JP2012125968A - Liquid ejecting head and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid ejecting head that can prevent damage to a substrate caused because static electricity reaches the substrate.SOLUTION: The liquid ejecting head includes: the substrate 1 having an ejection energy generating element 3 that generates energy for ejecting a liquid; a flow path forming member that configures an ejection port 10 that ejects the liquid and a liquid path 11 that communicates with the ejection port 11. The liquid ejecting head also includes a conductive film 12 disposed in the flow path forming member and a resister that is electrically connected with the conductive film.

Description

  The present invention relates to a liquid discharge head that discharges a liquid such as ink to perform recording on a recording medium, and a manufacturing method thereof.

  As a liquid discharge head that discharges liquid, an ink jet recording head that discharges ink is known. As an inkjet recording head, for example, as disclosed in Patent Document 1, a structure including a substrate, a highly insulating nozzle structure stacked on the substrate, and an ejection port that is a through hole for ejecting ink. Is disclosed.

JP-A-6-286149

  In the ink jet recording head described in Patent Document 1, when ink is not filled in the discharge port, static electricity may enter the discharge port and reach the substrate below the discharge port, which may damage the substrate. there were.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid discharge head that can prevent damage to the substrate caused by static electricity reaching the substrate.

The present invention
A liquid discharge head comprising: a substrate having a discharge energy generating element that generates energy for discharging a liquid; a discharge port that discharges the liquid; and a flow path forming member that forms a liquid flow path communicating with the discharge port Because
A conductive film disposed on the flow path forming member;
A resistor electrically connected to the conductive film;
A liquid discharge head.

The present invention also provides:
A substrate having a discharge energy generating element that generates energy for discharging a liquid, a discharge port that discharges the liquid, and a flow path forming member that configures a liquid flow path communicating with the discharge port,
The flow path forming member is a method of manufacturing a liquid discharge head including a flow path wall member that forms a side wall of the liquid flow path, and a discharge port member that forms an upper wall of the discharge port and the liquid flow path. There,
(1) preparing the substrate having a resistance element and the ejection energy generating element;
(2) forming a mold material serving as a mold of the liquid channel and the channel wall member on the substrate;
(3) forming a conductive film electrically connected to the resistance element on the mold member and the flow path wall member;
(4) forming the discharge port member on the conductive film;
(5) removing the mold material;
A method for manufacturing a liquid discharge head, comprising:

  In the liquid discharge head according to the present invention, the static electricity that has entered from the discharge port is absorbed by the metal film and consumed by the resistor before reaching the substrate. Therefore, with the configuration of the present invention, it is possible to suppress damage to the substrate due to static electricity, and it is possible to provide a liquid discharge head that is highly reliable against static electricity.

FIG. 2 is a schematic perspective view, top view, and cross-sectional view of a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment. It is a cross-sectional process drawing for explaining an example of a method for manufacturing a liquid ejection head according to the present embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an ink jet recording head will be described as an example of the liquid discharge head. The scope of application of the present invention is not limited to an ink jet recording head, but can also be applied to a liquid ejection head for biochip manufacturing or electronic circuit printing. As the liquid discharge head, in addition to the ink jet recording head, for example, a head for producing a color filter can be cited.

(Embodiment 1)
With reference to FIG. 1, the ink jet recording head of this embodiment will be described. FIG. 1A is a perspective view of the ink jet recording head of the present embodiment, FIG. 1B is a top view, and FIG. 1C is a cross-sectional view taken along line XX ′ in FIG. Note that in this specification, the side on which a discharge port for discharging a liquid such as ink is formed is an upward direction.

  The ink jet recording head of the present embodiment has an ejection energy generating element 3 for generating energy for ejecting ink, and a resistance element 4 as a resistor for converting static electricity into heat energy for consumption. A substrate 1 is provided. In addition, the ink jet recording head includes a flow path forming member that forms an ink flow path 11 as a liquid flow path on the surface side (front side) of the substrate 1 on which the ejection energy generating element 3 and the resistance element 4 are formed. .

  The ink flow path 11 communicates with an ink supply port (not shown) provided on the substrate 1 and serves as a flow path for sending the supplied ink to the ink discharge port 10. The ink flow path 11 includes a foaming chamber that transmits energy generated by the ejection energy generating element 3 to the ink. The bubbling chamber is located below the ink discharge port 10.

