JP2012022958A - Flat panel display manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily form an alignment mark with high accuracy and good visibility without adapting a production line nor significantly increasing the number of steps, and to manufacture a flat panel display with good productivity at low cost.SOLUTION: The flat panel display manufacturing method includes a process of forming an alignment mark for recognizing the position of a substrate. The process of forming an alignment mark includes the steps of: coating the substrate with a photosensitive paste; drying a coated film into a photosensitive film; exposing the photosensitive film thereby to form the alignment mark; measuring a reflectance of the dried photosensitive film; and changing a condition of the drying step based on a result of measurement of the reflectance of the dried photosensitive film.

Description

  The present invention relates to a method for manufacturing a flat panel display such as a plasma display panel.

  In recent years, among flat panel displays, a plasma display panel (hereinafter referred to as “PDP”) that can be easily enlarged has become one of the mainstream.

  In a conventional PDP, a large number of discharge cells are formed between a front plate and a back plate arranged to face each other. The front plate has a front glass substrate, a display electrode pair formed of a pair of scan electrodes and sustain electrodes formed on the glass substrate, and a dielectric layer and a protective layer covering them. The back plate includes a glass substrate on the back side, a data electrode formed on the glass substrate, a dielectric layer covering the glass electrode, a partition wall, and a phosphor layer. Then, the front plate and the rear plate are arranged opposite to each other so that the display electrode pair and the data electrode are three-dimensionally crossed and sealed, and a discharge gas is sealed in the internal discharge space. Here, a discharge cell is formed at a portion where the display electrode pair and the data electrode face each other. A gas discharge is generated in each discharge cell of the PDP configured as described above, and red, green, and blue phosphors are excited and emitted to perform color display.

  The scan electrode and the sustain electrode are formed by laminating a narrow striped bus electrode on a wide striped transparent electrode. The transparent electrode is formed by patterning an indium tin oxide (hereinafter referred to as “ITO”) thin film formed on the entire surface of the glass substrate by sputtering or the like into a stripe shape by photolithography. At this time, alignment marks for aligning the exposure mask necessary for the subsequent processes (steps) are simultaneously formed. The bus electrode is formed by printing a conductive photosensitive paste on a glass substrate on which a transparent electrode and an alignment mark are formed, aligning and exposing an exposure mask, and then etching (see, for example, Patent Document 1). ).

JP 2000-156158 A

  However, in order to form a transparent electrode, a large vacuum apparatus and an expensive ITO target material for forming an ITO thin film by sputtering or the like are necessary. Furthermore, an exposure machine and an exposure mask for patterning the ITO thin film are required, which causes a problem that not only the production facility becomes large, but also the productivity of the PDP becomes low.

  Therefore, as a method for manufacturing a PDP without forming a transparent electrode, a PDP in which a scan electrode and a sustain electrode are formed with a conductive bus electrode is disclosed. However, in a PDP in which no transparent electrode is formed, it is necessary to form alignment marks by other methods. As a method of forming the alignment mark, for example, a method of forming by printing, laser engraving, a method of forming with the same material as the bus electrode, and the like are known.

  As for the alignment mark of a flat panel display, position accuracy, shape accuracy, and visibility are important. In particular, high-definition PDPs that are becoming mainstream in recent years require particularly high positional accuracy and shape accuracy. However, in order to manufacture a PDP having an electrode configuration that does not use a transparent electrode, the alignment mark must be formed by another method, and there are problems such as remodeling of the manufacturing line and increase in the number of manufacturing steps.

  For example, although a means for forming an alignment mark using a conventional photosensitive paste or the like is disclosed, it is necessary to separately provide an exposure / development process at the stage before forming the display electrode pair, and the number of manufacturing steps is reduced. Increase significantly.

