JP2012102368A - Device for wiping hot-dip plated wire, and method for wiping hot-dip plated wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for wiping a hot-dip plated wire and a method for wiping the hot-dip plated wire, in which a wiping member used for squeezing out surplus hot-dip plated metal does not deteriorate and which allows stable wiping for a long time when the surplus hot-dip plated metal is squeezed out from the surface of the hot-dip plated wire pulled from a plating bath.SOLUTION: In the device for wiping a hot-dip plated wire, the wiping member 7 has a through-hole 8 through which the hot-dip plated wire 5 passes, the radius of a circle (inscribed circle 10) touching internally the through-hole 8 in the cross section perpendicular to the axial direction of the through-hole 8 is lager by 0.02 mm or more than the radius of the plated wire 5, the surface 9 of the through-hole 8 is made of a metal (wiping member metal), and the wiping member metal is a metal good in wettability to the hot-dip plated metal. An intermetallic compound layer 13 is formed in a gap between the through-hole 8 and the hot-dip plated wire 5, and the surplus hot-dip plated metal 14 is squeezed out from the surface of the hot-dip plated wire 5 by the intermetallic compound layer 13.

Description

  The present invention relates to a wiping apparatus and a wiping method for removing excess hot dip plated metal on the surface of a hot dip wire.

  A metal wire used in a corrosive environment is subjected to molten metal plating on the surface in order to impart corrosion resistance. Examples of metal wires include iron wires, steel wires, non-ferrous metal wires, and alloy wires. Further, examples of the hot metal plating include hot dip galvanizing and galvanizing alloy containing Al at an arbitrary ratio.

  In molten metal plating of metal wires, immerse the metal wires in a hot-dip metal bath, attach the hot-dip metal to the surface of the metal wire, and then pull up to adjust the thickness of the plated metal layer attached to the surface of the metal wire To do.

  When relatively thick plating is applied to the surface of the metal wire, when the metal wire is pulled up from the hot dipping bath, the metal wire is pulled up vertically, and the amount of hot-dip metal deposited on the surface of the metal wire can be adjusted by the pulling speed of the metal wire. . The higher the pulling speed, the greater the remaining amount of hot-dip plated metal and the thicker the plating thickness. When attempting to make the plating thickness relatively thin in the category of thick plating, the pulling speed of the metal wire is slowed down. Furthermore, regarding the case of reducing the plating thickness, Patent Document 1 discloses a method of controlling the amount of molten metal attached using a drawing die. Ceramics are preferred as the material for the drawing die. Further, in Patent Document 2, a square hole shape is formed in the center by two U-shaped plate pieces, a wire pulled up from the hot-dip plating layer is passed through the square hole shape, and the hot-dip metal is changed into a hole shape. After the squeezing, the plated metal is uniformly and thickly coated around the wire by surface tension. As the U-shaped plate material, a molten metal and an alloy or a metal that hardly reacts is used. Patent Document 3 discloses a method for controlling the thickness of the hot-dip plating deposited by gas wiping. Those described in Patent Documents 1 to 3 can be applied as a plating thickness control method in relatively thick plating with a plating thickness of about 30 μm or more.

  In the case of thin metal plating with a thickness of 10 to 20 μm in molten metal plating of metal wire, excess hot-dipped metal is removed by using a drawing die and making the die diameter of the drawing die equal to the plating wire diameter after plating. The method of doing is known (patent documents 4 and 5). However, in these methods, it is necessary to pass a metal wire through a drawing die hole that is approximately equal to the diameter of the metal wire before starting the operation, and workability is inferior. In addition, foreign matter may get caught in the slight gap between the metal wire and the drawing die hole, and the surface of the plated wire may be wrinkled. Further, the core wire before plating is welded, projected, and burred when the coil is connected. Etc., and the cross-sectional shape is not necessarily constant. Therefore, when manufacturing a thin hot-dip galvanized wire, there is a concern about the occurrence of disconnection.

When the metal wire to be plated comes into contact with the hot dipped metal bath, the metal constituting the metal wire and the plated metal may form an intermetallic compound. For example, when an iron wire is used as the metal wire and zinc is used as the plating metal, an intermetallic compound such as ζ phase (FeZn ₁₈ ), δ ₁ phase (FeZn ₇ ) is formed. When the metal wire is immersed in the plating bath, an intermetallic compound layer is formed on the surface of the metal wire, and when it is pulled out from the hot dipping bath, a solid intermetallic compound layer is formed on the surface of the metal wire with an appropriate thickness. Molten plating metal adheres to the surface. Therefore, as a method of performing thin plating, a method of forming an intermetallic compound layer on the surface of a metal wire in a plating bath, pulling up from the plating bath, and scoring the molten plated metal layer is used. After squeezing, a solid intermetallic compound layer remains, and this intermetallic compound layer becomes a plating layer. By controlling the thickness of the intermetallic compound layer, it is possible to accurately control the thickness of the plating layer in the case of thin plating. As a method of scoring the molten metal, a heat resistant material made of wire, glass wool, heat resistant resin fiber, etc., such as an aramid fiber yarn, is wound around a metal wire pulled up from a hot dipping bath, or a pad made of these materials is made to face. A method is adopted in which the plated wire is sandwiched and the adhered molten metal is scraped off (see Patent Document 6). In particular, the pad method is suitable for manufacturing a thin-plated hot-dip wire because it can increase the line speed.

