional vacuum processing apparatus, the window material must be shielded during the vacuum processing in order to avoid contamination of the window material. For this reason, during the vacuum processing, it has not been possible to detect whether the positional relationship between the tray 62 and the mask 63 is in a normal state.

  Also, in the structure where the optical sensor is attached outside the vacuum processing device as in the conventional vacuum processing device, the degree of freedom of the mounting location of the optical sensor is restricted by the arrangement of the vacuum port, pressure gauge, vacuum line, electrode, etc. was there.

  In the vacuum processing apparatus 1, the weight scales 46 a to 46 f are covered with the tray 62 during the vacuum treatment on the substrate 61. Therefore, even if the vacuum treatment is continued for a long time, no film is formed on the surfaces of the weighing scales 46a to 46f.

Since the weighing scales 46a to 46f are attached to the inside of the vacuum processing apparatus 1, the above-described sensor window member and shielding mechanism are not required. Therefore, the vacuum processing apparatus 1 has a simpler structure, and the cost increase of the vacuum processing apparatus is suppressed.
Subsequently, a modified example of the detection means will be described. The following modification also has the same effect as the first embodiment.

(Second Embodiment)
FIG. 6 is a schematic diagram of a vacuum processing apparatus according to the second embodiment, (a) is a schematic plan view of a vacuum processing chamber, and (b) is a YY ′ position in (a). It is a cross-sectional schematic diagram. FIG. 6A shows a state where the vicinity of the support base 41 s in the vacuum processing chamber 47 is transmitted. In FIG. 6A, the substrate 61, the tray 62, and the mask 63 shown in FIG. 6B are not displayed.

  The basic structure of the vacuum processing chamber 47 is the same as the basic structure of the vacuum processing chamber 41. However, in the vacuum processing chamber 47, weigh scales 46a, 46b, and 46c are attached to the upper ends of the respective pin portions 41p of the lifter 41lf. In the second embodiment, the weigh scales 46a, 46b, 46c attached to the respective tips of the plurality of pin portions 41p are detection means. That is, the detection results obtained by the plurality of detecting means are the weight scales attached to the respective tips of the plurality of pin portions 41p of the lifter 41lf after the assembly 60 is placed on the plurality of pin portions 41p of the lifter 41lf. Detected by 46a, 46b, 46c.

  When the positional relationship between the tray 62 and the mask 63 is normal, the weights 46a, 46b, and 46c are respectively weighted within the allowable values, and the weight values detected by the weight scales 46a, 46b, and 46c, respectively. Is within the tolerance. In other words, it can be determined that the positional relationship between the tray 62 and the mask 63 is in a normal state if the weights applied to the weigh scales 46a, 46b, and 46c are substantially the same and are within an allowable value.

  When the positional relationship between the tray 62 and the mask 63 is not in a normal state, the weight within the allowable value is not applied to each of the weighing scales 46a, 46b, and 46c. The weight value detected by each of the weigh scales 46a, 46b, 46c is a value outside the allowable value. In other words, if the weights applied to the weigh scales 46a, 46b, and 46c indicate values outside the allowable values, it can be determined that the positional relationship between the tray 62 and the mask 63 is not in a normal state.

  As described above, the detection unit according to the second embodiment can detect whether or not the positional relationship between the tray 62 and the mask 63 is in a normal state.

  The cables connected to the weigh scales 46a, 46b, and 46c are connected to a measuring device provided outside the vacuum processing chamber 47 through the inside of the pin portion 41p, the inside of the table portion 41tb, and the inside of the lifting mechanism 41ma. Yes.

  The number of pin portions 41p is not limited to the number illustrated. In addition, each of the plurality of pin portions 41p may be periodically arranged at equal intervals or may be aperiodically arranged. A weight scale can be attached to each of the plurality of pin portions 41p.

(Third embodiment)
FIG. 7 is a schematic plan view of a vacuum processing apparatus according to the third embodiment.
8 is a cross-sectional view taken along the line ZZ ′ of FIG. 7. FIG. 8A is a diagram in which the positional relationship between the tray and the mask is in a normal state, and FIG. 8B is a diagram in which the positional relationship between the tray and the mask is in a normal state. FIG.

  FIG. 7 shows a state in which the vicinity of the support base 41 s in the vacuum processing chamber 48 is transmitted. In FIG. 7, the substrate 61, the tray 62, and the mask 63 displayed in FIG. 8 are not displayed.

  The basic structure of the vacuum processing chamber 48 shown in FIG. 7 is the same as the basic structure of the vacuum processing chamber 41. However, in the vacuum processing chamber 48, a plurality of light emitting portions 70a to 70f are attached to the tray mounting portion 41tr of the support base 41s. Furthermore, the light receiving parts 71a to 71f adjacent to the light emitting parts 70a to 70f are attached to the tray mounting part 41tr of the support base 41s.