  A metal film 12 as a conductive film is disposed on the flow path forming member, and the metal film 12 is electrically connected to the resistance element 4 provided on the substrate 1.

  In FIG. 1, the flow path forming member has a flow path wall member 8 made of a first organic resin layer and a discharge port member 9 made of a second organic resin layer, and the flow path wall member 8 and the discharge port member. A metal film 12 is arranged between The discharge port member 9 constitutes the face surface of the flow path forming member and the upper wall of the ink flow path 11. The flow path wall member 8 is disposed between the discharge port member 9 and the substrate 1 and constitutes a side wall of the ink flow path 11. The metal film 12 is disposed between the discharge port member 9 and the flow path wall member 8. The metal film 12 is formed so as to be exposed to the ink flow path 11, and is disposed around the ink discharge port 10. More specifically, at least a part of the metal film forms an opening on the liquid flow path side of the ink discharge port 10.

  The metal film 12 extends from the periphery of the ink discharge port 10 to the outer wall of the flow path forming member 2, and is electrically connected to the resistance element 4 provided in a region on the substrate other than the region where the flow path forming member 2 is formed. Connected. In FIG. 1, the metal film 12 and the resistance element 4 are electrically connected via the metal wiring 13 provided on the side wall of the flow path forming member 2.

  As described above, the ink jet recording head of this embodiment has the metal film 12 on the flow path forming member 2. The metal film 2 plays a role of drawing in static electricity. For example, when static electricity enters from the discharge port, the metal film 2 draws the static electricity and consumes it by the resistance element 4 as a resistor, thereby preventing static electricity from reaching the substrate below the discharge port.

  The metal film 12 is preferably disposed around the discharge port 10 as described above for the purpose of more effectively drawing static electricity generated in the vicinity of the discharge port, and is disposed so as to be in contact with the outer edge of the discharge port 10. More preferably. In particular, as shown in FIG. 1B, the metal film 12 is preferably disposed in contact with the outer edge of the opening so as to surround the discharge port. It can also be understood that at least a part of the metal film 12 forms an opening on the ink flow path side of the ink discharge port 10. In such a configuration, for example, a metal film is provided on the part of the discharge port member that forms the ink discharge port 10, and the hole diameter of the metal film 12 is formed with the same size as the hole diameter of the second organic resin layer 9. Can be formed.

  The discharge port member 9 may be formed of a plurality of layers, and in this case, the metal film may be interposed between these layers. Similarly, the flow path wall member 8 may be formed of a plurality of layers, and in this case, the metal film may be interposed between these layers.

  The resistor is preferably a resistance element formed on a substrate. Further, the resistance element can be formed in the same configuration as the ejection energy generating element, and can be configured by a laminated structure including a wiring material and a heater material. In addition, since the resistance element is formed in the same process as the ejection energy generation element, it is preferable that the resistance element is formed using the same material as that used for the ejection energy generation element.

  A metal wiring 13 is provided on the side wall of the flow path wall member 8, and the metal film 12 is electrically connected to the resistance element 4 through the metal wiring 13. The metal wiring 13 is connected to a part of the wiring material constituting the resistance element 4. The metal film 12 is formed so as to extend from the periphery of the discharge port 10 to the metal wiring 13 provided on the side wall of the discharge port member 9 through between the flow path wall member 8 and the discharge port member 9.

  As described above, the metal film 12 is preferably provided between the flow path wall member 8 and the discharge port member 9 so as to be exposed on the upper wall of the ink flow path 11. The metal film can also be disposed on the face surface of the flow path forming member. In this case, the metal film can be extended to the end of the face surface and can be electrically connected to the resistor through the metal wiring provided on the side wall of the flow path forming member.

  The conductive film is not particularly limited as long as it is a conductive film, but it is preferable to use a metal film made of metal as described above. The metal film 12 is preferably a single metal film having low electrical resistance, but may be an alloy film. The material of the metal film 12 is not particularly limited, and examples thereof include gold, silver, copper, aluminum, tungsten, nickel, iridium, or an alloy composed of at least two of these metals. It is done. Moreover, depending on the case, you may be comprised by the laminated film which consists of a some layer. Examples of constituent materials of the metal film 12 are shown below. Gold (2.05 μΩcm, 0 ° C.), silver (1.47 μΩcm, 0 ° C.), copper (1.55 μΩcm, 0 ° C.), aluminum (2.50 μΩcm, 0 ° C.), tungsten (4.9 μΩcm, 0 ° C.), Nickel (6.2 μΩcm, 0 ° C.), iridium (4.7 μΩcm, 0 ° C.), etc.