  In addition, when the display electrode pair is formed using a conventional photosensitive conductive paste or the like, it is possible to form the alignment mark simultaneously with the display electrode pair. However, this method cannot be applied when the display electrode pair is formed by performing multiple exposures. Actually, when forming the display electrode pair, exposure is performed twice in order to suppress exposure defects due to scratches on the exposure mask and adhesion of dust. At this time, in order to prevent misalignment between the first exposure and the second exposure, an alignment mark for aligning at least the second exposure mask is indispensable.

  The present invention has been made in view of the above problems, and can easily form an alignment mark having high accuracy and good visibility without remodeling the production line and without greatly increasing the number of man-hours. Provided is a flat panel display manufacturing method capable of manufacturing a flat panel display with high productivity at low cost.

  The FPD manufacturing method of the present invention is an FPD manufacturing method including a step of forming an alignment mark for recognizing the position of the substrate, the alignment mark applying the photosensitive paste on the substrate, Drying the coated film to form a photosensitive film; exposing the photosensitive film to form an alignment mark; and measuring the reflectance of the dried photosensitive film; and drying The condition of the drying step is changed based on the measurement result of the reflectance of the photosensitive film.

  According to the present invention, an alignment mark having high accuracy and good visibility can be easily formed without remodeling the production line and without greatly increasing the number of man-hours. Can be manufactured.

1 is an exploded perspective view of a PDP in Embodiment 1 of the present invention. The figure which shows the detail of the front plate of the PDP The figure for demonstrating the manufacturing method of the front plate of the PDP The figure which shows the alignment mark of the PDP The figure which shows the detail of the alignment mark of the PDP The figure for demonstrating the manufacturing method of the backplate of the PDP The figure for demonstrating the manufacturing method of the front plate of PDP in Embodiment 2 of this invention. The figure which shows the detail of the other shape of the display electrode pair of PDP in Embodiment 1 or 2 of this invention The figure which shows the detail of the alignment mark of the other shape of PDP in Embodiment 1 or 2 of this invention The figure which shows the alignment mark of PDP in a prior art The figure which shows the alignment mark of PDP in a prior art The figure which shows the alignment mark of PDP in embodiment of this invention The figure which shows the differential curve calculated when the alignment mark of PDP in embodiment of this invention is recognized Diagram showing the relationship between drying temperature and alignment mark recognition rate Diagram showing the relationship between drying temperature and organic material mass change rate Diagram showing the relationship between drying temperature and panel center and edge gloss

  Hereinafter, a manufacturing method of a flat panel display according to an embodiment of the present invention will be described with reference to the drawings, taking a manufacturing method of a PDP as an example.

(Embodiment 1)
FIG. 1 is an exploded perspective view of PDP 10 according to Embodiment 1 of the present invention. The PDP 10 is configured by arranging the front plate 20 and the back plate 30 so as to face each other and sealing the periphery with low-melting glass (not shown), and a large number of discharge cells are formed therein. Yes.

  The back plate 30 has a glass substrate 31 on the back side, a data electrode 32, a dielectric layer 33, a partition wall 34, and a phosphor layer 35. On the glass substrate 31, a plurality of data electrodes 32 are formed in parallel to each other. A dielectric layer 33 is formed so as to cover the data electrode 32, and further, a grid-like partition wall 34 including a vertical partition wall 34 a and a horizontal partition wall 34 b is formed thereon, and the surface of the dielectric layer 33 and the side surface of the partition wall 34 are formed. In addition, phosphor layers 35 of red, green and blue colors are formed.

  The front plate 20 and the back plate 30 are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are three-dimensionally crossed, and a discharge cell is formed at a portion where the display electrode pair 24 and the data electrode 32 face each other. . The front plate 20 and the back plate 30 are sealed using low-melting glass at a position outside the image display area where the discharge cells are formed, and a discharge gas is sealed in the internal discharge space.

  FIG. 2 is a diagram showing details of front plate 20 of PDP 10 in the first exemplary embodiment of the present invention. FIG. 2A is an enlarged view of the front surface of the front plate 20, and FIG. 2B is an enlarged view of a cross section of the front plate 20.