JP 2000-282205 A Japanese Utility Model Publication No. 47-38018 JP 2002-88460 A Japanese Utility Model Publication No. 50-107710 JP-A-53-125234 JP 2008-214680 A

  In the above method, an intermetallic compound layer is formed on the surface of a metal wire in a hot dipping bath, and a pad made of a heat-resistant resin fiber or the like is pressed against the surface of the pulled-up metal wire to scrub the molten metal layer. For example, when wiping is continued for a long time, an aramid fiber may be carbonized by heat to decrease in strength and fall off the pad. Therefore, there is a problem that a part of the pad adheres to the hot dip wire and deteriorates the surface quality.

  The present invention provides hot dip wiping that can be stably wiped for a long time without deterioration of the wiping member used for wiping when the hot dip plating metal is scraped from the surface of the hot dip wire pulled up from the plating bath. An object of the present invention is to provide a wire wiping apparatus and a hot dip wiping method.

That is, the gist of the present invention is as follows.
(1) A wiping device for removing surplus hot dip plated metal on the surface of a hot dipped wire, the wiping device having a wiping member 7, and the wiping member 7 having a through hole 8 through which the hot dipped wire 5 passes. The radius of a circle inscribed in the through hole in the cross section perpendicular to the axial direction of the through hole 8 (hereinafter referred to as “inscribed circle 10”) is 0.02 mm or more larger than the plating wire radius, and the surface of the through hole 8 9 is a metal (hereinafter referred to as “wiping member metal”). The wiping member metal has a wetting angle of 90 ° when a flat wiping member metal is applied with zinc chloride ammonium and brought into contact with a hot dipped metal. A hot-dip wiping device for a hot-dip plated wire, which is a metal as follows
(2) The distance between the through-hole surface 9 and the center 11 of the inscribed circle 10 in any part of the through-hole in the circumferential direction is within the cross section perpendicular to the axial direction in part or all of the through-hole 8 in the axial direction. The wiping device for a hot dipped wire according to the above (1), wherein the radius is +3.0 mm or less.
(3) The hot dip wiping apparatus for hot-dip plated wire as described in (1) or (2) above, wherein steel other than stainless steel is used as the wiping member metal instead of the prescription based on the wetting angle.
(4) The melting according to any one of (1) to (3) above, wherein the wiping member 7 can be divided into a plurality of pieces along the dividing surface 18, and the dividing surface 18 passes through the through hole 8. Plating wire wiping device.
(5) The galvanized wire wiping apparatus according to (4), wherein the plurality of divided wiping members are pressed against each other with a pressing force of 250 N or less.
(6) The hot-dip wiping device for hot-dip plated wire as described in any one of (1) to (5) above, wherein the length of the through hole 8 is 5 to 150 mm.
(7) A stopper 6 is further provided. When the hot-dip plated wire 5 is passed through the through hole 8 of the wiping member 7, the stopper 6 is positioned downstream of the wiping member 7, and the wiping member 7 contacts the stopper 6. The galvanized wire wiping device according to any one of (1) to (6), wherein the wiping device is disposed so as to be in contact with each other.
(8) The method according to any one of (1) to (7), which is used for wiping a hot-dip plated wire in which a ratio of an intermetallic compound in a plating layer of the hot-dip wire is 90% or more in area ratio Wiping equipment for hot-dip plated wire.
(9) Using the hot dip wiping apparatus according to any one of (1) to (7) above, an antioxidant is applied to the through hole surface 9 of the wiping member 7, and the through hole 8 of the wiping member is applied to the through hole 8. A method for wiping a hot-dip plated wire, comprising passing the hot-dip plated wire 5 which has passed through a hot-dip plating bath.
(10) About the plating layer of the hot-dip plated wire cooled after wiping, the ratio of the intermetallic compound is 90% or more in area ratio. Wiping method.
(11) The galvanized wire wiping method according to (10) above, wherein the core wire 1 to be plated is a steel wire and the plating metal is zinc.

  The present invention relates to a wiping apparatus for removing surplus molten plated metal on the surface of a hot dip plated wire, wherein the wiping member has a through hole through which the hot dip plated wire passes, and the size of the through hole is made larger than that of the hot dip plated wire. The surface of the through-hole uses a hot-dip metal and a metal with good wettability, so an intermetallic compound layer is formed in the gap between the through-hole and the hot-dip plated wire. Since excess hot-dip plated metal is scraped off from the surface, the wiping member used for scraping is not deteriorated, and stable wiping is possible for a long time.

