JP2012059507A - Connector structure between boards - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a short connector structure between boards which can easily attach and detach an integrated circuit board while securely preventing the integrated circuit board from being separated in a natural state.SOLUTION: A connector structure between boards has an insulation assembly 30 with a spring protrusion part 32 with an engagement part 32b projecting on the side of a first circuit board 10 on the side of an opposite surface 11b with a cross-shaped slit 13 (female type terminal part) provided. The insulation assembly 30 has a second circuit board 20 with a columnar bump 22 (male type terminal part) positioned to have the first circuit board 10 in-between. The second circuit board 20 has an engagement hole 24 formed to receive the spring protrusion part 32. Also, the engagement part 32b is engaged on a peripheral part of the engagement hole 24 while the insulation assembly 30, the first circuit board 10, and the second circuit board 20 are integrated.

Description

  The present invention relates to an inter-board connector structure for detachably combining two circuit boards.

  In recent years, electronic devices such as mobile phones and personal computers have been increasingly demanded for miniaturization and high performance, and the circuits built in such electronic devices have been reduced in the height of inter-board connection connectors that unite circuit boards together. By enabling (thinning), downsizing can be achieved.

  In response to the demand for a low profile of such an inter-board connector, conventionally, a female terminal portion formed on one circuit board is connected to a through hole formed in an insulating film and a pad connected to the through hole. There is one in which the male terminal part formed on the other circuit board is formed with a conductive protrusion that is inserted into the small hole of the female terminal part (for example, a patent) Reference 1).

Japanese Patent No. 4059522

  However, in the above conventional board-to-board connector structure, the two circuit boards are merged by the small holes of the female terminal part and the conductive projections of the male terminal part, so that the circuit board is repeatedly attached and detached. In this case, elastic deterioration occurs in the pad portion in which the small holes are formed. When the elastic deterioration occurs in this way, the retention strength of the conductive protrusions deteriorates and the connection strength between the two circuit boards joined together is lowered, and a poor conduction between the female and male terminal portions is caused. There is a risk.

  Further, in Patent Document 1, a circuit board provided with a male terminal portion is provided with a columnar guide and a hole-shaped columnar guide separately from the conductive protrusion, and a circuit board provided with a female terminal portion. Discloses that a female guide for receiving the guide protrusions is formed.

  By inserting the guide protrusion into the female guide in this way, the fixing position of the two circuit boards can be stabilized. In this case, the female guide is an opening formed on the circuit board side. Can be considered.

  However, the circuit board on which the opening (female guide) is formed is required to have a certain degree of rigidity in order to guide the guide protrusion, even though it has flexibility. Further, in order to fit the guide protrusions while positioning them in the opening, it is necessary to increase the fitting accuracy between them. For this reason, when the two circuit boards are combined, there is a problem that the insertion of the guide protrusion into the opening becomes difficult and the connection becomes difficult. In addition, as in the columnar guide and the columnar guide with a hole shown in Patent Document 1, when the outer circumferences of these guide projections are simply formed with the same diameter over the entire length, the guide projections inserted into the openings are externally provided. There is a risk that the combined circuit boards may be separated in a natural state.

  Accordingly, the present invention provides a board-to-board connector structure capable of facilitating the removal and mounting of a circuit board and achieving a more reliable prevention of separation of a circuit board once combined in a natural state while achieving a low profile. With the goal.

  In order to solve this problem, in the inter-board connector structure of the present invention, the first circuit board on which one of the female terminal part and the male terminal part is formed, the female terminal part, and the male type A second circuit board on which the other of the terminal parts is formed, and the first circuit board and the second circuit board are combined while the female terminal part and the male terminal part are in contact with each other. In the inter-board connector structure to be provided, the first circuit board is disposed on the side opposite to the surface on which the terminal portion is formed, and is contracted with a radial elastic force on the side facing the first circuit board. An insulating assembly having a spring projection having a locking portion at a tip thereof that is free to be provided is provided, a locking hole that receives the spring projection is provided in the second circuit board, and A second circuit board is coupled to the insulating assembly In the state where the insulating circuit assembly, the first circuit board, and the second circuit board are combined, the locking portion is placed on the peripheral edge of the locking hole. It is characterized by being locked.

