JP2012084811A - Circuit structure and electrical connection box - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit structure which can be adapted to high-density mounting on a board and can be used for a high-current circuit, and also to provide an electrical connection box.SOLUTION: A circuit structure 20 comprises: a circuit board 21 on which electronic components 22 are mounted; and a conductive plate 30 attached to one face 21A of the circuit board 21. A plurality of attachment holes 25 for attaching the conductive plate 30 are provided on the circuit board 21 such that the holes penetrate through both faces of the circuit board 21. A conductive plate body 31 and board attachment parts 34 are integrally provided on the conductive plate 30. The board attachment parts 34 are formed in a manner extending from the conductive plate body 31 to the circuit board 21 side and are attached into the attachment holes 25 on the circuit board 21. Further, the board attachment parts 34 are each provided with a contact portion 35 which comes into contact with the one face 21A of the circuit board 21 and a pair of attachment pieces 36, 36. The pair of attachment pieces 36, 36 are provided to extend from the contact portion 35, and they are inserted through the attachment holes 25 and folded so as to be in contact with the other face 21B of the circuit board 21, thereby sandwiching and fixing the circuit board 21 together with the contact portion 35.

Description

  The present invention relates to a circuit structure and an electrical junction box.

As a printed circuit board used for a large current circuit, for example, the one proposed in Patent Document 1 is known.
In Patent Document 1, a short bar serving as a conductor for large current is attached to a copper foil portion through which a large current passes among copper foil portions provided by etching on a printed circuit board by burring, and the copper foil portion A printed circuit board for high current is proposed in which an electrical product is electrically connected to a burring portion by screwing.

JP-A 63-271996

In recent years, in-vehicle substrates and the like are required to be reduced in size, but high-density mounting with higher functionality is required, so securing a mounting space on the substrate has been an issue.
However, in the printed circuit board proposed in Patent Document 1, a short bar is attached to a part of the copper foil portion to constitute a printed circuit board for a large current circuit. The arrangement and the wiring pattern of the copper foil portion are affected, and the above-mentioned demand for high-density mounting cannot be sufficiently met.

  The present invention has been completed based on the above-described circumstances, and is compatible with high-density mounting of a substrate and can be used for a high-current circuit, and an electrical connection including the circuit structure The purpose is to provide a box.

  In order to solve the above problems, the present invention provides a circuit structure including a circuit board on which electronic components are mounted and a conductive plate mounted on one surface of the circuit board. A plurality of mounting holes for mounting the conductive plate are provided so as to penetrate the surfaces on both sides of the conductive plate. On the conductive plate, the conductive plate main body portion extends from the conductive plate main body portion to the circuit board side. A board mounting portion that is formed and mounted in the mounting hole of the circuit board is integrally provided, and the board mounting section has a contact portion that contacts one surface of the circuit board; A mounting piece that extends from the contact portion, is inserted through the mounting hole and is bent so as to contact the other surface of the circuit board, thereby holding and fixing the circuit board together with the contact section. Has features where it is installed That.

  Moreover, as what solves the said subject, this invention is an electrical junction box provided with the said circuit structure and the case which accommodates the said circuit structure.

  In the present invention, the mounting piece of the board mounting portion provided in the conductive plate is inserted into the mounting hole provided in the circuit board on which the electronic component is mounted, and the contact portion is brought into contact with one surface of the circuit board. When the mounting piece is bent so as to be in contact with the other surface of the circuit board, the conductive plate is positioned and fixed with respect to the circuit board with the contact portion and the mounting piece sandwiching the circuit board. When the conductive plate is mounted on the circuit board, for example, by reflow soldering, a plurality of through holes provided in the circuit board and a plurality of terminals integrally formed from the conductive board are connected. A circuit structure can be obtained.

  In the present invention, the board mounting portion of the conductive plate is positioned and fixed with respect to the circuit board simply by attaching it to the mounting hole of the circuit board on which the electronic component is mounted. Does not affect the pattern. Further, if a conductive plate that allows a large current is used, it can be used for a large current circuit. As a result, according to the present invention, it is possible to provide a circuit structure body and an electrical junction box that can be used for high-current circuits and that can be used for high-density mounting of substrates.

  In addition, according to the present invention, the conductive plate is positioned and fixed to the circuit board simply by mounting the board mounting portion provided on the conductive board in the mounting hole of the circuit board. Work can be performed efficiently.