It is the schematic which shows the hot dipping line of a metal wire. It is a schematic perspective view which shows the wiping apparatus of this invention, (a) is the condition which is wiping, (b) shows the condition which divided | segmented the wiping member. It is a figure which shows the shape of various wiping members, (a) is a monolithic structure and a through-hole is circular, (b)-(d) is a 2 division | segmentation structure, and each through-hole is circular, a triangle, a rectangle, (e) ( f) is a schematic view showing a cross section of the wiping member. It is a figure which shows the relationship between the shape of the through-hole of a wiping member, and the shape of a hot dipped wire. It is sectional drawing explaining the intermetallic compound layer formed in the clearance gap between a through-hole and a hot dipped wire. It is sectional drawing which shows the condition which scoops off the excess hot-dip metal from the surface of a hot-dip wire by the intermetallic compound layer formed in the clearance gap between a through-hole and a hot-dip wire. It is a figure which shows the division | segmentation condition of a wiping member. It is a figure explaining the wiping apparatus of this invention using a stopper. It is a figure explaining the wiping method of this invention.

  The wiping apparatus of the present invention can be used in a hot dipping line for metal wires as shown in FIG. The core wire 1 is immersed in the hot dipping bath 4 and pulled up from the hot dipping bath 4 through the sinker 3. Since there is no need to pull the metal wire (hot-plated wire 5) pulled up from the hot-dip plating bath in the vertical direction, the hot-dip wire 5 can be lifted obliquely from the hot-dip bath 4 as shown in FIG.

  The present invention is applicable to a plating method in which an intermetallic compound layer is formed on the surface of a core wire in a plating bath, pulled out from the hot dipping bath, and the hot dipped metal layer is squeezed out as a method of performing thin plating.

  The present invention will be described with reference to FIGS. The wiping device of the present invention has a wiping member 7, the wiping member 7 has a through hole 8 through which a hot dipped wire 5 passes, and the surface 9 of the through hole is metal (wiping member metal). As shown in FIG. 6, when the hot dip plating wire 5 that has passed through the hot dip plating bath 4 passes through the through hole 8 of the wiping member 7 as shown in FIGS. Further, the hot-dip plated metal 14 adhered to the surface of the intermetallic compound layer 12 is scraped off, and the intermetallic compound layer 12 remains on the surface of the plated wire after passing through. It becomes a plating layer.

  A radius 30 of a circle inscribed in the through hole in a cross section perpendicular to the axial direction of the through hole 8 of the wiping member 7 (hereinafter also simply referred to as “inscribed circle 10”) is larger than the plating wire radius 31 by 0.02 mm or more. To do. In the present invention, the circle inscribed in the through hole (inscribed circle 10) means a circle having the largest radius among the circles in which the entire circle is contained in the through hole. FIG. 4A shows an inscribed circle 10 when the through hole 8 has a square cross-sectional shape. As shown in FIG. 4B, when the cross-sectional shape of the through hole 8 is a perfect circle, the shape of the through hole and the inscribed circle 10 coincide. The plating wire radius 31 refers to the target radius of the plating wire. It means the radius of the plated wire after the intermetallic compound layer 12 is formed on the core wire 1 and the surface of the hot-dip plated metal is scraped off. In the drawing die conventionally used for wiping, the inner diameter of the die hole shape is made equal to the diameter of the plating wire, and excess molten metal on the surface of the plating wire is removed by the drawing die. In the through hole of the wiping member of the present invention, the radius of the circle inscribed in the through hole (inscribed circle 10) is larger than the plating wire radius as described above. Can not. In the present invention, the surface 9 of the through hole 8 of the wiping member is a metal (wiping member metal), and a metal having good wettability with a hot dipping bath is selected as the wiping member metal. “Wettability is good” refers to a case where the wet angle is 90 ° or less when the hot-dip metal is brought into contact with a planar metal surface activated. In activating the metal surface, the metal surface cannot be easily used unless it is a metal that is easily activated by a flux usually used in brazing. In the present invention, if zinc zinc chloride is used as a standard as a flux, and a metal whose wettability is improved when this flux is applied and then contacted with a hot dipped metal, it can be used favorably as a wiping member metal. .

  When the hot-dip plating wire that has passed through the hot-dip plating bath passes through the through hole of the wiping member, the hot-dip plating metal adhering to the hot-dip plating wire surface comes into contact with the wiping member metal, and the hot-dip plating metal and the wiping member metal are wet. Since the property is good, both adhere to each other and get wet. An intermetallic compound layer is formed at the interface between the core wire of the hot dipped wire and the hot dipped metal. When the hot-dip plated wire started to pass through the through-hole, the gap between the hot-dip plated wire and the through-hole was filled with hot-dip plated metal. The gap between the holes is replaced by the intermetallic compound. It is considered that a part of the intermetallic compound formed on the surface of the passing hot-dip wire remains in the through hole and gradually accumulates. Further, if a metal that forms an intermetallic compound with a hot dip metal is selected as the wiping member metal, the intermetallic compound is supplied into the hot dip metal from the wiping member metal side. When the gap between the hot dipped wire and the through hole is replaced by the intermetallic compound in this way, the gap between the hot dipped wire 5 and the through hole 8 is filled as shown in FIG. The deposited intermetallic compound layer 13 is rubbed and rubbed against the intermetallic compound layer 12 formed on the surface of the hot dipped wire, and the surface of the intermetallic compound layer 13 on the through hole side forms a smooth cylindrical shape, The inner diameter of the cylinder becomes equal to the outer surface diameter of the intermetallic compound layer 12 of the hot dipped wire. As a result, as shown in FIG. 6, the intermetallic compound layer 13 deposited on the through-hole side exhibits a function of scoring the molten plated metal 14 deposited on the surface of the molten plated wire. Thus, on the surface of the hot dipped wire 5 that has passed through the through hole 8, the intermetallic compound layer 12 formed on the surface of the wire remains before entering the through hole, and the hot dipped metal layer deposited thereon. 14 is removed to form a hot dip plated wire with a plating layer having a predetermined thickness.

