JP2012059424A - Led lighting apparatus - Google Patents

Led lighting apparatus Download PDF

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JP2012059424A
JP2012059424A JP2010199467A JP2010199467A JP2012059424A JP 2012059424 A JP2012059424 A JP 2012059424A JP 2010199467 A JP2010199467 A JP 2010199467A JP 2010199467 A JP2010199467 A JP 2010199467A JP 2012059424 A JP2012059424 A JP 2012059424A
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led
substrate
led group
lighting device
led lighting
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JP5514677B2 (en
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Sayumi Yamaguchi
さゆみ 山口
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OPETH KK
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting apparatus that maintains a performance of the LED element itself and also a light volume stable for a long period as a whole lighting fixture including a protection cover housing an LED array.SOLUTION: The LED lighting apparatus includes a substrate 14 on which an LED group 12 is arranged and wired, a power supply circuit 16 which drives the wired LED group 12 to emit light, a reinforcing body 21 which supports the substrate 14 and has a heat sink 20 which is adhered tightly to the substrate 14 at a portion not covering the LED group 12 and dissipates heat emitted from driving of the LED group 12, a cover 22 which surrounds the LED group 12, the substrate 14, and the portion not covering the heat sink 20 of the reinforcing body 21, and a transparent optical catalyst layer 24 formed on both sides of the surface and the backside of a portion of the semi-transparent cover 22 through which light emitted from the LED group 12 is transmitted.

Description

本発明は、蛍光灯と互換性のある蛍光灯型のLED照明装置に関する。   The present invention relates to a fluorescent lamp type LED lighting apparatus compatible with a fluorescent lamp.

地球温暖化を防止するために、様々な分野で環境対応型の機器の導入や、旧型機から省エネタイプの新型機への更新が行なわれている。照明器具では、白熱電球だけでなく、蛍光灯も、LED(発光ダイオード)を使用した照明器具に置き換えられようとしている。しかし、商用電源は交流であるのに対して、LEDは直流電源により駆動される。ブラケットや駆動装置全てを交換するのは不経済で現実的でない。そこで、駆動回路を内蔵させて、既存の器具にそのまま装着できるLED照明装置が普及している(特許文献1参照)。   In order to prevent global warming, environmentally friendly equipment has been introduced in various fields, and the old model has been upgraded to the new energy-saving model. In lighting fixtures, not only incandescent bulbs but also fluorescent lamps are being replaced by lighting fixtures using LEDs (light emitting diodes). However, while the commercial power source is an alternating current, the LED is driven by a direct current power source. Replacing all brackets and drive units is uneconomical and impractical. Therefore, an LED lighting device that incorporates a drive circuit and can be directly mounted on an existing appliance is widely used (see Patent Document 1).

特開2010−92990号公報JP 2010-92990 A

既知の従来の技術には、次のような解決すべき課題があった。
LEDは省電力であるだけでなく、長寿命であることも普及の要因になっている。蛍光灯は、長期間使用して劣化すると暗くなり、それを目安にして交換をする。一方、LED(発光ダイオード)を使用した照明は高コストであるが長寿命であるから、長期的に見ると経済的であるという特徴を持つ。従って、長期間安定した光量を維持することが求められる。
上記の課題を解決するために、本発明は、LED素子自体の性能だけでなく、LEDアレイを収容した保護カバーを含む器具全体として長期間安定した光量を維持することができるような、LED照明装置を提供することを目的とする。
The known prior art has the following problems to be solved.
LEDs not only save power, but also have a long lifespan. Fluorescent lamps become darker when used for a long time, and should be replaced as a guide. On the other hand, illumination using LEDs (light-emitting diodes) is expensive, but has a long life, and is therefore economical in terms of long-term performance. Therefore, it is required to maintain a stable light amount for a long time.
In order to solve the above-described problems, the present invention is not limited to the performance of the LED element itself, but the LED illumination that can maintain a stable light amount for a long period of time as a whole device including a protective cover that houses the LED array. An object is to provide an apparatus.

