JP2012079752A - Method for forming pattern and method for manufacturing circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for easily forming a pattern of a via hole or the like by means of a printing method.SOLUTION: A method for patterning a first thin film provided on a substrate and comprising a first polymer material comprises: a polymer solution dropping step of preparing a polymer solution obtained by dissolving a second polymer material into a first solvent which dissolves a first polymer material and dropping the solution on the first thin film; and a second solvent contact step of bringing the first thin film into contact with a second solvent after the first solvent is dried. The second solvent is a solvent which does not dissolves the first polymer material but dissolves the second polymer material.

Description

  The present invention relates to a pattern forming method and a circuit board manufacturing method to which the pattern forming method is applied. In particular, the present invention relates to a method of manufacturing an active matrix substrate by applying a functional organic material using a printing method.

  Conventionally, in order to manufacture an active matrix substrate using a silicon semiconductor, a thin film formation process, a photolithography process, and an etching process are used as basic cycles, and this basic cycle is repeated a plurality of times. First, after the thin film is formed on the entire substrate, a photoresist pattern corresponding to the required thin film pattern is made, and most of the thin film is removed by the etching process based on the pattern, and the remaining photoresist pattern is It was removed and used as a basic cycle. That is, in this manufacturing method, most of the thin film material and all of the photoresist material have to be finally discarded, so to speak, it can be said that it is based on grand waste. In addition, a vacuum process is required for the film forming process and the etching process. These processes require a long processing time, poor productivity, and a large-scale manufacturing apparatus.

  Therefore, a method of manufacturing an active matrix substrate by a printing method has been studied as a manufacturing method that does not use the above basic cycle as much as possible, has excellent productivity, and avoids the use of a large-scale manufacturing apparatus as much as possible. Although there are various printing methods, an inkjet method is considered suitable for manufacturing an active matrix substrate. This is because the ink-jet method forms the pattern in a non-contact manner on the substrate only among various printing methods, and has the lowest probability of occurrence of defects. This is because various printing methods other than the ink jet method make it difficult to eliminate dust entrapment and physical defects because the printing plate is brought into contact with the substrate.

  In general, an active matrix substrate is provided with a plurality of wiring layers, and these wiring layers are separated by an insulating film. In places where electrical continuity is required between the wiring layers, via holes are opened to connect the two wirings. Even when an active matrix substrate is manufactured by a printing method, conduction between the wiring layers is required. For example, in Patent Document 1, via holes are formed using a photolithography process and a dry etching process. In Patent Document 2, a via hole is formed by irradiating a laser beam to an insulating film. In Patent Document 3, as shown in FIG. 17, a via hole is formed by dropping a solvent for dissolving the insulating film onto the insulating film.

  In the method of Patent Document 3, as shown in FIG. 17A, the solvent dropped on the insulating film 171 forms droplets 172 on the insulating film 171. The droplet 172 evaporates while dissolving the underlying insulating film 171. If the thickness of the insulating film 171 is as thin as about 200 nm to 400 nm, as shown in FIG. 17B, the entire insulating film 171 is dissolved in the solvent in the thickness direction. When this dries, a micro flow as shown by the arrow in FIG. 17B is generated. The material of the insulating film 171 dissolved in the solvent is also collected in the vicinity of the outer peripheral portion of the droplet 172 along this flow. As a result, a crater-shaped depression as shown in FIG.

JP 2008-277371 A JP 2007-266237 A Special table 2003-518755 gazette

  However, in the conventional manufacturing method represented by Patent Document 1, the photolithography process has a significant effect on the functional organic material used for the active matrix substrate, and the active matrix substrate having excellent characteristics can be stably formed. There was a problem that it was difficult to manufacture. This is because the functional organic material may be irradiated with strong short-wavelength light during exposure in the photolithography process, and the functional organic material may be photodegraded. Moreover, it is because there exists a possibility that a developing solution may permeate | transmit a functional organic material at the time of image development in a photolithography process, and a functional organic material may change chemically.

  In addition, the conventional manufacturing method represented by Patent Document 2 has a problem that productivity is low and a yield is low, in addition to the problem that the manufacturing cost increases due to the use of a laser device. Normally, it is necessary to irradiate a laser beam at the same point several times to the opening of the via hole. However, since there are tens of thousands to millions of via holes in the active matrix substrate, opening them while aligning several to several hundreds with a laser device is extremely long. Time is spent. In addition, electrical continuity cannot be obtained even if the laser output fluctuates slightly. For example, if the laser output is slightly weak, the via hole cannot be opened (an insulating film remains at the bottom of the via hole). On the other hand, if it is too strong, even the electrode to be conductive is ablated. Furthermore, because of the use of laser ablation, the generation of dust is unavoidable, and the yield is lowered as a result of soiling the active matrix substrate.

  Moreover, in the conventional manufacturing method represented by patent document 3, there existed a subject that it was difficult to form the hole penetrated completely. As shown in FIG. 17C, a little insulating film material remained at the bottom 173 of the hole. This is a phenomenon that occurs almost inevitably because evaporation is more dominant than solvent transfer in the final drying process. Therefore, in order to avoid this, in Patent Document 3, following this step, the entire surface of the insulating film is uniformly etched to remove the thin skin residue at the bottom 173 of the hole. Specifically, a dry etching process using plasma or a wet etching process using a solvent has been performed. However, when the insulating film is made of a polymer material, the dry etching treatment with plasma has a problem that the insulating film causes plasma damage and deteriorates the quality of the insulating film. Further, the method of performing the wet etching process has a problem that the surface of the insulating film becomes rough. Further, there is a problem that the solvent enters the interface of the insulating film and the insulating film is peeled off.

  In other words, in forming a pattern such as a via hole, there has been a problem that a pattern forming method suitable for the printing method does not exist conventionally. Similarly, there has been a problem that it is difficult to stably produce a circuit board having excellent characteristics at a high yield by a printing method.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

(Application Example 1) A pattern forming method according to this application example is a pattern forming method of a first thin film provided on a substrate, and the first thin film is made of a first polymer material, and the first polymer material is made of The polymer solution in which the second polymer material is dissolved in the first solvent to be dissolved is dropped onto the first thin film, and after the first solvent is dried, the first thin film is touched with the second solvent. A second solvent contacting step, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material.
According to this configuration, a pattern such as a via hole can be easily formed by a printing method, and the quality of the remaining first thin film other than the via hole can be kept high.

(Application Example 2) A pattern forming method according to this application example is a pattern forming method of a first thin film provided on a substrate, and the first thin film is made of a first polymer material, and the first polymer material is made of A third solvent dropping step of dropping a third solvent to be dissolved on the first thin film, and a polymer in which the second polymer material is dissolved in the first solvent that dissolves the first polymer material after the third solvent is dried A polymer solution dropping step of dropping the solution on the first thin film; and a second solvent contact step of bringing the first thin film into contact with the second solvent after the first solvent is dried, The second polymer material is dissolved without dissolving the polymer material.
According to this configuration, since the movement of the first polymer material is promoted when the third solvent is dried, after the third solvent is dried, the first polymer material is slightly in the vicinity of the central portion where the third solvent is dropped. Does not remain. Since this slight residue is then removed, patterns such as via holes can be easily and reliably formed by a printing method, and the quality of the remaining first thin film other than via holes can be kept high. Can do.

Application Example 3 In the pattern forming method according to the application example described above, it is preferable that the molecular weight of the second polymer material is in the range of 500 to 50,000.
According to this configuration, since the molecular weight is 500 or more, the second polymer material exhibits characteristics as a polymer, and causes phase separation from the first polymer material when the first solvent is dried. For this reason, when the second polymer material is removed after the second solvent contact step, the portion becomes a region where neither the first polymer material nor the second polymer material exists. Since the molecular weight of the second polymer material is 50000 or less, the viscosity of the polymer solution during the drying period of the first solvent is kept low for a relatively long time. As a result, patterns such as via holes can be easily formed by a printing method.

Application Example 4 A circuit board manufacturing method according to this application example includes a first conductor forming step of forming a first conductor on a substrate, and a first polymer material so as to cover the first conductor. A first thin film forming step for forming the first thin film, and a through hole forming step for exposing a surface of the first conductor by opening a through hole in the first thin film on the first conductor. The through-hole forming step includes a polymer solution dropping step in which a polymer solution in which the second polymer material is dissolved in the first solvent in which the first polymer material is dissolved is dropped on the first thin film; A second solvent contact step of contacting the first thin film with the second solvent after drying, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material And
According to this configuration, the via hole can be easily opened in the circuit board by a printing method, and the electronic element manufactured on the circuit board is not adversely affected. Therefore, a circuit board exhibiting excellent circuit characteristics can be stably manufactured with a high yield by a printing method.

Application Example 5 A circuit board manufacturing method according to this application example includes a first conductor forming step of forming a first conductor on a substrate, and a first polymer material so as to cover the first conductor. A first thin film forming step for forming the first thin film, and a through hole forming step for exposing a surface of the first conductor by opening a through hole in the first thin film on the first conductor. The through-hole forming step includes a third solvent dropping step of dropping a third solvent that dissolves the first polymer material onto the first thin film, and a first solvent that dissolves the first polymer material after the third solvent is dried. A polymer solution dropping step in which a polymer solution in which a second polymer material is dissolved in a solvent is dropped onto the first thin film, and a second solvent in which the first thin film is brought into contact with the second solvent after the first solvent is dried The second solvent preferably does not dissolve the first polymer material but dissolves the second polymer material.
According to this configuration, since the movement of the first polymer material is promoted when the third solvent is dried, after the third solvent is dried, the first polymer material is slightly in the vicinity of the central portion where the third solvent is dropped. Does not remain. Thereafter, the slight residue is removed, so that a via hole can be easily and surely opened in the circuit board by a printing method, which does not adversely affect the electronic device fabricated on the circuit board. Therefore, a circuit board exhibiting excellent circuit characteristics can be stably manufactured with a high yield by a printing method.

Application Example 6 In the method for manufacturing a circuit board according to the application example described above, the molecular weight of the second polymer material is preferably in the range of 500 or more and 50000 or less.
According to this configuration, since the molecular weight is 500 or more, the second polymer material exhibits characteristics as a polymer, and causes phase separation from the first polymer material when the first solvent is dried. For this reason, when the second polymer material is removed after the second solvent contact step, the portion becomes a region where neither the first polymer material nor the second polymer material exists. Since the molecular weight of the second polymer material is 50000 or less, the viscosity of the polymer solution during the drying period of the first solvent is kept low for a relatively long time. As a result, via holes can be easily and reliably opened in the circuit board by a printing method.

Application Example 7 In the method for manufacturing a circuit board according to the application example described above, after the through-hole forming step, a liquid-repellent step for making the surface of the first conductor liquid-repellent, and a precursor resin is printed in a region other than the through-hole. It is preferable to further include a second insulating film forming step of curing the precursor resin after printing to form a second insulating film.
According to this configuration, the via hole can be easily opened in the circuit board by a printing method, and the electronic element manufactured on the circuit board is not adversely affected. Therefore, a circuit board exhibiting excellent circuit characteristics can be stably manufactured with a high yield by a printing method.

Application Example 8 In the method of manufacturing a circuit board according to the application example described above, the method includes a second conductor forming step of forming a second conductor on the first thin film after the liquid repellency step, and after the second conductor forming step. It is preferable to perform the second insulating film forming step.
In the liquid repellent step, the surface of a conductor such as a metal is selectively made liquid repellent. According to this configuration, since the second conductor is not yet formed at the time of the liquid repellent process, only the portion where the through hole is opened in the first conductor is selectively liquid repellent, and the other areas are liquid repellent. Not. Therefore, in the next second insulating film forming step, the precursor resin can be printed uniformly in the region other than the through hole, and the second insulating film can be formed without any defects in the region other than the through hole.

Application Example 9 In the method for manufacturing a circuit board according to the application example described above, it is preferable to include a third conductor forming step of forming a third conductor in a region including the through hole after the second insulating film forming step.
According to this configuration, the second insulating film is not formed in the region including the through hole, and the region naturally becomes a via hole. Therefore, electrical conduction can be established between the first conductor and the third conductor via the first thin film and the second insulating film, and a complicated and highly functional circuit can be formed by printing. Can be manufactured.

