JP2012144672A - Epoxy resin composition, prepreg and fiber-reinforced composite material - Google Patents
Epoxy resin composition, prepreg and fiber-reinforced composite material Download PDFInfo
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- JP2012144672A JP2012144672A JP2011005645A JP2011005645A JP2012144672A JP 2012144672 A JP2012144672 A JP 2012144672A JP 2011005645 A JP2011005645 A JP 2011005645A JP 2011005645 A JP2011005645 A JP 2011005645A JP 2012144672 A JP2012144672 A JP 2012144672A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 102
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 102
- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 239000000463 material Substances 0.000 title claims description 15
- 239000003733 fiber-reinforced composite Substances 0.000 title claims description 13
- -1 phosphazene compound Chemical class 0.000 claims abstract description 42
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 22
- 239000011574 phosphorus Substances 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- 239000003063 flame retardant Substances 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 125000004103 aminoalkyl group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 claims description 2
- 125000005915 C6-C14 aryl group Chemical group 0.000 claims description 2
- 125000005024 alkenyl aryl group Chemical group 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 2
- 125000003107 substituted aryl group Chemical group 0.000 claims description 2
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 claims 1
- 238000001723 curing Methods 0.000 description 31
- 229920000049 Carbon (fiber) Polymers 0.000 description 20
- 239000004917 carbon fiber Substances 0.000 description 20
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 14
- 239000000835 fiber Substances 0.000 description 13
- 238000002485 combustion reaction Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 239000010452 phosphate Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000012783 reinforcing fiber Substances 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 229920006287 phenoxy resin Polymers 0.000 description 3
- 239000013034 phenoxy resin Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZWOULFZCQXICLZ-UHFFFAOYSA-N 1,3-dimethyl-1-phenylurea Chemical compound CNC(=O)N(C)C1=CC=CC=C1 ZWOULFZCQXICLZ-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 0 CC[C@@](*)(C=C)N=C Chemical compound CC[C@@](*)(C=C)N=C 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011208 reinforced composite material Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KDQTUCKOAOGTLT-UHFFFAOYSA-N 3-[3-(dimethylcarbamoylamino)-4-methylphenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=C(C)C(NC(=O)N(C)C)=C1 KDQTUCKOAOGTLT-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- KLFSCDLQXKYZFJ-UHFFFAOYSA-N ethanamine trihydrofluoride Chemical compound F.F.F.C(C)N KLFSCDLQXKYZFJ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【課題】優れた難燃性と耐熱性を向上させることができるエポキシ樹脂組成物を提供する。
【解決手段】エポキシ樹脂(A)、式(1)に示す構造を有するホスファゼン化合物(B)、式(2)に示す構造を有する芳香族系リン化合物(C)およびエポキシ樹脂硬化剤(D)を含み、ホスファゼン化合物(B)成分と芳香族系リン化合物(C)成分の質量比(B)/(C)が0.1〜9.0であるエポキシ樹脂組成物。
【選択図】なしAn epoxy resin composition capable of improving excellent flame retardancy and heat resistance is provided.
An epoxy resin (A), a phosphazene compound (B) having a structure represented by formula (1), an aromatic phosphorus compound (C) having a structure represented by formula (2), and an epoxy resin curing agent (D). An epoxy resin composition in which the mass ratio (B) / (C) of the phosphazene compound (B) component and the aromatic phosphorus compound (C) component is 0.1 to 9.0.
[Selection figure] None
Description
本発明は、優れた難燃性を有するエポキシ樹脂組成物、ならびに該エポキシ樹脂組成物を用いたプリプレグおよび繊維強化複合材料に関する。 The present invention relates to an epoxy resin composition having excellent flame retardancy, and a prepreg and a fiber-reinforced composite material using the epoxy resin composition.
強化繊維で強化した繊維強化複合材料(以下、FRPという。)は、比強度、比剛性などに優れ、かつ、軽量である特性を有しており、そのような特性を活かして、航空機用構造材料、自動車用部品、ラケットやゴルフシャフトなどのスポーツ用途などに広く使用されている。 A fiber-reinforced composite material (hereinafter referred to as FRP) reinforced with reinforcing fibers has excellent specific strength, specific rigidity, and the like, and has characteristics that are lightweight. Widely used in sports applications such as materials, automotive parts, rackets and golf shafts.
中でも近年、特に電子材料用途、自動車部品、鉄道車両、航空機等の用途では難燃化、燃焼時の低発煙化への要求が高まってきている。しかし従来のエポキシ樹脂組成物を用いたFRPに難燃性能は無く、また燃焼時の発煙性に問題があった。 In particular, in recent years, there has been an increasing demand for flame retardancy and low smoke generation during combustion, particularly in applications such as electronic materials, automobile parts, railway vehicles, and aircraft. However, the conventional FRP using the epoxy resin composition has no flame retardancy and has a problem in smoke generation during combustion.
これまでに種々のFRPの難燃化方法が検討され、中でも臭素化エポキシ樹脂が高い難燃性を有する理由から広く採用されてきた。しかし、臭素化エポキシ樹脂は高い難燃性を有するものの、火災時に発生するハロゲン系ガスの毒性が問題となり、人体への安全性、地球環境保護の観点から代替方法が望まれてきた。 Various flame retardant methods for FRP have been studied so far, and brominated epoxy resins have been widely adopted because of their high flame retardancy. However, although brominated epoxy resins have high flame retardancy, toxicity of halogen-based gas generated at the time of fire becomes a problem, and alternative methods have been desired from the viewpoint of safety to human bodies and protection of the global environment.
そこで、臭素化エポキシ樹脂を代替する難燃化方法として、赤リンやリン酸エステル化合物をエポキシ樹脂に添加する方法(特許文献1)が主流となってきた。しかしこれらの方法は、その添加量等に応じて、1)機械的強度の低下、2)貯蔵安定性不良、3)長期間に亘ってリン化合物が徐々に染み出す、4)容易に加水分解されるため絶縁性や耐水性が高く求められるプリント配線基板や電子材料などでの採用が難しい、などの問題が依然として残っている。
また、リン酸エステル化合物を使用した場合は、樹脂組成物の耐熱性が低下する問題がある。
Therefore, a method of adding red phosphorus or a phosphoric acid ester compound to an epoxy resin (Patent Document 1) has become the mainstream as a flame retardant method replacing the brominated epoxy resin. However, depending on the amount of addition, etc., these methods are 1) decrease in mechanical strength, 2) poor storage stability, 3) gradual leaching of phosphorus compounds over a long period of time, 4) easy hydrolysis Therefore, problems such as difficulty in adoption in printed wiring boards and electronic materials that require high insulation and water resistance remain.
