JP2012089339A - Sealing jig and device sealing method - Google Patents

Sealing jig and device sealing method Download PDF

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JP2012089339A
JP2012089339A JP2010234756A JP2010234756A JP2012089339A JP 2012089339 A JP2012089339 A JP 2012089339A JP 2010234756 A JP2010234756 A JP 2010234756A JP 2010234756 A JP2010234756 A JP 2010234756A JP 2012089339 A JP2012089339 A JP 2012089339A
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sealing
sheet
jig
pressure
sensitive adhesive
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Kazue Uemura
和恵 上村
Yoshitomo Ono
義友 小野
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Lintec Corp
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Lintec Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

PROBLEM TO BE SOLVED: To provide a sealing jig and a device sealing method which can easily seal a device such as an organic electroluminescence (EL) element without large-scale equipment and even in a place, like an inside of a glove box, where a work range is restricted.SOLUTION: A sealing jig for sealing a device by attaching a sealing sheet on the device, comprises a plurality of pillars in the vicinity of one end of the jig, and a recessed portion having an opening of which depth is equal to or less than the thickness of the device and on which the device can be placed. A device sealing method is provided by using the sealing jig.

Description

本発明は、封止シートを貼付してデバイスを封止するために用いる封止用治具、及び、デバイス封止方法に関する。   The present invention relates to a sealing jig used for sealing a device by attaching a sealing sheet, and a device sealing method.

近年、有機エレクトロニクスは、塗布法や印刷法を用いて、室温に近い低温で、フレキシブルな透明プラスチック基板上に、ディスプレイ、回路、電池等を形成できる技術として注目されており、さまざまな有機デバイスの研究開発が進められている。例えば、有機エレクトロルミネッセンス(EL)素子は、低電圧直流駆動による高輝度発光が可能な発光素子として、液晶ディスプレイやELディスプレイへの適用が注目されている。
しかしながら、有機EL素子は、一定時間駆動すると、発光輝度、発光効率、発光均一性の発光特性が初期に比べて劣化するという問題がある。劣化の原因としては、有機EL素子内に侵入した酸素や水分による電極の酸化や有機発光素子材料の変性、駆動時の熱による有機発光素子材料の酸化分解等が挙げられる。そこで、水分や酸素との接触を避けるために、有機EL素子を封止材により封止することが検討されている。
In recent years, organic electronics has attracted attention as a technology that can form displays, circuits, batteries, etc. on flexible transparent plastic substrates at low temperatures close to room temperature using coating and printing methods. Research and development is ongoing. For example, organic electroluminescence (EL) elements are attracting attention for application to liquid crystal displays and EL displays as light-emitting elements capable of high-luminance emission by low-voltage direct current drive.
However, when the organic EL element is driven for a certain period of time, there is a problem that the light emission characteristics of light emission luminance, light emission efficiency, and light emission uniformity are deteriorated compared to the initial stage. Causes of deterioration include oxidation of the electrode due to oxygen and moisture entering the organic EL element, modification of the organic light emitting element material, oxidative decomposition of the organic light emitting element material due to heat during driving, and the like. Therefore, in order to avoid contact with moisture and oxygen, it has been studied to seal the organic EL element with a sealing material.

有機EL素子を封止するための方法は確立されていないが、例えば、中空部分を有するガラス製の封止材の周囲を、該素子に接触しないように接着剤で貼付して封止する方法が挙げられる。しかしながら、該封止方法では封止に時間がかかることと、封止材が高価であることが問題となる。
一方、有機EL素子と封止シートとを貼り合わせてラミネートする等の封止方法も考えられる。封止シートは、封止用粘着剤層と基材とからなる積層シートであり、上記ガラス封止材よりも安価である点で好ましい。
有機EL素子等のデバイスの封止は、作業中に該デバイス内に水分や酸素が侵入しない条件下で行うことが望ましい。例えば、不活性ガス雰囲気下、減圧条件で封止を行う方法及び装置が知られている(特許文献1参照)。しかしながら、減圧条件下で封止を行うには、真空チャンバー等の大掛かりな装置が必要となる。
そこで、窒素やアルゴン等の不活性ガス雰囲気にしたグローブボックス内で該デバイスの封止を行う方法も考えられる。しかしながら、グローブボックス内では作業範囲が著しく制限されるため、該デバイスと封止シートの位置合わせを行って貼り合わせるという精密な作業を行うには困難が伴う。特に、封止枚数が多い場合には膨大な時間と労力を要する。
そこで、封止シートを貼付してデバイスを封止するための、簡易でかつ容易な封止用治具の開発が望まれている。
Although a method for sealing an organic EL element has not been established, for example, a method of sealing by adhering the periphery of a glass sealing material having a hollow portion with an adhesive so as not to contact the element Is mentioned. However, this sealing method has problems that it takes time to seal and that the sealing material is expensive.
On the other hand, a sealing method such as laminating and laminating an organic EL element and a sealing sheet is also conceivable. The sealing sheet is a laminated sheet composed of a sealing pressure-sensitive adhesive layer and a substrate, and is preferable in that it is cheaper than the glass sealing material.
It is desirable to seal a device such as an organic EL element under conditions that prevent moisture and oxygen from entering the device during operation. For example, a method and an apparatus that perform sealing under reduced pressure conditions in an inert gas atmosphere are known (see Patent Document 1). However, in order to perform sealing under reduced pressure conditions, a large apparatus such as a vacuum chamber is required.
Therefore, a method of sealing the device in a glove box in an inert gas atmosphere such as nitrogen or argon is also conceivable. However, since the working range is remarkably limited in the glove box, it is difficult to perform a precise work of aligning and bonding the device and the sealing sheet. In particular, a large amount of time and labor are required when the number of sealed sheets is large.
Then, development of the simple and easy sealing jig | tool for sticking a sealing sheet and sealing a device is desired.

