JP2012138429A - Electronic component module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component module which solves a problem that a large stress may be applied to a jointing member for electrically connecting the electronic component to a wiring conductor of base housing the electronic component.SOLUTION: The method for manufacturing the electronic component comprises a step for preparing a green laminated body having a green sheet laminated body in which a cavity is formed therein and a first conductive paste provided on a surface of the green sheet laminated body, and an electronic component having a laminated body composed of a plurality of ceramic layers and having a second input/output electrode provided on the surface of the laminated body; a step for housing the electronic component in the cavity and connecting the first conductive paste and a second input/output electrode with each other via the second conductive paste being a conductive jointing member; and a step for exposing of at least a part of the jointing member to the cavity after a sintering step by having the volume of the cavity larger than that of the electronic component when the green laminated body is sintered.

Description

  The present invention relates to an electronic component module including an electronic component in which a coil-shaped inner conductor is embedded. Such an electronic component module is used as a module component including, for example, an inductor, a transformer, a coil component, an LC component, or a feedthrough capacitor in a wide variety of electronic devices typified by industrial electronic devices and consumer electronic products. it can.

  As a module including an electronic component in which a coil-shaped inner conductor is embedded, for example, a multilayer ceramic substrate described in Patent Document 1 is known. In the method of manufacturing a multilayer ceramic substrate described in Patent Document 1, a space is provided in advance in a ceramic green sheet laminate, and a raw composite laminate is produced by fitting passive components into this space. . A multilayer ceramic substrate is produced by firing the raw composite laminate.

Japanese Patent Laid-Open No. 11-87918

  In the multilayer ceramic substrate described in Patent Document 1, a space is previously provided in the ceramic green sheet laminate, and a passive composite component is fitted into this space and a raw composite laminate produced thereby. Is fired. However, when the material composition of the ceramic material used for the passive component corresponding to the electronic component is different from that of the ceramic material used for the ceramic green sheet, or a pre-fired passive component is fitted in the above space. When the raw composite laminate is fired, the shrinkage rate of the passive component differs from that of the ceramic green sheet, so there is no gap between these members, and the passive component is removed from the ceramic green sheet. There is a possibility that a large pressure will be applied.

  When such a large pressure is applied, a large pressure is also applied to the conductive paste that electrically connects the wiring conductor of the laminate and the passive component. For this reason, a contact failure may occur between the wiring conductor and the passive component, or the conductive paste may extend greatly in an unexpected direction and an electrical short circuit may occur.

  This invention is made in view of such a prior art, and manufacture of the electronic component module which can suppress that a big pressure is added to the electrically conductive paste which electrically connects a wiring conductor and a passive component. It aims to provide a method.

A method for manufacturing an electronic component module according to an aspect of the present invention includes a green sheet laminate in which a plurality of ceramic green sheets are laminated, and a space is formed therein, and the green sheet lamination so as to face the space. Preparing a green laminate comprising a first conductive paste serving as a first input / output electrode disposed on the surface of the body, a laminate comprising a plurality of ceramic layers, and a coil embedded in the laminate A step of preparing an electronic component including a second input / output electrode disposed on the surface of the laminated inner conductor and electrically connected to the coiled inner conductor; and Joining the first conductive paste and the second input / output electrode via a second conductive paste that is housed in the space of the green laminate and becomes a conductive joining member; Article has a step of firing the raw laminate housed in the space. The volume of the space before the firing step is larger than the volume of the electronic component, and at least a part of the joining member after the firing step is exposed to the space.

  In the manufacturing method of the electronic component module based on the above aspect, the volume of the space formed in the green sheet laminate before the firing step is larger than the volume of the electronic component, and at least the joining member after the firing step A part is exposed in this space. For this reason, even when pressure is applied to the second conductive paste serving as the bonding member, stress can be released to the space.