  Further, according to the present invention, the board mounting portion for mounting the conductive plate on the circuit board is provided integrally with the conductive board main body, and when the conductive plate is mounted on the circuit board, the circuit board and the conductive board are electrically connected. Since there is no need to attach other components other than the plate, the number of components required for mounting the conductive plate on the circuit board is small, and the manufacturing cost can be reduced.

The present invention may have the following configurations.
The mounting portion may be provided with two mounting pieces for each mounting hole. With such a configuration, the conductive plate is positioned and fixed by sandwiching the hole edge of one mounting hole of the circuit board between the two mounting pieces, so that sufficient fixing strength can be obtained.

Between the extending end of the board mounting part from the conductive plate main body part and the contact part, there is a mounting foot that can be mounted in a state where the conductive plate is separated from the circuit board. It may be provided integrally with the main body portion and the contact portion.
With such a configuration, the circuit board and the conductive plate can be fixed in a separated state, so that electronic components can be mounted on both sides of the circuit board, and further high-density mounting is possible. In addition, the space between the circuit board and the conductive plate can insulate the circuit board from the conductive plate. This eliminates the need for a step of applying an adhesive, a pressurizing step for curing, and the like as compared with the case where an insulating adhesive is used to insulate between a circuit board and a conductive plate. The process can be simplified and the manufacturing cost can be reduced.

  The mounting piece may be provided with a narrow portion formed narrower than other portions at a position near the extending end from the contact portion. With such a configuration, the work of bending the mounting piece inserted through the mounting hole of the circuit board to the other surface side of the circuit board can be easily performed, and a large scale is required for the process of mounting the conductive plate to the circuit board. Since it is not necessary to introduce a new facility, the manufacturing cost can be reduced.

The mounting hole may be formed in an oval shape.
With such a configuration, since the movement of the mounting piece is restricted by the oval mounting hole, the positioning when the conductive plate is mounted on the circuit board can be ensured.

  ADVANTAGE OF THE INVENTION According to this invention, the electrical connection box provided with a circuit structure body and this circuit structure body which respond | correspond to the high-density mounting of a board | substrate and can be used for a large current circuit can be provided.

The perspective view of the electrical junction box of Embodiment 1 The perspective view of each member which comprises an electric junction box Top view of circuit structure Side view of the short side direction of the circuit structure of FIG. Side view of long side direction of circuit structure of FIG. Main part enlarged side view showing a state where the board mounting part is mounted on the circuit board Expanded cross-sectional view of the main part showing the connection structure between the conductive plate terminals and the circuit board The principal part enlarged side view which shows the state before mounting the board mounting part on the circuit board The top view of the circuit composition object of Embodiment 2. FIG. 9 is a side view of the circuit configuration body in the short side direction. 9 is a side view of the circuit structure of FIG. 9 in the long side direction. Main part enlarged side view showing a state where the board mounting part is mounted on the circuit board Expanded cross-sectional view of the main part showing the connection structure between the conductive plate terminals and the circuit board The principal part enlarged side view which shows the state before mounting the board mounting part on the circuit board The perspective view of the circuit composition object explained by other embodiments FIG. 15 is an exploded perspective view of the circuit structure of FIG.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
An electrical junction box 10 according to the present embodiment is shown in FIG. The electrical junction box 10 includes a circuit configuration body 20 including a circuit board 21 and a conductive plate 30 and a case 11 that accommodates the circuit configuration body 20 (see FIG. 2).

(Case 11)
As shown in FIG. 1, the case 11 includes a lower case 12 disposed on the lower side and an upper case 14 disposed on the upper side. As shown in FIG. 2, a conductive plate 30, a circuit board 21, and a frame 18 are accommodated in the case 11 in order from the bottom.

The lower case 12 is made of a synthetic resin and opens upward. A synthetic resin upper case 14 is assembled to the lower case 12 from above. A plurality of locking protrusions 13 projecting outward are formed on the side wall of the lower case 12. On the other hand, on the side wall of the upper case 14, a plurality of locking pieces 15 that can be bent and deformed when the locking projection 13 abuts are formed at positions corresponding to the locking projections 13 of the lower case 12. On the upper side of the stop piece 15, an engagement hole 16 is formed in which the engagement protrusion 13 is fitted and engaged. The upper case 14 and the lower case 12 are assembled together by engaging the locking projection 13 of the lower case 12 with the locking hole 16 of the upper case 14.