  The scan electrode 22 includes a bus electrode 221 and a bus electrode 222. The sustain electrode 23 also has a bus electrode 231 and a bus electrode 232. A discharge gap MG is formed between the bus electrode 221 and the bus electrode 231.

  The bus electrodes 221 and 222 are composed of black layers 221b and 222b and conductive layers 221c and 222c, respectively, and the bus electrodes 231 and 232 are also composed of black layers 231b and 232b and conductive layers 231c and 232c. The black layers 221b, 222b, 231b, and 232b are provided to make the scanning electrodes 22 and the sustain electrodes 23 appear black when the PDP 10 is viewed from the display surface side. For example, a black material such as ruthenium oxide is formed on the glass substrate 21 in a narrow stripe shape. The conductive layers 221c, 222c, 231c, and 232c are provided to increase the conductivity of the scan electrode 22 and the sustain electrode 23, and a conductive material containing silver on the black layers 221b, 222b, 231b, and 232b. Are formed by laminating.

  In the present embodiment, black pastes (hereinafter referred to as “black photosensitive pastes”), conductive photosensitive pastes (hereinafter referred to as “conductive feelings”), particularly as various pastes used for manufacturing the front plate 20. A dielectric paste). Below, the creation method of each paste is demonstrated.

(Black photosensitive paste)
The black photosensitive paste is applied onto the glass substrate 21 and dried to form a first photosensitive film (hereinafter referred to as “black photosensitive film”), and then exposed to black layers 221b, 222b, It is a photosensitive paste for forming 231b, 232b and alignment marks. The black photosensitive paste is composed of an inorganic material component including a black material as a solid content and glass powder, and an organic material component including a photosensitive polymer, a photosensitive monomer, and a photopolymerization initiator. The diameter is 1 μm or less.

  The black photosensitive paste has an inorganic material composed of a black material and glass powder, a photosensitive polymer such as a photocurable polymer, various organic materials such as a photosensitive monomer, a photopolymerization initiator, and a solvent with a predetermined composition. It is prepared by mixing and homogeneously mixing and dispersing.

  As the black material, for example, at least one of oxides such as ruthenium oxide, iron oxide, cobalt oxide, nickel oxide, copper oxide, and manganese dioxide can be used. Here, in order to increase the accuracy of the alignment mark, the average particle diameter of the black pigment is set to 1 μm or less, more desirably 0.01 μm to 0.5 μm. By including these black materials in the paste in an amount of 5 wt% to 55 wt%, good black layers 221b, 222b, 231b, 232b and alignment marks can be formed. If the black material is less than 5 wt%, the color becomes light and the contrast may be lowered. On the other hand, if it is larger than 55 wt%, the softening point of the paste rises and it becomes difficult to match the thermal expansion coefficient with the glass substrate 21. Further, the ultraviolet rays do not reach the lower part during exposure, and there is a possibility that a black layer may be poorly formed.

  As the glass powder, glass powder containing bismuth oxide as a main component can be used. The average particle size of the glass powder is desirably 0.3 μm to 1.0 μm. When the average particle diameter of the glass powder exceeds 1.0 μm, the surface roughness of the black photosensitive film bx is affected, and the alignment mark recognition accuracy is deteriorated as described later. On the other hand, when the average particle size of the glass powder is less than 0.3 μm, the glass powder may aggregate, and the particle size of the aggregate increases. That is, the surface roughness of the black photosensitive film bx is affected, and the alignment mark recognition accuracy is deteriorated. It is further desirable that the maximum particle size is 2.0 μm or less.

  The composition of the glass powder is 30 wt% to 85 wt% of bismuth oxide, 5 wt% to 30 wt% of silicon oxide, 5 wt% to 20 wt% of boron oxide, 0.1 wt% to 10 wt% of zirconium oxide, and 2 wt% of zinc oxide. It is desirable to contain 20 wt% and aluminum oxide 1 wt% to 5 wt%, respectively. In order to improve the adhesion to the glass substrate, it is desirable to contain 25 wt% to 40 wt% of glass powder in the paste.

