JP2012134427A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a semiconductor device which can simplify a manufacturing operation with inhibiting increase in manufacturing cost and the device size, and enhance long-term reliability of the device.SOLUTION: A semiconductor device includes a connection member 50 electrically connecting a semiconductor element 20 and a control substrate 30. In the control substrate 30, a notched part 40 penetrating the control substrate 30 in a height direction H and opening on an exterior edge of the control substrate 30 is formed. A connection member 50 extends from a base 51 fixed on the semiconductor substrate 10 side in an extension direction E slanting with respect to the height direction H and fixed to the control substrate 30 by a brazing filler metal 60 in a state of penetrating the notched part 40 in the height direction H. An opening direction O of the notched part 40 is the same direction as the extension direction E when viewed from above in the height direction H.

Description

  The present invention includes a semiconductor substrate in which a semiconductor element is arranged on an element arrangement surface, and a control board that controls the semiconductor element and is arranged apart from the semiconductor substrate in a height direction orthogonal to the element arrangement surface. The present invention relates to a semiconductor device.

  As such a semiconductor device, for example, a device described in Patent Document 1 below is already known. Hereinafter, in the description of the background art, the code or name of Patent Document 1 is appropriately described in () and cited. In the apparatus described in Patent Document 1, as shown in FIG. 1 of the document, a connection member (relay terminal 5) for electrically connecting the semiconductor element (3) and the control board (6) is provided. Then, a control signal for controlling the semiconductor element is transmitted through the connection member.

  By the way, since the semiconductor substrate and the control substrate are spaced apart from each other in the height direction, the connection member is configured to have a portion extending in the height direction. In the configuration described in Patent Document 1, the connection member extends from the base fixed to the semiconductor substrate side in a direction parallel to the height direction, and penetrates the hole (through hole 6a) provided in the control substrate. Provided. The connecting member is fixed to the control board by solder bonding in the hole. And in the structure of patent document 1, the guide member (guide member 7) for guiding the front-end | tip part of the said connection member at the time of insertion to the hole of a connection member is provided in the lower surface of the control board. This makes it easy to insert the connection member into the hole during manufacture of the semiconductor device, thereby obtaining a semiconductor device that can be easily assembled.

  However, in the configuration described in Patent Document 1, although it is possible to facilitate the work at the time of manufacturing the semiconductor device, it is necessary to separately include a guide member, so that the manufacturing cost increases due to an increase in the number of parts, There is a possibility that the apparatus becomes large due to the space for arranging the guide member. In addition, since the connecting member and the control board are joined in the holes defined by the control board on the entire circumference, it is not easy to detect the presence or absence of defects in the joint by visual inspection. Therefore, the long-term reliability of the device may be reduced.

JP 2004-87605 A

  Therefore, it is desired to realize a semiconductor device that can facilitate manufacturing work while suppressing an increase in manufacturing cost and an increase in size of the device, and can improve long-term reliability of the device.

  A semiconductor substrate in which a semiconductor element is arranged on an element arrangement surface according to the present invention; and a control board that controls the semiconductor element and is arranged apart from the semiconductor substrate in a height direction orthogonal to the element arrangement surface; The semiconductor device comprising: a semiconductor device comprising: a connection member that electrically connects the semiconductor element and the control board; the control board penetrates the control board in the height direction and the control board A notch is formed in an outer edge of the substrate, and the connection member extends from a base fixed to the semiconductor substrate in an extending direction inclined with respect to the height direction, and the inside of the notch is It is joined to the control substrate by a brazing material in a state penetrating in the vertical direction, and the opening direction of the notch is the same direction as the extending direction in a plan view along the height direction. It is in.

  In the present application, the “same direction” with respect to the two directions is used as a concept including not only a case where the two directions are completely the same direction but also a deviation corresponding to a manufacturing error. An error in manufacturing occurs due to, for example, a deviation within a tolerance range of dimensions and mounting positions.

