JP2012036383A - Composition for photonic device fixing material, method for using the same, and photonic device sealed body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composition for a photonic device fixing material giving a cured product having excellent heat resistance and transparency and having high adhesion, a method for using the same, and a photonic device sealed body.SOLUTION: The composition for a photonic device fixing material includes: (A) a silane compound copolymer obtained by condensing a silane compound mixture including a silane compound (1) represented by formula: CH(R)(X)-D-Si(OR)(X), a silane compound (2) represented by formula: RSi(OR)(X), and a silane compound (3) represented by formula: Si(OR)(X), the silane compounds (1) to (3) being included in a molar ratio [silane compound (1)+silane compound (2)]:[silane compound (3)] of (100:15) to (100:85); (B) an epoxy compound; (C) a curing agent; and (D) a curing catalyst. In the formulae, Rrepresents a hydrogen atom or a 1C-6C alkyl group; Xrepresents a halogen atom, a cyano group or a group represented by the formula: OG (G is a protective group for a hydroxy group); D represents a single bond or a linking group; R, Rand Rindividually represent a 1C-6C alkyl group; Xto Xindividually represent a halogen atom; p and q individually represent an integer of 0-3; Rrepresents a 1C-20C alkyl group or a phenyl group which may have a substituent; and r represents an integer of 0-4. There are also provided the method for using the composition and the photonic device sealed body.

Description

  The present invention relates to a composition for an optical element fixing material that is excellent in transparency and heat resistance and obtains a cured product having high adhesive strength, and a method of using the composition as an adhesive for optical elements or an encapsulant for optical elements. And an optical element sealing body.

  Examples of the optical element include various lasers such as a semiconductor laser (LD), light emitting elements such as a light emitting diode (LED), a light receiving element, a composite optical element, and an optical integrated circuit. In recent years, optical elements of blue light and white light whose emission peak wavelength is shorter have been developed and widely used. Such a light emitting element with a short peak wavelength of light emission has been dramatically increased in brightness, and accordingly, the amount of heat generated by the optical element tends to be further increased.

The optical element is usually used as an optical element sealing body sealed with a cured product of the composition for optical element fixing material.
However, as described above, with the recent increase in brightness of optical elements, the cured product of the composition for optical element fixing materials is exposed to higher energy light and higher temperature heat generated from the optical elements for a long time. As a result, there was a problem in that it deteriorated to generate cracks or peel off.

In order to solve this problem, Patent Documents 1 to 4 propose compositions for optical element fixing materials containing a polysilsesquioxane compound as a main component.
However, even if it is a cured product of the composition for optical element fixing materials mainly composed of the polysilsesquioxane compound described in Patent Documents 1 to 4, heat resistance and transparency are maintained while maintaining sufficient adhesive force. It was sometimes difficult to get.

In addition, as a composition used for sealing an optical element, Patent Document 5 proposes an epoxy resin composition using an alicyclic epoxy resin, and Patent Document 6 proposes an epoxy resin composition containing a polythiol compound. Has been.
However, even when these compositions are used, if the exposure time is prolonged, there is a problem that sufficient light resistance due to aging cannot be satisfied or the adhesive strength is lowered. there were.
Therefore, development of the composition for optical element fixing materials which is excellent in heat resistance and transparency, and can obtain the hardened | cured material which has high adhesive force is earnestly desired.

JP 2004-359933 A JP 2005-263869 A JP 2006-328231 A JP 2007-56146 A JP 7-309927 A JP 2009-001752 A

  The present invention has been made in view of the state of the prior art, and is a composition for an optical element fixing material that provides a cured product having excellent heat resistance and transparency and having high adhesive strength, a method for using the same, and light. It is an object to provide an element sealing body.

  As a result of intensive studies to solve the above problems, the present inventors have identified (A) a specific silane compound copolymer, (B) an epoxy compound, (C) a curing agent, and (D) a curing catalyst. The composition contained in a proportion has been found to be an optical element fixing material having a high adhesive force even at high temperatures while maintaining excellent transparency and heat resistance over a long period of time, and has completed the present invention.

  Thus, according to the first aspect of the present invention, the following composition for optical element fixing material [1] to [3] is provided.

[1] (A) Formula (1): CH (R ¹ ) (X ⁰ ) -D—Si (OR ² ) _p (X ¹ ) _3-p [wherein R ¹ is a hydrogen atom or a carbon number 1 to 1 6 represents an alkyl group, X ⁰ represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a hydroxyl-protecting group), and D represents a single bond or a linking group. To express. R ² represents an alkyl group having 1 to 6 carbon atoms, X ¹ represents a halogen atom, and p represents an integer of 0 to 3. At least one of silane compounds (1) represented by
Formula (2): R < ³ > Si (OR < ⁴ >) _q (X < ² >) _{< 3-q>} (In formula, R < ³ > represents the phenyl group which may have a C1-C20 alkyl group or a substituent. , R ⁴ represents an alkyl group having 1 to 6 carbon atoms, X ² represents a halogen atom, q represents an integer of 0 to 3, and at least one of silane compounds (2) represented by the formula ( _{^{3): Si (OR 5)}} r (X 3) in _4-r (wherein, ^{R 5} represents an alkyl group having 1 to 6 carbon atoms, ^{X 3} represents a halogen atom, r is an integer of 0 to 4 A mixture of silane compounds including at least one of the silane compounds (3) represented by:
The silane compound (1), the silane compound (2), and the silane compound (3) are in a molar ratio [silane compound (1) + silane compound (2)]: [silane compound (3)] = 100: 15. A silane compound copolymer obtained by condensing one containing 100: 85,
(B) an epoxy compound,
The composition for optical element fixing materials containing (C) hardening | curing agent and (D) hardening catalyst.

[2] The content ratio of the components (A) to (D) is a mass ratio of (A) to [(B) + (C) + (D)], and (A): [(B) + ( C) + (D)] = 100: 2 to 100: 55 The composition for optical element fixing materials according to [1], wherein
[3] The composition for optical element fixing material according to [1] or [2], further comprising an antioxidant.

According to a second aspect of the present invention, there is provided a method of using the composition for optical element fixing material of the present invention of the following [4] and [5].
[4] A method of using the composition for optical element fixing material according to any one of [1] to [3] as an optical element sealing agent.
[5] A method of using the composition for optical element fixing material according to any one of [1] to [3] as an adhesive for optical elements.

According to the third aspect of the present invention, there is provided the optical element sealing body of [6] below.
[6] A sealed optical element, wherein the optical element is sealed with a cured product of the composition for optical element fixing material according to any one of [1] to [3].

According to the composition for optical element fixing material of the present invention, even if the optical element to be used has a light emission peak with a short wavelength and a high luminance, it is colored by high energy light or high heat generated from the optical element. Thus, the optical element fixing material having excellent transparency over a long period of time and having high adhesive force even at high temperatures can be obtained without the transparency being lowered.
The composition for optical element fixing materials of the present invention can be suitably used particularly as an optical element adhesive and an optical element sealing agent.
Since the optical element sealing body of the present invention is sealed with the cured product of the composition for optical element fixing agent of the present invention, it has excellent heat resistance.

Hereinafter, the present invention will be described in detail by dividing into 1) a composition for an optical element fixing material, 2) a method for using the composition for an optical element fixing material, and 3) an optical element sealing body.
1) Composition for optical element fixing material The composition for optical element fixing material of the present invention comprises:
(A) at least one of silane compounds (1) represented by formula (1): CH (R ¹ ) (X ⁰ ) —D—Si (OR ² ) _p (X ¹ ) _3-p ,
Formula (2): R ³ Si (OR ⁴ ) _q (X ² ) At least one of silane compounds (2) represented by _3-q , and Formula (3): Si (OR ⁵ ) _r (X ³ ) A mixture of silane compounds containing at least one silane compound (3) represented by _4-r ,
The silane compound (1), the silane compound (2), and the silane compound (3) are in a molar ratio [silane compound (1) + silane compound (2)]: [silane compound (3)] = 100: 15. A silane compound copolymer obtained by condensing one containing 100: 85,
(B) an epoxy compound,
It contains (C) a curing agent and (D) a curing catalyst.

(A) Silane Compound Copolymer The composition for an optical element fixing material of the present invention may be referred to as a specific silane compound copolymer (hereinafter referred to as “silane compound copolymer (A)”) as the component (A). .).
Silane compound copolymer (A) used in the present invention, the formula ^{(1): CH (R 1} ) (X 0) -D-Si (OR 2) p (X 1) a silane compound represented by the _3-p At least one of (1), formula (2): R ³ Si (OR ⁴ ) _q (X ² ) at least one of silane compounds (2) represented by _3-q , and formula (3): Si (OR ⁵ ) It is obtained by condensing a mixture of silane compounds containing at least one silane compound (3) represented by _r (X ³ ) _4-r .

