JP2012107881A - Method for manufacturing sensor device, and sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To previously prevent occurrence of a failure caused by sagging of a long flexible printed board (13) in a method for electrically connecting a first member (3) to a second member (2) by the long flexible printed board (13).SOLUTION: A chip-like attraction member (15) composed of iron is fixed to an intermediate part of an FPC (13) for electrically connecting between a housing (2) and a connector case part (3). The weight of the attraction member (15) is previously set from the standpoint of resonance prevention. One end side of the FPC (13) is connected to a pressure detection element (7) by a bonding wire (16) and the other end side is connected to a terminal (10) by soldering. Although the FPC (13) is extended in connection work and sagging may be generated on the intermediate part of the FPC (13) between the housing (2) and the connector case part (3), the intermediate part is stored in a storing recess (9a). The storing work is performed by magnetically attracting the attraction member (15) from the outside of the connector case part (3) by using a magnetic fixture.

Description

  The present invention relates to a method of manufacturing a sensor device and a sensor device including a first member, a second member, and a flexible printed circuit board that electrically connects them.

  For example, a semiconductor pressure sensor used for detecting a common rail pressure of an automobile engine has a metal (SUS) housing having a pipe portion extending downward for introducing pressure, and is coupled (joined) to the upper surface side of the housing. And a synthetic resin connector case portion. On the upper part of the connector case portion, a terminal is provided by insert molding to constitute a connector for external connection. In addition, a metal cylindrical portion having an open bottom surface is provided on the outer peripheral portion on the lower end side of the connector case portion. The connector case portion is joined by welding the lower end portion of the metal cylindrical portion to the housing.

  On the upper surface side of the housing, a pressure detecting element for transmitting the pressure of the diaphragm portion provided at the upper end portion of the pipe portion is bonded with glass. The electrical connection between the pressure detecting element and the terminal of the connector is made by a flexible printed circuit board (hereinafter abbreviated as “FPC”) in which a wiring pattern is formed on an elongated synthetic resin film. (For example, refer to Patent Document 1). In this case, one end of the FPC is bonded to the housing, and the electrode on the upper surface and the electrode of the pressure detection element are connected by a bonding wire. The electrode at the other end of the FPC is connected to the base end of the connector terminal by soldering.

JP 2000-111432 A

  By the way, when manufacturing the semiconductor pressure sensor described above, the other end portion of the FPC is connected to the connector case side (terminal) by soldering, and one end side of the FPC is bonded to the upper surface of the housing and connected by a bonding wire. Then, the procedure of welding the metal cylindrical part of a connector case with respect to a housing is taken. At this time, in order to perform the above connection work (to ensure workability), the FPC is configured in advance to be longer than the length required in the final assembly form. Therefore, in the assembled state of the semiconductor pressure sensor, the FPC is housed in the internal space between the housing and the connector case with a slack.

  However, when the FPC is housed in such a state that there is a slack, the slack portion comes into contact with the bonding wire, causing damage to the bonding wire. If the length of the FPC is relatively long, resonance may occur due to external vibration (vehicle body or engine), and may vibrate with a large amplitude. Due to the resonance, the solder connection portion, bonding wire portion, or adhesion may occur. There is a possibility that the part may be damaged greatly or the FPC itself may deteriorate.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to electrically connect a first member and a second member by a flexible printed circuit board. The present invention provides a sensor device manufacturing method and a sensor device that can prevent problems caused by sagging of a flexible printed circuit board even when there is a situation that must be configured in a scale.

  In order to achieve the above object, a method for manufacturing a sensor device according to the present invention includes a connecting step of electrically connecting a first member (3) and a second member (2) by a flexible printed circuit board (13). A sensor device (1) including an assembling step for joining the first member (3) and the second member (2) in a state in which the flexible printed circuit board (13) is housed in an internal space formed by them. 21), wherein the first member (3) has an accommodating recess (9b) for accommodating a slack portion of an intermediate portion of the flexible printed circuit board (13) so as to open in the internal space. ) Is formed, and the flexible printed circuit board (13) has an adsorbing member (15) made of a magnetic material fixed to an intermediate portion accommodated in the accommodating recess (9b), Connecting step In addition, the suction member (15) is magnetically attracted from the outside of the first member (3), so that the slack portion of the intermediate portion of the flexible printed circuit board (13) is placed in the housing recess (9b). It is characterized in that a housing step of housing is performed (invention of claim 1).

