JP2012117932A - Semiconductor testing device, diagnosis program for the same, and diagnosis method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten testing time by diagnosing units included in a semiconductor testing device to estimate a unit to be replaced.SOLUTION: A semiconductor testing device 1 for testing a DUT includes: diagnosis units 11 and 21 respectively arranged corresponding to a plurality of replaceable FRUs to perform failure diagnosis whether failures occur in the FRUs; a coverage database 31 for storing faiLure statistic information which is statistics about the possibility of FRU causing failures corresponding to the failure diagnosis; a diagnosis data generation unit 24 for generating, when the diagnosis units 11 and 21 diagnose the FRUs as having failures, diagnosis data by combining values of the failure static information corresponding to the diagnosed FRUs for each of the FRUs; and a rearrangement unit 26 for rearranging the diagnosis data in the order of the values.

Description

  The present invention relates to a semiconductor test apparatus for testing a device under test, and more particularly to a semiconductor test apparatus for diagnosing a failure of a replaceable unit provided therein, a diagnostic program for the semiconductor test apparatus, and a diagnostic method for the semiconductor test apparatus. is there.

  2. Description of the Related Art Conventionally, a semiconductor test apparatus for testing a device under test (DUT) has been used. FIG. 7 shows a hardware configuration of the semiconductor test apparatus 101, which includes a plurality of cards 102A to 102F (collectively, the card 102), a tester controller 103, and a hard disk 104.

  The card 102 has a function for performing a DUT test. For example, a pin electronics card or a digitizer is applied. The tester controller 103 is a computer that performs overall control of each card 102. The hard disk 104 is an auxiliary storage device that stores various programs and various data operating on the tester controller 103.

  As shown in FIG. 8, each card 102 has a functional block 105, and the two cards 102 are connected by connection paths AB, AC, AD, and DE. Thereby, the connection between the two functional blocks 105 is established. The two function blocks 105 connected have a relationship between the upper side and the lower side, and the upper function block 105 makes the lower function block 105 subordinate.

  In this example, the functional block 105A is on the upper side, and the functional blocks 105B, 105C, and 105D are on the lower side. The function block 105D is on the upper side, and the function block 105E is on the lower side. On the other hand, the function block 105F exists independently, and one function block 105F performs one function.

  Actually, a large number of functional blocks 105 are subordinate to one functional block 105, and the number of subordinate stages is also multistage. The plurality of functional blocks 105 in the dependency relationship fulfill one function (measurement function). In the example of FIG. 8, there are four measurement functions AB, AC, ADE, and F.

  The measurement function AB is one function realized by the function blocks 105A and 105B. Similarly, the measurement function AC is a function realized by the function blocks 105A and 105C, and the measurement function ADE is a function realized by the function blocks 105A, 105D and 105E.

  Each card 102 can be exchanged with another card 102. The tester controller 103, the hard disk 104, and each connection path are the same, and each can be replaced. The replaceable card 102, the tester controller 103, and the hard disk 104 are set as one replaceable unit (FRU: Field Replaceable Unit). That is, it becomes possible to exchange in units of FRU.

  Each FRU can cause a failure. If a failure has occurred, the failed FRU is replaced with a normal FRU to restore operation. For this purpose, for example, a self-diagnosis board is provided and self-diagnosis is performed as in Patent Document 1. The process of replacing the FRU and restoring the normal operation is performed using the measurement functions AB, AC, ADE, and F.

  The measurement functions AB, AC, ADE, and F are output to determine whether a predetermined result is obtained. If a predetermined result cannot be obtained, it is recognized that a failure has occurred in any FRU related to the measurement function based on the output result of the measurement function. When this recognition is made, the flow from steps S101 to S105 in FIG. 9 is repeated.

  First, one FRU is exchanged among FRUs related to the measurement function in which the failure is detected (step S102). Then, the fault diagnosis is performed by outputting the measurement function again and obtaining a predetermined result (step S103). For example, when the failure diagnosis is performed using the measurement function ADE, the measurement function ADE is output from the card 102A using the function blocks of the cards 102D and 105E. Based on the output result, it is determined whether or not a failure has occurred (step S104).