  Further, a conductive material may be further included as an inorganic material of the black photosensitive paste. As the conductive material, for example, fine metal particles such as silver, platinum, palladium, cobalt, nickel, manganese, molybdenum, and ruthenium having an average particle diameter of 1 μm or less, more preferably 0.01 μm to 0.5 μm can be used. . The content of metal fine particles made of silver or a silver-based alloy is desirably such that yellowing can be suppressed while imparting good conductivity to the lower layer. A suitable content of such silver-based metal fine particles is about 0.01 to 5 wt%.

  As an organic material of the black photosensitive paste, it is desirable to use an oligomer or polymer having a weight average molecular weight of 500 to 100,000 having a carboxyl group and an unsaturated double bond in the molecule as the photosensitive polymer. As the photosensitive monomer, a compound containing a carbon-carbon unsaturated bond can be used. By setting the content of these various organic material components to 20 wt% to 70 wt%, it is possible to create a black photosensitive paste with good printing characteristics. It is desirable to use a type in which the photosensitive monomer does not scatter due to the drying temperature. For example, when the drying temperature is 110 to 130 ° C., trimethylolpropane triacrylate (boiling point: 315.5 ° C.), pentaerythritol triacrylate (boiling point: about 205 ° C. to 215 ° C.), bisphenol A-ethylene oxide-diacrylate ( Boiling point: about 200 ° C.). As a result, the alignment mark portion is not excessively dried, and the sensitivity during exposure does not deteriorate. In addition to photosensitive polymers, photosensitive monomers, photopolymerization initiators and solvents as organic materials, binders, UV light absorbers, sensitizers, sensitization aids, polymerization inhibitors, plasticizers, sensitizers can be added as necessary. Additives such as a sticking agent, an organic solvent, an antioxidant, a dispersant, a suspending agent, and a leveling agent can also be added.

  The viscosity of the black photosensitive paste is preferably adjusted in the range of 2000 cps to 20000 cps. For example, in order to obtain a black photosensitive film having a film thickness of 5 μm to 20 μm by coating once by a screen printing method, 50000 cps to 200000 cps is desirable. In order to obtain a black photosensitive film using a blade coater method or a die coater method, 1500 cps to 20000 cps is desirable. The viscosity of the black photosensitive paste can be adjusted to the above range by the addition ratio of inorganic powder, thickener, organic solvent, plasticizer, precipitation inhibitor and the like.

  In this embodiment, 10 wt% of ruthenium oxide having an average particle size of 0.1 μm as a black material, 26 wt% of cobalt tetroxide, 12 wt% of a commercially available glass frit mainly composed of bismuth oxide as a glass powder, organic As a material, a total of 22 wt% of a commercially available photocurable polymer, a photosensitive monomer, and a photopolymerization initiator, and 30 wt% of a solvent were prepared. Subsequently, these were uniformly mixed and dispersed with three rollers to prepare a black photosensitive paste.

(Conductive photosensitive paste)
The conductive photosensitive paste is coated on a black photosensitive film and dried to form a second photosensitive film (hereinafter referred to as “conductive photosensitive film”), and then exposed to light to form a conductive layer. It is a material for forming 221c, 222c, 231c, and 232c. The conductive photosensitive paste includes an inorganic material component composed of a conductive material mainly composed of silver and glass powder, a photosensitive polymer such as a photocurable polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The various organic material components are prepared so as to have a predetermined composition, and then mixed and dispersed homogeneously.

  As the conductive material, in order to form the conductive layers 221c, 222c, 231c, and 232c finely, silver powder having an average particle size of 0.1 μm to 2.0 μm is desirable, and silver powder of 45 wt% or more is contained in the paste. By doing so, a preferable pattern for a conductive layer can be formed.