(I) Silane compound (1)
The silane compound (1) is a compound represented by the formula (1): CH (R ¹ ) (X ⁰ ) —D—Si (OR ² ) _p (X ¹ ) _{3 -p} . By using the silane compound (1), it is possible to obtain a silane compound copolymer having excellent transparency and adhesion even after curing.

In the formula, R ¹ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms (hereinafter sometimes abbreviated as C1 to 6), and is preferably a hydrogen atom.
Examples of the C1-6 alkyl group of R ¹ include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, t-butyl group, i-butyl group, s-butyl group, n- A pentyl group, n-hexyl group, etc. are mentioned.

X ⁰ represents a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom or an iodine atom; a cyano group; or a group represented by the formula: OG.

  G represents a hydroxyl-protecting group. There is no restriction | limiting in particular as a hydroxyl-protecting group, The well-known protecting group known as a hydroxyl-protecting group is mentioned. For example, acyl protecting groups; silyl protecting groups such as trimethylsilyl group, triethylsilyl group, t-butyldimethylsilyl group, t-butyldiphenylsilyl group; methoxymethyl group, methoxyethoxymethyl group, 1-ethoxyethyl group An acetal type protective group such as tetrahydropyran-2-yl group or tetrahydrofuran-2-yl group; an alkoxycarbonyl type protective group such as t-butoxycarbonyl group; a methyl group, an ethyl group, a t-butyl group or an octyl group , Ether-based protecting groups such as allyl group, triphenylmethyl group, benzyl group, p-methoxybenzyl group, fluorenyl group, trityl group and benzhydryl group; Among these, as G, an acyl-type protecting group is preferable.

The acyl-based protecting group is specifically a group represented by the formula: —C (═O) R ⁶ . In the formula, R ⁶ represents C ¹ such as methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, t-butyl group, n-pentyl group and the like. -6 alkyl group; Or the phenyl group which may have a substituent is represented.

Examples of the substituent of the phenyl group which may have a substituent of R ⁶ include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an s-butyl group, and an i-butyl group. Alkyl groups such as t-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group and i-octyl group; halogen atoms such as fluorine atom, chlorine atom and bromine atom; methoxy group And alkoxy groups such as ethoxy group.

Among these, as X ^{0, since} it is easy to obtain and a fixing material having high adhesive strength is obtained, a chlorine atom, a group represented by the formula: OG ′ (wherein G ′ is an acyl group) And a cyano group are preferred, a chlorine atom, an acetoxy group and a cyano group are more preferred, and an acetoxy group is particularly preferred.

D represents a single bond or a linking group.
The linking group may have an alkylene group which may have a substituent, an alkenylene group which may have a substituent, an alkynylene group which may have a substituent, or a substituent. Examples thereof include a combination of an arylene group and an arylene group which may have a substituent (an alkylene group, an alkenylene group or an alkynylene group) and an arylene group which may have a substituent.

Examples of the alkylene group of the alkylene group which may have a substituent include C1-10 alkylene groups such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. It is done.
Examples of the alkenylene group of the alkenylene group which may have a substituent include C2-10 alkylene groups such as vinylene group, propenylene group, butenylene group, and pentenylene group.
Examples of the alkynylene group of the alkynylene group which may have a substituent include an ethynylene group and a propynylene group.
Examples of the arylene group of the arylene group which may have a substituent include an o-phenylene group, an m-phenylene group, a p-phenylene group, and a 2,6-naphthylene group.

  Examples of the substituent for the alkylene group, alkenylene group, and alkynylene group include a halogen atom such as a fluorine atom and a chlorine atom; an alkoxy group such as a methoxy group and an ethoxy group; an alkylthio group such as a methylthio group and an ethylthio group; a methoxycarbonyl group; An alkoxycarbonyl group such as an ethoxycarbonyl group; and the like.

Examples of the substituent for the arylene group include: a cyano group; a nitro group; a halogen atom such as a fluorine atom, a chlorine atom and a bromine atom; an alkyl group such as a methyl group and an ethyl group; an alkoxy group such as a methoxy group and an ethoxy group; And alkylthio groups such as ethylthio group; and the like.
These substituents may be bonded to any position of the alkylene group or the arylene group, and a plurality of these substituents may be bonded to each other in the same or different manner.

  The combination of an optionally substituted (alkylene group, alkenylene group, or alkynylene group) and an optionally substituted arylene group may have the aforementioned substituent (alkylene group). A group in which at least one of a group, an alkenylene group, or an alkynylene group) and at least one of the arylene groups optionally having the substituent are bonded in series. Specific examples include groups represented by the following formula.

  Among these, as D, since a fixing material having high adhesive strength is obtained, a C1-6 alkylene group is preferable, and an ethylene group is particularly preferable.

R ² is methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i-butyl group, t-butyl group, n-pentyl group, n-hexyl group, etc. Represents a C1-6 alkyl group.

X ¹ represents a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom.
p represents an integer of 0 to 3.
When p is 2 or more, OR ² may be the same or different. When (3-p) is 2 or more, X ¹ may be the same or different.

Specific examples of the silane compound (1) include chloromethyltrimethoxysilane, bromomethyltriethoxysilane, 2-chloroethyltripropoxysilane, 2-bromoethyltributoxysilane, 3-chloropropyltrimethoxysilane, and 3-chloro. Propyltriethoxysilane, 3-chloropropyltripropoxysilane, 3-chloropropyltributoxysilane, 3-bromopropyltrimethoxysilane, 3-bromopropyltriethoxysilane, 3-bromopropyltripropoxysilane, 3-bromopropyltri Butoxysilane, 3-fluoropropyltrimethoxysilane, 3-fluoropropyltriethoxysilane, 3-fluoropropyltripropoxysilane, 3-fluoropropyltributoxysilane, 3-iodopropylto Methoxysilane, 2-chloroethyltrimethoxysilane, 3-chloropropyltriethoxysilane, 4-chlorobutyltripropoxysilane, 5-chloropentyltripropoxysilane, 2-chloropropyltrimethoxysilane, o- (2-chloroethyl) X ⁰ is a halogen atom, such as phenyltripropoxysilane, m- (2-chloroethyl) phenyltrimethoxysilane, p- (2-chloroethyl) phenyltriethoxysilane, p- (2-fluoroethyl) phenyltrimethoxysilane Certain trialkoxysilane compounds;

Chloromethyltrichlorosilane, bromomethylbromodimethoxysilane, 2-chloroethyldichloromethoxysilane, 2-bromoethyldichloroethoxysilane, 3-chloropropyltrichlorosilane, 3-chloropropyltribromosilane, 3-chloropropyldichloromethoxysilane, 3-chloropropyldichloroethoxysilane, 3-chloropropylchlorodimethoxysilane, 3-chloropropylchlorodiethoxysilane, 3-bromopropyldichloroethoxysilane, 3-bromopropyltribromosilane, 3-bromopropyltrichlorosilane, 3- Bromopropylchlorodimethoxysilane, 3-fluoropropyltrichlorosilane, 3-fluoropropylchlorodimethoxysilane, 3-fluoropropyldichloromethoxysilane 3-fluoropropyl chloro diethoxy silane, 3-iodopropyl trichlorosilane, 4-chlorobutyl chloro diethoxy silane, such as 3-chloro -n- butyl chloromethyl diethoxy silane, halosilane compound X ⁰ is a halogen atom Kind;

Cyanomethyltrimethoxysilane, cyanomethyltriethoxysilane, 1-cyanoethyltrimethoxysilane, 2-cyanoethyltrimethoxysilane, 2-cyanoethyltriethoxysilane, 2-cyanoethyltripropoxysilane, 3-cyanopropyltrimethoxysilane, 3- Cyanopropyltriethoxysilane, 3-cyanopropyltripropoxysilane, 3-cyanopropyltributoxysilane, 4-cyanobutyltrimethoxysilane, 5-cyanopentyltrimethoxysilane, 2-cyanopropyltrimethoxysilane, 2- (cyano Methoxy) ethyltrimethoxysilane, 2- (2-cyanoethoxy) ethyltrimethoxysilane, o- (cyanomethyl) phenyltripropoxysilane, m- (cyanomethyl) phenyltrimethoxy Run, p-(cyanomethyl) phenyl triethoxysilane, p-(2-cyanoethyl) trialkoxysilane compounds are such phenyltrimethoxysilane, X ⁰ is a cyano group;