Application Example 10 In the method of manufacturing a circuit board according to the application example, the method includes a semiconductor film formation step of printing an organic semiconductor film after the first conductor formation step, and the first thin film formation step after the semiconductor film formation step. It is preferable to do this.
According to this configuration, since an organic semiconductor film can be used as the functional organic material, an organic thin film transistor can be formed on the circuit board, and a circuit board having a highly functional circuit can be manufactured. Further, in this configuration, the first conductor is used as a source / drain electrode, the active layer semiconductor film of the transistor is printed after the source / drain electrode is formed, and then a first thin film that functions as a gate insulating film is formed. That is, since the first conductor forming process is the first, this process does not affect the organic semiconductor film and the gate insulating film, and various methods can be applied to the first conductor forming process (the degree of freedom in the process). high). In a thin film transistor, the semiconductor film and the gate insulating film are important elements that determine transistor characteristics, but with this configuration, it is possible to completely eliminate the situation where the first conductor formation process adversely affects these important elements. A thin film transistor can be manufactured.
In a circuit using a transistor, it is an important requirement to improve circuit performance to shorten the length of the channel formation region of the transistor (distance separating the source electrode and the drain electrode in the case of an organic thin film transistor). According to this configuration, the degree of freedom in the first conductor forming process is high, and the photolithography process and the etching process can be used here prior to the formation of the organic semiconductor film and the gate insulating film. It can be very short to a few microns or less. In other words, if the photolithography process and the etching process are used only once in the manufacturing process of the circuit board, the length of the channel formation region is extremely large even if the circuit board is manufactured by the printing method for all the remaining processes. A short high-performance thin film transistor can be provided on the circuit board.

Application Example 11 In the method of manufacturing a circuit board according to the application example described above, the organic semiconductor film is an ether solvent, a ketone solvent, an ester solvent, and a fluorine solvent. However, it is preferable to exhibit poor solubility.
According to these configurations, π-conjugated molecules can be used as an organic semiconductor film, and since they can use an aromatic hydrocarbon or a saturated hydrocarbon as a solvent, an ink containing an organic semiconductor can be prepared. That is, the organic semiconductor can be printed in a shape required for the circuit board by a printing method such as an inkjet method.

Application Example 12 In the method for manufacturing a circuit board according to the application example described above, the first thin film is preferably soluble in any of ether solvents, ketone solvents, ester solvents, and fluorine solvents.
According to these structures, an insulating material soluble in an ether solvent, a ketone solvent, an ester solvent, or a fluorine solvent, an ether resin, a ketone resin, an ester resin, or fluorine Since an insulating material made of a resin can be used for the first thin film forming step, the first thin film can be formed by a printing method. In addition, since the options for the first thin film are wide, the function of the circuit board can be maximized. Furthermore, when the first thin film is used as a gate insulating film of a transistor, the first thin film material does not dissolve the organic semiconductor film, so that the interface between the semiconductor film and the gate insulating film is smooth and an intermediate transition layer exists. Do not be beautiful. As a result, a thin film transistor having excellent characteristics can be manufactured over a circuit board.

Application Example 13 In the method for manufacturing a circuit board according to the application example described above, it is preferable that the first thin film is hardly soluble in an alcohol solvent.
According to this configuration, the alcohol-based material or the material soluble in the alcohol-based solvent in the lyophobic process, the second conductor forming process, and the second insulating film forming process performed after the first thin film forming process. Can be used. That is, using these materials, the lyophobic process, the second conductor forming process, and the second insulating film forming process can be performed by a printing method. Furthermore, since the first thin film is not damaged during these steps, the first thin film can be maintained without deteriorating the functions required of the circuit board.

Application Example 14 In the method for manufacturing a circuit board according to the application example described above, it is preferable that the first thin film exhibits poor solubility in the precursor resin.
According to this configuration, the first thin film is not damaged by the precursor resin during the second insulating film forming step, and the first thin film can be maintained without deteriorating the function required for the circuit board.

Application Example 15 In the method for manufacturing a circuit board according to the application example described above, it is preferable that the liquid repellent process includes bringing the surface of the first conductor into contact with a solution containing a thiol compound or a disulfide compound.
According to this configuration, the sulfur atom of the thiol compound or disulfide compound is quickly bonded to the metal atom, so that only the surface of the first conductor is easily made liquid repellent easily by a short contact of several seconds to several minutes. I can do things.

Application Example 16 In the circuit board manufacturing method according to the application example described above, it is preferable that the thiol compound includes a fluorinated alkyl chain.
Since the fluorinated alkyl chain lowers the surface tension, according to this configuration, the liquid repellency of the surface to which the thiol compound is bonded can be made extremely high.

Application Example 17 In the method for manufacturing a circuit board according to the application example, it is preferable that the disulfide compound includes a fluorinated alkyl chain.
Since the fluorinated alkyl chain lowers the surface tension, according to this configuration, the liquid repellency of the surface to which the disulfide compound is bonded can be made extremely high.

Application Example 18 In the circuit board manufacturing method according to the application example described above, the precursor resin preferably includes a monomer having a hydroxyl group.
Although the second insulating film is formed on the first thin film, the first thin film is stable against the alcohol-based material. Therefore, according to this configuration, the precursor resin damages the first thin film (first film). Melting one thin film).

Application Example 19 In the circuit board manufacturing method according to the application example described above, the precursor resin is preferably soluble in an alcohol solvent.
According to this configuration, since the precursor resin can be diluted with an alcohol solvent, the concentration of the solution can be adjusted relatively freely, and various printing methods can be applied to the second insulating film forming step. Further, since the first thin film is stable with respect to the alcohol-based material, it is possible to avoid the second insulating film forming step from damaging the first thin film (melting the first thin film).

Application Example 20 In the method for manufacturing a circuit board according to the application example, the precursor resin is preferably a photocurable resin.
According to this configuration, the second insulating film can be formed quickly and easily by irradiating light after printing the precursor resin.

Application Example 21 In the method of manufacturing a circuit board according to the application example, the precursor resin is preferably a thermosetting resin.
According to this structure, after printing precursor resin, a 2nd insulating film can be easily formed by simple heat processing.

Application Example 22 In the method for manufacturing a circuit board according to the application example, it is preferable that the circuit board includes a transistor including a gate insulating film, and the first thin film functions as the gate insulating film.
According to this configuration, a circuit board having a high-function circuit can be realized. Further, since the circuit board is manufactured by the printing method except for the first conductor forming step, it is estimated that the productivity is very high and a circuit board having a high-function circuit can be manufactured in one day. The process is easy to automate, and the main printing method is the ink jet method, which reduces waste.

FIG. 3 is a cross-sectional view schematically showing the pattern forming method according to the first embodiment. FIG. 3 is a cross-sectional view schematically showing a wiring connection structure manufactured using the pattern forming method according to the first embodiment. Sectional drawing which showed typically the manufacturing method of the circuit board concerning Embodiment 2. FIG. Sectional drawing which showed typically the manufacturing method of the circuit board concerning Embodiment 2. FIG. Sectional drawing which showed typically the manufacturing method of the circuit board concerning Embodiment 2. FIG. FIG. 9 is a plan view schematically showing a circuit board manufacturing method according to the second embodiment. FIG. 9 is a plan view schematically showing a circuit board manufacturing method according to the second embodiment. The figure explaining in detail the state at the time of completion | finish of a liquid repellency process in the manufacturing method of the circuit board concerning Embodiment 2. FIG. FIG. 5 is a plan view schematically showing an active matrix substrate manufactured using the circuit board manufacturing method described in detail in the second embodiment. FIG. 3 is a cross-sectional view schematically showing an electro-optical device using the above active matrix substrate. FIG. 4 is a perspective view schematically showing an electronic apparatus using the above-described electro-optical device, where (a) is a front perspective view and (b) is a rear perspective view. Sectional drawing of the circuit board concerning the modification 1. FIG. The top view of the manufacturing method of the circuit board concerning the modification 2. FIG. The top view of the circuit board concerning the modification 3. FIG. Sectional drawing of the circuit board concerning the modification 3. FIG. Sectional drawing of the circuit board concerning the modification 8. FIG. Sectional drawing which showed the pattern formation method concerning a prior art typically.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scales are different for each layer and each member so that each layer and each member has a size that can be recognized on the drawing.

(Embodiment 1)
FIG. 1 is a cross-sectional view schematically showing a pattern forming method according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing a wiring connection structure manufactured by using the pattern forming method according to the first embodiment. Hereinafter, the pattern forming method will be described with reference to FIGS.

"Outline of pattern formation method"
First, the outline will be described with reference to FIG.
The present invention relates to a method of forming a pattern such as a through-hole 32 on a first thin film provided on a substrate 10 by a printing method. In FIG. 1, the first thin film is an insulating film 211 made of a first polymer material.

  The following steps are performed to form a pattern by a printing method. First, a solution in which a second polymer material is dissolved in a first solvent is prepared as a polymer solution. The first solvent also dissolves the first polymeric material. That is, both the first polymer material and the second polymer material are dissolved in the first solvent. The first polymer material and the second polymer material are different materials that phase separate from each other when the first solvent is dried. Next, as shown in FIG. 1A, in the polymer solution dropping step, this polymer solution is dropped on the first thin film to form minute droplets 52. Although this droplet dries immediately, a micro flow is generated in the droplet during drying, and the first polymer material and the second polymer material move from the vicinity of the center of the droplet to the periphery of the droplet. Thus, as shown in FIG. 1B, the first polymer material and the second polymer material are slightly left in a thin skin state after drying near the center of the droplet. Both polymer materials remaining in a thin skin state are phase-separated from each other to form a number of minute domains two-dimensionally. After this, as a second solvent contact step, the first thin film is brought into contact with the second solvent. The second solvent does not dissolve the first polymer material, but is a solvent that dissolves the second polymer material. By doing so, the second polymer material is selectively removed from the thin skin residue near the center. That is, as shown in FIG. 1C, the domain in which the second polymer material was present is opened, and the through hole 32 is formed. On the other hand, since the first polymer material in the region other than the through hole 32 is kept stable, the through hole 32 can be formed by the printing method while maintaining the quality of the first thin film.

  Hereinafter, the pattern forming method will be described in detail for each process.

"First thin film deposition process"
First, a first thin film is formed on the substrate 10 as a first thin film forming step. Here, the first thin film is the insulating film 211, and polymethyl methacrylate (PMMA) of 500 nm is formed by spin coating. The insulating film 211 is formed by uniformly applying the first polymer material over the entire substrate, and then performing patterning such as opening a via hole. The first polymer material has a property that it dissolves well (soluble) in the first solvent and is stable and hardly soluble (slightly soluble) in the second solvent. On the other hand, the second polymer material dissolved in the first solvent is soluble in both the first solvent and the second solvent. Examples of the first polymer material include an acrylic polymer such as PMMA, and a fluorine-based aromatic polymer as disclosed in JP 2010-74088 A (hereinafter simply referred to as a fluorine-based aromatic polymer). An olefin polymer such as polycycloolefin can be used.

"Solvents and polymer materials"
The first solvent, the second solvent, and the second polymer material are as follows. When the first polymer material is an acrylic polymer or a fluorine aromatic polymer, the first solvent is an ether solvent (ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, 1,4-dioxane). , 2-methoxy-2-methylpropane, diethylene glycol monobutyl ether, etc.) or glycol diether (glyme) solvents (triethylene glycol ethyl methyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol isopropyl methyl ether, tripropylene) Glycol dimethyl ether) or ketone solvents (acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone (D IBK), cyclohexanone, diacetone alcohol (DAA), 3,5,5-trimethyl-2-cyclohexen-1-one (isophorone), or ester solvents (γ-butyrolactone, ethyl acetate, methyl acetate, butyl acetate, Methoxybutyl acetate, ethyl glycol acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, butyl lactate, cyclohexanol acetate, dimethyl glutarate, ethyl octanoate, butyl benzoate, 1,6-diacetic acid Hexanediol, propylene glycol diacetate, etc.) or glycol ester solvents (solvents containing ethers and esters with glycols, diethylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether) Acetate, dipropylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate), or special solvent (ethyl 3-ethoxypropionate containing ether and ester, either a 3-methoxybutyl acetate, etc.). Among these, the first solvent, which is particularly excellent in solubility, is an organic compound having a cyclic structure, such as a lactone, containing an ester bond as part of the molecular ring (for example, γ-butyrolactone), or the molecular structure of a cyclic ketone. And an organic compound having a cycloalkane ring (for example, an ester of cyclohexanol, cyclohexanol acetate). Of these three types, a solvent having a boiling point of 180 ° C. or higher is most suitable as the first solvent (for example, γ-butyrolactone or isophorone). The second solvent is an alcohol solvent (methanol, ethanol, butanol, isopropyl alcohol (IPA), normal propyl alcohol, butanol, tertiary butanol (TBA), butanediol, ethylhexanol, benzyl alcohol, etc.). In this case, the second polymer material is a polymer material that is soluble in both the solvent selected as the first solvent and the alcohol solvent. For example, a resin or phenol in which a hydroxyl group is introduced into a vinyl compound is used as a raw material. Resin is preferred. Specifically, the second polymer material is a vinylphenol homopolymer (polyvinylphenol) or a vinyl alcohol monomer or a vinylphenol monomer other vinyl monomer (for example, vinyl chloride or vinyl acetate). ) Or a phenolic resin (novolak resin), etc., which is soluble in both the first solvent and the second solvent. Polystyrene can be used as the second polymer. In this case, the first solvent is an ester solvent, a ketone solvent, or an ether solvent, and the second solvent is a saturated hydrocarbon (hexane or ring). The saturated hydrocarbon of the formula is cyclohexane, methylcyclohexane, ethylcyclohexane, decalin, etc.). Here, the first polymer material is PMMA, γ-butyrolactone, which is a cyclic ester, is selected as the first solvent, isopropyl alcohol is used as the second solvent, and polyvinylphenol is used as the second polymer material. Even when the first polymer material is a fluorinated aromatic polymer as disclosed in JP 2010-74088 A, the first solvent is γ-butyrolactone, the second solvent is isopropyl alcohol, and the second polymer material is Polyvinylphenol is preferred.

