JP2012167251A5 - - Google Patents
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- JP2012167251A5 JP2012167251A5 JP2011287774A JP2011287774A JP2012167251A5 JP 2012167251 A5 JP2012167251 A5 JP 2012167251A5 JP 2011287774 A JP2011287774 A JP 2011287774A JP 2011287774 A JP2011287774 A JP 2011287774A JP 2012167251 A5 JP2012167251 A5 JP 2012167251A5
- Authority
- JP
- Japan
- Prior art keywords
- molded article
- antistatic agent
- conductive resin
- weight
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000002216 antistatic agent Substances 0.000 claims description 8
- 239000002608 ionic liquid Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 description 6
- -1 polypropylene Polymers 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000000835 fiber Substances 0.000 description 3
- 229920005672 polyolefin resin Polymers 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 1
- 239000002134 carbon nanofiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
Description
本発明者らは上記目的を達成すべく鋭意検討した結果、上記課題を達成することができる、次の導電性樹脂成形体を見出した。
（１）全組成を１００重量％として、
（Ａ）平均繊維直径が１〜２０μｍ、成形品中の重量平均繊維長が０．３〜１０ｍｍである炭素繊維１０〜４０重量％
（Ｂ）帯電防止剤０．１〜２０重量％
（Ｃ）（Ａ）以外の導電性フィラー０．１〜５重量％
（Ｄ）ポリオレフィン系樹脂３５〜７９．８重量％
を含む樹脂組成物を成形してなる成形体であって、成形体の体積抵抗率が０．１Ω・ｃｍ以下であることを特徴とする導電性樹脂成形体。
（２）前記（Ａ）炭素繊維の体積抵抗率が２．０×１０−３Ω・ｃｍ以下であることを特徴とする（１）に記載の導電性樹脂成形体。
（３）（Ｂ）帯電防止剤が（Ｂ−１）高分子型帯電防止剤、（Ｂ−２）イオン性液体から選ばれる少なくとも１種であることを特徴とする（１）〜（２）のいずれかに記載の導電性樹脂成形体。
（４）（C）（Ａ）以外の導電性フィラーがカーボンブラック、気相成長炭素繊維、カーボンナノチューブから選ばれる少なくとも１種であることを特徴とする（１）〜（３）のいずれかに記載の導電性樹脂成形体。
（５）（Ｄ）ポリオレフィン系樹脂がポリプロピレン樹脂であることを特徴とする（１）〜（４）のいずれかに記載の導電性樹脂成形体。
（６）（Ｄ）ポリオレフィン系樹脂が未変性ポリプロピレン樹脂と変性ポリプロピレン樹脂の混合物であることを特徴とする（１）〜（５）のいずれかに記載の導電性樹脂成形体。
（７）電気部品収納容器であることを特徴とする（１）〜（６）のいずれかに記載の導電性樹脂成形体。
（８）（Ｂ）耐電防止剤が（Ｂ−１）高分子型耐電防止剤と（Ｂ−２）イオン性液体の２種類を用いており、その割合が（Ｂ−１）／（Ｂ−２）＝１／１〜４／１（重量比）である（３）〜（７）いずれかに記載の導電性樹脂成形体。
（９）高分子型耐電防止剤の数平均分子量が１０，０００〜５０，０００である（３）〜（８）いずれかに記載の導電性樹脂成形体。
（１０）未変性ポリプロピレン樹脂および／または変性ポリプロピレン樹脂がブロックポリプロピレンである（６）〜（９）いずれかに記載の導電性樹脂成形体。
（１１）（Ａ）の重量平均繊維長が０．８〜２．０ｍｍである（１）〜（１０）いずれかに記載の導電性樹脂成形体。
As a result of intensive studies to achieve the above object, the present inventors have found the following conductive resin molded product that can achieve the above-mentioned problems.
