JP2012118184A - Image display device, disassembly tool for image display device, and disassembly method of image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an image display device in which a display substrate and a chassis can be separated from a drive substrate with an added force by configuring the image display device so as to add a predetermined force in a direction of separating a display substrate, the chassis and the drive substrate without requiring any large work space outside the configuration in watching from a laminating direction of components, in the display device where the display substrate is joined to one side of the chassis via a first adhesive layer and the drive substrate is joined to another side of the chassis via a second adhesive layer.SOLUTION: An image display device includes a chassis 2, a display substrate 6 and a drive substrate 15A. The display substrate 6 includes a display section 8 which displays a video image, and is joined to one side of the chassis 2 via a first adhesive layer 3. The drive substrate 15A is provided for driving the display section 8 and joined to another side of the chassis 2 via a second adhesive layer 13. A joint force of the first adhesive layer 3 joining the chassis 2 ans the display substrate 6 is greater than a joint force of the second adhesive layer 13 joining the chassis 2 and the drive substrate 15A.

Description

  The present invention relates to an image display device such as an organic EL display device using an organic EL element, a disassembly jig for the image display device, and a disassembly method for the image display device.

As a display device using a flat display panel, a liquid crystal display device, a plasma display device, an organic luminescence panel (organic EL panel), and the like are widely known.
A liquid crystal display device is used for a relatively small display device such as a portable electronic information device represented by a notebook personal computer, a mobile phone, and a portable information terminal.

Plasma display devices and organic EL display devices are used for thin and large display devices. In fact, they are widely used as display devices for wall-mounted televisions for business use and recently for home use.
Furthermore, in the various display devices described above, development for supplying a display panel having a shape that meets the needs, such as a curved surface on the surface of a display panel, instead of a flat display panel in a commercial electronic signboard, is also in progress.

  In recent years, due to the growing awareness of global environmental issues, there is a need to reduce the amount of industrial waste, and in products in each field, used products are disassembled and, for example, glass and Metal parts are collected and recycled, and display devices are no exception.

Here, a configuration of a main part of a general display device will be described.
The display device includes a display panel and a chassis to which the back surface of the display panel is fixed via a first adhesive layer.

And the conventional display apparatus which comprised the 1st contact bonding layer with the double-sided adhesive tape, isolate | separated between a glass substrate and a chassis easily, and raised recyclability is proposed.
A conventional display device includes a plurality of double-sided pressure-sensitive adhesive tapes for fixing a display panel and a chassis, and the double-sided pressure-sensitive adhesive tape has a lower adhesive force than a peeling force generated by a distortion in a width direction due to a pull in a longitudinal direction. (For example, refer to Patent Document 1).

  In the conventional display device configured as described above, the display panel and the chassis are easily separated by pulling the double-sided adhesive tape in the longitudinal direction.

Further, as a display device, a drive substrate for driving a display unit included in the display panel is fixed to the other surface of the chassis via the second adhesive layer, and the display panel and the drive substrate are fixed via the chassis. Many are attached to opposite positions.
In this case, separation between the chassis and the drive substrate is desired. And as a 2nd adhesive layer, by comprising with the double-sided adhesive tape similar to the conventional display panel, it becomes separable by pulling a double-sided adhesive tape between a chassis and the board | substrate for a drive.

Japanese Patent No. 4478347

  However, for example, when a large display unit is configured by arranging a plurality of display devices in which a drive substrate and a chassis are integrated using an adhesive tape similar to that of a conventional display device, the drive substrate and chassis of each display device are arranged. In order to separate them, it is necessary to pull the adhesive tape in the longitudinal direction. That is, it is necessary to pull the adhesive tape in a direction parallel to the surfaces of the display panel and the chassis, in other words, in the display panel arrangement direction. At this time, in order to pull the adhesive tape, it is necessary to use the outside of the display panel as a work area when viewed from the opposite direction, but there is a display panel adjacent to the display panel having the adhesive tape to be pulled. In some cases, it may be difficult to separate the drive substrate and the chassis.

  The present invention has been made to solve the above-described problems. The display substrate is bonded to one surface of the chassis via the first adhesive layer, and the drive substrate is bonded to the other surface of the chassis via the second adhesive layer. In the image display device to be joined, the display substrate, the chassis, and the drive substrate can be connected to each other without requiring a large working space outside the configuration as viewed from the stacking direction of the display substrate, the chassis, and the drive substrate. An image display device configured to be able to apply a predetermined force in the separating direction and separating the display substrate and the chassis from the drive substrate by the applied force, a disassembly jig for the image display device, and disassembly of the image display device The purpose is to obtain a method.

  An image display device according to the present invention includes a chassis and a display unit that displays an image. The display substrate is bonded to one surface of the chassis via a first adhesive layer, and is provided for driving the display unit. A drive substrate bonded to the surface via the second adhesive layer, and a bonding force of the first adhesive layer that bonds the chassis and the display substrate is a bonding force of the second adhesive layer that bonds the chassis and the drive substrate It is getting bigger.

  According to the image display device of the present invention, the bonding force of the first adhesive layer that bonds the chassis and the display substrate is larger than the bonding force of the second adhesive layer that bonds the chassis and the drive substrate. In the image display device having such a configuration, when a predetermined force is applied to the drive substrate in a direction in which the display substrate is separated, creep occurs in the second adhesive layer, and the second adhesive layer gradually moves from the drive substrate. Thus, the drive substrate and the chassis to which the display substrate is bonded can be separated. At this time, a force for generating creep in the second adhesive layer may be applied in the stacking direction of the display substrate, the chassis, and the drive substrate. Therefore, by configuring the image display device as described above, instead of the conventional idea of directly holding the adhesive tape provided between the drive substrate and the chassis and pulling in the longitudinal direction of the adhesive tape, the drive substrate Even if there is no large work space outside the image display device, the drive substrate and the display substrate are joined together by using a jig that holds the chassis and the display substrate against the drive substrate. The chassis can be separated.

1 is a cross-sectional view of an organic EL display device according to Embodiment 1 of the present invention. It is a figure explaining the disassembly method of the 1st disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 1 of this invention, and the 1st disassembly jig | tool, and uses the 1st disassembly jig | tool, This shows the state before creep occurs. It is a figure explaining the disassembly method of the 1st disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 1 of this invention, and the 1st disassembly jig | tool, and uses the 1st disassembly jig | tool, The state after creep is generated is shown. It is a figure explaining the disassembly method of the organic EL display apparatus using the 2nd disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 1 of this invention, and a 2nd disassembly jig | tool. It is a figure explaining the method using a wire in the disassembly method using the 2nd disassembly jig | tool of the organic electroluminescence display which concerns on Embodiment 1 of this invention. Example 1 and Example 2 of the organic EL display device according to Embodiment 1 of the present invention, a comparative example of the organic EL display device, and the organic EL display device of each example using the first and second disassembly jigs It is a figure explaining a dismantling result. It is sectional drawing of the organic electroluminescence display which concerns on Embodiment 2 of this invention. It is a cross section explaining the disassembly method of the 3rd disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 2 of this invention, and the 3rd disassembly jig | tool. It is the top view which looked at FIG. 8 from the A direction. It is a figure explaining what used the wire in the disassembly method using the 3rd disassembly jig | tool of the organic electroluminescence display which concerns on Embodiment 2 of this invention. It is a figure explaining the disassembly result of the organic EL display apparatus of each Example by Example 3 and Example 4 of the organic EL display apparatus which concerns on embodiment of this invention, and a disassembly jig | tool. It is sectional drawing of the organic electroluminescence display which concerns on Embodiment 3 of this invention. It is a figure explaining the disassembly method of the organic EL display apparatus using the 4th disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 3 of this invention, and a 4th disassembly jig | tool. It is a figure explaining the disassembly method of the 5th disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 3 of this invention, and the 5th disassembly jig | tool. Examples 5 and 6 of the organic EL display device according to Embodiment 3 of the present invention, fourth and fifth disassembly jigs, and disassembly of examples 5 and 6 by the fourth and fifth disassembly jigs It is a figure explaining a result. It is sectional drawing of the organic electroluminescence display which concerns on Embodiment 4 of this invention. It is a figure explaining the 6th disassembly jig | tool which disassembles the organic EL display apparatus which concerns on Embodiment 4 of this invention, and the disassembly method of the organic EL display apparatus using a 6th disassembly jig | tool. It is a figure explaining the disassembly result of Example 7 of the organic EL display device which concerns on Embodiment 4 of this invention, and the organic EL display device of Example 7 by the 6th disassembly jig | tool.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

Embodiment 1 FIG.
1 is a sectional view of an organic EL display device according to Embodiment 1 of the present invention.