  If it is determined that no failure has occurred, it can be recognized that no failure has occurred in all FRUs related to the measurement function ADE. Therefore, the process ends. On the other hand, if it is determined that a failure has occurred, a failure has occurred in any FRU related to the measurement function. Therefore, the process shifts to a FRU different from the FRU exchanged in step S102 (return to step S101). Then, the flow from step S101 to S105 is repeated until it is not determined that there is a failure in step S104.

JP 2008-98230 A

  A large number of cards 102 of the semiconductor test apparatus 101 are provided, and the functional block 105 has a multistage dependency relationship. In the case of FIG. 9 in which a failure is determined using the measurement function, the flow from step S101 to step S105 is repeated until no failure is determined, so that FRU replacement is required for the number of flows. In the case of the measurement function ADE, five FRUs (function blocks 105A, 105D, 105E, connection path AD, DE) are to be exchanged, but in reality, many units are candidates.

  Therefore, in the case of a flow in which FRUs are replaced and failure diagnosis is repeatedly performed, FRU replacement work frequently occurs. Since a predetermined time is required for the replacement work, a lot of time is spent for the replacement work by repeating this. As a result, the time during which the DUT test cannot be performed using the semiconductor test apparatus 101 (downtime) becomes longer. This leads to a long test time.

  If the person has a high level of proficiency, it is possible to reduce which FRU replacement work by predicting which unit is out of the many unit candidates. However, in the case of a person with low proficiency, the downtime is also prolonged, leading to a longer test time.

  Therefore, an object of the present invention is to shorten the test time by diagnosing a unit provided in a semiconductor test apparatus and estimating a unit to be replaced.

  In order to solve the above problems, a first semiconductor test apparatus of the present invention is a semiconductor test apparatus for testing a device under test, and is provided corresponding to each of a plurality of replaceable units. A failure statistic information that is a statistic of the possibility of the unit that causes a failure in response to the failure diagnosis. A failure statistical information storage unit that stores the failure statistical information value corresponding to the unit that has performed the diagnosis for each unit when the diagnostic unit diagnoses that the unit has failed. A diagnostic data generation unit that generates diagnostic data generated by summing, and a rearrangement unit that rearranges the diagnostic data in order of values.

  According to this semiconductor test apparatus, a faulty unit is estimated with reference to the fault statistical information. Thereby, the unit which has produced the failure can be identified and replaced at an early stage. Therefore, the down time can be shortened and the test time is shortened.

  The second semiconductor test apparatus of the present invention is the first semiconductor test apparatus, and the functional unit for testing the device under test among the units applies the test to the device under test. A diagnosis unit that includes a plurality of drivers that output test signals and that performs a failure diagnosis of its own functional unit provided in the functional unit determines whether a failure has occurred by inputting the test signal from each driver. Thus, failure diagnosis of the functional unit is performed.

  According to this semiconductor test apparatus, self-diagnosis of the unit itself is performed by a diagnosis unit that can input test signals output from a plurality of drivers. Each unit needs to have a diagnostic unit for performing self-diagnosis, but one diagnostic unit can oversee a plurality of parts in one unit to perform fault diagnosis. As a result, the test time can be shortened while simplifying the hardware.

  The third semiconductor test apparatus of the present invention is the second semiconductor test apparatus, and the upper functional unit of the two functional units diagnoses a connection unit that connects the two functional units. A diagnostic data transmitter that transmits diagnostic data for the diagnostic unit, and a diagnostic unit that performs a fault diagnosis of the connection unit provided in a lower functional unit of the two functional units receives the connection unit via the connection unit A failure diagnosis is performed based on the diagnosis data.

  According to this semiconductor test apparatus, not only self-diagnosis of the function unit itself but also connection diagnosis (failure diagnosis) of the connection units that connect the function units is possible.

  A fourth semiconductor test apparatus according to the present invention is any one of the first to third semiconductor test apparatuses, wherein the failure statistical information storage unit is based on information of a unit that has failed among the units. A failure statistic information changing unit for changing a value of the stored failure statistic information is provided.

  According to this semiconductor test apparatus, by reflecting the actual failure status of the unit in the failure statistical information, the accuracy of the failure statistical information can be further improved, and the test time can be further shortened. become able to.

