JP2012169494A - Cooling system and method for efficiently cooling apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool an apparatus that requires cooling.SOLUTION: A system for cooling an apparatus comprises: temperature measuring means for measuring temperatures of individual grids by dividing plate-like heat generation sources, which are juxtaposed by having a plurality of devices, in a predetermined grid pattern; cooling means for enabling the heat generation source to be cooled in such a manner as to correspond to the grid; and heat density distribution monitoring means for centralizing or decentralizing the heat generation sources by changing operations of the juxtaposed devices on the heat generation sources on the basis of the temperatures of the individual grids, which are measured by the temperature measuring means, and for making the cooling means controlled in such a manner as to correspond to a generated heat value.

Description

  The present invention relates to a base station apparatus used in a mobile communication system and a cooling system used in a server rack. More specifically, the present invention relates to a cooling system characterized by a method for treating heat generated during operations such as information processing, and efficiency. The present invention relates to a method for cooling a static device.

  In recent years, many base stations have been installed due to the spread of mobile terminals. In addition, in order to increase the speed of communication systems, increase data communication traffic, and reduce the size of base stations, devices in the base stations are increased in speed and integrated. In the base station, in order to cope with such an increase in traffic, a large number of devices having the same function are formed into cards (boarded). Some servers used in computer systems have a large number of devices having the same function.

  The conventional base station apparatus is entirely cooled by a large number of large fans (FANs), and by operating as a base station, the temperature inside the apparatus rises as the temperature of some devices rises. In order to cool it appropriately, the fan speed is increased.

  The temperature rise in the base station apparatus has become a big problem because of the mounting of electronic equipment with high performance and high density of the base station apparatus.

As a technique for solving such a problem, Patent Document 1 is cited.
In Patent Document 1, in order to reduce the amount of power consumed by the fan unit, the operation state is detected for each card (printed circuit board) that realizes the configuration functions of various base stations necessary for communication. Technology that performs fan control corresponding to cards that have unnecessary or malfunctioning functions in conjunction with each card and the fan, while preventing the load from being biased to a predetermined card according to the detected operating state of the card Are listed.

  A similar problem occurs in the server device.

JP 2002-27109 A

  The technique described in Patent Document 1 detects whether a card is mounted or not mounted on a card basis. In addition, the maintenance staff detects the mounting / non-mounting by changing the operation of the cooling means by inserting and removing the card at the site. Further, the operation of the cooling means is changed by detecting a failure of the fan or the like.

  However, when the cooling efficiency of the entire apparatus is improved as described above, there is a problem that heat generated by individual devices cannot be dealt with. This is because the existing cooling method cannot intensively cool only a specific area in a card where a device that is at a high temperature exists based on external instructions, and the entire card or the entire apparatus can be cooled with a large number of fans. It is cooling. Therefore, there is a problem that extra power is consumed for cooling.

  The present invention has been made in view of the above problems, and provides a cooling system capable of efficiently cooling the inside of the apparatus by combining the management of the operation state of the device in the apparatus and the control of the cooling means. With the goal.

  The cooling system according to the present invention comprises a temperature measuring means for measuring a temperature of each grid by dividing a plate-like heat source having a plurality of devices arranged in parallel into a predetermined grid, and the heat generation Based on the cooling means for allowing the source to cool in correspondence with the grid and the temperature of the individual grids measured by the temperature measuring means, the operation of the parallel devices on the heat source is changed. Thus, the heat source is concentrated or dispersed, and a heat density distribution monitoring unit for controlling the cooling unit according to the generated heat generation amount is provided.

  According to the present invention, based on the measurement result of the temperature measuring means, the cooling that can efficiently cool the inside of the apparatus by integrally performing the management of the operation state of the device in the apparatus and the control of the cooling means. Can provide a system.

It is the schematic which shows a part of base station apparatus of one Embodiment. It is the schematic which shows a part of base station apparatus of 2nd Embodiment. It is the schematic which shows a part of base station apparatus of 3rd Embodiment. It is the schematic which shows the cooling system which concerns on an Example. It is explanatory drawing which illustrates the preparation method of the heat density distribution map which concerns on an Example. It is explanatory drawing which illustrates the method to distribute the operation | movement of the device which concerns on an Example. It is explanatory drawing which illustrates the method of concentrating the operation | movement of the device which concerns on an Example. It is a flowchart which shows the processing operation which concentrates the operation | movement of the device which concerns on an Example. It is a flowchart which shows the processing operation which distributes the operation | movement of the device which concerns on an Example. It is explanatory drawing which illustrates the arrangement position of a sheet-like thermal monitor. It is explanatory drawing which shows the processing operation which concentrates operation | movement to one card | curd, when there exist several cards in an apparatus.

  An embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a schematic diagram illustrating a part of a base station apparatus according to an embodiment.

  In the base station apparatus 10 according to the embodiment, the heat density distribution of the base station circuit board 100 serving as a heat generation source in the base station apparatus 10 is measured, and the use time and the idle time of each of the parallel devices are measured. The amount of heat generated is converted into information using the concept of a heat density distribution map per card (board), and the usage status of each device is managed and controlled based on the heat density distribution map. Cool properly.

  Therefore, a heat density distribution monitoring function unit 110 that generates and uses a heat density distribution map is provided for heat management of the base station apparatus 10. In addition, the base station apparatus 10 includes a thermal monitor 120 and a cooling unit 130 that cooperate with the heat density distribution monitoring function unit 110.

  The base station circuit board 100 has a plurality of devices that realize individual functions, and the individual devices are arranged in parallel. Base station circuit board 100 is cooled at a predetermined position by cooling unit 130.

