JP2012033634A - Manufacturing method and manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform an anodic bonding without damaging a circuit element.SOLUTION: Provided are a manufacturing method and a manufacturing device, both for manufacturing a bonded article by bonding first and second objects to be bonded with each other. The method comprises: a contact step in which a bonding portion of the first object to be bonded is brought into contact with a bonding portion of the second object to be bonded; and a bonding step in which the bonding portions are bonded with each other by locally heating the bonding portions in the entire first and second objects. The bonding step includes passing light, which is allowed to travel in the first object, through the first object and applying the light to the bonding portions where the first and second objects are in contact with each other, thereby heating the bonding portions.

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus.

Conventionally, an airtight package of a circuit element has been manufactured by anodically bonding a first substrate on which a circuit element is formed and a second substrate on which a lid for blocking the circuit element from outside air is formed (for example, a patent Reference 1).
Patent Literature 1 JP 2009-27055 A

  However, in such anodic bonding, since the two substrates to be bonded are brought into contact with each other and heated as a whole, the formed circuit element may be damaged by the heating temperature.

  In order to solve the above-mentioned problem, in the first aspect of the present invention, there is provided a manufacturing method for manufacturing a joined product obtained by joining a first joining object and a second joining object, the first joining object and the first joining object. 2 a contact stage in which the objects to be joined are brought into contact with each other at a place to be joined, and a joining stage in which the part to be joined is partially heated in the first joining object and the whole second joining object to join the places to be joined. A manufacturing method is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

The structural example of the 1st joining target object 110 and the 2nd joining target object 120 which concern on this embodiment is shown. Sectional drawing which showed the cross section of AA 'of the 2nd joining target object 120 of FIG. 1 with the corresponding 1st joining target object 110 is shown. An example of the manufacturing method of the joined article 100 concerning this embodiment is shown. The modification of the manufacturing method of the joined article 100 concerning this embodiment is shown. The structural example of the manufacturing apparatus 400 which concerns on this embodiment is shown with the 1st joining target object 110 and the 2nd joining target object 120. FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 shows a configuration example of the first joining object 110 and the second joining object 120 according to the present embodiment. FIG. 1 shows an overall configuration example of the first joining object 110 and the second joining object 120 and an enlarged view in which a part of the second joining object 120 is enlarged. FIG. 2 is a cross-sectional view showing a cross section AA ′ of the second bonding target 120 of FIG. 1 together with the corresponding first bonding target 110. In the present embodiment, the first joining object 110 and the second joining object 120 are brought into contact with each other at the joining target part, and the joining target part is partially heated to manufacture a joined object obtained by joining the joining target parts.

  The first bonding object 110 and the second bonding object 120 may be various substrates such as a glass substrate, a semiconductor substrate such as silicon, or a ceramic substrate. Here, the first joining object 110 and the second joining object 120 may be substrates of different materials. Here, when joining the 1st joining target object 110 and the 2nd joining target object 120 with the light irradiated from the outside, at least one of the 1st joining target object 110 and the 2nd joining target object 120 permeate | transmits light. The material to be formed.

  As an example, the first bonding target 110 is a glass substrate, and the second bonding target 120 is a silicon substrate. The first bonding target 110 includes a convex portion 115, an electronic circuit 117, and a bonding target portion 130. Further, the second bonding target 120 includes a convex portion 125, an electronic circuit 127, and a bonding target portion 130.

  The convex part 115 and the convex part 125 may each have the joining object location 130. The first joining object 110 and the second joining object 120 may contact at the joining target portion 130 provided on the convex portion 115 and the convex portion 125. It replaces with this and the convex part 115 provided in the 1st joining target object 110 may contact the surface of the 2nd joining target object 120. FIG. In this case, the joining object location 130 may be provided on each of the convex portion 115 and the surface of the second joining object 120.

  It replaces with this and the convex part 125 provided in the 2nd joining target object 120 may contact the surface of the 1st joining target object 110. FIG. In this case, the joining object location 130 may be provided on each of the convex portion 125 and the surface of the first joining object 110. Instead of this, the first joining object 110 and the second joining object 120 are not provided with a convex part, and the first joining object 110 and the second joining object 120 may be in contact with each other on the surface. . In this case, at least a part of the surface where the first joining object 110 and the second joining object 120 are in contact with each other may be used as the joining object location 130.