Moreover, when a phosphoric acid ester compound is used, there exists a problem that the heat resistance of a resin composition falls.
本発明は、上記事情に鑑みてなされたものであって、ハロゲン系難燃剤、赤リン、リン酸エステルを含有せずに優れた難燃性を達成することができ、また耐熱性を向上させることができるエポキシ樹脂組成物、ならびに該エポキシ樹脂組成物を用いたプリプレグおよび繊維強化複合材料を提供することを目的とする。 The present invention has been made in view of the above circumstances, and can achieve excellent flame retardancy without containing a halogen-based flame retardant, red phosphorus, and phosphate ester, and can improve heat resistance. It is an object of the present invention to provide an epoxy resin composition that can be used, and a prepreg and a fiber-reinforced composite material using the epoxy resin composition.
本発明者等は鋭意検討の結果、下記式(1)で示されるホスファゼン化合物(B)、下記式(2)で示される環状リン化合物(C)を併用することで、(B)成分と(C)成分の難燃性の相乗効果により、エポキシ樹脂組成物の優れた難燃性を達成できるとともに、耐熱性を向上させることができることを見出して本発明に至った。 As a result of intensive studies, the present inventors have used a phosphazene compound (B) represented by the following formula (1) and a cyclic phosphorus compound (C) represented by the following formula (2) in combination, and the component (B) and ( It was found that the flame retardancy synergistic effect of component C) can achieve excellent flame retardancy of the epoxy resin composition and can improve heat resistance.
本発明は、以下の態様を有する。
[1]エポキシ樹脂(A)、式(1)に示す構造を有するホスファゼン化合物(B)、式(2)に示す構造を有する芳香族系リン化合物(C)およびエポキシ樹脂硬化剤(D)を含み、ホスファゼン化合物(B)成分と芳香族系リン化合物(C)成分の質量比(B)/(C)が0.1〜9.0であるエポキシ樹脂組成物。
The present invention has the following aspects.
[1] An epoxy resin (A), a phosphazene compound (B) having a structure represented by formula (1), an aromatic phosphorus compound (C) having a structure represented by formula (2), and an epoxy resin curing agent (D) An epoxy resin composition comprising a phosphazene compound (B) component and an aromatic phosphorus compound (C) component having a mass ratio (B) / (C) of 0.1 to 9.0.
[式中、R1およびR2は同一又は異なっていてもよく、炭素数1〜18のアルキル基、炭素数5〜8のシクロアルキル基、炭素数6〜14のアリール基、炭素数7〜18のアルキルアリール基、炭素数2〜18のアルケニル基、炭素数8〜18のアルケニルアリール基、アミノ基置換フェニル基、アミノアルキル基置換フェニル基(置換基としてのアミノアルキル基の炭素数は1〜6である。)、ヒドロキシ基置換フェニル基、またはヒドロキシアルキル基置換フェニル基(置換基としてのヒドロキシアルキル基の炭素数は1〜6である。)のいずれかである。nは3〜10000の整数を示す。] [In formula, R < 1 > and R < 2 > may be the same or different, C1-C18 alkyl group, C5-C8 cycloalkyl group, C6-C14 aryl group, C7-C7 18 alkylaryl groups, alkenyl groups having 2 to 18 carbon atoms, alkenyl aryl groups having 8 to 18 carbon atoms, amino group-substituted phenyl groups, aminoalkyl group-substituted phenyl groups (the number of carbon atoms of the aminoalkyl group as a substituent is 1 Or 6), a hydroxy group-substituted phenyl group, or a hydroxyalkyl group-substituted phenyl group (the hydroxyalkyl group as the substituent has 1 to 6 carbon atoms). n represents an integer of 3 to 10,000. ]
[式中、R3は炭素数6〜20のヒドロキシ置換アリール基、炭素数1〜18のヒドロキシ置換アルキル基、炭素数6〜20のアリール基、炭素数1〜18のアルキル基、炭素数7〜21のシアノ置換アリール基、炭素数1〜18のシアノ置換アルキル基、水素原子、またはヒドロキシ基である。] [Wherein, R 3 represents a hydroxy substituted aryl group having 6 to 20 carbon atoms, a hydroxy substituted alkyl group having 1 to 18 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkyl group having 1 to 18 carbon atoms, or 7 carbon atoms. A -21-substituted cyano-substituted aryl group, a C1-C18 cyano-substituted alkyl group, a hydrogen atom, or a hydroxy group. ]
[2]強化繊維に、[1]のエポキシ樹脂組成物を含浸してなるプリプレグ。
[3][2]のプリプレグを硬化して得られる繊維強化複合材料。
[4][3]の繊維強化複合材料であって、0.6mm厚の成形板としたときの難燃性がUL−94VでV−0である繊維強化複合材料。
[2] A prepreg obtained by impregnating the reinforcing resin with the epoxy resin composition of [1].
[3] A fiber-reinforced composite material obtained by curing the prepreg of [2].
[4] The fiber-reinforced composite material according to [3], which has a flame retardancy of UL-94V and V-0 when formed into a 0.6 mm-thick molded plate.
本発明のエポキシ樹脂組成物は、ハロゲン系難燃剤、赤リン、またはリン酸エステルを含有していないにもかかわらず、その硬化物は優れた難燃性を達成することができ、また耐熱性の向上も図ることができる。
本発明のプリプレグは、これを構成するエポキシ樹脂組成物がハロゲン系難燃剤、赤リン、またはリン酸エステルを含有していないにもかかわらず、その硬化物は優れた難燃性を達成することができ、また耐熱性の向上も図ることができる。
本発明の繊維強化複合材料は、優れた難燃性を達成することができ、また耐熱性の向上も図ることができる。
Although the epoxy resin composition of the present invention does not contain a halogen-based flame retardant, red phosphorus, or phosphate ester, the cured product can achieve excellent flame retardancy and is also heat resistant. Can be improved.