特開2007−035514号公報JP 2007-035514 A

本発明は、大掛かりな装置を使用することなく、かつグローブボックス内のように作業範囲が制限された場所においても、有機EL素子等のデバイスを封止シートによって簡便に封止できる封止用治具、及びデバイス封止方法の提供を目的とする。   The present invention provides a sealing treatment capable of easily sealing a device such as an organic EL element with a sealing sheet without using a large-scale apparatus and in a place where the work range is limited as in a glove box. An object is to provide a device and a device sealing method.

本発明は、(1)封止シートをデバイスに貼付してデバイスを封止するための封止用治具であって、上記治具の一端部近傍に複数の支柱を有し、上記デバイスの厚み以下の深さであって上記デバイスの載置が可能な開口部を有する凹部を設けた封止用治具、及び、(2)封止シートをデバイスに貼付してデバイスを封止する方法であって、一端部近傍に複数の支柱を有し、上記デバイスの厚み以下の深さであって上記デバイスの載置が可能な開口部を有する凹部を設けた封止用治具の前記凹部に上記デバイスを載置し、上記支柱を挿通できる複数の挿通穴を有し上記挿通穴以外の部分に上記封止シートを仮接着させた粘着シートの上記挿通穴に、上記支柱を挿通させて、上記封止シートと上記デバイスとを対向して接触させた後、上記封止シートを押圧して上記デバイスに貼付するデバイス封止方法、
である。
The present invention is (1) a sealing jig for affixing a sealing sheet to a device to seal the device, having a plurality of support posts near one end of the jig, A sealing jig provided with a recess having an opening that can be placed on the device, and (2) a method of sealing the device by attaching a sealing sheet to the device The recessed portion of the sealing jig having a plurality of support columns in the vicinity of one end, and having a recessed portion having a depth equal to or smaller than the thickness of the device and capable of mounting the device. The above-mentioned device is placed, and the post is inserted into the insertion hole of the adhesive sheet having a plurality of insertion holes through which the post can be inserted and the sealing sheet is temporarily bonded to a portion other than the insertion hole. After the sealing sheet and the device are brought into contact with each other, the sealing sheet is Device sealing method of attaching to the device by pressing the bets,
It is.

本発明の封止用治具及びデバイス封止方法によれば、簡易かつ容易に、有機EL素子や、太陽電池、有機/無機薄膜トランジスタ等の各種デバイスを封止シートにより封止することができる。   According to the sealing jig and the device sealing method of the present invention, various devices such as organic EL elements, solar cells, and organic / inorganic thin film transistors can be easily and easily sealed with a sealing sheet.

(a)は本発明の封止用治具の一例を示す平面図であり、(b)はその側面図である。(A) is a top view which shows an example of the jig | tool for sealing of this invention, (b) is the side view. 本発明の封止用治具に設けられた凹部に、封止対象となるデバイスが載置された封止用治具、及び封止シートを仮接着させた粘着シートの一例の斜視図である。FIG. 3 is a perspective view of an example of a pressure-sensitive adhesive sheet in which a sealing jig on which a device to be sealed is placed and a sealing sheet are temporarily bonded to a recess provided in the sealing jig of the present invention. . 本発明の封止用治具に設けられた凹部からデバイスを挿脱するための凹部をさらに設けた、封止用治具本体部上面の一例を示す部分拡大平面図である。It is the elements on larger scale which show an example of the upper surface of the sealing jig main part which further provided the recessed part for inserting / removing a device from the recessed part provided in the jig | tool for sealing of this invention. 本発明の封止用治具を用いたデバイス封止方法の一例を示す図である。It is a figure which shows an example of the device sealing method using the jig | tool for sealing of this invention. 本発明に用いる封止シートの一例を示す断面図である。It is sectional drawing which shows an example of the sealing sheet used for this invention. 本発明に用いる、封止シートを仮接着させた粘着シートの一例を示す断面図である。It is sectional drawing which shows an example of the adhesive sheet to which the sealing sheet used for this invention was temporarily bonded. (a)は封止シートを押圧してデバイスに貼付する際に用いられる板状の押圧治具の一例を示す平面図であり、(b)はその側面図である。(A) is a top view which shows an example of the plate-shaped pressing jig used when pressing a sealing sheet and sticking to a device, (b) is the side view. (a)は封止シートを押圧してデバイスに貼付する際に用いられるロール状の押圧治具の一例を示す平面図であり、(b)はその側面図、(c)はその斜視図である。(A) is a top view which shows an example of the roll-shaped pressing jig used when pressing a sealing sheet and sticking to a device, (b) is the side view, (c) is the perspective view. is there.