In FIG. 1, an organic EL display device 1 </ b> A as an image display device includes a chassis 2 and a display substrate 6 having a display unit 8 mainly composed of organic EL elements and capable of displaying an image. A display panel unit 5 bonded via the first adhesive layer 3 and a drive substrate 15A provided for driving the display unit 8 and bonded to the other surface of the chassis 2 via the second adhesive layer 13 are provided. I have.
The panel module 4 includes a chassis 2 and a display panel unit 5 joined to the chassis 2 via a first adhesive layer 3.

  The chassis 2 is made into a rectangular flat plate shape using materials such as aluminum, aluminum alloy, stainless steel, magnesium, coated iron, and ceramics. However, from the viewpoint of light weight and high heat dissipation, the chassis 2 is preferably made of aluminum or aluminum alloy. When aluminum is used for the chassis 2, the surface may be coated in consideration of design properties or the like, or chemical conversion treatment or alumite treatment may be performed. Moreover, the thickness of the chassis 2 should just be able to endure the force for generating a creep in the 2nd contact bonding layer 13 joined to the chassis 2, For example, when using aluminum alloy as a material, the thickness of the chassis 2 is sufficient. Is 0.5 mm or more, more preferably 0.8 mm or more. Although an upper limit should just be a manufacturable thing, it is usually 3 mm or less.

  The drive substrate 15A is not particularly limited, but is a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, a glass epoxy substrate, a glass polyimide substrate, a Teflon (registered trademark) substrate, an alumina substrate, a ceramic substrate, A metal substrate, a halogen-free substrate, or the like can be used. Here, the drive substrate 15 </ b> A is formed in a rectangular flat plate shape having a longer side than the chassis 2.

  Further, the drive substrate 15A preferably has a predetermined thickness or more in order to ensure high rigidity, and is particularly preferably a glass epoxy substrate. When a glass epoxy substrate is used as the drive substrate 15A, the thickness of the substrate is desirably 0.4 mm to 3.0 mm, and is desirably 0.8 mm or more in order to further ensure rigidity.

The chassis 2 and the drive substrate 15A are stacked via the first adhesive layer 3 with the longitudinal direction and the short direction parallel to each other, and a pair of outer edges of the drive substrate 15A is viewed from the stacking direction. A predetermined region including each of the long edge portions protrudes outside the chassis 2 to form a first extension portion 15a.
An electronic component (not shown) for controlling the display unit 8 is mounted on the drive board 15A.

  The display panel unit 5 surrounds and seals a pair of opposed rectangular flat glass substrates 7a and 7b, a display unit 8 sandwiched between the pair of glass substrates 7a and 7b, and an outer periphery of the display unit 8. The display substrate 6 having the sealing resin 9 to be used and having the exposed surface of one glass substrate 7a as a front surface and the exposed surface of the other glass substrate 7b (the back surface of the display substrate 6) are integrated. A communication member 12 that is attached and constitutes a communication path between the drive substrate 15A and the display unit 8 is provided. The communication member 12 is connected to the drive board 15A via a cable (not shown).

The size of the glass substrates 7 a and 7 b corresponds to the size of the chassis 2.
The area of the communication member 12 is smaller than the areas of the glass substrates 7a and 7b, and a step is formed with respect to the surface of the glass substrate 7b.

The display unit 8 is composed of an organic EL element, and is configured to display an image.
The communication member 12 is, for example, a flexible printed board, and an infinite number of wiring patterns for transmitting signals to the organic EL elements of the display unit 8 are formed.
Although not shown in detail, the wiring pattern of the communication member 12 and the signal input / output electrode of the organic EL element are electrically connected by a desired wiring. This enables communication with the display unit 8 drive substrate 15A. The electrode may be moisture-proofed.
The communication member 12 is not a flexible printed circuit board, but is composed of a metal film wiring or a connector or the like in which conductive and insulating silicon rubber are alternately arranged and the conductive portion is used for the wiring path. Also good.

  Although not shown in detail, the communication member 12 and the drive board 15A are connected by wiring not shown. Then, the control signal of the display unit 8 generated by the drive substrate 15A is input to the display unit 8 via the communication member 12, and each organic EL element is caused to emit light according to the control signal, and a desired image is displayed. Is displayed.

The first adhesive layer 3 is applied to at least one of the glass substrate 7 b and the communication member 12 of the display substrate 6 and the chassis 2, and is cured after joining the display substrate 6 and the communication member 12 side to the chassis 2. It is composed of an adhesive. The first adhesive layer 3 is formed between the entire surface of the chassis 2 facing the glass substrate 7b and the glass substrate 7b.
The bonding force of the first adhesive layer that bonds the chassis 2 and the glass substrate 7b constituting the display panel unit 5 and the communication member 12 is the first bonding force.
The first bonding force is the weaker bonding among the bonding force between the glass substrate 7b and the communication member 12 and the first adhesive layer 3, and the bonding force between the chassis 2 and the first adhesive layer 3. I say power.

  The first adhesive layer 3 may be composed of a double-sided adhesive tape or the like without depending on the cured adhesive, but by being composed of an adhesive, the first adhesive layer 3 is formed between the surface of the glass substrate 7b and the communication member 12. Even if there is a step, the adhesive spreads by leveling so as to eliminate the step. Therefore, since it becomes possible to join the glass substrate 7b and the communication member 12 at a desired interval without requiring a particularly troublesome operation, the first adhesive layer 3 is made of an adhesive. preferable.

  Although the kind of adhesive agent which comprises the 1st contact bonding layer 3 is not specifically limited, A urethane type, an epoxy type, an acrylic type, a silicone type, and a modified silicone type adhesive agent are mentioned. The adhesive may be either a one-component type or a two-component type.

  Since the chassis 2 and the communication member 12 are made of different materials, different stresses are generated due to differences in thermal expansion coefficients, for example. In order to absorb the difference in stress and prevent the chassis 2 and the communication member 12 from cracking, it is preferable to use a silicone or modified silicone as the adhesive.

  Here, the chassis 2 plays a role of heat dissipation. For this reason, the one where the heat conductivity of the 1st contact bonding layer which adhere | attaches between the glass substrate 7b, the communication member 12, and the chassis 2 is higher is preferable. Specifically, the thermal conductivity is preferably 0.4 W / mK or more.

  Further, when the display panel unit 5 and the chassis are joined via the adhesive, the glass substrate 7b and the communication member 12 constituting the display panel unit 5 and the chassis 2 are pressurized in a direction approaching each other. If the viscosity of the adhesive is high, a large pressure is required and the display substrate 6 and the communication member 12 may be damaged. Therefore, the viscosity of the adhesive is preferably not too high. Specifically, it is preferable that the glass substrate 7b and the communication member 12 can be brought close to the chassis 2 using an adhesive having a viscosity of 50 Pa · s or less, more preferably 20 Pa · s or less.

  The sealing resin 9 is for protecting the display unit 8. Although the kind of sealing resin 9 is not specifically limited, For example, UV curing type acrylic resin can be used.

The configuration of the second adhesive layer 13 is not particularly limited, but when a predetermined force is applied in the direction in which the chassis 2 is separated from the drive board 15A (the pulling direction) in the stacking direction of the drive board 15A and the chassis 2. In addition, those made of a material that effectively generates creep are preferable.
The second adhesive layer 13 is formed between the entire surface facing the drive substrate 15A and the drive substrate 15A. The joining force of the second adhesive layer 13 that joins the chassis 2 and the drive substrate 15A is the second joining force, and the first joining force is larger than the second joining force.
Here, the second bonding force is the weaker bonding force of the bonding force between the drive substrate 15 </ b> A and the second adhesive layer 13 and the bonding force between the chassis 2 and the second adhesive layer 13. Say.

The second adhesive layer 13 is preferably composed of various double-sided pressure-sensitive adhesive tapes having flexibility such as rubber, silicone, and acrylic. As a characteristic of the double-sided pressure-sensitive adhesive tape, the storage elastic modulus in dynamic viscoelasticity measurement at room temperature is preferably 10 ⁸ Pa or less, and more preferably the storage elastic modulus is 10 ⁷ Pa or less.

