JP2012039487A - Radio communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radio communication device which is small and light and improves transmission efficiency and receiver sensitivity.SOLUTION: A radio communication device comprises: a first circuit board 24 on which a plurality of first terminal parts 28 are installed; a high frequency circuit 36 which is installed on the first circuit board 24 and connected to at least one of the plurality of first terminal parts 28; a second circuit board 32 on which a plurality of second terminal parts 40 opposed to the plurality of first terminal parts 28 are installed; a first internal circuit 10 which is installed on the second circuit board 32 and connected to at least one of the plurality of second terminal parts 40; an antenna element 30 which is installed on the second circuit board 32 and connected to at least one of the plurality of second terminal parts 40; and conduction means 42 for making conduct between the plurality of first terminal parts 28 and the plurality of second terminal parts 40. The high frequency circuit 36 and the antenna element 30 are connected through the conduction means 42.

Description

  The present invention relates to a wireless communication apparatus.

  In recent years, a wireless communication device has been miniaturized and a wristwatch type has also appeared. High-density mounting is essential for miniaturization and weight reduction, and it is important to improve reception sensitivity under severe reception environments. Further, since the power supply capacity is limited, it is necessary to reduce the power consumption.

  In order to improve reception sensitivity, it is conceivable to install an antenna on the display panel substrate 32 as shown in FIG. 11, for example. The chip antenna 30 is separated from the circuit board 24 as much as possible so as not to be affected by noise from a CPU (not shown) or the like on the circuit board 24 and to prevent a decrease in efficiency and a shift of the center frequency due to the metal part. It is desirable to install it.

  When the above configuration is designed based on the prior art, the following structure is obtained. In general, as shown in FIGS. 12 and 13, a display panel connection circuit board side terminal (hereinafter abbreviated as a circuit board side terminal) 28 on the circuit board 24 and a display panel connection display panel side on the display panel board 32. The terminal (hereinafter, abbreviated as a display panel side terminal) 40 is “a rubber connector in which conductive silicone rubber using metal particles as a conductor and electrically insulating silicone rubber are alternately laminated in a zebra shape” (commonly known as zebra, hereinafter referred to as 42 Connected by a connector).

  However, when the high frequency analog IC 36 on the circuit board 24 and the chip antenna 30 on the display panel board 32 are connected, the circuit board side terminal 28 on the circuit board 24 becomes an obstacle, so the through hole 58 is provided. 24, the wiring 52 on the front surface, the conductive member 34 that fills the through hole 58 inside the circuit board side terminal 28, and the wiring 52 on the back surface of the circuit board 24. 28 is raised to the surface of the circuit board 24 by the conductive member 34 of the through hole 58 outside, and from there, a spring contact 60 on the circuit board 24, a connection spring 62, a spring contact 60 on the display panel board 32, and The chip antenna 30 installed on the display panel substrate 32 is connected via the conductive member 34 of the through hole 58.

JP 2008-172598 A

  As shown in paragraph [0015] of Patent Document 1 and FIG. 1 of Patent Document 1, soldering or spring connection is used to connect the antenna and the substrate on which the high-frequency circuit is mounted. However, in the case of soldering, it is necessary to remove the solder every time the device is disassembled, and there is a possibility that the working efficiency is deteriorated and the reliability is lowered. On the other hand, in the case of spring connection, there is a risk of transmission loss due to the inductance and resistance components of the spring, and a new component called a spring is required, which may lead to high costs.

  Further, in the above-described structure designed based on the prior art, as shown in FIG. 13, the high-frequency signal line has a long path and must pass through the through-hole 58 and the connection spring 62, resulting in an increase in transmission loss and a line. The impedance becomes unstable, and as a result, the transmission efficiency and the reception sensitivity may be deteriorated.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A first circuit board on which a plurality of first terminal portions are installed, a high-frequency circuit that is installed on the first circuit board and connected to at least one of the plurality of first terminal portions, A second circuit board provided with a plurality of second terminal parts facing the plurality of first terminal parts; and installed on the second circuit board and connected to at least one of the plurality of second terminal parts. The first internal circuit, the first high-frequency cutoff element having one end connected to the second terminal portion and the other end connected to the first internal circuit, and the second internal circuit board. An antenna element connected to at least one of the second terminal portions; and a conducting means for conducting the plurality of first terminal portions and the plurality of second terminal portions; and the high-frequency circuit and the antenna element Is connected through the conduction means. Apparatus.