  When the first polymer material is an olefin polymer, the first solvent is an aromatic hydrocarbon (toluene, xylene, mesitylene, cyclohexylbenzene, etc.) or a cyclic saturated hydrocarbon (cyclohexane, methylcyclohexane, ethyl). Cyclohexane, decalin, etc.) and the second solvent is an alcohol solvent (methanol, ethanol, butanol, isopropyl alcohol (IPA), normal propyl alcohol, butanol, tertiary butanol (TBA), butanediol, ethylhexanol, benzyl alcohol, etc.) Or ester solvents (γ-butyrolactone, ethyl acetate, methyl acetate, butyl acetate, methoxybutyl acetate, ethyl glycol acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, ethyl lactate Butyl lactate, cyclohexanol acetate, dimethyl glutarate, ethyl octanoate, butyl benzoate and diacetate 1,6-hexanediol, propylene glycol diacetate, etc.). In this case, the second polymer material is a polymer material that is soluble in both the solvent selected as the first solvent and the solvent selected as the second solvent, and a benzene ring is introduced into the vinyl compound. Resins are preferred. Specifically, the second polymer material is a styrene homopolymer (polystyrene) or a compound copolymerized with styrene and another vinyl monomer (for example, vinylphenol or vinyl acetate). When the first polymer material is polycycloolefin, the first solvent is preferably decalin, the second solvent is butyl acetate, and the second polymer material is preferably polystyrene.

  Olefin polymers can be used as ether solvents, ketone solvents, and ester solvents by copolymerizing with materials having polar functional groups such as hydroxyl groups and carbonyl groups, or by adding these as side chains. Can be melted. When the olefin polymer subjected to such treatment is used as the first polymer material, the first solvent and the second solvent are the same as in the case where the first polymer material is an acrylic polymer or a fluorinated aromatic polymer. A second polymeric material is used.

"Polymer solution dripping process"
A second polymer material is dissolved in the first solvent to form a polymer solution, and this polymer solution is dropped on the first thin film as shown in FIG. This is the polymer solution dropping step. Specifically, a polymer solution in which polyvinyl phenol was dissolved in γ-butyrolactone was dropped onto the insulating film 211 made of PMMA by the inkjet method 51. The concentration of polyvinylphenol in the polymer solution was 0.2%. Here, a droplet 52 of a polymer solution of about 25 pL was dropped three times. In other words, when a polymer solution is dropped, even if the boiling point of the solvent is about 200 ° C., the 25 pL minute droplet dries within 5 seconds at room temperature. Here, when the polymer solution is dropped again, the first polymer material remaining near the center is further reduced. Such repetition was carried out three times here.

  Before describing the polymer solution, the principle that enables patterning of via hole openings and the like by dropping the solution will be described first. In order to open the through-hole 32 in the insulating film 211 which is the first thin film, the droplet 52 of the polymer solution is dropped on the first thin film by the ink jet method 51. As shown in FIG. 1A, the polymer solution dropped onto the first thin film spreads to a certain diameter depending on the wettability. The polymer solution wet and spread evaporates while dissolving the first thin film below. When the polymer solution evaporates, a micro flow is generated inside the droplet 52 from the center to the outer edge. This is because the contact line (outer edge) of the droplet 52 is pinned (fixed) and cannot be easily moved. As a result, the evaporation of the first solvent in the vicinity of the contact line is compensated by the movement of the liquid from the center, and a minute flow from the center toward the outer edge is generated. Both the first polymer material (the constituent element of the first thin film) and the second polymer material dissolved in the first solvent are collected in the vicinity of the contact line on this micro flow. Thus, as shown in FIG. 1B, crater-like irregularities are formed in which the vicinity of the central portion is depressed and the vicinity of the outer edge is raised. If the depression near the center is sufficiently thin, the first polymer material and the second polymer material are phase-separated into a stone wall shape in plan view to form two-dimensional domains as described above. To do. Thereafter, as shown in FIG. 1C, the domain of the second polymer material is removed with the second solvent, and the through hole 32 is formed.

  From the above principle, in order to open the through-hole 32 by this method, (1) the first thin film is easily dissolved in the dropped polymer solution, that is, the first polymer material is better in the first solvent. (2) The contact angle between the polymer solution and the first thin film is about 15 ° or more and does not spread so much and (3) The drying speed of the polymer solution is slow (that is, the evaporation rate of the first solvent is low). Slowly, the first thin film dissolves in the polymer solution, moves in a micro flow, and the first polymer material and the second polymer material reduce the interfacial energy (phase-separated and There is time to move (to make a domain) (ie, the boiling point of the first solvent is high), (4) the viscosity of the polymer solution is somewhat low (ie, the second solvent is soluble in the polymer solution) (5) polymer solution that the concentration of the polymer material is low) The first polymer material and the second polymer material are phase-separated during drying (that is, the first polymer material and the second polymer material have low compatibility with each other, easily phase-separated, and a polymer solution) (6) Before the contact with the second solvent, the depression near the center is sufficiently thin as 100 nm or less and the thickness direction is uniform (thickness). It can be understood that the six points are important: phase separation does not occur in the direction) and phase separation occurs two-dimensionally (in a plane).

  According to experiments, in order to form fine through-holes, the surface tension of the polymer solution is preferably 35 mN / m or more, ideally 40 mN / m or more. Actually, when the surface tension of the polymer solution is about 40 mN / m, the contact angle with respect to PMMA is about 15 °, and a 20 pL droplet 52 with a circumference of about 100 μm in diameter (as shown in FIG. 1C). The through-hole 32 is opened by forming a raised apex portion) and a hollow portion (near the center in FIG. 1B) having a diameter of 20 μm to 30 μm. When cyclohexanol acetate is used as the first solvent, excellent solubility is exhibited, but since the boiling point is as low as 173 ° C., only about 10 nm can be dug by one drop. Therefore, in order to form a deep through-hole, it is preferable that the boiling point of the first solvent is higher than 180 ° C. In order to cause phase separation between the first polymer material and the second polymer material, it is desirable that the molecular weight of the second polymer material is 500 or more. Furthermore, the molecular weight of the second polymer material is desirably 50000 or less so that the viscosity of the polymer solution is somewhat low when dried. Further, in order to maintain a low viscosity state during drying for a certain period of time and form a through hole, it is desirable that the concentration of the second polymer material dissolved in the polymer solution is less than 3%. Furthermore, in order for the first polymer material and the second polymer material to undergo phase separation, the concentration of the second polymer material in the polymer solution is desirably 0.02% or more.

  In addition, according to experiments, when the depression near the center is 100 nm or less, the through hole 32 can be formed by immersing in the second solvent. However, if the depression near the center is thicker than this, it is immersed in the second solvent. It becomes difficult to form through holes. This is considered to be due to phase separation in the thickness direction. Regarding the viscosity, since the polymer solution is ejected by the ink jet method 51, the viscosity is preferably in the range of 1 mPa · s to 5 mPa · s. If the viscosity is 1 mPa · s or more, the polymer solution can be easily dropped by the ink jet method 51, and if it is 5 mPa · s or less, a minute flow is generated in the polymer solution and the through hole 32 can be opened. The viscosity of the dropped polymer solution was about 2 mPa · s, the surface tension was about 44 mN / m, and the boiling point of γ-butyrolactone was 207 ° C. Although depending on the evaporation rate of the first solvent determined by the temperature and wind speed during the dropping step of the polymer solution, these conditions are satisfied and the normal working environment (temperature 20 ° C. to 30 ° C., relative humidity 30% to 80%). When a drop 52 of about 20 pL is dropped once with a downflow air volume of 0.01 to 0.1 m / s), a hole with a depth of about 200 nm to 400 nm can be formed. When the droplet 52 is dropped once, a hole having a depth of about 400 nm to 600 nm can be formed. Therefore, if the first thin film has a thickness of less than about 400 nm and a droplet 52 of about 40 pL is used, the through-hole 32 can be formed by a single solvent drop, as shown in FIG. When the first thin film is thicker or when the solubility is insufficient, the droplet 52 is dropped several times at the same position to form a through hole. In this case, since a single solution (that is, a polymer solution) is dropped by the inkjet method 51 (since there is no need to separate a plurality of solutions), the polymer solution dropping step is easy.

  In general, the volume of the droplet 52 that can be easily ejected by the inkjet method 51 is about 6 pL to 14 pL (when a nozzle having a diameter of 25 μm is used). Therefore, for example, “dropping a 25 pL droplet 52 once” strictly speaking, four 6.3 pL droplets 52 are continuously discharged into the first discharged droplet and dried. Means things. Further, dropping the 25 pL droplet 52 three times means that a cycle in which four droplets of 6.3 pL 52 are continuously discharged to the same spot and dried for several seconds is repeated three times. Of course, if the nozzle diameter or the driving method of the ink jet method 51 is changed, a droplet having a larger volume (for example, a droplet of 25 pL) can be ejected at a time, and thus this method may be applied.

"Second solvent contact process"
After the polymer solution dropping step is completed and the first solvent is dried, the first thin film is brought into contact with the second solvent. This is the second solvent contact step. As described above, the second solvent does not dissolve the first polymer material, but dissolves the second polymer material. Thus, the second solvent of the second polymer material remaining in the vicinity of the center where the liquid droplets landed by this step. The domain is removed and the through hole 32 is opened. Here, the substrate was immersed in isopropyl alcohol at 27 ° C. for 2 minutes. Since the domain of the second polymer material is as thin as 100 nm or less, the second polymer material can be removed from the crater-like depression by a short immersion of less than 1 minute, but from the standpoint of performing the process stably, the immersion time Is preferably 1 minute or longer. Further, from the standpoint of improving productivity and minimizing damage to the insulating film due to dipping, the dipping time is desirably 10 minutes or less. The temperature of the second solvent is about 20 ° C to 90 ° C. Here, the substrate is immersed in the second solvent, but the second solvent may be sprayed in a shower or may flow over the substrate.

  As described above in detail, the patterning of the first thin film (through-hole formation) is completed by performing the polymer solution dropping step and the second solvent contact step. FIG. 1 (c) shows a state in which the domain of the first polymer material remains in the vicinity of the center, but the domain of the first polymer material in the center does not necessarily remain. Depending on how the materials are combined and the dropping conditions of the polymer solution, it is possible to completely replace the depression near the center with the second polymer material. On the other hand, when the through-hole forming method of the present embodiment is carried out, a domain of the second polymer material is formed in the vicinity of the outer periphery as shown in FIGS. This second polymeric material can be removed by a second solvent contacting step, but there will always be domain marks.

"Third solvent dropping process"
As described above, when the first thin film is thick or the solubility of the first polymer material in the polymer solution is insufficient, the droplet 52 is dropped several times at the same position to form a through hole. However, when a plurality of different solutions can be dropped by the inkjet method 51, it is preferable to perform the third solvent dropping step prior to the polymer solution dropping step. The third solvent dropping step is a step of dropping the third solvent onto the first thin film, and the third solvent is a solvent that dissolves the first polymer material well. When the third solvent dropping step is performed, the polymer solution dropping step is performed after the third solvent is dried.