According to said characteristic structure, a connection member can be inserted in a notch part comparatively easily at the time of manufacture of a semiconductor device. That is, when the semiconductor device is manufactured, the connection member extending in the same direction as the opening direction of the notch portion in a plan view is located on the opening direction side by bringing the control substrate closer to the height direction with respect to the connection member. Are sequentially inserted into the notch. Therefore, it becomes easy to absorb the error of the dimension of the connecting member, the mounting position, or the extending direction. Similarly, when the semiconductor device is manufactured, the control board is brought close to the direction intersecting the height direction with respect to the connection member, and the connection member is inserted into the cutout portion from the opening side in the same manner. It becomes easy to absorb errors in dimensions, mounting positions, or extending directions. Therefore, the connecting member can be inserted into the cutout portion relatively easily.
As described above, according to the above-described characteristic configuration, the connection member can be inserted into the notch portion relatively easily during the manufacture of the semiconductor device without separately providing a special member such as a guide member. That is, it is possible to provide a semiconductor device in which the manufacturing operation is facilitated in a form in which an increase in manufacturing cost and an increase in size of the device are suppressed.
In addition, according to the above-described characteristic configuration, the joint portion of the connecting member and the control board formed by the brazing material is not formed in the hole portion partitioned by the control board on the entire circumference but in the notch that opens to the outer edge of the control board. Is done. For this reason, the appearance inspection of the joint portion can be performed from the direction not blocked by the control substrate (that is, the opening side). Therefore, it becomes relatively easy to find defects in the joint such as non-wetting of the brazing material, and the long-term reliability of the apparatus can be improved.

  Here, it is preferable that the connection member is bonded to the control board in a state where the connection member is in contact with a bottom portion which is a boundary edge with the control board on a side opposite to the opening direction of the notch.

  According to this configuration, since the connecting member, which is two members to be joined, and the control board can be joined with the brazing material in a state where they are in contact with each other at the joined portion, the joining work is facilitated. At the same time, highly reliable joining can be performed.

  As described above, in the configuration in which the connection member is bonded to the control board in contact with the bottom portion, the connection member is elastically deformed by being pressed in the opening direction by the bottom portion of the notch portion. It is preferable that it is in contact with the bottom in a state.

  According to this configuration, the state in which the connection member and the bottom of the notch are in contact with each other can be easily maintained, so that the above-described joining work can be facilitated and the joining reliability can be more reliably improved. it can.

  In the semiconductor device having each configuration described above, it is preferable that the cutout portion is formed so that a width in a direction orthogonal to the opening direction becomes wider as it goes in the opening direction in the plan view.

When the connection member is inserted into the notch by bringing the control board closer to the connection member in the height direction, and the connection member is moved closer to the direction intersecting the height direction than the connection member, and the connection member is moved to the notch. In both cases of insertion from the opening side, the connecting member moves in the notch from the opening side toward the bottom side.
In view of this point, according to the above configuration, it is possible to increase the width of the portion where the connection member first enters in the cutout portion so that the connection member is easily introduced into the cutout portion. When a part of the connection member enters the notch, the inner surface of the notch can then function as a guide for the connection member, and the connection member can be moved to a predetermined position in the notch. That is, according to the above configuration, it is easy to absorb the error in the dimension of the connecting member and the mounting position in the direction (opening width direction) orthogonal to both the height direction and the opening direction, or the error in the extending direction. Become.

1 is an exploded perspective view of a semiconductor device according to an embodiment of the present invention. 1 is a top view of a semiconductor device according to an embodiment of the present invention. It is III-III sectional drawing in FIG. It is IV-IV sectional drawing in FIG. It is an expanded sectional view of the junction part vicinity of the connection member and control board concerning the embodiment of the present invention. It is explanatory drawing of the connection member insertion process which concerns on embodiment of this invention.

  Embodiments of a semiconductor device according to the present invention will be described with reference to the drawings. Here, a case where the semiconductor device according to the present invention is applied to the semiconductor device 100 including the switching element 20 as a semiconductor element will be described as an example. As shown in FIG. 1, the semiconductor device 100 according to the present embodiment includes a semiconductor substrate 10 in which a switching element 20 is arranged on an element arrangement surface 11, a control board 30 that controls the switching element 20, a switching element 20, and a control. A connection member 50 for electrically connecting the substrate 30 is provided.

  In such a configuration, in the semiconductor device 100 according to the present embodiment, the control board 30 is formed with the notch portion 40 that opens to the outer edge portion 31 of the control board 30, and the connection member 50 is high from the base 51. It extends in the extending direction E inclined with respect to the height direction H, and is joined to the control board 30 by the solder 60 in a state of penetrating the notch 40 in the height direction H (FIG. 3). And the opening direction O of the notch part 40 is made into the same direction as the extending direction E by planar view along the height direction H (FIG. 2). As a result, the connection member 50 can be inserted into the cutout portion 40 relatively easily when the semiconductor device 100 is manufactured, and the manufacturing operation can be facilitated. Hereinafter, the configuration of the semiconductor device 100 according to the present embodiment will be described in the order of “semiconductor device configuration”, “notch configuration”, and “semiconductor device manufacturing method”.