Cyanomethyltrichlorosilane, cyanomethylbromodimethoxysilane, 2-cyanoethyldichloromethoxysilane, 2-cyanoethyldichloroethoxysilane, 3-cyanopropyltrichlorosilane, 3-cyanopropyltribromosilane, 3-cyanopropyldichloromethoxysilane, 3- Cyanopropyldichloroethoxysilane, 3-cyanopropylchlorodimethoxysilane, 3-cyanopropylchlorodiethoxysilane, 4-cyanobutylchlorodiethoxysilane, 3-cyano-n-butylchlorodiethoxysilane, 2- (2-cyano Ethoxy) ethyltrichlorosilane, 2- (2-cyanoethoxy) ethylbromodiethoxysilane, 2- (2-cyanoethoxy) ethyldichloropropoxysilane, o- (2-cyanoethyl) pheny Trichlorosilane, m-(2-cyanoethyl) phenylmethoxy dibromo silane, p-(2-cyanoethyl) phenyl dimethoxy chlorosilane, p-(2-cyanoethyl) and phenyl tribromosilane silane, halosilane compound ^{X 0} is a cyano group Kind;

3-acetoxypropyltrimethoxysilane, 3-acetoxypropyltriethoxysilane, 3-acetoxypropyltripropoxysilane, 3-acetoxypropyltributoxysilane, 3-propionyloxypropyltrimethoxysilane, 3-propionyloxypropyltriethoxysilane, 3-benzoyloxypropyltrimethoxysilane, 3-benzoyloxypropyltriethoxysilane, 3-benzoyloxypropyltripropoxysilane, 3-benzoyloxypropyltributoxysilane, 2-trimethylsilyloxyethyltrimethoxysilane, 3-triethylsilyloxy Propyltriethoxysilane, 3- (2-tetrahydropyranyloxy) propyltripropoxysilane, 3- (2-tetrahydrofurani Oxy) propyltributoxysilane, 3-methoxymethyloxypropyltrimethoxysilane, 3-methoxyethoxymethyloxypropyltriethoxysilane, 3- (1-ethoxyethyloxy) propyltripropoxysilane, 3- (t-butoxycarbonyloxy) ) X ⁰ is a group represented by the above formula: OG, such as propyltrimethoxysilane, 3-t-butoxypropyltrimethoxysilane, 3-benzyloxypropyltriethoxysilane, 3-triphenylmethoxypropyltriethoxysilane, etc. Certain trialkoxysilane compounds;

3-acetoxypropyltrichlorosilane, 3-acetoxypropyltribromosilane, 3-acetoxypropyldichloromethoxysilane, 3-acetoxypropyldichloroethoxysilane, 3-acetoxypropylchlorodimethoxysilane, 3-acetoxypropylchlorodiethoxysilane, 3- Benzoyloxypropyltrichlorosilane, 3-trimethylsilyloxypropylchlorodimethoxysilane, 3-triethylsilyloxypropyldichloromethoxysilane, 3- (2-tetrahydropyranyloxy) propylchlorodiethoxysilane, 3- (2-tetrahydrofuranyloxy) Propyldichloroethoxysilane, 3-methoxymethyloxypropyltribromosilane, 3-methoxyethoxymethyloxypropyltrichloro Lan, 3- (1-ethoxyethyloxy) propylchlorodimethoxysilane, 3-t-butoxycarbonyloxypropyldichloromethoxysilane, 3-t-butoxypropylchlorodiethoxysilane, 3-triphenylmethoxypropyldichloroethoxysilane, 3 -Halogenosilane compounds such as benzyloxypropyltribromosilane, where X ⁰ is a group represented by the formula: OG;
These silane compounds (1) can be used singly or in combination of two or more.

Among these, as the silane compound (1), since an adhesive having better adhesiveness is obtained, trialkoxysilane compounds in which X ⁰ is a halogen atom, trialkoxysilane in which X ⁰ is a cyano group Compounds, or trialkoxysilane compounds in which X ⁰ is a group represented by the formula: OG are preferred, trialkoxysilane compounds having a 3-chloropropyl group, trialkoxysilane compounds having a 2-cyanoalkyl group The trialkoxysilane compounds having a 3-acetoxypropyl group are more preferable, and the trialkoxysilane compounds having a 3-acetoxypropyl group are more preferable.

(Ii) Silane compound (2)
The silane compound (2) is a compound represented by the formula (2): R ³ Si (OR ⁴ ) _q (X ² ) _3-q .
In the formula, R ³ represents a C1-20 alkyl group or a phenyl group which may have a substituent. Examples of the C1-20 alkyl group of R ³ include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i-butyl group, t-butyl group, and n-pentyl. Group, n-hexyl group, n-octyl group, i-octyl group, n-nonyl group, n-decyl group, n-dodecyl group and the like.

Examples of the substituent of the phenyl group which may have a substituent of R ³ include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an s-butyl group, and an i-butyl group. , T-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, i-octyl group and other alkyl groups; methoxy group, ethoxy group and other alkoxy groups; fluorine atom, chlorine atom And halogen atoms such as

Specific examples of the phenyl group which may have a substituent for R ³ include a phenyl group, a 2-chlorophenyl group, a 4-methylphenyl group, a 3-ethylphenyl group, and a 2-methoxyphenyl group.

R ⁴ represents the same C1-6 alkyl group as R ² described above.
X ² represents the same halogen atom as X ¹ .
q represents an integer of 0 to 3.
When q is 2 or more, OR ⁴ may be the same or different. When (3-q) is 2 or more, X ² may be the same or different.

Specific examples of the silane compound (2) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-butyltriethoxysilane, i-butyltrimethoxy. Alkyltrialkoxysilane compounds such as silane, n-pentyltriethoxysilane, n-hexyltrimethoxysilane, i-octyltriethoxysilane, dodecyltrimethoxysilane, methyldimethoxyethoxysilane, methyldiethoxymethoxysilane;
Alkyl halogenoalkoxysilanes such as methylchlorodimethoxysilane, methyldichloromethoxysilane, methyldichloromethoxysilane, methylchlorodiethoxysilane, ethylchlorodimethoxysilane, ethyldichloromethoxysilane, n-propylchlorodimethoxysilane, n-propyldichloromethoxysilane Compounds;
Alkyltrihalogenosilane compounds such as methyltrichlorosilane, methyltribromosilane, ethyltrichlorosilane, ethyltribromosilane, n-propyltrichlorosilane;

Has substituents such as phenyltrimethoxysilane, 4-methoxyphenyltrimethoxysilane, 2-chlorophenyltrimethoxysilane, phenyltriethoxysilane, 2-methoxyphenyltriethoxysilane, phenyldimethoxyethoxysilane, phenyldiethoxymethoxysilane Optionally phenyltrialkoxysilane compounds;
Phenylhalogenoalkoxysilane compounds which may have a substituent such as phenylchlorodimethoxysilane, phenyldichloromethoxysilane, phenylchloromethoxyethoxysilane, phenylchlorodiethoxysilane, phenyldichloroethoxysilane;
A phenyltrihalogenosilane compound which may have a substituent such as phenyltrichlorosilane, phenyltribromosilane, 4-methoxyphenyltrichlorosilane, phenyltrichlorosilane, 2-ethoxyphenyltrichlorosilane, 2-chlorophenyltrichlorosilane; Can be mentioned.
These silane compounds (2) can be used alone or in combination of two or more.

  Among these, as the silane compound (2), a phenyltrialkoxysilane compound is preferable because an adhesive having better adhesiveness can be obtained.

(Iii) Silane compound (3)
The silane compound (3) is a compound represented by the formula (3): Si (OR ⁵ ) _r (X ³ ) _4-r . By using the silane compound (3), a cured product having high hardness can be obtained.

Wherein, ^{R 5} represents the same C1~6 alkyl group and the ^{R 2.}
X ³ represents the same halogen atom as X ¹ .
r represents an integer of 0 to 4.
When r is 2 or more, OR ⁵ may be the same or different. When (4-r) is 2 or more, X ³ may be the same or different.