  According to this, in the wireless communication apparatus, when the high-frequency circuit unit and the antenna element installed on the display panel substrate are connected, the connection is made through the conduction means, so that transmission efficiency and reception sensitivity are improved. In addition, since no new parts such as a connection spring are required, it is possible to reduce the size and weight. Furthermore, since soldering is not performed, disassembling work is facilitated and connection reliability is improved.

  Moreover, the power consumption of the transmission part and reception part of a high frequency circuit can be reduced by improvement of transmission efficiency and reception sensitivity. Further, since new parts such as connecting spring parts are not required, the design man-hours and cost are not required.

  Application Example 2 In the wireless communication device, the plurality of terminals of the first terminal unit are connected in parallel, and the plurality of terminals of the second terminal unit facing the first terminal unit connected in parallel. Are connected in parallel.

  According to this, even when the impedance of the conducting means with respect to the high-frequency signal is large at one terminal, the impedance can be reduced by connecting a plurality of terminals in parallel, so that the insertion loss with respect to the conducting means is reduced.

  Application Example 3 In the wireless communication device, a capacitor is inserted between terminals connected in parallel among the first and second terminal portions.

  According to this, even when the signals supplied to the plurality of first terminal portions are not the same, the frequency 2 currently used for normal wireless communication can be obtained by connecting the plurality of terminals in parallel via a small-capacitance capacitor. The .4 GHz signal passes through the capacitor, and the direct current or very low frequency signal supplied to the first internal circuit is blocked by the capacitor.

  Application Example 4 In the wireless communication apparatus, the conduction unit is installed above and below or right and left of the display unit, and the antenna element is installed on the second circuit board in the vicinity of the conduction unit. A wireless communication apparatus.

  According to this, by selecting a high-performance antenna configuration, the transmission efficiency and the reception sensitivity of the high-frequency circuit are improved.

  Application Example 5 In the wireless communication apparatus, the antenna element forms a dipole antenna.

  According to this, since it becomes a high-performance antenna element, the transmission efficiency and reception sensitivity of the high-frequency circuit are improved. A monopole antenna requires a large-area GND in order to exhibit its performance, but it is difficult to sufficiently secure it with a small wireless communication device such as a wristwatch type. On the other hand, since a dipole antenna does not require GND in principle, it is suitable for a small wireless communication apparatus such as a wristwatch type.

  Application Example 6 In the above wireless communication apparatus, the antenna element constitutes a diversity antenna.

  According to this, since the antenna element with the better reception state can be selected, it becomes a high-performance antenna element and the transmission efficiency and reception sensitivity of the high-frequency circuit are improved.

  Application Example 7 In the wireless communication device, the wireless communication device includes a first high-frequency cutoff element having one end connected to the second terminal portion and the other end connected to the first internal circuit. apparatus.

  According to this, since the high-frequency circuit and the antenna element are connected via the terminal portion on the surface of the same substrate connected to the first internal circuit via the first high-frequency cutoff element, the first internal circuit It is possible to separate a DC signal or a low frequency signal of a signal input to the high frequency signal used in the high frequency circuit by frequency.

  Application Example 8 In the wireless communication device, the first high-frequency cutoff element is an inductance element.

  According to this, the inductance element functions as a so-called low-pass filter. That is, since it has a high impedance for the frequency component of the high frequency signal and a low impedance for the frequency component of the DC signal or the low frequency signal, the leakage of the high frequency signal to the first internal circuit can be prevented. At the same time, a DC signal or a low-frequency signal applied to the terminal portion can be passed to the first internal circuit.

  Application Example 9 In the wireless communication device, the first high-frequency cutoff element is a resistance element.

  According to this, the resistance element has a function of blocking a high-frequency signal (a large amount of current). Further, since the current flowing through the first internal circuit is very small, a certain resistance value can be allowed, so that a DC signal or a low-frequency signal applied to the terminal portion can be passed through the first internal circuit.