  What is important in the present invention is that the wiping member metal forming the surface 9 of the through hole and the hot dipped metal get wet. If the wettability is not good, the hot-dip plated metal on the hot-plated wire surface does not stay in the through-hole, and therefore the intermetallic compound layer 13 is not formed in the through-hole and the function of scouring is not exhibited. For example, when the material forming the surface of the through hole is ceramic, the ironing function is not exhibited. Moreover, even if the surface of the through hole is a metal, the ironing function is not exhibited unless the surface of the through hole is wet with the hot-dip metal. The flux is applied to the surface of the through hole before passing the hot dip plated wire, and then the hot dip plated wire is passed, so that the surface of the through hole is activated and the ironing function is exhibited.

  As described above with reference to FIG. 4, the radius 30 of the circle inscribed in the through hole (inscribed circle 10) in the cross section perpendicular to the axial direction of the through hole of the wiping member is larger than the plating wire radius 31 by 0.02 mm or more. To do. If the radius 30 of the inscribed circle is too close to the plating wire radius 31, foreign matter may be caught in the slight gap between the metal wire and the through-hole, and the surface of the plating wire may be wrinkled. . In addition, since sufficient molten plating metal cannot enter between the wiping member and the core wire at the initial stage of the plating process, the intermetallic compound layer 13 for scoring the molten metal is not formed, and wiping is not performed. The plating surface may be uneven and the appearance may be impaired. If the radius 30 of the inscribed circle is larger than the plating wire radius 31 by 0.02 mm or more, such inconvenience does not occur. It is more preferable that the radius 30 of the inscribed circle is larger than the plating wire radius 31 by 0.05 mm or more.

  On the other hand, if there is a part where the distance between the plated wire 5 and the surface 9 of the through hole is too large at any part of the through hole 8 in the circumferential direction, the gap between the plated wire 5 and the through hole 8 at that part. In some cases, the intermetallic compound layer 13 is not sufficiently formed, and wiping cannot be performed sufficiently. If the distance 32 from the center 11 of the inscribed circle of any part of the surface of the through hole in the circumferential direction perpendicular to the axial direction of the through hole is equal to or less than the plating wire radius +3.0 mm, the plated wire and the through hole The intermetallic compound layer 13 is sufficiently formed in the gap between the two and the wiping can be sufficiently performed. It is more preferable that the distance from the center of the inscribed circle in any part of the through hole surface in the circumferential direction is equal to or less than the plating wire radius +1.0 mm.

  As a cross-sectional shape of the through hole in a cross section perpendicular to the axial direction of the through hole, the radius of the inscribed circle is within a preferable range, and the distance between the surface of the through hole and the center of the inscribed circle is within a preferable range. For example, the invention can be implemented in any shape. A quadrangular shape (FIG. 3D), a triangular shape (FIG. 3C), or the like can be employed. On the other hand, the most preferable shape as a cross-sectional shape of the through hole in a cross section perpendicular to the axial direction of the through hole is a circular shape (FIGS. 3A and 3B). By making the cross-section of the through-hole a circle, the distance between the surface of the hot-dip plated wire passing through the through-hole and the surface of the through-hole can be the same distance at any location in the circumferential direction of the hot-dip plated wire. This is because the formation state of the intermetallic compound layer in the gap between the hot dipped wire and the through hole can be made uniform. If the cross-sectional shape of the through hole is a circle, the radius of the through hole is equal to the radius of the circle inscribed in the through hole (FIG. 4B), and the distance 32 between the surface of the through hole and the center of the inscribed circle is any Even at the place, the inscribed circle radius 31 is equal.

  Further, in the axial direction of the through-hole, the cross-sectional size of the through-hole does not have to be constant as shown in FIG. 3 (e), but the through-hole cross-sectional size in the axial direction of the through-hole as shown in FIG. 3 (f). The shape may change. In this case, the radius of the inscribed circle needs to be 0.02 mm or more than the plating wire radius in any part in the axial direction of the through hole. The effect of the present invention can be exhibited as long as the portion has a cross-sectional shape whose distance from the center of the inscribed circle is a plating wire radius +3.0 mm or less.

  As described above, the wiping member metal may be any material as long as the metal has good wettability with the hot dipping bath. By the way, the hot-dip galvanized steel wire is most commonly a hot-dip galvanized steel wire using a steel wire as a core wire and zinc as a plating metal. Steel can be used for the wiping member metal as an inexpensive metal having good wettability with the molten zinc bath. If it is steel except stainless steel, since an intermetallic compound is formed between the galvanizing baths which contacted, it is suitable also in that respect. By using the most commonly used ammonium zinc chloride as the flux, the surface can be easily activated and wetted with the hot dipping bath. However, among the steels, stainless steel is not preferable as a wiping member metal because the oxide on the surface cannot be removed by a flux that is usually used.