  According to the inter-board connector structure of the present invention, the combination of the first circuit board and the second circuit board is performed via an insulating assembly provided with a protruding spring protrusion. That is, while the first circuit board is sandwiched between the insulating assembly and the second circuit board, the second circuit board is inserted while the spring protrusion is inserted into the locking hole of the second circuit board. Against the insulating assembly as a whole. Then, the female terminal portion and the male terminal portion of the first circuit board and the second circuit board are in contact with each other and are electrically connected to each other, and the locking portion of the spring protrusion is the periphery of the locking hole. It is locked to the part.

  Therefore, the insulating assembly only needs to have sufficient strength to project the spring protrusion, and can be thinned by selecting a material for forming the insulating assembly. Therefore, it is possible to reduce the height of the inter-board connector that is formed by combining the first circuit board, the second circuit board, and the insulating assembly.

  Further, since the spring protrusion can be reduced in diameter with a radial elastic force, the spring protrusion can be extracted from the locking hole by reducing the diameter of the spring protrusion. Thereby, the first circuit board and the second circuit board can be easily attached and detached.

  Further, the combined state of the first circuit board and the second circuit board is held once because the locking portion provided at the tip of the spring projection is locked to the peripheral edge of the locking hole. It is possible to more reliably prevent the separated circuit board from separating in a natural state.

FIG. 1 is a view showing a first circuit board used in a board-to-board connector structure according to an embodiment of the present invention, and (a) is a side view along the width direction (left-right direction) of (b). , (B) is a bottom view of the main part. 2A and 2B are views showing a second circuit board used in the board-to-board connector structure according to the embodiment of the present invention. FIG. 2A is a plan view, and FIG. 2B is a width direction of FIG. It is a side view along a horizontal direction. FIG. 3: shows the insulating assembly used for the board-to-board connector structure concerning one Embodiment of this invention, (a) is a side view in alignment with the width direction (left-right direction) of (b), (b) is It is a bottom view of the principal part. FIG. 4 is a front view showing an assembled state of the inter-board connector structure according to the embodiment of the present invention. FIG. 5 is an enlarged view of a portion I in FIG. 6 is a cross-sectional view taken along the line AA in FIG. FIG. 7 is a cross-sectional view taken along the line BB in FIG. 8A and 8B show a modification of the spring protrusion shown in FIG. 3, wherein FIG. 8A is a cross-sectional view of the two-branch spring protrusion, and FIG. 8B is a cross-sectional view of the three-branch spring protrusion. FIG. 9 shows a modification of the spring protrusion shown in FIG. 8A, FIG. 9A is a schematic plan view in which the main projecting directions of a plurality of spring protrusions intersect at right angles, and FIG. It is the typical top view which crossed the main bullet direction of the spring protrusion diagonally.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 to 7 show an embodiment of a board-to-board connector structure according to the present invention. The first circuit board 10 shown in FIG. 1 and the second circuit board 20 shown in FIG. The board-to-board connector 1 shown in FIG. 4 is configured by combining them using the insulating assembly 30 shown in FIG.

  As shown in FIGS. 1A and 1B, the first circuit board 10 has one side surface of a first insulating substrate 11 made of an insulating film such as polyimide resin or glass epoxy (glass epoxy) (FIG. 1A). A plurality of conductor circuits 12 are patterned on the middle and lower surface 11a to form an FPC board. A cross-shaped slit 13 as a female terminal portion is provided at each end of the conductor circuit 12.

  As shown in FIG. 5, the cross-shaped slit 13 is formed concentrically at the center of the wide cross-shaped pad portion 12 a provided at the end of the conductor circuit 12. At this time, the cross-shaped slit 13 penetrates the cross-shaped pad portion 12a and the first insulating substrate 11, as shown in FIG.