  In order to achieve the above object, the sensor device of the present invention includes a first member (3), a second member (2), and a flexible printed circuit board (13) that electrically connects them. The flexible printed circuit board (13) is configured to be long in advance for connection work, and is formed by coupling the first member (3) and the second member (2) to each other. A sensor device (1, 21) accommodated in a space, wherein the first member (3) has a slack portion at an intermediate portion of the flexible printed circuit board (13) so as to open in the internal space. A housing recess (9b) is formed, and the flexible printed circuit board (13) is located at an intermediate portion of the housing recess (9b), and is located in the first member (3). By magnetic attraction from outside Suction member made of a magnetic material for accommodating the slack portion relative to the housing recess (9b) Te (15) having characterized in that is secured (the invention of claim 6).

  In the present invention, the flexible printed circuit board (referred to as “FPC”) (13) for electrically connecting the first member (3) and the second member (2) is configured to be long in advance in connection work. For this reason, there is a situation in which a slack portion occurs in the intermediate portion. However, since the accommodation recess (9b) that opens in the internal space is formed in the first member (3), the slack portion of the FPC (13) is accommodated in the accommodation recess (9b), so that the FPC (13) The slack portion can be prevented from coming into contact with another member such as a bonding wire (16), particularly a member with low strength.

  At this time, in the joined state of the first member (3) and the second member (2), the internal space in which the FPC (13) is disposed is closed, so that the intermediate portion of the FPC (13) from the outside after joining. Cannot be moved directly. However, by adhering the attracting member (15) made of a magnetic material to the intermediate part of the FPC (13), it is possible to move the attracting member (15) and thus the intermediate part of the FPC (13) by magnetic attraction. It becomes.

  Therefore, the slack portion of the intermediate portion of the FPC (13) can be accommodated in the accommodating recess (9b) by the magnetic attractive force from the outside of the first member (3) (accommodating step). Problems caused by the slack of the FPC (13) can be prevented in advance. In addition, the operation | work (accommodation process) which accommodates the slack part of the intermediate part of FPC (13) in an accommodation recessed part (9b) is at the time of joining (1st member (3) and 2nd member (2) (assembly process). ) May be performed immediately before or after the assembly process. Furthermore, it is possible to execute the accommodating process at the same time (during execution) as the assembling process.

  In the manufacturing method of the sensor device of the present invention, the housing step is performed by sucking the adsorption member (15) from the outside of the first member (3) using a magnetic jig (18) made of a magnet. This can be carried out by entering the housing recess (9b) (invention of claim 2). At this time, it is more effective if the accommodating step is executed in the arrangement state of the first member (3) with the opening of the accommodating recess (9b) facing upward (invention of claim 3).

  In the manufacturing method of the sensor device of the present invention, the housing step is performed in a temporarily joined state in which the first member (3) and the second member (2) are aligned, and then the temporarily joined. The assembly | attachment process which couple | bonds the 1st member (3) and 2nd member (2) of a state can be performed (invention of Claim 4). Or the said accommodation process can be performed before the said assembly | attachment process, after the said assembly | attachment process, or simultaneously with the said assembly | attachment process (invention of Claim 5).

  By the way, when the sensor device (1, 21) having the above configuration is mounted on, for example, an automobile, if the FPC (13) may resonate due to vibrations of the vehicle body, the engine, etc., Problems such as damage occur. In this case, the main vibration frequency components in the automobile can be obtained experimentally, for example, and are limited to some. On the other hand, since the resonance frequency of the FPC (13) varies depending on its weight, for example, the resonance frequency can be shifted by adjusting the weight (the resonance frequency decreases as the weight increases).

  Therefore, in the sensor device of the present invention, the suction member (15) is also used as a weight for adjusting the weight of the FPC (13) to shift the resonance frequency with respect to the external vibration frequency. (Invention of claim 7). According to this, by adjusting the weight of the adsorbing member (15), the resonance frequency of the FPC (13) can be adjusted, and the FPC (13) that hardly resonates can be obtained. At this time, since the adsorption member (15) is used as a weight for adjusting the resonance frequency, a simple and inexpensive configuration can be achieved without increasing the number of parts and complicating the structure. Can do.

  Alternatively, the electronic component (22) for noise removal is mounted on the FPC (13) at the slack portion of the intermediate portion, and the electronic component (22) for noise removal is mounted on the weight of the FPC (13). Thus, the function as a weight for shifting the resonance frequency with respect to the external vibration frequency can also be used (the invention of claim 8). According to this, the resonance frequency of the FPC (13) can be adjusted by mounting the electronic component (22) for noise removal on the FPC (13) and adjusting the weight, thereby obtaining a high noise removal effect. However, the FPC (13) which is difficult to resonate can be obtained.