  The thermal monitor 120 is a plurality of grids that can identify the surface position of one card having a plurality of devices arranged or mounted in parallel, which are heat sources constituting the base station circuit board 100, in a plane coordinate system. And measure the temperature of each grid individually. Each sensor of the thermal monitor 120 may be a card-mounted temperature sensor that measures the temperature of the heat generating portion mounted on the surface of the card and directly bonded to the heat generating portion or in the vicinity of the heat generating portion. On the other hand, a sheet-type temperature sensor that measures the temperature in a form of surface contact or a form of contact may be used. At this time, the card-mounted temperature sensor operated as the thermal monitor 120 can measure the temperature of each element of the device (device targeted for concentration / distribution of operation) mounted on the base station circuit board 100 in a plane. Install it like this. The thermal monitor 120 of the sheet type temperature sensor can measure a planar radiation temperature distribution. In the temperature measurement, a sheet-type thermal monitor 120 may be directly attached to the front surface or the back surface of the card, and the heat density distribution of each grid unit may be measured. In addition, the sheet-type temperature sensor includes a method in which one temperature sensor is attached to the entire card and a method in which the sheet is divided so that the temperature of a specific portion of the target grid can be measured, and one or more sheets are attached to the card. is there. By dividing, it is possible to measure the temperature distribution of the necessary area only for the necessary part according to the position of the heat generation target. In addition, the sheet-type thermal monitor 120 may be configured to prepare a plurality of single sheet-type temperature sensors in charge of one grid, and a plurality of necessary portions may be affixed on one sheet. May be a general sheet in which a plurality of temperature sensors are evenly arranged. Further, a plurality of types of temperature sensors, for example, a sheet-like sensor having a plurality of temperature sensors and a sheet-like sensor having one temperature sensor may be combined and attached to the front surface, back surface, or both surfaces of the card.

  The cooling unit 130 can select or collectively cool individual grids or a plurality of grids by causing the heat generation source of the base station circuit board 100 to correspond to the grid of the thermal monitor 120, and the heat density distribution monitoring function unit 110 Operates according to control. The cooling unit 130 can adjust its cooling performance, and for example, it is only necessary to adjust the rotation speed of the fan or change the wind direction by operating a louver. Further, as a cooling method other than air cooling, water cooling or oil cooling may be used.

  The thermal density distribution monitoring function unit 110 is connected to a thermal monitor 120 that operates as a temperature measurement unit, a base station circuit board 100 that is a heat generation source and is a cooling target, and a cooling unit 130 that operates as a cooling unit.

  The heat density distribution monitoring function unit 110 efficiently cools the device in operation based on the heat density distribution map generated from the measurement result detected by the thermal monitor 120 and the capability of the cooling unit 130. At this time, the control of the cooling unit 130 is controlled, and the operation of each device is instructed to be concentrated, distributed, or a combination thereof. This instruction sets in advance whether the operation of the device is concentrated or distributed at the center or the end side in correspondence with the heat density distribution map. Further, as an example of a combination of concentration and dispersion, there is a combination in which a high heat generation source is concentrated at the central portion and a high heat generation source is disposed at an end portion and cooled. Also, a combination of concentrating high heat sources at the points of intake air and waste air and averaging other heat sources may be used. That is, the operation and load of the device are moved so that the heat source is moved to a point where it can be efficiently cooled.

  The thermal density distribution monitoring function unit 110 causes the thermal monitor 120 to measure the temperature of each grid so as to correspond to the designated grid, obtains the detection result, and creates a thermal density distribution map. The detection of the heat density distribution may be periodically measured, measured according to the amount of temperature change, or measured in combination.

  In creating the heat density distribution map, for example, a range in which one fan can be cooled may be handled as one grid. Further, the base station circuit board 100 may be divided into grids for each measurement resolution of the thermal monitor 120 to represent the temperature of the grid. Further, the grid may be divided in association with each device that becomes a heat generation source.

  Each grid on the generated heat density distribution map can be divided into two or more areas as a plurality of areas. For example, a plurality of grids may be collectively managed as an area at regular intervals. Further, the coolable range may be managed as a large area by the operation of both adjacent fans. Further, this large area may correspond to a predetermined operation of the base station circuit board 100. Here, the predetermined operation includes, for example, predetermined arithmetic processing performed by a device designated to be used at the time of transmission of a specific signal, function movement processing between parallel devices, load movement processing, and the like. It is done.

  The heat density distribution monitoring function unit 110, when controlling the operation of the individual devices together with the operation control of the cooling unit 130, cools the individual device so that the operation of the device is concentrated from the other region to the region where the heat generation amount is large. Is generated and notified to the base station circuit board 100. The operation instruction may be created and delivered as a device operation map.

  When the heat density distribution monitoring function unit 110 distributes the operation of individual devices together with the operation control of the cooling unit 130 for cooling, the individual operation is performed so that the operation of the devices is distributed from the region where the heat generation amount is large to other regions. A device operation instruction is created and notified to the base station circuit board 100. The operation instruction may be created as a device operation map.

  For example, a judgment criterion for a region having a large calorific value is exemplified by setting a heat density distribution in a sleep state, a low processing state, and a normal state as a threshold value for all devices, and setting this as a target of the heat density distribution in each region. When the entire apparatus is uniformly cooled, an operation instruction is generated in the form of a device operation map or the like so as to distribute the operation of the device from an area larger than the threshold to an area smaller than the threshold, and is notified to the base station circuit board 100.

  With such a configuration, it becomes possible to efficiently cool the inside of the base station apparatus without consuming energy in the cooling unit 130 and inefficiently cooling an area with small heat generation. As a result, there are merits of reducing power consumption and reducing noise such as rotating sound.