  On the upper surface of the upper case 14, a plurality of connector fitting portions 17 that can be fitted with mating connectors (not shown) are formed to open upward. A plurality of connector terminals 19 formed on the frame 18 are disposed inside the connector fitting portion 17. The counterpart connector is connected to various electrical components (not shown).

(Frame 18)
The frame 18 is made of synthetic resin and has a shape that generally follows the outer shape of the circuit board 21 disposed on the lower side (see FIG. 2). The frame 18 is provided with connector terminals 19 penetrating in the vertical direction. The connector terminals 19 have a rod shape or an elongated plate shape.

(Circuit board 21)
A conductive path (not shown) is formed on the upper surface 21B of the substantially rectangular circuit board 21 by a printed wiring technique. As shown in FIGS. 2 and 3, a plurality of semiconductor switching elements 22 (electronic components 22) are mounted on the upper surface 21 </ b> B of the circuit board 21 in the longitudinal direction of the circuit board 21. 22 is electrically connected to the conductive path.

  The circuit board 21 is formed with a plurality of through holes 23 penetrating both surfaces of the circuit board 21. A conductive path is formed on the inner surface of the through hole 23 by a known technique such as plating. The plurality of through holes 23 include a connector terminal through hole 23A connected to the connector terminal 19 and a conductive plate terminal through hole 23B connected to a conductive plate terminal 33 formed in the conductive plate 30 described later. It is composed of The lower end of the connector terminal 19 is inserted into the connector terminal through hole 23A and connected by soldering.

  The conductive plate terminal through hole 23B is formed between the adjacent semiconductor switching elements 22. Ring-shaped lands 24 are formed at the upper and lower opening edges of the through hole 23B for the conductive plate terminal. The upper and lower lands 24 are formed integrally with the conductive path formed on the inner wall of the conductive plate terminal through hole 23B (see FIG. 7).

  The circuit board 21 is formed with six (plural) oval mounting holes 25 in which the board mounting portion 34 of the conductive plate 30 is mounted. The mounting holes 25 are respectively formed at the four corners of the circuit board 21 and at substantially the center of the two long sides of the circuit board 21. In the mounting hole 25, a pair of mounting pieces 36 and 36 (two mounting pieces 36 and 36) are mounted as a substrate mounting portion 34 formed in the conductive plate 30 (see FIG. 6).

(Conductive plate 30)
One conductive plate 30 is disposed on the lower surface 21A of the circuit board 21 with a space from the circuit board 21 (see FIGS. 4 and 5). In the present embodiment, the conductive plate 30 is formed by pressing a metal plate material into a predetermined shape, and allows a large current to be allowed. As shown in FIG. 2, the conductive plate 30 has a substantially rectangular shape and has a conductive plate main body portion 31 having substantially the same size as the circuit board 21, and outward from one corner of the conductive plate main body portion 31. A protruding power supply terminal 32, a plurality of conductive plate terminals 33 cut upward from the conductive plate main body 31, and a circuit board 21 provided to extend upward from the conductive plate main body 31 (on the circuit board 21 side). A substrate mounting portion 34 to be mounted. The conductive plate main body 31, the power supply terminal 32, the conductive plate terminal 33, and the substrate mounting portion 34 are integrally provided.

  The power supply terminal 32 formed on the conductive plate 30 penetrates the case and protrudes outward in a state where the lower case 12 and the upper case 14 are assembled. The power supply terminal 32 is electrically connected to the power supply by being screwed to a terminal block (not shown).

As shown in FIG. 7, each of the conductive plate terminals 33 is cut out from the conductive plate main body 31 and bent upward at a right angle.
The front end portion 33A of the conductive plate terminal 33 can be inserted into the through hole 23B for conductive plate terminal, positioning of the circuit board 21 and the conductive plate 30, and the through hole 23B for conductive plate terminal and the conductive plate terminal. The solder connection 33 can be made more firmly. As shown in FIG. 7, the tip end portion 33 </ b> A of the conductive plate terminal 33 is soldered to the inner wall of the through hole 23 and the land 24.

