JP2012038681A - Dry mica tape and electrical insulation coil using the same - Google Patents
Dry mica tape and electrical insulation coil using the same Download PDFInfo
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- JP2012038681A JP2012038681A JP2010180223A JP2010180223A JP2012038681A JP 2012038681 A JP2012038681 A JP 2012038681A JP 2010180223 A JP2010180223 A JP 2010180223A JP 2010180223 A JP2010180223 A JP 2010180223A JP 2012038681 A JP2012038681 A JP 2012038681A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
- B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
- B32B19/045—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/30—Windings characterised by the insulating material
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/32—Windings characterised by the shape, form or construction of the insulation
- H02K3/40—Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/04—Insulators
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Insulated Conductors (AREA)
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Abstract
Description
本発明はドライマイカテープ、電気絶縁線輪、固定子コイル及び回転電機に係る。 The present invention relates to a dry mica tape, an electrically insulated wire ring, a stator coil, and a rotating electric machine.
発電機、車両および一般産業用途の回転電機は、小型化や軽量化、大容量化が要求されている。回転電機の小型化や軽量化の一つの手段として、電流密度を高くすることが挙げられるが、同一容量の場合には導体の発熱量が増大するため、コイルに用いられる絶縁材料には高耐熱化が要求される。 Generators, vehicles, and rotating electrical machines for general industrial use are required to be reduced in size, weight, and capacity. One way to reduce the size and weight of a rotating electrical machine is to increase the current density. However, if the capacity is the same, the heat generated by the conductor increases. Is required.
回転電機に用いられる電気絶縁線輪や固定子コイルの絶縁処理として、マイカテープと含浸ワニスを用いた単独注入(含浸)方式や、全含浸方式が知られている。
(1)単独注入方式は、規定形状に成型して絶縁被覆した導体に、ドライマイカテープを巻き回して電気絶縁線輪単体とし、この電気絶縁線輪単体に含浸ワニスを真空注入(含浸)後、さらに加圧注入(含浸)し、熱硬化して電気絶縁線輪とする。この電気絶縁線輪を鉄心スロットに収納してサシギ下ライナー、サシギなどで固定して固定子コイルとする方式である。
(2)全含浸方式は、規定形状に成型して絶縁被覆した導体に、ドライマイカテープを巻回して電気絶縁線輪単体とし、この電気絶縁線輪単体を鉄心スロットに組込み、サシギ下ライナー、サシギなどでスロット内に固定し鉄心外端部で接続して一体化して固定子単体とする。この固定子単体に含浸ワニスを真空、加圧により注入した後、熱硬化して固定子コイルとする方式である。
As an insulation treatment for an electric insulated wire ring and a stator coil used in a rotating electrical machine, a single injection (impregnation) method using mica tape and an impregnation varnish and a full impregnation method are known.
(1) In the single injection method, a dry mica tape is wound around a conductor that has been molded into a specified shape and covered with insulation to form a single electrically insulated wire ring, and after impregnating the impregnated varnish into this electrically insulated wire ring alone (impregnation) Further, pressure injection (impregnation) is performed and thermosetting is performed to obtain an electrically insulated wire ring. This electric insulated wire ring is housed in an iron core slot and fixed with a sashimi lower liner, sashimi or the like to form a stator coil.
(2) The all impregnation method is to wrap a dry mica tape around a conductor that has been molded into a specified shape and covered with insulation to form a single electric insulated wire ring, and this electric insulated wire ring is incorporated into an iron core slot. Fix in the slot with sashigi, etc., connect at the outer end of the core and integrate to make a single stator. In this method, the impregnated varnish is injected into the stator alone by vacuum and pressurization and then thermoset to form a stator coil.
以上のように、単独注入方式や全含浸方式は、導体などコイル全体に含浸ワニスが浸透できるため、電気絶縁性能を低下させる要因であるボイドを減らすことができ、電気絶縁信頼性が高い。これらの絶縁処理方式に適用される絶縁材料は、不飽和ポリエステル樹脂やエポキシ樹脂を主成分とする含浸ワニスと、フィルムなどの補強基材、マイカペーパーおよびマイカペーパーとフィルム基材とを貼り合わせるバインダ樹脂などからなるドライマイカテープで構成されている。 As described above, the single injection method and the total impregnation method allow the impregnation varnish to permeate the entire coil such as a conductor, and therefore can reduce voids that are a cause of lowering the electric insulation performance, and the electric insulation reliability is high. The insulating material applied to these insulation treatment methods is an impregnating varnish mainly composed of unsaturated polyester resin or epoxy resin, a reinforcing substrate such as a film, mica paper, and a binder that bonds mica paper and film substrate. It consists of dry mica tape made of resin.
前記注入方式で作製するコイル絶縁材料の耐熱性は、絶縁材料に用いられている含浸ワニスの硬化物の耐熱性に依存する。含浸ワニスを高耐熱化することで注入方式を用いて作製するコイル絶縁材料を高耐熱化する方法は、例えば、特開平1ー4615号(特許文献1)や特開平9ー316167号(特許文献2)に記載される方法がある。特許文献1や特許文献2では、多官能エポキシ樹脂や多官能硬化剤などの耐熱性に優れている素材を用いた含浸ワニスを採用している。しかし、多官能エポキシ樹脂や多官能硬化剤などは常温(25℃)で固形または高粘度であり、これらを配合した含浸ワニスも常温で高粘度となる。したがって、コイルの導体間や絶縁材料の細部に対する含浸ワニスの注入性が低下するため、例えば、含浸ワニスは注入時に加熱して粘度を低くしてから使用される。さらに、含浸ワニスは、何度も繰り返してコイルの注入に使用される。このため、上述のように注入の度に加熱すると徐々に硬化反応が進むことから、定期的な廃棄が必要となる。この結果、特許文献1や特許文献2に記載された含浸ワニスによって絶縁材料を高耐熱化するには、注入性が低下し、また、廃棄量が増えるという問題が生じる。
The heat resistance of the coil insulating material produced by the injection method depends on the heat resistance of the cured product of the impregnating varnish used for the insulating material. For example, Japanese Patent Laid-Open No. 1-4615 (Patent Document 1) and Japanese Patent Laid-Open No. 9-316167 (Patent Document) disclose a method of increasing the heat resistance of a coil insulating material manufactured by using an injection method by increasing the heat resistance of the impregnating varnish. There is a method described in 2). In
これに対して、ドライマイカテープのバインダ樹脂を高耐熱化することにより、加熱硬化時における注入方式で作製するコイル絶縁材料の劣化などを要因とする剥離を防止して、200℃以上で連続使用可能とするコイルを作製する方法がある。例えば、特開平03−77203号(特許文献3)、特開平6ー233485号(特許文献4)や特開平6ー233486号(特許文献5)である。特許文献3ではドライマイカテープのバインダ樹脂としてp−(2,3−エポキシプロポキシ)フェニル基を3個以上含む多官能エポキシ樹脂を単独、またはフェノール硬化剤を併用し、特許文献4はバインダ樹脂として不飽和イミド系樹脂組成物を用い、特許文献5はバインダ樹脂としてナフタレン骨格を有するエポキシ樹脂組成物を用いることで上述の効果を有する。しかし、特許文献3から5はドライマイカテープのバインダ樹脂が固形であるため、注入された含浸ワニスと溶解しにくいので、バインダ樹脂と含浸ワニスの硬化反応が不均一になる問題があった。また、前記特許文献3から5は、ドライマイカテープの補強基材とマイカペーパー(マイカ層)とを一つのバインダ樹脂で接着する構成である。
On the other hand, by increasing the heat resistance of the binder resin of the dry mica tape, it prevents peeling due to deterioration of the coil insulating material produced by the injection method at the time of heat curing, and is continuously used at 200 ° C or higher. There is a method of making a coil that enables it. For example, JP-A-03-77203 (Patent Document 3), JP-A-6-233485 (Patent Document 4) and JP-A-6-233486 (Patent Document 5). In
前記特許文献3から5では、本発明で明記した補強基材とマイカペーパーを接着するバインダ樹脂層Aが単独で硬化反応して硬化する機能を有する記載はない。さらに、前記特許文献3から5はマイカペーパー表面に前記バインダ樹脂と組成が異なる第二のバインダ樹脂を存在させて、含浸ワニスと硬化反応するといった記載もない。従って、前記特許文献3から5は、本発明における組成の異なる二つのバインダ樹脂を用いる構成については記載がなく、さらに、硬化反応前にマイカパーパーと補強基材を接着し、硬化反応後にマイカパーパーと補強基材を硬化する機能を有するバインダ樹脂層Aと、マイカペーパー表面に存在し、含浸ワニスと溶解、硬化反応する機能を有するバインダ樹脂層Bを用いる構成は開示されていないことは明白である。
In
本発明の目的は、ドライマイカテープと含浸ワニスを用いて、注入方式で作製するコイル絶縁材料の耐熱性を向上し、電気絶縁線輪および固定子コイルの高温における電気絶縁性を向上して、回転電機を小型化することである。また、含浸ワニスが導体に巻回したドライマイカテープ絶縁層等に確実に含浸され、それによって電気特性の優れた電気絶縁線輪、固定子コイル及び回転電機を提供することができる。 The purpose of the present invention is to improve the heat resistance of the coil insulating material produced by the injection method using dry mica tape and impregnating varnish, and to improve the electrical insulation properties at high temperatures of the electric insulated wire ring and the stator coil, This is to reduce the size of the rotating electrical machine. In addition, an impregnated varnish is reliably impregnated in a dry mica tape insulating layer or the like wound around a conductor, thereby providing an electrically insulated wire ring, a stator coil, and a rotating electrical machine having excellent electrical characteristics.