In the prepreg of the present invention, the cured product achieves excellent flame retardancy even though the epoxy resin composition constituting the prepreg does not contain a halogen flame retardant, red phosphorus, or phosphate ester. In addition, the heat resistance can be improved.
The fiber-reinforced composite material of the present invention can achieve excellent flame retardancy and can also improve heat resistance.
<エポキシ樹脂(A)>
エポキシ樹脂(A)としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、脂環式エポキシ樹脂、ビフェニル骨格を有するエポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、レゾルシノール型エポキシ樹脂、ポリエチレングリコール型エポキシ樹脂、ポリプロピレングリコール型エポキシ樹脂、ナフタレン骨格を有するエポキシ樹脂、トリスフェニルメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、アミノグリシジル型エポキシ樹脂、アミノフェノール型エポキシ樹脂、アミノクレゾール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、およびフェノール類を前駆体とするエポキシ樹脂をウレタンやイソシアネートで変性したエポキシ樹脂からなる群から選ばれる1種または2種以上が用いられる。
これらのうち、機械物性・耐熱性・粘度等の取り扱い性の点でビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、およびトリスフェニルメタン型エポキシ樹脂からなる群から選ばれる1種または2種以上が好ましい。特に優れた難燃性が得られやすい点でフェノールノボラック型エポキシ樹脂が好ましい。
本態様のエポキシ樹脂組成物は、取り扱い性の都合上、30℃での粘度が103〜106Pa・sで70℃での粘度が100〜103Pa・sであることが望ましい。
<Epoxy resin (A)>
As the epoxy resin (A), bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, epoxy resin having biphenyl skeleton, phenol novolac type epoxy resin , Cresol novolac type epoxy resin, resorcinol type epoxy resin, polyethylene glycol type epoxy resin, polypropylene glycol type epoxy resin, epoxy resin having naphthalene skeleton, trisphenylmethane type epoxy resin, phenol aralkyl type epoxy resin, aminoglycidyl type epoxy resin, An aminophenol-type epoxy resin, aminocresol-type epoxy resin, dicyclopentadiene-type epoxy resin, and phenols as precursors One or more selected the carboxy resin from the group consisting of modified epoxy resin with urethane or isocyanate is used.
Among these, 1 selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, and trisphenylmethane type epoxy resin in terms of handling properties such as mechanical properties, heat resistance and viscosity. Species or two or more are preferred. In particular, a phenol novolac type epoxy resin is preferable because excellent flame retardancy is easily obtained.
The epoxy resin composition of this embodiment preferably has a viscosity at 30 ° C. of 10 3 to 10 6 Pa · s and a viscosity at 70 ° C. of 10 0 to 10 3 Pa · s for convenience of handling.
<ホスファゼン化合物(B)>
ホスファゼン化合物(B)は、前記式(1)で示される構成単位を有する化合物(環状ホスファゼン化合物も含まれる。)であれば特に限定されない。
式(1)において、好ましいR1およびR2は、炭素数6〜8のアリール基、炭素数1〜3のアルキル基である。nは3〜20が好ましく、3〜8がより好ましい。
入手性の容易さの点で、R1、R2がフェニル基でありn=3である環状ホスファゼン化合物がより好ましい。
<Phosphazene Compound (B)>
The phosphazene compound (B) is not particularly limited as long as it is a compound having a structural unit represented by the formula (1) (including cyclic phosphazene compounds).
In Formula (1), preferable R 1 and R 2 are an aryl group having 6 to 8 carbon atoms and an alkyl group having 1 to 3 carbon atoms. n is preferably from 3 to 20, and more preferably from 3 to 8.
From the viewpoint of availability, a cyclic phosphazene compound in which R 1 and R 2 are phenyl groups and n = 3 is more preferable.
<芳香族系リン化合物(C)>
芳香族系リン化合物(C)は、前記式(2)で表される化合物であれば特に限定されない。
式(2)において、難燃性能および保存安定性の点で、R3はヒドロキシ置換フェニル基が好ましい。
式(2)で表される化合物は市販品から入手可能である。例えば、三光株式会社製のHCA−HQ、BCA、HCA(いずれも製品名)などが挙げられる。
<Aromatic phosphorus compound (C)>
The aromatic phosphorus compound (C) is not particularly limited as long as it is a compound represented by the formula (2).
In the formula (2), R 3 is preferably a hydroxy-substituted phenyl group from the viewpoint of flame retardancy and storage stability.
The compound represented by Formula (2) can be obtained from a commercial item. Examples thereof include HCA-HQ, BCA, and HCA (all are product names) manufactured by Sanko Co., Ltd.
<含有割合>
エポキシ樹脂組成物のリン含有量は0.5〜3.0質量%であることが望ましい。リン含有量が0.5質量%以上であると十分な難燃性向上効果が得られやすく、3質量%以下であると、機械的強度の低下、貯蔵安定性不良等の問題が発生しにくい。該リン含有量のより好ましい範囲は0.9〜2.9質量%である。
エポキシ樹脂組成物に添加されるホスファゼン化合物(B)および芳香族系リン化合物(C)の合計量は、これらに由来するリンの含有量の合計が上記の範囲内となるように設定することが好ましい。
ホスファゼン化合物(B)と芳香族系リン化合物(C)の質量比(B)/(C)は0.1〜9.0である。この範囲であると、B成分とC成分の相乗効果が効果的に得られ、難燃性を付与するために必要な難燃剤の添加量を低減させることができる。エポキシ樹脂組成物の硬化物の難燃性を高くする点では、ホスファゼン化合物(B)の含有割合が、上記の範囲内で多い方が好ましく、エポキシ樹脂組成物の硬化物のTgを高くして耐熱性を向上させる点では、芳香族系リン化合物(C)の含有割合が、上記の範囲内で多い方が好ましい。
<Content ratio>
The phosphorus content of the epoxy resin composition is preferably 0.5 to 3.0% by mass. When the phosphorus content is 0.5% by mass or more, a sufficient flame retardancy improvement effect is easily obtained, and when it is 3% by mass or less, problems such as a decrease in mechanical strength and poor storage stability are unlikely to occur. . A more preferable range of the phosphorus content is 0.9 to 2.9% by mass.