  The material of the metal wiring 13 is the same as the material of the metal film 12. Moreover, it is more preferable that the metal wiring includes at least one of gold, silver, and nickel. Further, it may be composed of a plurality of layers. In addition, it is desirable to make the electrical resistance relatively lower than that of the metal film 12. As a result, static electricity drawn by the metal film 12 flows efficiently and efficiently into the metal wiring 13.

In addition, it is desirable to select the material and dimensions of the resistance element 4 in consideration of consumption of static electricity as heat. As the resistance element 4, for example, material: tantalum silicon nitride, sheet resistance: 350Ω / □, cross-sectional area: 3 × 10 ⁻⁷ (thickness: 0.00003 mm, width: 0.01 mm), length: 0.1 mm be able to. Note that the material, sheet resistance, cross-sectional area, length, and the like of the resistance element 4 may be arbitrarily changed. Further, at least one resistance element 4 may be provided on the substrate, and two or more resistance elements 4 may be provided on the substrate. Static electricity is drawn in by the metal film 12, travels through the metal wiring 13, and is transmitted to the resistance element 4 through the wiring 22 a ′ in the heater board substrate 1. In the resistance element 4, static electricity is converted into heat and consumed. Thereby, damage to the substrate that can occur due to static electricity reaching the substrate can be suppressed, and a highly reliable inkjet recording head can be provided.

Example 1
2 to 5 show an example of the method of manufacturing the ink jet recording head according to the present embodiment. 2 to 5 are schematic process diagrams for explaining the process in the cross-sectional view corresponding to FIG.

  First, as shown in FIG. 2A, a substrate 1 containing a wiring circuit (not shown) pattern in a silicon crystal was prepared.

  Next, as shown in FIG. 2B, a first insulating layer 5 made of a silicon oxide film was formed to a thickness of 0.0012 mm by chemical vapor deposition.

  Next, a first resist 19 made of a positive organic resin was applied on the first insulating layer 5 by spin coating. Thereafter, as shown in FIG. 2C, exposure and development were performed to partially remove the first resist 19 in the exposed portion.

  Next, the first insulating layer 5 was selectively removed by a dry etching method using the first resist 19 as a mask. Thereafter, the first resist 19 was removed to form a laminated structure shown in FIG. The first insulating layer 5 has an opening exposing the substrate 1 at the bottom.

  Next, as shown in FIG. 2E, a heater material 20 was formed on the first insulating layer 5 and the substrate 1. In this example, the heater material 20 made of tantalum silicon nitride was formed by reactive sputtering using a tantalum-silicon alloy target. In the present embodiment, the heater material 20 includes a discharge energy generating element for generating energy for ink discharge in a later process, and a resistance element for converting static electricity drawn by the metal film into heat energy. Will play the role of configuring. Therefore, in order to satisfy both functions, the heater material has a sheet resistance of 350Ω / □ and a film thickness of 0.00003 mm.

  Next, as shown in FIG. 2 (f), a wiring material 22 was formed on the heater material 20. The main material of the wiring member 22 was aluminum, and the thickness of the wiring member 22 was 0.0004 mm.

  Next, the 2nd resist 21 which consists of positive type organic resin was apply | coated on the wiring material 22 with the spin coat method. Thereafter, as shown in FIG. 2G, exposure and development were performed to partially remove the second resist 21 in the exposed portion.

  Next, using the second resist 21 as a mask, the wiring material 22 and the heater material 20 were removed by a dry etching method. Thereafter, the second resist 21 was removed to form a laminated structure shown in FIG. In FIG. 3H, the heater material 20a and the wiring material 22a are materials constituting the resistance element, and the heater material 20b and the wiring material 22b are materials constituting the ejection energy generating element.

  Next, the 3rd resist 23 which consists of positive type organic resin was apply | coated to the outermost surface. Thereafter, as shown in FIG. 3I, exposure / development was performed to partially remove the third resist 23 in the exposed portion.