本発明は、補強基材と、該補強基材上に形成され、エポキシ樹脂を含むバインダ樹脂層A、該バインダ樹脂層Aに接して形成されたマイカペーパー層、及び前記マイカペーパー層に接して形成され、エポキシ樹脂を含み、導体に巻回したドライマイカテープに含浸する含浸ワニスと反応して、含浸ワニスのみの硬化物よりも高いガラス転移点を有する硬化物を与えるバインダ樹脂層Bを含むことを特徴とするドライマイカテープを提供するものである。また、本発明のドライマイカテープは、巻回したドライマイカテープに含浸する含浸ワニスやバインダ樹脂層を硬化反応するのための硬化促進剤を含むことができる。
本発明は更に、規定形状に成型し絶縁被覆した導体に、本発明のドライマイカテープを巻回して電気絶縁線輪単体とし、前記電気絶縁線輪単体を鉄心スロットに組み込み、複数の前記電気絶縁線輪を鉄心外端部で接続して、前記複数の電気絶縁線輪と鉄心とを一体にした状態で、エポキシ樹脂及び酸硬化剤を含む含浸ワニスを注入して硬化した固定子コイルを提供するものである。さらに本発明は、上記固定子コイルを用いた回転電機を提供するものである。
The present invention comprises a reinforcing base material, a binder resin layer A formed on the reinforcing base material and containing an epoxy resin, a mica paper layer formed in contact with the binder resin layer A, and in contact with the mica paper layer. A binder resin layer B formed and reacted with an impregnating varnish impregnated in a dry mica tape wound around a conductor, including an epoxy resin, to give a cured product having a glass transition point higher than a cured product of only the impregnated varnish The dry mica tape characterized by the above is provided. Further, the dry mica tape of the present invention can contain a curing accelerator for curing reaction of the impregnated varnish or binder resin layer impregnated in the wound dry mica tape.
The present invention further includes winding a dry mica tape of the present invention on a conductor molded into a prescribed shape and insulation-coated to form an electric insulated wire ring alone, incorporating the electric insulated wire ring alone into an iron core slot, and a plurality of the electric insulations Provided is a stator coil that is cured by injecting an impregnating varnish containing an epoxy resin and an acid curing agent in a state where the wire ring is connected at the outer end of the core and the plurality of electrically insulated wire rings and the iron core are integrated. To do. Furthermore, this invention provides the rotary electric machine using the said stator coil.
本発明のドライマイカテープと含浸ワニスを含むコイル絶縁材料は耐熱性を向上できる。また、本発明のドライマイカテープを用いた電気絶縁線輪、固定子コイルは電気絶縁性を向上できる。したがって、本発明の電気絶縁線輪、固定子コイルを適用した回転電機は小型化できる。 The coil insulating material containing the dry mica tape and impregnated varnish of the present invention can improve heat resistance. Moreover, the electrical insulation wire ring and the stator coil using the dry mica tape of the present invention can improve electrical insulation. Therefore, the rotating electrical machine to which the electrically insulated wire ring and the stator coil of the present invention are applied can be miniaturized.
本発明の好ましい実施態様のいくつかの例について説明する。前記ドライマイカテープにおいて、前記バインダ樹脂層Bは、巻回した前記ドライマイカテープに含浸する含浸ワニスと反応して、前記含浸ワニスのみの硬化物よりも高いガラス転移点を有する硬化物を与えるエポキシ樹脂を含むことが必要である。エポキシ樹脂や硬化剤を含む含浸ワニスと反応してより高いガラス転移点を有する硬化物を形成するのに適したものは脂環式エポキシ樹脂や多官能エポキシ樹脂などである。 Several examples of preferred embodiments of the present invention are described. In the dry mica tape, the binder resin layer B reacts with the impregnating varnish impregnated in the wound dry mica tape to give a cured product having a glass transition point higher than the cured product of only the impregnated varnish. It is necessary to contain a resin. Suitable for forming a cured product having a higher glass transition point by reacting with an impregnating varnish containing an epoxy resin or a curing agent is an alicyclic epoxy resin or a polyfunctional epoxy resin.
前記バインダ樹脂層A及びバインダ樹脂層Bにはエポキシ樹脂の硬化促進剤を含有することができる。含浸ワニスやドライマイカテープのバインダ樹脂層A及び/又はバインダ樹脂層Bなどに用いるエポキシ樹脂を硬化するのには、一般的に硬化促進剤が必要で、これを含浸ワニス或いはドライマイカテープのバインダ樹脂層A及び/またはバインダ樹脂層Bに添加する。含浸ワニスの保存寿命という観点からすれば、含浸ワニスには硬化促進剤を添加しないで、ドライマイカテープのバインダ樹脂層A及び/又はバインダ樹脂層Bなどの構成材に含有することが好ましい。 The binder resin layer A and the binder resin layer B may contain an epoxy resin curing accelerator. In order to cure the epoxy resin used in the binder resin layer A and / or the binder resin layer B of the impregnated varnish or dry mica tape, a curing accelerator is generally required, and this is used as the binder of the impregnated varnish or dry mica tape. It is added to the resin layer A and / or the binder resin layer B. From the viewpoint of the shelf life of the impregnating varnish, it is preferable that the impregnating varnish is contained in a constituent material such as the binder resin layer A and / or the binder resin layer B of the dry mica tape without adding a curing accelerator.
前記バインダ樹脂層Aに含まれるエポキシ樹脂はエポキシ基を三つ以上有する多官能エポキシ樹脂を含み、前記バインダ樹脂層Bに含まれるエポキシ樹脂は脂環式エポキシ樹脂を含むことがより好ましい。 More preferably, the epoxy resin contained in the binder resin layer A contains a polyfunctional epoxy resin having three or more epoxy groups, and the epoxy resin contained in the binder resin layer B contains an alicyclic epoxy resin.
該バインダ樹脂層A及び/又はバインダ樹脂層Bはエポキシ樹脂と硬化促進剤を含むことが好ましい。該バインダ樹脂層A及び/又はバインダ樹脂層Bに含まれる硬化促進剤は、アミン系硬化促進剤がより好ましい。ここで、アミン系硬化促進剤はイミダゾール類を含むものとする。前記バインダ樹脂層A及び/又はバインダ樹脂層Bに含まれる硬化促進剤は、コアがアミン化合物であって、シェルがエポキシ樹脂からなるカプセル型硬化促進剤が好ましい。ここで、アミン化合物はイミダゾール類を含むものとする。また、該バインダ樹脂層A及び/又はバインダ樹脂層Bに含まれる硬化促進剤は、金属アセチルアセトネートであってもよい。 The binder resin layer A and / or the binder resin layer B preferably contains an epoxy resin and a curing accelerator. The curing accelerator contained in the binder resin layer A and / or the binder resin layer B is more preferably an amine-based curing accelerator. Here, the amine curing accelerator includes imidazoles. The curing accelerator contained in the binder resin layer A and / or the binder resin layer B is preferably a capsule-type curing accelerator whose core is an amine compound and whose shell is an epoxy resin. Here, the amine compound includes imidazoles. Further, the curing accelerator contained in the binder resin layer A and / or the binder resin layer B may be metal acetylacetonate.
前記バインダ樹脂層A又はバインダ樹脂層Bは、更に(式1)で表わされる酸無水物骨格を有する酸硬化剤を含むことができる。 The binder resin layer A or the binder resin layer B may further include an acid curing agent having an acid anhydride skeleton represented by (Formula 1).