  In this embodiment, the first insulating substrate 11 has a long length extending in the vertical direction in FIG. 1B, and the plurality of cross-shaped slits 13 are formed in the length direction of the first insulating substrate 11 ( A plurality of rows (four rows in the present embodiment) and a plurality of columns (six columns in the present embodiment) are arranged in a matrix in order in the vertical direction in the drawing and the width direction (left and right in the drawing). Even in the second circuit board 20 and the insulating assembly 30 described below, the direction along the length direction of the first insulating board 11 is the length direction, and the direction along the width direction is the width direction. Shall be stated.

  As shown in FIGS. 2A and 2B, the second circuit board 20 includes a rectangular second insulating substrate 21 with four corners chamfered, and one side surface of the second insulating substrate 21 (FIG. b) Middle upper surface) It is formed by protruding columnar bumps 22 as male terminal portions on 21a.

  The second insulating substrate 21 is formed with a width W2 (see FIG. 2A) larger than the width W1 (see FIG. 1B) of the first insulating substrate 11, and W1 <W2. At this time, the width W <b> 2 of the second insulating substrate 21 is wider than the first insulating substrate 11 in the dimension in which the locking holes 24 described later are provided at both ends in the width direction of the second insulating substrate 21. That is, as shown in FIG. 2A, when the formation space dimension in the width direction of the locking hole 24 is S, W2> W1 + 2S.

  The columnar bumps 22 are formed in a cylindrical shape with a diameter that is inserted (press-fit) into the cross-shaped slit 13 of the first circuit board 10 while deforming the peripheral portion of the cross-shaped slit 13 together with the first insulating substrate 11. Yes. At this time, the columnar bump 22 is preferably a cylindrical shape having a circular cross section in order to push the cruciform slit 13 equally in the circumferential direction. In particular, the cross sectional shape is not limited to a circular shape, and is not a non-circular shape such as an ellipse or a polygon. It may be circular.

  Further, the columnar bumps 22 are formed of a conductive material such as metal or conductive resin, and the base portion 22a of the columnar bumps 22 penetrates through the insertion holes 23 formed in the second insulating substrate 21, as shown in FIG. Have been planted. The columnar bumps 22 protruding from the one side surface 21a of the second insulating substrate 21 are offset from the base portion 22a implanted in the second insulating substrate 21. The columnar bumps 22 and the base portion 22a are in contact with the second insulating substrate 21. Are connected by dumbbell-shaped connecting plates 22b arranged along one side surface 21a.

  The base portion 22a of the columnar bump 22 slightly protrudes from the other side surface 21b of the second insulating substrate 21, and a hook-shaped locking portion 22c is formed at the protruding end portion. Then, the base 22a and the columnar bumps 22 are prevented from being detached from the second insulating substrate 21 by the locking portions 22c, and the exposed front end surface of the locking portions 22c is not connected to other circuit boards or electronic components not shown. It becomes a contact point.

  Of course, the columnar bumps 22 are provided at positions corresponding to the cross-shaped slits 13 arranged in a matrix, and the plurality of columnar bumps 22 are also arranged in a matrix.

  As shown in FIGS. 3A and 3B, the insulating assembly 30 is integrally formed of an insulating material such as a synthetic resin to form a terminal portion (cross-shaped slit 13) of the first circuit board 10. It is disposed on the side opposite to the surface, that is, on the other side surface 11b side of the first insulating substrate 11 (upper in FIG. 1A).

  The insulative assembly 30 includes a base plate 31 formed in a rectangular shape having substantially the same outer shape as the second insulating substrate 21, and spring protrusions 32 and both end portions in the width direction of one side surface 31 a of the base plate 31. Pilot pillars 33 are provided in a protruding manner.