  In the following description, “upper” indicates a direction (upward in FIG. 1) from the semiconductor substrate 10 toward the control substrate 30 along the height direction H orthogonal to the element arrangement surface 11, and “lower” , The direction from the control substrate 30 toward the semiconductor substrate 10 along the height direction H (downward in FIG. 1). The height direction H is the vertical direction in the configuration in which the element arrangement surface 11 is arranged in parallel with the horizontal plane. In the following description, unless otherwise specified, the direction of each member constituting the semiconductor device 100 indicates the direction in which these members are assembled to the semiconductor device 100. Note that the direction of each member and the relationship of the arrangement direction between the two members (for example, “parallel”, “orthogonal”, etc.) are used as a concept including a deviation corresponding to a manufacturing error. Such manufacturing errors are caused, for example, by deviations within the tolerances of dimensions and mounting positions.

1. Configuration of Semiconductor Device As shown in FIGS. 1 to 3, the semiconductor device 100 includes a case 1, a base plate 2 fixed to the lower side of the case 1, and a control board 30 fixed to the upper side of the case 1. I have. As shown in FIG. 1, the case 1 is formed in a frame shape having a wall portion extending in the height direction H. In addition, a part of the wall portion included in the case 1 is cut away from the upper surface portion. And a second upper surface portion 1b located on the side. In FIG. 1, a part of the case 1 is cut out to facilitate understanding of the invention.

  By configuring the case 1 as described above, a gap G is formed between the second upper surface portion 1b and the control board 30 as shown in FIG. 3 with the control board 30 fixed to the upper side of the case 1. Is formed. By forming this gap G, it is easy to inspect the appearance of the joint between the connection member 50 and the control board 30 as described later. In this example, the case 1 is formed of an insulating material (for example, resin).

  The base plate 2 is a plate-like member that serves as a base for placing the semiconductor substrate 10, and is fixed to the lower portion of the case 1. The base plate 2 is formed of a material having thermal conductivity (for example, a metal material such as copper or aluminum, or a resin material), and heat radiating fins 4 are formed on the lower surface. The base plate 2 is fixed to the lower surface portion of the case 1 with fastening bolts, adhesive members, or the like. Note that the base plate 2 may be formed integrally with the case 1.

  The control board 30 includes a control circuit for controlling the switching element 20, and is arranged away from the semiconductor substrate 10 in the height direction H. An insertion hole 95 is formed in the control board 30, and a fastening bolt 96 (see FIG. 2) inserted into the insertion hole 95 from above is formed in the upper surface portion (first upper surface portion 1 a) of the case 1. By being fixed to 94, the control board 30 is fastened and fixed to the case 1 in the vertical direction.

  In this example, the outer edges of the case 1, the base plate 2, and the control board 30 in a plan view (hereinafter simply referred to as “plan view”) along the height direction H are rectangular with the same size. It is formed as follows. The base plate 2, the case 1, and the control board 30 are arranged so as to be stacked in parallel with each other along the height direction H in the order described, and the case 1, the base board 2, and the control board 30 are stacked. As shown in FIGS. 1 and 3, the semiconductor substrate 10 is accommodated in a rectangular parallelepiped space surrounded by. In this example, a plurality of (for example, six or twelve) semiconductor substrates 10 are arranged in the rectangular parallelepiped space.

  The upper surface of the semiconductor substrate 10 is an element arrangement surface 11 for arranging the switching element 20. In this example, the semiconductor substrate 10 is formed of a conductive material (for example, a metal material such as copper or aluminum), and is disposed on the upper surface of the base plate 2 via an insulating member 3 formed of resin or the like. ing. As shown in FIG. 3, the semiconductor substrate 10 is arranged in parallel to the insulating member 3, and in this example, the base plate 2, the control board 30, and the semiconductor substrate 10 are arranged in parallel to each other. Is done. In the present embodiment, the switching element 20 corresponds to a “semiconductor element” in the present invention. As the switching element 20, for example, an IGBT or a MOSFET can be used.