1 shows a first embodiment of the present invention, and is a longitudinal sectional view showing an overall configuration of a pressure sensor device A longitudinal sectional view of the pressure sensor device showing the connection process Vertical cross-sectional view of the pressure sensor device upside down showing the state during the storage process FIG. 1 equivalent view showing a second embodiment of the present invention.

  Hereinafter, a first embodiment in which the present invention is applied to a semiconductor pressure sensor device used for detecting a pressure in a fuel pipe of a common rail of an automobile engine, for example, will be described with reference to FIGS. FIG. 1 shows an overall configuration of a pressure sensor device 1 as a sensor device according to the present embodiment. As shown in FIGS. 2 and 3, the pressure sensor device 1 connects (joins) a metal (for example, SUS) housing 2 as a second member and a connector case portion 3 as a first member. Configured.

  In this case, the housing 2 includes a base portion 4 having a disk shape (ring shape having a hole at the center) and a circular pipe portion 5 having an upper end inserted into the hole. The lower surface side of the portion 4 is fixed by welding or the like. Thus, the housing 2 is configured to have a form integrally including the pipe portion 5 extending downward from the lower surface center portion of the base portion 4. Compared with the case where the entire housing 2 is manufactured as a single body, the manufacturing is simplified, and the material of the base portion 4 and the pipe portion 5 can be made different.

  The pipe portion 5 has a distal end (lower end) surface opened, and a base end portion (upper end portion) integrally provided with a diaphragm 6 so as to block the opening end portion of the pipe. Further, a threaded portion 5 a is formed on the outer peripheral portion of the pipe portion 5. Although not shown, the pressure sensor device 1 is mounted by screwing the screw portion 5a into a mounting hole having a female screw portion provided in the common rail portion. Thereby, a common rail pressure (fuel pressure) is introduced through the hollow part in the pipe part 5, and the diaphragm 6 receives the pressure and deform | transforms.

  A pressure detection element (semiconductor pressure sensor chip) 7 is bonded to the center of the upper surface of the housing 2 (the upper surface portion of the diaphragm 6) via an adhesive glass 8, and the pressure of the diaphragm 6 is transmitted. It has become so. Although not shown in detail, as is well known, the pressure detecting element 7 forms a strain gauge formed by bridge-connecting four piezoresistors on a silicon chip, and has an amplifier circuit integrated therein. It has three electrodes (power supply, ground, signal output) on the right side in FIG.

  On the other hand, as shown in FIGS. 1 to 3, the connector case portion 3 is made of a synthetic resin molded product such as PPS, for example, and has a cylindrical block-shaped body portion 9 and a cylindrical shape extending upward from the body portion 9. The connector housing 9a is integrally provided, and for example, the three terminals 10 and the metal cylindrical portion 11 are integrally provided by insert molding. The connector housing 9a and the terminal 10 constitute a connector 12 for electrical connection with the outside (for example, an engine control unit (ECU)).

  The metal cylindrical portion 11 has a circular opening at the center at the upper end surface of a thin cylindrical body that opens on the lower surface side and is configured to be slightly smaller in diameter than the outer diameter of the housing 2 (base portion 4). The ring-shaped part which has has the form which has integrally. The cylindrical metal part 11 is insert-molded so that the body part is in close contact with the outer peripheral surface of the body part 9 and the ring-like part is embedded in the body part 9. The lower end portion of the body portion of the metal cylindrical portion 11 is positioned so as to extend downward from the lower surface of the body portion 9.

  As will be described later, the housing 2 and the connector case 3 are assembled by joining (joining) the lower end portion of the metal cylindrical portion 11 to the upper surface of the base portion 4 of the housing 2 by, for example, welding. At this time, an internal space is formed between the lower surface side of the body portion 9 and the upper surface of the housing 2 so that the outer peripheral side is closed by the metal cylindrical portion 11. Components such as the pressure detection element 7 and an FPC described later are arranged.

  The three terminals 10 (only one is shown) are formed in a pin shape extending in the vertical direction, and the lower part thereof is insert-molded in a form embedded in the body part 9, and the upper end part is the connector housing. 9a. The lower ends of the three terminals 10 protrude downward from the lower surface of the body portion 9 by a slight amount. The body 9 is formed with a housing recess 9b that is located near the outer periphery on the right side in FIG. The accommodating recess 9b has a rectangular cross section and is formed to have a size that accommodates an intermediate portion (slack portion) of the FPC described later.