Specific examples of the silane compound (3) include tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, tetra t-butoxysilane, tetras-butoxysilane, methoxytri A silane compound in which r is 4 in formula (3), such as ethoxysilane, dimethoxydiethoxysilane, triethoxymethoxysilane;
A silane compound in which r is 3 in formula (3), such as trimethoxychlorosilane, trimethoxybromosilane, trimethoxyfluorosilane, triethoxychlorosilane, triethoxybromosilane, triisopropylchlorosilane, tri-n-propylbromosilane;
Dimethoxydichlorosilane, diethoxydichlorosilane, di-n-propoxydichlorosilane, diisopropoxydichlorosilane, di-t-butoxydichlorosilane, dimethoxydibromosilane, diethoxydibromosilane, din-propoxydibromosilane, diisopropoxydibromosilane A silane compound wherein r is 2 in formula (3), such as di-t-butoxydibromosilane;

Methoxytrichlorosilane, ethoxytrichlorosilane, n-propoxytrichlorosilane, isopropoxytrichlorosilane, t-butoxytrichlorosilane, methoxytribromosilane, ethoxytribromosilane, n-propoxytribromosilane, isopropoxytribromosilane, t- A silane compound in which r is 1 in formula (3), such as butoxytribromosilane;
Silane compounds in which r is 0 in formula (3) such as tetrafluorosilane, tetrachlorosilane, tetrabromosilane, tetraiodosilane, trichlorobromosilane, dichlorodibromosilane, chlorotribromosilane, and the like.

  A silane compound (3) can be used individually by 1 type or in combination of 2 or more types.

  Among these, as the silane compound (3), an silane compound having r of 4 is preferable because an adhesive having better adhesiveness can be obtained.

(Iv) Silane compound copolymer The silane compound copolymer (A) is a silane compound containing at least one of the silane compounds (1), at least one of the silane compounds (2), and at least one of the silane compounds (3). Obtained by condensation.

  The mixture of silane compounds may be a mixture composed of only the silane compound (1), the silane compound (2) and the silane compound (3), as long as the object of the present invention is not impaired. In addition to the silane compound (2) and the silane compound (3), the mixture may further contain other silane compounds, but only from the silane compound (1), the silane compound (2) and the silane compound (3). Is preferred.

  The use ratio of the silane compound (1), the silane compound (2) and the silane compound (3) is a molar ratio of [silane compound (1) + silane compound (2)]: [silane compound (3)]: 100: 15 to 100: 85, more preferably 100: 17 to 100: 70, and particularly preferably 100: 19 to 100: 55.

  Moreover, the use ratio of the silane compound (1) and the silane compound (2) is [silane compound (1)]: [silane compound (2) from the viewpoint of obtaining the composition for optical element fixing agents intended by the present invention. ] Is preferably 20:80 to 80:20.

  The method for condensing the mixture of the silane compounds is not particularly limited, but a predetermined amount is added to a solvent solution of the silane compound (1), the silane compound (2), the silane compound (3), and other silane compounds as required. And a method of stirring at a predetermined temperature.

The catalyst used may be either an acid catalyst or a base catalyst.
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid; organic acids such as methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, acetic acid and trifluoroacetic acid; Can be mentioned.

  Base catalysts include trimethylamine, triethylamine, lithium diisopropylamide, lithium bis (trimethylsilyl) amide, pyridine, 1,8-diazabicyclo [5.4.0] -7-undecene, aniline, picoline, 1,4-diazabicyclo [2 2.2] Organic bases such as octane and imidazole; Organic salt hydroxides such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; Metals such as sodium methoxide, sodium ethoxide, sodium t-butoxide and potassium t-butoxide Alcoholates; Metal hydrides such as sodium hydride and calcium hydride; Metal hydroxides such as sodium hydroxide, potassium hydroxide and calcium hydroxide; Metal carbonates such as sodium carbonate, potassium carbonate and magnesium carbonate; Hydrogen carbonate And the like are; thorium, metal hydrogen carbonates such as potassium hydrogen carbonate.

  The usage-amount of a catalyst is 0.1 mol%-10 mol% normally with respect to the total molar amount of the silane compound contained in the mixture of the said silane compound, Preferably it is the range of 1 mol%-5 mol%.

  The solvent to be used can be appropriately selected according to the type of the silane compound. For example, water; aromatic hydrocarbons such as benzene, toluene and xylene; esters such as methyl acetate, ethyl acetate, propyl acetate and methyl propionate; ketones such as acetone, methyl ethyl ketone, methyl i-butyl ketone and cyclohexanone; methyl And alcohols such as alcohol, ethyl alcohol, n-propyl alcohol, i-propyl alcohol, n-butyl alcohol, i-butyl alcohol, s-butyl alcohol and t-butyl alcohol. These solvents can be used alone or in combination of two or more.

  Among these, water, aromatic hydrocarbons, and a mixed solvent thereof are preferable, and a mixed solvent of water and toluene is particularly preferable. When water and toluene are used, the ratio of water to toluene (volume ratio) is preferably 1: 9 to 9: 1, more preferably 7: 3 to 3: 7.

  The amount of the solvent used is such that the total molar amount of the silane compound is usually 0.1 mol to 10 mol, preferably 0.5 mol to 10 mol per liter of the solvent.

  The temperature at which the silane compound is condensed (reacted) is usually in the temperature range from 0 ° C. to the boiling point of the solvent used, preferably in the range of 20 ° C. to 100 ° C. If the reaction temperature is too low, the progress of the condensation reaction may be insufficient. On the other hand, if the reaction temperature is too high, it is difficult to suppress gelation. The reaction is usually completed in 30 minutes to 20 hours.

  After completion of the reaction, when an acid catalyst is used, an alkaline aqueous solution such as sodium hydrogen carbonate is added to the reaction solution. When a base catalyst is used, the reaction solution is added with an acid such as hydrochloric acid. Summing is performed, and the salt generated at that time is removed by filtration or washing with water, etc., and the desired silane compound copolymer can be obtained.

The weight average molecular weight (Mw) of the silane compound copolymer (A) used in the present invention is usually in the range of 1,000 to 30,000, preferably 1,500 to 6,000. A weight average molecular weight (Mw) can be calculated | required as a standard polystyrene conversion value by the gel permeation chromatography (GPC) which uses tetrahydrofuran (THF) as a solvent, for example.
Moreover, molecular weight distribution (Mw / Mn) of a silane compound copolymer (A) is 1.0-3.0 normally, Preferably it is the range of 1.1-2.0.
A silane compound copolymer (A) can be used individually by 1 type or in combination of 2 or more types.

(B) Epoxy compound The composition for optical element fixing materials of this invention contains an epoxy compound as (B) component.
Since the composition for optical element fixing materials of this invention contains (B) component, the optical element fixing material which is excellent in heat resistance can be obtained.

  As an epoxy compound, what is necessary is just a compound which has an epoxy group in a molecule | numerator, However, In this invention, the compound which has 2 or more of epoxy groups is preferable.

  Examples of epoxy compounds having two or more epoxy groups include glycidyl ethers of phenols such as bisphenol A, bisphenol F, bisphenol S, resorcinol, phenol novolac, cresol novolac, and biphenyl; alcohols such as butanediol, polyethylene glycol, and polypropylene glycol Glycidyl ether of carboxylic acid such as phthalic acid, isophthalic acid, tetrahydrophthalic acid; epoxy is introduced by oxidizing the double bond of a compound containing an alicyclic structure having a carbon-carbon double bond So-called alicyclic epoxy compounds;

Glycidylamine type epoxy resin, glycidyl ester type epoxy resin, hydantoin type epoxy resin, acrylic acid modified epoxy resin, phosphorus-containing epoxy resin, stilbene type epoxy resin, hydroquinone type epoxy resin, naphthalene skeleton type epoxy resin, tetraphenylolethane type epoxy Resin, DPP (di-n-pentylphthalate) type epoxy resin, trishydroxyphenylmethane type epoxy resin, dicyclopentadienephenol type epoxy resin, silicon-containing epoxy resin, diglycidyl ether of bisphenol A ethylene oxide adduct, bisphenol A propylene Diglycidyl ether of oxide adduct, cyclohexanedimethanol diglycidyl ether, polyglycidyl ether of aliphatic polyhydric alcohol, polybasic Epoxy resins such as polyglycidyl esters; and epoxy resins such as these halides (brominated epoxy resin) and nuclear hydrogenation products; and the like.
These can be used individually by 1 type or in combination of 2 or more types.

Among these, it is preferable to use an alicyclic epoxy compound from the viewpoint of obtaining a fixing material having high adhesive force even at a high temperature.
Examples of the alicyclic epoxy compound include compounds having an alicyclic structure in the molecule and having two or more epoxy rings. Examples of the alicyclic structure include a cycloalkane structure, a cycloalkene structure, and a cycloalkyne structure.