Next, another embodiment is shown. Note that the description of the same parts as those of the first embodiment is simplified or omitted.
FIG. 2 is a schematic diagram illustrating a base station apparatus according to the second embodiment.
In the base station apparatus 20 according to the second embodiment, the heat density distribution of the base station circuit board 100 for each card in the base station apparatus 20 is measured and converted into information by a heat density distribution map, and the individual heat Based on the density distribution map, the use status of the entire device is managed and controlled, and the cooling means is controlled to perform efficient cooling.

  The heat density distribution monitoring function unit 210 is provided for thermal management of the plurality of base station circuit boards 100 of the base station device 20. The base station apparatus 20 includes a plurality of thermal monitors 120 and a plurality of cooling units 130 that cooperate with the heat density distribution monitoring function unit 110. In addition, you may provide the cooling part 230 which cools the whole.

  Each thermal monitor 120 divides one card, which is the base station circuit board 100, into a predetermined grid shape, and measures the temperature of each grid. Note that the temperature of two or more adjacent base station circuit boards 100 may be measured by one thermal monitor 120.

  Each cooling unit 130 can cool the heat generation source of each base station circuit board 100 and operates under the control of the heat density distribution monitoring function unit 110. In addition, you may comprise so that two or more adjacent base station circuit boards 100 can be cooled collectively.

  The heat density distribution monitoring function unit 210 is connected to each base station circuit board 100, each thermal monitor 120, and the cooling unit (130, 230).

The heat density distribution monitoring function unit 210 requires each device of the operating base station circuit board 100 based on the heat density distribution map generated from the heat density distribution detected by each thermal monitor 120 and the capability of the cooling unit. Cool to respond. At this time, operation control of each cooling unit 130 and the whole cooling unit 230 is performed. In addition to the control of the cooling unit 130 and the entire cooling unit 230, the operation of each device is instructed to be concentrated, distributed, or a combination thereof beyond the card frame as necessary. This instruction sets in advance whether the operation of the device is concentrated or distributed centrally or on the end side in correspondence with the heat density distribution map. Moreover, you may produce | generate the integrated heat density distribution map which shows the three-dimensional heat density distribution which considered the physical three-dimensional structure of the base station apparatus 20 from the produced | generated individual heat density distribution map.
That is, the thermal monitor 120 measures the temperature of each grid so as to correspond to the specified grid, and the thermal density distribution monitoring function unit 210 acquires the detection result and creates a plurality of thermal density distribution maps. Then, an integrated heat density distribution map is generated as necessary.

  The generated heat density distribution map, and the integrated heat density distribution map generated as necessary, are set in a region in which the grid is integrated and a large region in which the region is integrated, and the heat density distribution monitoring function unit 210 sets the cooling unit 130 and the cooling unit. Used for controlling the unit 230.

  The heat density distribution monitoring function unit 210 concentrates the operation of devices from other regions in a region where a large amount of heat is generated when cooling the operation of individual devices together with the operation control of the cooling unit 130 and the cooling unit 230. The operation instruction of each device is created and notified to the base station circuit board 100. Similarly, the heat density distribution monitoring function unit 210 controls the operation of the cooling unit 130 and the cooling unit 230 and distributes the operation of each device to cool the device from the region where the heat generation amount is large to another region. An operation instruction for each device is generated so as to distribute the operation, and the base station circuit board 100 is notified.

  With such a configuration, it becomes possible to efficiently cool the inside of the base station apparatus without consuming energy in the cooling unit 130 and the cooling unit 230 and inefficiently cooling an area where heat generation is small. As a result, there are merits of reducing power consumption and reducing noise such as rotating sound.

Next, a third embodiment will be described. Note that the description of the same parts as those of the first and second embodiments is simplified or omitted.
The configuration of the base station device 30 of the third embodiment is the same as that of the base station device 20 of the second embodiment, and the method of using the heat density distribution map is different. Each heat density distribution map has a grid and a region in which the grids are gathered. Moreover, it has the large area | region demonstrated in description of 1st Embodiment.

  In the third embodiment, the heat density distribution monitoring function unit 310 uses a prediction map corresponding to a predetermined operation of the base station circuit board 100. Here, the prediction map is information stored and held in advance regarding the relevance of each device that generates heat in response to a predetermined operation. The heat density distribution monitoring function unit 310 drives the cooling unit 120 and the cooling unit 230 according to the information, so that the reaction rate for heat generation can be increased or decreased. In other words, by maintaining the heat generation point as a prediction map that corresponds to the area or large area, it becomes possible to start cooling at the start of heat generation of each device or after a predetermined time after heat generation, and if necessary before heat generation Cooling can also be started. In addition, since it is associated as a large area, it is possible to easily follow cooling even if the device that performs a predetermined operation is changed. It is desirable for the prediction map to store the amount of heat generation per hour and device interlocking. The predetermined operation may be acquired as an operation notification from each of the base station circuit boards 100 as illustrated, or may be acquired collectively from any of the base station circuit boards 100. Further, it may be acquired from a higher-level device (such as RNC or MME), or may be acquired from the communication status between the higher-level device and the base station device (number of calls increased or decreased, traffic increase / decrease of a predetermined call). The format of the operation notification may be the same format as the device operation map or may be another format.

  At this time, the heat density distribution obtained from the thermal monitor 120 can also be used to confirm that the temperature change of the grid belonging to the large region is within a predetermined value (within prediction).

  The large area and the prediction map may be created across a plurality of cards as necessary.

  Moreover, the prediction map may be mapped so that time may pass. This is because, for example, it is predicted that data communication with the mobile station will be performed after processing associated with call setup, and the communication amount at the start of data communication can also be predicted. By mapping the change in the heat generation amount in advance according to time, timing, communication amount, etc., the cooling destination device, the cooling timing, and the cooling amount can be predicted.