  As a result, the bonding member is stably bonded to the first input / output electrode of the base and the second input / output electrode of the electronic component, so that the connection between the first input / output electrode and the second input / output electrode It is possible to reduce the possibility of contact failure or the possibility of an electrical short circuit due to the joining member extending greatly in an unexpected direction.

It is a perspective sectional view showing the electronic component module of one embodiment. It is an expanded sectional view which shows the area | region in which the electronic component in the electronic component module of embodiment shown in FIG. 1 was arrange | positioned. It is a disassembled perspective view which shows the electronic component in the electronic component module of embodiment shown in FIG. It is the disassembled perspective view which expanded partially the internal space in the electronic component module of embodiment shown in FIG. It is the disassembled perspective view which expanded the upper surface of the electronic component in the electronic component module of embodiment shown in FIG. 1 partially. It is a figure which shows a mode that the 1st input / output electrode and 2nd input / output electrode in the electronic component module of embodiment shown in FIG. 1 are joined, Comprising: (a) is the process of baking a raw laminated body. It is an expanded sectional view showing the front. Moreover, (b) is an enlarged cross-sectional view showing the step after the step of firing the green laminate.

  Hereinafter, the electronic component module of this embodiment and the manufacturing method thereof will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the electronic component module according to the present embodiment can include any constituent member that is not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1-3, the manufacturing method of the electronic component module 1 of this embodiment is made by first laminating a plurality of ceramic green sheets, and has a space inside (hereinafter referred to as an internal space 5 for convenience). And a green sheet laminate 3 formed with a first conductive paste 7 serving as a first input / output electrode 7 disposed on the surface of the green sheet laminate 3 so as to face the internal space 5. It has the process of preparing the laminated body 9.

Specifically, first, a ceramic green sheet constituting the green laminate 9 is produced. For the production of the ceramic green sheet, a mixing member is produced by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder. As the raw material powder, for example, alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO) can be used. A plurality of ceramic green sheets can be produced by forming the mixing member into a sheet.

  At this time, the internal space 5 is formed by forming the mixing member in a sheet shape so as to have a through-hole corresponding to the region to be the internal space 5 and sandwiching between the ceramic green sheets having no such through-hole. The formed green sheet laminate 3 can be produced.

  In addition, a first conductive paste 7 to be the first input / output electrode 7 is disposed on the surface of the ceramic green sheet with a part of the upper surface facing the internal space 5. In this way, the first conductive paste 7 is disposed on the surface of the green sheet laminate 3 so as to face the internal space 5. In the method of manufacturing the electronic component module 1 according to the present embodiment, the first conductive paste 7 is disposed on the surface of the ceramic green sheet with a part of the upper surface facing the internal space 5. It is not something that can be done. For example, the first conductive paste 7 may be disposed on the inner peripheral surface of the through hole in the ceramic green sheet having the above through hole.

  Moreover, it is preferable that the 1st electrically conductive paste 7 has a through-hole opened to an upper surface and a lower surface. As shown in FIG. 4, when the first conductive paste 7 has through holes that open to the upper surface and the lower surface, stress can be released into the through holes. This is because even if a pressing force is applied to the second conductive paste 11 that becomes the bonding member 11, the bonding member 11 can be pushed out into the through hole. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13.

  Moreover, although the 1st electrically conductive paste 7 may have a through-hole opened on an upper surface and a lower surface, it is also preferable that the 1st electrically conductive paste 7 has a recessed part on an upper surface. In the case where the first conductive paste 7 is formed in this way, even if a pressing force is applied to the second conductive paste 11 that becomes the bonding member 11, the bonding member 11 can be pushed out into the recess. Because it can. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13 while suppressing an excessive pressing force from being applied to the second conductive paste 11.