  The electronic circuit 117 and the electronic circuit 127 are respectively formed on the surface where the joining target portion 130 exists in the first joining object 110 and the surface where the joining target portion 130 exists in the second joining object 120. Instead, the electronic circuit 117 or the electronic circuit 127 is provided on either the surface of the first bonding target 110 where the bonding target location 130 exists or the surface of the second bonding target 120 where the bonding target location 130 exists. , May be formed.

  The electronic circuit 117 and the electronic circuit 127 may include an electronic circuit such as an amplifier circuit, a transmission circuit, a switch, and / or a sensor. Further, the electronic circuit 117 and / or the electronic circuit 127 may include an actuator including a movable part that is movable in response to an electric signal. The electronic circuit 117 and the electronic circuit 127 may have via holes that electrically connect the surface on which the joining target portion 130 exists and the surface on the opposite side through the inside of the substrate.

  In the present embodiment, the joining target portion 130 is formed so as to surround and contact the electronic circuit 117 and / or the electronic circuit 127, and seals the electronic circuit 117 and / or the electronic circuit 127.

  FIG. 3 shows an example of a method for manufacturing the bonded article 100 according to the present embodiment. In FIG. 3A, the first joining object 110 and the second joining object 120 are brought into contact with each other at the joining object location 130. In FIG. 3 (b), the light that passes through the first object 110 is irradiated through the first object 110 to the part 130 where the first object 110 and the second object 120 are in contact with each other. Then, the joining target portion 130 is heated.

  Here, the light source 210 irradiates the joining target portion 130 with light. The light source 210 may condense light generated from a light source such as a laser, an LED, or a lamp onto the joining target portion 130 with an optical component such as a lens. The light source 210 may irradiate light having a wavelength that is transmitted through the first object 110 and is not easily transmitted through the second object 120. As an example, the first object 110 is a glass substrate, the second object 120 is a silicon substrate, and the light source 210 has a wavelength 1 from the near-ultraviolet wavelength region that is transmitted through the glass substrate and absorbed by the silicon substrate. . Irradiates light with a wavelength up to about 2 μm in the infrared wavelength region.

  As a result, at least a part of the light emitted from the light source 210 passes through the first object to be welded 110 and reaches the part to be welded 130. Moreover, light energy is converted into thermal energy by absorbing at least a part of the light reaching the joining target location 130 by the second joining target 120, and the joining target location 130 can be heated.

  Here, the voltage application unit 220 applies a voltage between the first joining object 110 and the second joining object 120, and the light source 210 applies a voltage between the first joining object 110 and the second joining object 120. In this state, light is irradiated to the bonding target portion 130 to anodic bond the bonding target portion 130. The voltage application unit 220 may apply a negative voltage of several hundred volts between the first object 110 and the second object 120.

For example, the first bonding object 110 that is a glass substrate includes positive movable alkali ions such as Na ⁺ and negative Si—O ⁻ ions fixed to the glass structure. When a voltage is applied between the first bonding object 110 and the second bonding object 120, the alkali ions in the glass move due to the applied negative voltage, and are moved to the interface with the second bonding object 120, which is a silicon substrate. the Si-O ^- space-charge layer having a thickness of about 1μm by ion is formed.

  An electrostatic attractive force acts between the space charge layer due to the fixed negative ions on the glass substrate side and the positive charges on the silicon substrate side, and a covalent bond is generated at the interface, so that the first bonding object 110 and the second bonding object 120 are formed. Are joined at the joining target location 130. Through the above process, it is possible to manufacture the bonded article 100 which is an airtight package in which the electronic circuit 117 and the electronic circuit 127 are sealed (FIG. 3C).

  Here, the first joining object 110 and the second joining object 120 are brought into contact with each other at a plurality of portions, and the plurality of joining object places 130 where the first joining object 110 and the second joining object 120 are in contact with each other. The light source 210 may irradiate light sequentially to join a plurality of joining target portions 130. Further, in this case, the irradiation position of the light source 210 is continuously moved so as to trace the lines or surfaces included in the plurality of bonding target portions 130, and the first bonding target 110 and the second bonding target 120 are linear. Or you may join planarly. Thereby, the part 130 to be joined of the first joining object 110 and the second joining object 120 is partially heated without heating the entire first joining object 110 and the second joining object 120. Can do.