  [Application Example 10] The wireless communication apparatus, wherein the wireless communication apparatus includes a DC cut capacitor for blocking a direct current signal between the first terminal portion and the high-frequency circuit.

  According to this, since the DC cut capacitor passes the alternating current component of the signal and blocks the direct current component, the direct current signal is prevented from flowing from the terminal portion to the high frequency circuit, and the high frequency signal received by the antenna element is more reliably detected. Can be input to a high-frequency circuit.

  Application Example 11 In the wireless communication device, the first internal circuit is a display unit.

  According to this, the information in the wireless communication device can be visually confirmed.

  Application Example 12 In the wireless communication apparatus, the first and second terminal portions are provided between the antenna element and the high-frequency circuit in a plan view.

  According to this, the connection distance between the high frequency circuit and the antenna element can be shortened, and transmission loss can be suppressed.

  Application Example 13 In the wireless communication device, the first and second terminal portions are a part of a wiring connecting the high-frequency circuit and the antenna element at the shortest distance. Communication device.

  According to this, the connection distance between the high frequency circuit and the antenna element can be minimized, and transmission loss can be further suppressed.

  Application Example 14 In the wireless communication device, a second internal circuit that outputs a DC signal or a low-frequency signal, one end connected to the first terminal unit, and the other end connected to the second internal circuit A second high-frequency cutoff element.

  According to this, since the high-frequency circuit and the antenna element are connected via the terminal portion on the surface of the same substrate connected to the second internal circuit via the second high-frequency cutoff element, the second internal circuit It is possible to separate the DC signal or low frequency signal of the signal output from the high frequency signal used in the high frequency circuit by frequency.

  Application Example 15 In the wireless communication device, the second high frequency cutoff element is an inductance element.

  According to this, the low-pass filter composed of an inductance element has a high impedance for the frequency component of the high-frequency signal and a low impedance for the frequency component of the DC signal or the low-frequency signal. The leakage of the high frequency signal to the circuit can be prevented, and the DC signal or the low frequency signal applied to the terminal portion can be passed to the second internal circuit.

  Application Example 16 In the wireless communication device, the second high frequency cutoff element is a resistance element.

  According to this, the resistance element is set to a relatively high resistance value, and has a function of blocking a high-frequency signal (a large amount of current). Further, since the current flowing through the second internal circuit is very small, a certain resistance value can be allowed, so that a DC signal or a low-frequency signal applied to the terminal portion can be passed through the second internal circuit.

  Application Example 17 In the wireless communication device, the second internal circuit is a signal processing digital IC.

  According to this, information in the wireless communication device can be digital signal processed.

BRIEF DESCRIPTION OF THE DRAWINGS Explanatory drawing which shows the whole structure of the arm mounting | wearing type | mold radio | wireless communication apparatus which concerns on 1st Embodiment. The top view and bottom view which show the circuit assembly mounted in the arm mounting | wearing type | mold radio | wireless communication apparatus which concerns on 1st Embodiment. Sectional drawing of the arm mounting | wearing type | mold radio | wireless communication apparatus which concerns on 1st Embodiment. Sectional drawing of the arm mounting | wearing type | mold radio | wireless communication apparatus which concerns on 1st Embodiment. 1 is a circuit diagram showing an arm-mounted wireless communication apparatus according to a first embodiment. The top view of the arm mounting type radio | wireless communication apparatus which concerns on 2nd Embodiment. The top view of the arm mounting type radio | wireless communication apparatus which concerns on 3rd Embodiment. Sectional drawing of the arm mounting | wearing type | mold radio | wireless communication apparatus which concerns on 3rd Embodiment. The figure which shows the structure of the antenna which concerns on 4th Embodiment. The figure which shows the structure of the antenna which concerns on 5th Embodiment. The top view of the conventional small radio | wireless apparatus. The top view of the conventional small radio | wireless apparatus. Sectional drawing of the conventional small radio | wireless apparatus.