  The third solvent may be the same as the first solvent, or may be a solvent that dissolves the first polymer material better than the first solvent. Ideal is the solvent that dissolves the first polymeric material most easily. Specifically, when the first polymer material is an acrylic polymer, a fluorine aromatic polymer, or an olefin polymer having a polar functional group such as a hydroxyl group or a carbonyl group, the third solvent is an ether. Solvent (ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, 1,4-dioxane, 2-methoxy-2-methylpropane, diethylene glycol monobutyl ether, etc.) or glycol diether (glyme) solvent ( Triethylene glycol ethyl methyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol isopropyl methyl ether, tripropylene glycol dimethyl ether, etc.), or Tone solvents (acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone (DIBK), cyclohexanone, diacetone alcohol (DAA), 3,5,5-trimethyl-2-cyclohexen-1-one (isophorone), etc.) or esters Solvents (γ-butyrolactone, ethyl acetate, methyl acetate, butyl acetate, methoxybutyl acetate, ethyl glycol acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, butyl lactate, cyclohexanol acetate, dimethyl glutarate, Ethyl octanoate, butyl benzoate, 1,6-hexanediol diacetate, propylene glycol diacetate, etc.) or glycol ester solvents (solvents containing ethers and esters with glycols) Diethylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, etc., or special solvents containing ether and ester (ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, etc.) ) Among these, the third solvent, which is particularly excellent in solubility, is an organic compound having a cyclic structure, such as a lactone, containing an ester bond as part of the molecular ring (for example, γ-butyrolactone), or the molecular structure of a cyclic ketone. And an organic compound having a cycloalkane ring (for example, an ester of cyclohexanol, cyclohexanol acetate). Of these three types, a solvent having a boiling point of 180 ° C. or higher is most suitable as the first solvent (for example, γ-butyrolactone or isophorone). When the first polymer material is a simple olefin polymer, the third solvent is an aromatic hydrocarbon (toluene, xylene, mesitylene, cyclohexylbenzene, etc.) or a cyclic saturated hydrocarbon (cyclohexane, methylcyclohexane, ethyl) Cyclohexane, decalin, etc.). As an example of the third solvent, γ-butyrolactone can be used when the first polymer material is PMMA or a fluorinated aromatic polymer, and decalin can be used when the first polymer material is polycycloolefin. . The preferred surface tension, boiling point, and viscosity of the third solvent are the same as those ranges for the polymer solution described above.

  In the third solvent dropping step, the third solvent is dropped once or a plurality of times on the first thin film so that the thickness of the thin skin-like first polymer material remaining in the crater-like depression is less than 100 nm. Thereafter, when the polymer solution dropping step is performed, since the first polymer material remaining in the depression is very small, the through-hole 32 can be easily and completely formed by dropping the polymer solution once or three times. Can be formed.

  The through-hole 32 can be formed by repeating the dropping of the polymer solution many times without performing the third solvent dropping step. However, when the dropping of the polymer solution is repeated, the second height increases in the crater-like depression. Molecular material gradually accumulates, making it difficult for the liquid to move within the droplet. On the other hand, the third solvent does not contain the polymer material, so that the viscosity is lowered and the hole can be effectively dug down. When the polymer solution is dropped after the bottom becomes sufficiently thin, the amount of the first polymer material remelted in the solution is relatively small, and the ratio of the domains of the second polymer material is increased. For this reason, it is easier to form the through holes 32 when the polymer solution dropping step is performed after the third solvent dropping step is performed first.

"Wiring connection process"
Next, a wiring connection structure by the above-described pattern forming method will be described with reference to FIG.
A first wiring 113 is formed of metal on the surface of the substrate 10. In order to protect the first wiring 113 mechanically or chemically, an insulating film 211 is provided so as to cover it. The insulating film 211 is the first thin film. Through holes 32 are formed in the insulating film 211 by the pattern forming method described above. Since the opening of the through-hole 32 is as small as 20 μm to 30 μm, the second wiring 131 is provided so as to cover the through-hole 32 in order to facilitate electrical connection with the outside. That is, in FIG. 2, the second wiring 131 is a connection terminal to the outside. The second wiring 131 is separated from the first wiring 113 by the insulating film 211, but is connected through the through hole 32 as shown in FIG.

As described above, according to the circuit board manufacturing method of the present embodiment, the following effects can be obtained.
After dropping the polymer solution onto the first thin film, the first thin film is brought into contact with the second solvent to dissolve the second polymer material, so that a pattern such as a via hole can be easily formed by a printing method. In addition, the quality of the first thin film remaining other than the via hole can be kept high.

  In addition, a third solvent is dropped on the first thin film so that only a small amount of the first polymer material remains in the vicinity of the dropped center, and then the polymer solution is dropped, and then the second solvent is touched. Since the second polymer material is dissolved, a pattern such as a via hole can be easily and reliably formed by a printing method. The quality of the remaining first thin film other than the via hole can be kept high.

  Further, since the molecular weight of the second polymer material is 500 or more, the second polymer material exhibits characteristics as a polymer. Furthermore, since the molecular weight of the second polymer material is 50000 or less, the viscosity of the polymer solution during the drying period of the first solvent is kept low for a relatively long time. As a result, patterns such as via holes can be easily formed by a printing method.

(Embodiment 2)
3, 4, and 5 are cross-sectional views schematically showing a circuit board manufacturing method according to the second embodiment. 6 and 7 are plan views schematically showing the circuit board manufacturing method according to the second embodiment. 3 to 5 correspond to the cross sections taken along lines AA ′ and BB ′ in FIGS. 6 and 7. For convenience, only the positions of AA ′ and BB ′ are shown in FIG. Is described. Hereinafter, a method of manufacturing a circuit board will be described with reference to FIGS.

"Outline of circuit board manufacturing method"
First, the outline will be described with reference to FIG.
The present invention relates to a method of manufacturing a circuit board 1 including two types of conductive layers and two types of insulating layers that separate them. The circuit board 1 is mainly manufactured by using a printing method, and relates to a technique of opening two via holes 31 in two types of insulating layers and electrically connecting the two types of conductive layers to each other so as to be suitable for the manufacturing method. In FIG. 5J, the two types of conductive layers are a source / drain electrode 11 made of a first conductor and a pixel electrode 13 being a third conductor. The two types of insulating layers are a gate insulating film 21 that is a first thin film and an interlayer insulating film 22 that is a second insulating film. The gate insulating film 21 covers a first conductor such as the source / drain electrode 11, an interlayer insulating film 22 is provided thereon, and a pixel electrode 13 is further formed thereon. A via hole 31 is opened on the source / drain electrode 11, and the source / drain electrode 11 and the pixel electrode 13 are connected via the via hole 31. The gate electrode 12 and the like are formed of the second conductor, and the gate electrode 12 and the pixel electrode 13 are insulated by the interlayer insulating film 22. That is, it is the first thin film that insulates the first conductor from the second conductor, and the second insulating film that insulates the second conductor from the third conductor.

  The following steps are performed to manufacture such a circuit board 1. First, as a first conductor forming step, a source / drain electrode 11 and the like are formed on a substrate. Next, as the first thin film forming step, the gate insulating film 21 is formed so as to cover the first conductor. The gate insulating film 21 is made of the first polymer material described in the first embodiment, and the first thin film forming process is the same as that described in the first embodiment. Next, as a through hole forming step, a through hole 32 is opened in the gate insulating film 21 on the source / drain electrode 11 to expose the surface of the source / drain electrode 11. In the through hole forming step, the pattern forming method described in the first embodiment is used. That is, in the through hole forming step, the second solvent contacting step is performed after the polymer solution dropping step. The polymer solution dropping step is a step of preparing a polymer solution in which the second polymer material is dissolved in the first solvent that dissolves the first polymer material, and dropping the polymer solution on the first thin film. The second solvent contact step performed after the first solvent is dried is a step in which the first thin film is brought into contact with the second solvent. The second solvent does not dissolve the first polymer material, and does not dissolve the second polymer material. Dissolve. Prior to the polymer solution dropping step, a third solvent dropping step may be performed. These solvents and polymer materials are also as described in the first embodiment. Thereafter, a lyophobic process for lyophobizing the surface of the source / drain electrode 11 is performed. Next, as a second insulating film forming step, the precursor resin of the interlayer insulating film 22 is printed in a region other than the through holes 32, and after the printing, the precursor resin is cured to form a second insulating film. The precursor resin has a low viscosity and spreads on the substrate surface during printing. However, the portion where the source / drain electrodes 11 are opened is not repelled because the liquid-repellent treatment is applied, and the precursor resin is applied to the portion. Not. Thus, the via hole 31 is easily and reliably formed. After the via hole 31 is formed, the pixel electrode 13 is formed, and the two kinds of conductive layers are electrically connected.

  Hereinafter, the manufacturing method of the circuit board 1 will be described in detail for each process. In this embodiment, as a preferred example, a case where an active matrix substrate having an upper gate type and having a thin film transistor (organic TFT) using an organic substance as a semiconductor film is applied to the circuit substrate 1 will be described.

"First conductor formation process and first thin film deposition process"
FIG. 3A shows a process up to the first thin film forming process in the manufacturing process of the circuit board of the present embodiment. The substrate 10 is a polyethylene naphthalate (PEN) film. As the substrate 10, any substrate such as a glass substrate, a metal substrate such as aluminum or stainless steel, a semiconductor substrate such as silicon or GaAs, or a plastic substrate can be used, but the organic TFT can be formed at a low temperature with a simple method. Therefore, among these, it is preferable to use a plastic substrate that is inexpensive, lightweight, and highly flexible.

  Examples of plastic substrates other than PEN films include polyolefins such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), cyclic polyolefin, modified polyolefin, polyvinyl chloride, poly Vinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylbenten-1), ionomer, acrylic resin, polymethyl methacrylate, acrylic-styrene copolymer (AS resin), butadiene-styrene copolymer Polyesters such as polymers, polio copolymers (EVOH), polyethylene terephthalate, polybutylene terephthalate, precyclohexane terephthalate (PCT), polyethers, polyether keto , Polyether ether ketone, polyether imide, polyacetal, polyphenylene oxide, modified polyphenylene oxide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, styrene, polyolefin, Various thermoplastic elastomers such as polyvinyl chloride, polyurethane, fluoro rubber, chlorinated polyethylene, epoxy resin, phenol resin, urea resin, melamine resin, unsaturated polyester, silicone resin, polyurethane, etc. A copolymer, a blend, a polymer alloy, and the like. Among these, a laminate in which one kind or two or more kinds are laminated can be used.

  A first conductor made of gold (Au) is provided on the substrate 10, and an electrode pad 111, a source / drain electrode 11, an unillustrated data line and other wirings connected to the outside are provided by these. Is formed. As the first conductor material, a material capable of bonding with a sulfur atom of a thiol compound or a disulfide compound is used. Besides gold, Cr, Al, Ta, Mo, Nb, Cu, Ag, Pt, Pd, Ni , And alloys using these metals are used. In addition to these, an oxide conductor such as indium tin oxide (ITO), tin oxide, or zinc oxide may be used as the first conductor material. These metal films and oxide conductors are patterned into a predetermined shape through a photolithography process and a wet or dry etching process after depositing a uniform thin film by vacuum deposition or sputtering. Alternatively, for a material that is difficult to etch, a metal film may be deposited (mask deposition) through a mask having holes in a predetermined shape. In addition, a dispersion of silver (Ag) nanocolloid may be printed by microcontact printing or convex plate reverse printing. This corresponds to the first conductor forming step. Here, gold was vacuum-deposited on the entire surface of the PEN film, and then the first conductor was formed through a photolithography process and a wet etching process. Note that a mixed solution of iodine and alkali iodide (ammonium iodide) was used for wet etching of gold.

  After the first conductor forming step, a semiconductor film forming step for printing the organic semiconductor film 41 is performed. A semiconductor material is printed by an inkjet method so as to connect the source / drain electrodes 11 (fill the channel formation region). Here, the organic semiconductor film 41 is poly (9,9-dioctylfluorene-cordithiophene) (F8T2), which is a polymer organic semiconductor exhibiting P-type semiconductor characteristics. Other P-type polymer organic semiconductor materials that can be used include poly (3-hexylthiophene) (P3HT), poly [5,5′-bis (3-dodecyl-2tinyl) -2,2 ′. -Bithiophene] (PQT-12), PBTTT and the like. When a soluble low molecular weight organic semiconductor material that can be printed is used, BTBT, thiophene oligomer, and the like can be given. Organic semiconductors have a π bond, so they are most soluble in aromatic hydrocarbons (toluene, xylene, mesitylene, cyclohexylbenzene, etc.), and then consist of cyclic saturated hydrocarbons (cyclohexane, methylcyclohexane, ethylcyclohexane, decalin, etc.) It is dissolved in a solvent and printed. The concentration of the semiconductor material at the time of dissolution is preferably in the range of 0.3% to 2.5%, and the ideal range is 0.5% to 1.5%. Since the first thin film is applied in the next step, it is desirable that the organic semiconductor has high solvent selectivity. Specifically, it is well soluble in aromatic hydrocarbons and cyclic saturated hydrocarbons for printing semiconductor films as described above, and water, alcohol-based solvents, ether-based to be stable after the next step. It is desired to be insoluble in solvents, ketone solvents, ester solvents, and fluorine solvents. From the viewpoint of solvent selectivity, a polymer type organic semiconductor material is preferable to a soluble low molecular weight organic semiconductor material. The F8T2 used here dissolves well in decalin and is stable to ketone solvents and ester materials. The semiconductor film was formed by printing F8T2 dissolved in decalin at a concentration of 2% by an inkjet method. The thickness of the semiconductor film is preferably in the range of 10 nm to 200 nm, and the ideal range is 30 nm to 60 nm. The thickness here was 50 nm.