  The pressure detection element 7 and the connector 12 (three terminals 10) are electrically connected by a flexible printed circuit board 13 (hereinafter abbreviated as “FPC 13”) disposed in the internal space. . As is well known, the FPC 13 is configured by forming a wiring pattern 13a such as a copper foil on the surface of a polyimide film, for example. In this embodiment, the FPC 13 is formed in an elongated strip shape as a whole, and three wiring patterns 13a (only one is shown) are provided extending in parallel in the longitudinal direction.

  Although not shown in detail, on the one end side surface portion of the FPC 13, three electrodes for connection with the pressure detecting element 7 are provided continuously to each wiring pattern 13a, and on the other end side, Three through holes for connection to the terminals 10 are provided to be connected to the wiring patterns 13a. Further, a chip capacitor 14 for noise removal (constituting a noise filter) is mounted in the middle part of the FPC 13 (portion close to the through hole). A chip-like adsorption member 15 made of a magnetic material such as iron is fixed to an intermediate portion of the FPC 13 by a method such as adhesion or soldering. The adsorption member 15 has a weight set in advance from the viewpoint of preventing resonance.

  As will be described in the following description of the operation (process description of the manufacturing method), the FPC 13 has a back surface on one end side bonded to the right side portion of the pressure detecting element 7 on the upper surface of the housing 2, and ends of each wiring pattern 13 a. These electrodes and each electrode of the pressure detecting element 7 are electrically connected by a bonding wire 16. On the other hand, the other end side of the FPC 13 is bonded to the lower surface of the body portion 9 of the connector case portion 3 in a state where the other end side of the FPC 13 is folded to the upper left side in FIG. Further, the base end portion of each terminal 10 is passed through each through hole and connected to each wiring pattern 13a by soldering (soldering portion 17).

  And since FPC13 is elongate, a slack part arises in the intermediate part of FPC13 arrange | positioned in the internal space between the housing 2 and the connector case part 3, but the intermediate part is accommodated in the accommodation recessed part 9a. It has come to be. At this time, the operation of accommodating the intermediate portion of the FPC 13 in the accommodating recess 9a is performed by magnetically attracting the adsorption member 15 fixed to the intermediate portion of the FPC 13 from the outside of the connector case portion 3, and finally. The adsorbing member 15 is positioned at the bottom (upper end) in the housing recess 9a.

  Next, the operation of the above configuration will be described. In manufacturing the pressure sensor device 1 having the above configuration, first, the connector case portion 3 (having the terminal 10 and the metal cylindrical portion 11 by insert molding) as the first member is manufactured. At the same time, a housing 2 (a member obtained by welding the pipe portion 5 to the base portion 4 and bonding the pressure detection element 7) as the second member is manufactured. Further, an FPC 13 to which the adsorbing member 15 is fixed is prepared.

  Next, a connection step is performed in which the housing 2 and the connector case 3 are electrically connected by the FPC 13. In this connection step, as shown in FIG. 2, after one end of the FPC 13 is bonded to the upper surface of the housing 2, wire bonding is performed between each electrode of the pressure detection element 7 and each electrode of the FPC 13. At the same time, the other end side of the FPC 13 is bonded to the lower surface of the body portion 9 of the connector case portion 3 (in FIG. 2, the upper surface of the connector case portion 3 is inverted), and each terminal 10 is connected to each through hole of the FPC 13. Solder through. At this time, in order to ensure the workability of the connection described above, the FPC 13 is configured to be long enough to cause a slack portion in the intermediate portion in the assembled state.

  Then, after the connecting step, the housing 2 and the connector case portion 3 are in a temporarily joined (temporarily fixed) state in which the lower end portion of the metal cylindrical portion 11 is placed in alignment with the outer peripheral portion of the upper surface of the housing 2. In this state, an accommodating step of accommodating an intermediate portion (slack portion) of the FPC 13 with respect to the accommodating recess 9b is performed. As shown in FIG. 3, the housing step is performed with the housing 2 and the connector case 3 turned upside down, that is, with the connector case 3 disposed so that the opening of the housing recess 9b faces upward. Is done.