また、前記バインダ樹脂層Aに含まれる酸硬化剤は(式2)で表されるメチルシクロヘキセンテトラカルボン酸二無水物にすれば、得られる硬化物をより高いガラス転移点にすることができるので好ましい。 Further, if the acid curing agent contained in the binder resin layer A is methylcyclohexene tetracarboxylic dianhydride represented by (Formula 2), the resulting cured product can have a higher glass transition point. preferable.
該バインダ樹脂層Bに含まれるエポキシ樹脂は、(式3)で表わされる骨格を有するエポキシ樹脂を含んでもよい。 The epoxy resin contained in the binder resin layer B may include an epoxy resin having a skeleton represented by (Formula 3).
該バインダ樹脂層Bに含まれる硬化促進剤は、エポキシアダクトイミダゾールまたは金属アセチルアセトネートが好ましい。 The curing accelerator contained in the binder resin layer B is preferably epoxy adduct imidazole or metal acetylacetonate.
また、前記バインダ樹脂層Bはエポキシ樹脂及び硬化促進剤に加えて、化学構造に(式1)で表わされる酸無水物骨格を有する酸硬化剤を含むことができる。 In addition to the epoxy resin and the curing accelerator, the binder resin layer B may include an acid curing agent having an acid anhydride skeleton represented by (Formula 1) in its chemical structure.
本発明によれば、絶縁被覆して規定形状に成型した導体に、補強基材と、該補強基材上に形成され、エポキシ樹脂を含むバインダ樹脂層A、該バインダ樹脂層Aに接して形成されたマイカペーパー層、及び前記マイカペーパー層に接して形成され、エポキシ樹脂を含み、導体に巻回したドライマイカテープに含浸するエポキシ樹脂を含む含浸ワニスと反応して、含浸ワニスのみの硬化物よりも高いガラス転移点を有する硬化物を与えるバインダ樹脂層Bを有するドライマイカテープを巻回して電気絶縁線輪単体とし、前記電気絶縁線輪単体にエポキシ樹脂を含む含浸ワニスを注入して硬化する電気絶縁線輪を提供する。 According to the present invention, a conductor formed by insulation coating and molded into a specified shape is formed on a reinforcing base material, a binder resin layer A containing an epoxy resin formed on the reinforcing base material, and in contact with the binder resin layer A. The cured mica paper layer, and the cured product of only the impregnated varnish formed by contacting with the mica paper layer, reacting with the impregnated varnish containing the epoxy resin and impregnating the dry mica tape wound around the conductor A dry mica tape having a binder resin layer B that gives a cured product having a higher glass transition point is wound to form a single electrically insulated wire ring, and an impregnated varnish containing an epoxy resin is injected into the electrically insulated wire ring and cured. An electrically insulated wire ring is provided.
上記電気絶縁線輪の製造方法において、前記含浸ワニスにはエポキシ樹脂の硬化剤が含まれるが硬化促進剤が含まれず、前記バインダ樹脂層A及びバインダ樹脂層Bに硬化促進剤が含まれるという構成を取ることができる。バインダ樹脂層A及びバインダ樹脂層Bの硬化性を損なうことなく、含浸ワニスの保存寿命が長くなり、コスト低減に貢献する。 In the method for manufacturing an electrically insulated wire ring, the impregnating varnish includes an epoxy resin curing agent but does not include a curing accelerator, and the binder resin layer A and the binder resin layer B include a curing accelerator. Can take. Without impairing the curability of the binder resin layer A and the binder resin layer B, the shelf life of the impregnating varnish is extended, contributing to cost reduction.
本発明は、絶縁被覆して規定形状に成型した導体に、補強基材と、該補強基材上に形成されたバインダ樹脂層A、該バインダ樹脂層Aに接して形成されたマイカペーパー層、及び前記マイカペーパー層に接して形成され、エポキシ樹脂を含み、導体に巻回したドライマイカテープに含浸するエポキシ樹脂を含む含浸ワニスと反応して、含浸ワニスのみの硬化物よりも高いガラス転移点を有する硬化物を与えるバインダ樹脂層Bを有するドライマイカテープを巻回して形成された電気絶縁線輪単体を、鉄心スロットに組込み、前記複数の電気絶縁線輪単体を鉄心外端部で接続して、前記電気絶縁線輪単体と鉄心とを一体にして固定子コイル単体とし、前記固定子コイル単体にエポキシ樹脂を含む含浸ワニスを含浸、硬化した固定子コイルを提供する。 The present invention comprises a conductor formed by insulation coating and molded into a prescribed shape, a reinforcing base material, a binder resin layer A formed on the reinforcing base material, a mica paper layer formed in contact with the binder resin layer A, And a glass transition point that is formed in contact with the mica paper layer, reacts with an impregnating varnish containing an epoxy resin, impregnating a dry mica tape wound around a conductor, and higher than a cured product of only the impregnating varnish A single unit of an electrically insulated wire ring formed by winding a dry mica tape having a binder resin layer B that gives a cured product having a core is assembled in an iron core slot, and the plurality of individual electrically insulated wire rings are connected at an outer end of the core. Providing a stator coil obtained by impregnating and hardening an impregnated varnish containing an epoxy resin into the stator coil alone. That.
上記固定子コイルにおいて、前記含浸ワニスにはエポキシ樹脂の硬化剤を含み、前記バインダ樹脂層A及びバインダ樹脂層Bは硬化促進剤を含むという構成を取ることができる。 In the stator coil, the impregnating varnish may include an epoxy resin curing agent, and the binder resin layer A and the binder resin layer B may include a curing accelerator.
上記固定子コイルと、回転子コイルから耐熱性及び電気的特性に優れた回転電機を構成することができる。 A rotating electrical machine having excellent heat resistance and electrical characteristics can be configured from the stator coil and the rotor coil.
本発明のドライマイカテープは、バインダ樹脂層A、バインダ樹脂層B、補強基材およびマイカペーパーを図1に示すような積層構造にする。すなわち、本発明のドライマイカテープのバインダ樹脂層Aは、エポキシ樹脂、硬化促進剤(特に熱潜在性硬化促進剤が好ましい)を含んでいるため、加熱硬化前に補強基材とマイカペーパーを接着する機能と、加熱硬化後に補強基材とマイカペーパーを硬化する機能がある。さらに、前記バインダ樹脂層Aの組成を多官能エポキシ樹脂、多官能性酸硬化剤、および熱潜在性硬化促進剤を含む組成にすれば、加熱硬化後にバインダ樹脂層Aの硬化物の耐熱性を向上できる効果がある。 In the dry mica tape of the present invention, the binder resin layer A, the binder resin layer B, the reinforcing base material and the mica paper have a laminated structure as shown in FIG. That is, since the binder resin layer A of the dry mica tape of the present invention contains an epoxy resin and a curing accelerator (especially a thermal latent curing accelerator is preferable), the reinforcing base material and the mica paper are bonded before heat curing. And a function of curing the reinforcing substrate and mica paper after heat curing. Furthermore, if the composition of the binder resin layer A is a composition containing a polyfunctional epoxy resin, a polyfunctional acid curing agent, and a thermal latent curing accelerator, the heat resistance of the cured product of the binder resin layer A after heat curing is improved. There is an effect that can be improved.
次に、本発明のドライマイカテープのバインダ樹脂層Bは、マイカペーパーの表面に存在しているため、ドライマイカテープに注入された含浸ワニスと溶解しやすく、均一に硬化反応できる。さらに、前記バインダ樹脂層Bの組成を脂環式エポキシ樹脂および潜在性硬化促進剤を含む組成にすれば、加熱硬化前は硬化反応がほとんど進まず保管寿命を長くでき、さらに加熱硬化後に含浸ワニスとバインダ樹脂層Bの硬化物は、含浸ワニスのみの硬化物よりも耐熱性を向上できる効果がある。 Next, since the binder resin layer B of the dry mica tape of the present invention exists on the surface of the mica paper, it easily dissolves with the impregnated varnish injected into the dry mica tape and can be uniformly cured. Furthermore, if the composition of the binder resin layer B is a composition containing an alicyclic epoxy resin and a latent curing accelerator, the curing reaction hardly proceeds before heat curing, and the storage life can be extended. The cured product of the binder resin layer B has an effect of improving the heat resistance as compared with the cured product of only the impregnating varnish.