  Next, the wiring material 22 was selectively removed by wet etching using the third resist 23 as a mask. Thereafter, the third resist 23 was removed to form a laminated structure shown in FIG. Through this process, the ejection energy generating element 3 for generating energy for ejecting ink and the resistance element 4 as a resistor that consumes the static electricity drawn from the metal film by converting it into thermal energy are completed.

Here, the material and dimensions of the resistance element 4 are selected so as to satisfy the function of consuming static electricity. In the present embodiment, the resistance element 4 has a heater material: tantalum silicon nitride, a sheet resistance: 350 Ω / □, a cross-sectional area: 3 × 10 ⁻⁷ mm ² (thickness: 0.00003 mm, width: 0.01 mm), length : 0.1 mm. The material, sheet resistance, cross-sectional area, length, and the like of the resistance element 4 can be arbitrarily selected.

  In FIG. 3 (j), the wiring member 22 a ′ plays a part in the role of electrically connecting the metal film 12 and the resistance element 4. Further, the wiring member 22 a ″ plays a role of electrically connecting the resistance element 4 and the substrate grounding portion 16. In this embodiment, the wiring material is connected to the heater material in contact with the substrate to be grounded.

  Next, as shown in FIG. 3 (k), a second insulating layer 6 made of silicon nitride was formed on the outermost surface. The second insulating layer 6 was formed to a thickness of 0.0003 mm using chemical vapor deposition.

  Next, a fourth resist 24 made of a positive organic resin was applied on the second insulating layer 6. Thereafter, as shown in FIG. 3L, exposure / development was performed to partially remove the fourth resist 24 in the exposed portion.

  Next, as shown in FIG. 3M, the second insulating layer 6 was partially selectively removed by dry etching using the fourth resist 24 as a mask. Thereafter, the fourth resist 24 was removed. The wiring member 20a 'is exposed at the bottom of the opening formed by partially removing the second insulating layer 6.

  Through the above steps, the substrate 1 having the ejection energy generating element 3, the resistance element 4, and the substrate grounding portion 16 was completed as shown in FIG. Hereinafter, the substrate having the configuration shown in FIG. 3M is also referred to as a heater board substrate.

  Next, as shown in FIG. 4N, a seed layer 25 was formed by a sputtering method as a preparation for forming the metal wiring 13 by an electrolytic plating method in a later step. The seed layer 25 is composed of two layers. As materials thereof, titanium tungsten, which is a refractory metal, is used for the lower layer, and gold is used for the upper layer. By adopting such a configuration, it is possible to prevent the upper layer Au atoms from diffusing to the underlying substrate side.

  Next, after a fifth resist 26 made of a positive organic resin is applied on the seed layer 25, as shown in FIG. 4 (o), the fifth resist 26 in the exposed portion is partially exposed by exposure and development. Removed.

  Next, as shown in FIG. 4 (p), the metal wiring 13 was formed using an electrolytic plating method. As the metal wiring 13, gold is used as a material because of its low electrical resistance and excellent corrosion resistance. In this embodiment, gold is used, but a material having a low electrical resistance such as silver, copper, or nickel may be used. Further, the metal wiring may be composed of a single film made of a single material, or may be composed of an alloy film made of a plurality of materials. Moreover, depending on the case, you may be comprised by the laminated film which consists of a some layer.

  Next, as shown in FIG. 4 (q), the fifth resist 26 was removed.

  Next, the seed layer 25 was removed by wet etching, and the metal wiring 13 was completed as shown in FIG. Here, an etching solution containing iodine and potassium iodide was used to remove gold constituting the upper layer of the seed layer. Further, hydrogen peroxide water was used for removing titanium tungsten constituting the lower layer of the seed layer.

  Next, as shown in FIG. 5S, an adhesion improving layer 7 and a mold material 17 were formed on the outermost surface of the heater board substrate. The adhesion improving layer 7 was disposed in a region where the flow path wall member 8 was formed by applying an adhesion improving material on the outermost surface of the heater board substrate by spin coating and selectively removing the material by dry etching. The mold material 17 serving as a mold for the ink flow path was formed by applying a soluble positive photosensitive resin material by spin coating, exposing and developing. The thickness of the mold member 17 was 14 μm.

  As the material of the mold material 17, there is little compatibility with the organic resin material to be coated in the subsequent process, it can be easily removed in the subsequent process, and degassing occurs when the metal film is formed in the subsequent process. Polymethylisopropenyl ketone was used from the point of view of no material.