The total amount of the phosphazene compound (B) and the aromatic phosphorus compound (C) added to the epoxy resin composition may be set so that the total content of phosphorus derived therefrom is within the above range. preferable.
The mass ratio (B) / (C) of the phosphazene compound (B) and the aromatic phosphorus compound (C) is 0.1 to 9.0. Within this range, the synergistic effect of the B component and the C component can be effectively obtained, and the amount of flame retardant added to impart flame retardancy can be reduced. In terms of increasing the flame retardancy of the cured product of the epoxy resin composition, the content ratio of the phosphazene compound (B) is preferably larger within the above range, and the Tg of the cured product of the epoxy resin composition is increased. In terms of improving heat resistance, it is preferable that the content of the aromatic phosphorus compound (C) is large within the above range.
<エポキシ樹脂用硬化剤(D)>
エポキシ樹脂用硬化剤(D)としては、アミン、酸無水物(カルボン酸無水物等)、フェノール(ノボラック樹脂等)、メルカプタン、ルイス酸アミン錯体、オニウム塩、イミダゾールなどが挙げられるが、エポキシ樹脂を硬化させうるものであればどのような構造のものでもよい。これらの中でも、アミン型の硬化剤が好ましい。
これら硬化剤は、1種単独で使用してもよいし、2種以上を併用してもよい。
<Curing agent for epoxy resin (D)>
Examples of the epoxy resin curing agent (D) include amines, acid anhydrides (such as carboxylic acid anhydrides), phenols (such as novolak resins), mercaptans, Lewis acid amine complexes, onium salts, imidazoles, and the like. Any structure can be used as long as it can be cured. Among these, amine type curing agents are preferable.
These curing agents may be used alone or in combination of two or more.
アミン型の硬化剤としては、例えばジアミノジフェニルメタン、ジアミノジフェニルスルホンのような芳香族アミン、脂肪族アミン、イミダゾール誘導体、ジシアンジアミド、テトラメチルグアニジン、チオ尿素付加アミン、およびこれらの異性体、変成体などが挙げられる。これらの中でも、プリプレグの保存性に優れる点で、ジシアンジアミドが特に好ましい。 Examples of amine-type curing agents include aromatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone, aliphatic amines, imidazole derivatives, dicyandiamide, tetramethylguanidine, thiourea-added amines, and isomers and modified products thereof. Can be mentioned. Among these, dicyandiamide is particularly preferable in terms of excellent prepreg storage.
エポキシ樹脂用硬化剤(D)の配合量は、エポキシ樹脂(A)のエポキシ当量に対するエポキシ樹脂用硬化剤(D)の活性水素当量の比が0.5〜1となる量が好ましい。該比は0.6〜0.8がより好ましい。0.5以上にすることで充分に硬化することができる。1以下にすることで硬化物の靭性を高くできる。 The compounding amount of the epoxy resin curing agent (D) is preferably such that the ratio of the active hydrogen equivalent of the epoxy resin curing agent (D) to the epoxy equivalent of the epoxy resin (A) is 0.5 to 1. The ratio is more preferably 0.6 to 0.8. By setting it to 0.5 or more, sufficient curing can be achieved. By setting it to 1 or less, the toughness of the cured product can be increased.
<硬化促進剤>
必要に応じて、エポキシ樹脂組成物に硬化促進剤を含有させることができる。
硬化促進剤としては、使用するエポキシ樹脂用硬化剤(D)による硬化反応を促進する効果を有するものであればよく、特に制限するものではない。
たとえばエポキシ樹脂用硬化剤(D)がジシアンジアミドである場合、3−フェニル−1,1−ジメチル尿素、3−(3,4−ジクロロフェニル)−1,1−ジメチル尿素(DCMU)、3−(3−クロロ−4−メチルフェニル)−1,1−ジメチル尿素、2,4−ビス(3,3−ジメチルウレイド)トルエン等の尿素誘導体が好ましい。また、エポキシ樹脂用硬化剤(D)がカルボン酸無水物やノボラック樹脂である場合、三級アミンが好ましい。また、エポキシ樹脂用硬化剤(D)がジアミノジフェニルスルホンである場合、イミダゾール化合物、フェニルジメチルウレア(PDMU)等のウレア化合物、三フッ化モノエチルアミン、三塩化アミン錯体等のアミン錯体が好ましい。これらの中でもジシアンジアミドとDCMUの組み合わせが特に好ましい。
<Curing accelerator>
If necessary, a curing accelerator can be contained in the epoxy resin composition.
The curing accelerator is not particularly limited as long as it has an effect of promoting the curing reaction by the epoxy resin curing agent (D) to be used.
For example, when the epoxy resin curing agent (D) is dicyandiamide, 3-phenyl-1,1-dimethylurea, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), 3- (3 Urea derivatives such as -chloro-4-methylphenyl) -1,1-dimethylurea and 2,4-bis (3,3-dimethylureido) toluene are preferred. Further, when the epoxy resin curing agent (D) is a carboxylic acid anhydride or a novolac resin, a tertiary amine is preferred. Moreover, when the epoxy resin curing agent (D) is diaminodiphenylsulfone, urea compounds such as imidazole compounds and phenyldimethylurea (PDMU), and amine complexes such as monoethylamine trifluoride and amine trichloride are preferable. Among these, a combination of dicyandiamide and DCMU is particularly preferable.
<熱可塑性樹脂>
本態様のエポキシ樹脂組成物は、必要に応じて、本発明の効果を損なわない範囲で、熱可塑性樹脂を含有してもよい。
熱可塑性樹脂の種類については特に限定されず、たとえばフェノキシ樹脂、ポリアミド、ポリエステル、ポリカーボネート、ポリエーテルスルフォン、ポリフェニレンエーテル、ポリフェニレンスルフィド、ポリエーテルエーテルケトン、ポリエーテルケトンケトン、ポリイミド、ポリテトラフルオロエチレン、ポリエーテル、ポリオレフィン、液晶ポリマー、ポリアリレート、ポリスルフォン、ポリアクリロニトリルスチレン、ポリスチレン、ポリアクリロニトリル、ポリメチルメタクリレート、ABS、AES、ASA、ポリビニルフォルマール等が挙げられる。
これらの中でも難燃性能とエポキシ樹脂への溶解性の点でフェノキシ樹脂が好ましい。
<Thermoplastic resin>
The epoxy resin composition of this embodiment may contain a thermoplastic resin as long as it does not impair the effects of the present invention.