  In FIG. 3 (c), the joined object 100 obtained by joining the first joining object 110 and the second joining object 120 may be cut into a plurality of joining parts 200. Here, the joined object 100 may be cut along a cutting line 230 included in the plane of the joining target portion 130. Moreover, the light source 210 may join the joining target location 130 without irradiating light to the cutting line 230 among the joining target locations 130. Accordingly, the bonded article 100 can be easily cut along the cutting line 230.

  Further, the plurality of joining parts 200 are formed adjacent to each other with the joining target portion 130 as a boundary, and are closed so as to enclose the electronic circuit 117 and / or the electronic circuit 127 included in the joining part 200 in order to seal each joining part 200. The shape may be irradiated with light. Here, the light source 210 may join the joining target portion 130 without irradiating light to the cutting line 230 among the joining target portions 130. As a result, the bonded article 100 can be easily cut along the cutting line 230 to produce a plurality of sealed bonded parts 200.

  Here, the cutting line 230 is a surface on the opposite side to the surface where the joining target portion 130 exists in the first joining object 110 or the surface opposite to the surface where the joining target portion 130 exists on the second joining object 120. In addition, it may be formed as a dicing line by photolithography or the like. For example, a metal film containing Au, Cu, Al, or the like is formed on the surface opposite to the surface where the bonding target portion 130 of the second bonding target 120 exists by vapor deposition or sputtering. A cutting line 230 on the surface of the formed metal film is selectively etched by photolithography or the like to form a dicing line. The dicing line thus formed is used as a guide for cutting the bonded article 100.

  According to the manufacturing method of the present embodiment described above, the joined object 100 or the joined component 200 can be obtained. The joined object 100 or the joined component 200 is an airtight package in which the electronic circuit 117 and the electronic circuit 127 are sealed, and the part to be joined 130 is partially heated in the manufacturing process, so that the electronic circuit 117 and the electronic circuit 127 are damaged by heating. Can be reduced. Therefore, deterioration or destruction of the electronic circuit 117 and the electronic circuit 127 in the manufacturing process can be prevented. Moreover, since the electronic circuit 117 and the electronic circuit 127 after manufacture are not damaged by heating, a long life and high reliability can be obtained.

  FIG. 4 shows a modification of the method for manufacturing the bonded article 100 according to this embodiment. In the manufacturing method of this modification, the same reference numerals are given to the substantially same components as those of the manufacturing method of the bonded article 100 according to the present embodiment shown in FIG.

  In FIG. 4A, a light absorbing portion 310 that absorbs light is formed at a bonding target location 130 in the first bonding target 110 or the second bonding target 120. The light absorbing part 310 may be formed by being embedded in the joining target portion 130. In this case, the light absorption unit 310 may be embedded in a recess formed by etching on the surface of the joining target portion 130. It replaces with this and the light absorption part 310 may be the thin film formed on the surface of the joining target location 130. FIG.

  The light absorption unit 310 includes a material that absorbs light emitted from the light source 210. When the light source 210 emits light having a frequency in the vicinity of visible light, the light absorption unit 310 may be a substance containing Ni, P, C, or the like. The light absorbing unit 310 absorbs light emitted from the light source 210 and generates heat. After the light absorption part 310 is formed at the joining target location 130, the first joining target 110 and the second joining target 120 may be brought into contact at the joining target location 130.

  In FIG. 4B, at least a part of the light emitted from the light source 210 passes through the first object 110 and reaches the joining target location 130 and the light absorbing portion 310. In addition, at least a part of the light reaching the joining target portion 130 and the light absorbing portion 310 is absorbed by the second joining target object 120 and the light absorbing portion 310, so that the light becomes heat and the joining target portion 130 is changed. Heat. In this way, by forming the light absorbing portion 310, the amount of light absorbed by the light source 210 is increased, so that the joining target portion 130 can be efficiently heated.

  Moreover, you may provide the reflection part 320 which reflects light toward the joining target location 130 in the surface opposite to the joining target location 130 in the 2nd joining target object 120. FIG. The reflection unit 320 may be a mirror that reflects light emitted from the light source 210. Here, the reflection part 320 may be provided in contact with the second bonding target 120, and instead, the reflection part 320 is provided at a position spaced apart from the second bonding target 120 by a predetermined distance. It's okay.

  As a result, of the light emitted from the light source 210, the light transmitted through the joining target portion 130 can be reflected by the reflecting portion 320 and irradiated again to the joining target portion 130. Therefore, since the amount of light irradiated to the joining target portion 130 can be substantially increased, the joining target portion 130 can be efficiently heated.