  Further, the heat density distribution monitoring function unit 310 may be provided with a prediction map construction unit (not shown). The prediction map construction unit generates and corrects a prediction map in correspondence with the current operation of the base station circuit board 100. That is, the difference between the prediction of heat generation corresponding to a predetermined communication operation and the actual measurement obtained from the thermal monitor 120 may be corrected. When there is no prediction map, the heat density distribution monitoring function unit 310 may generate a prediction map from the actual measurement obtained from the thermal monitor 120 and the operation of the base station circuit board 100.

  With such a configuration, the heat generation point and the amount thereof are estimated without efficiently consuming the low heat generation area by consuming energy in the cooling unit 130 and the cooling unit 230, and the efficiency in the base station apparatus. Cooling is possible. For example, in response to the start of a predetermined communication, it is possible to estimate a device that generates heat in addition to the current amount of heat from a predetermined amount of time sequentially after a predetermined time, and change the device operating status allocation as necessary Then, the output to the cooling unit that can cool the devices can be increased by the amount corresponding to the heat generation amount. In addition, since it is possible to estimate a device whose calorific value decreases after a predetermined time, it is possible to gradually reduce the cooling capacity of the cooling unit in a timely manner. As a result, there are merits of reducing power consumption and reducing noise such as rotating sound.

  Next, an Example is shown and this invention is demonstrated.

  FIG. 4 shows a cooling system according to the first embodiment. It consists mainly of the following four functional parts.

  The base station circuit board 1000 includes a plurality of devices serving as heat generation sources, and each device can be operated in parallel by assigning operations to each device. That is, devices having the same function are distributed and arranged in the base station circuit board 1000 to have a redundant configuration.

  The heat density distribution monitoring function unit 1100 is connected to the base station circuit board 1000, the thermal monitor 1200, and the FAN control unit 1300. First, set the period of the temperature distribution measurement to determine whether the operation of the device in the heat density distribution map is concentrated or dispersed. The set data is stored in the heat density distribution monitoring function unit 1100. It is assumed that each grid of the thermal monitor 1200 is divided into regions so that one region is cooled by one FAN. Each grid is represented by a bit notation and is expressed by binary values of low temperature and high temperature. Note that the temperature detected by the thermal monitor can be increased in number of bits, and the efficiency of temperature control can be improved by increasing the number of stages.

  The thermal monitor 1200 has a plurality of measurement points so that the temperature of the entire base station circuit board 1000 can be divided into grids and is output in bits according to the temperature at each measurement point. The measurement result is acquired by the heat density distribution monitoring function unit 1100.

  The heat density distribution monitoring function unit 1100 creates a heat density distribution map from the measurement results, calculates the arrangement of device operations from preset concentration / distribution, and creates a device operation map after the operation change. The heat density distribution monitoring function unit 1100 notifies the base station circuit board 1000 of the calculated device operation map, and the base station circuit board 1000 changes the device operation status (used device, load factor, etc.) according to the device operation map.

  The heat density distribution monitoring function unit 1100 calculates the FAN to be rotated corresponding to the state of the device operation map and the number of rotations thereof, and notifies the FAN control unit 1300 to control the cooling amount so as to correspond to the operation state of the device. To do.

  Here, an example of a method for creating a heat density distribution map is shown in FIG.

  On the base station circuit board 1000, devices having equivalent functions are arranged in a redundant configuration. The thermal monitor 1200 measures the temperature of the base station circuit board 1000 (the temperature distribution is exemplified as the distribution 2100), and measures the temperature distribution with a bit value. The obtained measurement result is acquired by the heat density distribution monitoring function unit 1100.

  The heat density distribution monitoring function unit 1100 acquires bit values for each measurement location of the thermal monitor 1200 and integrates them to create a heat density distribution map 2200. It is assumed that the number of bit stages can be set separately. In the case of FIG.

  Next, FIG. 6 illustrates a calculation method when the operation of the devices constituting the base station circuit board 1000 performed by the heat density distribution monitoring function unit 1100 is distributed.

The bit value of each grid is set as a preset area.
Calculate the heat density distribution for each region. In the case of the example shown in FIG. 6, each region has two levels of bit values and four grids, so the denominator is 2 × 4 = 8, and the heat density distribution of each region is a fraction in which the total value in the region is a numerator. Can be shown. The calculation results for each region are shown below.
(2210): (1 + 1 + 1 + 1) / (2 × 4) = 4/8
(2220): (2 + 2 + 2 + 1) / (2 × 4) = 7/8
(2230): (1 + 1 + 2 + 1) / (2 × 4) = 5/8
(2240): (1 + 1 + 1 + 1) / (2 × 4) = 4/8
The heat density distribution 4/8, which is the value of the heat density distribution when all devices sleep, is used as the threshold value here. The threshold value is compared with the value of the heat density distribution in each region, and a part or all of the operation of the device in the region larger than the threshold value is made to sleep, and the operation of the device sleeping in the region below the threshold value is started. Note that instead of being able to sleep, a constant output operation that generates low heat, a low power mode, or the like may be used.
Thereby, the area | region which becomes below a threshold value increases, and operation | movement of a device is disperse | distributed to the whole base station circuit board 1000. FIG.

  Next, FIG. 7 illustrates a calculation method when the operation of the devices constituting the base station circuit board 1000 performed by the heat density distribution monitoring function unit 1100 is concentrated.

Divide the bit values of each grid into preset areas.
Calculate the heat density distribution for each region. In the case of the example shown in FIG. 7, since each region has two steps of bit values and four grids, the denominator is 2 × 4 = 8, and the heat density distribution of each region is a fraction in which the total value in the region is a numerator. Can be shown.

