JP2012054499A - Cooling system of electronic apparatus - Google Patents

Cooling system of electronic apparatus Download PDF

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JP2012054499A
JP2012054499A JP2010197763A JP2010197763A JP2012054499A JP 2012054499 A JP2012054499 A JP 2012054499A JP 2010197763 A JP2010197763 A JP 2010197763A JP 2010197763 A JP2010197763 A JP 2010197763A JP 2012054499 A JP2012054499 A JP 2012054499A
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server
cooling
temperature sensor
cooling system
control device
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Masato Fukagaya
正人 深萱
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SOHKI KK
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Abstract

PROBLEM TO BE SOLVED: To effectively cool multiple electronic apparatuses stored in a rack by using a coolant at flow rates varied according to their heating values.SOLUTION: A server cooling system 1 includes cooling pumps 4 respectively provided on outer surfaces of multiple servers 3, and coolant is supplied to a heat generating part of each server 3 by the cooling pump 4. The heat temperature of each server 3 is individually detected by a temperature sensor 5, and a control unit 6 controls the cooling pump 4 based on temperature information input from the temperature sensor 5. The control unit 6 is stored in a rack 2 with the server 3. Input terminals 28 each of which connects with the temperature sensor 5, the cooling pumps 4, a circulation pump 24, output terminals 29 to which a cooler 26 connects, and a network terminal 30 connecting to a remote monitoring apparatus 34 are provided on an outer surface of the control unit 6.

Description

本発明は、ラック内に格納された電子機器を冷却するシステムに関する。   The present invention relates to a system for cooling an electronic device stored in a rack.

従来、サーバラック内の複数のサーバを空調機によって冷却するシステムが知られている。例えば、図４に示すように、特許文献１に記載された冷却システム５１は、サーバラック５２内に複数の空調機５３を格納し、各空調機５３に複数のサーバ５４を割り当て、制御装置５５がサーバ５４の温度に基づいて空調機５３の運転を制御するように構成されている。また、制御装置５５は、空調機５３の能力不足を判定した場合に、データセンター等の室内に設備された大型空調機の能力を増強するための制御を行っている。   Conventionally, a system for cooling a plurality of servers in a server rack by an air conditioner is known. For example, as shown in FIG. 4, the cooling system 51 described in Patent Document 1 stores a plurality of air conditioners 53 in a server rack 52, assigns a plurality of servers 54 to each air conditioner 53, and controls a control device 55. Is configured to control the operation of the air conditioner 53 based on the temperature of the server 54. In addition, when the controller 55 determines that the capacity of the air conditioner 53 is insufficient, the control device 55 performs control for enhancing the capacity of the large air conditioner installed in a room such as a data center.

特開２００６−６４２５３号公報JP 2006-64253 A

しかし、空冷単独の冷却方式は効率が低いため、従来の冷却システム５１によると、一つのサーバラック５２に複数の空調機５３を設置する必要があり、設備費が高くついた。また、空調機５３を室内の大型空調機と協調制御する必要もあり、システム５１が複雑で大規模になるという問題点もあった。特に、一台の空調機５３で複数のサーバ５４を冷却する構成によると、発熱量の大きなサーバ５４を充分に冷却できなかったり、発熱量が少ないサーバ５４を無駄に冷却したりするなど、個々のサーバ５４を的確に制御することができないという不都合があった。   However, since the cooling method using only air cooling is low in efficiency, according to the conventional cooling system 51, it is necessary to install a plurality of air conditioners 53 in one server rack 52, which increases the equipment cost. In addition, the air conditioner 53 needs to be cooperatively controlled with a large indoor air conditioner, which causes a problem that the system 51 is complicated and large-scale. In particular, according to the configuration in which a plurality of servers 54 are cooled by a single air conditioner 53, the server 54 having a large heat generation amount cannot be sufficiently cooled, or the server 54 having a small heat generation amount is wasted. The server 54 cannot be accurately controlled.

そこで、本発明の目的は、ラック内部に格納された複数の電子機器を発熱量に応じた流量の冷却液で効率よく冷却できるシステムを提供することにある。   Therefore, an object of the present invention is to provide a system that can efficiently cool a plurality of electronic devices stored in a rack with a coolant having a flow rate corresponding to the amount of heat generated.

