JP2012033629A - Electronic circuit board - Google Patents

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JP2012033629A
JP2012033629A JP2010170851A JP2010170851A JP2012033629A JP 2012033629 A JP2012033629 A JP 2012033629A JP 2010170851 A JP2010170851 A JP 2010170851A JP 2010170851 A JP2010170851 A JP 2010170851A JP 2012033629 A JP2012033629 A JP 2012033629A
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circuit board
mounting hole
electronic circuit
opening
electronic component
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Kenji Yahata
健志 八幡
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Sharp Corp
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Sharp Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit board that can reduce man hours when electronic components are mounted on the electronic circuit board by inserting pins.SOLUTION: An electronic circuit board 1, on which electronic components 10 are mounted by inserting pins therein, includes a land part 2 to which solder 2a is applied, a slid-type mounting hole 3 whose one end is provided in the land part 2, and an opening part 4 which continuously opens to the other end of the mounting hole 3 and which is widen to the mounting hole 3.

Description

本発明は、電子部品がピン挿入実装される電子回路基板に関する。   The present invention relates to an electronic circuit board on which electronic components are mounted by pin insertion.

従来の電子回路基板は特許文献1に開示されている。この電子回路基板はIC等の電子部品に設けられる複数のピンを挿入する円形の実装孔が一列に並設される。電子回路基板の半田付け面には実装孔の周囲に導体パターンから成るランド部が設けられる。   A conventional electronic circuit board is disclosed in Patent Document 1. In this electronic circuit board, circular mounting holes for inserting a plurality of pins provided in an electronic component such as an IC are arranged in a line. The soldering surface of the electronic circuit board is provided with a land portion made of a conductor pattern around the mounting hole.

電子回路基板は一般にチップマウンタ等によって電子部品のピンが半田付け面と反対の面から実装孔に挿入され、DIP槽に搬送されてランド部が浸漬される。これにより、ランド部に半田が塗布され、半田の固化によって電子回路基板に電子部品がピン挿入実装される。   The electronic circuit board is generally inserted into the mounting hole from the surface opposite to the soldering surface by a chip mounter or the like, transported to the DIP tank, and the land portion is immersed therein. Thereby, solder is applied to the land portion, and electronic components are pin-mounted on the electronic circuit board by solidification of the solder.

また、作業者が手動で電子部品を実装する際に、電子回路基板のランド部には半田槽の浸漬等によって半田が塗布される。その後、実装孔に電子部品のピンを挿入し、ランド部の半田によりピンを半田付けして電子部品がピン挿入実装される。   Further, when the operator manually mounts the electronic component, solder is applied to the land portion of the electronic circuit board by immersion in a solder bath or the like. Thereafter, the pins of the electronic component are inserted into the mounting holes, and the pins are soldered by the solder of the land portion, and the electronic component is inserted and mounted.

特開2005−311146号公報(第4頁−第6頁、第1図)Japanese Patent Laying-Open No. 2005-31146 (pages 4 to 6, FIG. 1)

しかしながら、上記従来の電子回路基板によると、電子部品の手動実装時に実装孔の周囲のランド部の半田により電子部品のピンを半田付けするため、実装孔とピンとの隙間が小さく形成される。このため、実装孔にピンを挿入する際にピンを曲げる虞があり、ピンの破損を回避するために慎重な作業を必要として工数が大きくなる問題があった。特に、一列に並設された複数の実装孔に複数のピンをそれぞれ挿入する場合には作業をより慎重に行う必要がある。   However, according to the above-described conventional electronic circuit board, since the pins of the electronic component are soldered by the solder of the land portion around the mounting hole when the electronic component is manually mounted, the gap between the mounting hole and the pin is formed small. For this reason, there is a possibility that the pin may be bent when the pin is inserted into the mounting hole, and there is a problem that man-hours are increased because careful work is required to avoid breakage of the pin. In particular, when inserting a plurality of pins into a plurality of mounting holes arranged in a line, it is necessary to perform the operation more carefully.