Based on the drawings, an arm-mounted wireless communication device as a wireless communication device according to the present embodiment will be described.
(First embodiment)
FIG. 1 is an explanatory diagram showing the overall configuration of the wrist-worn radio communication apparatus according to the present embodiment. 2A and 2B are a plan view and a bottom view showing the circuit assembly mounted on the arm-mounted radio communication device according to the present embodiment. The arm-mounted wireless communication device 2 according to the present embodiment includes a device main body 12 in which a side on which a liquid crystal display panel (display unit) (first internal circuit) 10 is disposed is a surface side, a pair of arm bands 14R, 14L. Each arm band 14R, 14L has a band base end attached to both ends of the apparatus body 12, and these bands can be connected to each other by a buckle 16 at each end.

  The apparatus main body 12 includes a casing 18 on the front surface side, and a back cover 20 fixed to the back side of the casing 18 on the back side of the apparatus main body 12. A circuit assembly 22 is built in the apparatus main body 12 constituted by the casing 18 and the back cover 20. The circuit assembly 22 has a structure in which main components are stacked in the thickness direction inside the apparatus main body 12. That is, in the circuit assembly 22, the liquid crystal display panel 10, the circuit board (first circuit board) 24, and the circuit driving battery 26 are arranged in the thickness direction.

  FIG. 3 is a cross-sectional view of the arm-mounted wireless communication apparatus according to the present embodiment. The wrist-worn radio communication device 2 includes a circuit board 24 and a display panel board (second circuit board) 32. On the circuit board 24, various integrated circuits (ICs) to be described later and display panel connection circuit board side terminals (hereinafter abbreviated as circuit board side terminals) (first terminal portions) 28 are arranged. Has been. ICs such as a high frequency analog IC (high frequency circuit) 36 having a transmission and reception function and a signal processing digital IC (second internal circuit) 38 (see FIG. 5) are face-down bonded to the circuit board 24. . Among these ICs, the high frequency analog IC 36 transmits and receives a high frequency signal (RF signal) such as 2.4 GHz. The digital IC 38 for signal processing incorporates a digital circuit for sampling a received signal before analog / digital conversion, a phase lock loop circuit, and the like, and is driven by a high-frequency drive signal such as several MHz. A multilayer substrate is used as the circuit board 24, and a surface layer pattern (wiring pattern) is formed on a substrate made of a glass-epoxy substrate or a phenol resin substrate.

  On the display panel substrate 32, a liquid crystal display panel 10, a chip antenna (antenna element) 30, a display panel connection display panel side terminal (hereinafter abbreviated as a display panel side terminal) (second terminal portion) 40, Is arranged.

  The chip antenna 30 is disposed at a predetermined location around the display panel substrate 32. Note that the chip antenna (antenna element) 30 does not necessarily have to be directly fixed to the display panel substrate 32, as long as it is electrically connected to the conductive member 34 in the through hole 58 of the display panel substrate 32. It may be a simple press contact or may be connected by wiring with a lead wire or the like. The chip antenna 30 includes a chip antenna (for example, a helical antenna) mounted on the display panel substrate 32, but may be a pattern antenna or the like patterned on the display panel substrate 32.

  In general, the circuit board-side terminal 28 on the circuit board 24 and the display panel-side terminal 40 on the display panel board 32 indicate that “conductive silicone rubber using metal particles as a conductor and electrically insulating silicone rubber are alternately formed in a zebra shape. They are connected by “laminated rubber connectors” (commonly called zebras, hereinafter referred to as zebra connectors (conductive means)). Here, since the signal supplied to the liquid crystal display panel 10 is a DC signal or a low-frequency (several kHz or less) signal, it can be separated from a high-frequency signal having a frequency of 2.4 GHz, which is currently used for normal wireless communication. it can. The circuit board side terminal 28 and the display panel side terminal 40 may be provided between the chip antenna 30 and the high frequency analog IC 36 in plan view. According to this, the connection distance between the high frequency circuit and the antenna element can be shortened, and transmission loss can be suppressed.