  Moreover, you may provide the mask 330 which covers parts other than the joining target location 130 in the light incident side in the 1st joining target object 110. FIG. Thereby, since the light emitted from the light source 210 can be blocked by the portions other than the bonding target portion 130, it is possible to prevent the portions other than the bonding target portion 130 from being heated by light irradiation.

  Here, the mask 330 may be provided in contact with the first joining object 110, and instead, the mask 330 may be provided in a space between the light source 210 and the first joining object 110. Alternatively, the mask 330 may be provided on the light source 210. In the case where the light source 210 is a lamp or the like that spreads light and irradiates light, the mask 330 is provided on the light source 210, so that the light emitted from the light source 210 can be blocked on portions other than the joining target portion 130.

  Further, a voltage application line 340 for applying a voltage for anodic coupling to one of the surface where the bonding target portion 130 exists in the first bonding target 110 and the surface where the bonding target portion 130 exists in the second bonding target 120. May be provided. The voltage application line 340 is electrically connected between the wiring provided on each of the surfaces opposite to the surface where the bonding target portion 130 exists in the first bonding object 110 and the wiring on each surface through the inside of the substrate. And via holes to be connected. Alternatively, the voltage application line 340 may be a part of the electronic circuit 117 and / or the electronic circuit 127.

  With the voltage application line 340, the voltage application unit 220 can apply a voltage used for anodic bonding to the bonding target portion 130. Moreover, since the voltage application part 220 can apply a voltage to the joining target location 130 from the surface where the joining target location 130 exists, the joining target location 130 is compared with the case where a voltage is applied from the surface where the joining target location 130 does not exist. The voltage can be applied from a more ideal position.

  Moreover, you may cool at least one part other than the joining target location 130, while heating the 1st joining target object 110 and the 2nd joining target object 120. FIG. For example, a cooling unit 350 that cools a part of the second bonding target 120 is provided. The cooling unit 350 may be provided in the vicinity of the second object 120, and is preferably provided in contact with the second object 120.

  The cooling unit 350 may be a Peltier element that utilizes the Peltier effect, and may instead be a gas cooling device that dissipates heat using the heat of vaporization of the liquid using a compressor. Alternatively, the cooling unit 350 may be a liquid cooling device that circulates liquid. Alternatively, the cooling unit 350 may be a cooling fan. Instead of this, the cooling unit 350 may be a heat radiator or a heat radiating pipe made of metal that easily conducts heat. The cooling unit 350 may be a combination of these.

  The cooling part 350 can reduce the influence of heat that is transferred to the electronic circuit 117 or the electronic circuit 127 by heat conduction when the joining target portion 130 is heated. Moreover, although the example which provides the cooling part 350 in the 2nd joining target object 120 was demonstrated in this modification, it replaces with this and is joined from both the 1st joining target object 110 side and the 2nd joining target object 120 side. You may cool at least one part other than the location 130. FIG. Thereby, the electronic circuit 117 and the electronic circuit 127 can be cooled, and the heat conduction damage to the electronic circuit 117 and the electronic circuit 127 when the joining target portion 130 is heated can be reduced.

  Alternatively, when the electronic circuit 117 and / or the electronic circuit 127 includes an actuator, the actuator may be a thermally driven actuator having a cooling unit 350 that cools itself, and the first joint object 110 and the second joint While the object 120 is being heated, the actuator may be cooled using the cooling unit 350. Accordingly, the electronic circuit 117 and the electronic circuit 127 can be cooled without providing the cooling unit 350 on the first bonding target 110 or the second bonding target 120, and the electrons when the bonding target portion 130 is heated. Damage to heat conduction to the circuit 117 and the electronic circuit 127 can be reduced.

  According to the manufacturing method of the present modification described above, the joining target portion 130 can be partially heated, and is substantially the same as the joined object 100 and the joined component 200 shown in FIGS. 3 (c) and 3 (d). Airtight packages can be manufactured. Accordingly, the joining target portion 130 is partially and efficiently heated in the manufacturing process, so that damage to the electronic circuit 117 and the electronic circuit 127 due to heating can be reduced.

  In the present embodiment and this modification, the example in which the joining target portion 130 is partially heated in the manufacturing process has been described. In addition to this, the first joining object 110 and the second joining object 120 may be heated to a temperature lower than the joining temperature. For example, the temperature control part which heats the whole 1st joining target object 110 and the 2nd joining target object 120 is provided, and the temperature control part heated the whole 1st joining target object 110 and the 2nd joining target object 120 Then, light is applied to the joining target portion 130.