以下の構成はそれぞれ上記の課題を解決するための手段である。
〈構成1〉
LED群を配列して結線をした基板と、前記結線されたLED群を駆動して発光させる電源回路と、前記基板を支持し、前記LED群を覆わない部分で前記基板に対して密着し、前記LED群の駆動により発せられる熱を放熱するヒートシンクを備えた補強体と、前記LED群と基板と、前記補強体のヒートシンクを覆わない部分とを包囲した、透明または半透明のカバーと、前記カバーの、前記LED群の発する光が透過する部分の表面と裏面の両面及び前記ヒートシンクの表面に、透明の光触媒層を形成したことを特徴とするLED照明装置。
The following configurations are means for solving the above-described problems.
<Configuration 1>
A substrate that is connected by arranging LED groups, a power supply circuit that drives the connected LED groups to emit light, supports the substrate, and adheres to the substrate at a portion that does not cover the LED group, A transparent or translucent cover surrounding a reinforcing body including a heat sink that dissipates heat generated by driving the LED group, the LED group and the substrate, and a portion of the reinforcing body that does not cover the heat sink; An LED lighting device, wherein a transparent photocatalyst layer is formed on both the front and back surfaces of a portion of the cover through which light emitted from the LED group is transmitted and the surface of the heat sink.

〈構成2〉
構成1に記載のLED照明装置において、前記補強体は、断面が長手方向に連続した一定の弓形の中空成型体であって、弦に相当する帯状の部分に前記基板が密着しており、弓の湾曲した面と前記カバーとで、全体として円筒状の蛍光灯と互換性のある外形を構成していることを特徴とするLED照明装置。
<Configuration 2>
In the LED lighting device according to Configuration 1, the reinforcing body is a constant arcuate hollow molded body whose cross section is continuous in the longitudinal direction, and the substrate is in close contact with a band-shaped portion corresponding to a string. The curved surface of the LED and the cover constitute an outer shape compatible with a cylindrical fluorescent lamp as a whole.

〈構成3〉
構成1または2に記載のLED照明装置において、酸化チタンとアパタイトを含む3ミクロン以下の微粒子を水を主成分とする揮発性の液に分散させて噴霧して、均一に付着させた光触媒層を設けたことを特徴とするLED照明装置。
<Configuration 3>
In the LED lighting device according to Configuration 1 or 2, a photocatalyst layer in which fine particles of 3 microns or less including titanium oxide and apatite are dispersed in a volatile liquid containing water as a main component and sprayed to uniformly adhere the photocatalyst layer An LED illumination device provided.

〈構成4〉
請求項1乃至3のいずれかに記載のLED照明装置において、前記LED群中に、光触媒反応を促進させる波長の光を発するLEDを混在させたことを特徴とするLED照明装置。
<Configuration 4>
4. The LED lighting device according to claim 1, wherein an LED that emits light having a wavelength that promotes a photocatalytic reaction is mixed in the LED group.