  On the other hand, pilot holes 14 through which the pilot pillars 33 are inserted are formed at positions corresponding to the pilot pillars 33 at both ends in the width direction of the first insulating substrate 11. In addition, at both ends in the width direction of the second insulating substrate 21, the locking holes 24 through which the spring projections 32 are inserted and the pilots through which the pilot columns 33 are inserted at positions corresponding to the spring projections 32 and the pilot columns 33, respectively. A hole 25 is formed. In this case, the pilot hole 14 of the first insulating substrate 11 and the pilot hole 25 of the second insulating substrate 21 are formed at the same position in the same diameter and face-to-face state.

  The spring protrusions 32 are located at both ends in the width direction of the base plate 31 and are arranged in pairs in the length direction at both ends in the width direction, so that a total of four spring protrusions 32 are provided. It has been. In addition, the pilot pillars 33 are located on the inner side in the width direction than the spring protrusions 32, and a total of two pilot pillars 33 are provided in a pair of diagonal portions of the base plate 31.

  The spring protrusion 32 is formed in a substantially cylindrical shape as a whole, and is branched into four crosses with the central axis C as the center, so that each branch piece 32a, 32a,... Has a resilient force in the radial direction. Has been. Thereby, the spring projection part 32 can be reduced in diameter with an elastic force in the radial direction as a whole.

  The number of branches of the spring protrusion 32 is not limited to four branches, but may be two branches as shown in FIG. 8 (a), for example, or three branches as shown in FIG. 8 (b). Further, although not shown, it may be five or more branches.

  Further, a locking portion 32b that is locked to the outer peripheral side (other side surface 21b) of the locking hole 24 described above is provided at the tip of the spring protrusion 32. The outer surface of the locking portion 32b is formed in a tapered shape that is reduced in diameter toward the tip, and the shape of the tip surface is smaller than the shape included in the locking hole 24, that is, the locking hole 24. Yes. Thereby, when inserting the spring projection part 32 in the latching hole 24, the front-end | tip part of the latching | locking part 32b is inserted smoothly as a guide. The locking hole 24 is formed to be slightly smaller than the outer diameter of the general portion of the spring projection 32 in the natural state, and the outer periphery of the general portion of the locking hole 24 is inserted with the spring projection 32 inserted. It is designed to be in pressure contact with the inner circumference.

  The pilot pillar 33 is formed in a cylindrical shape as a whole, and a tapered portion 33 a that is reduced in diameter toward the tip is formed at the tip of the pilot pillar 33. The tip surface of the tapered portion 33 a has a smaller diameter than the pilot hole 14 of the first insulating substrate 11 and the pilot hole 25 of the second insulating substrate 21. In addition, each pilot hole 14, 24 is formed to have the same diameter or slightly larger diameter as the outer diameter of the pilot pillar 33, and with the pilot pillar 33 inserted, the outer periphery of the pilot pillar 33 is the pilot holes 14, 24. It is designed to be in close or almost intimate contact with the inner circumference. By the way, as shown in FIG. 3A, the pilot column 33 is formed shorter than the spring projection 32 by the substantially axial length of the locking portion 32b, and the pilot column 33 is formed on the second insulating substrate 21. It does not protrude from the other side surface 21b.

  Furthermore, the base plate 31 of the insulating assembly 30 is in close contact with the first insulating substrate 11 of the first circuit board 10 in the assembled state. A plurality of through holes 34 having a predetermined diameter are formed at positions corresponding to. Of course, these through holes 34 are also arranged in a matrix, and these through holes 34 also correspond to the positions of the respective columnar bumps 22.

  And in order to unite the 1st circuit board 10 and the 2nd circuit board 20, as shown in FIG. 4, between the insulating assembly 30 and the 2nd circuit board 20, the 1st circuit board 10 is positioned. Then, the spring protrusion 32 of the insulating assembly 30 is elastically inserted into the locking hole 24 of the second circuit board 20, and the pilot pillar 33 of the insulating assembly 30 is inserted into the first circuit board 10 and The pilot holes 14 and 25 of the second circuit board 20 are inserted.