The type of the double-sided pressure-sensitive adhesive tape constituting the second adhesive layer 13 is not particularly limited, such as a baseless material made of only a pressure-sensitive adhesive or a material in which a pressure-sensitive adhesive is applied to both surfaces of a base material. Further, the material of the base material of the double-sided pressure-sensitive adhesive tape may be a well-known foam type, and is not particularly limited.
When it is desired to increase the thermal conductivity from the drive substrate 15A to the chassis 2, a double-sided adhesive tape (thermal conductive tape) excellent in thermal conductivity in which an inorganic filler is added to an adhesive may be used. .

  Here, when the 2nd adhesive layer 13 is comprised with a double-sided adhesive tape, the thickness of a double-sided adhesive tape is determined in consideration of the dimensional accuracy of the drive substrate 15A and the panel module 4. The double-sided adhesive tape only needs to be capable of joining the drive substrate 15A and the chassis 2 without a gap between the drive substrate 15A and the chassis 2 due to dimensional errors even if the thickness thereof is thin. Practically, the thickness of the double-sided pressure-sensitive adhesive tape is 0.01 mm or more. More preferably, the thickness of the double-sided adhesive tape is such that the drive substrate 15A and the chassis 2 are separated from an assumed gap between the drive substrate 15A and the chassis 2 due to a dimensional error between the drive substrate 15A and the panel module 4. It should be 0.05 mm or more so that it can be handled with a margin for joining.

  Moreover, if the thickness of the double-sided pressure-sensitive adhesive tape is too thick, the total thickness of the organic EL display device 1A increases, and the total deformation amount of the double-sided pressure-sensitive adhesive tape due to aging and thermal expansion increases, so the thickness of the double-sided pressure-sensitive adhesive tape Is preferably, for example, 1.5 mm or less.

Further, as the adhesive strength of the double-sided adhesive tape, in order to release the connection between the chassis 2 of the panel module 4 and the drive substrate 15A, a force in the pulling direction is applied to the display panel unit 5 while holding the drive substrate 15A. When selected, the chassis 2 and the display panel unit 5 constituting the drive board 15A and the panel module 4 are selected within a range not to be damaged. Specifically, the adhesive strength of the double-sided pressure-sensitive adhesive tape in the pulling direction at 20 ° C. is preferably 10 N / cm ² or more, and from the viewpoint of sufficiently securing the bonding force between the drive substrate 15A and the chassis, 20 N / cm ² or more is preferable. The upper limit of the adhesive strength of the double-sided pressure-sensitive adhesive tape is not limited as long as the constituent members of the drive substrate 15A and the panel module 4 that are separated and recovered are not damaged, but is suitably 200 N / cm ² or less.

  Note that the magnitude of the bonding force between the second adhesive layer 13 and the drive substrate 15A and the bonding force between the second adhesive layer 13 and the chassis 2 depends on the combination of the materials of the drive substrate 15A and the chassis 2. It can change.

  When the chassis 2 is made of aluminum or an aluminum alloy that is very common for heat dissipation, and the drive substrate 15A is a resin substrate such as a glass epoxy substrate that is common as an electronic circuit board, both sides of the double-sided adhesive tape Are the same, the second bonding force between the drive substrate 15A and the adhesive constituting the second adhesive layer 13 is between the chassis 2 and the adhesive constituting the second adhesive layer 13. It becomes weaker than the first bonding force.

  If the drive substrate 15A and the chassis 2 are joined with a double-sided adhesive tape with the same adhesive applied on both sides, the gap between the drive substrate 15A and the adhesive constituting the second adhesive layer 13 is assumed. Is stronger than the bonding force between the chassis 2 and the adhesive constituting the second adhesive layer 13.

In this case, the adhesive strength of the adhesive on one side of the double-sided tape joined to the chassis 2 is greater than a predetermined value relative to the adhesive strength of the adhesive on the other side of the double-sided tape joined to the drive substrate 15A. By using one, the bonding force between the drive substrate 15 </ b> A and the second adhesive layer 13 can be set to be weaker than the bonding force between the chassis 2 and the second adhesive layer 13.
Note that the predetermined value is a joining force between the drive substrate 15A and the adhesive constituting the second adhesive layer 13 and a joining force between the chassis 2 and the adhesive constituting the second adhesive layer. Corresponds to the difference.

  The second adhesive layer 13 may use an adhesive regardless of the adhesive tape.

  In the organic EL display device 1A configured as described above, the first bonding force of the first adhesive layer that bonds the glass substrate 7b and the communication member 12 and the chassis 2 bonds the chassis 2 and the drive substrate 15A. It is larger than the second bonding force of the second adhesive layer. In the organic EL display device 1A having such a configuration, when a predetermined force is applied to the drive substrate 15A in a direction in which the display panel unit 5 is separated, creep occurs in the second adhesive layer 13 and the drive substrate 15A. The second adhesive layer 13 is gradually peeled off, so that the drive substrate 15A and the chassis 2 of the panel module 4 can be separated. The predetermined force for generating the creep of the second adhesive layer 13 may be smaller than the second bonding force, and does not damage the drive substrate 15A and the display panel unit 5.

  At this time, instead of the conventional idea of directly pulling the adhesive tape provided between the drive substrate 15A and the chassis 2 in the longitudinal direction of the adhesive tape, the drive substrate 15A is pressed and the chassis 2 and the display substrate 6 are driven. By using the first disassembly jig 40A and the second disassembly jig 40B that are pulled with respect to the substrate 15A, even if there is no large work space outside the organic EL display device 1A, the drive substrate 15A and the display substrate The chassis 2 to which 6 is joined can be separated.

  Further, when the second adhesive layer 13 is composed of a double-sided adhesive tape, the chassis 2 and the drive substrate 15A are separated, and then the second adhesive layer 13 is to be removed from the chassis 2 or the drive substrate 15A. Therefore, it is possible to reduce the trouble of removing the second adhesive layer 13 as compared with the case where the second adhesive layer 13 is made of an adhesive.

  Further, when the second adhesive layer 13 is composed of a double-sided adhesive tape and a force is applied to separate the drive substrate 15A and the chassis 2 from each other, the double-sided adhesive tape is peeled from the drive substrate 15A. Thus, the following effects are acquired by setting the adhesive force of the one surface and the other surface of the double-sided pressure-sensitive adhesive tape.

  That is, in many cases, the drive board 15A and the panel module 4 including the display panel unit 5 and the chassis 2 are separated and a new panel module is joined to the drive board 15A. In such a case, if the second adhesive layer 13 remains on the drive substrate 15A side when the drive substrate 15A and the panel module 4 are separated, the trouble of removing the second adhesive layer 13 from the drive substrate 15A is eliminated. Is required.

  The adhesive strength of the adhesive on one side of the double-sided pressure-sensitive adhesive tape affixed to the drive substrate 15A is made a predetermined amount or more stronger than the adhesive strength of the adhesive on the other side of the double-sided adhesive tape affixed to the drive substrate 15A. If this is the case, the second adhesive layer 13 is separated from the drive board 15A together with the chassis 2 when the drive board 15A and the panel module 4 are separated from each other, so that the trouble of removing the second adhesive layer 13 from the drive board 15A is eliminated. The drive substrate 15A can be used as it is.

  In addition, the first adhesive layer 3 is made of an adhesive that is cured after the display substrate 6 and the communication member 12 and the chassis 2 are joined together in a liquid state, so that the surface of the glass substrate 7b is formed. The following effects are obtained when the communication member 12 is attached with a step. For example, a liquid adhesive is applied so as to cover one surface of the chassis 2, and the glass substrate 7b and the communication member 12 and the chassis 2 are pressed and joined to each other through the adhesive in a direction approaching each other. The agent flows into the step portion between the glass substrate 7b and the communication member 12 by leveling, and does not form a space between the glass substrate 7b and the communication member 12, and the glass substrate 7b and the chassis 2 are parallel to each other. Can be joined together.

  Further, in the conventional display device, the idea was to separate the glass substrate and the chassis by using a plurality of narrow double-sided tapes. A complicated manufacturing process of incorporating a plurality of double-sided tapes between the glass substrate and the chassis is required. On the other hand, according to the organic EL display device 1A, when the second adhesive layer 13 that joins the drive substrate 15A and the chassis 2 is configured with a double-sided adhesive tape, it is not necessary to divide the double-sided adhesive tape into a plurality of The manufacturing process of the organic EL display device 1A is simplified.

  In the first embodiment, the chassis 2, the drive substrate 15A, and the glass substrates 7a and 7b are rectangular flat plates. However, these shapes are not particularly limited, and may be other shapes.