  The target here is a heat density distribution of 8/8 when all devices can be cooled efficiently. This is the target of the heat density distribution in each region. Compare the threshold value with the heat density distribution of each area, sleep the area whose value is larger than the threshold value and far from the target, and sleep the area that is below the target and close to the target even if the movement of the device is moved Move (aggregate) operations to the active device.

  As a result, the region where the heat density distribution is equal to or less than the threshold and the region close to the target value are increased, and the device operation is concentrated in a part of the region.

  By realizing the above, it is possible to efficiently cool the inside of the base station apparatus and improve power consumption, and to reduce noise caused by high rotation of the FAN.

  Next, the processing operation of the cooling system will be described.

First, the creation of a heat density distribution map in the case where the grid division is divided into 16 in advance and the measurement values are divided into two stages of low temperature and high temperature and set as bit notation will be described with reference to FIG.
(1) In order to measure the temperature distribution of the entire base station circuit board 1000 with the thermal monitor 1200, the temperature of each grid is measured.
(2) The heat density distribution monitoring function unit 1100 acquires the measurement result from the thermal monitor 1200, and identifies the base station circuit board 1000 as an area in 16 divisions as set in advance.
(3) Create a heat density distribution map with 1 as the low temperature part and 2 as the high temperature part. Next, in the heat density distribution monitoring function part 1100, use the acquired heat density distribution map to distribute the operation of each device. Decide whether to concentrate or combine.

Next, if the determination by the heat density distribution monitoring function unit 1100 is dispersion, the operation of each device is dispersed by the following exemplary method using the heat density distribution map divided into 16 (see FIG. 6).
(1) After creating the heat density distribution map, divide the bit value into areas and calculate the heat density distribution of each area. (2) Sleep the device that operates in the area where the heat density distribution is equal to or greater than the threshold value. Operate a device with an equivalent function that was sleeping in the area of (set the threshold to "4/8")
(3) Since the operation of the devices is dispersed, it becomes possible to cool each FAN at a uniform rotational speed, so that the uniform rotational speed is notified to the FAN control unit 1300. Similarly, in the heat density distribution monitoring function unit 1100 If the determination is concentrated, the operation of each device is concentrated by the following exemplary method using the heat density distribution map divided into 16 (see FIG. 7).
(1) After creating the heat density distribution map, divide the bits into regions and calculate the heat density distribution of each region (set the threshold target "4/8", "8/8")
(2) Equivalent function that sleeps the device that operates in the region where the heat density distribution is larger than the target threshold “4/8” and sleeps in the region that is less than the threshold “8/8” and has a close value. Move the sleep function to the device you have.
(3) Control is performed to increase the rotation speed of the FAN in charge of a region having a larger heat density distribution (concentrated region) where the devices to be operated are concentrated, and cooling is performed by decreasing the rotation speed of other regions.

  Next, a processing operation example of the heat density distribution monitoring function unit 1100 at this time will be described.

FIG. 8 is a flowchart when the heat density distribution monitoring function unit 1100 concentrates the operation of the device.
The measurement result of the heat generation of the base station circuit board 1000 is acquired by the thermal monitor 1200 (step S1).
A heat density distribution map is created from the acquired measurement results (step S2).
Is the heat density distribution of each region a value to be concentrated (step S3)? At this time, other determination elements to be concentrated may be added.
If Yes: go to step S4
No: Do not concentrate device operations
Based on the threshold value, a device operation map in which device operations are concentrated is calculated and notified to the base station circuit board 1000 (step S4).

  The FAN controller 1300 is notified of the rotational speed of each FAN (step S5).

  FIG. 9 is a flowchart when the heat density distribution monitoring function unit 1100 distributes device operations.

The measurement result of the heat generation of the base station circuit board 1000 is acquired by the thermal monitor 1200 (step S1).
A heat density distribution map is created from the acquired measurement results (step S2).
Is the heat density distribution of each region a value to be dispersed (the heat density distribution of the target region is all the same, etc.) (step S3)? At this time, other determination elements to be dispersed may be added.
If Yes: go to step S4
No: Does not distribute device operations
A device operation map in which device operations are distributed based on the threshold is calculated and notified to the base station circuit board 1000 (step S4).

  The FAN controller 1300 is notified of the rotational speed of each FAN (step S5).

  By operating as described above, it is possible to reduce the number of FANs operating as a whole or to reduce the number of FAN rotations. As a result, the cooling system can be operated efficiently and the apparatus to be cooled can also be operated efficiently. In addition, the overall power consumption can be reduced to achieve energy savings, noise reduction, and FAN life extension.

  In other words, by integrally managing and controlling the operation and cooling of devices, cooling efficiency can be improved by centrally cooling the devices and their collection that have generated a large amount of heat, or by distributing the amount of heat generated. . This is because the temperature change in the card is detected by the sensor in detail and the operation is dynamically changed.

  It should be noted that in a low priority process or a process with low power consumption, the heat generation amount may be adjusted according to the power saving function of the cooling target such as the low power consumption mode instead of Sleep.

  In addition, when causing a specific device to stop performing a process that causes a significant temperature increase, only the load may be moved as the low power consumption mode.

  In addition, the size of the region can be appropriately expanded and reduced. This is preferably performed in correspondence with the total heat density distribution per card. Since the effect of dispersion and concentration starts to decrease when the whole becomes hotter than a predetermined threshold, cooling is achieved by expanding the area and compressing the processing amount and moving the function to another card. On the other hand, if a good constant temperature is maintained as a whole, the region is reduced, and the device is dispersed and concentrated with higher definition and cooling control is performed to maintain good efficiency.

  Moreover, the temperature sensor sheet used as the thermal monitor may be arranged as shown in FIG. 10 so as to measure the two cards in a non-contact manner. In this case, it is not always necessary to match the grids on both sides of the sheet, and measurement may be performed according to the position of the device mounted on each card. The illustrated temperature sensor sheet measures the temperature on the surface side as one grid within an area surrounded by a broken line.