  At this time, by pressing the second circuit board 20 against the base plate 31 of the insulating assembly 30, the spring protrusion 32 and the pilot pillar 33 are inserted into the locking hole 24 and the pilot holes 14, 25, and the first The first circuit board 10 and the second circuit board 20 are pressed in the proximity direction. As a result, the columnar bumps 22 of the second circuit board 20 are inserted into the cross-shaped slits 13 of the first circuit board 10 and the respective terminal portions are electrically connected.

  In the present embodiment, when the first circuit board 10 and the second circuit board 20 are combined via the insulating assembly 30 as described above, first, the other side surface 11b side of the first insulating substrate 11 (see FIG. 1 (a), the insulating assembly 30 is disposed, and the pilot pillar 33 is inserted into the pilot hole 14 of the first circuit board 10. As a result, the first circuit board 10 and the insulating assembly 30 are preliminarily assembled.

  Next, with respect to the first circuit board 10 and the insulating assembly 30 that are pre-assembled, the second circuit board 20 is disposed on the side surface 11a side (lower side in FIG. 1A) of the first insulating board 11. Place. The locking holes 24 of the second insulating substrate 21 are aligned with the spring protrusions 32 of the insulating assembly 30, and the pilot holes 25 protrude from the pilot holes 14 of the first insulating substrate 11. Align to. In this state, while the second circuit board 20 is pressed against the first circuit board 10, the locking hole 24 is inserted into the spring protrusion 32 and the pilot hole 25 is inserted into the pilot pillar 33.

  Thereby, the columnar bump 22 is guided to the fitting position with the cross-shaped slit 13, and the columnar bump 22 is inserted into the cross-shaped slit 13 by further pressing of the second insulating substrate 21. At the same time, the locking portion 32 b of the spring protrusion 32 is locked to the outer peripheral edge of the locking hole 24 of the second circuit board 20. In this state, the three members of the first circuit board 10, the second circuit board 20, and the insulating assembly 30 are united together to form the inter-board connector 1 as shown in FIG.

  At this time, the first insulating substrate 11 is tightly held between the base plate 31 and the second insulating substrate 21. In addition, the length of the spring protrusion 32 is such that the locking portion 32b is locked to the outer peripheral edge of the locking hole 24 in a state where the insulating substrates 11 and 21 and the base plate 31 are in close contact with each other. Is preset.

  With the above configuration, according to the board-to-board connector structure of the present embodiment, the first between the insulating assembly 30 and the second circuit board 20, that is, between the base plate 31 and the second insulating board 21. In the state where the first insulating substrate 11 of the circuit board 10 is sandwiched, the second circuit board 20 is entirely pressed against the insulating assembly 30 and the spring protrusion 32 of the insulating assembly 30 is moved to the second circuit. It is inserted into the locking hole 24 of the substrate 20.

  Then, the columnar bumps 22 of the second circuit board 20 are inserted into the cross-shaped slits 13 of the first circuit board 10 so that they are electrically connected. At the same time, the locking portion 32 b of the spring protrusion 32 inserted into the locking hole 24 is locked to the outer peripheral edge of the locking hole 24. As a result, the first circuit board 10 is sandwiched between the insulating assembly 30 and the second circuit board 10, so that the respective separation is prevented. The state, that is, the electrical conduction state can be ensured.

  Therefore, the insulating assembly 30 only needs to have sufficient strength to project the spring protrusion 32 and the pilot column 33, and the thickness of the base plate 31 can be reduced by selecting the material for forming the insulating assembly 30. Can do. As a result, it is possible to achieve a reduction in the height of the inter-board connector 1 configured by combining the first circuit board 10, the second circuit board 20, and the insulating assembly 30.