The type of thermoplastic resin is not particularly limited. For example, phenoxy resin, polyamide, polyester, polycarbonate, polyether sulfone, polyphenylene ether, polyphenylene sulfide, polyether ether ketone, polyether ketone ketone, polyimide, polytetrafluoroethylene, poly Examples include ether, polyolefin, liquid crystal polymer, polyarylate, polysulfone, polyacrylonitrile styrene, polystyrene, polyacrylonitrile, polymethyl methacrylate, ABS, AES, ASA, and polyvinyl formal.
Among these, a phenoxy resin is preferable in terms of flame retardancy and solubility in an epoxy resin.
<添加剤>
本態様のエポキシ樹脂組成物は、必要に応じて、本発明の効果を損なわない範囲で、公知の様々な添加剤を含有してもよい。該添加剤としては、たとえば、シリコーンオイル、天然ワックス類、合成ワックス類、直鎖脂肪酸の金属塩、酸アミド、エステル類、パラフィン類等の離型剤、結晶質シリカ、溶融シリカ、ケイ酸カルシウム、アルミナ、炭酸カルシウム、タルク、硫酸バリウム等の粉体やガラス繊維、炭素繊維等の無機充填剤、カーボンブラック、ベンガラ等の着色剤、シランカップリング剤等を使用することができる。
<Additives>
The epoxy resin composition of this embodiment may contain various known additives as long as it does not impair the effects of the present invention. Examples of the additive include silicone oils, natural waxes, synthetic waxes, metal salts of linear fatty acids, acid amides, esters, paraffins and other mold release agents, crystalline silica, fused silica, calcium silicate. Further, powders such as alumina, calcium carbonate, talc and barium sulfate, inorganic fillers such as glass fibers and carbon fibers, colorants such as carbon black and bengara, silane coupling agents and the like can be used.
≪エポキシ樹脂組成物の調製方法≫
本態様のエポキシ樹脂組成物は、それぞれ、各成分を混合することにより調製できる。各成分の混合方法としては、三本ロールミル、プラネタリミキサー、ニーダー、万能かくはん機、ホモジナイザー、ホモディスパーなどの混合機を用いる方法が挙げられる。
≪Method for preparing epoxy resin composition≫
The epoxy resin composition of this embodiment can be prepared by mixing each component. Examples of the method for mixing the components include a method using a mixer such as a three-roll mill, a planetary mixer, a kneader, a universal agitator, a homogenizer, or a homodisper.
≪プリプレグ≫
本態様のエポキシ樹脂組成物は、強化繊維に含浸させてプリプレグとして使用することができる。
強化繊維としては、炭素繊維、アラミド繊維、ナイロン繊維、高強度ポリエステル繊維、ガラス繊維、ボロン繊維、アルミナ繊維、窒化珪素繊維などの各種の無機繊維または有機繊維を用いることができる。中でも難燃性の観点から、炭素繊維、アラミド繊維、ガラス繊維、ボロン繊維、アルミナ繊維、窒化珪素繊維が好ましく、比強度および比弾性に優れる点から炭素繊維が特に好ましい。
強化繊維の形態としては、一方向に引き揃えてもよく、織物、またノンクリンプファブリックでもよい。
プリプレグは、本態様のエポキシ樹脂組成物と前記強化繊維を用いて、公知の方法で製造することができる。
≪Prepreg≫
The epoxy resin composition of this embodiment can be used as a prepreg by impregnating reinforcing fibers.
As the reinforcing fiber, various inorganic fibers or organic fibers such as carbon fiber, aramid fiber, nylon fiber, high-strength polyester fiber, glass fiber, boron fiber, alumina fiber, and silicon nitride fiber can be used. Among these, carbon fiber, aramid fiber, glass fiber, boron fiber, alumina fiber, and silicon nitride fiber are preferable from the viewpoint of flame retardancy, and carbon fiber is particularly preferable from the viewpoint of excellent specific strength and specific elasticity.
The form of the reinforcing fiber may be aligned in one direction, or may be a woven fabric or a non-crimp fabric.
The prepreg can be produced by a known method using the epoxy resin composition of the present embodiment and the reinforcing fiber.
≪繊維強化複合材料≫
繊維強化複合材料は、前記プリプレグを硬化して得られる。
本発明において、繊維強化複合材料は、強化繊維として炭素繊維を含む炭素繊維強化複合材料であることが好ましい。
該炭素繊維強化複合材料は、難燃性に優れるとともに、耐熱性に優れる。難燃性については、例えば、エポキシ樹脂組成物全体のリン含有量が3質量%以下で、0.6mm厚の繊維強化複合材料成形板としたときの難燃性がUL−94VでV−0のレベルを達成することが可能である。耐熱性については、例えば、エポキシ樹脂組成物全体のリン含有量が3質量%以下で、該樹脂組成物の硬化物のTgが105℃以上、より好ましくは110℃以上を達成することが可能である。
≪Fiber reinforced composite material≫
The fiber reinforced composite material is obtained by curing the prepreg.
In the present invention, the fiber reinforced composite material is preferably a carbon fiber reinforced composite material containing carbon fibers as reinforcing fibers.
The carbon fiber reinforced composite material is excellent in flame retardancy and heat resistance. Regarding the flame retardancy, for example, the flame retardancy when the phosphorous content of the entire epoxy resin composition is 3% by mass or less and a 0.6 mm thick fiber reinforced composite material molded plate is UL-94V and V-0. Can be achieved. With respect to heat resistance, for example, the phosphorus content of the entire epoxy resin composition can be 3 mass% or less, and the Tg of the cured product of the resin composition can be 105 ° C or higher, more preferably 110 ° C or higher. is there.