本発明は、電子部品のピン挿入実装時の工数を削減できる電子回路基板を提供することを目的とする。   An object of this invention is to provide the electronic circuit board which can reduce the man-hour at the time of pin insertion mounting of an electronic component.

上記目的を達成するために本発明は、電子部品をピン挿入実装する電子回路基板において、半田が塗布されるランド部と、前記ランド部内に一端が配されるスリット状の実装孔と、前記実装孔の他端に連続して開口するとともに前記実装孔に対して拡幅された開口部とを備えたことを特徴としている。   In order to achieve the above object, the present invention provides an electronic circuit board on which an electronic component is inserted by pin insertion, a land portion to which solder is applied, a slit-shaped mounting hole having one end arranged in the land portion, and the mounting An opening that is continuously open at the other end of the hole and is widened with respect to the mounting hole is provided.

この構成によると、電子部品を手動により実装する際にランド部に半田が塗布される。次に、電子部品に設けられるピンが幅の広い開口部に挿入され、電子部品をスライドしてスリット状の実装孔の一端にピンが配置される。次に、ランド部の半田によってピンが半田付けされ、電子部品が電子回路基板にピン挿入実装される。   According to this configuration, the solder is applied to the land portion when the electronic component is manually mounted. Next, a pin provided in the electronic component is inserted into the wide opening, and the electronic component is slid to place the pin at one end of the slit-shaped mounting hole. Next, the pins are soldered by the solder of the land portion, and the electronic component is inserted and mounted on the electronic circuit board.

また本発明は、上記構成の電子回路基板において、複数の前記ランド部及び前記実装孔をそれぞれ一方向に並設するとともに、長孔状に形成した一の前記開口部により複数の前記実装孔を連結したことを特徴としている。この構成によると、電子回路基板には長孔状の開口部から複数のスリット状の実装孔が延出される。電子部品に設けた一列に並ぶ複数のピンが長孔状の開口部に挿入され、電子部品のスライドによって各ピンがスリット状の実装孔の一端に配置される。   According to the present invention, in the electronic circuit board configured as described above, the plurality of land portions and the mounting holes are arranged side by side in one direction, and the plurality of mounting holes are formed by the one opening formed in a long hole shape. It is characterized by being connected. According to this configuration, a plurality of slit-shaped mounting holes are extended from the elongated hole-shaped opening in the electronic circuit board. A plurality of pins arranged in a row provided in the electronic component are inserted into the elongated hole-shaped opening, and each pin is arranged at one end of the slit-shaped mounting hole by sliding the electronic component.

また本発明は、上記構成の電子回路基板において、複数の前記ランド部、前記実装孔及び前記開口部をそれぞれ一方向に並設したことを特徴としている。この構成によると、電子部品に設けた一列に並ぶ複数のピンが複数の開口部にそれぞれ挿入され、電子部品のスライドによって各ピンがスリット状の実装孔の一端に配置される。   According to the present invention, in the electronic circuit board configured as described above, a plurality of the land portions, the mounting holes, and the opening portions are arranged in one direction. According to this configuration, a plurality of pins arranged in a row provided in the electronic component are respectively inserted into the plurality of openings, and each pin is arranged at one end of the slit-shaped mounting hole by sliding the electronic component.

また本発明は、上記構成の電子回路基板において、前記開口部は前記実装孔から延びる傾斜面を有することを特徴としている。   According to the present invention, in the electronic circuit board configured as described above, the opening has an inclined surface extending from the mounting hole.

本発明によると、スリット状の実装孔に連続するとともに実装孔に対して拡幅された開口部を備えるので、電子部品に設けられるピンを開口部に挿入し、電子部品をスライドすることによって実装孔の端部にピンを配置して半田付けを行うことができる。従って、容易にピンを実装孔に挿入することができ、電子部品のピン挿入実装時の工数を削減することができる。   According to the present invention, since it has an opening that is continuous with the slit-shaped mounting hole and is widened with respect to the mounting hole, the mounting hole is formed by inserting a pin provided in the electronic component into the opening and sliding the electronic component. Soldering can be performed by placing a pin at the end of the wire. Therefore, the pins can be easily inserted into the mounting holes, and the man-hours required for inserting and mounting the pins of the electronic component can be reduced.