  As shown in FIG. 3, the arm-mounted wireless communication device 2 according to the present embodiment is connected using a zebra connector 42. Here, since the signal supplied to the liquid crystal display panel 10 is a DC signal or a signal with a very low frequency, it can be separated from a signal with a frequency of 2.4 GHz currently used for normal wireless communication. This structure shortens the path of the high-frequency signal line and does not need to go through the conventional spring for connection, and also reduces the number of through holes, thereby reducing transmission loss and stabilizing the line impedance, resulting in transmission efficiency, Receive sensitivity is improved. Therefore, the power of the transmission / reception unit 44 (see FIG. 9) of the high frequency analog IC 36 can be reduced. Since the conventional connection spring is not necessary, it is possible to reduce the size, weight, and cost. Furthermore, since soldering is not performed, disassembling work is facilitated and connection reliability is improved.

  FIG. 4 is a cross-sectional view of the arm-mounted wireless communication apparatus according to the present embodiment. As shown in FIG. 4, the chip antenna 30 may be provided on the surface of the display panel substrate 32 that faces the circuit substrate 24 opposite to the surface on which the liquid crystal display panel 10 is provided. Thereby, since the chip antenna 30 is installed on the circuit board 24 side of the display panel substrate 32, a through hole is not required, and transmission loss is further reduced.

  FIG. 5 is a circuit diagram showing the arm-mounted wireless communication apparatus according to the present embodiment. When the impedance of the digital IC 38 for signal processing or the liquid crystal display panel 10 is low when viewed from the high frequency analog IC 36 or the chip antenna 30, or when the line from the circuit board side terminal 28 to the digital IC 38 for signal processing is long, the high frequency signal In order to surely prevent leakage to the digital IC 38 for signal processing and the liquid crystal display panel 10, as shown in FIG. 5A, the liquid crystal display panel 10 and the zebra connector 42 (display panel side terminal 40) An inductance element (first high frequency cutoff element) 46 may be provided between the two. As a result, the low-pass filter composed of the inductance element 46 has a high impedance for the frequency component of the high-frequency signal and a low impedance for the frequency component of the DC signal or the low-frequency signal. The high frequency signal can be prevented from leaking to the liquid crystal display panel, and a DC signal or a low frequency signal applied to the display panel side terminal 40 can be supplied to the liquid crystal display panel 10. For example, a high-frequency signal having a frequency of 2.4 GHz used for wireless communication is blocked by the inductance element 46. The signal supplied to the liquid crystal display panel 10 is a direct current signal or a signal with a very low frequency, and since the current is very small, even if the inductance element 46 is inserted, there is almost no problem.

  If necessary, a DC cut capacitor (DC cut capacitor) 50 is inserted between the high frequency analog IC 36 and the signal processing digital IC 38 or the liquid crystal display panel 10. Specifically, a DC cut capacitor 50 may be provided between the circuit board side terminal 28 and the high frequency analog IC 36. As a result, the DC cut capacitor 50 passes the AC component of the signal and blocks the DC component, so that the high frequency signal received by the chip antenna 30 can be more reliably input to the high frequency analog IC 36.

  The circuit board side terminal 28 and the display panel side terminal 40 are part of the wiring connecting the high frequency analog IC 36 and the chip antenna 30 with the shortest distance. As a result, the connection distance between the high frequency analog IC 36 and the chip antenna 30 can be minimized, and transmission loss can be suppressed. Further, the width (short direction) of the wiring 52 connected to the high frequency analog IC 36 and the wiring 52 connected to the chip antenna 30 is the width (short direction) of the circuit board side terminal 28 on the circuit board 24. It may be the same. As a result, transmission loss, particularly increase in conductor loss and increase in inductance, in the electrical signal transmission characteristic of the through hole that has conventionally occurred in the through hole are caused by the connection portion between the wiring 52 and the circuit board side terminal 28, and the wiring 52. Since there is no transmission loss at the connection between the circuit board side terminal 28 and the circuit board side terminal 28, the communication distance can be expanded without increasing the power consumption.

  With such a configuration, a high-frequency signal from the high-frequency analog IC 36 and a DC signal or a low-frequency signal supplied from the signal processing digital IC 38 are superimposed on the circuit board side terminal 28. Due to the low-pass filter, only a direct current component or an alternating current component having a relatively low frequency flows to the liquid crystal display panel 10, and a high frequency signal does not leak to the liquid crystal display panel 10. That is, almost no transmission loss of high-frequency signals occurs. Further, by providing the DC cut capacitor 50 between the circuit board side terminal 28 and the high frequency analog IC 36, it is possible to suppress a direct current from flowing through the high frequency analog IC 36.