上記課題を解決するために、本発明は次のような冷却システムを提供する。
（１）ラック内部に格納された複数の電子機器に冷却液を別々に供給する流体アクチュエータと、電子機器の発熱温度を個別に検出する温度センサと、温度センサから入力した温度情報に基づいて流体アクチュエータを制御する制御装置とを備えたことを特徴とする冷却システム。 In order to solve the above problems, the present invention provides the following cooling system.
(1) A fluid actuator that separately supplies coolant to a plurality of electronic devices stored in the rack, a temperature sensor that individually detects the heat generation temperature of the electronic device, and a fluid based on temperature information input from the temperature sensor A cooling system comprising: a control device that controls the actuator.

（２）流体アクチュエータが冷却液を電子機器の発熱部に圧送するポンプを含むことを特徴とする（１）に記載の冷却システム。
（３）流体アクチュエータが電子機器の発熱部に接続された冷却液の供給配管を開閉する電磁バルブを含むことを特徴とする（１）に記載の冷却システム。
（４）電子機器の発熱部を送風により冷却するファンを備え、制御装置が温度センサから入力した温度情報に基づいて流体アクチュエータとファンを協調制御することを特徴とする（１）、（２）又は（３）に記載の冷却システム。 (2) The cooling system according to (1), wherein the fluid actuator includes a pump that pumps the coolant to the heat generating portion of the electronic device.
(3) The cooling system according to (1), wherein the fluid actuator includes an electromagnetic valve that opens and closes a coolant supply pipe connected to a heat generating portion of the electronic device.
(4) It is provided with a fan that cools the heat generating part of the electronic device by blowing air, and the control device cooperatively controls the fluid actuator and the fan based on the temperature information input from the temperature sensor (1), (2) Or the cooling system as described in (3).

（５）制御装置を電子機器と共にラック内部に格納し、制御装置の外面に流体アクチュエータおよび温度センサの接続端子を設けたことを特徴とする（１）〜（４）のいずれか一つに記載の冷却システム。
（６）制御装置を電子機器と共にラック内部に格納し、複数のラックの制御装置を通信線で遠隔監視装置に接続したことを特徴とする（１）〜（５）のいずれか一つに記載の冷却システム。 (5) The control device is housed in the rack together with the electronic equipment, and the connection terminals of the fluid actuator and the temperature sensor are provided on the outer surface of the control device, as described in any one of (1) to (4) Cooling system.
(6) The control device is housed in the rack together with the electronic device, and the control devices of the plurality of racks are connected to the remote monitoring device by communication lines, as described in any one of (1) to (5) Cooling system.

本発明の冷却システムによれば、ラック内部に格納された複数の電子機器にそれぞれ流体アクチュエータと温度センサとを設けたので、発熱量に応じた流量の冷却液によって電子機器を効率よく冷却できるという効果がある。   According to the cooling system of the present invention, since the fluid actuator and the temperature sensor are provided for each of the plurality of electronic devices stored in the rack, the electronic device can be efficiently cooled by the coolant having a flow rate corresponding to the heat generation amount. effective.

本発明の一実施形態を示すサーバ冷却システムの概略図である。It is the schematic of the server cooling system which shows one Embodiment of this invention. サーバごとに設けられた冷却機構を示す斜視図である。It is a perspective view which shows the cooling mechanism provided for every server. サーバと制御装置をラックに格納した形態を示す斜視図である。It is a perspective view which shows the form which stored the server and the control apparatus in the rack. 従来のサーバ冷却システムを示す立面図である。It is an elevation view showing a conventional server cooling system.