  As the glass powder, glass powder containing bismuth oxide as a main component can be used. The average particle size of the glass powder is preferably 0.3 μm to 1.0 μm, and more preferably the maximum particle size is 2.0 μm or less. The composition of the glass powder is 30 wt% to 85 wt% bismuth oxide, 5 wt% to 30 wt% silicon oxide, 5 wt% to 20 wt% boron oxide, 0.1 wt% to 10 wt% zirconium oxide, and 2 wt% zinc oxide. It is desirable to contain ˜20 wt% and aluminum oxide 1 wt% ˜5 wt%, respectively. Moreover, in order to improve the adhesiveness to a glass substrate, it is desirable to contain 0.5 wt%-5 wt% glass powder in a paste. In addition, when the above various organic materials are contained in the paste in an amount of 20 wt% to 45 wt%, a conductive photosensitive paste having good printing characteristics can be formed.

  In this embodiment, 69 wt% of silver powder having an average particle diameter of 0.8 μm, 3 wt% of a commercially available glass frit mainly composed of bismuth oxide, a commercially available photocurable polymer, a photosensitive monomer, and photopolymerization start A total of 13 wt% of the agent and 15 wt% of the solvent were prepared, and the mixture was uniformly mixed and dispersed with three rollers to prepare a conductive photosensitive paste.

(Dielectric paste)
The dielectric paste is a material for forming the dielectric layer 26. Dielectric paste is softening point containing some of boron oxide, silicon oxide, zinc oxide, alkaline earth oxide, alkali metal oxide, bismuth oxide, aluminum oxide, molybdenum oxide, tungsten oxide, cerium oxide, etc. It is a paste containing dielectric glass at 520 ° C to 590 ° C.

  In the dielectric layer 26 of the present embodiment, boron oxide 35 wt%, silicon oxide 1.4 wt%, zinc oxide 27.2 wt%, barium oxide 3.3 wt%, bismuth oxide 25 wt%, aluminum oxide 1.1 wt%, A dielectric paste containing dielectric glass containing molybdenum oxide 4.0 wt% and tungsten oxide 3.0 wt% was prepared. The dielectric glass thus prepared has a softening point of about 570 ° C.

  Next, a method for manufacturing the PDP 10 will be described. FIG. 3 is a diagram for explaining a method of manufacturing the front plate 20 of the PDP 10 according to Embodiment 1 of the present invention. The manufacturing process of the front plate 20 is divided into the following five steps, and each will be described in detail.

(First step)
In the first step, a glass substrate 21 is used as a substrate on the front side, a black photosensitive paste is applied on the glass substrate 21 and dried to form a black photosensitive film bx as a first photosensitive film. First, the glass substrate 21 is alkali cleaned. If the glass substrate 21 is a 42-inch PDP, for example, it is a glass substrate having a size of 980 mm × 554 mm and a thickness of 1.8 mm.

  Next, as shown in FIG. 3A, a black photosensitive film bx is formed by applying and drying a black photosensitive paste on the entire surface of the glass substrate 21 using a known technique such as a screen printing method. At this time, a black photosensitive paste is applied to a region where the display electrode pair 24 on the glass substrate 21 is not to be formed and where an alignment mark is to be formed. In the present embodiment, the four corner regions of the glass substrate 21 correspond. However, the region where the alignment mark is formed is not limited to the above, and the region where the display electrode pair 24 on the long side of the glass substrate 21 is not formed or the display electrode pair 24 on the short side of the glass substrate 21 is not formed. It may be a region.

  Here, when the region where the alignment mark is to be formed exists in the periphery of the application region of the black photosensitive paste, it is desirable that the thickness of the alignment mark formation region is larger than the thickness of the other regions. This is based on the following reason.

  In the drying process after application of the black photosensitive paste, the alignment mark formation region is in the periphery of the application region, so that the dry state differs from the other regions. In particular, when the dry state is matched with the image display area, the alignment mark forming area tends to be overdried. Therefore, it is desirable to increase the film thickness of the alignment formation region as compared with other regions to prevent over-drying.