  A diagnostic program for a semiconductor test apparatus according to a fifth aspect of the present invention is a diagnostic program for a semiconductor test apparatus for diagnosing a semiconductor test apparatus for testing a device under test. The computer is assigned to each of a plurality of replaceable units. It is a statistics of the possibility of the unit that causes the failure corresponding to the failure diagnosis with respect to the failure diagnosis performed by the diagnosis unit that is provided correspondingly and performs the failure diagnosis of whether or not the unit has a failure. About the failure statistics information, when the diagnosis unit diagnoses that the unit has a failure, the value of the failure statistics information corresponding to the unit for which the diagnosis has been performed is generated for each unit. And functioning as diagnostic data generating means for generating diagnostic data, and rearranging means for rearranging the diagnostic data in order of values, That.

  A sixth semiconductor test apparatus diagnosis method of the present invention is a semiconductor test apparatus diagnosis method for diagnosing a semiconductor test apparatus for testing a device under test, corresponding to each of a plurality of replaceable units. A failure statistic that is a statistic of the unit that may cause a failure corresponding to the failure diagnosis, with respect to a failure diagnosis performed by a diagnosis unit that performs a failure diagnosis as to whether or not a failure has occurred in the unit. Information is stored, and when the diagnosis unit diagnoses that the unit has a failure, the diagnostic data generated for each unit is a value of the failure statistical information corresponding to the unit that has performed the diagnosis. The diagnostic data is generated and rearranged in order of values.

  According to the present invention, it is possible to estimate and display a unit having a high possibility of causing a failure among a plurality of units provided in a semiconductor test apparatus. As a result, the unit to be replaced can be identified at an early stage, and the test time can be shortened.

It is a block diagram which shows the structure of a semiconductor test apparatus. It is a figure explaining a self-diagnosis and a connection diagnosis. It is a figure which shows an example of a coverage database. It is a figure which shows an example of diagnostic data. It is a flowchart explaining the flow of a process of this invention. It is a block diagram which shows the structure of the semiconductor test apparatus in a modification. It is a block diagram which shows the hardware constitutions of a semiconductor test apparatus. It is a figure for demonstrating the dependency between each card | curd. It is a flowchart for demonstrating the flow of the conventional process.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a semiconductor test apparatus 1 of the present invention. The semiconductor test apparatus 1 includes cards 2A to 2F (collectively, card 2), a tester controller 3, a hard disk 4, and a connection path 5. The hardware configuration is the same as that shown in FIG. 7, and the card 2 (102) is connected to the tester controller 3 (103), and the tester controller 3 and the hard disk 4 (104) are connected.

  The card 2, the tester controller 3, the hard disk 4, and the connection path 5 shown in FIG. 1 can be exchanged. The replaceable card 2, the tester controller 3, the hard disk 4, and the connection path 5 constitute one unit (FRU: Field Replaceable Unit). Each FRU is replaceable.

  Therefore, the card 2 as the FRU can be exchanged with another card 2, and the tester controller 3, the hard disk 4, and the connection path 5 can be exchanged as the FRU as well. Therefore, it is possible to exchange in units of one FRU. The FRU can be easily replaced by simply inserting and removing it from the housing, and does not involve removing the circuit from the substrate.

  The card 2 is an FRU and is a functional unit used for testing a device under test (DUT). For example, a pin electronics card as a digital board for applying a test signal to the DUT and making a pass / fail judgment based on a response signal from the DUT, an analog card for generating an analog signal, a device power card equipped with a power supply, A digitizer (oscilloscope) or the like is applied as the card 2.

  In FIG. 1, six cards 2A to 2F are illustrated as an example, but may be five or less, or may be seven or more. Actually, a large number of cards 2 are provided. The card 2 includes a functional block 10 and a diagnosis unit 11. The function block 10 is a part having the function of the card 2.

  The diagnosis unit 11 is provided on each card 2. The diagnosis unit 11 diagnoses whether or not a failure has occurred in its own card 2 (self-diagnosis) or diagnoses whether or not a failure has occurred in the connection path 5 as a connection unit to which the card itself is connected ( Perform connection diagnosis). 2a shows a self-diagnosis, and b) shows a connection diagnosis.