〈構成1の効果〉
カバーの両面に形成した光触媒層で、長期間にわたって、光量が減少しない光源を実現できる。即ち、カバーをLED群の発する光が透過するとき、光触媒層が反応する。従って、油分等の付着が抑制される。また、LED群を配列して半田付け等により結線をした基板からは、前記LED群の駆動により発せられる熱によりペースト等の蒸気が出る。この蒸気がカバーの裏面に付着すると、光量が低下するだけでなく、外部から清掃できない汚れになる。カバーの裏面に生成された光触媒層が反応して、その汚れを防止する。汚染雰囲気においても、セルフクリーニング効果により、長期間光量を低下させないから、LED照明は長寿命であるという長所を十分に生かすことができる。また、熱せられたヒートシンクの表面に付着した光触媒層は、反射光等により効率的に反応して、周辺雰囲気を浄化する。
〈構成2の効果〉
カバーと断面が弓形の補強体とを一体化して、円筒状の本体を形成し、既存の蛍光灯と互換性のある構造にすることができる。
〈構成3の効果〉
酸化チタンとアパタイトを含む3ミクロン以下の微粒子は、バインダー無しでもカバーに付着して、透明の光触媒層を形成することができる。この光触媒層は、バインダーが無いので長期間劣化し難く、バインダーの劣化による光量減少を抑制できる。
〈構成4の効果〉
LED群中に、光触媒反応を促進させる波長の光を発するLEDを混在させると、光量の減少を抑制する光触媒反応を持続させることができる。
<Effect of Configuration 1>
With the photocatalyst layers formed on both sides of the cover, it is possible to realize a light source in which the light amount does not decrease over a long period of time. That is, when the light emitted from the LED group is transmitted through the cover, the photocatalytic layer reacts. Therefore, adhesion of oil etc. is suppressed. Further, a vapor such as a paste is generated from the substrate in which the LED groups are arranged and connected by soldering or the like by heat generated by driving the LED groups. When this vapor adheres to the back surface of the cover, not only the amount of light is reduced, but also dirt that cannot be cleaned from the outside. The photocatalyst layer generated on the back surface of the cover reacts to prevent the contamination. Even in a contaminated atmosphere, the amount of light is not reduced for a long time due to the self-cleaning effect, so that the advantage that LED lighting has a long life can be fully utilized. Moreover, the photocatalyst layer adhering to the surface of the heated heat sink reacts efficiently by reflected light or the like to purify the surrounding atmosphere.
<Effect of Configuration 2>
The cover and the reinforcing member having an arcuate cross section can be integrated to form a cylindrical main body, and a structure compatible with existing fluorescent lamps can be obtained.
<Effect of Configuration 3>
Fine particles of 3 microns or less containing titanium oxide and apatite can be attached to the cover without a binder to form a transparent photocatalytic layer. Since this photocatalyst layer does not have a binder, the photocatalyst layer is hardly deteriorated for a long period of time, and the light amount reduction due to the deterioration of the binder can be suppressed.
<Effect of Configuration 4>
When LEDs emitting light having a wavelength that promotes the photocatalytic reaction are mixed in the LED group, the photocatalytic reaction that suppresses the decrease in the amount of light can be sustained.

(a)はLED照明装置の実施例を示す斜視図、(b)は分館斜視図である。(A) is a perspective view which shows the Example of an LED lighting apparatus, (b) is a building perspective view. LED照明装置10の横断面図である。2 is a cross-sectional view of the LED lighting device 10. FIG. 電球型のLED照明装置の実施例側面図である。It is an Example side view of a bulb-type LED lighting device. LED照明装置の実施例の周辺回路結線図である。It is a peripheral circuit connection diagram of the Example of LED lighting apparatus.

以下、本発明の実施の形態を実施例毎に詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail for each example.

図1(a)はLED照明装置の実施例を示す斜視図、(b)は分館斜視図である。
図の(a)に示すように、LED照明装置10は、良くしられた蛍光灯と同様の外観をしている。直管型のものを実施例に示したが、本発明は、サークル(環状)型や、球型、U字型のものにも利用できる。また、下記の実施例では、LEDを半透明のカバーで覆ったものを説明するが、透明カバーで覆って、より明るい照明についても利用できる。
Fig.1 (a) is a perspective view which shows the Example of an LED illuminating device, (b) is a building perspective view.
As shown to (a) of a figure, the LED illuminating device 10 has the external appearance similar to the improved fluorescent lamp. Although the straight pipe type is shown in the embodiment, the present invention can also be used for a circle (annular) type, a spherical type, and a U-shaped type. Moreover, although the following Example demonstrates what covered LED with the translucent cover, it can cover also with a transparent cover and can utilize also for brighter illumination.