  In this housing step, the attracting member 13 fixed to the intermediate portion of the FPC 13 is magnetically applied from the outside (in this case, the lower side) of the connector case portion 3 using, for example, a magnetic jig 18 made of a permanent magnet. As shown in FIG. As a result, the suction member 13 is moved into the interior of the housing recess 9b, and the suction member 13 is moved toward the bottom of the housing recess 9b. At this time, it can be expected that the attracting member 13 smoothly enters the interior of the housing recess 9b by the action of gravity in addition to the magnetic attractive force.

  In this way, by moving the suction member 13 fixed to the FPC 13, the intermediate portion of the FPC 13 is accommodated in the accommodating recess 9b, and the slack is eliminated. Then, the assembly | attachment process which couple | bonds the housing 2 made into the temporary joining state and the metal cylindrical part 11 of the connector case part 3 by welding is performed. Thus, as shown in FIG. 1, the pressure sensor device 1 in which the pressure detection element 7 and the FPC 13 are accommodated in the internal space formed by the housing 2 and the connector case portion 3 is completed.

  According to the present embodiment, even if the FPC 13 that electrically connects the housing 2 and the connector case 3 is configured to be long in advance in connection work, the body of the connector case 3 By accommodating the intermediate portion of the FPC 13 in the accommodating recess 9b formed in the accommodating recess 9b, it is possible to prevent the slack portion of the FPC 13 from coming into contact with the bonding wire 16 and adversely affecting it. be able to.

  At this time, in the joined (temporary joined) state between the housing 2 and the connector case portion 3, the internal space in which the FPC 13 is disposed is closed, and thus the intermediate portion of the FPC 13 cannot be directly moved from the outside. However, in this embodiment, the adsorbing member 15 made of a magnetic material is fixed to the intermediate portion of the FPC 13, so that it is adsorbed by the magnetic attraction force by the magnetic jig 18 from the outside of the connector case portion 3 in the housing process. The member 15 and thus the intermediate portion of the FPC 13 can be moved and accommodated in the accommodating recess 9b. As a result, it is possible to prevent problems caused by sagging of the FPC 13 beforehand.

  By the way, although the pressure sensor device 1 of this embodiment is mounted on an automobile, if the FPC 13 resonates due to vibrations of the vehicle body or the engine (common rail), the bonding wire 16 or soldering is performed. Problems such as damage to the electrical connection parts such as the part 17 occur. In this case, the main vibration frequency components in the automobile can be obtained experimentally, for example, and are limited to some. On the other hand, since the resonance frequency of the FPC 13 varies according to its weight, the resonance frequency can be shifted from the above-mentioned several main vibration frequencies by adjusting the weight.

  Therefore, in the present embodiment, the weight of the FPC 13 is adjusted by adjusting the weight of the FPC 13 by setting the weight of the suction member 15 so as to obtain an appropriate resonance frequency (experienced to cause resonance) that is experimentally obtained in advance. A function as a weight for shifting the resonance frequency with respect to the vibration frequency is also used. According to this, by adjusting the weight of the adsorbing member 15, it is possible to obtain the FPC 13 that does not easily resonate. Since the attracting member 15 is used as a weight for adjusting the resonance frequency, a simple and inexpensive configuration can be achieved without increasing the number of components or complicating the structure.

  FIG. 4 shows the configuration of the pressure sensor device 21 according to the second embodiment of the present invention. The difference from the pressure sensor device 1 of the first embodiment is that the housing 2, the connector case portion 3, and the like. The FPC 13 is electrically connected to each other. That is, the FPC 13 is provided with a noise removing chip capacitor 14 and, for example, an iron adsorbing member 15 for executing a housing process, as in the first embodiment. In addition, a plurality of chip components 22 that are electronic components for noise removal are provided at an intermediate portion (slack portion) of the FPC 13. As the chip component 22, a chip capacitor, a chip resistor, a chip diode for preventing static electricity, or the like can be employed. These chip components 22 also function as weights for adjusting the weight of the FPC 13 and shifting the resonance frequency with respect to the external vibration frequency.

  According to the second embodiment, similarly to the first embodiment, the adsorbing member 15 made of a magnetic material is fixed to the intermediate portion of the FPC 13 so that the intermediate portion of the FPC 13 is accommodated in the accommodating recess in the accommodating step. 9b can be accommodated, and problems due to sagging of the FPC 13 can be prevented in advance. In addition to this, by adjusting the weight by mounting the chip component 22 on the FPC 13, the resonance frequency of the FPC 13 can be adjusted, and an FPC 13 that hardly resonates while obtaining a higher noise removal effect is obtained. be able to.