[封止用治具]
本発明の封止用治具は、封止用治具本体部と、複数の支柱から構成され。封止用治具本体部の上面に凹部が設けられる。
図1(a)は本発明に係る封止用治具の一例の平面図、(b)はその側面図である。また、図2は、凹部にデバイスが載置された封止用治具と、封止シートを仮接着させた粘着シートの斜視図である。
図1及び図2において、1は封止用治具、11は封止用治具本体部、12は支柱、13はデバイスの載置が可能な開口部を有する凹部である。
また、図2において、2はデバイス、3は粘着シート、31は粘着シートの一端部近傍に設けられた挿通穴、4は封止シートである。
封止用治具1の大きさは、封止するデバイス2の面積や形状等に応じて適宜選択できるが、封止作業時の雰囲気を制御しやすいという観点から、グローブボックスに入る程度の大きさであることが好ましい。
[Sealing jig]
The sealing jig of the present invention includes a sealing jig main body and a plurality of support columns. A recess is provided on the upper surface of the sealing jig main body.
Fig.1 (a) is a top view of an example of the sealing jig | tool based on this invention, (b) is the side view. FIG. 2 is a perspective view of a sealing jig in which a device is placed in a recess and an adhesive sheet on which a sealing sheet is temporarily bonded.
1 and 2, 1 is a sealing jig, 11 is a sealing jig main body, 12 is a support column, and 13 is a recess having an opening in which a device can be placed.
In FIG. 2, 2 is a device, 3 is an adhesive sheet, 31 is an insertion hole provided in the vicinity of one end of the adhesive sheet, and 4 is a sealing sheet.
The size of the sealing jig 1 can be appropriately selected according to the area and shape of the device 2 to be sealed, but is large enough to enter the glove box from the viewpoint of easy control of the atmosphere during the sealing operation. It is preferable.

封止用治具本体部11の形状は、特に限定されないが、例えば図1及び図2に示すように、長尺に作製することができる。封止用治具本体部11は、上面が平滑であることが好ましい。
封止用治具本体部11の材質は、後述する一連のデバイス封止工程に耐え得る機械的強度を有していれば、特に制限されない。例えば、金属、プラスチック等が挙げられる。中でも、封止用治具本体部11の材質はポリテトラフルオロエチレン製であることが好ましい。後述するデバイス封止方法において、封止シート4を押圧してデバイス2に貼付した後、粘着シート3を封止用治具本体部11から剥離するのが容易になるためである。
また、封止用治具本体部11は、後述するデバイス封止方法において、デバイスに封止シートを貼付する際に、封止用治具1が動かないように、封止用治具本体部11の下部に比重の高いステンレス等からなる金属部材を接合したり、滑り止めの加工を行っていてもよい。
The shape of the sealing jig main body 11 is not particularly limited, but can be made long, for example, as shown in FIGS. It is preferable that the upper surface of the sealing jig body 11 is smooth.
The material of the sealing jig main body 11 is not particularly limited as long as it has mechanical strength that can withstand a series of device sealing steps described later. For example, a metal, a plastic, etc. are mentioned. Especially, it is preferable that the material of the jig body 11 for sealing is made of polytetrafluoroethylene. This is because, in the device sealing method described later, after the sealing sheet 4 is pressed and attached to the device 2, it is easy to peel the adhesive sheet 3 from the sealing jig body 11.
Further, the sealing jig main body 11 has a sealing jig main body so that the sealing jig 1 does not move when a sealing sheet is attached to the device in the device sealing method described later. A metal member made of stainless steel or the like having a high specific gravity may be joined to the lower portion of 11 or anti-slip processing may be performed.

支柱12は、図1及び図2に示すように、封止用治具本体部11の上面の一端部近傍に複数配置される。支柱12の本数は、封止シート4の貼付の際、封止シート4を仮接着させた粘着シート3の挿通穴31に支柱12を挿通した後に粘着シート3がずれにくく、位置合わせを安定して行えるという観点から、3本以上であることが好ましく、4本以上であることがより好ましい。   As shown in FIGS. 1 and 2, a plurality of support columns 12 are arranged near one end of the upper surface of the sealing jig main body 11. When the sealing sheet 4 is pasted, the number of the support posts 12 is less likely to be displaced after the support posts 12 are inserted into the insertion holes 31 of the adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded, and the alignment is stabilized. From the viewpoint that it is possible to do it, it is preferably 3 or more, more preferably 4 or more.