以下に実施例を用いて本発明をさらに詳しく説明するが、本発明はこれら実施例に限定されるものではない。
以下の各例で使用した原料(樹脂等)、炭素繊維、評価方法を以下に示す。
<原料>
・エポキシ樹脂A−1:ビスフェノールA型エポキシ樹脂(三菱化学株式会社製、製品名:jER828、エポキシ当量189g/eq、粘度(25℃):15Pa・S、粘度(75℃):16mPa・S)
・エポキシ樹脂A−2:ビスフェノールA型エポキシ樹脂(三菱化学株式会社製、製品名:jER1001、エポキシ当量475g/eq、粘度(75℃):200Pa・S)
・エポキシ樹脂A−3:ビスフェノールF型エポキシ樹脂(三菱化学株式会社製、製品名:jER807、エポキシ当量168g/eq、粘度(25℃):4Pa・S、粘度(75℃):6mPa・S)
・エポキシ樹脂A−4:フェノールノボラック型エポキシ樹脂(新日鐵化学株式会社製、製品名:YDPN−638、エポキシ当量180g/eq、粘度(75℃):5.5Pa・S)
Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples.
The raw materials (resins etc.), carbon fibers, and evaluation methods used in the following examples are shown below.
<Raw material>
Epoxy resin A-1: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER828, epoxy equivalent 189 g / eq, viscosity (25 ° C.): 15 Pa · S, viscosity (75 ° C.): 16 mPa · S)
Epoxy resin A-2: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER1001, epoxy equivalent 475 g / eq, viscosity (75 ° C.): 200 Pa · S)
Epoxy resin A-3: Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER807, epoxy equivalent 168 g / eq, viscosity (25 ° C.): 4 Pa · S, viscosity (75 ° C.): 6 mPa · S)
Epoxy resin A-4: Phenol novolac type epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., product name: YDPN-638, epoxy equivalent 180 g / eq, viscosity (75 ° C.): 5.5 Pa · S)
・ホスファゼン化合物B−1:環状フェノキシホスファゼン(株式会社伏見製薬所製、製品名:ラビトルFP−110、前記式(1)においてR1、R2がフェニル基であり、n=3である化合物、リン含有率13.4質量%)
・芳香族系リン化合物C−1:10−(2,5−ジヒドロキシフェニル)−10H−9−オキソ−10−ホスファフェナントレン−10−オキシド(三光株式会社製、製品名:HCA−HQ、下記式(3)で表わされる化合物、リン含有率9.5質量%)
Phosphazene compound B-1: Cyclic phenoxyphosphazene (Fushimi Pharmaceutical Co., Ltd., product name: Ravitor FP-110, a compound in which R 1 and R 2 are phenyl groups and n = 3 in the above formula (1), Phosphorus content 13.4% by mass)
Aromatic phosphorus compound C-1: 10- (2,5-dihydroxyphenyl) -10H-9-oxo-10-phosphaphenanthrene-10-oxide (product name: HCA-HQ, manufactured by Sanko Co., Ltd.) Compound represented by formula (3), phosphorus content 9.5% by mass)
・縮合リン酸エステル1(比較例):1,3−フェニレンビズジキシレニルフォスフェート(株式会社ADEKA製、製品名:アデカスタブFP−500、リン含有率9.0質量%
・熱可塑性樹脂1:フェノキシ樹脂(新日鐵化学株式会社製、製品名:YP−50S)
・硬化剤D−1:ジシアンジアミド(三菱化学株式会社製、製品名:DICY15)
・硬化促進剤1:3−(3,4−ジクロロフェニル)−1,1−ジメチル尿素(保土ヶ谷化学株式会社製、製品名:DCMU99)
<炭素繊維>
・炭素繊維1:TR50S 15L、(製品名、三菱レイヨン株式会社製、目付け:1g/m)
Condensed phosphate ester 1 (comparative example): 1,3-phenylene bizdixylenyl phosphate (manufactured by ADEKA, product name: ADK STAB FP-500, phosphorus content 9.0 mass%
-Thermoplastic resin 1: Phenoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., product name: YP-50S)
Curing agent D-1: Dicyandiamide (Mitsubishi Chemical Corporation, product name: DICY15)
Curing accelerator 1: 3- (3,4-dichlorophenyl) -1,1-dimethylurea (Hodogaya Chemical Co., Ltd., product name: DCMU99)
<Carbon fiber>
Carbon fiber 1: TR50S 15L (Product name, manufactured by Mitsubishi Rayon Co., Ltd., basis weight: 1 g / m)
<評価方法>
(1)UL−94V燃焼試験(樹脂板):
2mm厚の樹脂板を試験片(長さ127mm×幅12.7mm)に加工し、スガ試験機製燃焼試験機を用いてUL−94V規格に従って燃焼試験を実施した。すなわち、試験片をクランプに垂直に取付け、20mm炎による10秒間接炎を行い燃焼時間を測定した。5個の試験片について燃焼試験を行い、クランプまで燃焼したサンプルの数、各燃焼時間のうちの最大値、および5個の燃焼時間の合計(総燃焼時間)を記録した。また、その結果に基づいて判定[V−0、V−1、V−2、fail]を行った。難燃性はV−0が最も優れており、V−1、V−2、failの順に劣っていく。
<Evaluation method>
(1) UL-94V combustion test (resin plate):
A resin plate having a thickness of 2 mm was processed into a test piece (length 127 mm × width 12.7 mm), and a combustion test was performed according to the UL-94V standard using a combustion tester manufactured by Suga Test Instruments. That is, the test piece was attached to the clamp vertically, an indirect flame with a 20 mm flame was performed for 10 seconds, and the combustion time was measured. A burn test was performed on five specimens, and the number of samples burned to the clamp, the maximum value of each burn time, and the sum of the five burn times (total burn time) were recorded. Moreover, determination [V-0, V-1, V-2, fail] was performed based on the result. As for flame retardancy, V-0 is most excellent, and V-1, V-2 and fail are in that order.
(2)UL−94V燃焼試験(炭素繊維複合材料板):
上記(1)のUL−94V燃焼試験(樹脂板)において、試験片を、繊維目付210g/m2、樹脂含有率33質量%の炭素繊維プリプレグを硬化して得られる、0.6mm厚または0.8mm厚の炭素繊維複合材料板([0°/90°]s)に変更するほかは、上記(1)と同様にして評価を行った。
(3)Tgの測定
測定機器はTAインスツルメント社製Q1000を用いた。
樹脂組成物の硬化物に関して、サンプルを粉砕し、5mg計量して、JISK7121準拠して、DSC−Tgを測定した。樹脂組成物の硬化条件は130℃×2時間、昇温速度2℃/分とした。
(4)粘度の測定
エポキシ樹脂組成物の30℃での粘度、および70℃での粘度を(測定装置:TAインスツルメント社製 AR−G2(製品名)、測定条件:25mmφパラレルプレートを用いて、プレートギャップ500nm、昇温速度2℃/minで昇温、角速度10rad/sec、ストレス300Pa)で測定した。
(2) UL-94V combustion test (carbon fiber composite material plate):
In the UL-94V combustion test (resin plate) of the above (1), the test piece is obtained by curing a carbon fiber prepreg having a fiber basis weight of 210 g / m 2 and a resin content of 33% by mass. Evaluation was performed in the same manner as in the above (1) except that the carbon fiber composite material plate ([0 ° / 90 °] s) having a thickness of 8 mm was used.