図の(b)に示すように、LED照明装置10は、補強体21に電源回路16と基板14とを固定し、半透明のカバー22で包囲した構成をしている。基板14上には、多数のLED(発光ダイオード)によるLED群12が搭載されている。基板14は、LED群12を配列して、印刷等による結線を施したものである。電源回路16は、結線されたLED群を駆動して発光させるためのものである。電源回路16には、AC/DCコンバータと、出力する直流電流を安定化させる電流または電圧安定化回路が含まれている。   As shown in (b) of the figure, the LED lighting device 10 has a configuration in which the power supply circuit 16 and the substrate 14 are fixed to a reinforcing body 21 and surrounded by a semitransparent cover 22. On the substrate 14, an LED group 12 including a large number of LEDs (light emitting diodes) is mounted. The substrate 14 is obtained by arranging the LED groups 12 and connecting them by printing or the like. The power supply circuit 16 is for driving the connected LED group to emit light. The power supply circuit 16 includes an AC / DC converter and a current or voltage stabilizing circuit that stabilizes the output direct current.

補強体21は、断面が弓状の中空のアルミニウム合金パイプ等により構成される。これは、押し出し成型法により製造することができる。補強体21は、基板14を支持し、LED群12を覆わない部分で基板14に対して密着し、LED群12の駆動により発せられる熱を放熱するヒートシンクを備えている。電源回路16には、端子カバー18の接続端子17が電気接続され、図1(a)に示すように組み立てられる。   The reinforcing body 21 is constituted by a hollow aluminum alloy pipe having a bow-like cross section. This can be manufactured by an extrusion method. The reinforcing body 21 includes a heat sink that supports the substrate 14, is in close contact with the substrate 14 at a portion that does not cover the LED group 12, and dissipates heat generated by driving the LED group 12. The connection terminal 17 of the terminal cover 18 is electrically connected to the power supply circuit 16 and is assembled as shown in FIG.

図2は、LED照明装置10の横断面図である。
図に示すように、補強体21は、断面が長手方向に連続した一定の弓形の中空成型体である。弦に相当する帯状の部分26に基板14が密着しており、LED群12の発生した熱をヒートシンク20に伝える構造になっている。弓の湾曲した面にヒートシンク20が溝状に形成されている。この部分と半透明のカバー22とで、全体として円筒状の蛍光灯と互換性のある外形を構成している。半透明のカバー22はポリカーボネート等のプラスチック板で構成するとよい。補強体21に設けた溝に縁を嵌め込まれて、補強体21と一体化されている。なお、この半透明のカバー22を透明度の高いものにすれば、より明るい光源にすることができる。
FIG. 2 is a cross-sectional view of the LED lighting device 10.
As shown in the figure, the reinforcing body 21 is a certain arcuate hollow molded body whose cross section is continuous in the longitudinal direction. The substrate 14 is in close contact with a belt-like portion 26 corresponding to a string, and the heat generated by the LED group 12 is transmitted to the heat sink 20. A heat sink 20 is formed in a groove shape on the curved surface of the bow. This part and the translucent cover 22 constitute an outer shape compatible with a cylindrical fluorescent lamp as a whole. The translucent cover 22 may be composed of a plastic plate such as polycarbonate. An edge is fitted into a groove provided in the reinforcing body 21 and is integrated with the reinforcing body 21. If the semi-transparent cover 22 is made highly transparent, a brighter light source can be obtained.

なお、本発明では、この半透明のカバー22の、LED群12の発する光が透過する部分の表面と裏面の両面に、透明の光触媒層24を形成した。図の破線で示したのは、半透明のカバー22に密着した光触媒層24である。このように、半透明のカバーの両面に形成した光触媒層24で、長期間にわたって、光量が減少しない光源を実現できる。   In the present invention, the transparent photocatalyst layer 24 is formed on both the front and back surfaces of the translucent cover 22 where the light emitted from the LED group 12 is transmitted. The broken line in the figure shows the photocatalyst layer 24 that is in close contact with the translucent cover 22. Thus, the photocatalyst layer 24 formed on both surfaces of the translucent cover can realize a light source that does not reduce the light amount over a long period of time.