複数の支柱12の配置は、特に制限はないが、支柱12が3本以上である場合は、同一直線上にない方が好ましい。また、複数の支柱12は互いに接することなく、ある程度離れた位置に設ける方が好ましい。
支柱12の高さは、特に制限はないが、デバイス2への封止シート4の貼付時に、封止シート4を仮接着させた粘着シート3の挿通穴31が支柱12から外れず、かつ、貼付終了時には粘着シート3を支柱12から容易に外せるという観点から、5mm〜5cmであることが好ましい。
また、支柱12の太さは、封止シート4の貼付時に、封止シート4を仮接着させた粘着シート3に引張等の力をかけた際に封止シート4を仮接着させた粘着シート3の破断が生じなければ、特に限定されない。支柱12の断面形状は、特に制限はないが、封止シート4の貼付時に、封止シート4を仮接着させた粘着シート3の破断を防ぐ観点から、円形、楕円系、四角形等、の鋭角を持たない形状であることが好ましい。
支柱12の材質は、封止シート4の貼付時に、封止シート4を仮接着させた粘着シート3に引張等の力をかけた際に形状が変形しない程度の機械的強度を有するものであれば特に制限されない。例えば、金属、プラスチック等が挙げられる。
The arrangement of the plurality of struts 12 is not particularly limited, but when there are three or more struts 12, it is preferable that they are not on the same straight line. Further, it is preferable that the plurality of support columns 12 are provided at positions separated to some extent without contacting each other.
The height of the support 12 is not particularly limited, but when the sealing sheet 4 is attached to the device 2, the insertion hole 31 of the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded does not come off from the support 12, and From the viewpoint that the pressure-sensitive adhesive sheet 3 can be easily removed from the support column 12 at the end of sticking, it is preferably 5 mm to 5 cm.
Moreover, the thickness of the support | pillar 12 is the adhesive sheet which temporarily bonded the sealing sheet 4 when applying force, such as tension | pulling, to the adhesive sheet 3 which temporarily bonded the sealing sheet 4 at the time of sticking of the sealing sheet 4 If 3 breakage does not occur, there is no particular limitation. The cross-sectional shape of the support column 12 is not particularly limited. From the viewpoint of preventing breakage of the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded when the sealing sheet 4 is pasted, an acute angle such as circular, elliptical, or quadrangular. It is preferable that it is a shape which does not have.
The material of the support column 12 should have a mechanical strength that does not deform the shape when a force such as tension is applied to the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded when the sealing sheet 4 is applied. There is no particular limitation. For example, a metal, a plastic, etc. are mentioned.

凹部13は、デバイス2の厚み以下の深さを有し、また、デバイス2の載置が可能な開口部を有する。凹部13の深さがデバイス2の厚みよりも深いと、後述するデバイス封止方法において、デバイス2と封止シート4とが接触せず、封止シート4を貼付できない場合がある。凹部13は、図1及び図2に示すように複数設けられる。
凹部13の開口部は、デバイス2を載置できる形状であればよく、デバイス2と封止シート4との位置合わせを行いやすいという観点から、デバイス2を固定できる形状であることが好ましい。例えば、デバイス2と相似形であって、デバイス2を載置できる大きさの開口部を有する形状である。
凹部13は、図3に示すように、デバイス2を挿脱するための凹部14をさらに有していてもよい。例えば、凹部14にピンセット等の先端を入れて、凹部13に載置されたデバイス2を容易に取り出すことができる。
The recess 13 has a depth that is equal to or less than the thickness of the device 2 and has an opening in which the device 2 can be placed. If the depth of the recess 13 is deeper than the thickness of the device 2, the device 2 and the sealing sheet 4 may not contact each other in the device sealing method described later, and the sealing sheet 4 may not be attached. A plurality of the recesses 13 are provided as shown in FIGS.
The opening part of the recessed part 13 should just be a shape which can mount the device 2, and it is preferable that it is a shape which can fix the device 2 from a viewpoint that it is easy to perform alignment with the device 2 and the sealing sheet 4. FIG. For example, the shape is similar to that of the device 2 and has an opening that is large enough to mount the device 2.
As shown in FIG. 3, the recess 13 may further include a recess 14 for inserting and removing the device 2. For example, by inserting a tip such as tweezers into the recess 14, the device 2 placed in the recess 13 can be easily taken out.

[デバイス封止方法]
図4は、本発明の封止用治具を用いたデバイス封止方法の一例を示す図であり、図5は封止シート4の一例を示す断面図である。図6は、封止シート4を仮接着させた粘着シート3の一例を示す断面図である。
図4〜図6を参照して、本発明の封止用治具1を用いたデバイス2の封止方法をさらに詳細に説明する。
まず、図4(a)に示すように、封止用治具本体11の上面に設けられた複数の凹部13にデバイス2を載置する。デバイス2は、特に限定されないが、例えば、ガラス等の基板上に封止対象となる素子を形成したものであり、有機EL素子や、太陽電池、有機/無機薄膜トランジスタ等の各種デバイスが挙げられる。デバイス2は、封止対象となる素子等が上になるように凹部13に載置される。
次に、図4(b)に示すように、封止シート4を仮接着させた粘着シート3の一端部近傍に設けられた複数の挿通穴31に、封止用治具本体11の上面に設けられた複数の支柱12を挿通させる。
粘着シート3には、あらかじめ封止用治具本体部11の上面に設けられた複数の支柱12に対向する位置に挿通穴31を設けておく。挿通穴31の開口部は、支柱12の径よりも若干大きく、支柱12の挿通が可能である。
[Device sealing method]
FIG. 4 is a view showing an example of a device sealing method using the sealing jig of the present invention, and FIG. 5 is a cross-sectional view showing an example of the sealing sheet 4. FIG. 6 is a cross-sectional view illustrating an example of the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded.
With reference to FIGS. 4-6, the sealing method of the device 2 using the jig | tool 1 for sealing of this invention is demonstrated still in detail.
First, as shown in FIG. 4A, the device 2 is placed in a plurality of recesses 13 provided on the upper surface of the sealing jig main body 11. Although the device 2 is not particularly limited, for example, an element to be sealed is formed on a substrate such as glass, and various devices such as an organic EL element, a solar cell, and an organic / inorganic thin film transistor are exemplified. The device 2 is placed in the recess 13 so that an element to be sealed is on top.
Next, as shown in FIG. 4B, a plurality of insertion holes 31 provided in the vicinity of one end of the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded are provided on the upper surface of the sealing jig body 11. The provided support columns 12 are inserted.
In the pressure-sensitive adhesive sheet 3, insertion holes 31 are provided at positions facing the plurality of support columns 12 provided in advance on the upper surface of the sealing jig main body 11. The opening of the insertion hole 31 is slightly larger than the diameter of the column 12, and the column 12 can be inserted.