  Specific examples of the alicyclic epoxy compound include 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl, vinylcyclohexene diepoxide represented by the following formula (a). Among these, 3,4-epoxycyclohexanecarboxylate 3,4-epoxycyclohexylmethyl is particularly preferable.

(C) Curing Agent The composition for optical element fixing material of the present invention contains a curing agent (hereinafter sometimes referred to as “curing agent (C)”) as the component (C). Since the composition for optical element fixing materials of this invention contains (C) component, the optical element fixing material excellent in heat resistance can be obtained.

The curing agent (C) is not particularly limited as long as it is a compound having a functional group capable of reacting with the epoxy compound (B) in the molecule. For example, aliphatic amine curing agent, alicyclic amine curing agent, secondary or tertiary amine curing agent, aromatic amine curing agent, dicyandiamide, boron trifluoride amine complex salt, imidazole compound, alicyclic And formula acid anhydrides.
A hardening | curing agent can be used individually by 1 type or in combination of 2 or more types.

Among these, alicyclic acid anhydrides are preferable because an optical element fixing material having excellent heat resistance can be obtained.
An alicyclic acid anhydride is an acid anhydride having a cyclic structure in the molecule. Examples of the alicyclic structure include a cycloalkane structure, a cycloalkene structure, and a cycloalkyne structure.
Examples of alicyclic acid anhydrides include 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, 4-methyl-1,2,3,6-tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, 3- Methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl nadic anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic acid Anhydride, norbornane-2,3-dicarboxylic acid anhydride, methyl-5-norbornene-2,3-dicarboxylic acid anhydride, methyl-norbornane-2,3-dicarboxylic acid anhydride, cyclohexane-1,2,4- And tricarboxylic acid-1,2-anhydride.
Among these, 4-methylcyclohexane-1,2-dicarboxylic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride are preferable, 4-methylcyclohexane-1,2-dicarboxylic anhydride The product is particularly preferred.

(D) Curing catalyst The composition for optical element fixing materials of this invention contains a curing catalyst (henceforth a "curing catalyst (D)") as (D) component. Since the composition for optical element fixing materials of this invention contains (D) component in addition to the said (B) and (C) component, the optical element fixing material which is more excellent in heat resistance can be obtained.

As the curing catalyst (D), organic phosphines such as triphenylphosphine; quaternary compounds such as tetraphenylphosphonium bromide, tetrabutylphosphonium bromide, methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, n-butyltriphenylphosphonium bromide Phosphonium salts; tertiary amines such as dimethylbenzylamine; quaternary ammonium salts; bicyclic amidines such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof; 2-methylimidazole, 2 -Imidazoles such as phenyl-4-methylimidazole; Alicyclic acid anhydrides having a carboxyl group; and the like.
These can be used individually by 1 type or in combination of 2 or more types.

  In the present invention, when an alicyclic acid anhydride is used as the curing agent (C), an alicyclic acid anhydride having a carboxyl group is preferably used as the curing catalyst (D). By using such a combination, it is possible to obtain an optical element fixing material having a higher adhesive force even at a high temperature.

The alicyclic acid anhydride having a carboxyl group is a compound in which a carboxyl group is substituted at an arbitrary position of the alicyclic structure of the alicyclic acid anhydride.
There are no particular restrictions on the number of carboxyl groups substituted on the alicyclic structure and the substitution position.

  Among them, hexahydrophthalic anhydride substituted with a carboxyl group, cyclohexane-1,2,4-tricarboxylic acid-1,2-acid anhydride, cyclohexane-1,2,3-tricarboxylic acid-1,2-acid anhydride And cyclohexane-1,2,4-tricarboxylic acid-1,2-acid anhydride is particularly preferable. This compound may have a stereoisomer, but may be any isomer or a mixture of isomers.

  In the composition for optical element fixing material of the present invention, the content ratio of the components (A) to (D) is a mass ratio of (A) and [(B) + (C) + (D)]. (A): [(B) + (C) + (D)] = 100: 2 to 100: 55 is preferable, 100: 6 to 100: 45 is more preferable, and 100: 9 to 100 : 35 is particularly preferable.

  By using the components (A) to (D) at such a ratio, a composition for an optical element fixing material is obtained that is excellent in transparency and heat resistance over a long period of time and can obtain a cured product having high adhesive force even at high temperatures. be able to.

  Moreover, the composition for optical element fixing materials of this invention WHEREIN: The said (B), (C), (D) component is a mass ratio of (B) and [(C) + (D)], (B) : [(C) + (D)] = 95: 5 to 40:60 It is preferable to contain, and the components (C) and (D) are contained in a mass ratio of (C) and (D). C): (D) = 95: 5 to 70:30.

The composition for optical element fixing material of the present invention may further contain other components in addition to the components (A) to (D) as long as the object of the present invention is not impaired.
Examples of other components include an antioxidant, an ultraviolet absorber, a light stabilizer, and a diluent.

Antioxidants are added to prevent oxidative degradation during heating.
Examples of the antioxidant include phosphorus antioxidants, phenolic antioxidants, sulfur antioxidants and the like.

  Phosphorus antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris (2,4-di-t-butylphenyl) ) Phosphite, cyclic neopentanetetraylbis (octadecyl) phosphite, cyclic neopentanetetraylbis (2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis (2,4 -Di-t-butyl-4-methylphenyl) phosphite, bis [2-t-butyl-6-methyl-4- {2- (octadecyloxycarbonyl) ethyl} phenyl] hydrogen phosphite, etc. 9,10-dihydro- -Oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-di-t-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- And oxaphosphaphenanthrene oxides such as 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

  Examples of phenolic antioxidants include 2,6-di-t-butyl-p-cresol, dibutylhydroxytoluene, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β- Monophenols such as (3,5-di-t-butyl-4-hydroxyphenyl) propionate; 2,2′-methylenebis (4-methyl-6-t-butylphenol), 2,2′-methylenebis (4- Ethyl-6-tert-butylphenol), 4,4′-thiobis (3-methyl-6-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 3,9-bis [1,1-dimethyl-2- {β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] 2,4,8, Bisphenols such as 10-tetraoxaspiro [5,5] undecane; 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2 , 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) Propionate] methane, bis [3,3′-bis- (4′-hydroxy-3′-t-butylphenyl) butyric acid] glycol ester, 1,3,5-tris (3 ′, 5′-di-) t-butyl-4′-hydroxybenzyl) -S-triazine-2,4,6- (1H, 3H, 5H) trione, polymer phenols such as tocophenol;

  Examples of the sulfur-based antioxidant include dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate, and the like.

  These antioxidants can be used alone or in combination of two or more. However, since the composition for an optical element fixing material of the present invention contains the component (B), oxidative deterioration during heating hardly occurs even without an antioxidant. The usage-amount of antioxidant is 0-10 weight part normally with respect to 100 weight part of silane compound copolymers (A).

The ultraviolet absorber is added for the purpose of improving the light resistance of the obtained fixing material.
Examples of the ultraviolet absorber include salicylic acids such as phenyl salicylate, pt-butylphenyl salicylate, p-octylphenyl salicylate; 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4 -Octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2-hydroxy-4-methoxy- Benzophenones such as 5-sulfobenzophenone; 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2 ′ -Hydroxy-3 ', 5'-di-t -Butylphenyl) benzotriazole, 2- (2'-hydroxy-3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di -T-butylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-t-amylphenyl) benzotriazole, 2-{(2'-hydroxy-3', 3 Benzotriazoles such as '', 4 '', 5 '', 6 ''-tetrahydrophthalimidomethyl) -5'-methylphenyl} benzotriazole; bis (2,2,6,6-tetramethyl-4-piperidyl ) Sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) [{3,5-bis (1 , 1-Dimethyl Chill) -4-hydroxyphenyl} methyl] butyl hindered amines, such as malonate; and the like.

These ultraviolet absorbers can be used alone or in combination of two or more.
The usage-amount of a ultraviolet absorber is 0-10 weight part normally with respect to 100 weight part of silane compound copolymers (A).

The light stabilizer is added for the purpose of improving the light resistance of the obtained fixing material.
Examples of the light stabilizer include poly [{6- (1,1,3,3, -tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6 , 6-tetramethyl-4-piperidine) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidine) imino}] and the like.

These light stabilizers can be used alone or in combination of two or more.
The usage-amount of a light stabilizer is 0-10 weight part normally with respect to 100 weight part of silane compound copolymers (A).