即ち、半透明のカバー22をLED群12の発する光が透過するとき、光触媒層24が反応する。従って、例えば、調理場等に配置された場合に、油分の付着が抑制される。また、あるいは、外側に付着した油分等が分解されて、簡単に拭き取れる状態になり、清掃が容易になる。   That is, when the light emitted from the LED group 12 passes through the translucent cover 22, the photocatalytic layer 24 reacts. Therefore, for example, when it is arranged at a cooking place or the like, oil adhesion is suppressed. Alternatively, the oil or the like adhering to the outside is decomposed so that it can be easily wiped off, and cleaning becomes easy.

一方、本発明等の実験によれば、このLED照明装置10を長期間使用していると、LED群12を配列して半田付け等により結線をした基板14から、LED群12の駆動により発せられる熱によって、ペースト等の蒸気が出ることがわかった。この蒸気が半透明のカバー22の裏面に付着すると、光量が低下するだけでなく、外部から清掃できない汚れになる。半透明のカバー22の裏面に生成された光触媒層24が反応すれば、その汚れを防止することができる。   On the other hand, according to the experiment of the present invention and the like, when the LED lighting device 10 is used for a long period of time, the LED group 12 is emitted from the board 14 arranged and connected by soldering or the like by driving the LED group 12. It was found that steam such as paste was generated by the generated heat. When this vapor adheres to the back surface of the translucent cover 22, not only the amount of light is reduced, but also dirt that cannot be cleaned from the outside. If the photocatalyst layer 24 produced | generated on the back surface of the translucent cover 22 reacts, the stain | pollution | contamination can be prevented.

上記のように、半透明のカバー22の両面に、全面的に均一に光触媒層24を付着させることが好ましい。その場合に、十分な光量を維持するには、光触媒層24が透明度の高いものであることが必要である。酸化チタンとアパタイトを含む3ミクロン以下の微粒子を水を主成分とする揮発性の液に分散させて噴霧して、均一に付着させた光触媒層は、この目的に最適である。なお、ヒートシンク20は、LED群12の駆動により発せられる熱によって温度上昇する。光触媒層24は、温度が高いほど効率良く反応する。従って、ヒートシンク20の表面にも、光触媒層24を付着させておくことが好ましい。ヒートシンク20の表面に付着した光触媒層24は、主として蛍光灯の背面に配置する反射板から光を受けて反応することができる。   As described above, it is preferable that the photocatalyst layer 24 is uniformly adhered to both surfaces of the translucent cover 22. In that case, in order to maintain a sufficient amount of light, the photocatalyst layer 24 needs to be highly transparent. A photocatalyst layer in which fine particles of 3 microns or less containing titanium oxide and apatite are dispersed and sprayed in a volatile liquid containing water as a main component and uniformly adhered is optimal for this purpose. The heat sink 20 rises in temperature due to heat generated by driving the LED group 12. The photocatalyst layer 24 reacts more efficiently as the temperature is higher. Therefore, it is preferable that the photocatalyst layer 24 is also attached to the surface of the heat sink 20. The photocatalyst layer 24 adhering to the surface of the heat sink 20 can react by receiving light mainly from a reflector disposed on the back surface of the fluorescent lamp.

水酸化チタンは、紫外光のエネルギーを吸収して、空気中の酸素と水分OHラジカルを発生させ、酸化分解作用により有機物を分解する機能を有する。従って、水酸化チタンを基材上に固着させて、滅菌効果を発揮させる方法が広く採用されている。また、この作用は触媒的な作用であって、水酸化チタンを固着させた基材はそのまま継続使用できる。このことから、水酸化チタンは光触媒と呼ばれて、抗菌、浄水、脱臭、防汚等の目的に広く利用されている。   Titanium hydroxide absorbs ultraviolet light energy, generates oxygen and moisture OH radicals in the air, and has a function of decomposing organic substances by oxidative decomposition. Therefore, a method is widely adopted in which titanium hydroxide is fixed on a substrate to exert a sterilization effect. This action is a catalytic action, and the base material to which titanium hydroxide is fixed can be used as it is. For this reason, titanium hydroxide is called a photocatalyst and is widely used for purposes such as antibacterial, water purification, deodorization, and antifouling.