本発明のドライマイカテープのバインダ樹脂としては、多官能エポキシ樹脂、多官能性酸硬化剤、および熱潜在性硬化促進剤を含む組成のバインダ樹脂層Aと、脂環式エポキシ樹脂又は脂環式エポキシ樹脂と多官能エポキシ樹脂との混合物および熱潜在性硬化促進剤を含む組成のバインダ樹脂層Bを用いることが、本発明のドライマイカテープと含浸ワニスを含むコイル絶縁材料の耐熱性を向上する効果を大きくできるため、より好ましい。 The binder resin of the dry mica tape of the present invention includes a binder resin layer A having a composition containing a polyfunctional epoxy resin, a polyfunctional acid curing agent, and a thermal latent curing accelerator, and an alicyclic epoxy resin or alicyclic type. Use of the binder resin layer B having a composition including a mixture of an epoxy resin and a polyfunctional epoxy resin and a thermal latent curing accelerator improves the heat resistance of the coil insulating material including the dry mica tape and the impregnated varnish of the present invention. Since an effect can be enlarged, it is more preferable.
以上のように、本発明のドライマイカテープは注入方式で作製するコイル絶縁材料の耐熱性を向上できるため、本発明の電気絶縁線輪や固定子コイルの高温における電気絶縁性が向上でき、回転電機を小型化できる。 As described above, since the dry mica tape of the present invention can improve the heat resistance of the coil insulating material produced by the injection method, the electric insulation at high temperatures of the electric insulated wire ring and the stator coil of the present invention can be improved. The electric machine can be downsized.
以下において、本発明のドライマイカテープ、電気絶縁線輪、固定子コイル及び回転電機について詳細に説明する。 Hereinafter, the dry mica tape, the electrically insulated wire ring, the stator coil, and the rotating electrical machine of the present invention will be described in detail.
<ドライマイカテープ>
本発明のドライマイカテープの断面図を図1に示す。本発明のドライマイカテープは、マイカペーパー、補強基材、バインダ樹脂層A、バインダ樹脂層Bを含む。本発明のドライマイカテープは、フィルムなどの補強基材とマイカペーパーをメチルエチルケトンやメタノールなどの溶媒に溶かしたバインダ樹脂層Aで接着されている。さらに、前記マイカペーパーの表面からメチルエチルケトンやメタノールなどの溶媒に溶かしたバインダ樹脂層Bを塗布する。
<Dry mica tape>
A cross-sectional view of the dry mica tape of the present invention is shown in FIG. The dry mica tape of the present invention includes mica paper, a reinforcing substrate, a binder resin layer A, and a binder resin layer B. The dry mica tape of the present invention is bonded with a binder resin layer A in which a reinforcing substrate such as a film and mica paper are dissolved in a solvent such as methyl ethyl ketone or methanol. Further, a binder resin layer B dissolved in a solvent such as methyl ethyl ketone or methanol is applied from the surface of the mica paper.
前記補強基材としては、要求される耐熱性や絶縁仕様に対応した有機物フィルムやガラスクロスなどを用いることができる。 As the reinforcing substrate, an organic film or glass cloth corresponding to required heat resistance and insulation specifications can be used.
前記マイカペーパーとしては、単独注入方式や一体注入方式などの絶縁処理方式に応じた最適な粒径の集成マイカやフレークマイカなどで作製したものを用いることができる。 As the mica paper, those made of laminated mica or flake mica having an optimum particle size according to an insulation treatment method such as a single injection method or an integral injection method can be used.
前記バインダ樹脂層Aは、エポキシ樹脂、硬化促進剤を含み、要求される特性に応じて硬化剤を加えることができる。前記エポキシ樹脂は、エポキシ基が一つ以上有するエポキシ樹脂を1種類、もしくは2種類以上を同時に用いることができる。例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、トリス(ヒドロキシフェニル)メタン型エポキシ樹脂、トリス(ヒドロキシフェニル)エタン型エポキシ樹脂、トリス(ヒドロキシフェニル)プロパン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)メタン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)プロパン型エポキシ樹脂などが挙げられる。これらエポキシ樹脂の中では、エポキシ基を三つ以上有するトリス(ヒドロキシフェニル)メタン型エポキシ樹脂や1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂などが、ドライマイカテープのバインダ樹脂Aの耐熱性を向上することができ、注入方式で作製するコイル絶縁材料の耐熱性を向上できるため、より好ましい。 The binder resin layer A includes an epoxy resin and a curing accelerator, and a curing agent can be added according to required characteristics. As the epoxy resin, one or more epoxy resins having one or more epoxy groups can be used at the same time. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, tris (hydroxyphenyl) methane type epoxy resin, tris (hydroxyphenyl) ethane type epoxy resin, tris (hydroxyphenyl) propane type epoxy resin, tetrakis (hydroxyphenyl) methane Type epoxy resin, tetrakis (hydroxyphenyl) ethane type epoxy resin, tetrakis (hydroxyphenyl) propane type epoxy resin, and the like. Among these epoxy resins, tris (hydroxyphenyl) methane type epoxy resin having 1,3 or more epoxy groups and 1,1,2,2-tetrakis (hydroxyphenyl) ethane type epoxy resin are binder resins of dry mica tape. Since the heat resistance of A can be improved and the heat resistance of the coil insulating material produced by the injection method can be improved, it is more preferable.
上記バインダ樹脂層Aの硬化促進剤は、エポキシ樹脂を硬化できる化合物であれば良い。前記硬化促進剤としては、例えば、金属アセチルアセトネート、イミダゾール化合物をエポキシ樹脂で置換したエポキシアダクトイミダゾール、ナフテン酸やオクチル酸などの金属塩、コアがアミン化合物で、シェルがエポキシ樹脂からなるカプセル硬化促進剤などを1種類もしくは、2種類以上を同時に用いることができる。これら硬化促進剤の中では、金属アセチルアセトネートやカプセル型硬化促進剤などが、ドライマイカテープの保管寿命や注入方式で作製するコイル絶縁材料の耐熱性を向上できるため、より好ましい。 The curing accelerator for the binder resin layer A may be any compound that can cure the epoxy resin. Examples of the curing accelerator include metal acetylacetonate, epoxy adduct imidazole obtained by substituting an imidazole compound with an epoxy resin, a metal salt such as naphthenic acid and octylic acid, a core made of an amine compound, and a shell made of an epoxy resin. One type or two or more types of accelerators can be used simultaneously. Among these curing accelerators, metal acetylacetonate, capsule-type curing accelerators, and the like are more preferable because they can improve the shelf life of the dry mica tape and the heat resistance of the coil insulating material produced by the injection method.
上記バインダ樹脂層Aは、エポキシ樹脂と硬化促進剤との単独重合系で硬化することも可能であるが、硬化反応性を向上するためにエポキシ樹脂、硬化促進剤に加えて硬化剤を用いることがより好ましい。このようなバインダ樹脂層Aに用いる硬化剤としては、前記(式1)に示す酸無水物骨格を一つ以上有する酸硬化剤を1種類、または2種類以上を同時に用いることができる。前記酸硬化剤としては、例えば、メチルシクロヘキセンテトラカルボン酸二無水物、エチレングリコールビスアンヒドロトリメリテート、グリセリンビス(ヒドロトリメリテート)モノアセテート、ベンゾフェノンテトラカルボン酸二無水物、無水ピロメリット酸、メチルナジック酸無水物、水素化メチルナジック酸無水物、メチルテトラヒドロ無水フタル酸などが挙げられる。このような酸硬化剤の中では、前記(式2)に示すようなメチルシクロヘキセンテトラカルボン酸二無水物がドライマイカテープのバインダ樹脂層Aの耐熱性を向上することができ、注入方式で作製するコイル絶縁材料の耐熱性を向上できるため、より好ましい。 The binder resin layer A can be cured by a homopolymerization system of an epoxy resin and a curing accelerator, but a curing agent is used in addition to the epoxy resin and the curing accelerator in order to improve curing reactivity. Is more preferable. As the curing agent used for the binder resin layer A, one kind or two or more kinds of acid curing agents having one or more acid anhydride skeletons represented by the above (Formula 1) can be used at the same time. Examples of the acid curing agent include methylcyclohexene tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (hydrotrimellitate) monoacetate, benzophenone tetracarboxylic dianhydride, pyromellitic anhydride Methyl nadic acid anhydride, hydrogenated methyl nadic acid anhydride, methyl tetrahydrophthalic anhydride and the like. Among such acid curing agents, methylcyclohexene tetracarboxylic dianhydride as shown in the above (Formula 2) can improve the heat resistance of the binder resin layer A of the dry mica tape, and is produced by an injection method. This is more preferable because the heat resistance of the coil insulating material can be improved.