  In the present embodiment, the switching element 20 is arranged on the element arrangement surface 11 provided in the semiconductor substrate 10, and the diode element 21 is arranged adjacent to the switching element 20. Although not shown, connection terminals are arranged on the upper surface of the switching element 20 and the diode element 21 and on the upper surface of the semiconductor substrate 10, and the connection terminal is connected to a DC power source or a rotating electrical machine (both not shown). The bus bars constituting the current path between them are connected. Then, the switching element 20 is turned on / off (switching operation) in accordance with the switching signal generated in the control board 30 (in this example, the gate drive signal), whereby the DC voltage from the DC power source is converted into an AC voltage and rotated. Supplied to the electric machine. That is, in this example, an inverter circuit for controlling the rotating electrical machine is formed by the switching element 20 and the diode element 21, and the semiconductor device 100 is an inverter device for driving and controlling the rotating electrical machine.

  As shown in FIG. 1, the switching element 20 includes five electrodes 20 a (for example, gate electrodes), and electrically connects the electrode 20 a provided on the switching element 20 and the control substrate 30. Thus, the connection member 50 is arranged. As shown in FIGS. 1 and 3, the connection member 50 extends from a base 51 fixed to the semiconductor substrate 10 side in an extending direction E inclined with respect to the height direction H, and has a height in the notch 40. They are arranged so as to penetrate in the direction H. The configuration of the notch 40 will be described in detail later in the section “2. Configuration of the notch”. The connection member 50 is formed of a conductive material (for example, a metal material such as copper or aluminum). In addition, the connecting member 50 has a cross-sectional shape that is orthogonal to the extending direction (same as the energizing direction) and is formed uniformly along the extending direction. In this example, the connecting member 50 has a rectangular cross-sectional shape. It is said that.

  In the present embodiment, as shown in FIG. 3, the connection member 50 is partly housed in the case 1 and extends in a direction perpendicular to the height direction H, and the height from the end of the first portion. Two parts that extend in a direction intersecting with the direction H and partially extend in the extending direction are connected to a second part accommodated in the case 1. And the said 1st part of the connection member 50 comprises the base 51, and the said 2nd part comprises the main-body part. Further, the end portion of the connection member 50 opposite to the first portion (base portion 51) of the second portion (main body portion) constitutes the distal end portion 52 of the connection member 50. In the present embodiment, “the extending direction of the second part (main body part)” is E. The extending direction E is a direction that intersects the height direction H, and is inclined from the height direction H by a predetermined angle. The predetermined angle can be, for example, an angle selected from an angle of less than 5 degrees, an angle of less than 10 degrees, an angle of less than 15 degrees, and an angle of less than 20 degrees.

  As shown in FIGS. 1 and 3, the base 51 of the connection member 50 and the electrode 20 a provided on the switching element 20 are composed of a conductive wire (bonding wire) 91 and an electrode formed on the upper surface of the insulating member 3. It is electrically connected to the pad 90. Further, the portion of the connecting member 50 on the tip end portion 52 side is joined to the control board 30 by the solder 60 in a state of penetrating the notch 40 in the height direction H. In the present embodiment, the solder 60 corresponds to “a brazing material” in the present invention. In the present invention, various solders can be employed regardless of the type of metal (eg, tin) contained as the main component.

  Although not shown, in the present embodiment, the concave space formed by the case 1 and the base plate 2 is filled with an insulating resin for protecting elements, preventing short circuits, and the like. The insulating resin is a hard resin having electrical insulation properties such as an epoxy resin or a urethane resin, and is provided to a height that covers at least the switching element 20, the diode element 21, and the wire 91. Note that a configuration in which such an insulating resin is not provided is also possible.

2. Next, the configuration of the notch 40 formed in the control board 30 will be described. As shown in FIGS. 1 to 3, the cutout portion 40 is formed so as to penetrate the control board 30 in the height direction H and open to the outer edge portion 31 of the control board 30. That is, the notch 40 is formed by notching the control substrate 30 inward from the outer edge 31 over the entire region in the thickness direction (height direction H). In this example, the cutout 40 has a cross-sectional shape (FIG. 5) orthogonal to the height direction H that is uniformly formed in the height direction H.

  As shown in FIG. 2, the notch 40 is formed so that the opening direction O is the same as the extending direction E of the connection member 50 as a target in plan view. Note that “O (E)” in FIG. 2 indicates that the direction in which the extending direction E is projected onto a plane orthogonal to the height direction H is equal to the opening direction O. Thereby, the connection member 50 fixed to the control board 30 with the solder 60 in a state of penetrating the notch 40 in the height direction H overlaps with the notch 40 in a plan view (notch) as shown in FIG. (Positioned within the portion 40).