Next, a disassembly jig for disassembling the organic EL display device 1A will be described.
FIG. 2 is a diagram for explaining a first disassembly jig for disassembling the organic EL display device according to Embodiment 1 of the present invention, and a disassembly method of the organic EL display device using the first disassembly jig. The state before creep is generated in the adhesive layer is shown. FIG. 3 is a diagram for explaining a first disassembly jig for disassembling the organic EL display device according to Embodiment 1 of the present invention, and a disassembly method for the organic EL display device using the first disassembly jig. The state after generating creep in the adhesive layer is shown.

  In FIG. 2, the first disassembly jig 40A of the organic EL display device includes a mounting member 41A bonded to the surface of the display substrate 6, in other words, one surface of one glass substrate 7a via the mounting member adhesive layer 45. The first bolt 42 is provided as a peeling force generating means that is provided so as to connect the mounting member 41A and the drive board 15A, and generates a force in a direction in which the drive board 15A and the mounting member 41A are separated from each other. ing.

A plate material having a larger area than the glass substrates 7a and 7b is used for the mounting member 41A.
Further, the attachment member 41A can be arranged with its outer edge portion extended from the glass substrate 7a so as to face the first extension portion 15a of the drive substrate 15A protruding from the chassis 2. . Here, the part of the attachment member 41A that protrudes from both side edges in the longitudinal direction of the glass substrate 7a constitutes a pair of attachment member extension parts 41a.
The attachment member extension 41a is provided with a screw hole 41b facing the first extension 15a. A plurality of screw holes 41b are provided in the attachment member extending portion 41a at intervals.

The attachment member adhesive layer 45 may be configured by curing an adhesive, or may be a double-sided adhesive tape as long as the glass substrate 7a and the attachment member 41A can be joined with the following adhesive force.
That is, it is only necessary that the third bonding force of the mounting member adhesive layer 45 that bonds the glass substrate 7a and the mounting member 41A is greater than the second bonding force. The third bonding force is preferably larger than the first bonding force.

The disassembly procedure of the organic EL display device using the first disassembly jig 40A is as follows.
First, as shown in FIG. 2, the screw hole 41b of the attachment member extension portion 41a is opposed to the first extension portion 15a, and an adhesive is applied to the attachment member 41A or the glass substrate 7b to attach the attachment member 41A. The glass substrate 7b is parallel to each other and bonded with an adhesive, and the adhesive is cured. Thereby, the attachment member 41 </ b> A is joined to the glass substrate 7 b via the attachment member adhesive layer 45.

  Then, the screw portion 42a of the first bolt 42 is screwed into the screw hole 41b from the side opposite to the drive substrate 15A. When the first bolt 42 is rotated around the axis until the tip end of the screw portion 42a contacts the drive board 15A, the first bolt 42 is further rotated around the axis. Since the screw 42 is prevented from being screwed in, the force to screw the first bolt 42 acts in a direction to separate the mounting member 41A screwed to the first bolt 42 from the drive board 15A (peeling force). Implementation of generation process).

That is, a predetermined force corresponding to the screwing amount of the first bolt 42 is applied to the drive board 15A in the direction of separating the panel module 4 to which the attachment member 41A is bonded. Since the first bonding force is greater than the second bonding force, creep occurs in the second adhesive layer 13 that bonds the drive substrate 15A and the second adhesive layer 13 as shown in FIG. Then, the portion of the second adhesive layer 13 located in the vicinity of the drive substrate 15A with which the tip of the first bolt 42 abuts is gradually peeled off from the first drive substrate 15A, and the drive substrate 15A and the panel module. 4 can be separated together with the second adhesive layer 13.
As described above, the organic EL display device 1A is disassembled.

Another embodiment of the disassembly jig will be described.
FIG. 4 is a diagram for explaining a second disassembly jig for disassembling the organic EL display device according to Embodiment 1 of the present invention and a disassembly method for the organic EL display device using the second disassembly jig.

In FIG. 4, the second disassembly jig 40B of the organic EL display device 1A, like the first disassembly jig A, is attached to one glass substrate 7a via the attachment member adhesive layer 45 and the attachment member 41B. A jack bolt 44 is provided as a peeling force generating means that is provided so as to connect the member 41B and the drive board 15A and generates a force in a direction in which the drive board 15A and the mounting member 41B are separated from each other.
The mounting member 41B is configured in the same manner as the mounting member 41A, except that no screw hole is formed.
The jack bolt 44 has a length slightly shorter than the distance between the attachment member extension portion 41a and the first extension portion 15a when the attachment member 41B is joined to the glass substrate 7a via the attachment member adhesive layer 45. Screw rod 44a and a nut 44b screwed to the screw rod 44a.
One end surface of the nut 44b can be arranged on the outer side in the axial direction of the screw rod 44a from one end of the screw rod 44a. That is, the jack bolt 44 can change the total axial length by the axial length of the nut 44b.

The disassembly procedure of the organic EL display device 1A using the second disassembly jig 40B is as follows.
First, the screw hole 41b of the attachment member extension portion 41a is opposed to the first extension portion 15a, and the adhesive constituting the attachment member adhesive layer 45 is applied to at least one of the attachment member 41B and the glass substrate 7a. The member 41B and the glass substrate 7b are parallel to each other and bonded with an adhesive, and the adhesive is cured. Thereby, the attachment member 41B is joined to the glass substrate 7b via the attachment member adhesive layer 45.

Then, the jack bolt 44 in which one end surface of the nut 44b is disposed in advance within the axial length range of the screw rod 44a is connected to the attachment member extending portion 41a of the attachment member 41B opposed to the screw rod 44a. Between the first extension part of the drive substrate 15A, the first extension part 15a and the attachment member extension part 41a are arranged so that the axial directions thereof coincide with each other.
At this time, one end of the screw rod 44a is directed to the mounting member 41B.
The other end of the screw rod 44a is brought into contact with the drive substrate 15A, and the nut 44b is moved in a direction to come out from one end of the screw rod 44a.

  Then, after the end surface of the nut 44b comes into contact with the mounting member extending portion 41a, when the nut 44b is further rotated in a direction to come out of the screw rod 44a, the mounting member 41B prevents the movement of the nut 44b. Since the jack bolt 44 tends to change in the direction of increasing the overall length, the nut 44b pressurizes the mounting member 41B. That is, a predetermined pressing force according to the protruding amount of one end face of the nut 44b from one end of the screw rod 44a acts in the direction of separating the panel module 4 together with the mounting member 41A against the drive board 15A.

  Since the first bonding force is larger than the second bonding force, creep occurs between the drive substrate 15A and the second adhesive layer 13, and the second adhesive layer 13 is gradually peeled off from the drive substrate 15A, thereby driving. The board 15A and the chassis 2 of the panel module 4 can be separated.

In the disassembly method of the organic EL display device 1A using the first disassembly jig 40A or the second disassembly jig 40B, a wire may be used as described below.
FIG. 5 is a view for explaining a method using a wire in a disassembly method using the second disassembly jig for disassembling the organic EL display device according to Embodiment 1 of the present invention.

  FIG. 5 shows an example in which the wire 50 is introduced during the disassembly of the organic EL display device 1A using the second disassembly jig 40B, but the wire 50 is similarly applied when the first disassembly jig 40A is used. Can be introduced. Further, the second adhesive layer 13 has a smaller bonding force with the drive substrate 15A than the bonding force with the chassis 2, and causes the second bonding layer 13 by the second disassembly jig 40B to creep. When force is applied, a gap is formed between the drive substrate 15A. When the bonding force between the drive substrate 15A and the second adhesive layer 13 is larger than the bonding force between the chassis 2 and the second adhesive layer 13, a gap is formed between the second adhesive layer 13 and the chassis 2. It will be.

  When creeping occurs in the second adhesive layer 13 and the peeling of the second adhesive layer 13 from the drive substrate 15A is started, as shown in FIG. The wire 50 as a strip is inserted into the gap between the layers 13 and both ends of the wire 50 are disposed outside the drive substrate 15A. The strip is not limited to the wire 50 and is not particularly limited as long as it has a string shape.

Next, as shown by the white arrow in FIG. 4, the drive substrate is moved and pressed along the drive substrate 15A from the lateral direction between the drive substrate 15A and the second adhesive layer 13 which are not separated, and driven. Both ends of the wire 50 are pulled so that a force in a direction to disconnect the joint between 15A and the second adhesive layer 13 works.
Thereby, the separation of the drive substrate 15A and the second adhesive layer 13 can be accelerated, and the disassembly efficiency of the organic EL display device 1A can be improved.