粘着シート3は、基材上に粘着剤層を設けたものであることが好ましい。粘着シート3に用いられる基材は、特に制限はないが、封止シート4とデバイス2との位置合わせを行う際の引張力や、封止シートを押圧する際の押圧により破断しにくい材質ものが好ましく、さらに、デバイス2と封止シート4との位置合わせを容易にするために、透明又は半透明であることが好ましい。例えば、後述する封止シート4の基材41として例示したものが挙げられる。
また、粘着シート3の粘着剤層は、封止シート4をデバイス2に貼付した後、封止用治具本体部11およびデバイス2から剥離しやすいように、微粘着性であることが好ましい。このような粘着剤層を形成する粘着剤としては、公知のものを用いることができる。また、粘着シート3は、帯電防止加工されているものがより好ましい。図4(b)において、粘着シート3の粘着剤層は、封止用治具本体11の上面に接する面となる。
The pressure-sensitive adhesive sheet 3 is preferably a sheet in which a pressure-sensitive adhesive layer is provided on a substrate. Although there is no restriction | limiting in particular in the base material used for the adhesive sheet 3, The material which is hard to fracture | rupture by the tensile force at the time of aligning the sealing sheet 4 and the device 2, and the press at the time of pressing a sealing sheet Further, in order to facilitate the alignment between the device 2 and the sealing sheet 4, it is preferable that the device 2 is transparent or translucent. For example, what was illustrated as the base material 41 of the sealing sheet 4 mentioned later is mentioned.
The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 3 is preferably slightly adhesive so that it can be easily peeled off from the jig body 11 for sealing and the device 2 after the sealing sheet 4 is attached to the device 2. As the pressure-sensitive adhesive forming such a pressure-sensitive adhesive layer, a known one can be used. The pressure-sensitive adhesive sheet 3 is more preferably subjected to antistatic processing. In FIG. 4B, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 3 becomes a surface in contact with the upper surface of the sealing jig main body 11.

封止シート4は、例えば図5に示すように、少なくとも基材41と、封止用粘着剤層42とが積層されたシートである。また、所望により、封止用粘着剤層42上に剥離シート43を積層させていてもよい。
基材41は、特に制限はなく、様々なものを用いることができる。具体的にはポリエチレン、ポリプロピレン等のポリオレフィン、ポリエチレンテレフタレート、ポリブチレンテレフタレート等のポリエステル、ポリイミド、ポリアミドなどの樹脂からなるシート;これらのシートにアルミニウム、マグネシウム、亜鉛、スズ等の金属蒸着を施したもの;これらのシートに窒化珪素、酸化珪素、酸窒化珪素、ポリシラザン化合物、ポリカルボシラン化合物、ポリシラン化合物、ポリオルガノシロキサン化合物、テトラオルガノシラン化合物等の珪素化合物、酸化アルミニウム、酸窒化アルミニウム等のアルミニウム化合物、酸化マグネシウム、酸化亜鉛、酸化インジウム、酸化スズ等の無機酸化物を積層したもの;上質紙、含浸紙等からなる紙類;アルミニウム箔、銅箔や鉄箔等の金属箔;不織布;合成紙等が用いられる。
封止用粘着剤層42には、粘着剤層を形成する粘着剤として通常用いられるもの、例えば、アクリル系粘着剤、ゴム系粘着剤、ポリウレタン系粘着剤、シリコーン系粘着剤を用いることができ、中でもガスバリア性の観点から、ゴム系粘着剤が好ましい。
封止シート4は、例えば、基材41上に、封止用粘着剤を公知の方法により塗工する等して封止用粘着剤層42を形成することにより作成される。
For example, as shown in FIG. 5, the sealing sheet 4 is a sheet in which at least a base material 41 and a sealing adhesive layer 42 are laminated. Moreover, if desired, a release sheet 43 may be laminated on the sealing adhesive layer 42.
There is no restriction | limiting in particular in the base material 41, A various thing can be used. Specifically, sheets made of polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyimides, polyamides, and the like; those obtained by depositing metal such as aluminum, magnesium, zinc and tin A silicon compound such as silicon nitride, silicon oxide, silicon oxynitride, polysilazane compound, polycarbosilane compound, polysilane compound, polyorganosiloxane compound or tetraorganosilane compound, aluminum compound such as aluminum oxide or aluminum oxynitride; Laminated with inorganic oxides such as magnesium oxide, zinc oxide, indium oxide and tin oxide; paper made of fine paper, impregnated paper, etc .; metal foil such as aluminum foil, copper foil and iron foil; non-woven fabric; synthetic paper etc Used.
As the pressure-sensitive adhesive layer 42 for sealing, those usually used as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer, for example, acrylic pressure-sensitive adhesive, rubber-based pressure-sensitive adhesive, polyurethane-based pressure-sensitive adhesive, and silicone-based pressure-sensitive adhesive can be used. Of these, rubber pressure-sensitive adhesives are preferred from the viewpoint of gas barrier properties.
The sealing sheet 4 is created, for example, by forming the sealing adhesive layer 42 on the base material 41 by applying a sealing adhesive by a known method.