  Specifically, at least a part (all in this example) of the connecting member 50 between the joint part with the control board 30 and the tip part 52 in the connection member 50 overlaps with the notch part 40 in a plan view (notch part). (Positioned within the portion 40). In the configuration in which only a part on the joint part side from the joint part to the tip part 52 is arranged so as to overlap the notch part 40 in a plan view, the part and the remaining part on the tip part 52 side. Is arranged so as to straddle the opening 42 in plan view.

  In this example, a plurality of connection members 50 are provided, and the same number of cutout portions 40 as the connection members 50 are formed in the control board 30 corresponding to each of the plurality of connection members 50. In FIG. 1, the cutout 40 is formed only on one side of the control board 30 formed in a rectangular shape, but the cutout 40 is also formed on the other side (for example, the side opposite to the one side). It can be set as the provided structure.

  As described above, by arranging the opening direction O of the notch 40 in the same direction as the extending direction E in plan view, the dimensions and mounting positions of the connection member 50 or the mounting position when the semiconductor device 100 is manufactured, or It becomes easy to absorb the error in the extending direction E, and the connecting member 50 can be inserted into the notch 40 relatively easily.

  Supplementally, when the control substrate 30 is brought close to the height direction H with respect to the connection member 50 when the semiconductor device 100 is manufactured, the connection member extends in the same direction as the opening direction O of the notch 40 in plan view. 50 are sequentially inserted into the notch 40 from the portion located on the opening direction O side. More precisely, the connecting member 50 is inserted into the notch 40 sequentially from the uppermost part (in this example, the tip 52) of the parts located in the notch 40 in plan view. .

  Further, when the semiconductor device 100 is manufactured, when the control substrate 30 is brought close to the direction intersecting the height direction H with respect to the connection member 50 (for example, a direction orthogonal or substantially orthogonal to the height direction H), the connection member is used. 50 is inserted into the notch 40 from the opening 42 side. Therefore, in any case, it is easy to absorb the dimension and mounting position of the connection member 50 or the error in the extending direction E, and the connection member 50 can be inserted into the notch 40 relatively easily. can do.

  Furthermore, in the present embodiment, as shown in FIG. 5, the cutout portion 40 has a direction orthogonal to the opening direction O as viewed in a plan view (in this example, the opening direction O and the height direction). The width W in the opening width direction orthogonal to both H is formed to be wide. Thereby, it becomes easy to absorb the error of the dimension and the mounting position of the connecting member 50 in the opening width direction or the error of the extending direction E when the semiconductor device 100 is manufactured, and the connecting member 50 is further inserted into the notch 40. It can be easily inserted.

  To supplementally describe, when the connection member 50 is inserted into the notch 40 by bringing the control board 30 close to the height direction H with respect to the connection member 50, and in the height direction with respect to the connection member 50. In both cases where the connection member 50 is inserted into the notch 40 by approaching the direction intersecting H, the connection member 50 moves in the notch 40 from the opening 42 side toward the bottom 41 side. Here, the “bottom 41” of the cutout 40 is a boundary edge with the control substrate 30 on the opposite side of the opening direction O of the cutout 40 as shown in FIG. In this example, as shown in FIG. 5, the bottom 41 of the notch 40 is a portion formed in an arc shape in plan view, and is configured by a curved wall portion of the control board 30.

  Therefore, as described above, by making the width W in the opening width direction of the cutout portion 40 wider toward the opening direction O, the width W of the portion where the connection member 50 first enters in the cutout portion 40 is wide. Thus, the connecting member 50 can be easily introduced into the notch 40. When a part of the connection member 50 enters the notch 40, the inner surface of the notch 40 (the outer surface of the control board 30 that defines the notch 40) is then used as a guide so that the connection member 50 is not cut. Since it can be moved to a predetermined position within 40 (the bottom 41 in this example), it is easy to absorb the error in the opening width direction.

  In the present embodiment, as shown in FIGS. 3 and 5, the connection member 50 is joined to the control board 30 in a state of being in contact with the bottom 41 of the notch 40. In FIG. 5, the solder 60 is omitted. Furthermore, the connecting member 50 is in contact with the bottom 41 in a state where it is elastically deformed by being pressed in the opening direction O by the bottom 41 of the notch 40 (see FIG. 6). Thereby, at the time of joining operation of the connection member 50 and the control board 30 when the semiconductor device 100 is manufactured, the connection member 50 and the control board 30 come into contact with each other by using a restoring force due to elastic deformation. The state can be easily maintained. As a result, it is possible to easily perform the joining operation of the connecting member 50 and the control substrate 30 with the solder 60 and to improve the reliability of the joining.