  When the hot dip metal is zinc, copper, a copper alloy, zinc, or a zinc alloy can also be used as the wiping member metal in addition to steel excluding stainless steel.

  The entire wiping member of the present invention may be made of a wiping member metal, or only a portion of the wiping member that is in contact with the surface of the through hole may be made of a wiping member metal.

  The intermetallic compound layer 13 filled in the gap between the hot-dip plated wire 5 and the through hole 8 has a very strong bond with the metal surface of the through hole 8, and the strength of the intermetallic compound layer 13 itself. Therefore, the intermetallic compound layer 13 does not fall off from the wiping member 7 during the wiping operation, and therefore does not fall off and adhere to the hot-dip plated wire, and the surface properties of the plated wire are not deteriorated.

  In the production of a hot-dip plated wire in which the present invention is intended to form an intermetallic compound layer on the surface of a metal wire in a plating bath, pull up from the plating bath and squeeze the molten plated metal layer, Since the melting point is higher than the temperature of the hot dipped metal bath, the intermetallic compound layer deposited in the gap between the through hole of the wiping member and the hot dipped wire does not melt and flow out, and the surplus molten metal on the surface of the plated wire is good Can be wiped.

  The entire wiping member 7 of the present invention can be integrally formed as shown in FIG. In the present invention, the wiping member can be divided into a plurality of parts along the dividing surface 18, and the dividing surface 18 preferably passes through the through hole 8. In deciding the direction of the dividing surface 18 around the through hole 8, in order to wipe the plating thickness so that the plating thickness is uniform in the circumferential direction of the hot dipped wire, the dividing surface 18 is uniform in the cross section perpendicular to the through hole 8. It is preferable to arrange | position. In a preferred example shown in FIG. 7A, the wiping member is divided into two parts having two dividing surfaces in the direction of 180 ° around the through hole. In a preferred example shown in FIG. 7B, the wiping member is divided into three parts having three dividing surfaces in the direction of 120 ° around the through hole. In a preferable example shown in FIG. 7C, the wiping member is divided into four parts having four dividing surfaces in the direction of 90 ° around the through hole. Even when the direction of the divided surfaces deviates from equality, it is permissible if the difference between the maximum value and the minimum value of the angles between the divided surfaces is 10 ° or less. Since the wiping member can be divided into a plurality of parts and the dividing surface passes through the through-hole, the wiping member is divided before the start of wiping, and the wiping members are combined so as to wrap the molten plating wire at the start of wiping. To do. As a result, it is not necessary to perform the operation of passing the hot-dip wire into the through-hole, so that wiping can be started quickly.

  After assembling the divided wiping members, the wiping members may be bonded to each other using bolts or the like. In the present invention, preferably, the plurality of divided wiping members are pressed against each other with a pressing force of 250 N or less. When the welded part of the seam part of the core wire to be hot-plated passes through the wiping member, the core wire may be broken or the wiping member may be damaged when the portion where the diameter of the core wire is locally increased is wiped. There is. If the pressing force between the divided wiping members is 250 N or less, the wiping member can escape when a joint portion having a large diameter passes locally, which can prevent disconnection and the like. On the other hand, if the pressing force between the wiping members is too weak, the intermetallic compound layer is formed in the gap between the through hole and the hot dipped wire during the hot dip wiping operation. Excessive penetration between the plated wire and the through hole may result in non-uniform wiping in the direction of the wire. If the pressing force between the divided wiping members is 10 N or more, wiping can be performed satisfactorily without such a phenomenon. As a means for applying a pressing force to the divided wiping members, a pressing force load means 15, for example, pinching with a spring (FIG. 7 (a)), tightening with a screw, etc., at a portion other than the through hole through which the wiping members are connected. Pressed against.

  In order to perform wiping satisfactorily in the present invention, it is necessary that the axial direction of the through hole of the wiping member coincides with the axial direction of the plating wire that passes therethrough. When the axial direction of the through hole and the axial direction of the plating wire are inclined with respect to each other, unevenness in the longitudinal direction may occur on the surface of the plating wire, and the surface properties may be impaired. For example, when the wiping member is disposed so as to abut on a stopper, which will be described later, the direction of the wiping member is determined by the stopper, so that the axial direction of the through hole can easily coincide with the axial direction of the plating wire. Furthermore, if the axial length of the through hole 8 (thickness in the through hole axial direction of the wiping member) is secured, the direction of the through hole follows the direction of the plating wire, so that the axial direction of the through hole is further increased. It becomes easy to match with the axial direction of the plating wire. If the axial length of the through hole is 5 mm or more, the direction of the through hole can be determined satisfactorily. On the other hand, if the axial length of the through-hole is too long, the friction between the hot-dip plated wire and the through-hole will increase, causing vibration in the hot-wired wire during operation and impairing the surface properties. is there. It is preferable that the length of the through hole in the axial direction is 150 mm or less because such a phenomenon is not caused.