  Here, the temperature heated by the temperature adjusting unit may be a temperature that is lower than the bonding temperature and that does not damage the electronic circuit 117 and the electronic circuit 127. Accordingly, it is possible to shorten the time from the start of irradiation of light to the joining target portion 130 until the joining target portion 130 reaches the joining temperature, and the joining time of the joining target portion 130 can be shortened.

  FIG. 5 shows a configuration example of the manufacturing apparatus 400 according to the present embodiment together with the first joining object 110 and the second joining object 120. The manufacturing apparatus 400 manufactures the joined object 100 and the joined component 200 obtained by joining the first joining object 110 and the second joining object 120. The manufacturing apparatus 400 includes a joining device 410 and a cutting device 420.

  The bonding apparatus 410 includes a stage unit 412, a transport unit 414, a voltage application unit 416, and a heating unit 418. The stage unit 412 mounts and fixes the first joining object 110 or the second joining object 120. The stage unit 412 may include a cooling unit 350 that cools the first bonding target 110 and / or the second bonding target 120. Further, the stage unit 412 may include a temperature adjusting unit that heats the first bonding target object 110 and the second bonding target object 120 to a temperature lower than the bonding temperature.

  The transport unit 414 mounts and transports the first joining object 110 or the second joining object 120. The transport unit 414 may include a cooling unit 350 that cools the first bonding target 110 and / or the second bonding target 120. Moreover, the conveyance part 414 may also contain the temperature control part which heats the 1st joining target object 110 and the 2nd joining target object 120 to temperature lower than joining temperature.

  The stage part 412 and the conveyance part 414 may make the 1st joining target object 110 and the 2nd joining target object 120 contact in the joining target location 130. FIG. In this case, the stage unit 412 and the transport unit 414 detect the first bonding object 110 and / or the second bonding object while detecting the spatial arrangement of the first bonding object 110 and the second bonding object 120 with a sensor or the like. 120 may be moved into contact. Instead of this, the stage unit 412 and the transport unit 414 may be mounted with the first bonding target object 110 and the second bonding target object 120 that have previously contacted at the bonding target point 130.

  For example, the voltage application unit 416 is electrically connected to the first bonding target 110 via the transport unit 414 and to the second bonding target 120 via the stage unit 412, and the first bonding target 110 and A voltage is applied between the second joining objects 120. The heating unit 418 includes a light source 210, and in a state where the voltage application unit 416 applies a voltage between the first bonding target object 110 and the second bonding target object 120, light is irradiated to the bonding target portion 130 to be bonded. The part 130 is heated and anodic bonded.

  The heating unit 418 may move the light source 210 so as to irradiate light to each of the plurality of bonding target portions 130. Instead, the heating unit 418 includes an optical component such as a mirror and moves the arrangement of the optical component. You may irradiate each of several joining object location 130 with light. Instead, the stage unit 412 may move the first bonding target 110 and the second bonding target 120, and the heating unit 418 may irradiate each of the plurality of bonding target points 130 with light. With the above-described joining device 410, the first joining object 110 and the second joining object 120 are anodically joined at the joining object location 130, and the joined object 100 is manufactured.

  The cutting device 420 cuts the bonded article 100 manufactured by the bonding device 410 to manufacture the bonded component 200. The cutting device 420 may be a dicing device that cuts the bonded article 100 with a rotating grindstone. Instead of this, the cutting device 420 may be a dicing device that condenses the inside of the bonded article 100 using a laser beam to form a thermal modification layer.

  Here, the manufacturing apparatus 400 may cut the bonded article 100 by adjusting the output power of the light source 210 included in the heating unit 418 and condensing the output light inside the bonded article 100. Instead, the heating unit 418 further includes a light source for dicing, and the manufacturing apparatus 400 switches to the light source for dicing when cutting the bonded article 100, and outputs light to the inside of the bonded object 100. It may be condensed. As a result, the manufacturing apparatus 400 can reduce the size of the apparatus and can shift to dicing immediately after manufacturing the bonded article 100, so that the manufacturing throughput of the bonded component 200 can be shortened.

  According to the manufacturing apparatus 400 according to the above-described embodiment, the joining target portion 130 is partially heated and anodic bonded without heating the entire first joining object 110 and the second joining object 120. The bonded product 100 can be manufactured. In addition, the manufacturing apparatus 400 can manufacture the joined component 200 by cutting the joined article 100.