  According to this embodiment, when the high frequency analog IC 36 and the chip antenna 30 are connected, the high frequency analog IC 36 and the chip antenna 30 are connected to the liquid crystal display panel 10 via the inductance element 46 on the same circuit board 24. The circuit board side terminal 28 is connected. The wiring 52 connected to the high frequency analog IC 36 and the wiring 52 connected to the chip antenna 30 are connected via a circuit board side terminal 28 on the same circuit board 24. As a result, the cost is reduced because the conventional through-hole is not formed. Further, the transmission loss of the high-frequency signal is reduced, the impedance is stabilized, and as a result, the reception sensitivity is improved. Further, since a through hole is not formed, it is possible to give the layout flexibility. Furthermore, compared to the case where a through hole is formed in the circuit board 24 and the RF signal is taken out from the back surface of the circuit board 24, the connection distance of the RF signal can be shortened by the amount not passing through the through hole, and transmission loss can be suppressed.

  In this embodiment, when connecting the high frequency analog IC 36 and the chip antenna 30 installed on the display panel substrate 32 in the arm-mounted wireless communication device, they are connected via the zebra connector 42. Thereby, transmission efficiency and reception sensitivity are improved. In addition, since no new parts such as a conventional connection spring are required, the size and weight can be reduced. Furthermore, since soldering is not performed, disassembling work is facilitated and connection reliability is improved.

(Modification 1)
In the above embodiment, the inductance element is provided in the first high-frequency cutoff element. However, as shown in FIG. 5B, the arm-mounted wireless communication device 4 in the present modification includes the liquid crystal display panel 10 and the display panel. A resistance element (first high frequency cutoff element) 48 may be provided between the side terminals 40. Thereby, the resistance element 48 is set to a relatively high resistance value and has a function of blocking the high-frequency signal. For example, since a high frequency signal having a frequency of 2.4 GHz used for wireless communication is blocked by the resistance element 48, the high frequency signal can be reliably prevented from leaking to the liquid crystal display panel 10 side. Further, since the current flowing through the liquid crystal display panel 10 is very small, a certain resistance value of the resistance element 48 can be allowed (energized). In this case, the structure of the resistance element 48 is simple because it is only necessary to increase the resistance value of the conductive portion of the zebra connector 42.

  According to the present embodiment, when the high frequency analog IC 36 and the chip antenna 30 are connected, the high frequency analog IC 36 and the chip antenna 30 are connected to the liquid crystal display panel 10 via the resistance element 48 on the same circuit board 24. The circuit board side terminal 28 is connected. The wiring 52 connected to the high frequency analog IC 36 and the wiring 52 connected to the chip antenna 30 are connected via a circuit board side terminal 28 on the same circuit board 24. As a result, the cost is reduced because the conventional through-hole is not formed. Further, the transmission loss of the high-frequency signal is reduced, the impedance is stabilized, and as a result, the reception sensitivity is improved.

(Modification 2)
Note that a circuit board side terminal 28 and a display panel side terminal 40 dedicated to high-frequency signal transmission may be provided. In this case, since the signal supplied to the liquid crystal display panel 10 is naturally not connected to this terminal, the high frequency signal and the signal supplied to the liquid crystal display panel 10 are separated, and an inductance element and a resistance element are not required, and the circuit is simple. become.

(Second Embodiment)
In the description of this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 6 is a top view of the arm-mounted wireless communication apparatus according to the present embodiment. In the first embodiment, one circuit board side terminal 28 and the display panel side terminal 40 are connected and used. However, the arm-mounted wireless communication device 6 according to this embodiment is as shown in FIG. A plurality of circuit board side terminals 28 and display panel side terminals 40 are used in parallel connection. As a result, when the impedance to the high frequency signal of the zebra connector 42 is large by connecting and using one circuit board side terminal 28 and the display panel side terminal 40, the impedance can be reduced. Loss is reduced.