  As shown in FIG. 1, the hot dipped wire 5 pulled up from the hot dipping bath 4 passes through a wiping member 7 and is wiped. As a method for arranging the wiping member 7 of the present invention, as shown in FIGS. 2 and 8, the stopper 6 is further provided, and when the hot-dip plated wire 5 is passed through the through hole 8 of the wiping member 7, the stopper 6 is provided. Is located on the downstream side of the wiping member 7 and is arranged so that the wiping member 7 abuts against the stopper 6. The surface 23 of the stopper that comes into contact with the wiping member is flat, and the stopper 6 is fixed with the surface 23 perpendicular to the hot-dip plating line direction. The stopper 6 is provided with a slit 22, and the stopper fixing position is determined so that the direction 17 of the hot dip plated wire 5 is the position of the slit 22. The width of the slit 22 is preferably larger by 10 mm or more than the diameter of the hot dipped wire 5. This is to prevent contact between the stopper and the hot dipped wire when the hot dipped wire is displaced or vibrated in the horizontal direction during operation. The slit 22 is preferably U-shaped by notching the upper part or the lower part in consideration of workability during the passage of the hot dipped wire. The material of the stopper 6 is not particularly defined, but stainless steel such as SUS304 is suitable. The end surface 21 that contacts the stopper 6 of the wiping member 7 is also planar and the end surface 21 is perpendicular to the axial direction of the through hole 8. When the hot-dip plated wire 5 starts to be pulled up at a predetermined speed while the hot-dip plated wire 5 passes through the through-hole 8 of the wiping member, the wiping member 7 is hot-dip plated by the frictional force between the through-hole 8 and the hot-dip plated wire 5. It moves with the line 5 and comes into contact with the stopper 6. After the contact, the wiping member 7 comes into contact with the stopper 6 and stays at that position, and the hot-dip plated wire 5 passes through the through-hole 8 of the wiping member. Even if there is a slight change in the passage position of the hot dipped wire, the wiping member changes its position corresponding to the change in the position of the hot dipped wire while contacting the stopper. Since the surface 23 of the stopper that comes into contact with the wiping member is oriented perpendicular to the hot dip plating line direction, the axial direction of the through hole always coincides with the hot dip plating wire axial direction even if the position of the wiping member changes. The galvanized wire smoothly passes through the through hole and can be wiped well.

  As the wiping operation is continued for a long time, a part of the intermetallic compound inside the through-hole of the wiping member develops only partly and becomes a protrusion, so that the surface of the hot dip wire is streaked. There is a case. In such a case, the protrusion can be scraped off by rotating the wiping member around the central axis of the plating wire while the wiping member is in contact with the stopper during the hot-dip wire passing. It is possible to continue the wiping operation.

  During the wiping operation, the wiping member in contact with the stopper is subjected to a drag force N from the stopper, a frictional force F generated along the passage of the hot-dip plated wire, and a gravity W of the wiping member itself, as shown in FIG. Hot dip wire may vibrate. However, the wiping member of the present invention is in contact with the stopper by the frictional force F acting in the direction of the hot-dip plated wire, and slides along the stopper contact surface following the vibration of the hot-plated wire. Is possible. Therefore, according to the present invention, the hot dipped wire can be passed through the hot dipped wire without receiving any resistance other than the frictional force from the wiping member, for example, stress acting perpendicularly to the direction of the wire passing. Occurrence can be prevented.

  The present invention is applied to wiping in which an intermetallic compound layer 12 is formed on the surface of a core wire in a hot dipping bath, and the hot dipped metal layer is squeezed from the surface of the hot drawn hot dipped wire. Therefore, the plating layer of the hot-dip plated wire cooled after wiping is characterized in that the proportion of the intermetallic compound is 90% or more in terms of area ratio. Moreover, it is suitable for wiping of a hot-dip plated wire having a plating thickness of 50 μm or less. More preferably, the plating thickness is 30 μm or less.

  In the wiping method using the wiping apparatus of the present invention, the function is exhibited only when the hot-dip metal gets wet with the surface of the through hole of the wiping member. In general, the metal surface of the wiping member constituting the surface of the through hole is inactivated by forming an oxide film. In this state, it cannot wet with the hot dipped metal. In the present invention, an antioxidant is applied to the surface of the through hole of the wiping member, and then the hot dip plated wire that has passed through the hot dip plating bath is passed through the through hole of the wiping member. By applying the antioxidant, the oxide film of the wiping member metal on the surface of the through-hole is removed and activated, and the wet plating metal can be wetted. As the antioxidant, zinc ammonium chloride is most preferred. Other antioxidants include boric acid, potassium fluoride, lithium chloride, zinc chloride, sodium fluoride, rosin flux, non-rosin organic flux (amine / amide, organic halogen, organic acid), etc. Can be used.

  The hot dip wiping method of the present invention exhibits an excellent effect when the core wire to be plated is an iron wire or a steel wire and the plated metal is zinc or a zinc alloy such as Zn-Al. In this case, it is preferable to use a steel other than stainless steel as the wiping member metal. This is because steel and molten zinc have good wettability, and further, they react to form an intermetallic compound at the contact interface between steel and molten zinc. Further, by making the wiping member made of steel, there is an advantage that it is easy to process and can be manufactured at low cost.

The present invention was applied when hot-dip galvanizing or hot-dip Zn alloy plating was applied to JIS SWRM6K and SWRS77A steel wires having a diameter of 3.17 mmφ as core wires. In Table 1, those listed as Fe ₁ to "core" column is SWRM6K, those described as Fe ₂ are SWRS77A.