  According to the first and second disassembly jigs 40A and 40B configured as described above, a large installation space and work are provided outside the organic EL display device 1A when viewed from the stacking direction of the drive substrate 15A and the panel module 4. Even if there is no space, the drive substrate 15A and the panel module 4 can be separated by being provided in the organic EL display device 1A.

Next, organic EL display devices of Example 1 and Example 2 described below are prepared, the result of disassembling the organic EL display device of the first example using the first disassembly jig 40A, and the second disassembly treatment The result of disassembling the organic EL display device using the tool 40B will be described.
FIG. 6 shows Examples 1 and 2 of the organic EL display device according to Embodiment 1 of the present invention, a comparative example of the organic EL display device, and organic EL of each example using the first and second disassembly jigs. It is a figure explaining the disassembly result of a display apparatus.

As shown in FIG. 6, in the organic EL display devices of Example 1 and Example 2, the first adhesive layer 3 is composed of a two-liquid addition type silicone adhesive, and the second adhesive layer is a heat conductive double-sided adhesive. I prepared a tape.
However, in Example 1, a double-sided adhesive tape with a bonding force between the drive substrate 15A and the second adhesive layer 13 of 100 N / cm ² is selected. In Example 2, the drive substrate 15A and the second adhesive layer 13 are selected. A double-sided pressure-sensitive adhesive tape having a bonding strength of 120 N / cm ² is selected.
Further, the organic EL display device of the comparative example has the same configuration as the organic EL display device of the example, but the first adhesive layer 3 is a two-liquid addition type silicone adhesive and the second adhesive layer 13 is a two-liquid type. An epoxy type adhesive was prepared.

Then, the organic EL display device of Example 1 is applied with a force for generating creep on the second adhesive layer 13 by the first disassembly jig 40 </ b> A, and the organic EL display device of Example 2 is creeped on the second adhesive layer 13. The force for generating the pressure was applied by the second disassembly jig 40B.
In the first disassembly jig 40A, the attachment member adhesive layer 45 is composed of a two-liquid acrylic adhesive, and in the second disassembly jig 40B, the attachment member adhesive layer 45 is composed of a two-liquid epoxy adhesive. did.

  As a result, the organic EL display devices of Example 1 and Example 2 were disassembled so that the drive substrate 15A and the panel module 4 were separated.

  In the disassembly of the organic EL display device of Example 2, both the use of the wire 50 and the non-use of the wire 50 were performed. Further, the tightening force of the first bolt 42 and the tightening force of the nut 44b of the jack bolt 44 are managed to be the same value by a torque wrench or the like, and the force for generating creep in the second adhesive layer 13 is The same setting is used regardless of whether the first disassembly jig 40A or the second disassembly jig 40B is used.

  In addition, also in the organic EL display device of the comparative example, force was applied in the direction of separating the drive substrate 15A and the panel module 4 using the second disassembly jig 40B.

As a result, in the organic EL display device of Example 1, the second adhesive layer peels from the drive substrate 15A in the entire area of the second adhesive layer 13 in 20 minutes, and the space between the drive substrate 15A and the panel module 4 is separated. separated.
Further, in the organic EL display device according to Example 2, the drive substrate 15A and the panel module 4 were separated in 10 minutes for those not using the wire 50, and in 5 minutes for those using the wire 50. The drive substrate 15A and the panel module 4 were separated. It was confirmed that the separation between the drive substrate 15A and the panel module 4 can be accelerated by using the wire 50.
Further, it was confirmed that the organic EL display devices of Example 1 and Example 2 were not damaged in the separated drive substrate 15A and the panel module 4.

  On the other hand, in the organic EL display device of the comparative example, the second adhesive layer 13 was condensed and broken by the pressure applied by the jack bolt 44, and the drive substrate 15A and the panel module 4 could not be separated cleanly.

Embodiment 2. FIG.
FIG. 7 is a cross-sectional view of an organic EL display device according to Embodiment 2 of the present invention and a diagram for explaining a method of disassembling the organic EL display device using a disassembly jig.
In addition, the same code | symbol is attached | subjected to the part which is the same as that of the said Embodiment 1, or an equivalent, and the description is abbreviate | omitted.

  In FIG. 7, the organic EL display device 1 </ b> B includes a drive substrate 15 </ b> B that is provided for driving the display unit 8 and is bonded to the other surface of the chassis 2 via the second adhesive layer 13. Further, the display substrate extending portion 7 c that protrudes from the chassis 2 is configured on the glass substrate 7 b. Other configurations are the same as those of the first embodiment.

The drive substrate 15B is formed in a rectangular flat plate shape, and the area thereof is smaller than the area of the chassis 2, and the drive substrate 15B is disposed inside the chassis 2 when viewed from the stacking direction of the drive substrate 15B and the chassis 2. Has been. The second adhesive layer 13 is formed between the drive substrate 15 </ b> B and the chassis 2. At this time, the second adhesive layer 13 is not provided between the predetermined region and the chassis 2 from both longitudinal sides of the drive substrate 15B toward the longitudinal center.
Then, the portions of the pair of drive substrates 15 </ b> B that protrude to the outside of the second adhesive layer 13 are configured as a pair of second extending portions 15 b.

  The long sides of the glass substrates 7 a and 7 b constituting the display substrate 6 are longer than the long sides of the chassis 2. The display panel unit 5 extends from the chassis 2 on both sides of the glass substrates 7a and 7b in the longitudinal direction when viewed from the stacking direction of the chassis 2 and the display substrate 6 and passes through the first adhesive layer 3 to the chassis 2. It is joined. The portion of the glass substrate 7b that protrudes from both sides in the longitudinal direction of the chassis 2 constitutes the display substrate extending portion 7c.

  Other configurations of the organic EL display device 1B are the same as those of the organic EL display device 1A.

Next, a disassembly jig for disassembling the organic EL display device 1B will be described.
FIG. 8 is a cross-sectional view illustrating a third disassembly jig for disassembling the organic EL display device according to Embodiment 2 of the present invention and a disassembly method of the organic EL display device using the third disassembly jig. FIG. 9 is a top view of FIG. 8 viewed from the A direction. FIG. 10 is a diagram for explaining a disassembly method using a third disassembly jig of an organic EL display device according to Embodiment 2 of the present invention, using wires.

  8 and 9, the third disassembly jig 40C includes a pair of attachment members 41C that are detachably attached to the drive substrate 15B, and second bolts 51 that are screwed to the attachment members 41C.

The attachment member 41C is formed in a rectangular parallelepiped shape having a rectangular cross section.
A fitting recess 41c is formed on one surface of the mounting member 41C and extends over the entire region in the longitudinal direction of the mounting member 41C with a predetermined width and a predetermined depth. The width perpendicular to the direction along the groove of the fitting recess 41c corresponds to the thickness of the drive substrate 15B, and the mounting member 41C is fitted to the second extension portion 15b including the outer edge portion of the drive substrate 15B. The mating recess 41c can be fitted.
In addition, a plurality of screw holes 41d are formed in the attachment member 41C at intervals in the longitudinal direction of the attachment member 41C, with the hole direction aligned with the width direction of the fitting recess 41c.

  When the second extending portion 15b of the drive substrate 15B is fitted into the fitting recess 41c of the mounting member 41C, at least a part of the opening of the screw hole 41d is a display substrate extending portion of the glass substrate 7b. 7c.

The disassembly procedure of the organic EL display device using the third disassembly jig 40C is as follows.
First, the fitting recess 41c of one mounting member 41C is fitted into one second extending portion 15b of the drive board 15B, and the fitting recess 41c of the other mounting member 41C is fitted to the other second of the drive board 15B. Fit into the extension 15b. Thereby, each attachment member 41C is restricted from moving in the thickness direction of the drive substrate 15B.

  Next, the screw part 51 a of the second bolt 51 is screwed into the screw hole 41 d of the first mounting member 41 </ b> C from the side opposite to the display substrate 6 constituting the display panel unit 5. When the second bolt 51 is rotated around the axis until the tip of the screw portion 51a contacts the glass substrate 7b, the second bolt 51 is further rotated around the axis by the glass substrate 7b. Therefore, the force to screw the second bolt 51 acts in the direction of separating the panel module 4 from the mounting member 51C screwed to the second bolt 51 (in the peeling force execution step). Implementation).