  After the semiconductor film forming step, the first thin film forming step described in the first embodiment is performed. A gate insulating film 21 which is a first thin film is provided to cover the semiconductor film. Here, polymethyl methacrylate (PMMA) having a thickness of 500 nm was formed by spin coating. In this way, the gate insulating film 21 is uniformly coated with the insulating first polymer material over the entire substrate. Since the organic semiconductor film 41 must not be dissolved at this time, the organic semiconductor material is insulatively soluble in a solvent in which the organic semiconductor material is hardly soluble (alcohol solvent, ether solvent, ketone solvent, ester solvent, fluorine solvent). Use functional polymers. Furthermore, the liquid repellency process, the second conductor forming process (gate electrode forming process), the second insulating film forming process (application and curing of the precursor resin in the interlayer insulating film forming process), etc. performed thereafter The gate insulating film 21 must be stable with respect to various processes to be performed. In these steps, alcoholic materials, glycols, and glycerin are used, so that the insulating polymer needs to be stable against these. That is, the first thin film is hardly soluble in alcohol solvents and materials (not easily soluble), and is soluble (soluble) in any of ether solvents, ketone solvents, ester solvents, or fluorine solvents. Material. Among the polymer materials described in the first embodiment, a simple olefin polymer cannot be used for the gate insulating film 21. This is because a solvent (aromatic hydrocarbon or cyclic saturated hydrocarbon) in which the olefin polymer is dissolved dissolves the organic semiconductor film 41 and performs. When using an olefin polymer, a polar functional machine is added. Specific examples of the first polymer material that can be used as the gate insulating film 21 include acrylic polymers such as PMMA, fluorinated aromatic polymers, and olefinic polymers having a polar functional machine such as a hydroxyl group or a carbonyl group. There are molecules. Since acrylic polymers have ester groups, they are well soluble in ester solvents such as butyl acetate and hardly soluble in alcoholic materials such as ethanol and propylene glycol. In addition, fluorine aromatic polymers have carbonyl groups and ester groups, so they are well soluble in ketone solvents and ester solvents in addition to fluorine solvents, but only slightly soluble in alcohol solvents such as ethanol. Indicates. The olefin polymer having a polar functional group is soluble in an ether solvent, a ketone solvent, and an ester solvent, and is slightly soluble in an alcohol solvent such as arrow-strung ethanol.

  As will be described later, the precursor resin is synthesized with a monomer having a hydroxyl group to form a second insulating film. However, since the first thin film is stable against alcohol-based materials, it is also hardly soluble in the precursor resin. Will be shown. The thickness of the first thin film is preferably in the range of 100 nm to 1000 nm, and more preferably in the range of 200 nm to 800 nm.

"Through hole formation process"
3B and 3C show a through-hole forming step in the process of manufacturing the circuit board according to the present embodiment. The pattern forming method described in the first embodiment is applied to the through hole forming step, and includes a polymer solution dropping step and a second solvent contacting step. Specifically, as shown in FIG. 3B, first, as a polymer solution dropping step, a polymer solution in which polyvinylphenol is dissolved at a concentration of 0.2% in γ-butyrolactone is formed by the inkjet method 51 and the source / drain electrodes 11. It dropped on the place which should form a through-hole. Here, the droplet 52 of the polymer solution of about 25 pL was dropped four times. Next, as a second solvent contact step, the substrate was immersed in isopropyl alcohol at 27 ° C. for 2 minutes. Thus, the through hole 32 was opened as shown in FIG. When the through-hole forming step is composed of a polymer solution dropping step and a second solvent contact step, it is not necessary to switch the solution by the ink jet method, which is excellent in productivity. In addition, you may perform a 3rd solvent dripping process prior to a polymer solution dripping process. In this case, first, as the third solvent dropping step, about 25 pL of γ-butyrolactone droplet 52 is dropped three times on the first thin film, and then about 25 pL of the polymer solution droplet 52 is applied as one polymer solution dropping step. Dripping once. Finally, as a second solvent contact step, the substrate is immersed in isopropyl alcohol at 27 ° C. for 2 minutes.

"Liquid repellent process"
FIG. 3D shows a lyophobic process during the manufacturing process of the circuit board of the present embodiment. FIG. 8 is a diagram for explaining in detail the state at the end of the lyophobic process in the circuit board manufacturing method according to the second embodiment. As shown in FIG. 3D, in the liquid repellent step, the surface of the first conductor is brought into contact with a solution 61 containing a thiol compound or a disulfide compound. The simplest technique is to immerse the substrate with through holes formed in a solution 61 containing a thiol compound or disulfide compound for a short period of time from several seconds to several minutes. Since the sulfur atom of the thiol compound or disulfide compound is quickly bonded to the metal atom forming the first conductor, the surface of the first conductor is easily made liquid repellent by such a short contact treatment. It is more preferable that the thiol compound or disulfide compound contains a fluorinated alkyl chain (fluorinated alkyl thiol or fluorinated alkyl disulfide, hereinafter, abbreviated as fluorinated alkyl thiol 62), resulting in increased liquid repellency. here,
_{HS- (CH 2) 6 - (} CF 2) 7 -CF 3
The alkyl fluoride thiol 62 represented by the chemical formula of

  As shown in FIG. 8B, the sulfur of the thiol compound or disulfide compound is firmly bonded to a metal such as gold, and the surface covered with the fluorinated alkylthiol 62 is covered with the fluorinated alkyl chain, and the surface energy is increased. Lower. As a result, the contact angle of the metal surface with water increases from about 100 ° to about 140 °. As described above, the lyophobic treatment is a treatment for lowering the surface energy of the first conductor so that the contact angle with water is 90 ° or more.

  The fluorinated alkyl thiol 62 is dissolved in an alcohol solvent (ethanol, isopropyl alcohol, butanol, etc.) at a concentration of 0.005% to 1%. The concentration is more preferably in the range of 0.05% to 0.5%. When the substrate is immersed in a solution having a concentration of about 0.2%, as shown in FIG. 8A, the exposed portion where the source / drain electrode 11 of the through-hole 32 is exposed almost instantaneously (less than 1 second). Covered with fluorinated alkylthiol 62 (in a very short time). However, from the standpoint of stably performing the process, the immersion time is preferably 1 minute or longer. Further, from the standpoint of improving productivity and minimizing substrate damage due to dipping, it is desirable that the dipping time be 3 minutes or less. Here, the above-mentioned alkylthiol was dissolved in ethanol at a concentration of 0.2%.

  Since the fluorinated alkyl thiol 62 is also dissolved in the fluorine-based solvent, it may be used as a diluted solvent for the fluorinated alkyl thiol 62. However, in this case, the first thin film is hardly soluble in both alcohol solvents and alcohol materials and fluorine solvents, and is soluble in either ether solvents, ketone solvents, or ester solvents. Must be the polymeric material shown. Specifically, it is an acrylic polymer, a fluorine-based aromatic polymer, a phenol-based polymer, or an olefin-based polymer.

The thiol compound or disulfide compound does not necessarily have to be substituted with fluorine in the main chain extending from the sulfur atom. If the main chain has a contact angle with respect to water of 90 ° or more, it can be used for the liquid repellency step without using fluoride. When the main chain extending from the sulfur atom is fluorinated, the contact angle with water can be easily increased to 110 ° or more, and excellent liquid repellency can be exhibited. The fluorinated alkyl thiol 62 includes
_{HS- (CH 2) k -O- (} CH 2) l - (CF 2) m -CF 3 or _{HS- (CH 2) k + l} - (CF 2) m -CF 3
A material represented by the chemical formula can be used. In order to form a dense SAM film by introducing a soft and small-volume alkyl chain to a hard and large-volume fluorinated alkyl, the value of k + 1 is preferably in the range of 4 to 16, The value of is preferably in the range of 0 or more and 3 or less. In order to exhibit excellent liquid repellency, the value of m needs to be 1 or more, and in order to dissolve in an alcohol solvent, the value of m is preferably 11 or less. When the value of m is 12 or more, the solubility in an alcohol-based solvent is lowered, making it difficult to use in the liquid repellency step. Instead of fluorinated alkyl, some or all of these may be substituted with fluorinated alicyclic hydrocarbons.

  In this case, the substrate is immersed in a solution containing the alkyl fluoride thiol 62. However, when some of the exposed first conductors are made liquid repellent and the rest are not made liquid repellent, The solution 61 containing a thiol compound or a disulfide compound may be dropped by an ink jet method only in 32 parts of the through-hole to be made liquid repellent.

  As described above, when an oxide conductor such as indium tin oxide (ITO), tin oxide, or zinc oxide is used as the first conductor material, the oxide is used instead of the thiol compound or disulfide compound. It is made liquid repellent using a compound such as adsorbing phosphoric acid, phosphonic acid, fatty acid, or organic silane. Specifically, a phosphoric acid ester having a fluorinated alkyl group, or a phosphoric acid ester salt having a fluorinated alkyl group, an ether of an alcohol having a fluorinated alkyl group and phosphoric acid, a phosphonic acid having a fluorinated alkyl group, Phosphonic acid ester having fluorinated alkyl group, phosphonic acid ester salt having fluorinated alkyl group, compound having carboxy group and fluorinated alkyl group (fatty acid having fluorinated alkyl group), silane cup having fluorinated alkyl group A compound such as a ring agent is used.

"Hydrophilic electrode formation process"
FIGS. 4E and 4F show a hydrophilic electrode forming step in the process of manufacturing the circuit board of the present embodiment. FIG. 6A is a plan view corresponding to FIG. As shown in FIG. 4 (e), the hydrophilic electrode forming step removes the first thin film at the place to be connected to the second conductor in the first conductor to remove the hydrophilic (liquid repellent). This is a step of forming a through hole having an electrode surface. Similar to the through hole forming step, this step also applies the pattern forming method described in the first embodiment.

  The circuit board 1 may require connection between the first conductor and the second conductor. For example, in an electrode pad 111 that connects a scanning line to an external control circuit, it may be desired to connect the electrode pad of the first conductor and the scanning line of the second conductor. For example, when configuring a series circuit of inverters or a pixel circuit of an organic EL display, the output (drain electrode, first conductor) of one transistor is connected to the input (gate electrode, second conductor) of another transistor. It is sometimes done. As described above, depending on the circuit board 1, there is a case where the connection between the first conductor and the second conductor is required. At this time, this hydrophilic electrode forming step is performed. This is because the electrical connection stability between the first conductor and the second conductor is increased and the next second conductor forming step is desired to be performed by a printing method. When the surface of the first conductor is liquid repellent, poor connection is likely to occur. Therefore, it is desirable that the surface of the first conductor is hydrophilic in order to obtain an electrical connection with a high yield. Further, since the conductor printing ink using water or an alcohol solvent is used in the printing method of the second conductor, if the surface of the first conductor is liquid repellent, the conductor ink is repelled, and the through hole is formed. The first conductor cannot be drawn on the part. For these reasons, it is desirable that the surface of the first conductor where the connection between the first conductor and the second conductor is required be hydrophilic.

  In the hydrophilic electrode forming step, as shown in FIG. 4E, first, as a polymer solution dropping step, it is desired to form a hydrophilic electrode from a polymer solution in which polyvinylphenol is dissolved in γ-butyrolactone to a concentration of 0.2%. It was dripped by the inkjet method 51 on the 1st thin film on the 1st conductor (for example, on the electrode pad 111). Here, the droplet 52 of the polymer solution of about 25 pL was dropped four times. Next, as a second solvent contact step, the substrate was immersed in isopropyl alcohol at 27 ° C. for 2 minutes. Thus, as shown in FIG. 4 (f) and FIG. 6 (a), the through-hole 32 is provided at a site where a hydrophilic electrode opening is required, such as on the electrode pad 111. As described in the through hole forming step, a third solvent dropping step may be performed prior to the polymer solution dropping step.

  In addition, as described above, when the liquid repellent process can be selectively made liquid repellent by using the ink jet method, this hydrophilic electrode forming process is unnecessary. In that case, all the through-holes 32 are opened during the through-hole forming step, and the liquid-repellent electrode surface and the hydrophilic electrode surface are separately formed using the ink jet method during the liquid-repellent step. Specifically, since the electrode surface that is not subjected to any treatment is hydrophilic, the fluorinated alkylthiol 62 is dropped only in the through-hole 32 where the liquid-repellent electrode surface is desired.

"Second conductor formation process"
FIG. 4G shows a second conductor forming step in the manufacturing process of the circuit board 1 of the present embodiment. FIG. 6B is a plan view corresponding to FIG. The second conductor forming step is a step of forming the second conductor on the first thin film after the liquid repellent step.