  In FIG. 5A, the functional block 10 functions as a pin electronics card and applies a voltage to a DUT (not shown). The functional block 10 is provided with a number of drivers 13 for applying a voltage, and a test signal (voltage) is applied to the DUT from a path connected to each driver 13. The test signal path (signal path) branches in the middle, and each branched path is connected to one ADC (analog-digital converter) 15. In addition, a switch 14 is provided in each path connected to the ADC 15, and the ADC 15 is connected to the diagnosis unit 11.

  Only one of the switches 14 is turned on, and the other switches 14 are turned off. Then, the switches to be turned on are sequentially switched. As a result, the test signal output by one driver 13 is input to the ADC 15. The ADC 15 converts the input voltage from analog data to digital data. Then, digital data of voltage is input to the diagnosis unit 11.

  Therefore, the diagnostic unit 11 acquires the voltage value output from each driver 13. The diagnosis unit 11 diagnoses whether or not a failure has occurred in the driver 13 based on whether or not the value of the input voltage is a predetermined voltage. When a failure occurs in the driver 13, the function block 10 fails and the card 2 as the FRU fails. Here, the failure of the driver 13 is diagnosed as a failure of the card 2, but a part other than the driver 13 may be self-diagnosed.

  Next, connection diagnosis will be described. In FIG. 2B, the card 2A and the card 2B are connected by a connection path 5 as a connection unit (the connection path 5 between the cards 2A and 2B is a connection path AB). The diagnostic data is transmitted and received between the card 2A and the card 2B via the connection path AB.

  As in FIG. 8, the functional block 10 (corresponding to the functional block 105) of the card 2 (card 102 in FIG. 8) has a dependency relationship. The upper card 2A is subordinate to the lower cards 2B, 2C, and 2D. The upper card 2D is subordinate to the lower card 2E. On the other hand, the card 2F is provided independently without being dependent on the other cards 2.

  The connection path 5 for connecting the cards 2A and 2B is AB, the connection path 5 for connecting 2A and 2C is AC, the connection path 5 for connecting AC 2A and 2D is a connection path 5 for connecting AD, 2D and 2E Is DE. In the example of FIG. 2, the upper card 2A and the lower card 2B are connected by a connection path AB. The higher-order card 2A includes a functional block 10, a diagnostic data transmission unit 16, a multiplexer ("MUX" in the drawing) 17, and a transmitter 18.

  The diagnostic data transmission unit 16 is a diagnostic data transmission unit that transmits diagnostic data for diagnosing the connection path AB. The multiplexer 17 switches which output of the functional block 10 and the diagnostic data transmitter 16 is to be validated. Although the function block 10 is always enabled, the diagnosis data transmission unit 16 is enabled when connection diagnosis is performed. The transmitter 18 outputs the data from the multiplexer 17 to the connection path AB.

  The lower card 2 </ b> B includes a receiver 19 and a serial / parallel conversion unit 20 in addition to the functional block 10 and the diagnosis unit 11. The receiver 19 receives the data output from the transmitter 18. Since data is transferred serially from the transmitter 18, the serial / parallel conversion unit 20 converts serial data into parallel data.

  The diagnosis unit 11 inputs diagnosis data converted into parallel data. Then, based on whether or not the diagnosis data transmitted from the diagnosis data transmission unit 16 has been received normally, it is diagnosed whether or not the connection route AB is normal. Similar to the self-diagnosis, the route diagnosis may be performed by a method other than FIG.

  The tester controller 3 controls each card 2. As shown in FIG. 1, the tester controller 3 includes a diagnostic unit 21, a diagnostic control unit 22, a diagnostic result acquisition unit 23, a diagnostic data generation unit 24, a diagnostic data storage unit 25, and a rearrangement unit 26. A display device 27 such as a monitor is connected to the tester controller 3. Each unit of the tester controller 3 can be realized as a program (software) that operates on the CPU.

  The diagnosis unit 21 performs self-diagnosis as to whether the tester controller 3 has failed, and also performs failure diagnosis of the hard disk 4. The diagnosis control unit 22 controls the diagnosis unit 11 of the card 2 and the diagnosis unit 21 of the tester controller 3 to diagnose whether or not a failure has occurred in the FRU. With this control, the diagnosis units 11 and 21 perform diagnosis.