以下、本発明の一実施形態を図面に基づいて説明する。図１に示すサーバ冷却システム１では、サーバラック２の内部に複数台のサーバ３が上下に規定の間隔をあけて格納されている。各サーバ３には、内部の発熱部に冷却液を供給する流体アクチュエータとしての冷却ポンプ４と、発熱部の温度をサーバ３ごとに検出する温度センサ５とが設けられている。そして、ラック２の最上部に制御装置６がサーバ３と一緒に格納され、温度センサ５から入力した温度情報に基づいて冷却ポンプ４を制御するようになっている。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the server cooling system 1 shown in FIG. 1, a plurality of servers 3 are stored in a server rack 2 at regular intervals in the vertical direction. Each server 3 is provided with a cooling pump 4 as a fluid actuator that supplies a coolant to an internal heat generating portion, and a temperature sensor 5 that detects the temperature of the heat generating portion for each server 3. A control device 6 is stored together with the server 3 at the top of the rack 2 and controls the cooling pump 4 based on temperature information input from the temperature sensor 5.

図２に示すように、冷却ポンプ４はサーバ３の筺体８の外面（例えば背面）に設置されている。筺体８の内部には、ＣＰＵやＬＳＩ等の発熱部９と、発熱部９を送風により冷却するファン１０と、メモリや電源ユニットを含む各種の電子部品１１とが配設されている。発熱部９にはジャケット１２が装着され、その外面に温度センサ５が装着されている。ジャケット１２の内部には冷却液通路１３が形成され、通路１３の上流端が給液配管１４で冷却ポンプ４の吐出口に接続され、下流端が排液配管１５で排出口１６に接続されている。   As shown in FIG. 2, the cooling pump 4 is installed on the outer surface (for example, the back surface) of the housing 8 of the server 3. Inside the housing 8 are disposed a heat generating portion 9 such as a CPU or LSI, a fan 10 for cooling the heat generating portion 9 by blowing air, and various electronic components 11 including a memory and a power supply unit. A jacket 12 is attached to the heat generating portion 9, and a temperature sensor 5 is attached to the outer surface thereof. A coolant passage 13 is formed inside the jacket 12, the upstream end of the passage 13 is connected to the discharge port of the cooling pump 4 through the liquid supply pipe 14, and the downstream end is connected to the discharge port 16 through the drainage pipe 15. Yes.

冷却ポンプ４の吸込口は逆止弁１９を介して供給配管２０に接続され、排出口１６が回収配管２１に接続されている。配管２０，２１は、図３に示すように、ラック２内の供給ダクト２２と回収ダクト２３に接続され、供給ダクト２２が循環ポンプ２４に接続され、回収ダクト２３がタンク２５に接続されている。タンク２５には冷却器２６が付設され、冷却器２６から低温冷却液Ｃが循環ポンプ２４により供給ダクト２２、供給配管２０を介してサーバ３に供給され、サーバ３を通過した後の高温冷却液Ｃが回収配管２１、回収ダクト２３を介してタンク２５に還流する。   The suction port of the cooling pump 4 is connected to the supply pipe 20 via the check valve 19, and the discharge port 16 is connected to the recovery pipe 21. As shown in FIG. 3, the pipes 20 and 21 are connected to a supply duct 22 and a recovery duct 23 in the rack 2, the supply duct 22 is connected to a circulation pump 24, and the recovery duct 23 is connected to a tank 25. . A cooler 26 is attached to the tank 25, and the low-temperature coolant C is supplied from the cooler 26 to the server 3 by the circulation pump 24 through the supply duct 22 and the supply pipe 20, and the high-temperature coolant after passing through the server 3. C returns to the tank 25 through the recovery pipe 21 and the recovery duct 23.