That is, a predetermined force corresponding to the screwing amount of the second bolt 51 is applied to the drive substrate 15B in the direction of separating the panel module 4 joined to the mounting member 41C. Since the first bonding force is larger than the second bonding force, creep occurs in the second bonding layer 13 and the second bonding layer 13 located near the drive substrate 15B with which the tip of the second bolt 51 is in contact is formed. The drive substrate 15B and the panel module 4 are separated together with the second adhesive layer 13 by being gradually peeled off from the site.
As described above, the organic EL display device 1B is disassembled.

  Further, as shown in FIG. 10, in the disassembly method of the organic EL display device 1B using the third disassembly jig 40C, it is the same as the disassembly method of the organic EL display device 1A using the second disassembly jig 40B. The wire 50 may be used.

Next, the organic EL display devices of the third and fourth embodiments described below are prepared, and the results of disassembling the organic EL display devices of the respective embodiments using the third disassembly jig 40C will be described.
FIG. 11 is a diagram for explaining the results of disassembling the organic EL display devices according to the third and fourth embodiments of the organic EL display device according to the embodiment of the present invention, and the organic EL display devices according to the respective examples using the disassembly jig.

As shown in FIG. 11, in the organic EL display devices of Examples 3 and 4, the first adhesive layer 3 is composed of a two-liquid addition type silicone adhesive, and the second adhesive layer 13 is a thermally conductive double-sided material. What was comprised with the adhesive tape was prepared.
However, in Example 3, a double-sided adhesive tape having a bonding force between the drive substrate 15B and the second adhesive layer 13 of 60 N / cm ² is selected. In Example 4, the drive substrate 15B and the first adhesive layer 13 are selected. The double-sided pressure-sensitive adhesive tape with a bonding force of 30 N / cm ² is selected.

And the force which generate | occur | produces a creep in the 2nd contact bonding layer 13 of the organic electroluminescence display of Example 3 and Example 4 was applied with the 3rd disassembly jig | tool 40C.
As a result, the organic EL display device was disassembled so that the drive substrate 15B and the panel module 4 were separated.

In the disassembly of the organic EL display device of Example 3, the wire 50 is not used as shown in FIG. 8, and in the disassembly of the organic EL display device of Example 4, the wire 50 is used as shown in FIG. Was used.
Further, the tightening force of the second bolt 51 of the third and fourth embodiments is managed by a torque wrench or the like, and the force that causes the second adhesive layer 13 to generate creep is the first disassembly jig 40A and the second disassembly treatment. It is set to be the same as when the organic EL display device of Example 1 or Example 2 is disassembled using the tool 40B.

As a result, in the organic EL display device of the third embodiment, the second adhesive layer 13 peels from the drive substrate 15B in the entire area of the second adhesive layer 13 in 20 minutes, and the drive substrate 15B and the panel module 4 are separated. There was a separation.
In the organic EL display device of the fourth example, the drive substrate 15B and the panel module 4 were separated in 5 minutes. Further, it was confirmed that the organic EL display devices of the third and fourth examples were not damaged in the separated drive substrate 15B and the panel module 4.

Embodiment 3 FIG.
FIG. 12 is a cross-sectional view of an organic EL display device according to Embodiment 3 of the present invention.
In FIG. 12, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 12, one end of the organic EL display device 1 </ b> C is bonded to the other surface of the chassis 2 via the first support member adhesive layer 17, and the other end is second supported on the surface of the drive substrate 15 </ b> B facing the chassis 2. The organic EL display device 1A is substantially the same as the organic EL display device 1A except that it includes a support member 19 that is bonded via the member adhesive layer 18 and supports the chassis 2 and the drive substrate 15B with a gap therebetween and the second adhesive layer 13 is omitted. It is the same as that of the structure.

The support member 19 can be made of the same material as that of the chassis 2 and is made of a material such as aluminum.
The configuration of the first support member adhesive layer 17 is not particularly limited, and may be configured by curing an adhesive or a double-sided adhesive tape. When using a double-sided pressure-sensitive adhesive tape, the same type of double-sided pressure-sensitive adhesive tape that can be used for the second adhesive layer 13 described above can be used. In the case of using an adhesive, the same adhesive that can be used for the first adhesive layer 3 can be used.

  In addition, the second support member adhesive layer 18 is not particularly limited, but is preferably composed of various double-sided pressure-sensitive adhesive tapes such as rubber, silicone, and acrylic similar to the above-described second adhesive layer. .

  The bonding force of the first support member adhesive layer 17 that bonds the chassis 2 and the support member 19 is the fourth bonding force, and the second support member adhesive layer 18 that bonds the support member 19 and the drive substrate 15A. The joining force is the fifth joining force, and the fourth joining force is larger than the fifth joining force.

The fourth bonding force is a weak one of the bonding force between the first support member bonding layer 17 and the chassis 2 and the bonding force between the first support member bonding layer 17 and the support member 19.
Further, the fifth bonding force is weak among the bonding force between the second support member adhesive layer 18 and the drive substrate 15A and the bond force between the second support member adhesive layer 18 and the support member 19. Say.

  The magnitude of the joining force between the second support member adhesive layer 18 and the support member 19 and the joining force between the second support member adhesive layer 18 and the drive substrate 15A are determined by the support member 19 and the drive substrate 15A. May vary depending on material combination.

  For example, the support member 19 is made of aluminum or an aluminum alloy, the drive substrate 15A is a resin substrate such as a glass epoxy substrate generally used as an electronic circuit substrate, and the second support member adhesive layer 18 is made of the same adhesive. When the double-sided pressure-sensitive adhesive tape is configured on both sides, the bonding force between the drive substrate 15A and the second support member adhesive layer 18 is between the support member 19 and the second support member adhesive layer 18. It becomes weaker than the bonding force.

  Further, when the second support member adhesive layer 18 is a double-sided adhesive tape, by setting the adhesive force of the adhesive on both sides of the double-sided adhesive tape to an appropriate one, the material of the support member 19 and the drive substrate 15A can be used. Regardless, the magnitude of the joining force between the drive substrate 15A and the second support member adhesive layer 18 and the joining force between the support member 19 and the second support member adhesive layer 18 can be selected.

  In the organic EL display device 1C configured as described above, the fourth bonding force of the first support member adhesive layer 17 that bonds the chassis 2 and the support member 19 bonds the support member 19 and the drive substrate 15A. It is larger than the fifth bonding force of the second support member adhesive layer 18. Accordingly, when a predetermined force is applied to the drive substrate 15A in the direction in which the panel module 4 is separated, creep occurs in the second support member adhesive layer 18, and the second support member adhesive layer 18 is formed from the drive substrate 15A. The drive substrate 15A and the support member 19 can be separated by being gradually peeled off. The predetermined force for generating the creep of the second support member adhesive layer 18 may be smaller than the fifth bonding force, and damages the drive substrate 15A, the panel module 4, and the support member 19. Nor.

  At this time, when viewed from the stacking direction of the display substrate 6, the chassis 2, and the drive substrate 15A, even if there is no large work space outside the organic EL display device 1C, the direction is approximately perpendicular to the other surface of the drive substrate 15A. By using the area located in the work area as a work area and applying a force to separate the drive board 15A and the panel module 4, the drive board 15A and the chassis 2 of the panel module 4 can be separated together with the support member 19. . For example, this can be realized by using a fourth disassembly jig described below.

A disassembly jig used for disassembling the organic EL display device 1C will be described.
FIG. 13 is a diagram for explaining a fourth disassembly jig for disassembling the organic EL display device according to Embodiment 3 of the present invention and a disassembly method for the organic EL display device using the fourth disassembly jig.

In FIG. 13, the fourth disassembly jig 40 </ b> D is configured by a contact plate 61 and a jack bolt 62 as a peeling force generating means.
The jack bolt 62 includes a screw rod 62a having a length slightly shorter than the distance obtained by subtracting the thickness of the contact plate 61 from the distance between the chassis 2 and the drive board 15A, and a nut 62b screwed to the screw rod 62a. Have.

  One end surface of the nut 62b can be arranged outside the one end of the screw rod 62a in the axial direction of the screw rod 62a. That is, the jack bolt 62 can change the total length in the axial direction by the axial length of the nut 62b with respect to the axial length of the screw rod 62a.

The disassembly procedure of the organic EL display device 1C using the fourth disassembly jig 40D is as follows.
In FIG. 13, the jack bolt 62 in which one end surface of the nut 62b is arranged in advance in the axial length range of the screw rod 62a is placed in the axial direction in the direction in which the drive board 15A and the chassis 2 face each other. The drive board 15A and the chassis 2 are arranged so as to match. At this time, one end of the screw rod 62a is directed toward the chassis 2.
Further, the abutting plate 61 is disposed between the other end of the screw rod 62a and the drive substrate, the other end of the screw rod 62a is brought into contact with the abutting plate, and the nut 62b is detached from one end of the screw rod 62a. Move.