The diluent is added to adjust the viscosity of the obtained composition for a fixing material.
Examples of the diluent include glycerin diglycidyl ether, butanediol diglycidyl ether, diglycidyl aniline, neopentyl glycol glycidyl ether, cyclohexane dimethanol diglycidyl ether, alkylene diglycidyl ether, polyglycol diglycidyl ether, and polypropylene glycol diglycidyl ether. Examples include ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, 4-vinylcyclohexene monoxide, vinylcyclohexene dioxide, methylated vinylcyclohexene dioxide, and the like.
These diluents can be used alone or in combination of two or more.

  The composition for an optical element fixing material of the present invention is obtained by blending the components (A) to (D) and other components at a predetermined ratio if necessary, and mixing and defoaming by a known method. Can do.

According to the composition for an optical element fixing material of the present invention obtained as described above, even if the optical element to be used has a light emission peak with a short wavelength and a high luminance, a high intensity generated from the optical element. It is possible to obtain a cured product having excellent transparency over a long period of time and having high adhesive force even at high temperatures without being colored by energy light or high heat and being deteriorated in transparency.
Therefore, the composition for optical element fixing materials of the present invention can be suitably used as an adhesive for optical elements and an encapsulant for optical elements, as will be described later.

  The hardened | cured material of the composition for optical element fixing materials of this invention has high adhesive force. It can be confirmed from the fact that the cured product of the composition for optical element fixing material of the present invention has a high adhesive force, for example, by measuring the adhesive force as follows. The composition for optical element fixing material is applied to the mirror surface of the silicon chip, and the coated surface is placed on an adherend (silver-plated copper plate) and pressure-bonded, and then heated and cured. This is left for 30 seconds on a measurement stage of a bond tester that has been adjusted to a predetermined temperature (for example, 25 ° C., 100 ° C.) in advance, and is horizontal to the adhesion surface (shearing) from a position 20 μm high from the adherend. Direction) and measure the adhesive force between the test piece and the adherend.

The adhesive strength at 25 ° C. of the cured product of the composition for optical element fixing material of the present invention is usually 90 N / 2 mm □ or more, preferably 95 N / 2 mm □ or more.
Moreover, the hardened | cured material of the composition for optical element fixing materials of this invention has a high adhesive force even when it is a case where it is set | placed at the high temperature of 100 degreeC. The adhesive strength at 100 ° C. of the cured product of the composition for optical element fixing material of the present invention is usually 50 N / 2 mm □ or more, preferably 55 N / 2 mm □ or more.
The adhesive strength at 100 ° C. of the cured product of the composition for optical element fixing material of the present invention is preferably 50% or more of the adhesive strength at 25 ° C.

The cured product of the composition for optical element fixing material of the present invention is excellent in transparency. The light transmittance at a wavelength of 450 nm of the cured product of the composition for optical element fixing material of the present invention is usually 85% or more, preferably 89% or more.
In addition, it is confirmed that the cured product of the composition for optical element fixing material of the present invention has excellent heat resistance for a long period of time, for example, even when it is placed at a high temperature for a long time, the transparency does not greatly decrease. can do.
The cured product of the composition for optical element fixing material of the present invention has a light transmittance at a wavelength of 450 nm after 300 hours of heating at 150 ° C. compared to the light transmittance before heating (initial transmittance). And it is preferable that it is 85% or more.

2) Method of using composition for optical element fixing material The second aspect of the present invention is a method of using the composition for optical element fixing material of the present invention as an adhesive for optical elements or an encapsulant for optical elements.
Examples of optical elements include light emitting elements such as LEDs and LDs, light receiving elements, composite optical elements, and optical integrated circuits.

<Adhesive for optical elements>
The composition for optical element fixing materials of the present invention can be suitably used as an adhesive for optical elements.
Main substrate materials for bonding optical elements include glass such as soda lime glass and heat-resistant hard glass; ceramics; iron, copper, aluminum, gold, silver, platinum, chromium, titanium, and alloys of these metals , Metals such as stainless steel (SUS302, SUS304, SUS304L, SUS309, etc.); polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, ethylene-vinyl acetate copolymer, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyetheretherketone , Synthetic resins such as polyethersulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, acrylic resin, norbornene resin, cycloolefin resin, glass epoxy resin, etc.

  As a method of using the composition for optical element fixing material of the present invention as an adhesive for optical elements, the composition is applied to one or both adhesive surfaces of a material to be bonded (such as an optical element and its substrate). Then, after press-bonding, there is a method of heat-curing and firmly bonding the materials to be bonded.

  Although the heating temperature at the time of heat-curing depends on the composition for optical element fixing material to be used, it is usually 100 to 200 ° C. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.

<Sealant for optical elements>
The composition for optical element fixing materials of this invention can be used suitably as a sealing agent of an optical element sealing body.
As a method of using the composition for optical element fixing material of the present invention as an encapsulant for optical elements, for example, after molding the composition into a desired shape to obtain a molded body containing an optical element, Examples thereof include a method for producing an optical element sealing body by heat-curing itself.
A method for molding the composition for optical element fixing material of the present invention into a desired shape is not particularly limited, and a known molding method such as a normal transfer molding method or a casting method can be employed.

  The heating temperature at the time of heat curing is usually 100 to 200 ° C., although it depends on the composition for optical element fixing material used. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.

  Since the obtained optical element sealing body uses the composition for optical element fixing material of the present invention, the optical element has a short peak wavelength of 400 to 490 nm such as white or blue light emitting LED. Even if is used, it is excellent in transparency and heat resistance that does not deteriorate due to heat or light.

3) Optical element sealing body The optical element sealing body of the present invention is obtained by sealing an optical element with a cured product of the composition for optical element fixing material of the present invention.
The optical element sealing body of the present invention can be produced, for example, by a method of using the composition for optical element fixing material of the present invention as an optical element sealing material.

  Since the optical element sealing body of the present invention seals the optical element by using the cured product of the composition for optical element fixing material of the present invention, the optical element can emit light such as white or blue light emitting LED. Even when a peak wavelength of 350 to 490 nm is used, the color does not deteriorate due to heat or light, and the heat resistance is excellent.

  EXAMPLES Next, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited to the following Example.

(Weight average molecular weight measurement)
The weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the silane compound copolymer obtained in the production example were standard polystyrene equivalent values, and measured with the following apparatus and conditions.

Device name: HLC-8220GPC, manufactured by Tosoh Corporation Column: TSKgelGMHXL → TSKgelGMMHXL → TSKgel2000HXL
Solvent: Tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 1 ml / min Detector: Differential refractometer

(Measurement of IR spectrum)
The IR spectrum of the silane compound copolymer obtained in Production Example was measured using the following apparatus.
Fourier transform infrared spectrophotometer (Spectrum 100, manufactured by PerkinElmer)

(Production Example 1)
In a 500 ml eggplant-shaped flask, 14.22 g (64 mmol) of 3-acetoxypropyltrimethoxysilane (manufactured by Acmax) (hereinafter referred to as “AcTMS”) as the silane compound (1) and phenyl as the silane compound (2) Trimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as “PhTMS”) 19.04 g (96 mmol), tetraethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter “TEOS”) as the silane compound (3) After charging 13.33 g (64 mmol) and toluene 224 ml and distilled water 112 ml as a solvent, 0.40 g (4.08 mmol) phosphoric acid (manufactured by Kanto Chemical Co., Inc.) as a catalyst while stirring the whole volume. ) And stirring was continued for an additional 16 hours at room temperature.

  After completion of the reaction, the reaction mixture was neutralized by adding a saturated aqueous sodium hydrogen carbonate solution. After standing for a while, toluene and water were removed, and the residue was washed twice with distilled water. The obtained residue was dissolved in 200 ml of ethyl acetate and dried over anhydrous magnesium sulfate. After magnesium sulfate was filtered off, the filtrate was dropped into a large amount of n-hexane to precipitate, and the precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone and collected, and the solvent was distilled off under reduced pressure with an evaporator, followed by vacuum drying to obtain 21.6 g of a silane compound copolymer (A1).

  The weight average molecular weight (Mw) of the silane compound copolymer (A1) was 3100, and the molecular weight distribution (Mw / Mn) was 1.51.

IR spectrum data of the silane compound copolymer (A1) are shown below.
^{Si-Ph: 700cm -1, 742cm} -1, Si-O: 1132cm -1, -CO: 1738cm -1

(Production Example 2)
In Production Example 1, 19.8 g of the silane compound copolymer (A2) was obtained in the same manner as in Production Example 1, except that the amount of TEOS used as the silane compound (3) was 6.67 g (32 mmol). It was.
The weight average molecular weight (Mw) of the silane compound copolymer (A2) was 3000, and the molecular weight distribution (Mw / Mn) was 1.50.