  The diagnosis result acquisition unit 23 acquires the result of diagnosis by the diagnosis units 11 and 21 (result of whether or not the FRU has failed: diagnosis result). From this diagnosis result, it is recognized whether or not the FRU to be diagnosed has a failure. The diagnosis result acquired by the diagnosis result acquisition unit 23 is output to the diagnosis data generation unit 24. The diagnostic data generation unit 24 acquires a diagnostic result, and generates diagnostic data with reference to a coverage database (coverage DB in the drawing) 31 stored in the hard disk 4.

  The coverage database 31 will be described. As shown in FIG. 3, the coverage database 31 is data arranged in two dimensions. The horizontal axis represents all FRUs constituting the semiconductor test apparatus 1. Here, a total of ten tester controllers 3, hard disks 4, cards 2A to 2F, connection paths AB, AC, AD, DE are FRUs.

  The vertical axis indicates the FRU that is the target of failure diagnosis performed by the diagnosis units 11 and 21 as a diagnosis item. Although one diagnosis item is basically provided for each FRU, a plurality of diagnoses may be performed on one FRU to obtain a diagnosis item. Accordingly, the number of diagnostic items may coincide with the total number of FRUs (10), but when two or more types of diagnosis are performed for one FRU, the number of diagnostic items may be 11 or more. . Here, a case where one diagnostic item is provided for one FRU will be described.

  Each value on the horizontal axis of the coverage database 31 is statistical information (failure statistical information) of probability indicating which FRU is likely to have a failure for one diagnostic item. Therefore, the coverage database 31 becomes a failure statistical information storage unit. Regarding the card 2, there is basically a 100% possibility that the card 2 is the cause of the failure.

  On the other hand, regarding the connection route AB, the possibility of being caused by the own connection route AB is 80%, and the possibility of being caused by the cards 2A and 2E is 10%. That is, when FRU failure diagnosis is performed, the FRU does not always cause a failure with a probability of 100%. Note that the values in the coverage database 31 in FIG. 3 are merely examples, and may be values other than those in FIG.

  When the diagnosis result acquired by the diagnosis result acquisition unit 23 is faulty, the diagnosis data generation unit 24 refers to the value of the coverage database 31 corresponding to the diagnosis item (in this case, coincides with FRU) that has been diagnosed. . Then, the values of the diagnostic items causing the failure are added together. Note that zero is added to each value when the number of diagnostic items is one.

  If there are a plurality of diagnosis items, the values of each FRU are added together for the plurality of diagnosis items. For example, when it is diagnosed that a failure has occurred using two FRUs of the card 2D and the connection path AD as a diagnostic item, the card 2D is 100% in the diagnostic item of the card 2, and the others are 0. %It has become. In the diagnosis item of the connection path AD, the failure estimation FRU is 80% for the connection path AD, 10% for the cards 2A and 2D, and 0% for the others.

  Therefore, the total value of the failure estimation FRU is 110% for the card 2D, 80% for the connection path AD, and 10% for the card 2A. Further, values other than these are 0%. The diagnostic data generation unit 24 generates these values (summed values of the failure estimation FRU) as diagnostic data. FIG. 4 shows the diagnostic data in this case.

  The diagnostic data storage unit 25 stores diagnostic data generated by the diagnostic data generation unit 24 as shown in FIG. The rearrangement unit 26 rearranges the diagnostic data stored for each failure estimation FRU in descending order of value. Then, the rearranged diagnostic data is displayed on the display device 27. In the example of FIG. 4, the card 2D is displayed as the highest possibility as 110%, the connection path AD is displayed in the order of 80%, and the card 2A is displayed in the order of 10%.

  The flow of failure diagnosis processing will be described with reference to the flowchart of FIG. First, the diagnostic data stored in the diagnostic data storage unit 25 is initialized (step S1). Thereby, all the diagnostic data for each FRU become 0%. Then, the process from step S2 to S7 is repeated until all diagnostic items are completed.

  One diagnosis item is provided for at least one FRU, and the processing from steps S2 to S7 is performed at least for the number of FRUs (10 times when FRU is 10). Here, there is one diagnostic item for each FRU, and the number of diagnostic items is also ten. Therefore, the process from step S2 to S7 is repeated 10 times.