  In the above-described embodiment of the present invention, the example in which the joined object 100 or the joined component 200 includes the electronic circuit 117 and / or the electronic circuit 127 has been described. The electronic circuit 117 and the electronic circuit 127 may not be provided. In this case, the first joining object 110 and the second joining object 120 may not include the convex part 115 and the convex part 125, respectively.

  Moreover, in the above embodiment of this invention, it demonstrated that the joining object location 130 was heated partially by irradiating light, and the joining thing 100 was manufactured. Instead of this, a heat source may be provided in the immediate vicinity of the joining target portion 130 and the joining target portion 130 may be partially heated.

  In this case, the heat source may be a heater such as a heating wire. Moreover, you may provide a heating wire in any one of the surface in which the joining target location 130 in the 1st joining target object 110 exists, and the surface in which the joining target location 130 of the 2nd joining target object 120 exists. The heating wire electrically connects between the wiring provided on each of the surfaces opposite to the surface where the bonding target portion 130 exists in the first bonding object 110 and the wiring on each surface through the inside of the substrate. It may be connected to a via hole. Alternatively, the heating wire may be a part of the electronic circuit 117 and / or the electronic circuit 127.

  Further, in the above-described embodiment of the present invention, it has been described that the bonded object 100 is manufactured by anodic bonding in which a voltage is applied between the first bonded object 110 and the second bonded object 120. Instead of this, the first joining object 110 and the second joining object 120 may be joined by heating. In this case, at least one of the first joining object 110 and the second joining object 120 may be melted and joined by heating. Instead, at least one of the first joining object 110 and the second joining object 120 may be provided with a material that melts by heating. Instead, a material that is solidified by heating may be applied to at least one of the first object 110 and the second object 120.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 100 Joined object, 110 1st joining target object, 115 convex part, 117 electronic circuit, 120 2nd joining target object, 125 convex part, 127 electronic circuit, 130 joining object location, 200 joining component, 210 light source, 220 Voltage application part , 230 cutting line, 310 light absorption part, 320 reflection part, 330 mask, 340 voltage application line, 350 cooling part, 400 manufacturing apparatus, 410 joining apparatus, 412 stage part, 414 transport part, 416 voltage application part, 418 heating part 420 Cutting device

Claims (9)

A manufacturing method for manufacturing a joined product obtained by joining a first joining object and a second joining object,
A contact stage in which the first joining object and the second joining object are brought into contact at a joining object location;
A joining step of joining the joining object part by partially heating the joining object part in the first joining object and the entire second joining object;
A manufacturing method comprising:   The joining step irradiates light that passes through the first joining object through the first joining object to the joining object place where the first joining object and the second joining object are in contact with each other, and The manufacturing method of Claim 1 which heats a joining object location. A voltage application step of applying a voltage between the first bonding object and the second bonding object;
The joining step irradiates the joining target portion with the light in a state where a voltage is applied between the first joining subject and the second joining subject to anodic join the joining subject portion. The manufacturing method as described. A circuit forming step of forming an electronic circuit on the surface of the first object to be joined and the surface of the second object to be joined and the surface of the second object to be joined;
In the contacting step, the joining target portion surrounds and contacts the electronic circuit,
The manufacturing method according to claim 3, wherein in the joining step, the joining target portions are joined and sealed.   The manufacturing method according to claim 4, wherein the electronic circuit includes an actuator.   The manufacturing method according to claim 4, wherein in the joining step, at least a part other than the joining target portion is cooled while the first joining object and the second joining object are heated. A manufacturing method for manufacturing a joined product obtained by joining a first joining object and a second joining object,
A contact stage in which the first joining object and the second joining object are brought into contact at a joining object location;
A step of irradiating light to be transmitted through the first object to be bonded to the position to be bonded through the first object to be bonded and bonding the position to be bonded;
A manufacturing method comprising:   The manufacturing method according to claim 1, wherein the first bonding target is a glass substrate, and the second bonding target is a silicon substrate. A manufacturing apparatus for manufacturing a joined product obtained by joining a first joining object and a second joining object,
A transport unit for bringing the first joining object and the second joining object into contact at a joining object location;
A heating unit that partially heats the portion to be joined in the first and second joining objects, and joins the joining portion;
A manufacturing apparatus comprising:

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