  In the first embodiment, the housing step of housing the intermediate portion of the FPC 13 in the housing recess 9b is performed before the joining (assembly step) between the housing 2 and the connector case portion 3. You may perform after an assembly | attachment process, and it is also possible to perform an accommodation process simultaneously with an assembly | attachment process (under execution). Moreover, in each said Example, although the material (magnetic material) of the adsorption | suction member 15 was comprised from iron, you may employ | adopt another magnetic material or a permanent magnet. At this time, the magnetic jig 18 for moving the attracting member 15 is not limited to a permanent magnet, but may be provided with an electromagnet. When the attracting member is made of a permanent magnet, it is made of a magnetic material such as iron. It is also possible to do.

  Furthermore, in each of the above embodiments, the present invention is applied to the semiconductor pressure sensor device. However, in addition to pressure detection, various applications and detections such as detection of other mechanical quantities and temperatures, detection of specific substances, and the like. It can be applied to the target sensor device. In addition, various changes can be made to the specific configurations of the first member and the second member, and various methods such as brazing, caulking, and screwing can be used for the joining method. The present invention can be implemented with appropriate modifications within a range not departing from the gist of the invention.

  In the drawings, 1 and 21 are pressure sensor devices (sensor devices), 2 is a housing (second member), 3 is a connector case portion (first member), 7 is a pressure detection element, 9 is a body portion, and 9b is a housing recess. 10 is a terminal, 12 is a connector, 13 is a flexible printed circuit board, 13a is a wiring pattern, 14 is a chip capacitor, 15 is a suction member, 16 is a bonding wire, 18 is a magnetic jig, and 22 is a chip component (electronic component). Show.

Claims (8)

A connecting step of electrically connecting the first member (3) and the second member (2) by the flexible printed circuit board (13);
A sensor device (1) including an assembling step for joining the first member (3) and the second member (2) in a state in which the flexible printed circuit board (13) is housed in an internal space formed by them. , 21)
The first member (3) is formed with an accommodation recess (9a) for accommodating a slack portion of an intermediate portion of the flexible printed circuit board (13) so as to open in the internal space.
An adsorbing member (15) made of a magnetic material is fixed to the flexible printed circuit board (13) at an intermediate portion accommodated in the accommodating recess (9b).
After the connecting step, the suction member (15) is magnetically attracted from the outside of the first member (3), whereby the slack portion of the intermediate portion of the flexible printed circuit board (13) is removed from the housing recess (9b). The manufacturing method of the sensor apparatus characterized by performing the accommodation process accommodated in.   In the housing step, the suction member (15) is sucked from the outside of the first member (3) by using a magnetic jig (18) made of a magnet so as to enter the housing recess (9b). The method for manufacturing a sensor device according to claim 1, wherein the method is performed.   The method for manufacturing a sensor device according to claim 2, wherein the housing step is executed in a state in which the first member (3) is disposed with the opening of the housing recess (9b) facing upward.   The housing step is performed in a temporarily joined state in which the first member (3) and the second member (2) are aligned, and then the first member (3) and the second member in the temporarily joined state are performed. The method for manufacturing a sensor device according to any one of claims 1 to 3, wherein an assembling step for coupling the member (2) is performed.   The sensor device according to any one of claims 1 to 3, wherein the housing step is performed before the assembly step, after the assembly step, or simultaneously with the assembly step. Manufacturing method. A first member (3), a second member (2), and a flexible printed circuit board (13) that electrically connects them are provided, and the flexible printed circuit board (13) is preliminarily used for connection work. A sensor device (1, 21) configured to be elongated and accommodated in an internal space formed by the first member (3) and the second member (2) in a coupled state,
The first member (3) is formed with an accommodation recess (9b) for accommodating a slack portion of an intermediate portion of the flexible printed circuit board (13) so as to open in the internal space.
The flexible printed circuit board (13) is positioned at an intermediate portion accommodated in the accommodating recess (9b), and is magnetically attracted from the outside of the first member (3) to the accommodating recess (9b). On the other hand, an adsorbing member (15) made of a magnetic material for accommodating the slack portion is fixed.   The suction member (15) also functions as a weight for adjusting the weight of the flexible printed circuit board (13) to shift the resonance frequency with respect to an external vibration frequency. Item 7. The sensor device according to Item 6. On the flexible printed circuit board (13), an electronic component (22) for noise removal is mounted on the slack portion of the intermediate portion,
The noise removing electronic component (22) also functions as a weight for adjusting the weight of the flexible printed circuit board (13) and shifting the resonance frequency with respect to the external vibration frequency. The sensor device according to claim 6.

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