本発明の第1実施形態の電子回路基板を示す側面断面図Side surface sectional drawing which shows the electronic circuit board of 1st Embodiment of this invention. 本発明の第1実施形態の電子回路基板の半田付け面を示す平面図The top view which shows the soldering surface of the electronic circuit board of 1st Embodiment of this invention. 本発明の第1実施形態の電子回路基板の電子部品を実装する際の状態を示す側面断面図Side surface sectional drawing which shows the state at the time of mounting the electronic component of the electronic circuit board of 1st Embodiment of this invention. 本発明の第1実施形態の電子回路基板の電子部品を実装する際の状態を示す側面断面図Side surface sectional drawing which shows the state at the time of mounting the electronic component of the electronic circuit board of 1st Embodiment of this invention. 本発明の第2実施形態の電子回路基板の半田付け面を示す平面図The top view which shows the soldering surface of the electronic circuit board of 2nd Embodiment of this invention

以下に本発明の実施形態を図面を参照して説明する。図1は第1実施形態の電子回路基板の電子部品を実装した状態を示す側面断面図である。また、図2は電子回路基板の半田付け面から見た平面図を示している。電子回路基板1の一面には導体パターンから成る複数のランド部2が一列に並設される。ランド部2には後述するように半田2aが塗布される。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side cross-sectional view showing a state where electronic components of the electronic circuit board of the first embodiment are mounted. FIG. 2 is a plan view seen from the soldering surface of the electronic circuit board. On one surface of the electronic circuit board 1, a plurality of land portions 2 made of a conductor pattern are arranged in a line. The land 2 is coated with solder 2a as will be described later.

電子回路基板1には複数のスリット状の実装孔3及び各実装孔3を連結する長孔状の開口部4が貫通して形成される。実装孔3の一端は各ランド部2内に配され、実装孔3の他端は開口部4に連結される。これにより、開口部4はスリット状の実装孔3に対して並設方向に拡幅され、開口部4から複数の実装孔3が延出される。開口部4には実装孔3から延びる傾斜面4aが設けられる。開口部4は傾斜面4aによって各実装孔3に対して徐々に幅が広げられる。   The electronic circuit board 1 is formed with a plurality of slit-shaped mounting holes 3 and long hole-shaped openings 4 connecting the mounting holes 3 therethrough. One end of the mounting hole 3 is disposed in each land portion 2, and the other end of the mounting hole 3 is connected to the opening 4. Accordingly, the opening 4 is widened in the parallel arrangement direction with respect to the slit-shaped mounting hole 3, and a plurality of mounting holes 3 are extended from the opening 4. The opening 4 is provided with an inclined surface 4 a extending from the mounting hole 3. The opening 4 is gradually widened with respect to each mounting hole 3 by the inclined surface 4a.

電子回路基板1には複数のピン10aを有する電子部品10がピン挿入実装される。図1、図2では電子部品10の一例としてLCD11が設けられる。LCD11はLCDホルダ12により保持され、リードフレーム等によって形成された一列に並ぶ複数のピン10aが導出される。ピン10aは各実装孔3の一端部に配され、ランド部2に塗布された半田2aにより半田付けされる。   An electronic component 10 having a plurality of pins 10a is mounted on the electronic circuit board 1 by pin insertion. 1 and 2, an LCD 11 is provided as an example of the electronic component 10. The LCD 11 is held by the LCD holder 12, and a plurality of pins 10a arranged in a line formed by a lead frame or the like are led out. The pin 10 a is disposed at one end of each mounting hole 3 and is soldered by the solder 2 a applied to the land portion 2.

