JP2012074715A5 - - Google Patents

Download PDF

Info

Publication number
JP2012074715A5
JP2012074715A5 JP2011248901A JP2011248901A JP2012074715A5 JP 2012074715 A5 JP2012074715 A5 JP 2012074715A5 JP 2011248901 A JP2011248901 A JP 2011248901A JP 2011248901 A JP2011248901 A JP 2011248901A JP 2012074715 A5 JP2012074715 A5 JP 2012074715A5
Authority
JP
Japan
Prior art keywords
adhesive layer
semiconductor element
support member
bonded
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011248901A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012074715A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011248901A priority Critical patent/JP2012074715A/ja
Priority claimed from JP2011248901A external-priority patent/JP2012074715A/ja
Publication of JP2012074715A publication Critical patent/JP2012074715A/ja
Publication of JP2012074715A5 publication Critical patent/JP2012074715A5/ja
Pending legal-status Critical Current

Links

JP2011248901A 2006-03-16 2011-11-14 接着シート Pending JP2012074715A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011248901A JP2012074715A (ja) 2006-03-16 2011-11-14 接着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006072624 2006-03-16
JP2006072624 2006-03-16
JP2011248901A JP2012074715A (ja) 2006-03-16 2011-11-14 接着シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006303168A Division JP5023664B2 (ja) 2006-03-16 2006-11-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2012074715A JP2012074715A (ja) 2012-04-12
JP2012074715A5 true JP2012074715A5 (enrdf_load_stackoverflow) 2012-11-29

Family

ID=46170536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011248901A Pending JP2012074715A (ja) 2006-03-16 2011-11-14 接着シート

Country Status (1)

Country Link
JP (1) JP2012074715A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232187A (ja) * 1993-01-29 1994-08-19 Hitachi Ltd 樹脂材料およびその樹脂材料の製造方法ならびにその樹脂材料を用いた半導体集積回路装置

Similar Documents

Publication Publication Date Title
JP2013539051A5 (enrdf_load_stackoverflow)
JP2012033615A5 (enrdf_load_stackoverflow)
BR112016003376A2 (pt) Métodos de preparação de superfície antes de ligação adesiva e de ligação, substrato compósito curado, estrutura ligada de forma covalente, e, estrutura compósita curável
CL2013003524A1 (es) Núcleo absorbente que comprende material absorbente con peso base que varía a través del núcleo y comprende una estructura absorbente que incluye una capa de sustrato y una capa absorbente con material absorbente; artículo absorbente desechable.
JP2016512050A5 (enrdf_load_stackoverflow)
PL2654470T3 (pl) Układ wytwarzania aerozolu posiadający środki obsługujące zużywanie ciekłego substratu
HUE055526T2 (hu) Vékonyréteg fényelektromos eszköz hullámos monolit összekapcsolásokkal
EP2781569A4 (en) BONDING FILM
EP2767566A4 (en) BONDING FILM
DE112011102278T8 (de) Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung
JP2011100877A5 (enrdf_load_stackoverflow)
EP2672507A4 (en) Bonding-sbstrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
JP2014237545A5 (enrdf_load_stackoverflow)
JP2015173244A5 (enrdf_load_stackoverflow)
JP2012030068A5 (enrdf_load_stackoverflow)
JP2017538810A5 (enrdf_load_stackoverflow)
JP2012507405A5 (enrdf_load_stackoverflow)
JP2013140343A5 (enrdf_load_stackoverflow)
JP2013023736A5 (enrdf_load_stackoverflow)
JP2014513003A5 (enrdf_load_stackoverflow)
JP2012068249A5 (enrdf_load_stackoverflow)
JP2012101354A5 (enrdf_load_stackoverflow)
JP2014531010A5 (enrdf_load_stackoverflow)
IT1401736B1 (it) Dispositivo di perforazione per l'esecuzione di diaframmi e relativo metodo.
PL2416386T3 (pl) Sposób wytwarzania urządzenia półprzewodnikowego z warstwą pasywacji i odpowiednie urządzenie półprzewodnikowe