  Next, a negative photosensitive resin material was applied by a slit coat method, exposed and developed, thereby forming a flow path wall member 8 with a thickness of 15 μm as shown in FIG. In addition to being incompatible with the material of the mold material 17, the flow path wall member 8 is required to have resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy. . As a material of the flow path wall member 8, for example, an epoxy resin, a polyetheramide resin, a polyimide resin, a polycarbonate resin, or a polyester resin can be used. Examples of the epoxy resin include EHPE-3150 (trade name, manufactured by Daicel Chemical Industries). The metal wiring 13 obtained in this step is in contact with the side wall of the flow path forming member 8.

  Next, as shown in FIG. 5 (u), a metal film 12 was formed on the outermost surface with a thickness of 2 μm by sputtering. The metal film 12 is desirably a film having low electrical resistance and excellent corrosion resistance to ink. In this embodiment, gold (2.05 μΩcm, 0 ° C.) was used. In the present embodiment, the sputtering method is used as the method for forming the metal film 12, but physical vapor deposition by vacuum vapor deposition or ion plating may be used. The metal film 12 was disposed on the mold material 17, the flow path wall member 8, and the metal wiring 13 so as to extend from the region where the discharge port is formed on the mold material to the metal wiring 13.

  Next, a sixth resist 28 made of a positive organic resin was applied on the metal film 12. Thereafter, as shown in FIG. 5 (v), exposure and development were performed to selectively remove the sixth resist 28 in the exposed portion.

  Next, using the sixth resist 28 as a mask, the metal film 12 was selectively removed by wet etching to form the metal film 12 having the first opening. Thereafter, as shown in FIG. 5 (w), the sixth resist 28 was removed to form the metal film 12. The metal film 12 is disposed on the flow path wall member 8, the mold material 17, and the metal wiring 13. The metal film 12 is electrically connected to the resistance element 4 through the metal wiring 13 and the wiring material 20a '. Further, the metal film 12 has a first opening in a part on the mold member 17, and the first opening forms a part of the discharge port.

  Next, a negative photosensitive resin material was applied by a slit coat method, and was exposed and developed to form a discharge port member 9 constituting the discharge port 10 as shown in FIG. The discharge port 10 includes a first opening provided in the metal film 12 and a second opening provided in the discharge port member. As a negative photosensitive resin material, in addition to being incompatible with the material of the mold material 17, corrosion resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy are required. . In the present embodiment, the same material as the flow path wall member 8 was used.

  Next, the mold member 17 was removed to complete the ink jet recording head as shown in FIG.

  By the above manufacturing method, an ink jet recording head in which a part of the metal film 12 is exposed on the side surface of the discharge port 10 can be provided. In this ink jet recording head, static electricity that has entered from the ejection port 10 is drawn into the metal film 12 exposed on the side surface of the ejection port 10 (or constituting a part of the ejection port 10). The drawn static electricity travels from the metal film 12 to the metal wiring 13, passes through the wiring 22 a ′ in the heater board substrate 1, is converted into heat by the resistance element 4, and is consumed. Therefore, damage to the substrate that can occur when static electricity reaches the substrate can be suppressed, and a highly reliable ink jet recording head can be provided.

(Example 2)
FIG. 6 is a schematic process diagram for explaining the process of the latter half part of the present embodiment, and is a diagram showing processes after the process of forming the heater board substrate 1. The heater board substrate 1 was formed in the same manner as in Example 1.

  First, according to the procedure shown in Example 1, the heater board board | substrate 1 was produced in order of FIGS.

  Next, an adhesion improving material is applied to the outermost surface of the heater board substrate by a spin coat method, and is selectively removed by a dry etching method, whereby the flow path wall member 8 is formed as shown in FIG. The adhesion improving layer 7 was formed in the region to be formed. Further, a soluble positive photosensitive resin material was applied by spin coating, exposed and developed to form a mold material 17 having a thickness of 14 μm as shown in FIG. As the material of the mold material 17, there is little compatibility with the organic resin material to be coated in the subsequent process, it can be easily removed in the subsequent process, and degassing occurs when the metal film is formed in the subsequent process. From the viewpoint of no material, a thermoplastic resin was used.