  The thermal monitor can also be used for optical measurement of heat by infrared rays or the like. In this case, it is also possible to obtain the heat density distribution of a plurality of cards to be cooled together by a reflecting member such as a mirror.

Further, instead of concentrating within one card, a method of concentrating operations on one card when there are a plurality of cards in the apparatus is also possible. By collecting high heat generation devices on one card, high heat generation cards and low heat generation cards are separated, and high heat generation cards are intensively cooled. Thereby, cooling with low power consumption is possible. This is illustrated in FIG. The operation is as follows.
The measurement result of the heat generation in each card on the base station circuit board is acquired by the thermal monitor. (Step S1)
A heat density distribution map of each card is created from the obtained measurement results. (Step S2)
Is the heat density distribution in each region a value that should concentrate the operation on one card (step S3)? At this time, other determination elements to be concentrated may be added.
If Yes: go to step S4
No: Do not concentrate device operations
Based on the threshold value, a device operation map of each card in which device operations are concentrated is calculated and notified to the base station circuit board (step S4).
The FAN controller 1300 is notified of the rotational speed of each FAN (step S5).

  As described above, according to the cooling system to which the present invention is applied, it is possible to efficiently cool the inside of the apparatus by combining the operation status management of the devices in the apparatus and the control of the cooling means.

  It should be noted that the specific configuration of the present invention is not limited to the above-described embodiment, and changes within a range not departing from the gist of the present invention are included in the present invention.

In addition, a part or all of the above-described embodiments can be described as follows. Note that the following supplementary notes do not limit the present invention.
[Appendix 1]
A temperature measuring means for measuring a temperature of each grid by dividing a plate-like heat source having a plurality of devices in parallel into a predetermined grid;
Cooling means for allowing the heat source to cool in correspondence with the grid;
Based on the temperature of each grid measured by the temperature measuring means, the operation of the parallel devices on the heat source is changed to concentrate or disperse the heat sources and to cope with the generated heat amount. And a heat density distribution monitoring means for controlling the cooling means.

[Appendix 2]
The heat density distribution monitoring means includes
A heat density distribution map of the plate-like heat source is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat of the divided individual regions is By comparing the density distribution with a predetermined threshold value, the device that becomes the heat source to be distributed is identified and the operation of the device is distributed,
The cooling system according to the above supplementary note, wherein the cooling unit is controlled in accordance with a calorific value that changes due to the dispersion.

[Appendix 3]
The heat density distribution monitoring means includes
A heat density distribution map of the plate-like heat source is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat of the divided individual regions is By comparing the density distribution with a predetermined threshold, the device that becomes the heat source to be concentrated is identified and the operation of the device is concentrated,
The cooling system according to the above supplementary note, wherein the cooling unit is controlled in accordance with a heat generation amount that changes due to the concentration.

[Appendix 4]
The heat density distribution monitoring means includes
When dispersing, move the operation of the device that is the heat source toward the edge of the plate-shaped heat source,
When concentrating, move the operation of the device that is the heat source to a specific area of the plate-shaped heat source,
The cooling system according to the above supplementary note, wherein the cooling unit is controlled in correspondence with the moved state.

[Appendix 5]
The temperature measuring unit measures the temperature of each grid by dividing each of the plurality of plate-like heat sources into predetermined grid shapes,
The cooling means can cool the plurality of heat sources in correspondence with the grid,
The heat density distribution monitoring unit changes the operation of the device at the predetermined heat source to a device of another heat source based on the heat density distribution of each heat source measured by the temperature measuring unit. The cooling system according to the above supplementary note, wherein the heat source is concentrated or dispersed and the cooling means is controlled in accordance with the amount of heat generated.

[Appendix 6]
The heat density distribution monitoring means includes
Maintain a prediction map about the relevance of each device that generates heat in response to a predetermined operation of the heat source,
Corresponding to the predetermined operation, based on the heat density distribution of each heat source measured by the temperature measuring means and the prediction map, the operation of the device at the predetermined heat source is changed to the device of another heat source. The cooling system according to the above supplementary note, wherein the cooling unit is controlled in accordance with the amount of heat generated.

[Appendix 7]
The prediction map is mapped with time,
The cooling system according to the above supplementary note, wherein the heat density distribution monitoring unit causes a change in operation of a device serving as a heat generation source and a control of the cooling unit to follow the time of the prediction map.

[Appendix 8]
A base station circuit board having a plate shape having a plurality of devices serving as a heat source and being paralleled; and
Temperature measuring means for dividing the base station circuit board into a predetermined grid shape and measuring the temperature of each grid;
Cooling means for allowing the base station circuit board to cool in correspondence with the grid;
Based on the temperature of the individual grids measured by the temperature measuring means, the heat source is concentrated or dispersed by changing the operation of the parallel devices on the base station circuit board, and the generated heat amount is generated. A base station apparatus comprising heat density distribution monitoring means for controlling the cooling means corresponding to the above.

[Appendix 9]
The heat density distribution monitoring means includes
Generate a heat density distribution map of the base station circuit board from the measurement result of the temperature measuring means, divide each grid on the heat density distribution map into a plurality of regions, and heat density of the divided individual regions By comparing the distribution with a predetermined threshold, the device to be distributed is identified and the operation of the device is distributed,
The base station apparatus according to the above supplementary note, wherein the cooling unit is controlled in accordance with a heat generation amount that changes due to the dispersion.