  The thickness of the alignment mark formation region is preferably 1.5 to 2.0 times that of the other regions as compared with the state after application. Even after the front plate 20 is formed, this appears as a difference between the film thickness of the alignment mark portion and the film thicknesses of the black layers 221b and 222b in the other image display areas.

  Further, as a method for increasing the film thickness only in the alignment mark formation region, there is a method in which an emulsion is applied in the vicinity of the region corresponding to the screen plate at the relevant location when the above-described screen printing method is used. Thereby, the coating amount of the black photosensitive paste printed on the glass substrate 21 can be increased.

  Next, as shown in FIG. 3B, a conductive photosensitive film cx as a second photosensitive film is formed in a region where no alignment mark is to be formed on the black photosensitive film bx. The conductive photosensitive film cx is formed by applying a conductive photosensitive paste on the black photosensitive film bx of the glass substrate 21 using a known technique such as a screen printing method and then drying. At this time, the conductive photosensitive paste is not applied to the region where the display electrode pair is not formed on the black photosensitive film bx and the region where the alignment mark is to be formed. In the present embodiment, the four corner regions of the glass substrate 21 correspond.

(Second step)
In the second step, the black photosensitive film bx is exposed using the first exposure mask to form an alignment mark. On the first exposure mask 41, a pattern for forming the bus electrodes 221, 222, 231, 232 and a pattern for forming the alignment mark 51 are formed.

As shown in FIG. 3C, the first exposure is performed using the first exposure mask 41. The exposure intensity at this time is, for example, 300 mJ / cm ² . Then, an uneven pattern appears on the surface of the black photosensitive film bx, and these form the alignment mark 51. In this manner, the alignment mark 51 is formed on the black photosensitive film bx applied to the four corner areas of the glass substrate 21, and the scanning electrode 22 and the sustain electrode 23 are formed in the image display area of the glass substrate 21. For the first time. However, since the black photosensitive film bx is not developed, the alignment mark 51 appears as an uneven pattern that emerges on the black photosensitive film bx.

  FIG. 4 is a diagram showing alignment marks 51 of PDP 10 according to Embodiment 1 of the present invention. FIG. 4A is an enlarged schematic plan view of a portion of the glass substrate 21 where the alignment mark 51 is formed. FIG. 4B is an enlarged cross-sectional view of a portion of the glass substrate 21 where the alignment mark 51 is formed. FIG. 5 is a diagram showing details of the alignment mark 51 of the PDP 10 in the first embodiment of the present invention. FIG. 5A is a schematic diagram of an image obtained by capturing the alignment mark 51 with a camera. FIG. 5B is a diagram showing the relationship between the first exposure mask 41 and the alignment mark 51 of the glass substrate 21. FIG.5 (c) is a figure which shows the result of having measured the shape of the surface along the AA line of Fig.5 (a) with the surface roughness meter.

  As described above, the alignment mark 51 forms the black photosensitive film bx formed by applying the black photosensitive paste on the glass substrate 21 and drying it, and at least one of the concave portion and the convex portion is formed on the surface of the black photosensitive film bx. It is formed by providing.

  In the present embodiment, as shown in FIG. 5 (c), the alignment mark 51 is formed by unevenness in which a concave portion and a convex portion are provided adjacent to each other on the surface of the black photosensitive film bx. The irregularities are formed by exposure. The shape of the alignment mark 51 is, for example, a cross shape having a vertical and horizontal length of 3 mm and a width of 160 μm. The convex portion is an exposed region, and it is considered that the photosensitive monomer contained in the black photosensitive film bx is formed by polymerization and curing by exposure to cause volume expansion. Moreover, it is thought that the adjacent convex part and recessed part which arise in the boundary of the area | region exposed and the area | region which is not exposed arise as follows. In the exposed region, the photosensitive monomer is polymerized and cured by exposure, and the concentration of the liquid monomer is lowered. Then, a large concentration gradient of the liquid monomer occurs at the boundary between the non-exposed area and the exposed area, and the liquid monomer diffuses from the non-exposed area to the exposed area. Due to this diffusion, the volume decreases on the side of the non-exposed region near the boundary to form a concave portion, while the exposed region side swells by the diffused liquid monomer to form a convex portion. In this way, a convex portion is formed on the exposure region side of the boundary between the non-exposure region and the exposure region, and a concave portion is formed on the non-exposure region side, and the optically detectable alignment mark 51 is formed on the surface of the black photosensitive film bx. Is done.