  Under the control of the diagnosis control unit 22, the diagnosis units 11 and 21 execute failure diagnosis such as self diagnosis and connection diagnosis (step S3). Thereby, the diagnosis units 11 and 21 perform failure diagnosis. Here, one diagnosis unit 11 or 21 performs failure diagnosis for one diagnosis item. That is, any one of the card 2, the tester controller 3, the hard disk 4, and the diagnosis units 11 and 21 of the connection path 5 performs failure diagnosis.

  The diagnosis result acquisition unit 23 acquires the diagnosis result of the failure diagnosis performed by the diagnosis units 11 and 21. Then, it is determined whether or not a failure has occurred (step S3). When it is determined that no failure has occurred in this diagnostic item, the process proceeds to the next diagnostic item (return to step S2). On the other hand, when it is determined in step S4 that a failure has occurred in the diagnostic item, the value in the coverage database 31 is referred to (step S5). The diagnosis result acquisition unit 23 acquires a diagnosis result indicating whether or not a failure has occurred for a diagnosis item. Therefore, the value of each failure estimation FRU corresponding to the diagnosis item is read from the coverage database 31. And the diagnostic data is produced | generated by adding the read value for every FRU (step S6).

  The generated diagnostic data is stored in the diagnostic data storage unit 25. And it transfers to the next diagnostic item again (returns to step S2). The above steps S2 to S7 are repeated for all diagnostic items (repeated 10 times). As described above, when a failure is diagnosed in the diagnosis items of the card 2D and the connection path AD, the values of the failure estimation FRUs of the respective diagnosis items are added together, and the card 2D is 110% and the connection path AD is 80%. , The diagnostic data of FIG. 4 in which the card 2A is 10% is generated.

  After the processing from step S2 to S7 is completed for all diagnostic items, it is determined whether or not a failure has occurred in any diagnostic item (step S8). When a failure is detected in any one of the diagnostic items, the diagnostic data stored in the diagnostic data storage unit 25 is displayed on the display device 27 (step S9).

  As described above, when a failure is diagnosed in the card 2D and the connection path AD, the card 2D (110%) is displayed on the display device 27 as the most likely FRU. The operator (user) confirms the diagnostic data on the display device 27 and replaces the card 2D. Although the connection path AD is also diagnosed as a failure, there is a 10% possibility that the failure of the connection path AD is the card 2D.

  Therefore, by replacing the card 2D, it may be possible to restore normal operation by replacing the FRU once. That is, after replacing the card 2D as the FRU, the process from step S1 is started again, and the diagnosis units 11 and 21 perform failure diagnosis. If only the card 2D has a failure, no failure is detected in all diagnostic items, and no failure is detected in step S8. As a result, normal operation can be restored.

  If a failure has occurred not only in the card 2D but also in the connection path AD, a failure in only the connection path AD is detected when the diagnosis units 11 and 21 perform a failure diagnosis after replacement of the card 2D. . At this time, the card 2D is excluded from the target of failure. Therefore, since the diagnostic data is generated and displayed on the display device 27, the user recognizes that the connection path AD should be exchanged. Then, by exchanging the connection path AD, it is possible to restore normal operation by exchanging FRUs twice.

  As described above, failure diagnosis is performed for each FRU (unit), and the failure database can be recognized in descending order with reference to the coverage database that is the statistical information of the failure. As a result, the FRU to be exchanged can be estimated, and the number of FRU exchange operations can be reduced.

  Of course, since the diagnostic data is generated based on the coverage database 31 that is failure statistical information, the FRU that is regarded as the highest failure factor is not always a failure factor. However, the FRU replacement is performed compared to the case where the FRU replacement work is performed randomly (in the case where the replacement work is performed based on the measurement function described in the prior art) because the failure factors are displayed in descending order. Work can be greatly reduced.

  Next, a modified example will be described. In this modification, an input device 41 is connected to the tester controller 3, and a database changing unit (DB changing unit in the drawing) 41 is added inside the tester controller 3. Other configurations are the same as those in FIG. The input device 41 is an input means such as a keyboard or a mouse.

  The database changing unit 42 is a failure statistical information changing unit that changes the value of the coverage database 31. As described above, based on the diagnostic data displayed on the display device 27, the user replaces the FRU and performs fault diagnosis of the diagnostic item again. When it is recognized that no failure has occurred in all FRUs, it is recognized that the replaced FRU is the cause of the failure. That is, the FRU causing the failure is identified.