封止シート4は、粘着シート3上の挿通穴31に支柱12を挿通させた時に、封止用治具本体部11の上面に設けられた凹部13に載置された1つ又は複数のデバイス2と対向する位置になるように、あらかじめデバイス2側に、すなわち粘着シート3の封止用治具本体11の上面に接する面(粘着剤層面)に仮接着させておくことが好ましい。
図6(a)(b)に、封止シート4を仮接着させた粘着シート3の一例を示す。
粘着シート3に封止シート4を仮接着させる方法としては、前記封止シート4を抜き加工等によりデバイス2に対応する形状にカットした後、基材41が粘着シート3の粘着剤層面に来るようにして、デバイス2と対向する位置になるように封止シート4を仮接着させて作製されていてもよい(図6(a))。なお、図示はしていないが、封止シート4には、剥離シート43が積層されていてもよい。
また、デバイス2に対応する形状になるように、封止シート4の基材41側から抜き加工等により剥離シート43までハーフカットを行い、剥離シート43上に、デバイス2に対応する形状にカットされた封止シート4が積層された状態で、粘着シート3の粘着剤層側に封止シート4を仮接着させて作製されてもよい(図6(b))。なお、剥離シート43は、封止シート4をデバイス2に貼付する際に剥離される。
封止シート4を仮接着させた粘着シート3は、デバイス2に貼付する前にアニーリングを行い、封止シート4に含有される余分な水分を除去しておくことが好ましい。
The sealing sheet 4 is one or more devices placed in the recess 13 provided on the upper surface of the sealing jig body 11 when the support 12 is inserted through the insertion hole 31 on the adhesive sheet 3. 2 is preferably preliminarily bonded to the device 2 side, that is, a surface (adhesive layer surface) in contact with the upper surface of the sealing jig main body 11 of the pressure-sensitive adhesive sheet 3 so as to face the position 2.
6A and 6B show an example of the pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded.
As a method of temporarily adhering the sealing sheet 4 to the pressure-sensitive adhesive sheet 3, the base material 41 comes to the pressure-sensitive adhesive layer surface of the pressure-sensitive adhesive sheet 3 after the sealing sheet 4 is cut into a shape corresponding to the device 2 by punching or the like. In this manner, the sealing sheet 4 may be temporarily bonded so as to be in a position facing the device 2 (FIG. 6A). Although not shown, the release sheet 43 may be laminated on the sealing sheet 4.
Further, a half cut is performed from the base material 41 side of the sealing sheet 4 to the release sheet 43 by a punching process or the like so as to obtain a shape corresponding to the device 2, and a cut is made on the release sheet 43 to a shape corresponding to the device 2. The sealing sheet 4 may be temporarily bonded to the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet 3 in a state where the sealing sheet 4 thus laminated is laminated (FIG. 6B). The release sheet 43 is peeled off when the sealing sheet 4 is attached to the device 2.
The pressure-sensitive adhesive sheet 3 to which the sealing sheet 4 is temporarily bonded is preferably annealed before being attached to the device 2 to remove excess moisture contained in the sealing sheet 4.

図4(b)のように、粘着シート3の挿通穴31に対向する位置に、挿通穴31に挿通可能な複数の支柱12を封止用治具本体部11の上面に設け、粘着シート3の挿通穴31に支柱12を挿通させることにより、封止用治具の凹部13に載置されたデバイス2と、粘着シート3に仮接着された封止シート4との位置合わせを容易に行い、封止シート4とデバイス2とを対向して接触させることができる。
次いで、デバイス2と対向して接触させた封止シート4を粘着シート3の上から押圧することにより、封止シート4はデバイス2に貼付され、デバイス2は封止される。
ここで、封止シート4を粘着シート3の上から押圧する際には、押圧治具等を用いることが出来る。
図4(c)に示すように、封止用治具1の支柱12が設けられた端部側から、粘着シート3の粘着剤層側の面を封止用治具本体部11の上面に接触させて、押圧治具5を用いて、粘着シート3の上から封止シート4を押圧し、支柱12を設けた側とは反対側の端部方向に押圧治具5を動かしながら、対向するデバイス2に封止シート4を貼付させることが好ましい。
なお、この時、デバイス2と粘着シート4とが接触しないように、適度な力で粘着シート3の挿通穴31と逆側の端部を支え、引張力を与えることで、気泡等の混入がなく、均一に封止シート4をデバイス2に貼付して封止することが出来る。
As shown in FIG. 4B, a plurality of support columns 12 that can be inserted into the insertion holes 31 are provided on the upper surface of the sealing jig main body 11 at positions facing the insertion holes 31 of the adhesive sheet 3. By inserting the support 12 into the insertion hole 31, the device 2 placed in the recess 13 of the sealing jig and the sealing sheet 4 temporarily bonded to the adhesive sheet 3 are easily aligned. The sealing sheet 4 and the device 2 can be brought into contact with each other.
Next, the sealing sheet 4 that is brought into contact with the device 2 is pressed from above the pressure-sensitive adhesive sheet 3 so that the sealing sheet 4 is attached to the device 2 and the device 2 is sealed.
Here, when the sealing sheet 4 is pressed from above the pressure-sensitive adhesive sheet 3, a pressing jig or the like can be used.
As shown in FIG. 4 (c), the surface on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet 3 is placed on the upper surface of the sealing jig main body 11 from the end side where the support column 12 of the sealing jig 1 is provided. Using the pressing jig 5, the sealing sheet 4 is pressed from above the adhesive sheet 3, and the pressing jig 5 is moved in the direction opposite to the side where the support column 12 is provided. It is preferable to attach the sealing sheet 4 to the device 2 to be performed.
At this time, the device 2 and the pressure-sensitive adhesive sheet 4 do not come into contact with each other, by supporting the end of the pressure-sensitive adhesive sheet 3 opposite to the insertion hole 31 with an appropriate force and applying a tensile force, so that bubbles and the like are mixed. The sealing sheet 4 can be uniformly adhered to the device 2 and sealed.