As shown in FIG. 6, the board mounting portion 34 is cut out from the conductive plate main body portion 31 and bent upward at a right angle. As shown in FIG. 6, the board mounting portion 34 is provided so as to extend from the conductive plate main body portion 31 and a rectangular portion 37 and an upper end surface 35 of the rectangular portion 37. And a pair of mounting pieces 36 and 36 inserted through the mounting holes 25 provided.
A rectangular portion 37 extending from the conductive plate main body 31 is a mounting foot portion 37 that allows the conductive plate 30 to be mounted in a state of being spaced (separated) from the circuit board 21. . An upper end surface 35 of the mounting foot portion 37 is a contact portion 35 disposed so as to contact the lower surface 21A (one surface 21A) of the circuit board 21. That is, the mounting leg portion 37 is between the extended end from the conductive plate main body portion 31 and the contact portion 35. The mounting foot portion 37 is provided integrally with the conductive plate main body portion 31, the contact portion 35, and the pair of mounting pieces 36 and 36. The height dimension X of the mounting foot 37 can be appropriately set in consideration of the distance from the circuit board 21.

The pair of mounting pieces 36, 36 provided extending from the contact portion 35 has a substantially rectangular shape. The pair of mounting pieces 36, 36 are formed with narrow portions 36 </ b> A that are narrower than other portions due to notches at positions near the extending ends from the contact portions 35. The narrow portion 36A serves as a fulcrum when the pair of mounting pieces 36 and 36 are folded so as to be in contact with the upper surface 21B of the circuit board 21 while pushing the pair of mounting pieces 36 and 36 apart.
The pair of mounting pieces 36 and 36 are inserted into the mounting hole 25 and bent so as to contact the upper surface 21B (the other surface 21B) of the circuit board 21, so that the circuit board 21 and the contact portion 35 are sandwiched and positioned and fixed. It has a function (see FIG. 6 and FIG. 8).

(Mounting and connection of the conductive plate 30 to the circuit board 21)
A corresponding board mounting portion 34 is disposed in each mounting hole 25 of the circuit board 21 and a conductive plate terminal 33 corresponding to each through hole 23B for the conductive board terminal of the circuit board 21 is disposed below the circuit board 21. The conductive plate 30 is mounted. When the pair of mounting pieces 36 and 36 are inserted into the mounting hole 25 of the circuit board 21 until the contact part 35 of the board mounting part 34 contacts the lower surface 21A of the circuit board 21, the tip 33A of the conductive plate terminal 33 becomes conductive. It is inserted into the through hole 23B for plate terminals.

  The contact portion 35 of the conductive plate 30 is brought into contact (contact) with the lower surface 21A of the circuit board 21, and the upper end portions 36B, 36B of the pair of mounting pieces 36, 36 are spread out using a jig or the like. Is bent so as to be in contact with the upper surface 21B of the circuit board 21, the pair of mounting pieces 36, 36 sandwich the hole edge (circuit board 21) of the mounting hole 25 from above and below, so that the conductive plate 30 is in contact with the circuit board 21. In contrast, the positioning is fixed with an interval corresponding to the height of the mounting foot portion 37. In the present embodiment, the pair of mounting pieces 36 and 36 in each mounting hole 25 are disposed at positions facing each other at the hole edge of the mounting hole 25.

  Next, when the conductive plate terminal 33 and the through hole 23 of the circuit board 21 are connected by reflow soldering, the circuit structure 20 is obtained. As described above, in a state where the conductive plate 30 is mounted on the lower surface 21A of the circuit board 21, the tip 33A of the conductive plate terminal 33 is inserted into the through hole 23 for the conductive plate terminal 33 as shown in FIG. Thus, since the conductive plate 30 is positioned with respect to the circuit board 21, the solder connection between the through hole 23 and the conductive plate terminal 33 can be performed more firmly.

  In the case of reflow soldering, cream solder may be printed only on the upper surface 21B side of the circuit board 21. In this manner, the cream solder is melted by passing through the reflow furnace in a state where the circuit board 21 and the conductive plate 30 are overlapped, and the molten solder travels along the conductive plate terminal 33 to be the lower surface 21A of the circuit board 21. The front end portion 33A of the conductive plate terminal 33 can be electrically connected to the wall of the through hole 23B for the conductive plate terminal and the land 24 by the soldering portion 26 formed by the molten solder being cooled and solidified. Connected.