  As shown in FIG. 4G, the second conductor is formed by dripping the ink 53 for the conductor by the ink jet method 51 and then firing it so that the second electrode is called the gate electrode 12 or a scanning line (not shown). A pattern of two conductors is formed. As the conductor ink 53, it is desirable to use an ink in which silver nanoparticles that can be baked at a low temperature are dispersed. Here, a conductor ink 53 (hereinafter abbreviated as silver ink) in which silver nanoparticles are dispersed in a mixed solvent of water and propanediol was used. In order to print a thin line having a line width of about 40 μm by the ink-jet method 51, it is desirable that the surface tension of the conductor ink 53 be in the range of 40 mN / m to 60 mN / m. In this way, the wetting and spreading of the ink dropped on the organic insulator can be controlled to be small, and a thin wiring is drawn. In addition, in order to print by the ink jet method 51, it is necessary that the viscosity of the conductor ink 53 is adjusted within a range of 1 mPs · s to 20 mPs · s. Furthermore, in order to prevent functional deterioration of organic substances such as semiconductor materials during firing of the conductor ink 53, it is desirable that the conductor ink 53 can be fired under processing conditions within a temperature range of 80 ° C to 150 ° C. The silver ink used here became a sufficiently low conductor having a specific resistance of 50 μΩcm or less after firing by performing a heat treatment at 100 ° C. for 30 minutes in the air.

  As the dispersion medium for the conductor ink 53, water or glycol having a large surface tension of 72 mN / m, or a substance containing a mixed solvent thereof is preferable because of its large surface tension. When it is difficult to draw a continuous line because the viscosity is too low or the surface tension is too high with water alone, an alcohol solvent, a diol solvent, or a glycerin solvent is added to water.

  In addition to silver ink, ink in which carbon (carbon black, graphite, carbon nanotube, fullerene, graphene, or the like) is dispersed in the above-described dispersion medium can also be used. In the present embodiment, since the surface of the second conductor was not desired to be liquid repellent, the liquid repellent step was performed prior to the second conductor forming step. In the case of using an ink in which carbon is dispersed, the surface of the carbon ink is not liquid repellent even if a liquid repellent process is performed. Therefore, in this case, the liquid repellent process may be performed after the second conductor forming process.

  As shown in FIG. 6B, silver ink is printed from the electrode pad 111 having a hydrophilic electrode opening to the scanning line and the gate electrode 12. Thereby, the electrode pad 111 made of the first conductor can be connected to the scanning line and the gate electrode 12. The wiring and electrode pads connected to the external control circuit are formed with the pattern of the first conductor using a photolithography process, so high-density wiring with a line and space of 50 μm or less is possible. This is useful for miniaturization of electronic equipment using the circuit board 1.

"Second insulating film formation process"
FIGS. 5H and 5I show a second insulating film forming step in the circuit board manufacturing process of the present embodiment. FIG. 7C is a plan view corresponding to FIG. If there is a second conductor on the circuit board, the second insulating film forming step is performed after the second conductor forming step.

  The second insulating film is an interlayer insulating film, and mainly electrically separates the second conductor and the third conductor. In order to form the second insulating film, as shown in FIG. 5 (h), first, the precursor resin of the interlayer insulating film is printed so as to avoid the through holes 32, and then as shown in FIG. 5 (i). Then, the reaction of the precursor resin is promoted to form a second insulating film. The precursor resin contains a monomer having a hydroxyl group and is soluble in an alcohol solvent. The precursor resin is preferably a photocurable resin. Here, an ultraviolet curable resin (hereinafter abbreviated as UV ink 54) containing a hydroxy-type acrylic monomer (acrylic acid or an ester of methacrylic acid and a polyhydric alcohol) that is soluble in an alcohol solvent is used as a precursor resin. did.

  As shown in FIG. 5 (h), first, UV ink 54 is dropped onto an area other than the through-hole 32 (that is, an area where the first thin film and the second conductor are present) by the inkjet method 51. The precursor resin such as the UV ink 54 is prepared to be suitable for the ink jet method 51 and contains a monomer as a main component. The polymer component is not included in the precursor resin, or a small amount is included. The monomer preferably contains an —OH group in order to increase polarity. As such a monomer, diethylene glycol mono 2-ethylhexyl ether acrylate, tetraethylene glycol monophenyl ether acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, or the like may be used. . Since such an acrylic monomer contains an —OH group, the polarity is high, and the solubility parameter (SP value) is 9.5 or more. Therefore, the polymer of the gate insulating film 21 is not dissolved, and the adhesiveness with the gate insulating film 21 is high.

  In this way, the precursor resin is a monomer having an SP value of 9.5 or more, which has a surface tension equivalent to that of an organic solvent (20 mN / m to 35 mN / m) and a viscosity equivalent to 10 mPa · s to 30 mPa · s. In this way, the ink jet method 51 can be easily used to discharge the ink. Since the surface tension is relatively low and the viscosity is low, the UV ink 54 spreads uniformly on the organic insulator or metal material to a diameter of 5 times or more after landing. On the other hand, since the wetting angle is 45 ° or more at the exposed portion of the lyophobic electrode, spreading of the precursor resin is suppressed. As a result, the precursor resin spreads over the first thin film and the second conductor without exposing the exposed portion of the lyophobic electrode with the UV ink 54. In this way, a uniform liquid film is printed by the inkjet method 51.

  The thickness of the second insulating film is controlled by adjusting the dropping amount of the UV ink 54. When the interlayer insulating film 22 of the TFT formed on the film is used as the second insulating film as in this embodiment, the first conductor or the second conductor is also used in terms of mechanically protecting the TFT. In view of minimizing the parasitic capacitance between the conductor and the third conductor, the thickness of the interlayer insulating film 22 is preferably 1 μm or more. When the thickness of the interlayer insulating film 22 exceeds 20 μm, the substrate is warped due to the influence of the volume change when the UV ink 54 is cured. If the amount of ink dropped is too large, the wetting angle at the exposed portion will be exceeded, and it will not be possible to maintain a state in which the exposed portion of the lyophobic electrode is not covered with the UV ink 54. The wetting angle of the precursor resin on the organic insulator is 45 ° or more and 70 ° or 90 ° or less. When the thickness of the liquid film exceeds 20 μm, the contact angle that is theoretically determined from the weight of the liquid and the surface tension exceeds the previous wetting angle. In this case, since the exposed portion of the lyophobic electrode is also covered with the precursor resin, it is necessary to suppress the dripping amount so that the theoretically determined contact angle does not exceed the previous wetting angle.

  Next, as shown in FIG. 5I, the UV ink 54 is irradiated with ultraviolet rays 55 to cure the UV ink 54, thereby forming the via hole 31. In order to completely cure, heat treatment may be performed in addition to ultraviolet irradiation. Since ultraviolet rays 55 are irradiated after printing the UV ink 54, a flat second insulating film is obtained except for the exposed portions of the electrodes. Here, after the UV ink 54 is printed, the ultraviolet rays 55 are collectively irradiated. However, the ultraviolet rays 55 may be irradiated simultaneously with the printing of the UV ink 54. In this case, wetting spread is suppressed by a chemical reaction, and the controllability of not applying the UV ink 54 to the exposed portion of the electrode is increased. By providing an ultraviolet irradiation device using an LED as a light source adjacent to an inkjet head, a small-sized device can be realized.

  The UV ink 54 is not limited to an acrylic monomer, and an epoxy monomer or the like may be used. Furthermore, the precursor resin is not limited to the UV ink 54, and may be a thermosetting resin. In these cases as well, the precursor resin must not dissolve the gate insulating film, so that the polarity is increased by introducing a hydroxyl group into the epoxy monomer or thermosetting resin.

  In order to form the second insulating film having a thickness of 1 μm or more by the inkjet method, in addition to the above-described method using a curable monomer, a method using a dispersion system of surface-treated fine particles and a polymer material is used. There may be. For example, silica fine particles are surface-treated with a surfactant such as lecithin so as to be dispersed in an organic solvent, and this is mixed with a polymer resin for a binder to obtain a dispersion. This dispersion becomes a low-viscosity precursor resin and can be printed by an ink jet method. However, after it is dried, the thickness of the second insulating film can be made relatively large, such as 1 μm or more.

"Third conductor formation process"
FIG. 5J illustrates a third conductor forming process in the process of manufacturing the circuit board according to the present embodiment. FIG. 7D is a plan view corresponding to FIG. After the second insulating film is formed, a third conductor is formed in a region including the via hole 31. Here, the third conductor is the pixel electrode 13.

  The pixel electrode 13 is formed by screen printing using carbon ink. Screen printing has high printing speed and excellent productivity. On the other hand, since printing is performed with the screen in contact with the substrate, there is a risk of damaging the thin film layer when this printing method is used in the production of organic TFTs. However, in this embodiment, since the hardened thick second insulating film covers the outermost surface, even a method of printing by contact such as screen printing does not lead to defects of the organic TFT, and has excellent productivity. You can enjoy the advantage of easy printing process. Moreover, since the reaction of the second insulating film is completed, the solvent of the carbon ink is not particularly limited.

  In the carbon ink, carbon (carbon black, graphite, carbon nanotube, fullerene, graphene, etc.) is dispersed in an organic solvent. As the organic solvent, a ketone solvent, an ester solvent, an ether solvent, or the like is used. The viscosity of the carbon ink is adjusted from 2000 mPa · s to 20000 mPa · s so as to be suitable for screen printing. In this way, even if printing is performed on the surface of the liquid-repellent first conductor, the carbon ink is not repelled and is electrically connected. Further, since most of the pixel electrode 13 is formed on the interlayer insulating film 22, the pixel electrode 13 is not peeled off. However, considering the reliability of the electrical connection, the yield, etc., prior to the printing of the pixel electrode 13, plasma treatment such as oxygen plasma or ozone irradiation treatment is performed to remove the alkyl fluoride thiol 62 from the surface of the first conductor. It is desirable to remove it. The circuit board 1 having the organic TFT is manufactured through the above steps.

As described above, according to the circuit board manufacturing method of the present embodiment, the following effects can be obtained.
The through-hole 32 is opened in the first thin film on the first conductor using the pattern forming method described in detail in Embodiment 2, and the surface of the first conductor is exposed to make the surface of the first conductor liquid repellent. Then, the precursor resin is printed in a region other than the through hole 32 to form the second insulating film, so that the via hole 31 can be easily opened in the circuit board 1 by a printing method. In order not to adversely affect the electronic elements produced on the circuit board 1, the circuit board 1 exhibiting excellent circuit characteristics can be stably manufactured by a printing method with a high yield.

  Further, since the second conductor is formed on the first thin film after the lyophobic process, only the portion where the through hole 32 is opened in the first conductor is selectively lyophobic, and the second conductor is repellent. Not liquefied. Thus, in the next second insulating film forming step, the precursor resin can be printed uniformly on the second conductor, and the second conductor can be electrically insulated by the second insulating film.

  In addition, since the third conductor is formed in the region including the through hole 32 after the second insulating film forming step, electrical conduction can be established between the first conductor and the third conductor. The circuit board 1 having a complicated and highly functional circuit can be manufactured by a printing method.

  In addition, since the organic semiconductor film 41 is printed after the first conductor forming step and then the first thin film forming step is performed, an organic thin film transistor can be formed on the circuit board 1. Furthermore, a high-performance thin film transistor can be manufactured with a high degree of freedom in the process of forming the first conductor. In addition, since the photolithography process and the etching process can be used prior to the formation of the organic semiconductor film 41 and the gate insulating film 21, the channel formation region length can be extremely shortened to several microns or less. It is possible to provide a thin film transistor circuit taking advantage of the scaling advantage on the circuit board 1.

  Further, since the organic semiconductor film 41 is hardly soluble in ether solvents, ketone solvents, ester solvents, and fluorine solvents, an ink containing an organic semiconductor is used. Ready. That is, the organic semiconductor can be printed in a shape required for the circuit board 1 by a printing method such as the inkjet method 51.

  Further, since the first thin film is soluble in any of ether solvents, ketone solvents, ester solvents, and fluorine solvents, the first thin film can be formed by a printing method. In addition, since the options for the first thin film are wide, the function of the circuit board 1 can be maximized. Further, when the first thin film is used as the gate insulating film 21 of the transistor, since the first thin film material does not dissolve the organic semiconductor film 41, a thin film transistor having excellent characteristics can be produced on the circuit board 1. .

  In addition, since the first thin film is hardly soluble in alcoholic solvents, it can be used in alcoholic materials or alcoholic solvents in the liquid repellent process, the second conductor forming process, and the second insulating film forming process. In addition, since the first thin film is not damaged during these steps, the first thin film can be maintained without deteriorating the function required for the circuit board 1.