  Then, after one end surface of the nut 62b abuts on the chassis 2, when the nut is further rotated in the direction in which the nut 62b is removed from the screw rod, the movement of the nut 62b is prevented by the chassis 2, but the jack bolt 62 has a full length. The nut 62 b pressurizes the chassis 2 because it is going to change in the longer direction. This applied pressure acts in a direction to separate the drive substrate 15A and the chassis 2 from each other, and a predetermined force corresponding to the amount of protrusion of one end surface of the nut 62b from one end of the screw rod 62a is applied to the drive substrate 15A. On the other hand, the panel module 4 is applied together with the support member 19 in the direction in which the panel module 4 is separated (execution of the peeling force generation step).

  Since the fourth bonding force is larger than the fifth bonding force, creep occurs in the second support member adhesive layer 18, and the second support member adhesive layer 18 is gradually peeled off from the drive substrate 15A, so that the panel module 4 and the panel module. 4 and the drive substrate 15A are separated from each other.

Another embodiment of the disassembly jig will be described.
FIG. 14 is a diagram for explaining a fifth disassembly jig for disassembling the organic EL display device according to Embodiment 3 of the present invention and a disassembly method for the organic EL display device using the fifth disassembly jig.

In FIG. 14, the fifth disassembly jig 40E of the organic EL display device is a ball plunger as a peeling force generating means.
A ball plunger that is the fifth disassembly jig 40E includes a cylindrical housing 66, a pair of balls 67 that are disposed on one end side and the other end side of the housing 66, and that can be projected and retracted on the housing 66, and a ball There is provided a biasing means such as a spring (not shown) for biasing 67 in the direction of pulling out 67 from the housing 66.
The length of the housing 66 is slightly shorter than the distance between the drive board 15A and the chassis 2.

The disassembly procedure of the organic EL display device 1C using the fifth disassembly jig 40E is as follows.
The ball plunger is pressed in the direction in which the ball 67 is immersed in the housing 66, and the housing 66 is inserted between the drive board 15 </ b> A and the chassis 2. At this time, the ball plunger is arranged so that one ball 67 faces the chassis 2 and the other ball 67 contacts the drive substrate 15A.

  At this time, each of the pair of balls 67 is urged by the urging means to pressurize the chassis 2 and the drive board 15A. The applied pressure acts in a direction in which the chassis 2 and the drive board 15A are separated from each other, and is applied in a direction in which the panel module 4 is separated from the drive board 15A together with the support member 19 (execution of the peeling force generation step). ).

  As a result, creep occurs in the second support member adhesive layer 18, and the second support member adhesive layer 18 is gradually peeled from the drive substrate 15 </ b> A as in the case of the fourth disassembly jig 40 </ b> D, and the panel module 4 and The support member 19 joined to the panel module 4 and the drive substrate 15A are separated.

Next, organic EL display devices of Examples 5 and 6 described below are prepared, and the results of disassembling the organic EL display device using the fourth disassembly jig 40D and the fifth disassembly jig 40E are used. The results of disassembling the organic EL display device of Example 6 will be described.
FIG. 15 shows Example 5 and Example 6 of the organic EL display device according to Embodiment 3 of the present invention, Example 5 and Example using the fourth and fifth disassembly jigs, and the fourth and fifth disassembly jigs. It is a figure explaining the dismantling result of 6.

As shown in FIG. 15, in the organic EL display devices of Examples 5 and 6, the first adhesive layer is composed of a two-liquid addition type silicone adhesive, and the first support member adhesive layer 17 and the second support are formed. What comprised the member contact bonding layer 18 with the heat conductive double-sided adhesive tape was prepared.
However, in Example 5, the double-sided pressure-sensitive adhesive tape constituting the second support member adhesive layer 18 was selected to join the drive substrate 15A and the support member 19 with a joining force of 60 N / cm ² , and Example 6 Then, what selected 15 A of drive substrates and the supporting member 19 with the joining force of 30 N / cm < ² > was selected.

  Then, in the organic EL display device of Example 5, a force for generating creep on the second support member adhesive layer 18 is applied by the fourth disassembly jig 40D so that the drive substrate 15A and the panel module 4 are separated. The organic EL display device of Example 6 is disassembled, and a force that generates creep on the second support member adhesive layer 18 is applied by the fifth disassembly jig 40E so that the drive substrate 15A and the panel module 4 are separated. Dismantled. In the disassembly of the organic EL display devices of Example 5 and Example 6, no wire is used.

  The tightening force of the nut 62b of the jack bolt 62 of the fourth disassembly jig 40D is managed by a torque wrench or the like, and the force for generating creep in the second support member adhesive layer 18 is the first disassembly jig 40A. In addition, the force for generating creep in the second adhesive layer 13 when the organic EL display device 1A is disassembled using the second disassembly jig 40B is set to be the same.

  Further, the urging force of the urging means for urging the ball 67 in the fifth disassembly jig 40E is the force for generating creep in the second support member adhesive layer 18 and the first disassembly jig 40A and the first disassembly jig 40E. The force for generating creep in the second adhesive layer 13 when the organic EL display device 1A is disassembled using the two dismantling jig 40B is made substantially the same.

As a result, in the organic EL display device of Example 5, the second support member adhesive layer 18 peels from the drive substrate 15A over the entire area of the second support member adhesive layer 18 in 10 minutes, and the drive substrate 15A and the support member 19 and separated.
In the organic EL display device of Example 6, the drive substrate 15A and the support member 19 were separated in 15 minutes. In both the organic EL display devices of Example 5 and Example 6, it was confirmed that the separated drive substrate 15A, the support member 19, and the panel module 4 were not damaged.

Embodiment 4 FIG.
FIG. 16 is a cross-sectional view of an organic EL display device according to Embodiment 4 of the present invention.
In FIG. 16, the same or corresponding parts as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

In FIG. 16, the organic EL display device 1D is formed in the same manner as the organic EL display device 1C except that a plurality of through holes 15c are formed in the drive substrate 15A.
Each of the through holes 15 c is formed in a portion of the drive substrate 15 </ b> A facing the chassis 2.

According to the organic EL display device 1D configured as described above, for example, a member (not shown) inserted through the through hole 15c presses the chassis 2 with a predetermined pressure, and the member is integrated with the drive substrate 15A. If it fixes to, the force of the direction which leaves | separates the panel module 4 with which the supporting member 19 was joined from the board | substrate 15A for a drive generate | occur | produces (implementation of peeling force generation process).
As a result, creep occurs in the second support member adhesive layer 18, the second support member adhesive layer 18 is gradually peeled from the drive substrate 15A, and the drive substrate 15A and the support member 19 are joined together. The chassis 2 is separated.

In order to insert the member into the through hole 15c, the member may be inserted into the through hole 15c from the direction opposite to the drive substrate 15A. The panel module 4 and the drive substrate 15A are viewed from the stacking direction. 4 and a large work space is not required outside the drive substrate 15A.
Therefore, if the chassis 2 is pressed with a predetermined pressure by a certain method and the members are integrally fixed to the drive substrate 15A, the chassis 2 to which the display panel unit 5 and the support member 19 are joined is connected to the drive substrate. A force in a direction away from 15A is applied, and the drive module 15A and the panel module 4 to which the support member 19 is bonded can be separated.

Hereinafter, a sixth disassembly jig used for disassembling the organic EL display device will be described.
FIG. 17 is a diagram for explaining a sixth disassembly jig for disassembling an organic EL display device according to Embodiment 4 of the present invention and a disassembly method of the organic EL display device using the sixth disassembly jig.

In FIG. 17, the sixth disassembly jig 40 </ b> F includes an attachment member 41 </ b> D and a third bolt 74.
The mounting member 41D includes a rectangular flat plate-like base 71 having an area corresponding to the area of the drive substrate 15A, and L-shaped engaging portions 72 extending from both ends in the longitudinal direction of one surface of the base 71. I have. One piece of the engaging portion 72 extends perpendicularly to the base portion 71, and the other side of the engaging portion 72 extends in parallel to the base portion 71 from the one piece toward the inside of the base portion 71. In addition, screw holes 71a are formed in the base 71 at positions corresponding to the plurality of through holes 15c formed in the drive substrate 15A when the attachment member 41D is attached to the drive substrate 15A.