(3) Measurement of Tg Q1000 manufactured by TA Instruments was used as a measuring instrument.
Regarding the cured product of the resin composition, the sample was pulverized, 5 mg was weighed, and DSC-Tg was measured according to JISK7121. The curing conditions for the resin composition were 130 ° C. × 2 hours, and the heating rate was 2 ° C./min.
(4) Viscosity measurement The viscosity at 30 ° C. and the viscosity at 70 ° C. of the epoxy resin composition (measuring device: AR-G2 (product name) manufactured by TA Instruments Co., Ltd.), measurement conditions: using a 25 mmφ parallel plate The measurement was performed at a plate gap of 500 nm, a temperature increase rate of 2 ° C./min, a temperature increase of 10 rad / sec, and a stress of 300 Pa).
<エポキシ樹脂組成物の調製方法>
予め、表1に示す組成の硬化剤マスターバッチ1と、表2、3に示す組成のエポキシ樹脂マスターバッチ1、2を調製しておき、これらを混合してエポキシ樹脂組成物を調製した。
[硬化剤マスターバッチ1の調製]
表1に示す組成で、エポキシ樹脂A−1、硬化剤D−1、硬化促進剤1を容器に計量し攪拌・混合した。さらに三本ロールミルにてさらに細かく混合して、硬化剤マスターバッチ1を得た。
<Method for preparing epoxy resin composition>
A curing agent master batch 1 having the composition shown in Table 1 and epoxy resin master batches 1 and 2 having the compositions shown in Tables 2 and 3 were prepared in advance, and these were mixed to prepare an epoxy resin composition.
[Preparation of curing agent master batch 1]
In the composition shown in Table 1, epoxy resin A-1, curing agent D-1, and curing accelerator 1 were weighed and mixed in a container. Furthermore, it further mixed finely with a three roll mill, and the hardening | curing agent masterbatch 1 was obtained.
[エポキシ樹脂マスターバッチ1、2の調製]
表2、3に示す組成でエポキシ樹脂Aおよび熱可塑性樹脂1をガラスフラスコに計量した後、170℃に過熱したオイルバス中で3時間攪拌・混合し、エポキシ樹脂マスターバッチ1、2をそれぞれ得た。
[Preparation of epoxy resin master batches 1 and 2]
Epoxy resin A and thermoplastic resin 1 having the compositions shown in Tables 2 and 3 were weighed into a glass flask and then stirred and mixed in an oil bath heated to 170 ° C. for 3 hours to obtain epoxy resin master batches 1 and 2, respectively. It was.
<実施例1〜5および比較例1、2>
表4に示す配合となるように各原料をガラスフラスコに計量した後、65℃に過熱したウォーターバス中で攪拌・混合し、エポキシ樹脂組成物を得た。エポキシ樹脂A−1〜A−3の合計のエポキシ当量に対する硬化剤D−1の活性水素当量の比はいずれも0.63である。
例4,5および比較例2で得られたエポキシ樹脂組成物の硬化物についてTgを測定した。結果を表4に示す。
<Examples 1 to 5 and Comparative Examples 1 and 2>
Each raw material was weighed into a glass flask so as to have the composition shown in Table 4, and then stirred and mixed in a water bath heated to 65 ° C. to obtain an epoxy resin composition. The ratio of the active hydrogen equivalent of the curing agent D-1 to the total epoxy equivalent of the epoxy resins A-1 to A-3 is 0.63.
Tg of the cured epoxy resin compositions obtained in Examples 4 and 5 and Comparative Example 2 was measured. The results are shown in Table 4.
実施例1〜5および比較例1、2で得られたエポキシ樹脂組成物を2mm厚のポリテトラフルオロエチレンのスペーサーを挟んだ2枚のガラス板の間に注入、130℃×2時間、昇温速度2℃/分の硬化条件で加熱硬化し、樹脂板を得た。得られた樹脂板についてUL−94準拠難燃性燃焼試験を行った。結果を表4に示す。
また得られたエポキシ樹脂組成物を、ヒラノテクシード社製、製品名:M−500のコンマコーターでフィルム状にし、52g/m2の樹脂フィルムを作製した。この樹脂フィルムと、前記炭素繊維1を用い、ドラムワインド方式によって繊維目付210g/m2、樹脂含有率33質量%の炭素繊維プリプレグを得た。
得られた炭素繊維プリプレグを200mm×200mmの大きさにカットし、繊維方向が[0°/90°]s=0°/90°/90°/0°となるように4枚積み重ね、または0°/90°/0°となるように3枚積み重ね、130℃×90分、昇温速度2℃/分、圧力0.6MPaの条件でオートクレーブにて硬化し、厚さが0.8mm(4枚積層)または0.6mm(3枚積層)の炭素繊維複合材料板をそれぞれ得た。得られた素繊維複合材料板はについてUL−94準拠難燃性燃焼試験を行った。結果を表4に示す。
The epoxy resin compositions obtained in Examples 1 to 5 and Comparative Examples 1 and 2 were injected between two glass plates sandwiching a 2 mm-thick polytetrafluoroethylene spacer, 130 ° C. × 2 hours, heating rate 2 Heat curing was performed under curing conditions of ° C./min to obtain a resin plate. The obtained resin plate was subjected to a flame retardant combustion test according to UL-94. The results are shown in Table 4.
The obtained epoxy resin composition was made into a film with a comma coater manufactured by Hirano Techseed Co., Ltd., product name: M-500, to prepare a 52 g / m 2 resin film. Using this resin film and the carbon fiber 1, a carbon fiber prepreg having a fiber basis weight of 210 g / m 2 and a resin content of 33% by mass was obtained by a drum wind method.