図１に示すように、制御装置６の外面（例えば背面）には、入力端子２８、出力端子２９、ネットワーク端子３０が配設されている。入力端子２８は信号線３１で温度センサ５に接続され、発熱部９の温度情報が制御装置６に入力される。出力端子２９は制御線３２で冷却ポンプ４、ファン１０、循環ポンプ２４、冷却器２６に接続され、制御装置６がこれらの機器に駆動／停止信号を出力する。ネットワーク端子３０は有線または無線のＬＡＮ配線、公衆電話回線等の通信線３３で遠隔監視装置３４に接続され、遠隔監視装置３４がデータセンター内に設置されたすべてのサーバ冷却システム１をラック単位で監視する。なお、遠隔監視装置３４としてパソコンを使用し、遠隔地から専用線またはインターネット経由でサーバ冷却システム１を監視してもよい。   As shown in FIG. 1, an input terminal 28, an output terminal 29, and a network terminal 30 are disposed on the outer surface (for example, the back surface) of the control device 6. The input terminal 28 is connected to the temperature sensor 5 through a signal line 31, and temperature information of the heat generating unit 9 is input to the control device 6. The output terminal 29 is connected to the cooling pump 4, the fan 10, the circulation pump 24, and the cooler 26 by a control line 32, and the control device 6 outputs a drive / stop signal to these devices. The network terminal 30 is connected to the remote monitoring device 34 via a communication line 33 such as a wired or wireless LAN wiring or a public telephone line, and all the server cooling systems 1 in which the remote monitoring device 34 is installed in the data center are connected to the rack. Monitor. Note that a personal computer may be used as the remote monitoring device 34, and the server cooling system 1 may be monitored from a remote location via a dedicated line or the Internet.

サーバラック２では、常時、制御装置６が温度センサ５からの信号に基づいてサーバ３の温度状態を監視している。サーバ３の稼動に伴い、温度センサ５の出力が閾値を超えると、制御装置６はこのサーバ３の冷却ポンプ４とファン１０を協調制御する。ポンプ４の駆動により、冷却液Ｃが筺体８の外部から給液配管１４を通ってジャケット１２に供給され、冷却液Ｃとの熱交換により発熱部９が冷却される。そして、ジャケット１２を通過した冷却液Ｃが排液配管１５を通り排出口１６より筺体８の外部に排出される。なお、冷却ポンプ４の駆動中は、ファン１０を停止または回転数を落とす制御を行うことで、節電効果を期待することもできる。   In the server rack 2, the control device 6 constantly monitors the temperature state of the server 3 based on a signal from the temperature sensor 5. When the output of the temperature sensor 5 exceeds the threshold value with the operation of the server 3, the control device 6 controls the cooling pump 4 and the fan 10 of the server 3 in a coordinated manner. By driving the pump 4, the coolant C is supplied from the outside of the housing 8 to the jacket 12 through the liquid supply pipe 14, and the heat generating portion 9 is cooled by heat exchange with the coolant C. Then, the coolant C that has passed through the jacket 12 passes through the drain pipe 15 and is discharged from the discharge port 16 to the outside of the housing 8. During the driving of the cooling pump 4, it is possible to expect a power saving effect by controlling the fan 10 to stop or reduce the rotational speed.

したがって、この実施形態の冷却システム１によれば、発熱量が多いサーバ３のみ冷却ポンプ４を駆動し、発熱量が少ないサーバ３ではポンプ４を停止状態に保持しておくことができる。このため、多数のサーバラック２が設置された大規模データセンターにおいて、電力利用効率の高い冷却運転を行うことができる。また、制御装置６をサーバ３と共にラック２に格納し、制御装置６の外面に冷却ポンプ４と温度センサ５の接続端子２８，２９を設けたので、信号線３１や制御線３２をラック２の外部に整然と配線することもできる。   Therefore, according to the cooling system 1 of this embodiment, the cooling pump 4 can be driven only by the server 3 with a large amount of heat generation, and the pump 4 can be held in the stopped state at the server 3 with a small amount of heat generation. For this reason, it is possible to perform a cooling operation with high power utilization efficiency in a large-scale data center in which a large number of server racks 2 are installed. Further, since the control device 6 is stored in the rack 2 together with the server 3, and the connection terminals 28 and 29 of the cooling pump 4 and the temperature sensor 5 are provided on the outer surface of the control device 6, the signal line 31 and the control line 32 are connected to the rack 2. It can also be arranged externally neatly.

なお、本発明は上記実施形態に限定されるものではなく、例えば、図２に示す冷却ポンプ４にかえ、流体アクチュエータとして電磁バルブを使用し、電磁バルブによって冷却液Ｃの供給配管２０を開閉することもできる。また、図３に示すタンク２５を複数のサーバラック２で共用してもよい。その他、本発明の趣旨を逸脱しない範囲で、各部の構成を適宜に変更して実施することも可能である。   The present invention is not limited to the above embodiment. For example, instead of the cooling pump 4 shown in FIG. 2, an electromagnetic valve is used as a fluid actuator, and the supply pipe 20 for the coolant C is opened and closed by the electromagnetic valve. You can also. Further, the tank 25 shown in FIG. 3 may be shared by a plurality of server racks 2. In addition, the configuration of each unit can be changed as appropriate without departing from the spirit of the present invention.