(Assembly of electric junction box 10)
The circuit structure 20 (circuit board 21 and conductive plate 30) obtained as described above is accommodated in the case 11. The circuit structure 20 is accommodated in the lower case 12 so that the conductive plate 30 is disposed on the lower side, and the connector terminals 19 projecting downward in the frame 18 into the through holes 23 for the connector terminals 19 of the circuit board 21. The frame 18 is mounted on the circuit board 21 so as to be inserted.

  Next, when the upper case 14 is placed on the frame 18 so that the connector terminals 19 protruding upward in the frame 18 are arranged in the connector fitting portions 17 of the upper case 14, the upper case 14 is locked. The piece 15 comes into contact with the locking projection 13 of the lower case 12 and bends and deforms outward. Further, when the upper case 14 is pushed downward and the locking projection 13 of the lower case 12 is fitted into the locking hole 16 of the upper case 14, the locking piece 15 is elastically restored and the locking projection 13 is locked. Is done. As a result, the upper case 14 is assembled to the lower case 12, and the electrical junction box 10 of the present embodiment is obtained.

(Effect of this embodiment)
In the present embodiment, the board mounting portion 34 of the conductive plate 30 is positioned and fixed with respect to the circuit board 21 simply by being attached to the mounting hole 25 of the circuit board 21 on which the electronic component 22 is mounted. The arrangement and wiring pattern of the electronic parts 22 are not affected. In addition, since a conductive plate 30 that allows a large current is used, it can be used in a large current circuit.
As a result, according to the present embodiment, it is possible to provide the circuit structure 20 and the electrical junction box 10 that can be used for a high-current circuit and can be used for high-density mounting of substrates.

  In addition, according to the present embodiment, the conductive plate 30 is positioned and fixed to the circuit board 21 only by mounting the board mounting portion 34 provided on the conductive board 30 in the mounting hole 25 of the circuit board 21, so that the subsequent conductive The connection work between the board 30 and the circuit board 21 can be performed efficiently.

  Further, according to the present embodiment, the board mounting portion 34 for mounting the conductive plate 30 on the circuit board 21 is provided integrally with the conductive plate main body, and when the conductive plate 30 is mounted on the circuit board 21. In addition, since it is not necessary to attach other components than the circuit board 21 and the conductive plate 30, the number of components required for mounting the conductive plate 30 on the circuit board 21 can be reduced, and the manufacturing cost can be reduced.

  Further, according to the present embodiment, the board mounting portion 34 is provided with the pair of mounting pieces 36 for each mounting hole 25, so that the hole edge of one mounting hole 25 of the circuit board 21 is provided. However, since the conductive plate 30 is positioned and fixed by being sandwiched between the pair of mounting pieces 36, 36, sufficient fixing strength can be obtained.

  By the way, when the mounting hole 25 has a shape close to a perfect circle, the pair of mounting pieces 36 and 36 may be displaced when the mounting hole 25 is sandwiched. However, in the present embodiment, since the mounting hole 25 is formed in an oval shape, the movement of the pair of mounting pieces 36 and 36 is restricted by the oval mounting hole 25, and the conductive plate 30 is mounted on the circuit board 21. The positioning at the time of hitting can be ensured.

  In the present embodiment, the mounting foot 37 is integrated with the conductive plate main body 31 and the contact portion 35 between the extended end of the board mounting portion 34 from the conductive plate main body 31 and the contact portion 35. Therefore, the circuit board 21 and the conductive plate 30 can be fixed in a separated state. As a result, it is possible to mount the electronic components 22 on both surfaces of the circuit board 21 and further high-density mounting is possible.

  Further, the space between the circuit board 21 and the conductive plate 30 can insulate the circuit board 21 from the conductive plate 30. Thereby, for example, compared with the case where the circuit board 21 and the conductive plate 30 are insulated from each other by an insulating adhesive, a process of applying an adhesive, a pressurizing process for curing, and the like become unnecessary. The manufacturing process can be simplified and the manufacturing cost can be reduced.