  When the signals supplied to the plurality of circuit board side terminals 28 and the display panel side terminals 40 are not the same, as shown in FIG. 6, the plurality of terminals are connected in parallel via a small-capacitance capacitor. A small-capacitance capacitor passes a 2.4 GHz signal that is currently used for normal wireless communication, and blocks a direct current or extremely low frequency signal supplied to the liquid crystal display panel 10.

(Third embodiment)
In the description of this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 7 is a top view of the arm-mounted wireless communication apparatus according to the present embodiment. FIG. 8 is a cross-sectional view of the arm-mounted wireless communication apparatus according to the present embodiment. In the first embodiment, the configuration of one chip antenna 30 is used. However, in the arm-mounted wireless communication device 8 according to this embodiment, the liquid crystal display panel 10 is generally connected in a vertical or horizontal pair. Specifically, as shown in FIG. 7, the liquid crystal display panel 10 is connected in a pair of upper and lower sides. Therefore, as shown in FIG. 8, two chip antennas 30 are arranged outside the respective zebra connectors 42. The connection structure is the same as in the first embodiment. According to this, by selecting a high-performance antenna configuration, the transmission efficiency and reception sensitivity of the high-frequency circuit unit are improved.

(Fourth embodiment)
In the description of this embodiment, the same components as those of the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 9 is a diagram illustrating a configuration of the chip antenna 30 according to the present embodiment. In the third embodiment, two chip antennas 30 are arranged outside the respective zebra connectors 42. However, as shown in FIG. A dipole antenna 54 is constituted by two chip antennas 30. Thereby, since it becomes a high-performance antenna, transmission efficiency and reception sensitivity are improved. A monopole antenna requires a large-area GND in order to exhibit its performance, but it is difficult to ensure enough in an arm-mounted radio communication device. On the other hand, since the dipole antenna 54 does not require GND in principle, it is suitable for an arm-mounted radio communication apparatus.

(Fifth embodiment)
In the description of this embodiment, the same components as those of the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 10 is a diagram illustrating a configuration of the chip antenna 30 according to the present embodiment. In the third embodiment, two chip antennas 30 are arranged outside the respective zebra connectors 42. However, as shown in FIG. Diversity antenna 56 is configured by two chip antennas 30. As a result, since signals are input through two radio wave reception routes, the chip antenna 30 with the better reception state can be selected, so that the chip antenna 30 becomes a high-performance chip antenna, and transmission efficiency and reception sensitivity are improved.

  As a wireless communication device that can use this embodiment, in addition to the arm-mounted wireless communication device described above, a pager (portable small wireless device caller) that uses a high-frequency circuit and an antenna element in a space-saving manner, There are telephone sets, television sets, satellite receivers such as GPS (Global Positioning System), and wireless LAN (Local Area Network).

  Further, when the line from the circuit board side terminal 28 to the signal processing digital IC 38 is long or when the impedance of the signal processing digital IC 38 is low, as shown in FIGS. A second high-frequency cutoff element composed of the element 46 and the resistance element 48 may be provided between the signal processing digital IC 38 and the circuit board side terminal 28. As a result, leakage of the high frequency signal to the digital IC 38 for signal processing can be reliably prevented. In the case where an inductance element is provided between the liquid crystal display panel 10 and the circuit board side terminal 28, an inductance element may be provided between the signal processing digital IC 38 and the circuit board side terminal 28, or a resistance. An element may be provided. In the case where a resistance element is provided between the liquid crystal display panel 10 and the circuit board side terminal 28, an inductance element may be provided between the signal processing digital IC 38 and the circuit board side terminal 28, or a resistance element may be provided. An element may be provided.