  Further, since the diameter of the spring projection 32 can be freely reduced, the spring projection 32 can be easily extracted from the locking hole 24 by reducing the diameter of the spring projection 32. As a result, the insulating assembly 30 and the second circuit board 20 can be separated from each other. As a result, the combined first circuit board 10 and second circuit board 20 can be easily detached from each other. Can be recombined. At this time, in the present embodiment, the combined holding of the first circuit board 10 and the second circuit board 20 is not performed at the fitting portion between the cross-shaped slit 13 and the columnar bump 22. Even when the circuit board 10 and the second circuit board 20 are attached to and detached from each other, it is possible to suppress the occurrence of conduction failure in the terminal portion.

  Furthermore, in the combined state of the first circuit board 10 and the second circuit board 20, the locking portion 32 b provided at the tip of the spring protrusion 32 is locked to the outer peripheral edge of the locking hole 24. The first circuit board 10 and the second circuit board 20 once combined can be more reliably prevented from separating in a natural state.

  In this embodiment, since the spring protrusion 32 is branched into four and has a radial resilience, the insulating assembly 30 is in a state where the spring protrusion 32 is inserted into the locking hole 24. It is possible to correct the delicate relative position between the second circuit board 20 and the second circuit board 20 so that the fitting state between the cross-shaped slit 13 and the columnar bump 22 can be properly maintained.

  Further, according to the present embodiment, the pilot pillar 33 of the insulating assembly 30 is inserted into the pilot holes 14 and 25 formed in the first insulating substrate 11 and the second insulating substrate 21 in close contact or almost in close contact with each other. The Thus, when the first circuit board 10 and the second circuit board 20 are combined with the insulating assembly 30, their assembly positions are accurately guided via the pilot pillars 33 and the pilot holes 14 and 25. can do. Therefore, the accuracy of alignment between the cross-shaped slits 13 and the columnar bumps 22 can be further increased, and the combination of the first circuit board 10, the second circuit board 20, and the insulating assembly 30 can be combined. It can be done quickly and accurately.

  According to the present embodiment, the first insulating substrate 11 of the first circuit board 10 is in close contact with the base plate 31 of the insulating assembly 30, and the base plate 31 corresponds to the cross-shaped slit 13. Through holes 34 are formed at the positions. Thus, when the second insulating substrate 21 is pressed against the first insulating substrate 11 and the columnar bumps 22 are press-fitted into the cross-shaped slits 13, the first insulating substrate 11 formed as an FPC substrate is bent at the through hole 34 portion. Therefore, the columnar bumps 22 can be inserted more smoothly.

  By the way, in this embodiment, as shown in FIG. 3B, the spring protrusion 32 branched into the four branch pieces 32a has the same branching widths δ1 and δ2 and equal elasticity in the circumferential direction. It is designed to be demonstrated. However, the main bullet mainly governing the elastic force in the radial direction of the spring protrusion 32 by making the branch widths δ1 and δ2 different in the width direction (left-right direction in the figure) and the length direction (up-down direction in the figure). The departure direction M can be determined. The main bullet direction M is a direction in which the elastic force (spring constant) increases.

  In this case, for example, by forming the branch width δ1 in the width direction to be narrower than the branch width δ2 in the length direction, the main projecting direction of the spring protrusion 32 indicated by X1 in FIG. M can be in the width direction.

  Then, when determining the main projecting directions M of the four spring projecting portions 32 indicated by X1, X2, X3, and X4 in the figure, the main projecting directions M of the respective spring projecting portions 32 are mutually different. It is preferable to arrange so as to intersect.

  That is, when the main projecting direction M of the spring projection 32 indicated by X1 is the width direction as described above, the main projection of the spring projection 32 indicated by X2 opposed to the spring projection 32 indicated by X1 in the length direction. The bullet direction M is the length direction. Further, the main projecting direction M of the spring projection 32 indicated by X3 opposed to the spring projection 32 indicated by X1 in the width direction is also defined as the length direction. Further, the main projecting direction M of the spring projection 32 indicated by X4 facing the spring projection 32 indicated by X3 in the length direction is defined as the width direction.