  Further, in the present embodiment, the pair of mounting pieces 36 and 36 are provided with a narrow portion 36 </ b> A formed narrower than other portions at a position near the extending end from the contact portion 35. Therefore, the work of bending the pair of mounting pieces 36, 36 inserted through the mounting hole 25 of the circuit board 21 while pushing and spreading each other on the upper surface 21B of the circuit board 21 can be easily performed. Since it is not necessary to introduce a large-scale facility for the process of attaching to the manufacturing cost, the manufacturing cost can be reduced.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS.
A circuit structure 40 according to the present embodiment is shown in FIG. Similar to the circuit structure of the first embodiment, the circuit structure of the present embodiment can be used as an electrical junction box by being assembled to the case 11 described in the first embodiment.
The circuit configuration body 40 of the present embodiment is different from the first embodiment in that the configuration of the conductive plate 50 and the conductive plate 50 are mounted on the circuit board 21 without a gap (see FIGS. 10 and 11). ). In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

(Conductive plate 50)
The conductive plate 50 arranged so as to be in contact with the insulating layer 41 formed on the lower surface 21A of the circuit board is formed by pressing a metal plate into a predetermined shape as shown in FIGS. Yes, a large current is acceptable. The insulating layer 41 is made of an insulating material and ensures the insulation between the circuit board 21 and the conductive plate 50.
The conductive plate 50 extends from the conductive plate main body 51, a conductive plate main body 51 having approximately the same size as the circuit board 21, a power supply terminal 52 protruding outward from one corner of the conductive plate main body 51. And a plurality of conductive plate terminals 53 provided so as to extend from the conductive plate main body 51 (on the circuit board 21 side) and a board mounting portion 54 that is provided on the circuit board 21. The conductive plate main body 51, the power terminal 52, the conductive plate terminal 53, and the board mounting portion 54 are integrally provided.

  The power supply terminal 52 formed on the conductive plate 50 penetrates the case 11 and protrudes outward in a state where the lower case 12 and the upper case 14 are assembled. The power terminal 52 is electrically connected to the power source by being screwed to a terminal block (not shown).

  The conductive plate terminal 53 is substantially U-shaped as shown in FIG. The conductive plate terminal 53 is formed by bending the connection portion 51A between the conductive plate terminal 53 and the conductive plate main body 51 downward after the conductive plate main body 51 is wound in a U shape. Accordingly, the folded portion of the conductive plate terminal 53 is disposed on the lower side, and the distal end portion 53 </ b> A of the conductive plate terminal 53 is disposed so as to protrude upward from the conductive plate main body 51.

The front end portion 53A of the conductive plate terminal 53 can be inserted into the through hole 23B for conductive plate terminal, positioning of the circuit board 21 and the conductive plate 50, and the through hole 23B for conductive plate terminal and the conductive plate terminal. 53 can be connected more firmly. As shown in FIG. 13, the front end portion 53 </ b> A of the conductive plate terminal 53 is soldered to the inner wall of the through hole 23 </ b> B for the conductive plate terminal and the land 24.

  As shown in FIG. 12, the board mounting portion 54 is cut out from the conductive plate main body portion 51 and bent upward at a right angle. As shown in FIGS. 12 and 14, the board mounting portion 54 includes a pair of mounting pieces 56, 56 extending from the conductive plate main body 51. An extended end portion of the pair of mounting pieces 56 and 56 is a contact portion 55.

The pair of mounting pieces 56, 56 have a substantially rectangular shape, and a narrow portion 56 </ b> A is formed at a position near the contact portion 55 so as to be narrower than other portions due to notches. The narrow portion 56A serves as a fulcrum when the pair of mounting pieces 56 and 56 are folded so as to be in contact with the upper surface 21B of the circuit board 21 while pushing the pair of mounting pieces 56 and 56 apart.
The pair of mounting pieces 56, 56 are inserted into the mounting hole 25 and bent so as to contact the upper surface 21B (the other surface 21B) of the circuit board 21, thereby holding and fixing the circuit board 21 together with the contact portion 55. (See FIG. 12).

(Mounting and connection of conductive plate 50 to circuit board 21)
A corresponding board mounting portion 54 is disposed in each mounting hole 25 of the circuit board 21 and a conductive plate terminal 53 corresponding to each through hole 23B for the conductive board terminal of the circuit board 21 is disposed below the circuit board 21. The conductive plate 50 is attached. When the pair of mounting pieces 56, 56 of the conductive plate 50 are inserted into the mounting hole 25 of the circuit board 21 until the contact portion 55 of the board mounting portion 54 contacts the lower surface 21A (insulating layer 41) of the circuit board 21, The leading end 53A of the conductive plate terminal 53 is inserted into the through hole 23B for the conductive plate terminal.