[Appendix 10]
The heat density distribution monitoring means includes
Generate a heat density distribution map of the base station circuit board from the measurement result of the temperature measuring means, divide each grid on the heat density distribution map into a plurality of regions, and heat density of the divided individual regions By comparing the distribution with a predetermined threshold, it is possible to identify the device to be concentrated and concentrate the operation of that device.
The base station apparatus according to the above supplementary note, wherein the cooling unit is controlled in accordance with a heat generation amount that changes due to the concentration.

[Appendix 11]
The heat density distribution monitoring means includes
When distributing, move the device operation toward the edge of the base station circuit board,
When concentrating, move the device operation to a specific area of the base station circuit board,
The base station apparatus as described in the above supplementary note, wherein the cooling unit is controlled in correspondence with each moved state.

[Appendix 12]
The temperature measuring means measures the temperature of a plurality of base station circuit boards,
The cooling means can cool the plurality of base station circuit boards in correspondence with the grid,
The heat density distribution monitoring means performs the operation of a device on a predetermined base station circuit board based on the heat density distribution of each base station circuit board measured by the temperature measuring means. The base station apparatus as described in the above supplementary note, wherein the heat source is concentrated or dispersed by changing to the above, and the cooling means is controlled in accordance with the amount of generated heat.

[Appendix 13]
The heat density distribution monitoring means includes
Holds as a prediction map about the relevance of each device that generates heat in response to a predetermined operation of the base station circuit board,
Based on the heat density distribution of each base station circuit board measured by the temperature measuring means and the prediction map in correspondence with the predetermined operation, the operation of the device on the predetermined base station circuit board is changed to another base station. The base station apparatus according to the above supplementary note, wherein the base station apparatus is changed to a device of a station circuit board and controls the cooling means in accordance with the amount of generated heat.

[Appendix 14]
The prediction map is mapped with time,
The base station apparatus as described in the above supplementary note, wherein the heat density distribution monitoring means follows a change in operation of devices to be concentrated or dispersed and control of the cooling means with the passage of time of the prediction map.

[Appendix 15]
The base station apparatus as described in the above supplementary note, wherein the predetermined operation of the base station circuit board reflected in the prediction map is acquired from a host apparatus or from a communication state between the host apparatus and the own apparatus.

[Appendix 16]
The base station apparatus according to the above supplementary note, wherein the predetermined operation of the base station circuit board reflected in the prediction map is acquired upon receiving a notification from the base station circuit board.

[Appendix 17]
The base station apparatus according to the above supplementary note, wherein the heat density distribution monitoring unit generates the prediction map based on a measurement result obtained from the temperature measuring unit and a predetermined operation of the base station circuit board.

[Appendix 18]
The base station apparatus according to the above supplementary note, wherein the heat density distribution monitoring unit corrects the prediction map based on a measurement result acquired from the temperature measurement unit.

[Appendix 19]
A server board having a plate shape having a plurality of devices serving as heat generation sources, and paralleled;
A temperature measuring means for measuring the temperature of each grid by dividing the server substrate into a predetermined grid;
Cooling means for allowing the server board to cool in correspondence with the grid;
Based on the temperature of each grid measured by the temperature measuring means, the operation of parallel devices on the server board is changed to concentrate or disperse the heat sources and to deal with the amount of heat generated. And a heat density distribution monitoring means for controlling the cooling means.

[Appendix 20]
The heat density distribution monitoring means includes
A heat density distribution map of the server board is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat density distribution of the divided individual regions and By comparing with a predetermined threshold value, the device to be distributed is identified and the operation of the device is distributed,
The server apparatus according to the above supplementary note, wherein the cooling unit is controlled in accordance with a calorific value that changes due to the dispersion.

[Appendix 21]
The heat density distribution monitoring means includes
A heat density distribution map of the server board is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat density distribution of the divided individual regions and By comparing with a predetermined threshold value, the target device to be concentrated is identified and the operation of the device is concentrated.
The server apparatus according to the above supplementary note, wherein the cooling unit is controlled in accordance with a heat generation amount that changes due to the concentration.

[Appendix 22]
The heat density distribution monitoring means includes
When distributing, move the device operation toward the edge of the server board,
When concentrating, move the device operation to a specific area of the server board,
The server device according to the above supplementary note, wherein the cooling unit is controlled in correspondence with each moved state.

[Appendix 23]
The temperature measuring means measures the temperature of a plurality of server boards,
The cooling means can cool the plurality of server boards in correspondence with the grid,
The heat density distribution monitoring means changes the operation of the device on a predetermined server board to a device on another server board based on the heat density distribution of each server board measured by the temperature measuring means, The server device according to the above-mentioned supplementary note, wherein the heat source is concentrated or dispersed and the cooling means is controlled in accordance with the amount of generated heat.

[Appendix 24]
The heat density distribution monitoring means includes
Relevance of each device that generates heat in response to a predetermined operation of the server board is retained as a prediction map,
Corresponding to the predetermined operation, based on the heat density distribution of each server board and the prediction map measured by the temperature measuring means, the operation of the device on the predetermined server board is transferred to the device on the other server board. The server device according to the above supplementary note, wherein the server is changed and the cooling unit is controlled in accordance with the amount of generated heat.

[Appendix 25]
The prediction map is mapped with time,
The server apparatus according to the above supplementary note, wherein the heat density distribution monitoring unit causes a change in operation of a device to be concentrated or dispersed and a control of the cooling unit to follow with the passage of time of the prediction map.

[Appendix 26]
The server apparatus according to the above supplementary note, wherein the predetermined operation of the server board reflected in the prediction map is acquired upon receiving a notification from the server board.

[Appendix 27]
The server apparatus according to the above supplementary note, wherein the heat density distribution monitoring unit generates the prediction map based on a measurement result acquired from the temperature measurement unit and a predetermined operation of the server board.

[Appendix 28]
The server apparatus according to the above supplementary note, wherein the heat density distribution monitoring unit corrects the prediction map based on a measurement result acquired from the temperature measurement unit.

