JP2012156179A5 - - Google Patents

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Publication number
JP2012156179A5
JP2012156179A5 JP2011011809A JP2011011809A JP2012156179A5 JP 2012156179 A5 JP2012156179 A5 JP 2012156179A5 JP 2011011809 A JP2011011809 A JP 2011011809A JP 2011011809 A JP2011011809 A JP 2011011809A JP 2012156179 A5 JP2012156179 A5 JP 2012156179A5
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JP
Japan
Prior art keywords
squeegee
longitudinal direction
sensitive adhesive
pressure
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2011011809A
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Japanese (ja)
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JP5780445B2 (en
JP2012156179A (en
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Publication date
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Priority to JP2011011809A priority Critical patent/JP5780445B2/en
Priority claimed from JP2011011809A external-priority patent/JP5780445B2/en
Publication of JP2012156179A publication Critical patent/JP2012156179A/en
Publication of JP2012156179A5 publication Critical patent/JP2012156179A5/ja
Application granted granted Critical
Publication of JP5780445B2 publication Critical patent/JP5780445B2/en
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Description

また、一つの実施態様として、前記スキージの前記粘着シートに接触する表面は、前記スキージの長手方向に垂直な断面が丸みを有していることが好ましい。
Moreover, as one embodiment, it is preferable that the surface of the squeegee that contacts the pressure-sensitive adhesive sheet has a round cross section perpendicular to the longitudinal direction of the squeegee .

Claims (1)

前記スキージの前記粘着シートに接触する表面は、前記スキージの長手方向に垂直な断面が丸みを有していることを特徴とする請求項２又は３に記載の半導体ウエーハブレーキング装置。 4. The semiconductor wafer braking device according to claim 2, wherein a surface of the squeegee contacting the pressure-sensitive adhesive sheet has a round cross section perpendicular to the longitudinal direction of the squeegee .
JP2011011809A 2011-01-24 2011-01-24 Semiconductor wafer breaking apparatus and method Active JP5780445B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011011809A JP5780445B2 (en) 2011-01-24 2011-01-24 Semiconductor wafer breaking apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011011809A JP5780445B2 (en) 2011-01-24 2011-01-24 Semiconductor wafer breaking apparatus and method

Publications (3)

Publication Number Publication Date
JP2012156179A JP2012156179A (en) 2012-08-16
JP2012156179A5 true JP2012156179A5 (en) 2014-02-27
JP5780445B2 JP5780445B2 (en) 2015-09-16

Family

ID=46837651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011011809A Active JP5780445B2 (en) 2011-01-24 2011-01-24 Semiconductor wafer breaking apparatus and method

Country Status (1)

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JP (1) JP5780445B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506606B2 (en) * 2015-04-27 2019-04-24 株式会社ディスコ Wafer division method
JP6663805B2 (en) * 2016-06-28 2020-03-13 東レエンジニアリング株式会社 Mounting device and mounting method
JP2018120915A (en) * 2017-01-24 2018-08-02 株式会社ディスコ Method for processing plate-like object
JP7214306B2 (en) * 2018-04-27 2023-01-30 株式会社ディスコ Workpiece processing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868820B2 (en) * 1990-01-12 1999-03-10 株式会社東芝 Braking device and braking method using the same
JPH04263944A (en) * 1991-02-19 1992-09-18 Hitachi Ltd Method for printing solder paste at every surface mounting ic part
JPH11251408A (en) * 1998-03-05 1999-09-17 Hitachi Ltd Method and apparatus for separating chip
JP2004243575A (en) * 2003-02-12 2004-09-02 Fujitsu Ltd Printing plate and printing method
JP2006024591A (en) * 2004-07-06 2006-01-26 Hugle Electronics Inc Breaking expander
JP2006066539A (en) * 2004-08-25 2006-03-09 Canon Machinery Inc Wafer dividing method and die bonder
JP5177992B2 (en) * 2006-10-27 2013-04-10 浜松ホトニクス株式会社 Processing object cutting method
JP5312970B2 (en) * 2009-02-06 2013-10-09 株式会社ディスコ Semiconductor wafer dividing method

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