  The core wire was mechanically descaled from a 5.5 mmφ hot-rolled steel wire, and then cold drawn using a dry lubricant to 3.17 mmφ. After the cold wire drawing, the core wire was washed to remove the dry lubricant remaining on the surface, pickled and washed with water, and further subjected to flux treatment in an ammonium zinc chloride aqueous solution and dried. Thereafter, as shown in FIG. 1, the core wire 1 was immersed in a hot dipping bath 4 and pulled up via the sinker 3. As the hot dip plating bath, those described as “Zn” in Table 1 are hot dip galvanized plating, and those described as “Zn alloy” in Table 1 are those containing 10% Al, with the balance being Zn. It is. The hot dipping bath temperature was 450 ° C., and the immersion time in the hot dipping bath was 10 seconds. During immersion in the hot dipping bath, a lead intermetallic compound layer 13 having a thickness of about 15 μm is formed on the surface of the core wire.

  As shown in FIG. 1, the molten metal on the surface of the hot-dip plated wire was scraped off using the wiping device 2 for the hot-dip wire 5 pulled up from the hot-dip bath 4. Comparative Example No. In any of the examples except 2, the stopper 6 shown in FIGS. 2 and 8B was provided. A SUS304 stainless steel plate with a thickness of 5 mm is used as the stopper 6, a slit 22 is provided, and the hot dipped wire 5 passes through the slit 22, and the surface 23 of the stopper 6 is fixed so as to be perpendicular to the hot dipped wire 5 direction. did.

  As the wiping member 7, as shown in FIGS. 3B to 3D, a member divided into two parts and having a through-hole cross-sectional shape of a circle, a square, or an equilateral triangle was used. As shown in FIG. 7A, a spring was used as the pressing force applying means 15 and the pressing force was applied with the pressing force shown in Table 1. At the beginning of wiping, zinc chloride ammonium was applied as an antioxidant to the portion of the through hole of the divided member, and these were attached to the hot-dip plated wire 5 and combined. The width of the wiping member (the length in the direction orthogonal to the line direction) is 30 mm, and the length in the line direction is as shown in Table 1.

  As the material of the wiping member, the material described as “Fe” in Table 1 uses JIS SS400 steel, the material described as “Cu” uses JIS C1020, and the material described as “Zn” uses JIS H2107. Zinc ingots specified in JIS R7211 are used for those described as “carbon”, and heat resistant by an underwater quenching method specified in JIS R1615 is used for those described as “ceramics”. A silicon nitride ceramic having an impact property of 650 ° C. was used, and what was described as “WC-Co” was a cemented carbide in which WC particles used for ordinary die drawing were bonded with Co. Those described as SUS304 and SUS310 are those standard stainless steels. What was described as “Aramid fiber-Teflon (registered trademark) resin pad” was a method in which the pads made of this material were opposed to each other, the plated wire was sandwiched, and the adhered molten metal was scrubbed. For wiping members other than “Aramid fiber-Teflon (registered trademark) resin pad”, zinc chloride ammonium was applied to the surface of the surface of the member, and then contacted with hot dip galvanized metal at 450 ° C. to determine the wetting angle. evaluated. Table 1 shows the wetting angle of 90 ° or less as “◯” and the other as “×”.

  Table 1 shows the values of “inscribed circle radius−plating wire radius” and “maximum distance from the center of the inscribed circle to the surface of the through hole−plating wire radius” for the size of the through hole. When the shape of the inscribed circle is a circle, the radius of the through hole, the radius of the inscribed circle, and the maximum distance from the center of the inscribed circle to the surface of the through hole are all the same value. The plating wire radius is 1.6 mm.

  A method for evaluating the wiping device will be described.

  About “visual evaluation”, about 100 m of the hot-dip galvanized wire after wiping was sampled, visually observed for color tone and gloss, and the presence or absence of wrinkles, protrusions, and irregularities on the surface of the hot-dip galvanized wire was determined by using a tentacle. “Gloves of tentacles” is a method of inspecting the surface properties by an inspector holding a gloves and grabbing a plated wire and sliding the wire in the hand. When the surface of the plating wire has more than 20 fluffs (fibers) due to rough skin of the plated wire, the color tone and luster of the surface of the hot-dip plated wire are visually observed even when the fluff is less than 20 places. Or, when it changed clearly in the longitudinal direction, or when it touched the plating wire directly by hand and felt irregularities in the circumferential direction or the longitudinal direction, it was evaluated as Δ, and when it did not apply to any of the above, it was evaluated as ○. △ and ○ are acceptable.

  Invention Example No. About 1-4, 10-13, the thing of the suitable conditions of this invention was used as a wiping apparatus, and it was able to continue operation stably for a long time in a state with very few vibrations during operation. In addition, the hot dip plated wire was not wrinkled, no irregularities were formed, and no change in color tone occurred.