  Moreover, as shown in FIG. 4, it is preferable to form the convex part 3a in the part which faces the space in the green sheet laminated body 3, and to arrange | position the 1st electrically conductive paste 7 on the convex part 3a. Thus, when the convex part 3a is formed, even if pressing force is added to the 2nd electrically conductive paste 11 used as the joining member 11, the joining member 11 can be extruded around this convex part 3a. Because. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13 while suppressing an excessive pressing force from being applied to the second conductive paste 11.

  As the first conductor paste, for example, a metal paste obtained by mixing an organic solvent and a binder with a metal powder made of a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold may be used. As a method of disposing the conductive paste on the surface of the green sheet laminate 3 so as to face the internal space 5, for example, a screen printing method may be used.

Further, the green laminate 9 in the present embodiment includes a third conductive paste 15 that is embedded in the green sheet laminate 3 and electrically connected to the first conductive paste 7. The third conductive paste 15 becomes a wiring conductor 15 that electrically connects the first input / output electrode 7 and the external wiring through a baking process described later. As the third conductor paste, similarly to the first conductor paste, a metal paste obtained by mixing a metal powder made of a metal material with an organic solvent and a binder may be used.

  As described above, the green laminate 9 in the method for manufacturing the electronic component module 1 of the present embodiment can be prepared.

  In addition, the manufacturing method of the electronic component module 1 of the present embodiment is provided on the surface of the multilayer body 17 composed of a plurality of ceramic layers, the coiled inner conductor 19 embedded in the multilayer body 17, and the multilayer body 17. A step of preparing an electronic component 21 having a second input / output electrode 13 electrically connected to the coiled inner conductor 19.

The laminate 17 can be produced by producing a plurality of ceramic green sheets and laminating these ceramic green sheets in the same manner as the raw laminate 9 described above. Examples of these ceramic green sheets include raw material powders and organic solvents using alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO). In addition, a mixing member produced by mixing a binder may be used.

  In particular, since the coiled inner conductor 19 is used as an inductor, it is preferable that the plurality of ceramic layers have magnetism, and specifically include, for example, a material made of ferrite or a magnetic material such as ferrite. Is preferred.

  The coiled inner conductor 19 can be formed by disposing a metal paste that becomes the coiled inner conductor 19 on the upper surface of the ceramic green sheet that becomes a ceramic layer by firing. The coiled inner conductor 19 is formed by firing this metal paste. In addition, the metal paste that becomes the coiled inner conductor 19 may be simply disposed on the upper surface of the ceramic green sheet. For example, a through hole is formed in the ceramic green sheet so as to correspond to the shape of the coiled inner conductor 19. Even if the coiled inner conductor 19 is formed by disposing a metal paste in the through hole, there is no problem.

  In addition, a part of the coiled inner conductor 19 is exposed on the outer surface of the laminated ceramic green sheet, and the second input / output electrode 13 is joined to the exposed part of the coiled inner conductor 19. A metal paste is disposed. By firing this metal paste, the second input / output electrode 13 disposed on the surface of the multilayer body 17 and electrically connected to the coiled inner conductor 19 can be formed.

  In the method for manufacturing the electronic component module 1 of the present embodiment, the second input / output electrode 13 is disposed on the lower surface of the multilayer body 17 so as to face the first conductive paste 7. Therefore, when the first conductive paste 7 is disposed on the inner peripheral surface of the through hole in the ceramic green sheet constituting the green laminate 9, the laminate 17 is opposed to the first conductive paste 7. The second input / output electrode 13 may be disposed on the side surface of the first electrode.

  Moreover, it is preferable that the 2nd input / output electrode 13 has a through-hole opened to an upper surface and a lower surface. As shown in FIG. 5, when the second input / output electrode 13 has a through hole that opens to the upper surface and the lower surface, stress can be released into the through hole. This is because even if a pressing force is applied to the second conductive paste 11 that becomes the bonding member 11, the bonding member 11 can be pushed out into the through hole. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13.