[Appendix 29]
A plate-like heat source that performs information processing that is paralleled with a plurality of devices is divided and managed in a predetermined grid shape, and the temperature of each grid is measured by the temperature measuring means,
Based on the measured temperature of each grid, the operation of the paralleled devices on the heat source is changed to concentrate or distribute the heat sources, and the heat generation corresponding to the amount of generated heat. Controlling cooling means for cooling the source in correspondence with the grid;
An efficient apparatus cooling method for an apparatus, wherein a concentrated or dispersed heat source is cooled by controlled cooling means.

[Appendix 30]
In the control,
Generate a heat density distribution map of the plate-like heat source from the measurement result of the temperature measuring means,
Devices to be concentrated or distributed by dividing each grid on the heat density distribution map into a plurality of regions and comparing the heat density distribution of each divided region with a predetermined threshold value Identify
The method for efficiently cooling an apparatus according to the above supplementary note, wherein the operations of the specified device are concentrated or distributed.

  The present invention can be performed together with an existing power saving method that is performed on the entire object to be cooled. For example, it can be used together with power saving by load sharing among servers, power sharing of multiple servers, and the like.

10 20 30 Base station apparatus 100 Base station circuit board 110 210 310 Thermal density distribution monitoring function unit 120 Thermal monitor 130 Cooling unit 230 Cooling unit (for the whole)

Claims (10)

A temperature measuring means for measuring a temperature of each grid by dividing a plate-like heat source having a plurality of devices in parallel into a predetermined grid;
Cooling means for allowing the heat source to cool in correspondence with the grid;
Based on the temperature of each grid measured by the temperature measuring means, the operation of the parallel devices on the heat source is changed to concentrate or disperse the heat sources and to cope with the generated heat amount. And a heat density distribution monitoring means for controlling the cooling means. The heat density distribution monitoring means includes
A heat density distribution map of the plate-like heat source is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat of the divided individual regions is By comparing the density distribution with a predetermined threshold value, the device that becomes the heat source to be distributed is identified and the operation of the device is distributed,
The cooling system according to claim 1, wherein the cooling unit is controlled in accordance with a calorific value that changes due to the dispersion. The heat density distribution monitoring means includes
A heat density distribution map of the plate-like heat source is generated from the measurement result of the temperature measuring means, and each grid on the heat density distribution map is divided into a plurality of regions, and the heat of the divided individual regions is By comparing the density distribution with a predetermined threshold, the device that becomes the heat source to be concentrated is identified and the operation of the device is concentrated,
The cooling system according to claim 1 or 2, wherein the cooling unit is controlled in accordance with a heat generation amount that changes due to the concentration. The heat density distribution monitoring means includes
When dispersing, move the operation of the device that is the heat source toward the edge of the plate-shaped heat source,
When concentrating, move the operation of the device that is the heat source to a specific area of the plate-shaped heat source,
The cooling system according to any one of claims 1 to 3, wherein the cooling unit is controlled in accordance with each moved state. The temperature measuring unit measures the temperature of each grid by dividing each of the plurality of plate-like heat sources into predetermined grid shapes,
The cooling means can cool the plurality of heat sources in correspondence with the grid,
The heat density distribution monitoring unit changes the operation of the device at the predetermined heat source to a device of another heat source based on the heat density distribution of each heat source measured by the temperature measuring unit. The cooling system according to any one of claims 1 to 4, wherein the heat source is concentrated or dispersed and the cooling unit is controlled in accordance with the amount of heat generated. The heat density distribution monitoring means includes
Maintain a prediction map about the relevance of each device that generates heat in response to a predetermined operation of the heat source,
Corresponding to the predetermined operation, based on the heat density distribution of each heat source measured by the temperature measuring means and the prediction map, the operation of the device at the predetermined heat source is changed to the device of another heat source. The cooling system according to any one of claims 1 to 5, wherein the cooling unit is controlled in accordance with the amount of heat generated. The prediction map is mapped with time,
The cooling system according to claim 6, wherein the heat density distribution monitoring unit causes a change in operation of a device serving as a heat generation source and a control of the cooling unit to follow the time lapse of the prediction map. A base station circuit board having a plate shape having a plurality of devices serving as a heat source and being paralleled; and
Temperature measuring means for dividing the base station circuit board into a predetermined grid shape and measuring the temperature of each grid;
Cooling means for allowing the base station circuit board to cool in correspondence with the grid;
Based on the temperature of the individual grids measured by the temperature measuring means, the heat source is concentrated or dispersed by changing the operation of the parallel devices on the base station circuit board, and the generated heat amount is generated. A base station apparatus comprising heat density distribution monitoring means for controlling the cooling means corresponding to the above. A server board having a plate shape having a plurality of devices serving as heat generation sources, and paralleled;
A temperature measuring means for measuring the temperature of each grid by dividing the server substrate into a predetermined grid;
Cooling means for allowing the server board to cool in correspondence with the grid;
Based on the temperature of each grid measured by the temperature measuring means, the operation of parallel devices on the server board is changed to concentrate or disperse the heat sources and to deal with the amount of heat generated. And a heat density distribution monitoring means for controlling the cooling means. A plate-like heat source that performs information processing that is paralleled with a plurality of devices is divided and managed in a predetermined grid shape, and the temperature of each grid is measured by the temperature measuring means,
Based on the measured temperature of each grid, the operation of the paralleled devices on the heat source is changed to concentrate or distribute the heat sources, and the heat generation corresponding to the amount of generated heat. Controlling cooling means for cooling the source in correspondence with the grid;
An efficient apparatus cooling method for an apparatus, wherein a concentrated or dispersed heat source is cooled by controlled cooling means.

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