IR spectrum data of the silane compound copolymer (A2) are shown below.
Si—Ph: 699 cm ⁻¹ , 741 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CO: 1738 cm ⁻¹

(Production Example 3)
In Production Example 1, 22.9 g of silane compound copolymer (A3) was obtained in the same manner as in Production Example 1 except that the amount of TEOS used as the silane compound (3) was 20.00 g (96 mmol). It was.
The weight average molecular weight (Mw) of the silane compound copolymer (A3) was 3200, and the molecular weight distribution (Mw / Mn) was 1.51.

IR spectrum data of the silane compound copolymer (A2) are shown below.
Si—Ph: 699 cm ⁻¹ , 742 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CO: 1737 cm ⁻¹

(Production Example 4)
In Production Example 1, 24.5 g of the silane compound copolymer (A4) was obtained in the same manner as in Production Example 1, except that the amount of TEOS used as the silane compound (3) was 26.66 g (128 mmol). It was.
The weight average molecular weight (Mw) of the silane compound copolymer (A4) was 3500, and the molecular weight distribution (Mw / Mn) was 1.79.

IR spectrum data of the silane compound copolymer (A4) are shown below.
^{Si-Ph: 700cm -1, 741cm} -1, Si-O: 1132cm -1, -CO: 1738cm -1

(Production Example 5)
In Production Example 1, AcTMS as silane compound (1) was not used, and the amount of PhTMS used as silane compound (2) was 31.73 g (160 mmol). 20.8g of compound copolymers (A5) were obtained.
The weight average molecular weight (Mw) of the silane compound copolymer (A5) was 2800, and the molecular weight distribution (Mw / Mn) was 1.38.

IR spectrum data of the silane compound copolymer (A5) are shown below.
Si—Ph: 697 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1133 cm ⁻¹

(Production Example 6)
In Production Example 1, the amount of AcTMS used as the silane compound (1) was 35.55 g (160 mmol), and PhTMS was not used as the silane compound (2). 24.1g of polymers (A6) were obtained.
The weight average molecular weight (Mw) of the silane compound copolymer (A6) was 2700, and the molecular weight distribution (Mw / Mn) was 1.43.

IR spectrum data of the silane compound copolymer (A6) are shown below.
Si—O: 1105 cm ⁻¹ , —CO: 1739 cm ⁻¹

(Production Example 7)
In Production Example 1, 18.8 g of silane compound copolymer (A7) was obtained in the same manner as in Production Example 1 except that TEOS as silane compound (3) was not used.
The weight average molecular weight (Mw) of the silane compound copolymer (A7) was 2600, and the molecular weight distribution (Mw / Mn) was 1.71.

IR spectrum data of the silane compound copolymer (A7) are shown below.
Si—Ph: 699 cm ⁻¹ , 741 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CO: 1738 cm ⁻¹

(Production Example 8)
In Production Example 1, the amount of PhTMS used as the silane compound (2) was 15.87 g (80 mmol), TEOS was not used as the silane compound (3), and AcTMS 14.22 g of the silane compound (1) ( In the same manner as in Production Example 1 except that 18.89 g (80 mmol) of γ-glycidoxypropyltrimethoxysilane (described as “GlyTMS” in the following Table 1) was used instead of 64 mmol), 19.0g of silane compound copolymers (A8) were obtained.
The weight average molecular weight (Mw) of the silane compound copolymer (A8) was 2800, and the molecular weight distribution (Mw / Mn) was 1.82.

IR spectrum data of the silane compound copolymer (A8) are shown below.
^{Si-Ph: 700cm -1, 742cm} -1, Si-O: 1132cm -1, epoxy group: 1254cm ^-1

(Production Example 9)
In a 500 ml eggplant-shaped flask, 3.75 g (21.4 mmol) of 2-cyanoethyltrimethoxysilane (manufactured by Azmax) (hereinafter referred to as “CNTMS”) as the silane compound (1), and as the silane compound (2) After charging 9.9 g (50 mmol) of PhTMS, 5.94 g (28.5 mmol) of TEOS as the silane compound (3), 120 ml of acetone as the solvent and 30 ml of distilled water, the whole volume was stirred and phosphorus was used as the catalyst. 0.15 g (1.5 mmol) of acid (manufactured by Kanto Chemical Co., Inc.) was added, and stirring was continued at room temperature for another 16 hours.

After completion of the reaction, the mixture was concentrated to 50 ml with an evaporator, 100 ml of ethyl acetate was added, and neutralized with a saturated aqueous sodium hydrogen carbonate solution. After standing still for a while, water was removed, and the organic layer was washed twice with distilled water and dried over anhydrous magnesium sulfate. After the magnesium sulfate was filtered off, the filtrate was concentrated to 50 ml with an evaporator, dropped into a large amount of n-hexane for reprecipitation, and the precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone and collected, and the solvent was distilled off under reduced pressure with an evaporator, followed by vacuum drying to obtain 17.3 g of a silane compound polymer (A9).
The weight average molecular weight (Mw) of the silane compound polymer (A9) was 1,900, and the molecular weight distribution (Mw / Mn) was 1.62.

IR spectrum data of the silane compound polymer (A9) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CN: 2259 cm ⁻¹

(Production Example 10)
In Production Example 9, the amount of CNTMS used was 4.4 g (25 mmol), the amount of PhTMS used was 11.6 g (58.3 mmol), and the amount of TEOS used was 3.5 g (16.7 mmol). Except for this, in the same manner as in Production Example 9, 15.2 g of the silane compound polymer (A10) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A10) was 1,800, and the molecular weight distribution (Mw / Mn) was 1.45.

IR spectrum data of the silane compound polymer (A10) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CN: 2259 cm ⁻¹

(Production Example 11)
In Production Example 9, the amount of CNTMS used was 1.9 g (10.7 mmol), the amount of PhTMS used was 12.0 g (60.7 mmol), and the amount of TEOS used was 6.0 g (28.6 mmol). Except for the above, in the same manner as in Production Example 9, 14.9 g of a silane compound polymer (A11) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A11) was 2,000, and the molecular weight distribution (Mw / Mn) was 1.39.

IR spectrum data of the silane compound polymer (A11) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CN: 2259 cm ⁻¹

(Production Example 12)
In Production Example 9, the amount of CNTMS used was 2.2 g (12.5 mmol), the amount of PhTMS used was 14.0 g (70.8 mmol), and the amount of TEOS used was 3.5 g (16.7 mmol). Except for the above, in the same manner as in Production Example 9, 14.9 g of a silane compound polymer (A12) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A12) was 1,800, and the molecular weight distribution (Mw / Mn) was 1.57.

IR spectrum data of the silane compound polymer (A12) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , —CN: 2259 cm ⁻¹

(Production Example 13)
In Production Example 9, 4.25 g (21.4 mmol) of chloropropyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as “ClTMS”) was used instead of CNTMS as the silane compound (1). In the same manner as in Production Example 9, except that the amount of PhTMS used was 9.9 g (50 mmol) and the amount of TEOS used was 5.94 g (28.5 mmol), the silane compound polymer (A13) 15. 0 g was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A13) was 1,900, and the molecular weight distribution (Mw / Mn) was 1.98.

IR spectrum data of the silane compound polymer (A13) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , C—Cl: 1445 cm ⁻¹

(Production Example 14)
In Production Example 13, the usage amount of ClTMS was 4.96 g (25 mmol), the usage amount of PhTMS was 11.6 g (58.3 mmol), and the usage amount of TEOS was 3.5 g (16.7 mmol). In the same manner as in Production Example 13, 14.6 g of a silane compound polymer (A14) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A14) was 2,200, and the molecular weight distribution (Mw / Mn) was 1.46.

IR spectrum data of the silane compound polymer (A14) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , C—Cl: 1445 cm ⁻¹

(Production Example 15)
In Production Example 13, the usage amount of ClTMS was 2.12 g (10.7 mmol), the usage amount of PhTMS was 12.0 g (60.7 mmol), and the usage amount of TEOS was 6.0 g (28.6 mmol). Except for this, in the same manner as in Production Example 13, 15.3 g of the silane compound polymer (A15) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A15) was 2,100, and the molecular weight distribution (Mw / Mn) was 1.35.