(1) The total composition is 100% by weight,
(A) 10 to 40% by weight of carbon fibers having an average fiber diameter of 1 to 20 μm and a weight average fiber length in the molded product of 0.3 to 10 mm
(B) 0.1-20% by weight of antistatic agent
(C) 0.1 to 5% by weight of conductive filler other than (A)
(D) 35 to 79.8% by weight of polyolefin resin
A conductive resin molded article obtained by molding a resin composition containing the resin composition, wherein the molded article has a volume resistivity of 0.1 Ω · cm or less.
(2) The conductive resin molded article according to (1), wherein the volume resistivity of the carbon fiber (A) is 2.0 × 10 −3 Ω · cm or less.
(3) (B) The antistatic agent is at least one selected from (B-1) a polymeric antistatic agent and (B-2) an ionic liquid (1) to (2) The conductive resin molded product according to any one of the above.
(4) (C) The conductive filler other than (A) is at least one selected from carbon black, vapor-grown carbon fiber, and carbon nanotube, The electroconductive resin molding as described.
(5) The conductive resin molded article according to any one of (1) to (4), wherein the (D) polyolefin resin is a polypropylene resin.
(6) The conductive resin molded article according to any one of (1) to (5), wherein the (D) polyolefin resin is a mixture of an unmodified polypropylene resin and a modified polypropylene resin.
(7) The conductive resin molded article according to any one of (1) to (6), which is an electrical component storage container.
(8) (B) Antistatic agent uses two types of (B-1) polymer type antistatic agent and (B-2) ionic liquid, and the ratio is (B-1) / (B- 2) = 1 to 4/1 (weight ratio) The conductive resin molded article according to any one of (3) to (7).
(9) The conductive resin molded article according to any one of (3) to (8), wherein the polymer type antistatic agent has a number average molecular weight of 10,000 to 50,000.
(10) The conductive resin molded article according to any one of (6) to (9), wherein the unmodified polypropylene resin and / or the modified polypropylene resin is block polypropylene.
(11) The conductive resin molded article according to any one of (1) to (10), wherein the weight average fiber length of (A) is 0.8 to 2.0 mm.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011287774A JP5817518B2 (en) | 2011-01-28 | 2011-12-28 | Conductive resin molding |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011016510 | 2011-01-28 | ||
| JP2011016510 | 2011-01-28 | ||
| JP2011287774A JP5817518B2 (en) | 2011-01-28 | 2011-12-28 | Conductive resin molding |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012167251A JP2012167251A (en) | 2012-09-06 |
| JP2012167251A5 true JP2012167251A5 (en) | 2014-12-18 |
| JP5817518B2 JP5817518B2 (en) | 2015-11-18 |
Family
ID=46971694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011287774A Active JP5817518B2 (en) | 2011-01-28 | 2011-12-28 | Conductive resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5817518B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6216149B2 (en) | 2013-04-26 | 2017-10-18 | キヤノン株式会社 | COMMUNICATION DEVICE, COMMUNICATION METHOD, AND PROGRAM |
| US10988613B2 (en) | 2015-12-10 | 2021-04-27 | Canon Kabushiki Kaisha | Resin composition, production process thereof and optical instrument |
| JP2017179253A (en) * | 2016-03-31 | 2017-10-05 | Ｍｃｐｐイノベーション合同会社 | Polyolefin resin composition |
| EP3505568A4 (en) * | 2016-08-25 | 2020-04-15 | Zeon Corporation | Ionic composition and crosslinked product |
| JP7067908B2 (en) * | 2016-12-26 | 2022-05-16 | キヤノン株式会社 | Resin composition and resin molded product |
| US11931973B2 (en) * | 2018-03-02 | 2024-03-19 | Ticona Llc | Weatherable fiber-reinforced propylene composition |
| JP7135825B2 (en) * | 2018-12-18 | 2022-09-13 | オムロン株式会社 | Resin composition and resin molded parts |
-
2011
- 2011-12-28 JP JP2011287774A patent/JP5817518B2/en active Active
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