上記バインダ樹脂層Bは、エポキシ樹脂、硬化促進剤を含み、要求される特性に応じて硬化剤を加えることができる。前記エポキシ樹脂は、エポキシ基を一つ以上有するエポキシ樹脂を1種類、もしくは2種類以上を同時に用いることができる。例えば、(3’,4’−エポキシシクロヘキサン)メチル3,4−エポキシシクロヘキサンカルボキシレート、2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2ーエポキシ−4−(2−オキシラニル)シクロヘキサン付加物、トリス(ヒドロキシフェニル)メタン型エポキシ樹脂、トリス(ヒドロキシフェニル)エタン型エポキシ樹脂、トリス(ヒドロキシフェニル)プロパン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)メタン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂、テトラキス(ヒドロキシフェニル)プロパン型エポキシ樹脂などが挙げられる。これらのエポキシ樹脂の中では、(3’,4’−エポキシシクロヘキサン)メチル3,4−エポキシシクロヘキサンカルボキシレートが、バインダ樹脂層Bと含浸レジンとの溶解性を向上して注入方式で作製するコイル絶縁材料の耐熱性が向上でき、ドライマイカテープの保管寿命などを向上できるため、より好ましい。
The binder resin layer B includes an epoxy resin and a curing accelerator, and a curing agent can be added according to required characteristics. As the epoxy resin, one or more epoxy resins having one or more epoxy groups can be used at the same time. For example, (3 ′, 4′-epoxycyclohexane)
上記バインダ樹脂層Bの硬化促進剤は、エポキシ樹脂を硬化できる化合物であれば良い。このような硬化促進剤としては、例えば、イミダゾール化合物をエポキシ樹脂で置換したエポキシアダクトイミダゾール、金属アセチルアセトネート、ナフテン酸やオクチル酸などの金属塩、カプセル型硬化促進剤などを1種類もしくは、2種類以上を同時に用いることができる。 The curing accelerator for the binder resin layer B may be any compound that can cure the epoxy resin. Examples of such a curing accelerator include one or two types of epoxy adduct imidazole obtained by replacing an imidazole compound with an epoxy resin, metal acetylacetonate, metal salts such as naphthenic acid and octylic acid, capsule type curing accelerator, and the like. More than one type can be used simultaneously.
これら硬化促進剤の中では、エポキシアダクトイミダゾールや、金属アセチルアセトネートなどが、注入方式で作製するコイル絶縁材料の耐熱性、ドライマイカテープの保管寿命などを向上できるため、より好ましい。 Among these curing accelerators, epoxy adduct imidazole, metal acetylacetonate, and the like are more preferable because they can improve the heat resistance of the coil insulating material produced by the injection method, the shelf life of the dry mica tape, and the like.
また、上記バインダ樹脂層Bの硬化剤は、前記(式1)で示される酸無水物骨格を1つ以上有する酸硬化剤を1種類、または2種類以上を同時に用いることができる。前記酸硬化剤としては、例えば、メチルシクロヘキセンテトラカルボン酸二無水物、エチレングリコールビスアンヒドロトリメリテート、グリセリンビス(ヒドロトリメリテート)モノアセテート、ベンゾフェノンテトラカルボン酸二無水物、無水ピロメリット酸、メチルナジック酸無水物、水素化メチルナジック酸無水物、メチルテトラヒドロ無水フタル酸などが挙げられる。 In addition, as the curing agent for the binder resin layer B, one type or two or more types of acid curing agents having one or more acid anhydride skeletons represented by (Formula 1) can be used at the same time. Examples of the acid curing agent include methylcyclohexene tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (hydrotrimellitate) monoacetate, benzophenone tetracarboxylic dianhydride, pyromellitic anhydride Methyl nadic acid anhydride, hydrogenated methyl nadic acid anhydride, methyl tetrahydrophthalic anhydride and the like.
<電気絶縁線輪>
電気絶縁線輪は、規定形状に成型して絶縁被覆した導体に本発明のドライマイカテープを巻き回して電気絶縁線輪単体を作製し、注入タンク内などで電気絶縁線輪単体に含浸ワニスを真空注入後に加圧注入し、熱硬化して作製される。
<Electrically insulated wire ring>
The electric insulated wire ring is manufactured by winding the dry mica tape of the present invention around a conductor that is molded into a specified shape and covered with insulation, and the electric insulated wire ring is made alone in an injection tank or the like. It is manufactured by pressure injection after vacuum injection and thermosetting.
<固定子コイル>
固定子コイルは、規定形状に成型して絶縁被覆した導体に本発明のドライマイカテープを巻き回して電気絶縁線輪単体を作製し、この電気絶縁線輪単体を鉄心スロットに組込み、サシギ下ライナー、サシギなどを用いてスロット内に固定し鉄心外端部で接続して、電気絶縁線輪単体と鉄心とを一体にして固定子コイル単体とする。注入タンク内などで前記固定子コイル単体に含浸ワニスを真空注入後に加圧注入し、熱硬化して固定子コイルが作製される。
<Stator coil>
The stator coil is manufactured by winding the dry mica tape of the present invention around a conductor that is molded into a specified shape and covered with insulation to produce a single electrically insulated wire ring, and this electrically insulated wire ring is assembled into an iron core slot, and a sashimi liner Then, it is fixed in the slot using sashigi or the like and connected at the outer end of the iron core, and the electric insulated wire ring and the iron core are integrated into a single stator coil. An impregnating varnish is vacuum injected into the stator coil alone in an injection tank or the like, and then pressure-injected and thermally cured to produce a stator coil.
<電気絶縁線輪を用いた回転電機>
上記の如く作製した電気絶縁線輪を適用した回転電機は、上記電気絶縁線輪を鉄心スロットに組込み、サシギ下ライナー、サシギなどでスロット内に固定して、鉄心外端部で接続して作製した固定子コイルと回転子を組立てて作製される。
<Rotary electric machine using electrically insulated wire ring>
A rotating electrical machine using the electrically insulated wire ring manufactured as described above is manufactured by incorporating the electrically insulated wire ring into the core slot, fixing it in the slot with a sashimi liner, sashimi, etc., and connecting it at the outer end of the core. The stator coil and the rotor are assembled and manufactured.
<固定子コイルを用いた回転電機>
上記の如く作製した固定子コイルと回転子を組立てて回転電機が作製される。以下、本発明のドライマイカテープ、本発明のドライマイカテープを用いて電気絶縁線輪、固定子コイルおよび回転電機を作製した例を、それぞれ実施例で具体的に説明する。
<Rotary electric machine using stator coil>
A rotating electrical machine is manufactured by assembling the stator coil and the rotor manufactured as described above. Hereinafter, examples in which the dry mica tape of the present invention and the electrically insulated wire ring, the stator coil, and the rotating electrical machine were produced using the dry mica tape of the present invention will be specifically described in Examples.
本実施例のドライマイカテープに含浸ワニスを注入した時の絶縁材料の特性は、以下の測定方法および条件で評価した。 The characteristics of the insulating material when the impregnated varnish was injected into the dry mica tape of this example were evaluated by the following measuring methods and conditions.
(1)絶縁材料の動的粘弾性評価(DMA:Dynamic Mechanical Analysis、以下DMAと略す)による耐熱性評価
エポキシ樹脂のような熱硬化性樹脂組成物の硬化物の耐熱性の一つの目安として、ガラス転移点(以下Tgと略す)がある。前記硬化物のTgが高いほど高温における回転電機用コイルの電気特性や機械特性が高くできる。そこで、本発明のドライマイカテープと含浸ワニスで作製する絶縁材料の耐熱性をTgで評価した。絶縁材料のTgは、Tgの評価方法の一つである動的粘弾性測定(DMA)を用いて力学的損失正接(tanδDMA)を測定し、tanδDMAのピーク温度で評価した。
(1) Evaluation of heat resistance by dynamic viscoelasticity evaluation (DMA: Dynamic Mechanical Analysis, hereinafter abbreviated as DMA) of an insulating material As one standard of heat resistance of a cured product of a thermosetting resin composition such as an epoxy resin, There is a glass transition point (hereinafter abbreviated as Tg). The higher the Tg of the cured product, the higher the electrical characteristics and mechanical characteristics of the coil for rotating electrical machines at high temperatures. Then, the heat resistance of the insulating material produced with the dry mica tape of this invention and an impregnation varnish was evaluated by Tg. The Tg of the insulating material was evaluated by measuring the dynamic loss tangent (tan δ DMA ) using dynamic viscoelasticity measurement (DMA), which is one of Tg evaluation methods, and evaluating the peak temperature of tan δ DMA .