水酸化チタンは固体である。これを基材に固着させるために、各種のバインダーを使用する。即ち、バインダー液中に水酸化チタンの微粉末を混ぜて基材に塗布し固定する。もしくは、スプレーで塗布する。しかしながら、こうした光触媒層では、バインダーに埋もれてしまっている水酸化チタンは十分触媒として機能せず、表面に露出しているものだけが機能するので、効率が悪い。また、スプレー塗布時には、バインダーの付着を嫌う各種機材に養生が必要になり、作業が煩雑になるという問題があった。さらに、バインダーにより透明度が悪くなるという問題があった。   Titanium hydroxide is a solid. In order to fix this to the base material, various binders are used. That is, a fine powder of titanium hydroxide is mixed in a binder solution and applied to a substrate and fixed. Or apply by spray. However, in such a photocatalyst layer, titanium hydroxide buried in the binder does not sufficiently function as a catalyst, and only what is exposed on the surface functions, so that the efficiency is poor. In addition, during spray application, various equipment that dislikes the adhesion of the binder needs to be cured, and there is a problem that the operation becomes complicated. Furthermore, there was a problem that transparency was deteriorated by the binder.

また、バインダーに埋もれた光触媒は外気に触れないため、周辺の気体を分解する機能が不十分になる。例えば、光触媒チタンアパタイトと呼ばれている市販品は、アパタイトの吸着性により、物体の壁面等に強力に吸着する。酸化チタンとアパタイトを含む3ミクロン以下の微粒子は、バインダー無しでも半透明のカバーに付着して、透明の光触媒層を形成することができる。光触媒は露出したままの状態である。この光触媒層は、バインダーが無いので長期間劣化し難く、バインダーの劣化による光量減少を抑制することができる。このような光触媒層には、例えば、ハンノウコートCR−C(長宗産業株式会社商品名)(2−プロパノール+アパタイト被覆二酸化チタン+二酸化ケイ素水溶液)を使用することができる。   Moreover, since the photocatalyst buried in the binder does not touch the outside air, the function of decomposing the surrounding gas becomes insufficient. For example, a commercially available product called photocatalytic titanium apatite is strongly adsorbed on the wall surface of an object due to the adsorptivity of apatite. Fine particles of 3 μm or less containing titanium oxide and apatite can be attached to a translucent cover without a binder to form a transparent photocatalytic layer. The photocatalyst remains exposed. Since this photocatalyst layer does not have a binder, it is difficult to deteriorate for a long period of time, and a reduction in the amount of light due to deterioration of the binder can be suppressed. For such a photocatalyst layer, for example, Hanno Coat CR-C (trade name of Chojong Industrial Co., Ltd.) (2-propanol + apatite-coated titanium dioxide + silicon dioxide aqueous solution) can be used.

図3は、電球型のLED照明装置の実施例側面図である。
図の電球型のLED照明装置は、基板14の上にLED群12や電源回路16を搭載している。半透明のカバー22は、LED群12を包囲している。基板14は、ヒートシンク20に密着するように支持されている。本体電極部28は既存の丸型電球と同様のねじ山を備える。この外形は既知のものと変わらない。ここで、この実施例では、半透明のカバー22の表裏面とヒートシンク20の表面に光触媒層24を付着させている。これにより、上記の実施例と同様の効果を得ることができる。
FIG. 3 is a side view of an embodiment of a bulb-type LED lighting device.
The bulb-type LED lighting device shown in the figure has an LED group 12 and a power supply circuit 16 mounted on a substrate 14. The translucent cover 22 surrounds the LED group 12. The substrate 14 is supported so as to be in close contact with the heat sink 20. The main body electrode portion 28 has the same thread as that of the existing round bulb. This external shape is not different from the known one. Here, in this embodiment, the photocatalyst layer 24 is attached to the front and back surfaces of the translucent cover 22 and the surface of the heat sink 20. Thereby, the effect similar to said Example can be acquired.