In addition, the second input / output electrode 13 may have a through hole that opens to the upper surface and the lower surface, but the second input / output electrode 13 preferably has a recess on the upper surface. In the case where the second input / output electrode 13 is formed in this way, even if a pressing force is applied to the second conductive paste 11 that becomes the bonding member 11, the bonding member 11 is pushed out into the recess. Because you can. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13 while suppressing an excessive pressing force from being applied to the second conductive paste 11.

  Moreover, as shown in FIG. 5, it is preferable that the laminated body 17 has the convex part 17a on the upper surface, and the 2nd input / output electrode 13 is arrange | positioned on this convex part 17a. Thus, when the convex part 17a is formed, even if pressing force is added to the 2nd conductive paste 11 used as the joining member 11, the joining member 11 can be extruded around this convex part 17a. Because. Therefore, the bonding member 11 can be stably bonded to the first input / output electrode 7 and the second input / output electrode 13 while suppressing an excessive pressing force from being applied to the second conductive paste 11.

  As the metal paste that becomes the coiled inner conductor 19 and the metal paste that becomes the second input / output electrode 13, for example, a metal such as tungsten, molybdenum, nickel, copper, silver, and gold, like the first conductor paste. What is necessary is just to use the metal paste which mixed the organic solvent and the binder with the metal powder which consists of material.

  In the step of preparing the electronic component 21, the surface of the multilayer body 17 where the second input / output electrode 13 is not disposed is not sintered or melted at the firing temperature of the raw multilayer body 9. An insulating layer 23 is preferably provided.

  By disposing such an insulating layer 23, when the green laminate 9 is fired, the ceramic green sheet constituting the green laminate 9 and the ceramic layer constituting the electronic component 21 are in contact with each other. However, it can suppress that these members adhere | attach. Therefore, the ceramic green sheet can easily slide on the surface of the ceramic layer, so that the stress applied to the electronic component 21 can be further reduced.

  Moreover, since it can suppress that these members adhere | attach, the component which comprises a ceramic green sheet and the component which comprises a ceramic layer can also react mutually. Therefore, it can suppress that the magnetic permeability of a ceramic layer changes.

  As the insulating layer 23, a ceramic film using a ceramic member that does not sinter at the firing temperature of the green laminate 9, an organic material layer made of an organic material that does not melt at the firing temperature of the green laminate 9, or the organic material layer described above A member whose surface is coated with the above ceramic film can be used.

  As described above, the electronic component 21 in the method for manufacturing the electronic component module 1 of the present embodiment can be prepared.

  Next, the electronic component 21 is accommodated in the internal space 5 of the green laminate 9 and the first conductive paste 7 and the second input / output electrode 13 are interposed via the second conductive paste 11 that becomes the conductive bonding member 11. And join.

At this time, the volume of the internal space 5 is larger than the volume of the electronic component 21, and a gap is provided between the internal space 5 of the green laminate 9 and the electronic component 21. This is because the raw laminate 9 contracts in the step of firing the raw laminate 9 to be described later. When the raw laminate 9 contracts, force is applied to the conductive paste and the electronic component 21, so that the first input / output electrode This is to reduce the possibility that a large pressure is also applied to the conductive paste that electrically connects 7 and the second input / output electrode 13.

  Therefore, the size of the gap provided between the internal space 5 of the green laminate 9 and the electronic component 21 is after the step of firing the green laminate 9, and the internal space 5 is contracted by the shrinkage of the green laminate 9. Even when this is small, it is required that at least a part of the joining member 11 has a size that can be exposed to the internal space 5.

  The conductive bonding member 11 is a metal obtained by mixing an organic solvent and a binder with a metal powder made of a metal material such as tungsten, molybdenum, nickel, copper, silver and gold, as in the case of the first conductor paste. A paste can be used.

  In particular, it is preferable that the bonding member 11 contains at least a part of components constituting the first input / output electrode 7 and the second input / output electrode 13. This is because the bonding property between the first input / output electrode 7 and the second input / output electrode 13 and the bonding member 11 can be improved.