押圧治具5は、本発明のデバイス封止方法において、デバイス2と封止シート4とを粘着シート3の上から押圧出来るものであれば特に限定されないが、扱いやすさの観点から、例えば図7に示したような板状の押圧治具や、図8に示したようなロール状の押圧治具が挙げられる。
板状の押圧治具5としては、一般にシール等を貼付するためのスキージ等が挙げられ、ロール状の押圧治具5としては、ラミネートロール等が挙げられる。
封止シート4を押圧しやすいという観点から、押圧治具5は板状であることが好ましい。また、押圧治具5の粘着シート3に接する部分が鋭角であると、適度な力を加えやすいため好ましい。
押圧治具5の大きさは、デバイス2と封止シート4とを粘着シート3の上から押圧して、封止シート4をデバイス2に貼付できるものであれば特に制限はない。
The pressing jig 5 is not particularly limited as long as it can press the device 2 and the sealing sheet 4 from above the pressure-sensitive adhesive sheet 3 in the device sealing method of the present invention. 7, a plate-shaped pressing jig as shown in FIG. 7, and a roll-shaped pressing jig as shown in FIG.
The plate-like pressing jig 5 generally includes a squeegee for attaching a seal or the like, and the roll-shaped pressing jig 5 includes a laminate roll or the like.
From the viewpoint of easily pressing the sealing sheet 4, the pressing jig 5 is preferably plate-shaped. Moreover, since the part which touches the adhesive sheet 3 of the press jig | tool 5 is an acute angle, since it is easy to apply moderate force, it is preferable.
The size of the pressing jig 5 is not particularly limited as long as it can press the device 2 and the sealing sheet 4 from above the pressure-sensitive adhesive sheet 3 and affix the sealing sheet 4 to the device 2.

また、押圧治具5は、押圧治具本体部51のみから構成されていてもよく、押圧治具本体部51に、柔軟性部52を設けた構成としてもよい。封止シート4を押圧して貼付しやすいという点から、後者であることが好ましい。
押圧治具5が板状である場合には、図7に示すように、押圧治具本体部51の先端に柔軟性部52を設けることができる。また、押圧治具5がロール状である場合には、図8に示すように、押圧治具本体部51の外周に柔軟性部52を設けることができる。
押圧治具本体部51の材質は、後述する一連の封止工程に耐え得る機械的強度を有し、かつ扱い易い材質であれば特に制限はなく、金属、プラスチック等が挙げられる。
押圧治具本体部51に設けられた柔軟性部52は、封止シート4を押圧してデバイス2に貼付させる際に、デバイス2や封止用治具本体部11の上面等を傷つけないようにするために設けられる。柔軟性部52の材質は、柔軟性を有する材質であれば特に制限はないが、例えばフェルト;布;スポンジ;ゴム等の弾性体;等が挙げられる。
In addition, the pressing jig 5 may be configured only by the pressing jig main body 51, or may be configured by providing the pressing jig main body 51 with the flexible portion 52. The latter is preferable from the viewpoint that the sealing sheet 4 is easily pressed and stuck.
When the pressing jig 5 is plate-shaped, a flexible portion 52 can be provided at the tip of the pressing jig main body 51 as shown in FIG. When the pressing jig 5 is in a roll shape, a flexible portion 52 can be provided on the outer periphery of the pressing jig main body 51 as shown in FIG.
The material of the pressing jig main body 51 is not particularly limited as long as it has a mechanical strength that can withstand a series of sealing processes described later and is easy to handle, and examples thereof include metals and plastics.
The flexible portion 52 provided in the pressing jig main body 51 does not damage the device 2 or the upper surface of the sealing jig main body 11 when the sealing sheet 4 is pressed and stuck to the device 2. It is provided to make it. The material of the flexible portion 52 is not particularly limited as long as it is a material having flexibility, and examples thereof include felt; cloth; sponge; elastic body such as rubber;