  In addition, since the first thin film is hardly soluble in the precursor resin, the first thin film is not damaged by the precursor resin during the second insulating film forming step. Can maintain the required functions without deteriorating.

  In the through-hole forming step, the polymer solution is dropped onto the first thin film, and then the first thin film is brought into contact with the second solvent to dissolve the second polymer material. Can be easily formed.

  Alternatively, in the through-hole forming step, the third solvent is dropped on the first thin film so that only a small amount of the first polymer material remains in the vicinity of the dropped central portion, and then the polymer solution is dropped. Since the second polymer material is dissolved by being brought into contact with the second solvent, the fine through holes 32 can be easily and reliably formed by the printing method.

  In the liquid repellency step, the surface of the first conductor is brought into contact with the solution 61 containing the thiol compound or disulfide compound, so that only the surface of the first conductor can be easily contacted in a short time of several seconds to several minutes. It can be selectively made liquid repellent.

  Further, since the thiol compound contains a fluorinated alkyl chain, the liquid repellency of the surface to which the thiol compound is bonded can be extremely increased.

  Moreover, since the disulfide compound contains a fluorinated alkyl chain, the liquid repellency of the surface to which the disulfide compound is bonded can be extremely increased.

  In addition, since the precursor resin contains a monomer having a hydroxyl group and the first thin film is stable with respect to the alcohol-based material, the precursor resin can avoid damaging the first thin film.

  Further, since the precursor resin is soluble in an alcohol solvent, the concentration of the solution can be adjusted relatively freely, and various printing methods can be applied to the second insulating film forming step. Furthermore, since the first thin film is stable with respect to the alcohol-based material, it is possible to avoid the second insulating film forming step from damaging the first thin film.

  Further, since the precursor resin is a photocurable resin, the second insulating film can be formed quickly and easily by irradiating light.

  Further, since the precursor resin is a thermosetting resin, the second insulating film can be easily formed by a simple heat treatment.

  Moreover, since the circuit board 1 has a transistor including the gate insulating film 21 and the first thin film functions as the gate insulating film 21, the circuit board 1 having a high-functional circuit can be realized.

"Electro-optical device"
FIG. 9 is a plan view schematically showing an active matrix substrate manufactured by using the circuit substrate manufacturing method described in detail in the second embodiment.

  Pixel circuits are arranged in a matrix on the active matrix substrate 81 to form a pixel region 71. Each pixel circuit is provided with an organic TFT 72 and a pixel electrode 13, and display information from the signal line 73 to the pixel electrode 13 is controlled by a switching operation of the organic TFT 72. Specifically, the gate electrode 12 of the organic TFT 72 is connected to the scanning line 74, one of the source / drain electrodes 11 is connected to the signal line 73, and the other of the source / drain electrodes 11 is connected to the pixel electrode 13. The plurality of scanning lines 74 are connected to the scanning line electrode pads 111 and connected to an external control circuit made of a silicon chip. Similarly, a plurality of signal lines 73 are also collected on the signal line electrode pads 111 and connected to an external control circuit made of a silicon chip.

  As shown in FIG. 5 (j), the source / drain electrode 11, the electrode pad 111, and the signal line 73 (not shown) are formed of the first conductor, the gate insulating film 21 becomes the first thin film, The scanning line 74 is formed of the second conductor, the interlayer insulating film 22 is the second insulating film, and the pixel electrode 13 is formed of the third conductor. The manufacturing method of the circuit board 1 described in detail in the second embodiment is applied to manufacture the active matrix substrate 81 having such a configuration.

  FIG. 10 is a cross-sectional view schematically showing an electro-optical device using the above-described active matrix substrate.

  The electro-optical device 80 includes an active matrix substrate 81 and a front substrate 82, and an electro-optical material is sandwiched between the substrates. The electro-optic material is an electrophoretic material 83, and therefore the electro-optic device 80 is an electrophoretic display. A common electrode 86 is formed on the surface of the front substrate 82. The electro-optic material is uniformly disposed on almost the entire surface of both substrates. The common electrode 86 is also formed on almost the entire surface of the front substrate 82. A flexible printed circuit (FPC 84) is connected to the electrode pad 111. A display signal from an external control circuit is supplied to each pixel electrode 13 via the FPC 84 and the organic TFT 72 of each pixel. A protective sheet 85 is attached to the outside of the active matrix substrate 81 and the front substrate 82 to enhance the mechanical durability and chemical stability of the electro-optical device 80.

  Since such an electro-optical device 80 includes the above-described active matrix substrate 81, the display quality is high. Furthermore, since the active matrix substrate 81 is manufactured by the above-described manufacturing method of the circuit board 1, the productivity is very high, and both resources and energy are utilized with high efficiency.

"Electronics"
11A and 11B are perspective views schematically showing an electronic apparatus using the above-described electro-optical device, where FIG. 11A is a front perspective view and FIG. 11B is a rear perspective view. Here, the electronic device is an electronic book 90.

  As shown in FIG. 11A, the electronic book 90 includes an electro-optical device 80 and a housing 91. The electro-optical device 80 has a flat rectangular shape. The casing 91 is disposed on the outer edge portion of the electro-optical device 80 and holds the electro-optical device 80. That is, the housing 91 is a holding unit for the display device. The holding part is gripped by the user's hand during use.

The electro-optical device 80 has a vertically long rectangle, and the casing 91 has a thin flat plate shape. As shown in FIG. 11A, a housing upper portion 92 (an upper part of the housing 91) is provided on the front surface serving as the display surface, and on the back surface opposite to the display surface as shown in FIG. Is provided with a casing lower portion 93 (a lower part of the casing 91). The casing upper part 92 and the casing lower part 93 are both thin flat plates, and are overlapped to form a casing 91. As can be seen by comparing FIG. 11A and FIG. 11B, the width of the front casing 91 (width W _F ) is smaller than the width of the rear casing 91 (width W _B ). ing.

  Various circuits (control circuit) for controlling the electro-optical device 80, a power source, and the like are housed in the lower portion 93 of the housing, and as a result, the housing 91 is a major part of more than half of the weight of the electronic book 90. Occupies a proportion. For these reasons, the center of gravity of the electronic book 90 is located in the housing lower part 93.

  Various types of information are displayed on the display unit of the electro-optical device 80. An operation switch 94 is provided in the center of the casing 91, and information displayed on the display unit is updated through the switch operation.

  The electro-optical device 80 is light and flexible. For this reason, it is relatively strong against external impact, and it is not necessary to cover and protect the entire electro-optical device 80 with the casing 91. Thus, the housing 91 can be provided on the outer edge portion of the electro-optical device 80. Since the housing 91 does not cover the entire display device and there is no need to dispose a metal reinforcing member or the like, the entire electronic book 90 is made thin and light.

(Modification 1)
"TFT is the bottom gate type"
FIG. 12 is a cross-sectional view of a circuit board according to the first modification. Hereinafter, a circuit board and a manufacturing method thereof according to this modification will be described. In addition, about the same component as Embodiment 2, the same number is attached | subjected and the overlapping description is abbreviate | omitted. This modification (FIG. 12) differs from the second embodiment (FIG. 5 (j)) in the structure of the organic TFT. Other configurations are almost the same as those of the second embodiment.

  In the second embodiment, the gate electrode 12 of the TFT is located on the upper side with respect to the organic semiconductor film 41 (upper gate type). However, in this modification, the gate electrode 12 of the TFT is formed of the organic semiconductor film 41 as shown in FIG. It is located on the lower side (lower gate type). That is, the gate electrode 12, the gate insulating film 21, the source / drain electrode 11, the organic semiconductor film 41, the first interlayer insulating film 221, the second interlayer insulating film 222, and the pixel electrode 13 are stacked in this order from the substrate 10 side. Yes. Among these, the source / drain electrode 11 is the first conductor, the first interlayer insulating film 221 is the first thin film, the second interlayer insulating film 222 is the second insulating film, and the pixel electrode 13 is the third conductor.

  A manufacturing method of the circuit board 1 having the lower gate type organic TFT 72 is as follows. First, the gate electrode 12, the electrode pad 111, and the scanning line 74 (not shown) are formed on the substrate with the second conductor, and then the gate insulating film 21 is formed. The gate insulating film 21 is formed using a die coating method or the like so as not to cover a part of the electrode pad 111. Thereafter, a first conductor is formed on the gate insulating film 21 as a first conductor forming step. The first conductor becomes the source / drain electrode 11 and a signal line 73 (not shown). The organic semiconductor film 41 is printed immediately before or after the first conductor forming step. In this modification, printing is performed immediately after the first conductor forming step. Next, as a first thin film forming step, a first interlayer insulating film 221 is formed so as to cover the first conductor. Next, as a through hole forming step, a through hole 32 is opened in the first interlayer insulating film 221 on the source / drain electrode 11 to expose the surface of the source / drain electrode 11. Next, as a liquid repellent step, the surface of the source / drain electrode 11 provided with the through hole 32 is made liquid repellent. Next, as a second insulating film forming step, a precursor resin is printed in a region other than the through holes 32, and the precursor resin is cured after printing to form the via holes 31 and the second interlayer insulating film 222. Finally, as a third conductor forming step, the pixel electrode 13 is printed in a region including the via hole 31. Each process from the first conductor forming process to the third conductor forming process is performed as described in the second embodiment.

As described above, according to the method of manufacturing the circuit board 1 according to this modification, the following effects can be obtained in addition to the effects of the second embodiment.
The first interlayer insulating film 221 of this modification is a first thin film, and the first thin film is the gate insulating film 21 in the second embodiment. That is, the first interlayer insulating film 221 of this modification has a film quality equivalent to that of the gate insulating film 21, and therefore the interface with the semiconductor film is also made high quality. The electrical characteristics of the TFT are strongly influenced by the interface of the semiconductor film on the gate electrode 12 side, and the interface on the opposite side (back side interface) also affects the electrical characteristics. In this modification, the interface on the back side of the semiconductor is covered with a high-quality polymer film that can also be used for the gate insulating film 21. Therefore, the number of interface traps generated at the interface on the back side is suppressed, and a high-performance organic TFT 72 is obtained. Further, since the first interlayer insulating film 221 and the second interlayer insulating film 222 are provided between the signal line 73 and the pixel electrode 13, the parasitic capacitance between them is reduced and the leakage current is also reduced. The circuit will operate fast and accurately.

  In general, when a reactive monomer or curing agent is in direct contact with an organic semiconductor material, the semiconductor characteristics are deteriorated. Therefore, if the UV ink 54 is applied directly on the organic semiconductor film 41, the organic TFT is forced to deteriorate the semiconductor characteristics. However, in the present modification, the high-quality first interlayer insulating film 221 protects the organic semiconductor film 41, and the UV ink 54 does not contact the organic semiconductor film 41. For this reason, the organic TFT exhibits excellent semiconductor characteristics. As a result, the first interlayer insulating film 221 is a protective film for the organic semiconductor film 41 and simultaneously plays a role of selectively forming the second interlayer insulating film 222 in a region other than the via hole 31.

(Modification 2)
“Example in which the active matrix substrate 81 includes capacitance lines”
FIG. 13 is a plan view of the circuit board manufacturing method according to the second modification. Hereinafter, the circuit board 1 according to this modification and the manufacturing method thereof will be described. This modified example (FIG. 13) is different from the second embodiment (FIG. 6B) in that a capacitor electrode is provided on the circuit board 1. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.

  In this modification, a storage capacitor is formed in the pixel circuit. The storage capacitor includes a first capacitor electrode, a second capacitor electrode 121, and a dielectric film sandwiched between these electrodes. The first capacitor electrode is connected to a pixel electrode (not shown), and the second capacitor electrode 121 is connected to a reference potential such as a ground potential or a common electrode potential. In the circuit board 1, a source / drain electrode 11 is formed of a first conductor, one of which is connected to the signal line 73 and the other is connected to a pixel electrode (not shown), but the first capacitor electrode is the other source. Also used as the drain electrode 11. The dielectric film is the same first thin film as the gate insulating film. As shown in FIG. 13, the second capacitor electrode 121 is formed of the same second conductor as that of the gate electrode 12. In order to connect the second capacitor electrode 121 to the reference potential, the capacitor common line 112 and a plurality of capacitor electrodes are connected. The capacitor common line 112 is formed of a first conductor, and is connected to the second capacitor electrode 121 through the through hole 32 provided in the capacitor common line 112. Therefore, the electrode surface of the through hole 32 is hydrophilic. The circuit board 1 having such a configuration is manufactured by the manufacturing method described in detail in the second embodiment.

  When the pixel circuit has a storage capacitor in the electrophoretic display, a voltage is applied to the electrophoretic material throughout the frame period, so that a high-contrast image can be easily displayed.