The obtained carbon fiber prepreg is cut into a size of 200 mm × 200 mm, and four sheets are stacked so that the fiber direction is [0 ° / 90 °] s = 0 ° / 90 ° / 90 ° / 0 °, or 0 Three sheets are stacked so that the angle is 90 ° / 90 °, cured at 130 ° C. for 90 minutes, heated at a rate of 2 ° C./minute, and pressure of 0.6 MPa in an autoclave. Sheet laminated) or 0.6 mm (three laminated) carbon fiber composite material plates were obtained. The obtained raw fiber composite material plate was subjected to a flame retardant combustion test in accordance with UL-94. The results are shown in Table 4.
表4の結果に示されるように、難燃剤として(C)成分だけを添加した比較例1に比べて、(C)成分に加えて(B)成分を用いた実施例1は難燃性が向上した。難燃剤として(B)成分だけを添加した比較例2に比べて、(C)成分とに加えて(B)成分を用いた実施例5は難燃性が向上した。
また、(B)成分と(C)成分とを併用した実施例4,5は、(B)成分だけを添加した比較例2に比べて硬化物のTgが高く、耐熱性が向上した。なお、実施例4,5において、(C)成分の含有量が増えるにしたがって、Tgが上昇する傾向にある。したがって、実施例1〜3はTgを測定していないが、実施例4の113℃より高いと推測される。
As shown in the results of Table 4, compared with Comparative Example 1 in which only the component (C) was added as a flame retardant, Example 1 using the component (B) in addition to the component (C) has flame retardancy. Improved. Compared to Comparative Example 2 in which only the component (B) was added as a flame retardant, Example 5 using the component (B) in addition to the component (C) improved the flame retardancy.
In Examples 4 and 5 in which the (B) component and the (C) component were used in combination, the Tg of the cured product was higher and the heat resistance was improved as compared with Comparative Example 2 in which only the (B) component was added. In Examples 4 and 5, Tg tends to increase as the content of component (C) increases. Therefore, although Examples 1-3 did not measure Tg, it is estimated that it is higher than 113 degreeC of Example 4. FIG.
<実施例6〜8>
配合を表5に示す通りに変更したほかは実施例1と同様にして、エポキシ樹脂組成物を得た。エポキシ樹脂A−1とA−4の合計のエポキシ当量に対する硬化剤D−1の活性水素当量の比は0.65である。
例6のエポキシ樹脂組成物について、30℃および70℃での粘度を測定した。結果を表5に示す。
例6〜8で得られたエポキシ樹脂組成物の硬化物についてTgを測定した。結果を表5に示す。
得られたエポキシ樹脂組成物を、実施例1と同じコンマコーターでフィルム状にし、53g/m2の樹脂フィルムを作製した。この樹脂フィルムを用い、実施例1と同じ方法で繊維目付215g/m2、樹脂含有率33%の炭素繊維プリプレグを得た。
得られた炭素繊維プリプレグを用い、実施例1と同様にして、厚さが0.8mmまたは0.6mmの炭素繊維複合材料板をそれぞれ得、燃焼試験を行った。結果を表5に示す。
<Examples 6 to 8>
An epoxy resin composition was obtained in the same manner as in Example 1 except that the formulation was changed as shown in Table 5. The ratio of the active hydrogen equivalent of the curing agent D-1 to the total epoxy equivalent of the epoxy resins A-1 and A-4 is 0.65.
About the epoxy resin composition of Example 6, the viscosity in 30 degreeC and 70 degreeC was measured. The results are shown in Table 5.
Tg was measured about the hardened | cured material of the epoxy resin composition obtained in Examples 6-8. The results are shown in Table 5.
The obtained epoxy resin composition was made into a film with the same comma coater as in Example 1 to produce a 53 g / m 2 resin film. Using this resin film, a carbon fiber prepreg having a fiber basis weight of 215 g / m 2 and a resin content of 33% was obtained in the same manner as in Example 1.
Using the obtained carbon fiber prepreg, a carbon fiber composite material plate having a thickness of 0.8 mm or 0.6 mm was obtained in the same manner as in Example 1, and a combustion test was performed. The results are shown in Table 5.
表5の結果に示されるように、エポキシ樹脂A−1とA−4を用いた実施例6〜8においても、良好な難燃性が得られた。 As shown in the results of Table 5, good flame retardancy was also obtained in Examples 6 to 8 using epoxy resins A-1 and A-4.
<比較例3>
表6に示す組成で原料をガラスフラスコに計量した後、65℃に過熱したウォーターバス中で攪拌・混合し、エポキシ樹脂組成物を得た。
得られたエポキシ樹脂組成物を、実施例1と同様にして、2mm厚の樹脂板に成形し、燃焼試験を行った。結果を表6に示す。
なお表6には、比較のために実施例5の結果を併記している。
<Comparative Example 3>
The raw materials were weighed in a glass flask with the composition shown in Table 6, and then stirred and mixed in a water bath heated to 65 ° C. to obtain an epoxy resin composition.
The obtained epoxy resin composition was molded into a 2 mm thick resin plate in the same manner as in Example 1, and a combustion test was performed. The results are shown in Table 6.
In Table 6, the results of Example 5 are also shown for comparison.
表6の結果に示されるように、難燃剤として縮合リン酸エステルを用いた比較例3に比べて、縮合リン酸エステルを用いず、その代わりに(B)成分を用いた実施例5は、リン含有量が同等であるにもかかわらず、難燃性が向上した。 As shown in the results of Table 6, compared to Comparative Example 3 using a condensed phosphate ester as a flame retardant, Example 5 using a component (B) instead of the condensed phosphate ester, Despite the same phosphorus content, flame retardancy was improved.
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| JP2019505412A (en) * | 2015-12-30 | 2019-02-28 | サイテック インダストリーズ インコーポレイテッド | Multifunctional surface material that resists burn-off |
| JP7007274B2 (en) | 2015-12-30 | 2022-01-24 | サイテック インダストリーズ インコーポレイテッド | Multi-functional surface material with melt-down resistance |
| WO2022111023A1 (en) * | 2020-11-30 | 2022-06-02 | 金发科技股份有限公司 | Flame-retardant abs composition, and preparation method therefor and application thereof |
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