絶縁材料は、幅30mm×長さ100mm×厚さ0.20mmのドライマイカテープを5層重ねて金属板の間に挟んで、含浸ワニス[ビスフェノールA型エポキシ樹脂jER828(ジャパンエポキシレジン社製)を100重量部、メチルヘキサヒドロ無水フタル酸硬化剤HN−5500(日立化成工業社製)を100重量部、マンガン[III]アセチルアセトネート(和光純薬社製)を2重量部としたエポキシ樹脂組成物を一例として用いた]を380Pa/1hの真空注入と0.4MPa/5hの加圧注入した後に、25℃から120℃までを30minで昇温して120℃/1h保持した後、120℃から210℃までを2h掛けて昇温して210℃/8h保持して製作した。DMAのサンプルは前記絶縁材料を長さ25mm×幅5mm×厚さ0.5mmの寸法に加工して作製した。 Insulating material is 5 layers of dry mica tape 30mm wide x 100mm long x 0.20mm thick and sandwiched between metal plates, impregnating varnish [bisphenol A type epoxy resin jER828 (made by Japan Epoxy Resin Co., Ltd.) 100 weight Epoxy resin composition containing 100 parts by weight of methylhexahydrophthalic anhydride curing agent HN-5500 (manufactured by Hitachi Chemical Co., Ltd.) and 2 parts by weight of manganese [III] acetylacetonate (manufactured by Wako Pure Chemical Industries, Ltd.) Used as an example], after vacuum injection of 380 Pa / 1 h and pressure injection of 0.4 MPa / 5 h, the temperature was raised from 25 ° C. to 120 ° C. over 30 minutes and held at 120 ° C./1 h, and then from 120 ° C. to 210 ° C. The temperature was raised to 2 ° C. over 2 hours and maintained at 210 ° C./8 hours. A DMA sample was produced by processing the insulating material into dimensions of 25 mm long × 5 mm wide × 0.5 mm thick.
DMAは、レオスペクトラDVE−V4(レオロジ社製)を用いて、引張りモードにより25℃から300℃までを2℃/minで昇温し、スパン間20mm、測定周波数10Hz、変位振幅0.5μmの条件で力学的損失正接(tanδDMA)を測定した。判定方法はtanδDMAのピーク値の温度が170℃以上の時は、高温域(170℃以上)での機械的特性やコイルなどの電気絶縁性が向上できるので○と表示し、170℃より低い時は×と表示し、tanδDMAのピーク値の温度を( )内に併記した。 The DMA uses a Leospectra DVE-V4 (manufactured by Rheology Co., Ltd.) and increases the temperature from 25 ° C. to 300 ° C. at a rate of 2 ° C./min. The mechanical loss tangent (tan δ DMA ) was measured under the conditions. When the peak value of tan δ DMA is 170 ° C. or higher, the determination method is indicated as “◯” because the mechanical properties in the high temperature range (170 ° C. or higher) and the electrical insulation of the coil can be improved. The time is indicated as x, and the temperature of the peak value of tan δ DMA is shown in parentheses.
(2)電気絶縁線輪および固定子コイルの電気絶縁性試験(tanδ)
180℃に保持した恒温槽内に電気絶縁線輪、固定子コイルを静置して、定格電圧1kVを印加したときのtanδを測定した。180℃におけるtanδの判定基準は電気絶縁性が優れるので15%以下とした。判定はtanδが15%以下の場合は○、15%を超える場合は×と表示した。
(2) Electrical insulation test (tan δ) of electrical insulated wire ring and stator coil
An electrically insulated wire ring and a stator coil were allowed to stand in a thermostat kept at 180 ° C., and tan δ when a rated voltage of 1 kV was applied was measured. The criterion for tan δ at 180 ° C. was 15% or less because of excellent electrical insulation. The determination was indicated as ◯ when tan δ was 15% or less, and × when it exceeded 15%.
以下の実施例及び比較例において用いられたエポキシ樹脂、硬化剤、硬化促進剤を表1,2,3においては略号で示したが、略号の意味は以下のとおりである。
(a)エポキシ樹脂
E1;トリス(ヒドロキシフェニル)メタン型エポキシ樹脂
E2;ビスフェノールA型エポキシ樹脂
E3;(3’、4’−エポキシシクロヘキサン)メチル―3,4−エポキシシクロヘキサンカルボキシレート
E4;2,2−ビス(ヒドロキシメチル―1−ブタノールの1,2−エポキシ―4−(2−オクチルシラニル)
E5;1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂
(b)硬化剤
C1;メチルシクロヘキセンテトラカルボン酸二無水物
C2;水素化メチルナジック酸
C3;フェノールノボラック樹脂
C4;エチレングリコールビスアンヒドロトリメリテート
(c)硬化促進剤
CP1;カプセル型硬化促進剤(コア:アミン化合物、シェル:エポキシ樹脂)
CP2;エポキシアダクトイミダゾール
CP3;マンガン[III]アセチルアセトネート
(実施例1〜10)、(比較例1〜3)
本発明の実施例1〜10のドライマイカテープを作製し、注入方式で作製する絶縁材料の耐熱性を評価した例を説明する。
The epoxy resins, curing agents, and curing accelerators used in the following examples and comparative examples are indicated by abbreviations in Tables 1, 2, and 3, and the meanings of the abbreviations are as follows.
(A) Epoxy resin E1; Tris (hydroxyphenyl) methane type epoxy resin E2; Bisphenol A type epoxy resin E3; (3 ′, 4′-epoxycyclohexane) methyl-3,4-epoxycyclohexanecarboxylate E4; 2,2 -Bis (1,2-epoxy-4- (2-octylsilanyl) of hydroxymethyl-1-butanol)
E5; 1,1,2,2-tetrakis (hydroxyphenyl) ethane type epoxy resin (b) curing agent C1; methylcyclohexenetetracarboxylic dianhydride C2; hydrogenated methylnadic acid C3; phenol novolac resin C4; ethylene glycol Bis anhydro trimellitate (c) Curing accelerator CP1; Capsule type curing accelerator (core: amine compound, shell: epoxy resin)
CP2; epoxy adduct imidazole CP3; manganese [III] acetylacetonate (Examples 1 to 10), (Comparative Examples 1 to 3)
Examples in which the dry mica tapes of Examples 1 to 10 of the present invention are produced and the heat resistance of the insulating material produced by the injection method is evaluated will be described.
本発明の実施例1〜10のドライマイカテープは、表1および表2に示した組成のバインダ樹脂層Aおよびバインダ樹脂層Bを用い、補強基材(ポリイミドフィルム)とマイカペーパーをバインダ樹脂層Aで接着し、マイカペーパーの表面にバインダ樹脂層Bを塗布して作製した。
バインダン樹脂層Aの調合は、エポキシ樹脂としてトリス(ヒドロキシフェニル)メタン型エポキシ樹脂(ジャパンエポキシレジン社製、製品名jER1032H60)、ビスフェノールA型エポキシ樹脂(旭化成ケミカルズ社製、製品名AER−260)、1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂(ジャパンエポキシレジン社製、製品名jER1031S)を[ ]内の数値の割合で混合して用いた。酸硬化剤としてメチルシクロヘキセンテトラカルボン酸二無水物(DIC社製、製品名エピクロンB−4400)、水素化メチルナジック酸無水物(新日本理化社製、製品名リカシッドHNA−100)、エチレングリコールビスアンヒドロトリメリテート(新日本理化社製、製品名TMEG−500)を[ ]内の数値の割合で混合して用いた。硬化促進剤としてカプセル型硬化促進剤(旭化成イーマテリアルズ社製、ノバキュアHX3088)、マンガン[III]アセチルアセトネート(和光純薬工業社製)を用いた。エポキシ樹脂と酸硬化剤は当量比1:1で混合し、硬化促進剤は前記エポキシ樹脂と酸硬化剤の総重量に対して表1および表2に記載した濃度で添加した。
バインダ樹脂層Bの調合は、エポキシ樹脂として(3’,4’−エポキシシクロヘキサン)メチル3,4ーエポキシシクロヘキサンカルボキシレート(ダイセル化学工業社製、製品名CEL2021P)、2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ―4−(2−オキシラニル)(ダイセル化学工業社製、製品名EHPE3150)、トリス(ヒドロキシフェニル)メタン型エポキシ樹脂、ビスフェノールA型エポキシ樹脂を[ ]内の数値の割合で混合して用いた。酸硬化剤として水素化メチルナジック酸無水物を用いた。硬化促進剤としてエポキシアダクトイミダゾール(ジャパンエポキシレジン製、商品名P200)、マンガン[III]アセチルアセトネートを用いた。硬化促進剤の塗布量はマイカテープに対して1〜1.2g/m2とし、エポキシ樹脂を単独、またはエポキシ樹脂と酸硬化剤を当量比1:1で混合したものに添加して用いた。なお、硬化促進剤は、バインダ樹脂層Bの前記エポキシ樹脂単独、あるいは前記エポキシ樹脂と酸硬化剤の混合物に添加せずに別に用意し、バインダ樹脂層Bを塗布する前後に、硬化促進剤をマイカペーパー表面へ塗布することもできる。
The dry mica tapes of Examples 1 to 10 of the present invention use the binder resin layer A and the binder resin layer B having the compositions shown in Tables 1 and 2, and the reinforcing base material (polyimide film) and mica paper as the binder resin layer. It was prepared by bonding with A and applying the binder resin layer B to the surface of mica paper.