本発明のデバイス封止方法において、デバイスに封止シートを貼付した後、粘着シート3は、封止用治具本体部11の上面から剥離される。この際、封止されたデバイス2も粘着シート3と同時に封止用治具本体部11の凹部13から剥離されてもよい。また、封止されたデバイス2が凹部13に残った場合は、凹部14にピンセットの先端を入れる等して取り出すことができる。   In the device sealing method of the present invention, after sticking the sealing sheet to the device, the pressure-sensitive adhesive sheet 3 is peeled from the upper surface of the sealing jig main body 11. At this time, the sealed device 2 may also be peeled from the recess 13 of the sealing jig main body 11 simultaneously with the pressure-sensitive adhesive sheet 3. Further, when the sealed device 2 remains in the recess 13, it can be taken out by inserting a tip of a tweezers into the recess 14.

本発明の封止用治具及びデバイス封止方法によれば、大掛かりな装置を使用することなく、かつグローブボックス内のように作業範囲が制限された場所においても、簡易かつ容易に、有機EL素子や、太陽電池、有機/無機薄膜トランジスタ等の各種デバイスを封止シートにより封止できる。   According to the sealing jig and the device sealing method of the present invention, the organic EL can be easily and easily performed in a place where the working range is limited as in a glove box without using a large-scale apparatus. Various devices such as elements, solar cells, and organic / inorganic thin film transistors can be sealed with a sealing sheet.

1 封止用治具
11 封止用治具本体部
12 支柱
13 デバイスの載置が可能な開口部を有する凹部
14 デバイスを挿脱するための凹部
2 デバイス
3 粘着シート
31 挿通穴
4 封止シート
41 基材
42 封止用粘着剤層
43 剥離シート
5 押圧治具
51 押圧治具本体部
52 柔軟性部
DESCRIPTION OF SYMBOLS 1 Sealing jig | tool 11 Sealing jig | tool main-body part 12 Support | pillar 13 The recessed part 14 which has the opening part which can mount a device The recessed part 2 for inserting / removing a device 2 Device 3 Adhesive sheet 31 Insertion hole 4 Sealing sheet 41 Substrate 42 Sealing adhesive layer 43 Release sheet 5 Pressing jig 51 Pressing jig body 52 Flexible part

Claims (2)

封止シートとデバイスとを貼付して前記デバイスを封止するための封止用治具であって、前記治具の一端部近傍に複数の支柱を有し、前記デバイスの厚み以下の深さであって前記デバイスの載置が可能な開口部を有する凹部を設けた封止用治具。   A sealing jig for affixing a sealing sheet and a device to seal the device, having a plurality of support columns near one end of the jig, and having a depth equal to or less than the thickness of the device A sealing jig provided with a recess having an opening on which the device can be placed. 封止シートをデバイスに貼付してデバイスを封止する方法であって、一端部近傍に複数の支柱を有し、前記デバイスの厚み以下の深さであって前記デバイスの載置が可能な開口部を有する凹部を設けた封止用治具の前記凹部に前記デバイスを載置し、前記支柱を挿通できる複数の挿通穴を有し前記挿通穴以外の部分に前記封止シートを仮接着させた粘着シートの前記挿通穴に、前記支柱を挿通させて、前記封止シートと前記デバイスとを対向して接触させた後、前記封止シートを押圧して前記デバイスに貼付するデバイス封止方法。   A method of sealing a device by attaching a sealing sheet to a device, the device having a plurality of support columns in the vicinity of one end, an opening having a depth equal to or less than the thickness of the device and capable of placing the device The device is placed in the recess of a sealing jig provided with a recess having a portion, and the sealing sheet is temporarily bonded to a portion other than the insertion hole having a plurality of insertion holes through which the support column can be inserted. A device sealing method for inserting the support column into the insertion hole of the adhesive sheet, bringing the sealing sheet and the device into contact with each other, and then pressing the sealing sheet to attach the device to the device .
JP2010234756A 2010-10-19 2010-10-19 Sealing jig and device sealing method Pending JP2012089339A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141512A1 (en) * 2014-03-19 2015-09-24 リンテック株式会社 Laminated sheet for sealing electronic elements and production method for electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141512A1 (en) * 2014-03-19 2015-09-24 リンテック株式会社 Laminated sheet for sealing electronic elements and production method for electronic device
CN106134288A (en) * 2014-03-19 2016-11-16 琳得科株式会社 Electronic package lamination sheets and the manufacture method of electronic device
KR20160135717A (en) * 2014-03-19 2016-11-28 린텍 가부시키가이샤 Laminated sheet for sealing electronic elements and production method for electronic device
JPWO2015141512A1 (en) * 2014-03-19 2017-04-06 リンテック株式会社 Electronic device sealing laminated sheet and electronic device manufacturing method
EP3122156A4 (en) * 2014-03-19 2017-11-29 LINTEC Corporation Laminated sheet for sealing electronic elements and production method for electronic device
TWI655797B (en) * 2014-03-19 2019-04-01 日商琳得科股份有限公司 Laminated sheet for electronic component packaging and method of manufacturing electronic device
KR102278124B1 (en) * 2014-03-19 2021-07-15 린텍 가부시키가이샤 Laminated sheet for sealing electronic elements and production method for electronic device

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