  In addition, in the manufacturing method of the electronic component module 1 of this embodiment, while preparing the unbaked electronic component 21 in said process, this unburned electronic component 21 is made simultaneously with the raw laminated body 9 by the baking process mentioned later. Although it is fired, it is not limited to this. The unfired electronic component 21 produced as described above may be separately fired and then stored in the internal space 5 of the green laminate 9.

  In particular, when the baked electronic component 21 is stored in the internal space 5 of the green laminate 9, the difference between the shrinkage rate of the green laminate 9 and the shrinkage rate of the electronic component 21 in the baking process becomes very large. Therefore, it is required to secure a wider internal space 5 as compared with the case of simultaneous firing.

  Next, the green laminate 9 in which the electronic component 21 is housed in the internal space 5 is fired.

  Specifically, by firing the green laminate 9 produced as described above, the green laminate 9 in the state shown in FIG. 6A contracts, and as shown in FIG. The first conductive paste 7 and the second input / output electrode 13 are joined via the two conductive pastes 11. In this way, the electronic component module 1 of the present embodiment can be manufactured. In the method for manufacturing the electronic component module 1 of the present embodiment, the unfired electronic component 21 is fired simultaneously with the firing of the green laminate 9. In addition, by firing the joining member 11 in this firing step, the first input / output electrode 7 and the second input / output electrode 13 can be electrically connected via the joining member 11.

  In the method for manufacturing the electronic component module 1 of the present embodiment, the optimum firing temperature differs depending on the ceramic green sheet constituting the green laminate 9 and the material used as the first conductive paste 7 to be the first input / output electrode 7. May be fired at a temperature of about 1500 to 1800 degrees.

  In addition, it is preferable that at least a part of the electronic component 21 is exposed to the internal space 5 after the above baking step. Since the stress can be relieved in the exposed portion, the possibility that a large pressure is applied from the raw laminate 9 to the electronic component 21 can be reduced by the shrinkage of the raw laminate 9 by this firing step. Because.

  An external electrode 25 electrically connected to the wiring conductor 15 is disposed on the outer surface of the fired substrate 9. By electrically connecting the external electrode 25 and an external wiring circuit (not shown), the electronic component 21 can be energized.

  As a method of disposing the external electrode 25 on the surface of the substrate 9, for example, a known vapor deposition or sputtering technique may be used. In addition, the external electrode 11 may be disposed on the surface of the base 9 so as to be electrically connected to the wiring conductor 15 after the green laminate 9 is fired. In addition, the external electrode 25 may be formed by firing the metal paste 9 simultaneously with the raw laminate 9 in the step of disposing the metal paste 25 and firing the raw laminate 9.

  By the above-described steps, the substrate 9 includes the insulator 3 having a space inside and the base 9 having the first input / output electrode 7 disposed on the surface of the insulator 3 so as to face the space, and a plurality of ceramic layers. A multilayer body 17, a coiled inner conductor 19 embedded in the multilayer body 17, and a second input / output electrode 13 disposed on the surface of the multilayer body 17 and electrically connected to the coiled inner conductor 19 are provided. The first input / output electrode 7 and the second input / output are located between the electronic component 21 housed in the space of the insulator 3 and the first input / output electrode 7 and the second input / output electrode 13. It is possible to manufacture the electronic component module 1 having the conductive joining member 11 electrically connected to the electrode 13 and exposing at least a part of the joining member 11 in the space.

  As described above, the manufacturing method of the electronic component module 1 according to the present embodiment includes a green sheet laminate 3 in which a plurality of ceramic green sheets are stacked and a space is formed therein, and a green sheet so as to face the space. A step of preparing a green laminate 9 having a first conductive paste 7 to be a first input / output electrode 7 disposed on the surface of the laminate 3, a laminate 17 comprising a plurality of ceramic layers, and a laminate And an electronic component 21 including a coiled inner conductor 19 embedded in 17 and a second input / output electrode 13 disposed on the surface of the multilayer body 17 and electrically connected to the coiled inner conductor 19. And the first conductive paste 7 and the second input / output electrode 13 through the second conductive paste 11 serving as the conductive bonding member 11 while accommodating the electronic component 21 in the space of the green laminate 9. The A step of coupling, the electronic component 21 and a step of firing the raw laminate 9 housed in the space.