  Next, a negative photosensitive resin material was applied by a slit coat method, exposed and developed, thereby forming a flow path wall member 8 with a thickness of 15 μm as shown in FIG. In addition to being incompatible with the material of the mold material 17, the material of the flow path wall member 8 is required to have resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy. The As the flow path wall member 8, for example, epoxy resin, polyether amide resin, polyimide resin, polycarbonate resin, polyester resin, or the like can be used.

  Here, the flow path wall member 8 in this embodiment serves as a conventional ink flow path wall, and at the same time serves as a member that determines the shape of the metal wiring 13 formed in a later step. It was. That is, an opening is provided in the flow path wall member 8 so that the wiring member 22a 'is exposed at the bottom, and the metal wiring 13 is disposed in the opening. In other words, the metal wiring 13 is arranged inside the flow path wall member.

  Subsequently, as shown in FIG. 6 (p), a metal wiring 13 was formed in the opening provided in the flow path wall member 8 by electroless plating. The electroless plating method is a technique for depositing a metal using electrons generated when a reducing agent contained in a plating solution is oxidized. By selecting the seed material and the plating solution for the base, metal formation is possible without providing a seed layer or a contact electrode as in the case of electrolytic plating. In this embodiment, aluminum of the wiring material 22a 'is used as a seed material for the base, and a nickel plating solution and a gold plating solution are selected as plating solutions. As a detailed formation method, first, the non-uniform natural oxide film covering the outermost surface of the wiring 14 was removed. Thereafter, a uniform oxide film was formed on the outermost surface of the wiring 14 by dipping in nitric acid. Next, zinc particles were formed on the wiring 14 by making use of an aluminum-zinc substitution reaction by bringing the wiring 14 into contact with a chemical solution containing zinc. Here, after removing zinc particles by immersing in nitric acid, uniform and fine zinc particles were formed by immersing them again in a chemical solution containing zinc. Subsequently, nickel plating was formed on the wiring 14 by dipping in a plating solution containing nickel ions. In this nickel plating formation, a nickel thin film is formed on the wiring by a zinc-nickel substitution reaction in the initial stage, and then a nickel thick film is formed on the nickel thin film triggered by an oxidation reaction of a reducing agent contained in the nickel plating solution. Is achieved. Nickel deposition was performed for 50 min at a nickel deposition rate of 0.3 μm / min to form nickel plating with a thickness of 15 μm. Next, by immersing in a displacement plating solution containing gold ions, a nickel thin film having a thickness of 0.03 to 0.05 μm covering nickel was formed using a nickel-gold displacement reaction.

  Next, after a metal film having a thickness of 2 μm is formed on the outermost surface by sputtering, a resist is applied, exposed, developed, and selectively removed by wet treatment, as shown in FIG. 6 (q). A metal film 12 was formed. Since this process flow is similar to the process flow of the metal film described in detail in Example 1, detailed description will be omitted. The metal film 12 was formed on the mold material 17, the flow path wall member 8, and the metal wiring 13 so as to extend from the region on the mold material 17 where the discharge port is formed to the metal wiring 13.

  The metal film 12 is desirably a film having a low electric resistance and excellent corrosion resistance to ink. In this embodiment, gold (2.05 μΩcm 0 ° C.) is used. In this embodiment, the sputtering method is used as a method for forming the metal film. However, physical vapor deposition such as vacuum deposition or ion plating may be used.

  Subsequently, a negative photosensitive resin material was applied by a slit coating method, exposed and developed to form an ejection port member 9 constituting the ink ejection port 10 as shown in FIG. In addition to being incompatible with the material of the mold material 17, the negative photosensitive resin material is required to have resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy. . In the present embodiment, the same material as that of the flow path wall member 8 is used. Subsequently, as shown in FIG. 6R, the mold member 17 was removed to complete the ink jet recording head.

  According to the manufacturing method of the present embodiment, since the flow path wall member 8 also serves as a mold for forming the metal wiring 13, the formation process of the metal wiring 13 can be simplified, and the inkjet recording head can be manufactured at low cost. Can be provided.

(Example 3)
FIG. 7 is a schematic process diagram for explaining the process of the latter half part of the present embodiment. The heater board substrate 1, which is a diagram showing processes after the process of forming the heater board substrate 1, is the same as in the first embodiment. It was made.