  Regarding the reliability of bonding, it is possible to further improve the reliability of bonding from the following points. That is, the joint portion of the connecting member 50 and the control board 30 by the solder 60 is not a hole (through hole or the like) partitioned by the control board 30 on the entire periphery, but a notch that opens to the outer edge 31 of the control board 30. 40. As a result, when the appearance inspection of the joint portion is performed from the opening 42 side of the notch 40, the solder 60 in the notch 40 is added to the fillet formed on the upper portion of the control board 30 as shown in FIG. 4. Can be observed. Further, in the present embodiment, as described above, the gap G is formed between the second upper surface portion 1b of the case 1 and the control board 30 (see FIG. 3), and further below the control board 30. The fillets that are formed can also be observed. Thereby, it becomes easy to find defects in the joint portion such as non-wetting of the solder 60, and it is possible to improve the long-term reliability of the joint portion between the connection member 50 and the control substrate 30.

  In addition, such a notch part 40 can be formed by a punching process or a router process. For example, after forming a through hole in the control substrate 30, the through hole is plated, and then, by punching out a portion (end portion) of the control substrate 30 adjacent to the outer edge portion 31 side with respect to the through hole, A notch 40 opening in the outer edge 31 of the control board 30 can be formed.

  In this example, a dedicated space (dead space) for transport by the transport device at the time of manufacturing the semiconductor device 100 is provided in the control substrate 30, and the notch 40 is formed in this space. By forming the notch 40 using such a space, it is possible to provide the notch 40 without increasing the area of the control board 30.

  By the way, as shown in FIG. 5, the opening direction O of the notch 40 is a direction from the bottom 41 to the opening 42. The opening 42 is formed by an opening surface having a predetermined area, and the bottom 41 is formed by the outer surface of the control board 30 having a predetermined area. Therefore, the opening direction O is not uniquely determined with respect to the cutout portion 40 and is an arbitrary direction included in a predetermined range. That is, all the directions from any one point on the bottom 41 to any one point on the opening surface are the opening direction O. Therefore, the arrangement in which the opening direction O of the notch 40 and the extending direction E of the connection member 50 are the same in a plan view is a degree of freedom corresponding to the uncertainty of the opening direction O (degree of freedom of setting). Have

  That is, when the distal end portion 52 of the connection member 50 is located in the notch portion 40 in plan view (see FIG. 2), the shape in which the distal end portion 52 is further extended to the outside of the notch portion 40 along the extending direction E. Assuming that the shape extends in the plan view through only the opening 42 of the notch 40 and extends to the outside of the notch 40, the opening direction O of the notch 40 and the extending direction of the connecting member 50 E can be said to be the same direction in plan view. Further, when the distal end portion 52 of the connection member 50 is located outside the notch portion 40 in plan view (not shown), a portion from the joint portion with the control board 30 to the distal end portion 52 in the connection member 50 is If it is arranged so as to straddle only the opening 42 of the notch 40 in plan view, the opening direction O of the notch 40 and the extending direction E of the connecting member 50 can be said to be the same direction in plan view.

  As shown in FIG. 5, when the overall shape of the notch 40 is a shape that is notched in the direction orthogonal to the outer edge 31 from the outer edge 31 of the control board 30, the opening It is preferable to design the direction orthogonal to the opening surface constituting 42 as the opening direction O. Further, when the overall shape of the notch 40 is a shape that is cut from the outer edge 31 of the control board 30 in a direction that intersects with the direction orthogonal to the outer edge 31, from the center point at the bottom 41. It is preferable to design the direction toward the center point on the opening surface as the opening direction O. With such a configuration, it is possible to absorb errors in the dimensions and attachment positions of the connection member 50 to the same extent on both sides in the opening width direction orthogonal to both the opening direction O and the height direction H.

  In addition, the said center point in an opening surface can be made into the gravity center in an opening surface, when an opening surface is a plane. Moreover, the said center point in an opening surface can be made into the point in which a normal line direction corresponds with the average value of the normal line direction of each part of an opening surface, when an opening surface is a curved surface. On the other hand, the said center point in the bottom part 41 can be made into the gravity center in the said plane, when the bottom part 41 is comprised by the plane. Further, the center point in the bottom portion 41 can be a point where the normal direction coincides with the average value of the normal direction of each portion of the curved surface when the bottom portion 41 is configured by a curved surface, or It can also be set as the point most spaced apart from the outer edge part 31 in the direction orthogonal to the outer edge part 31.