  DESCRIPTION OF SYMBOLS 2, 4, 6, 8 ... Arm-mounted radio | wireless communication apparatus (wireless communication apparatus) 10 ... Liquid crystal display panel (display part) (1st internal circuit) 12 ... Apparatus main body 14R, 14L ... Arm band 16 ... Buckle 18 ... Casing DESCRIPTION OF SYMBOLS 20 ... Back cover 22 ... Circuit assembly 24 ... Circuit board (1st circuit board) 26 ... Battery for circuit drive 28 ... Circuit board side terminal for display panel connection (1st terminal part) 30 ... Chip antenna (antenna element) 32 ... display panel substrate (second circuit board) 34 ... conductive member 36 ... high frequency analog IC (high frequency circuit) 38 ... digital IC for signal processing (second internal circuit) 40 ... display panel connection display panel side terminal (first 2 terminal part) 42 ... zebra connector (conduction means) 44 ... transmission / reception part 46 ... inductance element (first and second high frequency cutoff elements) 48 ... resistance element (first 50 ... DC cut capacitor 52 ... Wiring 54 ... Dipole antenna 56 ... Diversity antenna 58 ... Through hole 60 ... Contact for spring 62 ... Spring for connection.

Claims (17)

A first circuit board provided with a plurality of first terminal portions;
A high-frequency circuit installed on the first circuit board and connected to at least one of the plurality of first terminal portions;
A second circuit board provided with a plurality of second terminal portions facing the plurality of first terminal portions;
A first internal circuit installed on the second circuit board and connected to at least one of the plurality of second terminal portions;
An antenna element installed on the second circuit board and connected to at least one of the plurality of second terminal portions;
Conducting means for conducting the plurality of first terminal portions and the plurality of second terminal portions;
Including
The radio communication apparatus, wherein the high-frequency circuit and the antenna element are connected via the conduction means. The wireless communication device according to claim 1,
The plurality of terminals of the first terminal portion are connected in parallel,
A plurality of terminals of the second terminal portion facing the first terminal portions connected in parallel are connected in parallel. The wireless communication device according to claim 2,
A wireless communication device, wherein a capacitor is inserted between terminals connected in parallel among the first and second terminal portions. In the radio | wireless communication apparatus as described in any one of Claims 1-3,
The conduction means is installed on the top and bottom or the left and right of the display unit,
The wireless communication device, wherein the antenna elements are respectively installed on the second circuit board in the vicinity of the conducting means. The wireless communication apparatus according to claim 4, wherein
The wireless communication device, wherein the antenna element constitutes a dipole antenna. The wireless communication apparatus according to claim 4, wherein
The radio communication apparatus according to claim 1, wherein the antenna element constitutes a diversity antenna. In the wireless communication apparatus according to any one of claims 1 to 6,
A wireless communication apparatus comprising a first high-frequency cutoff element having one end connected to the second terminal portion and the other end connected to the first internal circuit. The wireless communication device according to claim 7, wherein
The wireless communication device, wherein the first high-frequency cutoff element is an inductance element. The wireless communication device according to claim 7, wherein
The wireless communication apparatus, wherein the first high-frequency cutoff element is a resistance element. The wireless communication apparatus according to any one of claims 1 to 9,
A wireless communication apparatus comprising a DC cut capacitor for blocking a direct current signal between the first terminal portion and the high frequency circuit. The wireless communication apparatus according to any one of claims 1 to 10,
The wireless communication apparatus, wherein the first internal circuit is a display unit. The wireless communication apparatus according to any one of claims 1 to 11,
The wireless communication apparatus, wherein the first and second terminal portions are provided between the antenna element and the high-frequency circuit in a plan view. The wireless communication apparatus according to any one of claims 1 to 12,
The wireless communication device according to claim 1, wherein the first and second terminal portions are a part of a wiring connecting the high-frequency circuit and the antenna element at a shortest distance. In the radio | wireless communication apparatus as described in any one of Claims 1-13,
A second internal circuit for outputting a DC signal or a low-frequency signal;
A second high-frequency cutoff element having one end connected to the first terminal portion and the other end connected to the second internal circuit;
A wireless communication apparatus comprising: The wireless communication device according to claim 14, wherein
The wireless communication apparatus, wherein the second high frequency cutoff element is an inductance element. The wireless communication device according to claim 14, wherein
The wireless communication apparatus, wherein the second high-frequency cutoff element is a resistance element. The wireless communication device according to any one of claims 14 to 16,
The wireless communication device, wherein the second internal circuit is a digital IC for signal processing.