  Invention Example No. 5 to 9 are examples in which the acceptable level is reached although it is not within the preferred conditions of the present invention under any condition. Invention Example No. No. 5 is a preferred example until the intermetallic compound layer 13 is formed between the through hole and the plating wire because the difference between the inscribed circle radius of the through hole and the plating wire radius is 5 mm, which is larger than the preferred range of the present invention. More time was required, and the thickness of the plating layer immediately after the start of hot dipping was slightly increased. Invention Example No. In No. 6, the length of the wiping member in the line-passing direction is longer than the preferred range of the present invention, and vibration in the line-passing direction may occur in the hot-dip plated wire during operation. Invention Example No. No. 7 is that the length of the wiping member in the wire passing direction is shorter than the preferred range of the present invention, and the direction of the through hole may not sufficiently follow the direction of the plated wire, and the plated wire surface may be uneven. It was. Invention Example No. No. 8, the pressing force of the wiping member is stronger than the preferred range of the present invention, and when the welded portion of the seam portion of the core wire to be hot-plated passes through the wiping member, the squeezing force is too great and unevenness of the hot-dip wire surface is generated. There was a thing. Invention Example No. In No. 9, the pressing force of the wiping member was weaker than the preferred range of the present invention, and the hot-dip plated metal entered excessively between the plated wire and the through-hole, and the wiping in the through-wire direction was sometimes uneven.

  Comparative Example No. No. 1 has a difference between the inscribed circle radius of the through hole and the hot dip plated wire radius of only 0.01 mm, and foreign matter may be caught in the slight gap between the plated wire and the through hole, and the surface of the plated wire may be wrinkled. Moreover, since the intermetallic compound layer 13 was not formed between the through hole and the hot dipped wire, the plating surface was uneven, and the visual evaluation result was x. Comparative Example No. 2 is a conventional example in which an aramid fiber-Teflon (registered trademark) resin pad is used as a wiping member, and the pad is carbonized by heat due to heat for a long time and the strength is reduced, and a part of the pad is dropped and melted. Since it adhered to the plating wire, the visual result was x. Comparative Example No. In all of Nos. 3 to 7, since the wettability of the wiping member was insufficient, the intermetallic compound layer 13 was not formed in the through hole, and the molten plated metal adhered to the surface of the molten plated wire could be sufficiently scraped off. The visual evaluation result was x.

DESCRIPTION OF SYMBOLS 1 Core wire 2 Wiping apparatus 3 Sinker 4 Hot dipping bath 5 Hot dipping wire 6 Stopper 7 Wiping member 8 Through hole 9 Surface of through hole 10 Inscribed circle 11 Center of inscribed circle 12 Intermetallic compound layer (attached to core wire)
13 Intermetallic compound layer (attached to wiping member)
14 Hot-dip plated metal 15 Pressing force loading means 17 Line direction 18 Dividing surface 21 End surface 22 Slit 23 Surface 30 Radius of inscribed circle 31 Radius of plated wire 32 Distance between surface of through-hole and center of inscribed circle

Claims (11)

A wiping device for removing surplus hot-dipped metal on the surface of hot-dipped wire,
The wiping device has a wiping member, the wiping member has a through hole through which a hot dipped wire passes, and is a circle inscribed in the through hole in a cross section perpendicular to the axial direction of the through hole (hereinafter referred to as “inscribed circle”). The surface of the through hole is a metal (hereinafter referred to as “wiping member metal”), and the wiping member metal is a planar wiping member metal. A galvanized wire wiping apparatus, which is a metal having a wetting angle of 90 ° or less when a zinc-plated ammonium chloride is applied and a metal-plated metal is brought into contact therewith.   The distance between the surface of the through-hole and the center of the inscribed circle in any part of the circumferential direction of the through-hole in a part or all of the axial direction of the through-hole is perpendicular to the axial direction. The hot-dip wiping device for hot-dip plated wires according to claim 1.   The wiping member wiping apparatus according to claim 1 or 2, wherein steel other than stainless steel is used as the wiping member metal in place of the regulation by the wetting angle.   4. The hot dip wiping apparatus according to claim 1, wherein the wiping member can be divided into a plurality of parts along a dividing surface, and the dividing surface passes through the through hole.   5. The hot dip wiping apparatus for hot-dip plated wires according to claim 4, wherein the plurality of divided wiping members are pressed against each other with a pressing force of 250 N or less.   6. The hot dip wiping device according to claim 1, wherein the length of the through hole is 5 to 150 mm.   Furthermore, it has a stopper, and when the hot-dip plated wire is passed through the through-hole of the wiping member, the stopper is located on the downstream side of the wiping member, and the wiping member is arranged so as to contact the stopper The hot dip wiping device according to any one of claims 1 to 6.   The wiping of a hot dipped wire according to any one of claims 1 to 7, wherein the hot dipped wire is used for wiping a hot dipped wire whose area ratio is 90% or more. apparatus.   The hot dip wiping device according to any one of claims 1 to 7, wherein an antioxidant is applied to the surface of the through hole of the wiping member, and the molten metal that has passed through the hot dip plating bath to the through hole of the wiping member. A wiping method for a hot-dip galvanized wire, characterized by passing a galvanized wire.   The method of wiping a hot-dip galvanized wire according to claim 9, wherein the ratio of the intermetallic compound to the plating layer of the hot-dip galvanized wire cooled after wiping is 90% or more in area ratio.   The method of wiping a hot dipped wire according to claim 10, wherein the core wire to be plated is a steel wire and the plated metal is zinc.

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