  The light emitting units 70a to 70f are, for example, semiconductor light emitting elements such as semiconductor lasers and LEDs (Light Emitting Diodes). The light receiving portions 71a to 71f are optical sensors such as charge coupled devices, for example.

  The detection unit according to the third embodiment is configured to mask light emitted from each of the plurality of light emitting units 70a to 70f attached to the tray mounting unit 41tr of the support base 41s and the plurality of light emitting units 70a to 70f. 63, and light receiving portions 71a to 71f that receive the light reflected from the mask 63. Each of the light emitting portions 70 a to 70 f is arranged so that light 70 p emitted from each of the light emitting portions 70 a to 70 f hits the outer end portion 63 e of the mask 63. As a result of detection by the plurality of detection means, after the assembly 60 is placed on the support base 41s, the light emitted from each of the plurality of light emitting portions 70a to 70f attached to the support base 41 is irradiated onto the mask 63. The light reflected from the mask 63 is detected by each of the light receiving portions 71a to 71f receiving light.

  For example, in the normal state of FIG. 8A, the light 70p emitted from the light emitting portion 70d irradiates the outer end portion 63e of the mask 63. The light 70p is reflected to the light receiving portion 71d side by the outer end portion 63e. The light receiving unit 71d receives the reflected light 70p. That is, when the positional relationship between the tray 62 and the mask is in a normal state, light emitted from each of the light emitting units 70a to 70f is received by each of the light receiving units 71a to 71f. In this case, the light intensity received by each of the light receiving portions 71a to 71f is substantially the same.

  On the other hand, as shown in FIG. 8B, when the mask 63 is removed from the tray 62, the light 70p emitted from the light emitting portion 70d does not irradiate the outer end portion 63e of the mask 63, and the vacuum is released. The light passes through the processing chamber 48. Although the light 70p transmitted upward is reflected by the upper wall or the like of the vacuum processing chamber 48, the intensity thereof is weaker than that of the light 70p reflected by the outer end 63e. That is, when the positional relationship between the tray 62 and the mask is not in a normal state, the light emitted from each of the light emitting units 70a to 70f is received by each of the light receiving units 71a to 71f, but the light receiving units 71a to 71f. The intensity of light received by each of these varies.

  Thus, the detection unit according to the third embodiment can detect whether or not the positional relationship between the tray 62 and the mask 63 is in a normal state.

  Electrical wiring is connected to each of the light emitting portions 70a to 70f and each of the light receiving portions 71a to 71f. Each electric wiring passes through the inside of the rotating shaft 41ra of the support base 41s, and is connected to a measuring instrument provided outside the vacuum processing chamber 48 through a slip ring at the end of the rotating shaft 41ra. . An optical fiber may be used instead of the electrical wiring.

  The numbers of the light emitting units and the light receiving units are not limited to the numbers illustrated. In addition, each of the plurality of light emitting units and light receiving units may be periodically arranged at regular intervals, or may be arranged aperiodically.

(Fourth embodiment)
FIG. 9 is a schematic perspective view of a vacuum processing apparatus according to the fourth embodiment. FIG. 9A is a schematic perspective view of a transfer arm of a vacuum robot provided in the transfer chamber, and FIG. It is a perspective schematic diagram of the state which supports the assembly with which the tray and the mask became one set.

  The detection means according to the fourth embodiment is a plurality of weighing scales 75 a to 75 e attached to the surface of the transfer arm 51 of the vacuum robot 50. Detection means capable of detecting the state in which the mask 63 is detached from the tray 62 is attached in the transfer chamber 10. The detection results by the plurality of detection means are detected by a plurality of weighing scales 75a to 75e attached to the surface of the transfer arm 51.

  When the assembly 60 including the substrate 61, the tray 62, and the mask 63 is transported by the transport arm 51, the assembly 60 is supported by the transport arm 51.

  When the positional relationship between the tray 62 and the mask 63 is normal, substantially the same weight is applied to each of the weighing scales 75a to 75e, and the weight values detected by the weighing scales 75a to 75e are substantially the same. In other words, if the weights applied to the weigh scales 75a to 75e are substantially the same and within the allowable value, it can be determined that the positional relationship between the tray 62 and the mask 63 is in a normal state.

  When the positional relationship between the tray 62 and the mask 63 is not in a normal state, the weight within the allowable value is not applied to each of the weight scales 75a to 75e. The weight values detected by each of the weigh scales 75a to 75e show different values. In other words, if the weights applied to the weigh scales 75a to 75e indicate a value outside the allowable value, it can be determined that the positional relationship between the tray 62 and the mask 63 is not in a normal state.