  The contact portion 55 of the conductive plate 50 is brought into contact (contact) with the lower surface 21A of the circuit board 21, and the upper end portion 56B, When 56B is bent so as to be in contact with the upper surface 21B of the circuit board 21, the pair of mounting pieces 56 and 56 sandwich the hole edge (circuit board 21) of the mounting hole 25 from above and below, and the conductive plate 50 is connected to the circuit board. It is positioned and fixed so as to come into contact with 21. In the present embodiment, in each mounting hole 25, the pair of mounting pieces 56, 56 are arranged at positions facing each other at the hole edge of the mounting hole 25.

  Next, when the conductive plate terminal 53 and the through hole 23 of the circuit board 21 are connected by reflow soldering, the circuit structure 20 is obtained. As described above, when the conductive plate 50 is mounted on the lower surface 21A of the circuit board 21, as shown in FIG. 13, the leading end 53A of the conductive plate terminal 53 is inserted into the through hole 23B for the conductive plate terminal. Thus, since the conductive plate 50 is positioned with respect to the circuit board 21, the solder connection between the conductive plate terminal through-hole 23B and the conductive plate terminal 53 can be made more firmly.

  In the case of reflow soldering, cream solder may be printed only on the upper surface 21B side of the circuit board 21. In this manner, the cream solder is melted by passing through the reflow furnace in a state where the circuit board 21 and the conductive plate 50 are overlapped, and the molten solder travels through the conductive plate terminal 53 to lower surface 21A of the circuit board 21. The distal end portion 53A of the conductive plate terminal 53 can be electrically connected to the wall of the through hole 23B for the conductive plate terminal and the land 24 by the soldering portion 26 formed by the molten solder being cooled and solidified. Connected.

(Effect of this embodiment)
In the present embodiment, the board mounting portion 54 of the conductive plate 50 is positioned and fixed with respect to the circuit board 21 simply by being attached to the mounting hole 25 of the circuit board 21 on which the electronic component 22 is mounted. The arrangement and wiring pattern of the electronic parts 22 are not affected. Further, since the conductive plate 50 that allows a large current is used, it can be used in a large current circuit.
As a result, according to the present embodiment, it is possible to provide the circuit structure 40 and the electrical junction box that can be used for a high-current circuit and that can be used for high-density mounting of substrates.

  Further, according to the present embodiment, the conductive plate 50 is positioned and fixed to the circuit board 21 only by mounting the board mounting portion 54 provided on the conductive board 30 in the mounting hole 25 of the circuit board 21, so that the subsequent conductive The connection work of the board 50 and the circuit board 21 can be performed efficiently.

  Further, according to the present embodiment, the board mounting portion 54 for mounting the conductive plate 50 on the circuit board 21 is provided integrally with the conductive plate main body 51, and the mounting of the conductive plate 50 to the circuit board 21. In this case, since it is not necessary to attach other components other than the circuit board 21 and the conductive plate 50, the number of components required for mounting the conductive plate 50 on the circuit board 21 can be reduced, and the manufacturing cost can be reduced. .

  Further, according to the present embodiment, the board mounting portion 54 is provided with the pair of mounting pieces 56, 56 for each mounting hole 25, so that the hole edge of one mounting hole 25 of the circuit board 21 is provided. However, since the conductive plate 50 is positioned and fixed by being sandwiched between the pair of mounting pieces 56, 56, sufficient fixing strength can be obtained.

  In the present embodiment, since the mounting hole 25 is formed in an oval shape, the movement of the pair of mounting pieces 56 and 56 is restricted by the oval mounting hole 25, and the conductive plate 50 is mounted on the circuit board 21. The positioning at the time of hitting can be ensured.