１ 冷却システム
２ サーバラック
３ サーバ
４ 冷却ポンプ
５ 温度センサ
６ 制御装置
９ 発熱部
１２ ジャケット
２４ 循環ポンプ
２５ タンク
２６ 冷却器
２８ 入力端子
２９ 出力端子
３０ ネットワーク端子
Ｃ 冷却液 DESCRIPTION OF SYMBOLS 1 Cooling system 2 Server rack 3 Server 4 Cooling pump 5 Temperature sensor 6 Control apparatus 9 Heat generating part 12 Jacket 24 Circulation pump 25 Tank 26 Cooler 28 Input terminal 29 Output terminal 30 Network terminal C Coolant

Claims (6)

ラック内部に格納された複数の電子機器に冷却液を別々に供給する流体アクチュエータと、前記電子機器の発熱温度を個別に検出する温度センサと、前記温度センサから入力した温度情報に基づいて流体アクチュエータを制御する制御装置とを備えたことを特徴とする冷却システム。   A fluid actuator that separately supplies a coolant to a plurality of electronic devices stored inside the rack, a temperature sensor that individually detects the heat generation temperature of the electronic device, and a fluid actuator based on temperature information input from the temperature sensor And a control device for controlling the cooling system. 前記流体アクチュエータが冷却液を電子機器の発熱部に圧送するポンプを含む請求項１記載の冷却システム。   The cooling system according to claim 1, wherein the fluid actuator includes a pump that pumps the coolant to a heat generating part of the electronic device. 前記流体アクチュエータが電子機器の発熱部に接続された冷却液の供給配管を開閉する電磁バルブを含む請求項１記載の冷却システム。   The cooling system according to claim 1, wherein the fluid actuator includes an electromagnetic valve that opens and closes a coolant supply pipe connected to a heat generating portion of the electronic device. 前記電子機器の発熱部を送風により冷却する空冷ファンを備え、前記制御装置が温度センサから入力した温度情報に基づいて流体アクチュエータと空冷ファンとを協調制御する請求項１、２又は３記載の冷却システム。   4. The cooling according to claim 1, comprising an air cooling fan that cools the heat generating part of the electronic device by blowing air, wherein the control device cooperatively controls the fluid actuator and the air cooling fan based on temperature information input from a temperature sensor. system. 前記制御装置を電子機器と共にラック内部に格納し、制御装置の外面に流体アクチュエータおよび温度センサの接続端子を設けた請求項１〜４のいずれか一項に記載の冷却システム。   The cooling system according to any one of claims 1 to 4, wherein the control device is stored in a rack together with electronic equipment, and a connection terminal for a fluid actuator and a temperature sensor is provided on an outer surface of the control device. 前記制御装置を電子機器と共にラック内部に格納し、複数のラックの制御装置を通信線で遠隔監視装置に接続した請求項１〜５のいずれか一項に記載の冷却システム。   The cooling system according to any one of claims 1 to 5, wherein the control device is stored inside a rack together with electronic equipment, and the control devices of a plurality of racks are connected to a remote monitoring device via communication lines.
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WO2015156817A1 (en) 2014-04-11 2015-10-15 Hewlett-Packard Development Company, L. P. Liquid coolant supply
JP2016509278A (en) * 2012-12-14 2016-03-24 ミダス グリーン テクノロジー、 リミテッド ライアビリティー カンパニーＭｉｄａｓ Ｇｒｅｅｎ Ｔｅｃｈｎｏｌｏｇｙ， Ｌｌｃ Equipment immersion cooling system
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CN117715394A (en) * 2024-02-06 2024-03-15 广州豪特节能环保科技股份有限公司 Liquid cooling intelligent control system based on data center
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