作業者が手動で電子部品10を実装する際に、電子回路基板1のランド部2には半田槽の浸漬等によって半田2aが塗布される。次に、図3に示すように、電子部品10に設けられるピン10aが幅の広い開口部4に挿入される。次に、図4に示すように電子部品10をスライドし、傾斜面4aを介してスリット状の実装孔3にピン10aが導かれる。これにより、実装孔3のランド部2内の一端にピン10aが配置される。   When the operator manually mounts the electronic component 10, the solder 2 a is applied to the land portion 2 of the electronic circuit board 1 by dipping in a solder bath or the like. Next, as shown in FIG. 3, the pin 10 a provided on the electronic component 10 is inserted into the wide opening 4. Next, as shown in FIG. 4, the electronic component 10 is slid, and the pin 10a is guided to the slit-shaped mounting hole 3 through the inclined surface 4a. Thereby, the pin 10 a is arranged at one end in the land portion 2 of the mounting hole 3.

次に、ランド部2の半田2aによってピン10aが半田付けされる。この時、電子部品10を開口部4から実装孔3に向かう方向に付勢してもよい。これにより、図1に示すように電子部品10が電子回路基板1にピン挿入実装される。   Next, the pin 10 a is soldered by the solder 2 a of the land portion 2. At this time, the electronic component 10 may be urged in the direction from the opening 4 toward the mounting hole 3. As a result, the electronic component 10 is pin-mounted on the electronic circuit board 1 as shown in FIG.

本実施形態によると、スリット状の実装孔3に連続するとともに実装孔3に対して拡幅された開口部4を備えるので、電子部品10に設けられるピン10aを開口部4に挿入し、電子部品10をスライドすることによって実装孔3の端部にピン10aを配置して半田付けを行うことができる。従って、容易にピン10aを実装孔3に挿入することができ、電子部品10のピン挿入実装時の工数を削減することができる。   According to the present embodiment, since the opening portion 4 that is continuous with the slit-like mounting hole 3 and is widened with respect to the mounting hole 3 is provided, the pin 10a provided in the electronic component 10 is inserted into the opening portion 4, and the electronic component By sliding 10, the pin 10 a can be disposed at the end of the mounting hole 3 for soldering. Therefore, the pin 10a can be easily inserted into the mounting hole 3, and the man-hour at the time of pin insertion mounting of the electronic component 10 can be reduced.

また、一端がランド部2内に配されるスリット状の実装孔3がランド部2から外側に延びるため、ランド部2に半田2aを塗布した際に実装孔3の半田2aによる閉塞を防止することができる。これにより、簡単に実装孔3にピン10aを配置することができる。尚、実装孔3をランド部2内に配置して開口部4をランド部2内から外側に延びて形成してもよい。   In addition, since the slit-shaped mounting hole 3 having one end arranged in the land portion 2 extends outward from the land portion 2, the solder hole 2a is prevented from being blocked by the solder 2a when the solder 2a is applied to the land portion 2. be able to. Thereby, the pin 10a can be easily arranged in the mounting hole 3. The mounting hole 3 may be disposed in the land portion 2 and the opening 4 may be formed to extend outward from the land portion 2.

また、長孔状に形成した一の開口部4により複数の実装孔3を連結したので、一列に並ぶ複数のピン10aを容易に開口部4に挿入して実装孔3に導くことができる。   In addition, since the plurality of mounting holes 3 are connected by the one opening 4 formed in the shape of a long hole, the plurality of pins 10 a arranged in a row can be easily inserted into the opening 4 and guided to the mounting hole 3.

また、開口部4が実装孔3から延びる傾斜面4aを有するので、開口部4に挿入されたピン10aを容易にスリット状の実装孔3に導くことができる。尚、傾斜面4aが実装孔3の対向する二面から延びているが、一面のみから延びて傾斜面4aを形成してもよい。   Further, since the opening 4 has the inclined surface 4 a extending from the mounting hole 3, the pin 10 a inserted into the opening 4 can be easily guided to the slit-shaped mounting hole 3. Although the inclined surface 4a extends from two opposing surfaces of the mounting hole 3, the inclined surface 4a may be formed by extending only from one surface.