  First, according to the procedure shown in Example 1, the heater board board | substrate 1 was produced in order of FIGS.

  Next, an adhesion improving material was applied to the outermost surface of the heater board substrate by a spin coating method and selectively removed by a dry etching method, thereby forming an adhesion improving layer 7 as shown in FIG. . Subsequently, a soluble positive photosensitive resin material was applied by spin coating, exposed and developed to form a mold material 17 having a thickness of 14 μm as shown in FIG. As the material of the mold material 17, there is little compatibility with the organic resin material to be coated in the subsequent process, it can be easily removed in the subsequent process, and degassing occurs when the metal film is formed in the subsequent process. From the viewpoint of no material, a thermoplastic resin was used.

  Next, a negative photosensitive resin material was applied by a slit coat method, exposed and developed, thereby forming a flow path wall member 8 with a thickness of 15 μm as shown in FIG. In addition to being incompatible with the material of the mold member 17, the flow path wall member 8 is required to have resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy. As the flow path wall member 8, for example, epoxy resin), polyether amide resin, polyimide resin, polycarbonate resin, polyester resin, or the like can be used.

  Next, after a metal film having a thickness of 4 μm is formed on the outermost surface by sputtering, a resist is applied, exposed, developed, and selectively removed by wet treatment, as shown in FIG. 7 (p). A metal film 12 was formed. Since this process flow is the same as the process flow of the metal film 12 described in detail in Example 1, detailed description thereof is omitted here. In this embodiment, the metal film 12 is directly connected to the wiring member 22a '. The metal film 12 is also formed on the side wall of the flow path wall member 8.

  The metal film 12 is desirably a film having a low electric resistance and excellent corrosion resistance to ink. In this embodiment, the metal film 12 is gold (2.05 μΩcm, 0 ° C.). In this embodiment, the sputtering method is used as the method for forming the metal film, but physical vapor deposition by vacuum vapor deposition or ion plating may be used.

  Next, a negative photosensitive resin material was applied by a slit coat method, and was exposed and developed to form an ejection port member 9 having ink ejection ports 10. In addition to being incompatible with the material of the mold material 17, the negative photosensitive resin material is required to have resistance to ink, adhesion to the substrate, strength against external impact, and high patterning accuracy. . In the present embodiment, the same material as that of the flow path wall member 8 is used.

  Next, as shown in FIG. 7 (q), the mold member 17 was removed to complete the ink jet recording head.

  According to the manufacturing method of the present embodiment, since it is not necessary to form the metal wiring 13, the process can be simplified and an ink jet recording head can be provided at a low cost.

9: second organic resin layer 10: ink discharge port 12: metal film 13: metal wiring 14: wiring 15: resistor 16: substrate grounding structure

Claims (32)