A fitting recess 73 is formed by the base 71 and the engaging portion 72 on both sides of the base 71 in the longitudinal direction.
The width of the cross section orthogonal to the direction along the groove of the fitting recess 73 has a width corresponding to the thickness of the drive substrate 15A. Thus, by fitting the edge of the drive substrate 15A into the fitting recess 73, the movement of the drive substrate 15A in the direction perpendicular to the drive substrate 15A is restricted. Further, the through hole 15c and the screw hole 71a are arranged at opposing positions.

  The mounting member 41D has been described as being integrally formed. However, when a large space is required outside the drive board 15A in order to fit the edge of the drive board 15A into the fitting recess 73. For example, the attachment member 41D may be configured by being divided into small sizes so as to have one fitting recess 73 and one screw hole 71a.

Moreover, the disassembly procedure of the organic EL display device using the sixth disassembly jig 40F is as follows.
First, the fitting recess 73 of the mounting member 41D is fitted into each of the first extending portion 15a and the other first extending portion 15a in the longitudinal direction of the drive board 15A.

  Next, the third bolt 74 is screwed into the screw hole 71 a from the side opposite to the support member 19. The third bolt 74 is rotated about its axis until the tip of the threaded portion of the third bolt 74 contacts the chassis 2 of the panel module 4. When the third bolt 74 is further rotated about its axis, the chassis 2 prevents the third bolt 74 from being screwed in. Therefore, the force to try to screw the third bolt 74 is screwed into the third bolt 74. Acts in the direction of separating the panel module 4 from the mounting member 41D (execution of the peeling force generation step).

That is, a predetermined force corresponding to the screwing amount of the third bolt is applied to the drive board 15A in the direction of separating the panel module 4. Since the fourth bonding force is larger than the fifth bonding force, creep occurs in the second support member adhesive layer 18, and the second support member adhesive layer 18 is gradually peeled from the drive substrate 15A, so that the panel module 4 and the panel module 4 and the drive substrate 15A are separated from each other.
As described above, the organic EL display device is disassembled.

Next, an organic EL display device of Example 7 described below is prepared, and the result of disassembling the organic EL display device of Example 7 using the sixth disassembly jig 40F will be described.
FIG. 18 is a diagram for explaining the results of disassembly of the organic EL display device according to Embodiment 7 of the present invention and the organic EL display device of Example 7 using the sixth disassembly jig.

As shown in FIG. 18, in the organic EL display device of Example 7, the first adhesive layer is composed of a two-liquid addition type silicone adhesive, and the first support member adhesive layer 17 and the second support member adhesive layer 18 are formed. Was prepared with a heat conductive double-sided adhesive tape.
However, the double-sided adhesive tape constituting the second support member adhesive layer 18 was selected to join the drive substrate 15A and the support member 19 with a joining force of 100 N / cm ² .

Then, in the organic EL display device of Example 7, a force for generating creep on the second support member adhesive layer 18 was applied by the sixth disassembly jig 40F.
As a result, the organic EL display device was disassembled so that the drive substrate 15A and the support member 19 bonded to the panel module 4 were separated.

  In the disassembly of the organic EL display device of Example 7, the tightening force of the third bolt 74 is managed by a torque wrench or the like, and the force for generating creep in the second support member adhesive layer 18 is the first disassembly. The force for generating creep in the second adhesive layer 13 when the organic EL display device 1A is disassembled using the jig 40A and the second disassembly jig 40B is set to be the same.

As a result, in 20 minutes, in the organic EL display device, the second support member adhesive layer 18 is peeled from the drive substrate 15A over the entire area, and the space between the drive substrate 15A and the support member 19 joined to the panel module 4 is separated. separated.
Further, it was confirmed that the separated drive substrate 15A, the support member 19 and the panel module 4 were not damaged.

  In each of the above embodiments, the image display device has been described as an organic EL display device. However, an image display device in which a display unit of a display substrate is configured using liquid crystal or the like may be used.

  1A to 1D Organic EL display device (image display device), 2 chassis, 3 first adhesive layer, 8 display portion, 7c display substrate extension, 12 communication member, 13 second adhesive layer, 15A, 15B drive substrate 15c Through hole, 17 First support member adhesive layer, 18 Second support member adhesive layer, 19 Support member, 40A to 40F First disassembly jig to 6 disassembly jig, 41A to 41D Mounting member, 42 First bolt (Peeling force generating means), 44 jack bolt (peeling force generating means), 45 mounting member adhesive layer, 50 wire (strip), 52 second bolt (peeling force generating means), 62 jack bolt (peeling force generating means) 66 Housing, 67 balls, 71a Screw hole, 74 Third bolt.

Claims (12)

The chassis,
A display substrate that includes a display unit that displays an image and is bonded to one surface of the chassis via a first adhesive layer;
A drive substrate provided for driving the display unit and bonded to the other surface of the chassis via a second adhesive layer;
An image display device, wherein a bonding force of the first adhesive layer for bonding the chassis and the display substrate is larger than a bonding force of a second adhesive layer for bonding the chassis and the drive substrate.   The image display device according to claim 1, wherein the second adhesive layer is made of a double-sided pressure-sensitive adhesive tape.   The double-sided adhesive tape has an adhesive force on one side and the other side so that the drive substrate and the chassis are separated from the drive substrate when a force is applied to separate the drive substrate and the chassis from each other. The image display device according to claim 2. A communication member for configuring a communication path between the drive substrate and the display unit is attached to the back surface of the display substrate facing the chassis side,
The said 1st contact bonding layer is comprised with the adhesive agent hardened | cured between the said display substrate and the said member for communication, and the said chassis, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The image display device described.   The image display device according to claim 4, wherein the adhesive is a silicone type or a modified silicone type. The chassis,
A display board that includes a display unit for displaying an image and is attached to one surface of the chassis;
One end is joined to the other surface of the chassis via a first support member adhesive layer, and the other end is joined to the surface of the drive substrate facing the chassis via a second support member adhesive layer. A support member for connecting the drive substrate with a gap,
The bonding force of the first support member adhesive layer for bonding the chassis and the support member is greater than the bonding force of the second support member adhesive layer for bonding the support member and the drive substrate. Image display device. A disassembly jig for an image display device for disassembling the image display device according to any one of claims 1 to 5,
The drive board has a first extending portion that protrudes outside the chassis,
A mounting member disposed on the surface of the display substrate so as to protrude from the outside of the chassis so as to be opposed to the first extending portion, and joined via a mounting member adhesive layer;
A peeling force generating means arranged to connect the mounting member and the drive substrate, and generating a force for pulling the display substrate and the chassis with respect to the drive substrate;
A disassembly jig for an image display device, wherein a bonding force of the attachment member adhesive layer for joining the display substrate and the attachment member is larger than a bonding force of the second adhesive layer. A disassembly jig for an image display device for disassembling the image display device according to any one of claims 1 to 5,
The display substrate has a display substrate extension that protrudes outside the chassis,
An attachment member fitted to the edge of the drive substrate and attached to the drive substrate and facing the display substrate extension;
It is disposed so as to connect the mounting member and the drive substrate, and has a peeling force generating means for generating a force for pulling the display substrate and the chassis with respect to the drive substrate. Dismantling jig for image display device. A disassembly jig for an image display device for disassembling the image display device according to claim 6,
A disassembly jig for an image display device, comprising: a peeling force generating means that is disposed between the chassis and the drive substrate and pressurizes the chassis and the drive substrate in directions opposite to each other. An image display device disassembly method using the image display device disassembly jig according to claim 7,
Attaching the attachment member to the display substrate via the attachment member adhesive layer;
An image display comprising: a peeling force generating step of generating a force to pull the display substrate and the chassis with respect to the drive substrate by the peeling force generating means to generate creep in the second adhesive layer. Method of dismantling the device. An image display device disassembly method using the image display device disassembly jig according to claim 8,
Attaching the attachment member to the drive substrate;
An image display comprising: a peeling force generating step of generating a force to pull the display substrate and the chassis with respect to the drive substrate by the peeling force generating means to generate creep in the second adhesive layer. Method of dismantling the device. An image display device disassembly method using the image display device disassembly jig according to claim 9,
The peeling force generating means generates a force that presses the drive substrate and the chassis in directions opposite to each other to generate a force that pulls the display substrate and the chassis against the drive substrate. A dismantling method for an image display device, comprising a peeling force generation step for generating creep in a layer.

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