  The user uses the input device 41 to input information on the FRU causing the failure. Based on this information, the database changing unit 42 changes the value of the coverage database 31. For example, when it is recognized that the connection path AD is broken for the diagnosis item (connection path AD) that has been performed, the value of the connection path AD in the coverage database 31 is increased, and the other values are decreased.

  As a result, the coverage database 31 can reflect the actual operation status (failure status) of the semiconductor test apparatus 1. For this reason, the reliability of the value of the coverage database 31 and the accuracy of the diagnostic data can be improved, and the FRU to be replaced can be recognized with higher accuracy. Accordingly, it is possible to further reduce the test time.

DESCRIPTION OF SYMBOLS 1 Semiconductor test apparatus 2 Card 3 Tester controller 4 Hard disk 5 Connection path 10 Functional block 11 Diagnosis part 13 Driver 16 Diagnosis data transmission part 21 Diagnosis part 22 Diagnosis control part 23 Diagnosis result acquisition part 24 Diagnosis data generation part 25 Diagnosis data storage part 26 Sorting unit 27 Display device 31 Coverage database 41 Input device 42 Database changing unit

Claims (6)

A semiconductor test apparatus for testing a device under test,
A diagnostic unit that is provided corresponding to each of a plurality of replaceable units and that performs a fault diagnosis as to whether or not a failure has occurred in the unit;
For failure diagnosis performed by the diagnosis unit, a failure statistical information storage unit that stores failure statistical information that is a statistic of the possibility of the unit that causes a failure in response to the failure diagnosis;
When the diagnosis unit diagnoses that a failure has occurred in the unit, it generates diagnosis data generated by adding the values of the failure statistical information corresponding to the unit that has performed the diagnosis for each unit. A diagnostic data generation unit;
A rearrangement unit for rearranging the diagnostic data in order of values;
A semiconductor test apparatus comprising: The functional unit for testing the device under test among the units includes a plurality of drivers that output a test signal to be applied to the device under test for testing.
A diagnostic unit that diagnoses a failure of its own functional unit provided in the functional unit performs a failure diagnosis of the functional unit by determining whether or not a failure has occurred by inputting the test signal from each driver. thing,
The semiconductor test apparatus according to claim 1. The upper functional unit of the two functional units includes a diagnostic data transmission unit that transmits diagnostic data for diagnosing a connection unit connecting the two functional units.
The diagnosis unit that performs failure diagnosis of the connection unit provided in the lower-level function unit of the two function units performs failure diagnosis based on the diagnosis data received through the connection unit. The semiconductor test apparatus according to claim 2. 2. A failure statistical information changing unit that changes a value of the failure statistical information stored in the failure statistical information storage unit based on information of a unit that has failed among the units. 4. The semiconductor test apparatus according to any one of items 1 to 3. A semiconductor test apparatus diagnostic program for diagnosing a semiconductor test apparatus for testing a device under test,
Computer
Provided in correspondence with each of a plurality of replaceable units, and the failure diagnosis performed by the diagnosis unit that diagnoses whether or not a failure has occurred in the unit is a cause of failure corresponding to the failure diagnosis For the failure statistical information that is a possibility statistics of the unit, when the diagnosis unit diagnoses that the unit has a failure, the value of the failure statistical information corresponding to the unit that has performed the diagnosis Diagnostic data generating means for generating diagnostic data generated by adding together each of the units;
Rearranging means for rearranging the diagnostic data in order of values;
Diagnostic program for semiconductor test equipment, characterized in that A semiconductor test apparatus diagnosis method for diagnosing a semiconductor test apparatus for testing a device under test,
Provided in correspondence with each of a plurality of replaceable units, and the failure diagnosis performed by the diagnosis unit that diagnoses whether or not a failure has occurred in the unit is a cause of failure corresponding to the failure diagnosis Store failure statistics, which are statistics of the possible units,
When the diagnosis unit diagnoses that the unit has a failure, generates diagnostic data in which the value of the failure statistical information corresponding to the unit that has performed the diagnosis is generated for each unit,
The diagnostic data is rearranged in order of values. A diagnostic method for a semiconductor test apparatus.

Images