  As described above, when a plurality of spring projections 32 are provided, the main projecting directions M of the respective spring projections 32 intersect each other, so that the plurality of spring projections 32 are formed in the locking holes 24. When inserted, the alignment between the second circuit board 20 and the insulating assembly 30 can be determined by the resilience in a plurality of directions. Thereby, the positional accuracy of the second circuit board 20 with respect to the insulating assembly 30 can be further increased.

  FIGS. 9A and 9B show the main projecting direction M when the spring projecting portion 32A is bifurcated, and FIG. 9A shows the main projecting direction M of the opposing spring projecting portion 32A orthogonal to each other. FIG. 5B shows a case where the main bullet direction M of the opposing spring protrusion 32A intersects with a predetermined angle. Even in these cases, a similar function of increasing the alignment accuracy can be exhibited. Of course, even when the spring protrusion 32 has three branches or more than five branches, the same function can be exhibited by setting the main bullet direction M individually and intersecting each other.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made. For example, the female terminal portion and the male terminal portion are not limited to the cruciform slit 13 and the columnar bump 22, but may be any terminal portion structure that is electrically connected to each other by fitting.

  In addition, the female terminal part (cross-shaped slit 13) is provided on the first circuit board 10 and the male terminal part (columnar bump 22) is provided on the second circuit board 20, but these are provided in reverse. May be.

  Further, in order to effectively arrange the female terminal portion and the male terminal portion at the center portion of the first circuit board 10 and the second circuit board 20, the spring protrusions 32 and the pilot pillars 33 are formed at both ends in the width direction. However, the formation positions of the spring protrusions 32 and the pilot pillars 33 are not limited to this, and can be provided at arbitrary positions in consideration of the terminal portions.

1 board-to-board connector 10 first circuit board 13 cross-shaped slit (female terminal part)
14 Pilot hole 20 Second circuit board 22 Columnar bump (male terminal)
24 Locking hole 25 Pilot hole 30 Insulating assembly 32 Spring protrusion 32a Branch piece 32b Locking part 33 Pilot column 34 Through hole M Main projection direction of spring protrusion

Claims (4)

A first circuit board on which one of a female terminal part and a male terminal part is formed; and a second circuit board on which the other of the female terminal part and the male terminal part is formed, the female terminal In the inter-board connection connector structure in which the first circuit board and the second circuit board are combined while contacting the part and the male terminal part,
The first circuit board is disposed on the side opposite to the surface on which the terminal portion is formed, and on the side facing the first circuit board, the diameter can be reduced with a radial elastic force, and the first circuit board is locked to the tip. Providing an insulative assembly with a protruding spring projection having a portion;
A locking hole for receiving the spring protrusion is provided in the second circuit board, and the second circuit board is arranged so as to sandwich the first circuit board with respect to the insulating assembly,
The board characterized in that the locking portion is locked to a peripheral edge of the locking hole in a state where the insulating assembly, the first circuit board, and the second circuit board are combined. Interconnect connector structure. The insulating assembly is provided with a pilot column protruding in the same direction as the spring protrusion,
2. The inter-board connector according to claim 1, wherein the first circuit board and the second circuit board are respectively formed with pilot holes for receiving the pilot pillars in close contact or substantially in close contact with each other. Construction.   The insulating assembly is brought into close contact with the first circuit board in a state of being combined with the first circuit board, and the female terminal portion and the male terminal portion of the insulating assembly are attached to the insulating circuit assembly. The board-to-board connector structure according to claim 1, wherein a through hole is formed at a corresponding position. A plurality of the spring projections are provided on the insulating assembly, and each spring projection is branched into at least two branches in the circumferential direction so that the branch piece has a resilient force in the radial direction, and each spring The substrate according to any one of claims 1 to 3, wherein the protrusions are arranged such that main projecting directions mainly controlling a radial resilience intersect each other. Interconnect connector structure.

Images