図3は、LED照明装置の実施例の周辺回路結線図である。
図のように、LED照明装置は、既知の蛍光灯と同様にして、一対の接続端子17を通じて電源に接続する。電源側には、電源プラグ32とスイッチングレギュレータ34と端子受け36とが順に接続されている。電源プラグ32は、商用電源のコンセントに接続する。スイッチングレギュレータ34は、交流の100ボルトから直流の24ボルトに変換する回路である。スイッチングレギュレータ34の出力は端子受け36に供給される。これらにより、定電圧直流電源を構成する。端子受け36は、既存の直管型蛍光灯を装着するための機器をそのまま利用することができる。既存の機器の内部に設けられた昇圧トランスやグローランプ等を除去して、この図に示す回路に置き換えればよい。
FIG. 3 is a peripheral circuit connection diagram of the embodiment of the LED lighting device.
As shown in the figure, the LED lighting device is connected to a power source through a pair of connection terminals 17 in the same manner as a known fluorescent lamp. On the power supply side, a power plug 32, a switching regulator 34, and a terminal receiver 36 are connected in order. The power plug 32 is connected to a commercial power outlet. The switching regulator 34 is a circuit that converts AC 100 volts into DC 24 volts. The output of the switching regulator 34 is supplied to the terminal receiver 36. These constitute a constant voltage DC power source. As the terminal receiver 36, a device for mounting an existing straight tube fluorescent lamp can be used as it is. What is necessary is just to remove the step-up transformer, the glow lamp, etc. provided in the existing equipment and replace them with the circuit shown in this figure.

LED照明装置側では、接続端子17と整流回路40と定電圧制御回路42とLED群12とが順に接続されている。一対の接続端子17は、一対の端子受け36にそれぞれ接続される。整流回路40は、接続端子17が交流電源に接続されても直流電源に接続されても、定電圧制御回路42を通じてLED群12に順方向の電流を供給する。これにより、LED群12を保護する。定電圧制御回路42は、並列接続されたLED群12の回路全体に印加する端子電圧を安定化するためのものである。   On the LED lighting device side, the connection terminal 17, the rectifier circuit 40, the constant voltage control circuit 42, and the LED group 12 are connected in order. The pair of connection terminals 17 are connected to the pair of terminal receivers 36, respectively. The rectifier circuit 40 supplies a forward current to the LED group 12 through the constant voltage control circuit 42 regardless of whether the connection terminal 17 is connected to an AC power supply or a DC power supply. Thereby, the LED group 12 is protected. The constant voltage control circuit 42 is for stabilizing the terminal voltage applied to the entire circuit of the LED group 12 connected in parallel.

なお、スイッチングレギュレータ34から安定な駆動電圧が供給される場合には、定電圧制御回路42を省略してもよい。また、定電圧制御回路42の代わりに、定電流制御回路を設けて、駆動電流安定化を優先しても構わない。また、必要な光量で発光するだけのLED素子を搭載するだけでなく、LED群12中に、光触媒反応を促進させる波長の光を発するLEDを混在させることもできる。   When a stable drive voltage is supplied from the switching regulator 34, the constant voltage control circuit 42 may be omitted. Further, instead of the constant voltage control circuit 42, a constant current control circuit may be provided to prioritize drive current stabilization. In addition to mounting LED elements that only emit light with a necessary amount of light, LEDs that emit light having a wavelength that promotes the photocatalytic reaction can be mixed in the LED group 12.