The preparation of the binder resin layer A is made of tris (hydroxyphenyl) methane type epoxy resin (product name: jER1032H60, manufactured by Japan Epoxy Resin), bisphenol A type epoxy resin (product name: AER-260, manufactured by Asahi Kasei Chemicals) as an epoxy resin, 1,1,2,2-Tetrakis (hydroxyphenyl) ethane type epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., product name jER1031S) was mixed and used at a numerical ratio in []. As acid curing agents, methylcyclohexene tetracarboxylic dianhydride (manufactured by DIC, product name Epiclone B-4400), hydrogenated methyl nadic acid anhydride (manufactured by Shin Nippon Rika Co., Ltd., product name Ricacid HNA-100), ethylene glycol bis Anhydrotrimellitate (manufactured by Shin Nippon Rika Co., Ltd., product name TMEG-500) was used by mixing in the ratio of the numerical value in []. As a curing accelerator, a capsule type curing accelerator (Asahi Kasei E-Materials, NovaCure HX3088) and manganese [III] acetylacetonate (Wako Pure Chemical Industries, Ltd.) were used. The epoxy resin and the acid curing agent were mixed at an equivalent ratio of 1: 1, and the curing accelerator was added at a concentration described in Tables 1 and 2 with respect to the total weight of the epoxy resin and the acid curing agent.
The binder resin layer B was prepared by using (3 ′, 4′-epoxycyclohexane)
比較例1〜2のドライマイカテープは、マイカペーパーと補強基材(ポリイミドフィルム)を表3に示した組成のバインダ樹脂層Aを用いて接着し、硬化促進剤としてエポキシアダクトイミダゾールをマイカペーパー表面に対して1g/m2塗布して作製した。バインダ樹脂層Aの調合は、エポキシ樹脂として1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂、ビスフェノールA型エポキシ樹脂を[ ]内の数値の割合で混合して用いた。 In the dry mica tapes of Comparative Examples 1 and 2, mica paper and a reinforcing base material (polyimide film) are bonded using the binder resin layer A having the composition shown in Table 3, and epoxy adduct imidazole is used as a curing accelerator on the surface of the mica paper. 1 g / m 2 was applied to the substrate. In the preparation of the binder resin layer A, 1,1,2,2-tetrakis (hydroxyphenyl) ethane type epoxy resin and bisphenol A type epoxy resin were mixed and used as an epoxy resin at a numerical ratio in [].
比較例3のドライマイカテープは、マイカペーパーと補強基材(ポリイミドフィルム)を表3に示した組成のバインダ樹脂層Aを用いて接着し、硬化促進剤としてエポキシアダクトイミダゾールをマイカペーパー表面に対して1g/m2塗布して作製した。
バインダ樹脂層Aの調合は、エポキシ樹脂として1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型エポキシ樹脂、ビスフェノールA型エポキシ樹脂を[ ]内の数値の割合で混合して用い、硬化剤としてフェノールノボラック型硬化剤(明和化成社製、製品名MF−1M)を用い、エポキシ樹脂と硬化剤を当量比1:1で混合して用いた。
In the dry mica tape of Comparative Example 3, mica paper and a reinforcing base material (polyimide film) were bonded using the binder resin layer A having the composition shown in Table 3, and epoxy adduct imidazole was used as a curing accelerator with respect to the mica paper surface. 1 g / m 2 was applied.
The binder resin layer A is prepared by using 1,1,2,2-tetrakis (hydroxyphenyl) ethane type epoxy resin and bisphenol A type epoxy resin as epoxy resins mixed at a ratio of the numerical values in []. A phenol novolac type curing agent (product name MF-1M, manufactured by Meiwa Kasei Co., Ltd.) was used as a mixture, and an epoxy resin and a curing agent were mixed at an equivalent ratio of 1: 1.
作製した本実施例および比較例のドライマイカテープは寸法を幅30mm×長さ20mとした。本実施例および比較例のドライマイカテープを用いて注入方式で作製するコイル絶縁材料の耐熱性を表1〜3に記載した。
実施例1〜10の絶縁材料の耐熱性は、いずれも170℃以上であった。一方、比較例1〜3のドライマイカテープの耐熱性は、いずれも170℃未満であり判定値を満足しなかった。これら比較例のドライマイカテープは、多官能エポキシ樹脂などの耐熱性を高くできるバインダ樹脂を用いたが、固形のバインダ樹脂が補強基材とマイカペーパーの間に存在しているだけであったために含浸ワニスが十分に浸透せず、それらの相互溶解性が悪く、耐熱性が向上しなかった。
The produced dry mica tapes of this example and comparative example were 30 mm wide × 20 m long. Tables 1 to 3 show the heat resistance of the coil insulating materials manufactured by the injection method using the dry mica tapes of this example and the comparative example.
The heat resistance of the insulating materials of Examples 1 to 10 was 170 ° C. or higher. On the other hand, the heat resistance of the dry mica tapes of Comparative Examples 1 to 3 was less than 170 ° C. and did not satisfy the judgment value. The dry mica tape of these comparative examples used a binder resin that can increase heat resistance such as a polyfunctional epoxy resin, but the solid binder resin was only present between the reinforcing substrate and the mica paper. The impregnating varnish did not penetrate sufficiently, their mutual solubility was poor, and the heat resistance was not improved.
以上、本実施例のドライマイカテープは、バインダ樹脂層A、バインダ樹脂層B、補強基材、マイカペーパーが積層構造であったため、注入方式で作製するコイル絶縁材料の耐熱性(動的粘弾性によるtanδDMAのピークの温度で判定)を170℃以上にできる効果があった。 As described above, since the dry mica tape of this example has a laminated structure of the binder resin layer A, the binder resin layer B, the reinforcing base material, and mica paper, the heat resistance (dynamic viscoelasticity) of the coil insulating material produced by the injection method. (Determined by the temperature of the peak of tan δ DMA) by 170 ° C. or more.
(実施例11〜13)、(比較例4〜5)
本発明のドライマイカテープを用いた電気絶縁線輪の製法および得られた電気絶縁線輪の特性を説明する。図2(a)は本実施例11〜13の電気絶縁線輪5の外観図で、図2(b)が図2(a)の円で示した部分の内部断面拡大図である。
(Examples 11 to 13), (Comparative Examples 4 to 5)
A method for producing an electrically insulated wire ring using the dry mica tape of the present invention and characteristics of the obtained electrically insulated wire ring will be described. 2A is an external view of the electrically insulated wire ring 5 of Examples 11 to 13, and FIG. 2B is an enlarged internal cross-sectional view of a portion indicated by a circle in FIG.