  The volume of the space before the firing step is larger than the volume of the electronic component 21, and at least a part of the bonding member 11 after the firing step is exposed to the space. Thereby, even if it is a case where a pressure is applied to the 2nd conductive paste 11 used as the joining member 11, stress can be relieved to the internal space 5. FIG. Therefore, since the joining member 11 can be stably joined to the first input / output electrode 7 of the base 9 and the second input / output electrode 13 of the electronic component 21, the first input / output electrode 7 and the second input / output electrode 13 can be joined. It is possible to reduce the possibility that a contact failure occurs between the contact member 13 and the joining member 11 is greatly extended in an unexpected direction to cause an electrical short circuit.

  As mentioned above, although the electronic component module of this embodiment and the manufacturing method thereof have been described, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Electronic component module 3 ... Insulator (green sheet laminated body)
5... Internal space 7... First input / output electrode (first conductive paste)
9 ... Substrate (green laminate)
11 ... Joining member (second conductive paste)
13 ... second input / output electrode 15 ... wiring conductor (third conductive paste)
17 ... laminate 19 ... coiled internal electrode 21 ... electronic component 23 ... insulating layer

Claims (8)

A green sheet laminate comprising a plurality of ceramic green sheets laminated with a space formed therein; and a first input / output electrode disposed on a surface of the green sheet laminate so as to face the space; Preparing a green laminate comprising a first conductive paste comprising:
A laminate composed of a plurality of ceramic layers, a coiled inner conductor embedded in the laminate, and a second input / output disposed on the surface of the laminate and electrically connected to the coiled inner conductor Preparing an electronic component with an electrode;
A step of housing the electronic component in the space of the green laminate and bonding the first conductive paste and the second input / output electrode via a second conductive paste serving as a conductive bonding member; ,
Firing the green laminate in which the electronic component is housed in the space,
The volume of the space before the firing step is larger than the volume of the electronic component, and at least a part of the joining member after the firing step is exposed to the space. Production method.   In the step of preparing the electronic component, a ceramic film that is not sintered at the firing temperature of the green laminate is provided on a portion of the laminate that is not provided with the second input / output electrode. The manufacturing method of the electronic component module of Claim 1 characterized by these.   2. The method of manufacturing an electronic component module according to claim 1, wherein through holes are formed in the first conductive paste so as to open on an upper surface and a lower surface.   The electronic component module according to claim 3, wherein a convex portion is formed in a portion facing the space in the green sheet laminate, and the first conductive paste is disposed on the convex portion. Manufacturing method. A base including an insulator having a space inside and a first input / output electrode disposed on a surface of the insulator so as to face the space;
A laminate composed of a plurality of ceramic layers, a coiled inner conductor embedded in the laminate, and a second input / output disposed on the surface of the laminate and electrically connected to the coiled inner conductor An electronic component comprising an electrode and housed in the space of the insulator;
A conductive bonding member positioned between the first input / output electrode and the second input / output electrode and electrically connecting the first input / output electrode and the second input / output electrode; Have
An electronic component module, wherein at least a part of the joining member is exposed to the space.   The electronic component module according to claim 5, wherein the first input / output electrode has a through-hole that opens to an upper surface and a lower surface.   7. The electron according to claim 6, wherein a convex portion is formed on a portion of the insulator facing the space, and the first input / output electrode is disposed on the convex portion. Parts module.   The electronic component module according to claim 5, wherein at least a part of the electronic component is exposed to the space.

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