次に、図5は第2実施形態の電子回路基板の半田付け面を示す平面図である。説明の便宜上、前述の図1〜図4に示す第1実施形態と同一の部分は同一の符号を付している。本実施形態は複数の開口部4が実装孔3に対応して設けられる。その他の部分は第1実施形態と同様である。   Next, FIG. 5 is a plan view showing a soldering surface of the electronic circuit board of the second embodiment. For convenience of explanation, the same parts as those in the first embodiment shown in FIGS. In the present embodiment, a plurality of openings 4 are provided corresponding to the mounting holes 3. Other parts are the same as those in the first embodiment.

電子回路基板1には複数の開口部4が一列に並んで開口する。各開口部4は複数のスリット状の実装孔3にそれぞれ連結され、スリット状の実装孔3に対して並設方向に拡幅される。開口部4には実装孔3から延びる傾斜面4aが設けられる。開口部4は傾斜面4aによって実装孔3に対して徐々に幅が広げられる。   The electronic circuit board 1 has a plurality of openings 4 arranged in a line. Each opening 4 is connected to a plurality of slit-shaped mounting holes 3 and is widened in the juxtaposition direction with respect to the slit-shaped mounting holes 3. The opening 4 is provided with an inclined surface 4 a extending from the mounting hole 3. The opening 4 is gradually widened with respect to the mounting hole 3 by the inclined surface 4a.

作業者が手動で電子部品10を実装する際に、前述の図3と同様に、電子部品10に設けられるピン10aが幅の広い各開口部4に挿入される。次に、前述の図4と同様に、電子部品10をスライドし、傾斜面4aを介してスリット状の実装孔3にピン10aが導かれて実装孔3の一端にピン10aが配置される。そして、ピン10aが半田付けされる。   When the operator manually mounts the electronic component 10, the pins 10 a provided on the electronic component 10 are inserted into the wide opening portions 4 as in FIG. 3 described above. Next, as in FIG. 4 described above, the electronic component 10 is slid, the pin 10a is guided to the slit-shaped mounting hole 3 through the inclined surface 4a, and the pin 10a is disposed at one end of the mounting hole 3. Then, the pin 10a is soldered.

本実施形態によると、第1実施形態と同様に、スリット状の実装孔3に連続して実装孔3に対して拡幅された開口部4を備えるので、電子部品10に設けられるピン10aを開口部4に挿入し、電子部品10をスライドすることによって実装孔3の端部にピン10aを配置して半田付けを行うことができる。従って、電子部品10のピン挿入実装時の工数を削減することができる。   According to the present embodiment, as in the first embodiment, since the opening portion 4 that is continuous with the slit-shaped mounting hole 3 and is widened with respect to the mounting hole 3 is provided, the pin 10a provided in the electronic component 10 is opened. By inserting into the part 4 and sliding the electronic component 10, the pin 10 a can be disposed at the end of the mounting hole 3 for soldering. Therefore, the man-hour at the time of pin insertion mounting of the electronic component 10 can be reduced.

また、複数のランド部2、実装孔3及び開口部4をそれぞれ一方向に並設したので、一列に並ぶ複数のピン10aを容易に開口部4に挿入して実装孔3に導くことができる。また、第1実施形態に比して開口部4の開口面積が小さいため、電子回路基板1の強度を向上させることができる。   Further, since the plurality of lands 2, the mounting holes 3 and the openings 4 are arranged in one direction, the plurality of pins 10a arranged in a row can be easily inserted into the openings 4 and guided to the mounting holes 3. . Moreover, since the opening area of the opening part 4 is small compared with 1st Embodiment, the intensity | strength of the electronic circuit board 1 can be improved.