3. Method for Manufacturing Semiconductor Device Next, a method for manufacturing the semiconductor device 100 according to the present embodiment will be described. As described below, the method for manufacturing the semiconductor device 100 according to the present embodiment includes a positioning step, a connecting member insertion step, and a joining step. And these positioning process, connecting member insertion process, and joining process are performed in the order of description, but in the state before execution of a positioning process, each component is assembled | attached to the state except the control board 30 from FIG. Suppose that That is, the case 1 in which the connection member 50 is fixed to the upper surface of the base plate 2 and the semiconductor substrate 10 are disposed via the insulating member 3, and the connection member 50 and the switching element 20 are electrically connected to each other. It is assumed that the connection work of the wire 91 for connecting to is completed. Furthermore, in this example, it is assumed that the concave space formed by the case 1 and the base plate 2 is filled with an insulating resin to a height that covers at least the switching element 20, the diode element 21, and the wire 91.

  The positioning step is a step of positioning the control board 30 with respect to the member to which the connection member 50 is attached (in this example, the case 1 integrated with the base plate 2). In other words, the positioning step is a step of positioning the control board 30 with respect to the switching element 20 (semiconductor substrate 10) to be connected to the connection member 50. In the present embodiment, in the positioning step, the control board 30 is disposed above the connection member 50, and the opening direction O of the notch 40 formed in the control board 30 is the same as the extending direction E of the connection member 50. Further, the control board 30 is arranged so that the insertion hole 95 formed in the control board 30 and the fastening hole 94 formed in the case 1 overlap in plan view. Note that the position and orientation of the connecting member 50 is such that at least a part on the tip 52 side overlaps with the notch 40 in plan view when the control board 30 is arranged as described above (located in the notch 40). ) Designed to be In a configuration in which only a part on the tip end 52 side is arranged so as to overlap the notch 40 in a plan view, a boundary part between the part and the remaining part on the tip end 52 side is a plan view. It is designed to straddle the opening 42.

  The connecting member inserting step is a step performed after the positioning step is performed, and is a step of bringing the control board 30 close to the connecting member 50 and inserting the connecting member 50 into the notch 40. In this example, in the connection member insertion step, as shown in FIG. 6A, the control board 30 is moved so as to approach the height direction H with respect to the connection member 50, and as shown in FIG. In this step, the lower surface of the control board 30 is brought into contact with the upper surface of the case 1 (first upper surface portion 1a, see FIG. 1). Thereby, the connecting member 50 is inserted into the cutout portion 40 from below. Specifically, in this example, as the control substrate 30 moves in the height direction H toward the connection member 50 side (semiconductor substrate 10 side), the tip end portion 52 of the connection member 50 is first inserted into the notch 40. Thereafter, the portion of the connecting member 50 located on the base 51 side is sequentially inserted at a position shifted to the bottom 41 side in the notch 40.

  In the present embodiment, as shown in FIG. 6, the connecting member 50 is inclined from the height direction H in the extending direction E of the connecting member 50 after the execution of the connecting member insertion step (FIG. 6B). The corner is set to be larger than before the connection member insertion step (FIG. 6A). That is, the connection member 50 is configured to be elastically deformed by being pressed in the opening direction O by the bottom 41 of the notch 40 by performing the connection member insertion step. Thereby, as mentioned above, it is possible to improve the workability of the joining process described below and the reliability of the joining.

  A joining process is a process performed after performing the said connection member insertion process, and is a process of joining the part which penetrates the notch part 40 in the connection member 50 to the height direction H, and the control board 30 with the solder 60. FIG. In a joining process, it can be set as the structure which joins by flow soldering or iron soldering by a robot, for example.

4). Other Embodiments Finally, other embodiments according to the present invention will be described. Note that the features disclosed in each of the following embodiments can be used only in that embodiment, and can be applied to other embodiments as long as no contradiction arises.

(1) In the above-described embodiment, a configuration in which the cutout portion 40 is formed so that the width W in the direction orthogonal to the opening direction O increases in the plan view in the direction orthogonal to the opening direction O will be described as an example. did. However, the embodiment of the present invention is not limited to this, and forming the width W of the notch 40 constant irrespective of the position in the opening direction O is one of the preferred embodiments of the present invention. It is. It is also possible to form the notch 40 so that the width W becomes narrower as it goes in the opening direction O.

(2) In the above embodiment, the connection member 50 has been described as an example in which the connection member 50 is pressed in the opening direction O by the bottom 41 of the notch 40 and is elastically deformed and is in contact with the bottom 41. However, the embodiment of the present invention is not limited to this, and the connection member 50 may be in contact with the bottom 41 without being pressed by the bottom 41 of the notch 40.