IR spectrum data of the silane compound polymer (A15) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , C—Cl: 1445 cm ⁻¹

(Production Example 16)
In Production Example 13, the usage amount of ClTMS was 2.48 g (12.5 mmol), the usage amount of PhTMS was 14.0 g (70.8 mmol), and the usage amount of TEOS was 3.5 g (16.7 mmol). Except for the above, in the same manner as in Production Example 13, 15.4 g of a silane compound polymer (A16) was obtained.
The weight average molecular weight (Mw) of the silane compound polymer (A16) was 1,900, and the molecular weight distribution (Mw / Mn) was 1.86.

IR spectrum data of the silane compound polymer (A16) are shown below.
Si—Ph: 698 cm ⁻¹ , 740 cm ⁻¹ , Si—O: 1132 cm ⁻¹ , C—Cl: 1445 cm ⁻¹

Example 1
10 g of the silane compound copolymer (A1) obtained in Production Example 1, 0.15 g of 3,4-epoxycyclohexanecarboxylic acid-3,4-epoxycyclohexylmethyl (manufactured by Sigma-Aldrich) as an epoxy compound (B), curing 0.135 g of 4-methylcyclohexane-1,2-dicarboxylic acid anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) as the agent (C) and cyclohexane-1,2,4-tricarboxylic acid-1 as the curing catalyst (D) , 2-acid anhydride (Mitsubishi Gas Chemical Co., Ltd.) 0.015 g was added, and the whole volume was thoroughly mixed and degassed (120 ° C., vacuum) to obtain a composition for optical element fixing material (1).

(Examples 2 to 23)
Table 1 below shows the types of silane compound copolymer (A) and the proportions of silane compound copolymer (A), epoxy compound (B), curing agent (C), and curing catalyst (D) used. In the same manner as in Example 1, compositions for optical element fixing materials (2) to (23) were obtained.
In Example 5, 0.003 g of a phosphorus-based antioxidant (IRGAFOS168 (manufactured by Ciba Japan)) was added as an antioxidant.

(Comparative Examples 1-9)
Table 1 below shows the types of silane compound copolymer (A) and the proportions of silane compound copolymer (A), epoxy compound (B), curing agent (C), and curing catalyst (D) used. In the same manner as in Example 1, compositions for optical element fixing materials (1r) to (9r) were obtained.

  About the hardened | cured material of the composition for optical element fixing materials obtained in Examples 1-23 and Comparative Examples 1-9, adhesive force, initial transmittance, and the transmittance | permeability after a heating are measured as follows, and adhesive heat resistance is measured. Initial transparency and heat resistance (transparency after heating) were evaluated.

(Adhesion test)
Each composition for optical element fixing material was applied to a mirror surface of a 2 mm square silicon chip so as to have a thickness of about 2 μm, and the coated surface was placed on an adherend (silver-plated copper plate) and pressure-bonded. Then, it heat-processed at 180 degreeC for 2 hours, it was made to harden | cure, and the adherend with a test piece was obtained. The adherend with the test piece is left on a measurement stage of a bond tester (series 4000, manufactured by Daisy) heated in advance to a predetermined temperature (25 ° C., 100 ° C.) for 30 seconds, and is 50 μm in height from the adherend. From the position, stress was applied in a horizontal direction (shear direction) to the bonding surface at a speed of 200 μm / s, and the adhesive force between the test piece and the adherend at 25 ° C. and 100 ° C. was measured (N / 2 mm □). . The measurement results are shown in Table 2 below.

  In the adhesive strength test, the case where the adhesive strength at 100 ° C. was 50% or more of the adhesive strength at 25 ° C. was evaluated as “◯”, and the case where it was less than 50% was evaluated as “X” (adhesive strength at high temperature). However, when the adhesive strength at 25 ° C. was 50 N / 2 mm □ or less, it was excluded from the evaluation target. The evaluation results are shown in Table 2 below.

(Measurement of initial transmittance)
Each of the optical element fixing material compositions was poured into a mold so as to have a length of 25 mm, a width of 20 mm, and a thickness of 1 mm, and cured by heating at 140 ° C. for 6 hours to prepare test pieces. About the obtained test piece, the initial transmittance (%) of wavelength 450nm was measured with the spectrophotometer (MPC-3100, Shimadzu Corporation make). The measurement results are shown in Table 2 below.

  In the initial transmittance measurement, the case where the transmittance at 450 nm was 85% or more was evaluated as “◯”, and the case where it was less than 85% was evaluated as “x” (initial transparency). The evaluation results are shown in Table 2 below.

(Measurement of transmittance after heating)
Each test piece whose initial transmittance was measured was placed in an oven at 150 ° C. for 300 hours, and the transmittance (%) at a wavelength of 450 nm was measured again. The measurement results are shown in Table 2 below. As a reference value, the measurement results of the transmittance after 100 hours in the oven are also shown in Table 2 below.

  When the transmittance after heating for 300 hours was 85% or more of the initial transmittance, it was evaluated as “◯”, and when it was less than 85%, it was evaluated as “x” [heat resistance (transparency after heating)]. The evaluation results are shown in Table 2 below.

  From Table 2, the hardened | cured material of the composition 1-23 for optical element fixing materials of Examples 1-23 has high adhesive force of 97.9 N / 2mm □ or more in 25 degreeC, and it is in high temperature (100 degreeC). Also, the adhesive strength of 50% or more of the adhesive strength at 25 ° C. was maintained and the adhesive heat resistance was excellent. Moreover, both the initial transmittance at a wavelength of 450 nm and the transmittance after heating were high, and the initial transparency and heat resistance (transparency) were excellent.

On the other hand, the compositions 1r to 4r, 8r, and 9r of the optical element fixing agents of Comparative Examples 1 to 4 and Comparative Examples 8 and 9 that did not use the components (B), (C), and (D) are all adhesive. It was inferior to. In particular, the composition for optical element fixing agent 1r of Comparative Example 1 did not adhere under the adhesion conditions according to the evaluation method described above.
The composition 5r for optical element fixing agent of Comparative Example 5 that did not use the silane compound (3) was inferior in all of adhesiveness, initial transparency, and heat resistance (transparency).
The 6r of Comparative Example 6 that does not use the silane compound (1) and the 7r of Comparative Example 7 that does not use the silane compound (2) also had poor adhesion.

Claims (6)

(A) formula ^{(1): CH (R 1} ) (X 0) -D-Si (OR 2) p (X 1) 3-p wherein, ^{R 1} represents a hydrogen atom or an alkyl having 1 to 6 carbon atoms X ⁰ represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a protecting group for a hydroxyl group), and D represents a single bond or a linking group. R ² represents an alkyl group having 1 to 6 carbon atoms, X ¹ represents a halogen atom, and p represents an integer of 0 to 3. At least one of silane compounds (1) represented by
Formula (2): R < ³ > Si (OR < ⁴ >) _q (X < ² >) _{< 3-q>} (In formula, R < ³ > represents the phenyl group which may have a C1-C20 alkyl group or a substituent. , R ⁴ represents an alkyl group having 1 to 6 carbon atoms, X ² represents a halogen atom, q represents an integer of 0 to 3, and at least one of silane compounds (2) represented by the formula ( _{^{3): Si (OR 5)}} r (X 3) in _4-r (wherein, ^{R 5} represents an alkyl group having 1 to 6 carbon atoms, ^{X 3} represents a halogen atom, r is an integer of 0 to 4 A mixture of silane compounds including at least one of the silane compounds (3) represented by:
The silane compound (1), the silane compound (2), and the silane compound (3) are in a molar ratio [silane compound (1) + silane compound (2)]: [silane compound (3)] = 100: 15. A silane compound copolymer obtained by condensing one containing 100: 85,
(B) an epoxy compound,
The composition for optical element fixing materials containing (C) hardening | curing agent and (D) hardening catalyst.   The content ratio of the components (A) to (D) is a mass ratio of (A) to [(B) + (C) + (D)], and (A): [(B) + (C) + (D)] = 100: 2 to 100: 55 The composition for optical element fixing material according to claim 1, wherein:   Furthermore, antioxidant is included, The composition for optical element fixing materials of Claim 1 or 2 characterized by the above-mentioned.   The method which uses the composition for optical element fixing materials in any one of Claims 1-3 as a sealing agent for optical elements.   The method to use the composition for optical element fixing materials in any one of Claims 1-3 as an adhesive for optical elements.   The optical element sealing body formed by sealing an optical element with the hardened | cured material of the composition for optical element fixing materials in any one of Claims 1-3.