(Modification 3)
“Example of drive circuit partially built in TFT”
FIG. 14 is a plan view of a circuit board according to the third modification. FIG. 15 is a cross-sectional view of a circuit board according to the third modification. Hereinafter, the circuit board 1 according to this modification and the manufacturing method thereof will be described. This modification (FIG. 14) differs from the active matrix substrate 81 (FIG. 9) described in the second embodiment in that a part of the drive circuit is built in the TFT. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.

  In this modification, as shown in FIG. 14, the organic TFT 72 constitutes a scanning circuit 75 that is a part of the drive circuit. The scanning circuit 75 includes a shift register and can select the scanning line 74. A series connection of inverters is used in the shift register, and FIG. 15 schematically shows a cross section of that portion. That is, the drain electrode 114 of the first organic TFT 721 becomes an output, and this is connected as an input to the gate electrode 12 of the second organic TFT 722. The circuit board 1 having such a configuration is manufactured by the manufacturing method described in detail in the second embodiment. Note that the electrode surface of the through hole 32 provided in the drain electrode 114 of the first organic TFT 721 is made hydrophilic.

  Since the drive circuit of the active matrix substrate 81 is partially built in, the electro-optical device 80 that displays a high-definition image can be obtained.

(Modification 4)
“Example of thin glass substrate”
This will be described with reference to FIG.
This modification differs from Embodiment 2 in that the substrate is thin glass. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.

  In the second embodiment, the substrate 10 is a plastic film, but the substrate 10 is not limited to this. For example, after the process described in detail in Embodiment 2 is performed on the surface of the glass substrate having a thickness of 0.5 mm to 1.1 mm, the back surface of the glass substrate may be etched to reduce the thickness to 0.1 mm or less. When the thickness of the glass substrate is 0.1 mm or less, flexibility is exhibited.

  In this way, a glass substrate having a normal thickness of 0.5 mm to 1.1 mm can be used when the circuit board 1 is manufactured, and then the flexible circuit board 1 can be relatively easily obtained simply by thinning the glass. Can be manufactured.

(Modification 5)
"Example where the substrate is a thin metal plate"
This will be described with reference to FIG.
This modification is different from the second embodiment in that the substrate is a thin metal plate. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.

  In the second embodiment, the substrate 10 is a plastic film, but the substrate 10 is not limited to this. For example, a thin stainless steel substrate may be covered with an inorganic insulating film such as a silicon oxide film or a nitrogen oxide film, or an organic insulating film such as polyimide, and used as the substrate 10. When a metal plate is used as the substrate 10, the substrate potential can be freely set, and the threshold voltage Vth of the organic TFT 72 can be easily adjusted. The surface of the organic insulating film is easily charged during manufacture. Therefore, if the charge removal on the insulating film surface is not performed properly, the Vth of the organic TFT 72 will deviate from the design value. In this modification, the organic TFT 72 can be operated correctly by adjusting the substrate potential even if the Vth shifts.

(Modification 6)
“Examples of electro-optic materials other than electrophoretic materials”
This will be described with reference to FIG.
This modification differs from Embodiment 2 in that a liquid crystal material or the like is used instead of the electrophoretic material 83 as an electro-optic material. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.

  In the second embodiment, the electrophoretic material 83 is used as the electro-optic material. However, as the electro-optic material, a liquid crystal material, an organic or inorganic electroluminescence (EL) material, an electrochromic material, or the like is also used. You may do it. Accordingly, the electro-optical device 80 is a liquid crystal display (LCD), an organic or inorganic electroluminescence display (also called a light emitting diode display, LED display), an electrochromic display (ECD). Etc. Examples of the electronic apparatus having the electro-optical device 80 include an electronic book, a television, a mobile phone, and a personal computer.

(Modification 7)
“Example of common electrode made on the first substrate”
This will be described with reference to FIG.
Modification 7 differs from Embodiment 2 (FIG. 10) in that the common electrode 86 is formed on the first substrate side. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.
In the second embodiment (FIG. 10), the common electrode 86 is formed on the front substrate 82, but this is not essential, and the common electrode 86 may be formed on the active matrix substrate 81. In this case, the common electrode 86 is provided in each pixel of the active matrix substrate 81, and a so-called in-plane switch type electro-optical device in which an electric field having an electric field component parallel to the surface of the active matrix substrate 81 is applied to the electro-optical material. 80. Applicable to EPDs and wide viewing angle liquid crystal displays that perform lateral electrophoresis.

(Modification 8)
"Example of multilayer wiring board"
FIG. 16 is a cross-sectional view of a circuit board according to Modification 8.
The modification 8 differs from the second embodiment (FIG. 5 (j)) in that the circuit board is a multilayer wiring board. Other configurations are substantially the same as those of the second embodiment, and a duplicate description is omitted.
In Embodiment 2 (FIG. 5 (j)), the organic TFT is provided on the circuit board, but this is not essential, and the circuit board may be a multilayer wiring board.

  As shown in FIG. 16, the multilayer wiring substrate 100 is laminated in the order of the first wiring 113, the first interlayer insulating film 221, the second interlayer insulating film 222, and the second wiring 131 from the substrate side. Among these, the first wiring 113 is the first conductor, the first interlayer insulating film 221 is the first thin film, the second interlayer insulating film 222 is the second insulating film, and the second wiring 131 is the third conductor. .

  A method of manufacturing the circuit board 1 having such multilayer wiring is as follows. First, the first wiring 113 is formed on the substrate as a first conductor forming step. Next, as a first thin film forming step, a first interlayer insulating film 221 is formed so as to cover the first conductor. Next, as a through hole forming step, the through hole 32 is opened in the first interlayer insulating film 221 of the first wiring 113 to expose the surface of the first wiring 113. Next, as a liquid repellent step, the surface of the first wiring 113 provided with the through holes 32 is made liquid repellent. Next, as a second insulating film forming step, a precursor resin is printed in a region other than the through hole 32, and the precursor resin is cured after printing to form the second interlayer insulating film 222 and the via hole 31. Next, as a third conductor forming step, metal ink is printed in a region including the via hole 31 to form the second wiring 131. Prior to printing the metal ink, the fluorinated alkyl thiol 62 (not shown) is removed from the bottom surface of the via hole 31. Thus, each process from the first conductor forming process to the third conductor forming process is performed by the method described in the second embodiment, and a two-layer wiring board is completed.

  One cycle for producing the multilayer wiring is from the first thin film forming step to the third conductor forming step, and the above-mentioned third conductor is the first conductor in the next cycle. It is also possible to obtain a multilayer wiring substrate 100 having a large number of wiring layers by repeating a plurality of times.

  In the above description, the names of the first conductor, the second conductor, and the third conductor are used for the three types of conductors. It is a name and does not specify the order of formation. Furthermore, three types of conductors are not required in the circuit board 1. For example, the circuit board 1 is provided with a first conductor, a first thin film covering the first conductor, and a second insulating film as a protective film for the first conductor, and a probe is provided on the first conductor with a probe card. The present invention can also be applied to a circuit board 1 having only one type of conductor, such as a structure having a via hole 31 for contacting each other.

  In the description so far, the names of the first solvent, the second solvent, and the third solvent are used for the three types of solvents, but these are names for distinguishing the types of the solvents. It is not a thing that specifies the order of use.

  DESCRIPTION OF SYMBOLS 1 ... Circuit board, 10 ... Board | substrate, 11 ... Source-drain electrode, 12 ... Gate electrode, 13 ... Pixel electrode, 21 ... Gate insulating film, 22 ... Interlayer insulating film, 31 ... Via hole, 32 ... Through-hole, 41 ... Organic Semiconductor film 51 ... Inkjet method 52 ... Droplet 53 ... Conductor ink 54 ... UV ink 55 ... Ultraviolet light 61 ... Solution 62 ... Alkyl thiol 72 ... Organic TFT 80 ... Electro-optical device 81 ... Active matrix substrate, 90 ... Electronic book, 100 ... Multi-layer wiring substrate, 111 ... Electrode pad, 113 ... First wiring, 131 ... Second wiring, 211 ... Insulating film, 221 ... First interlayer insulating film, 222 ... second interlayer insulating film.

Claims (22)

A pattern forming method for a first thin film provided on a substrate,
The first thin film is made of a first polymer material,
A polymer solution dropping step in which a polymer solution in which a second polymer material is dissolved in a first solvent that dissolves the first polymer material is dropped on the first thin film;
A second solvent contact step of contacting the first thin film with the second solvent after the first solvent is dried,
The pattern forming method, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material. A pattern forming method for a first thin film provided on a substrate,
The first thin film is made of a first polymer material,
A third solvent dropping step of dropping a third solvent that dissolves the first polymer material on the first thin film;
After the third solvent is dried, a polymer solution dropping step of dropping a polymer solution in which the second polymer material is dissolved in the first solvent in which the first polymer material is dissolved into the first thin film;
A second solvent contact step of contacting the first thin film with the second solvent after the first solvent is dried,
The pattern forming method, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material.   3. The pattern forming method according to claim 1, wherein the molecular weight of the second polymer material is in the range of 500 or more and 50000 or less. A first conductor forming step of forming a first conductor on the substrate;
A first thin film forming step of forming a first thin film made of a first polymer material so as to cover the first conductor;
Forming a through hole in the first thin film on the first conductor and exposing a surface of the first conductor;
The through-hole forming step includes a polymer solution dropping step in which a polymer solution in which a second polymer material is dissolved in a first solvent that dissolves the first polymer material is dropped on the first thin film;
A second solvent contact step of contacting the first thin film with the second solvent after the first solvent is dried,
The method of manufacturing a circuit board, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material. A first conductor forming step of forming a first conductor on the substrate;
A first thin film forming step of forming a first thin film made of a first polymer material so as to cover the first conductor;
Forming a through hole in the first thin film on the first conductor and exposing a surface of the first conductor;
The through-hole forming step includes a third solvent dropping step of dropping a third solvent that dissolves the first polymer material on the first thin film;
After the third solvent is dried, a polymer solution dropping step of dropping a polymer solution in which the second polymer material is dissolved in the first solvent in which the first polymer material is dissolved into the first thin film;
A second solvent contact step of contacting the first thin film with the second solvent after the first solvent is dried,
The method for manufacturing a circuit board, wherein the second solvent does not dissolve the first polymer material but dissolves the second polymer material.   The method for producing a circuit board according to claim 3 or 4, wherein the molecular weight of the second polymer material is in the range of 500 or more and 50000 or less. A liquid repellency step for making the surface of the first conductor liquid repellant after the through hole forming step;
5. A second insulating film forming step of printing a precursor resin in a region other than the through hole and curing the precursor resin after printing to form a second insulating film. The manufacturing method of the circuit board as described in any one of thru | or 6. After the liquid repellency step, including a second conductor forming step of forming a second conductor on the first thin film,
The method for manufacturing a circuit board according to claim 7, wherein the second insulating film forming step is performed after the second conductor forming step.   9. The method of manufacturing a circuit board according to claim 7, further comprising a third conductor forming step of forming a third conductor in a region including the through hole after the second insulating film forming step. After the first conductor forming step, including a semiconductor film forming step of printing an organic semiconductor film,
The method for manufacturing a circuit board according to claim 4, wherein the first thin film forming step is performed after the semiconductor film forming step.   11. The organic semiconductor film according to claim 10, wherein the organic semiconductor film exhibits poor solubility in an ether solvent, a ketone solvent, an ester solvent, and a fluorine solvent. Circuit board manufacturing method.   The circuit board according to any one of claims 4 to 11, wherein the first thin film is soluble in any of an ether solvent, a ketone solvent, an ester solvent, and a fluorine solvent. Production method.   The method of manufacturing a circuit board according to any one of claims 4 to 12, wherein the first thin film is hardly soluble in an alcohol solvent.   The method of manufacturing a circuit board according to any one of claims 7 to 12, wherein the first thin film is hardly soluble in the precursor resin.   The method for manufacturing a circuit board according to any one of claims 7 to 9, wherein in the liquid repellent step, the surface of the first conductor is brought into contact with a solution containing a thiol compound or a disulfide compound.   The method for manufacturing a circuit board according to claim 15, wherein the thiol compound includes a fluorinated alkyl chain.   The method of manufacturing a circuit board according to claim 15, wherein the disulfide compound includes a fluorinated alkyl chain.   The method for manufacturing a circuit board according to claim 7, wherein the precursor resin contains a monomer having a hydroxyl group.   The method for manufacturing a circuit board according to claim 7, wherein the precursor resin is soluble in an alcohol solvent.   The method for manufacturing a circuit board according to claim 7, wherein the precursor resin is a photocurable resin.   The method for manufacturing a circuit board according to claim 7, wherein the precursor resin is a thermosetting resin. The circuit board includes a transistor including a gate insulating film,
The method for manufacturing a circuit board according to any one of claims 4 to 21, wherein the first thin film functions as the gate insulating film.

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