実施例11の電気絶縁線輪は、規定形状に成型して絶縁被覆した導体に、実施例2のドライマイカテープ(厚0.15mm×幅25mm)を5回巻回して電気絶縁線輪単体を作製した。この電気絶縁線輪単体を25℃に保持した含浸槽内に静置して含浸ワニス(jER828を100重量部、HN−5500を100重量部、マンガン[III]アセチルアセトネートを2重量部とした含浸ワニスを一例として用いた)を380Pa/1hの真空注入と0.4MPa/5hの加圧注入した後に、熱硬化[25℃から120℃までを30minで昇温して120℃/1h保持した後、120℃から210℃までを2h掛けて昇温して210℃/8h保持]して実施例11の電気絶縁線輪を製作した。実施例12の電気絶縁線輪単体は実施例4のドライマイカテープを用いた以外は実施例11と同様の方法で作製し、この電気絶縁線輪単体に実施例11と同様の方法で含浸ワニスを注入して実施例12の電気絶縁線輪を作製した。実施例13の電気絶縁線輪単体は実施例6のドライマイカテープを用いて最終硬化温度を230℃に変えた以外は実施例11と同様の方法で作製し、この電気絶縁線輪単体に実施例11と同様の方法で含浸ワニスを注入して実施例13の電気絶縁線輪を作製した。 The electric insulated wire ring of Example 11 is obtained by winding the dry mica tape (thickness 0.15 mm × width 25 mm) of Example 2 5 times around a conductor molded into a prescribed shape and insulated and coated. Produced. This electrically insulated wire ring alone was placed in an impregnation tank maintained at 25 ° C. to make an impregnation varnish (100 parts by weight of jER828, 100 parts by weight of HN-5500, and 2 parts by weight of manganese [III] acetylacetonate). Impregnating varnish was used as an example) after vacuum injection of 380 Pa / 1 h and pressure injection of 0.4 MPa / 5 h, followed by thermosetting [from 25 ° C. to 120 ° C. over 30 min and maintained at 120 ° C./1 h Thereafter, the temperature was raised from 120 ° C. to 210 ° C. over 2 hours and held at 210 ° C./8 h] to produce an electrically insulated wire of Example 11. The electric insulated wire ring of Example 12 was produced by the same method as in Example 11 except that the dry mica tape of Example 4 was used. The electric insulated wire ring alone was impregnated with the same method as in Example 11. Was injected to produce an electrically insulated wire ring of Example 12. The electric insulated wire ring of Example 13 was produced in the same manner as in Example 11 except that the final curing temperature was changed to 230 ° C. using the dry mica tape of Example 6, and this electric insulated wire ring was carried out. An impregnated varnish was injected in the same manner as in Example 11 to produce an electrically insulated wire ring of Example 13.
一方、比較例4の電気絶縁線輪単体は比較例1の構成のドライマイカテープを用いた以外は本実施例11と同様な方法で作製し、この電気絶縁線輪単体に実施例11と同様の方法で含浸ワニスを注入して、比較例4の電気絶縁線輪を作製した。比較例5の電気絶縁線輪単体は比較例3の構成のドライマイカテープを用いた以外は本実施例11と同様の方法で作製し、この電気絶縁線輪単体に本実施例11と同様の方法で含浸ワニスを注入して比較例5の電気絶縁線輪を作製した。 On the other hand, the electrically insulated wire ring of Comparative Example 4 was produced by the same method as in Example 11 except that the dry mica tape having the structure of Comparative Example 1 was used. The impregnated varnish was injected by the method described above to produce an electrically insulated wire ring of Comparative Example 4. The electric insulated wire ring of Comparative Example 5 was produced by the same method as in Example 11 except that the dry mica tape having the structure of Comparative Example 3 was used. An impregnated varnish was injected by the method to produce an electrically insulated wire ring of Comparative Example 5.
実施例11〜13、比較例4〜5の電気絶縁線輪の180℃におけるtanδ(印加電圧1kV)を測定した。その結果を表4に示す。本実施例11〜13の電気絶縁線輪のtanδは13.2〜14.1%の範囲であった。一方、比較例4〜5の電気絶縁線輪は比較例1、3のドライマイカテープを用いたため、耐熱性が低くなってしまいtanδがそれぞれ24.2%、22.3%であった。 Tan δ (applied voltage: 1 kV) at 180 ° C. of the electrically insulated wire rings of Examples 11 to 13 and Comparative Examples 4 to 5 was measured. The results are shown in Table 4. The tan δ of the electrically insulated wire rings of Examples 11 to 13 was in the range of 13.2 to 14.1%. On the other hand, since the electrically insulated wire rings of Comparative Examples 4 to 5 used the dry mica tapes of Comparative Examples 1 and 3, the heat resistance was low and tan δ was 24.2% and 22.3%, respectively.
以上、本実施例11〜13は、絶縁材料の耐熱性が向上できるドライマイカテープを用いることにより、電気絶縁性に優れた電気絶縁線輪が得られた。 As described above, in Examples 11 to 13, by using the dry mica tape that can improve the heat resistance of the insulating material, an electrically insulated wire ring having excellent electrical insulation was obtained.
(実施例14〜16)
本発明に示すドライマイカテープを用いて固定子コイルを作製した例について説明する。図3(a)は本発明の固定子コイルの断面正面図、図3(b)が本発明の図3(a)の楕円で示した部分の鉄心スロット(電機絶縁線輪単体挿入後)断面拡大図である。
(Examples 14 to 16)
The example which produced the stator coil using the dry mica tape shown to this invention is demonstrated. 3 (a) is a sectional front view of the stator coil of the present invention, and FIG. 3 (b) is a sectional view of the iron core slot (after inserting the electric insulated wire ring alone) shown by the ellipse of FIG. 3 (a) of the present invention. It is an enlarged view.
実施例14の固定子コイルは、実施例1のドライマイカテープを用いて実施例7と同様の方法で電気絶縁線輪単体を作製し、この電気絶縁線輪単体を鉄心9の鉄心スロット10に挿入した後、図3(b)に示すサシギ下ライナー11及びサシギ12を電気絶縁線輪単体の固定のために各々挿入して固定子コイル単体を作製した。この固定子コイル単体を25℃に保持した含浸槽内に静置して、実施例11と同様の含浸ワニスを用いて実施例11と同様の注入条件と熱硬化条件にて、本実施例14の固定子コイルを作製した。次に、実施例15の固定子コイルは、実施例3のドライマイカテープを用いた以外は本実施例11と同様の方法で作製した。さらに、実施例16の固定子コイルは、実施例5のドライマイカテープを用いた以外は本実施例11と同様の方法で作製した。
For the stator coil of Example 14, an electric insulated wire ring was produced by the same method as in Example 7 using the dry mica tape of Example 1, and this electric insulated wire ring was placed in the
実施例14〜16の固定子コイルの180℃におけるtanδ(印加電圧1kV)を測定した。その結果を表5に示した。本実施例14〜16の固定子コイルはtanδが12.2〜14.0%であった。 Tan δ (applied voltage: 1 kV) at 180 ° C. of the stator coils of Examples 14 to 16 was measured. The results are shown in Table 5. The stator coils of Examples 14 to 16 had tan δ of 12.2 to 14.0%.
以上、本実施例14〜16は、絶縁材料の耐熱性が向上できるドライマイカテープを用いることにより、電気絶縁性に優れた固定子コイルが得られた。 As described above, in Examples 14 to 16, a stator coil excellent in electrical insulation was obtained by using a dry mica tape capable of improving the heat resistance of the insulating material.
(実施例17)
本発明に示すドライマイカテープを用いて作製した固定子コイルを、本発明の回転電機に適用した例について説明する。実施例17の回転電機は、実施例14と同様の方法で作製した固定子コイルを用いて、図4に示すように、前記固定子コイル13と回転子コイル14等を組立てて結線して回転電機15を作製した。
(Example 17)
The example which applied the stator coil produced using the dry mica tape shown to this invention to the rotary electric machine of this invention is demonstrated. As shown in FIG. 4, the rotating electrical machine of the seventeenth embodiment is assembled by connecting the
以上、本実施例17の回転電機は、高温(180℃)における電気絶縁性が向上できる固定子コイルを用いているため、固定子コイルのサイズを変えることなく出力を高くできるので、本発明の回転電機を小型化できる効果が得られた。 As described above, since the rotating electrical machine of the seventeenth embodiment uses the stator coil that can improve the electrical insulation at a high temperature (180 ° C.), the output can be increased without changing the size of the stator coil. The effect of reducing the size of the rotating electrical machine was obtained.
1…補強基材、2…バインダ樹脂層A、3…マイカペーパー、4…バインダ樹脂層B
5…電気絶縁線輪、6…導体、7…ドライマイカテープに含浸ワニスを注入し硬化した絶縁材料、8…コロナシールド、9…鉄心、10…鉄心スロット、11…サシギ下ライナー、12…サシギ、13…固定子コイル、14…回転子、15…回転電機
DESCRIPTION OF
DESCRIPTION OF SYMBOLS 5 ... Electrically insulated wire ring, 6 ... Conductor, 7 ... Insulating material which injected hardened impregnating varnish to dry mica tape, 8 ... Corona shield, 9 ... Iron core, 10 ... Iron core slot, 11 ... Sashigi lower liner, 12 ... Sashigi , 13 ... Stator coil, 14 ... Rotor, 15 ... Rotating electric machine
Claims (17)
4. The dry mica tape according to claim 3, wherein the curing accelerator contained in the binder resin layer A and / or the binder resin layer B is metal acetylacetonate.
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Also Published As
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US20120038239A1 (en) | 2012-02-16 |
US8669473B2 (en) | 2014-03-11 |
JP5166495B2 (en) | 2013-03-21 |
EP2418079A1 (en) | 2012-02-15 |
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