本実施形態において、電子部品10が複数のピン10aを有しているが、一のピン10aを有する電子部品10に対して一組のランド部2、実装孔3及び開口部4を設けてもよい。   In the present embodiment, the electronic component 10 has a plurality of pins 10a. However, even if a set of land portions 2, mounting holes 3, and openings 4 are provided for the electronic component 10 having one pin 10a. Good.

また、第1、第2実施形態において、電子部品10の一辺に沿ってピン10aが設けられるが、電子部品10の対向する二辺に沿ってピン10aを設けてもよい。この時、対向する二辺に対応するランド部2から実装孔3及び開口部4を同じ方向に延びて形成することにより、上記と同様に、ピン挿入実装の工数を削減することができる。   In the first and second embodiments, the pin 10 a is provided along one side of the electronic component 10, but the pin 10 a may be provided along two opposite sides of the electronic component 10. At this time, by forming the mounting hole 3 and the opening 4 in the same direction from the land portions 2 corresponding to the two opposite sides, the man-hours for pin insertion mounting can be reduced as described above.

本発明によると、電子部品がピン挿入実装される電子回路基板に利用することができる。   According to the present invention, the electronic component can be used for an electronic circuit board on which a pin is inserted and mounted.

1 電子回路基板
2 ランド部
2a 半田
3 実装孔
4 開口部
10 電子部品
10a ピン
11 LCD
12 LCDホルダ
DESCRIPTION OF SYMBOLS 1 Electronic circuit board 2 Land part 2a Solder 3 Mounting hole 4 Opening part 10 Electronic component 10a Pin 11 LCD
12 LCD holder

Claims (4)

電子部品をピン挿入実装する電子回路基板において、半田が塗布されるランド部と、前記ランド部内に一端が配されるスリット状の実装孔と、前記実装孔の他端に連続して開口するとともに前記実装孔に対して拡幅された開口部とを備えたことを特徴とする電子回路基板。   In an electronic circuit board for inserting and mounting electronic components, a land portion to which solder is applied, a slit-shaped mounting hole having one end arranged in the land portion, and a continuous opening at the other end of the mounting hole An electronic circuit board comprising an opening widened with respect to the mounting hole. 複数の前記ランド部及び前記実装孔をそれぞれ一方向に並設するとともに、長孔状に形成した一の前記開口部により複数の前記実装孔を連結したことを特徴とする請求項1に記載の電子回路基板。   The plurality of land portions and the mounting holes are juxtaposed in one direction, respectively, and the plurality of mounting holes are connected by the one opening portion formed in a long hole shape. Electronic circuit board. 複数の前記ランド部、前記実装孔及び前記開口部をそれぞれ一方向に並設したことを特徴とする請求項1に記載の電子回路基板。   The electronic circuit board according to claim 1, wherein a plurality of the land portions, the mounting holes, and the opening portions are arranged in one direction. 前記開口部は前記実装孔から延びる傾斜面を有することを特徴とする請求項1または請求項2に記載の電子回路基板。   The electronic circuit board according to claim 1, wherein the opening has an inclined surface extending from the mounting hole.
JP2010170851A 2010-07-29 2010-07-29 Electronic circuit board Pending JP2012033629A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112769U (en) * 1977-02-15 1978-09-08
JPH01161353U (en) * 1988-04-28 1989-11-09
JPH0375562U (en) * 1989-11-24 1991-07-29
JPH0513916A (en) * 1990-11-15 1993-01-22 Tokyo Gas Co Ltd Printed wiring board, printed circuit board and electronic machine
JPH07122894A (en) * 1993-10-25 1995-05-12 Tokai Rika Co Ltd Device for mounting electric component

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112769U (en) * 1977-02-15 1978-09-08
JPH01161353U (en) * 1988-04-28 1989-11-09
JPH0375562U (en) * 1989-11-24 1991-07-29
JPH0513916A (en) * 1990-11-15 1993-01-22 Tokyo Gas Co Ltd Printed wiring board, printed circuit board and electronic machine
JPH07122894A (en) * 1993-10-25 1995-05-12 Tokai Rika Co Ltd Device for mounting electric component

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