  As described above, the detection unit according to the fourth embodiment can detect whether or not the positional relationship between the tray 62 and the mask 63 is in a normal state.

  Cables connected to the weigh scales 75 a to 75 e are connected to a measuring instrument provided outside the transfer chamber 10 through the vacuum robot 50.

  The number of weigh scales is not limited to the number shown. In addition, each of the plurality of weighing scales may be periodically arranged at regular intervals, or may be arranged aperiodically.

  The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. In other words, those specific examples that have been appropriately modified by those skilled in the art are also included in the scope of the present invention as long as they have the characteristics of the present invention. Each element included in each of the specific examples described above and their arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be appropriately changed.

In addition, each element included in each of the above-described embodiments can be combined as long as technically possible, and combinations thereof are also included in the scope of the present invention as long as they include the features of the present invention.
In addition, in the category of the idea of the present invention, those skilled in the art can conceive of various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present invention. .

DESCRIPTION OF SYMBOLS 1 Vacuum processing apparatus 10 Transfer chamber 20 Load lock chamber 21 Atmospheric gate valve 22, 30V, 41V, 42V, 43V, 44V Vacuum gate valve 30 Pre-processing chamber 41, 42, 43, 44, 47, 48 Vacuum processing chamber 41a Electrostatic Adsorption surface 41b Substrate 41d Ceramic plate 41h Guide hole 41lf Lifter 41ma Lifting mechanism 41mb Shutter mechanism 41p Pin part 41ra, 41rb Rotating shaft 41s Support base 41sp Discharge space 41st Shutter plate 41tb Table part 41tr Tray mounting part 41w Vacuum wall 45 Sputter source 45 Case 45t Target 46a, 46b, 46c, 46d, 46e, 46f, 75a, 75b, 75c, 75d, 75e Weigh scale 50 Vacuum robot 51 Transport arm 60 Assembly 61 Substrate 62 Tray 62a Substrate support 62 b Mask support part 62c, 63c Center point 62t Groove part 63 Mask 63e Outer end part 63r Rib 70a, 70b, 70c, 70d, 70e, 70f Light emitting part 70p Light 71a, 71b, 71c, 71d, 71e, 71f Light receiving part 80 Judgment means

Claims (10)

A vacuum processing chamber for vacuum processing the substrate;
An assembly comprising the substrate, a tray on which the substrate can be placed, and a mask placed on the tray;
A transfer arm for transferring the assembly into the vacuum processing chamber;
A support base installed in the vacuum processing chamber and supporting the assembly;
A lifter installed in the vacuum processing chamber for moving the assembly between the transfer arm and the support;
With
A plurality of detection means capable of detecting the state of the assembly;
A vacuum processing apparatus, comprising: a determination unit configured to determine that the positions of the mask and the tray are shifted based on a plurality of detection results from the detection unit.   The vacuum processing apparatus according to claim 1, wherein the detection unit includes a plurality of weighing scales attached to the support base. The lifter has a plurality of pin portions that can contact the lower surface of the tray,
The vacuum processing apparatus according to claim 1, wherein the detection unit includes a weight meter attached to each tip of the plurality of pin portions.   The detection means receives a plurality of light emitting portions attached to the support base and light emitted from each of the plurality of light emitting portions and receiving the light reflected from the mask. The vacuum processing apparatus according to claim 1, further comprising: a light receiving unit.   The vacuum processing apparatus according to claim 1, wherein the detection unit includes a plurality of weighing scales attached to a surface of the transfer arm. In the vacuum processing apparatus according to claim 1,
When the variation of each value of the plurality of detection results is not within an allowable value, it is determined that the position of the tray and the mask is shifted,
A vacuum processing method, wherein the vacuum processing is stopped.   The vacuum processing method according to claim 6, wherein the plurality of detection results are detected by a plurality of weighing scales attached to the support base after the assembly is placed on the support base.   The plurality of detection results are detected by a weighing scale attached to each tip of the plurality of pin portions of the lifter after the assembly is placed on the plurality of pins of the lifter. The vacuum processing method according to claim 6.   The plurality of detection results are reflected from the mask by irradiating the mask with light emitted from each of a plurality of light emitting units attached to the support after the assembly is placed on the support. The vacuum processing method according to claim 6, wherein each of the light receiving units receives the light to be detected.   The vacuum processing method according to claim 6, wherein the plurality of detection results are detected by a plurality of weighing scales attached to a surface of the transfer arm.

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