A liquid discharge head comprising: a substrate having a discharge energy generating element that generates energy for discharging a liquid; a discharge port that discharges the liquid; and a flow path forming member that forms a liquid flow path communicating with the discharge port Because
A conductive film disposed on the flow path forming member;
A resistor electrically connected to the conductive film;
A liquid ejection head comprising:   The liquid discharge head according to claim 1, wherein the conductive film draws static electricity, and the resistor consumes static electricity drawn by the conductive film.   The liquid discharge head according to claim 1, wherein at least a part of the conductive film is disposed around the discharge port.   The liquid discharge head according to claim 1, wherein at least a part of the conductive film is exposed on a side surface of the discharge port.   The liquid discharge head according to claim 1, wherein at least a part of the conductive film forms an opening on the liquid flow path side of the discharge port. The flow path forming member includes a flow path wall member that forms a side wall of the liquid flow path, and a discharge port member that is disposed on the upper side of the flow path wall member and that forms the discharge port and the upper wall of the liquid flow path. And including
The liquid discharge head according to claim 1, wherein the conductive film is disposed between the flow path wall member and the discharge port member.   The liquid discharge head according to claim 6, wherein the conductive film is exposed on an upper wall of the liquid flow path.   The liquid discharge head according to claim 1, wherein the resistor is formed on the substrate.   The liquid discharge head according to claim 8, wherein the resistor is formed in a region other than a region where the flow path forming member is formed.   The liquid discharge head according to claim 8, wherein the resistor is a resistance element configured by a laminated structure including a wiring material and a heater material.   The liquid discharge head according to claim 10, wherein the resistance element is made of the same material as that used for the discharge energy generating element.   The liquid according to claim 10 or 11, wherein the conductive film is electrically connected to the wiring material constituting the resistance element via a metal wiring provided on a side wall or inside of the flow path forming member. Discharge head.   The liquid ejection head according to claim 12, wherein the metal wiring has an electric resistance lower than that of the conductive film.   The liquid discharge head according to claim 10, wherein the conductive film is directly connected to the wiring material constituting the resistance element.   15. The conductive film is formed at least partially on a side wall of the flow path wall member and extends from the periphery of the discharge port until reaching the wiring member constituting the resistance element. Liquid discharge head.   The liquid discharge head according to claim 1, wherein the conductive film is a metal film.   The liquid discharge head according to claim 1, wherein at least one resistor is provided on the substrate. A substrate having a discharge energy generating element that generates energy for discharging a liquid, a discharge port that discharges the liquid, and a flow path forming member that configures a liquid flow path communicating with the discharge port,
The flow path forming member is a method of manufacturing a liquid discharge head including a flow path wall member that forms a side wall of the liquid flow path, and a discharge port member that forms an upper wall of the discharge port and the liquid flow path. There,
(1) preparing the substrate having a resistance element and the ejection energy generating element;
(2) forming a mold material serving as a mold of the liquid channel and the channel wall member on the substrate;
(3) forming a conductive film electrically connected to the resistance element on the mold member and the flow path wall member;
(4) forming the discharge port member on the conductive film;
(5) removing the mold material;
A method of manufacturing a liquid discharge head, comprising:   The method of manufacturing a liquid discharge head according to claim 18, wherein the resistance element is a resistance element having a laminated structure including a wiring material and a heater material.   The method of manufacturing a liquid ejection head according to claim 19, wherein the resistance element is made of the same material as that used for the ejection energy generation element.   21. The method of manufacturing a liquid ejection head according to claim 19, wherein the resistance element is formed in a region other than a region where the flow path wall member is formed. The step (2) further includes a step of forming a metal wiring electrically connected to the wiring material constituting the resistance element, and the metal wiring and the flow path forming member obtained in the step (2) Is in contact with the side wall of
In the step (3), the conductive film is formed on the mold material, the flow path wall member, and the metal wiring so as to extend from the region where the discharge port is formed on the mold material to the metal wiring. The method of manufacturing a liquid discharge head according to claim 19, wherein the method is a step of forming a liquid.   The method of manufacturing a liquid discharge head according to claim 22, wherein the metal wiring is formed by an electrolytic plating method.   The step (2) further includes a step of forming a metal wiring electrically connected to the wiring member constituting the resistance element on the substrate and inside the flow path wall member. 22. A method for manufacturing a liquid discharge head according to any one of items 1 to 21.   25. The method of manufacturing a liquid ejection head according to claim 24, wherein the metal wiring is formed in an opening provided in the flow path wall member and exposing the wiring material constituting the resistance element at a bottom.   In the step (3), the conductive film is formed on the mold material, the flow path wall member, and the metal wiring so as to extend from the region where the discharge port is formed on the mold material to the metal wiring. 26. The method of manufacturing a liquid discharge head according to claim 24 or 25, wherein the method is a step of forming a liquid.   27. The method of manufacturing a liquid ejection head according to claim 24, wherein the metal wiring is formed inside the opening by an electroless plating method.   28. The method of manufacturing a liquid ejection head according to claim 22, wherein the metal wiring includes at least one of gold, silver, and nickel.   29. The method of manufacturing a liquid discharge head according to claim 22, wherein the metal wiring is formed using a material having an electric resistance lower than that of the conductive film.   The method of manufacturing a liquid ejection head according to claim 21, wherein in the step (3), the conductive film is also formed on a side wall of the flow path wall member and the wiring material constituting the resistance element. In the step (3), a first opening constituting a part of the discharge port is provided in the conductive film,
31. The liquid discharge head according to claim 18, wherein in the step (4), the discharge port member is provided with a second opening so as to communicate with the first opening, and the discharge port is formed. Production method.   The liquid according to any one of claims 18 to 31, wherein in the step (3), the conductive film is formed by a sputtering method, a vacuum evaporation method, an ion plating method, or a plating method using a metal as a material. Manufacturing method of the discharge head.

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