(3) In the above-described embodiment, the configuration in which the connection member 50 is joined to the control board 30 in a state of being in contact with the bottom 41 of the notch 40 has been described as an example. However, the embodiment of the present invention is not limited to this, and the connection member 50 is in contact with the control board 30 at the intermediate position between the opening 42 and the bottom 41 in the notch 40 or the contact member 50. It can also be set as the structure joined to the control board 30 with the solder 60 in the state which is not contacting.

(4) In the above embodiment, the connecting member insertion step moves the control board 30 so as to approach the height direction H with respect to the connecting member 50, and inserts the connecting member 50 into the notch 40 from below. The case where it is the process to perform was demonstrated as an example. However, the embodiment of the present invention is not limited to this, and the connecting member insertion step is performed in a direction (for example, orthogonal to the height direction H) that intersects the control board 30 with respect to the connection member 50 in the height direction H. Alternatively, the connection member 50 may be moved from the opening 42 side to the notch 40 by moving it so as to approach the substantially orthogonal direction.

(5) In the above embodiment, the connection member 50 has a configuration in which the cross-sectional shape is rectangular. However, the connection member 50 has a cross-sectional shape other than the rectangular shape (for example, a circular shape or a polygonal shape). A member can also be used.

(6) In the above embodiment, the case where the brazing material in the present invention is solder has been described as an example. However, the embodiment of the present invention is not limited to this, as long as it has a lower melting point than the material that divides the connection member 50 and the notch 40 (the portion surrounding the notch 40 of the control board 30). Instead of solder, various brazing materials (for example, those containing gold, silver, copper, etc., regardless of whether they are hard or soft) can be employed. Furthermore, the brazing material is not limited to a material made of an alloy, and any conductive material that can be liquefied by heating and solidified by cooling (including natural cooling) to join the connection terminal and the surface to be joined is dredged. Can be adopted.

(7) In the above embodiment, the case where the semiconductor device 100 is an inverter device has been described as an example. However, embodiments of the present invention are not limited to this, and the present invention can be applied to any semiconductor device including a semiconductor substrate on which semiconductor elements are arranged and a control substrate that controls the semiconductor elements.

(8) Regarding other configurations as well, the embodiments disclosed herein are illustrative in all respects, and the embodiments of the present invention are not limited thereto. That is, as long as the configuration described in the claims of the present application and a configuration equivalent thereto are provided, a configuration obtained by appropriately modifying a part of the configuration not described in the claims is naturally also included in the present invention. Belongs to the technical scope.

  The present invention includes a semiconductor substrate in which a semiconductor element is arranged on an element arrangement surface, and a control board that controls the semiconductor element and is arranged apart from the semiconductor substrate in a height direction orthogonal to the element arrangement surface. It can be suitably used for a semiconductor device.

10: Semiconductor substrate 11: Element arrangement surface 20: Switching element (semiconductor element)
30: Control board 31: Outer edge part 40: Notch part 41: Bottom part 50: Connection member 51: Base part 60: Solder (saddle material)
100: Semiconductor device H: Height direction E: Extension direction O: Opening direction W: Width

Claims (4)

A semiconductor comprising: a semiconductor substrate on which a semiconductor element is arranged on an element arrangement surface; and a control board that controls the semiconductor element and is arranged apart from the semiconductor substrate in a height direction orthogonal to the element arrangement surface. A device,
A connection member for electrically connecting the semiconductor element and the control board;
The control board is formed with a notch that penetrates the control board in the height direction and opens at the outer edge of the control board.
The connection member extends from a base portion fixed to the semiconductor substrate side in an extending direction inclined with respect to the height direction, and passes through the notch portion in the height direction so as to pass through the height direction with the control substrate. Are joined to
A semiconductor device in which an opening direction of the notch is the same as the extending direction in a plan view along the height direction.   2. The semiconductor device according to claim 1, wherein the connection member is bonded to the control board in a state of being in contact with a bottom portion that is a boundary edge with the control board on a side opposite to the opening direction of the notch. .   The semiconductor device according to claim 2, wherein the connection member is in contact with the bottom in a state of being elastically deformed by being pressed in the opening direction by the bottom of the notch.   4. The semiconductor device according to claim 1, wherein the cutout portion is formed so that a width in a direction orthogonal to the opening direction becomes wider toward the opening direction in the plan view. 5. .

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