可視光よりも、若干紫外光に近い波長のほうが、光触媒反応を促進させる効果が高い場合がある。使用する光触媒の種類に応じて、LED群中に、光触媒反応促進用の波長の光を発するLEDを混在させて、光触媒反応を効率良く持続させることができる。   A wavelength slightly closer to ultraviolet light than visible light may have a higher effect of promoting the photocatalytic reaction. Depending on the type of photocatalyst to be used, LEDs emitting light having a wavelength for promoting photocatalytic reaction can be mixed in the LED group, so that the photocatalytic reaction can be sustained efficiently.

10 LED照明装置
12 LED群
14 基板
16 電源回路
17 接続端子
18 端子カバー
20 ヒートシンク
21 補強体
22 半透明のカバー
24 光触媒層
26 弦に相当する帯状の部分
28 本体電極部
32 電源プラグ
34 スイッチングレギュレータ
36 端子受け
40 整流回路
42 定電圧制御回路
DESCRIPTION OF SYMBOLS 10 LED illuminating device 12 LED group 14 Board | substrate 16 Power supply circuit 17 Connection terminal 18 Terminal cover 20 Heat sink 21 Reinforcing body 22 Translucent cover 24 Photocatalyst layer 26 Band-shaped part 28 corresponding to a string 28 Main body electrode part 32 Power plug 34 Switching regulator 36 Terminal receiver 40 Rectifier circuit 42 Constant voltage control circuit

Claims (4)

LED群を配列して結線をした基板と、
前記結線されたLED群を駆動して発光させる電源回路と、
前記基板を支持し、前記LED群を覆わない部分で前記基板に対して密着し、前記LED群の駆動により発せられる熱を放熱するヒートシンクを備えた補強体と、
前記LED群と基板と、前記補強体のヒートシンクを覆わない部分とを包囲した、透明または半透明のカバーと、
前記カバーの、前記LED群の発する光が透過する部分の表面と裏面の両面及び前記ヒートシンクの表面に、透明の光触媒層を形成したことを特徴とするLED照明装置。
A substrate in which LED groups are arranged and connected;
A power supply circuit for driving the connected LED group to emit light;
A reinforcing body provided with a heat sink that supports the substrate, adheres closely to the substrate at a portion that does not cover the LED group, and dissipates heat generated by driving the LED group;
A transparent or translucent cover surrounding the LED group, the substrate, and a portion of the reinforcing body that does not cover the heat sink;
An LED lighting device, wherein a transparent photocatalyst layer is formed on both the front and back surfaces of a portion of the cover through which light emitted from the LED group is transmitted and on the surface of the heat sink.
請求項1に記載のLED照明装置において、
前記補強体は、断面が長手方向に連続した一定の弓形の中空成型体であって、弦に相当する帯状の部分に前記基板が密着しており、弓の湾曲した面と前記カバーとで、全体として円筒状の蛍光灯と互換性のある外形を構成していることを特徴とするLED照明装置。
The LED lighting device according to claim 1,
The reinforcing body is a constant bow-shaped hollow molded body having a continuous cross section in the longitudinal direction, the substrate is in close contact with a band-shaped portion corresponding to a string, and the curved surface of the bow and the cover, An LED lighting device characterized in that the outer shape is compatible with a cylindrical fluorescent lamp as a whole.
請求項1または2に記載のLED照明装置において、
酸化チタンとアパタイトを含む3ミクロン以下の微粒子を水を主成分とする揮発性の液に分散させて噴霧して、均一に付着させた光触媒層を設けたことを特徴とするLED照明装置。
The LED lighting device according to claim 1 or 2,
An LED lighting device comprising a photocatalyst layer in which fine particles of 3 microns or less containing titanium oxide and apatite are dispersed and sprayed in a volatile liquid containing water as a main component and uniformly adhered.
請求項1乃至3のいずれかに記載のLED照明装置において、
前記LED群中に、光触媒反応を促進させる波長の光を発するLEDを混在させたことを特徴とするLED照明装置。
In the LED lighting device according to any one of claims 1 to 3,
An LED lighting device, wherein LEDs emitting light having a wavelength that promotes a photocatalytic reaction are mixed in the LED group.
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