  In the present embodiment, the pair of mounting pieces 56 and 56 are provided with a narrow portion 56 </ b> A formed narrower than other portions at a position near the extending end from the contact portion 55. Therefore, it is possible to easily perform the work of bending the pair of mounting pieces 56, 56 inserted through the mounting holes 25 of the circuit board 21 toward the upper surface 21B side of the circuit board 21 while spreading the conductive plate 50 to the circuit board. Since it is not necessary to introduce a large-scale facility for the process of attaching to 21, the manufacturing cost can be reduced.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above embodiment, a circuit board on which electronic components are mounted on one side is shown. However, when mounting a conductive plate having a board mounting portion provided with mounting feet as shown in the first embodiment, both sides are electronic. A circuit board on which components are mounted may be used.
(2) In the above-described embodiment, the circuit configuration body including the conductive plate having the conductive plate main body substantially the same size as the circuit board is shown, but the present invention is not limited to this. For example, like the circuit structure 60 shown in FIGS. 15 and 16, the outer peripheral edge is substantially the same size as the circuit board 21, but the inside of substantially half of the region is cut into a square shape to form a frame shape. The conductive plate 70 having the conductive plate main body 71 may be provided. The conductive plate 70 does not have a power supply terminal protruding from the circuit board. In the circuit structure 60 shown in FIGS. 15 and 16, the configuration other than the conductive plate 70 is substantially the same as that of the first embodiment, and therefore the same configuration as that of the first embodiment in FIGS. 15 and 16 is the same as that of the first embodiment. A reference is attached. 15 to 16, 72 is a power supply terminal, 73 is a conductive plate terminal, 73A is a leading end portion of the conductive plate terminal, 74 is a substrate mounting portion, 75 is a contact portion, 76 is a mounting piece, and 76B is an upper end portion of the mounting piece. , 77 is a mounting foot.
(3) In the above embodiment, the conductive plate including the substrate mounting portion provided with a pair of mounting pieces for each mounting hole is shown, but the substrate mounting portion provided with only one mounting piece for one mounting hole is used. A conductive plate may be provided.
(4) In the above embodiment, the conductive plate provided with the board mounting portion provided with the mounting piece formed with the narrow portion is shown, but the board mounting portion provided with the mounting piece not formed with the narrow portion. May be a conductive plate.
(5) In the above embodiment, a circuit board having an oval mounting hole is shown, but the mounting hole may have a perfect circle shape, a square shape, or the like.
(6) In the above-described embodiment, the conductive plate including the substrate mounting portion provided in a state where the pair of mounting pieces are inserted into the mounting holes and protrudes from the upper surface of the substrate is shown, but the pair of mounting pieces protrudes from the upper surface of the substrate. Instead, it may be fixed in a state of being pressed against the inner wall of the mounting hole.

DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 11 ... Case 12 ... Lower case 14 ... Upper case 20, 40, 60 ... Circuit structure 21 ... Circuit board 21A ... Lower surface (one surface)
21B ... Upper surface (the other surface)
22. Semiconductor switching element (electronic component)
25 ... mounting hole 30, 50, 70 ... conductive plate 31, 51, 71 ... conductive plate main body 34, 54, 74 ... substrate mounting portion 35, 55, 75 ... contact portion 36, 56, 76 ... mounting piece 36A, 56A ... Narrow part 36B, 56B, 76B ... (Upper part of mounting piece) 37, 77 ... Mounting foot part (rectangular part extended from conductive plate main body part)

Claims (6)

A circuit structure comprising a circuit board on which electronic components are mounted, and a conductive plate mounted on one surface of the circuit board,
While the circuit board is provided with a plurality of mounting holes for mounting the conductive plate so as to penetrate the surfaces on both sides thereof,
In the conductive plate, a conductive plate main body portion and a board mounting portion that is formed extending from the conductive plate main body portion to the circuit board side and is mounted in the mounting hole of the circuit board are integrally provided. ,And,
The board mounting portion is provided with a contact portion that contacts one surface of the circuit board, and extends from the contact portion, and is inserted into the mounting hole and contacts the other surface of the circuit board. And a mounting piece for holding and fixing the circuit board together with the contact portion by being bent. 2. The circuit structure according to claim 1, wherein two mounting pieces are provided for each of the mounting holes in the board mounting portion. Between the extending end of the board mounting part from the conductive plate main body part and the contact part, there is a mounting foot that can be mounted in a state where the conductive plate is separated from the circuit board. The circuit structure according to claim 1, wherein the circuit structure is provided integrally with the main body portion and the contact portion. 4. The mounting piece is provided with a narrow portion formed narrower than other portions at a position near an extending end from the contact portion. The circuit structure according to any one of the above. The circuit structure according to claim 1, wherein the mounting hole is formed in an oval shape. An electrical junction box comprising: the circuit structure according to any one of claims 1 to 5; and a case for housing the circuit structure.

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