  Immediately after the exposure, the unevenness of the surface of the black photosensitive film bx is relatively small, and the unevenness tends to increase with time. Therefore, in this embodiment, a standing time of 30 min to 60 min is provided after the first exposure.

  The inventors measured the shape of the surface in the vicinity of the alignment mark 51 after the elapse of 60 minutes after exposure with a surface roughness meter. As a result, as shown in FIG. 5C, the step width (= maximum value−minimum value) of the step between the concave and convex portions at the boundary between the exposed region and the non-exposed region is about 0.5 μm to 1.0 μm. It was confirmed that it can be used sufficiently as an alignment mark.

  Further, depending on the degree of diffusion / swelling, there may be a case where only a concave portion or only a convex portion is formed, but if the swing width of the step satisfies the above degree, it is recognized as an alignment mark.

  It is considered that when the alignment mark is irradiated with illumination, the presence of the concave portion or the convex portion causes a contrast in the reflected light and the image is picked up by the camera so that the shape can be detected.

  In addition to the above, it is also conceivable that the volume is reduced by drying and a step is generated at the boundary between the non-exposed area and the exposed area. Actually, the alignment mark can be formed in a short time by drying the glass substrate after the exposure.

(Third step)
In the third step, as shown in FIG. 3D, the alignment mark 51 is recognized in the state before developing the black photosensitive film bx, and the second electrode for forming the scan electrode 22 and the sustain electrode 23 is formed. The alignment of the exposure mask 42 is performed, and the second exposure of the black photosensitive film bx is performed. At this time, the alignment mark 51 formed on the surface of the black photosensitive film bx is irradiated with light, and the alignment mark 51 is imaged with a camera to position the second exposure mask. On the second exposure mask 42, a pattern for forming bus electrodes 221, 222, 231, 232 is formed. However, the pattern formed on the second exposure mask 42 is designed to be slightly narrower than the pattern width of the first exposure mask 41. In the present embodiment, a pattern that is about 20% narrower than the pattern width of the bus electrodes 221, 222, 231, 232 formed on the first exposure mask 41 is formed on the second exposure mask 42. . At this time, if the light irradiating the alignment mark 51 is diffused too much, the alignment mark 51 cannot be imaged with high accuracy. Therefore, it is desirable to recognize the alignment mark 51 by irradiating the alignment mark 51 with linear light using a coaxial incident illumination system and imaging the density of reflected light. When the step width is less than 0.5 μm, the alignment mark may not be sufficiently recognized even if a coaxial epi-illumination system is used. The second exposure intensity is, for example, 200 mJ / cm ² .

  By repeating the exposure for forming the bus electrodes 221, 222, 231, and 232 twice as described above, exposure defects due to scratches and dust adhesion on the exposure masks 41 and 42 can be suppressed to substantially zero. At this time, in order to prevent a positional shift between the first exposure and the second exposure, the alignment of the second exposure mask 42 is performed using the alignment mark formed by the first exposure. Furthermore, since the electrode pattern of the second exposure mask 42 is designed to be slightly narrower than the width of the electrode pattern of the first exposure mask 41, the electrode to be formed even if a slight positional deviation occurs. The shape of is not greatly damaged.

(4th step)
In the fourth step, the black photosensitive film bx is developed to form the scan electrode 22 and the sustain electrode 23. Specifically, as shown in FIG. 3 (e), the black photosensitive film bx is developed and the precursors 221bx, 222bx, 231bx, 232bx and the conductive layers 221c, 222c of the black layers 221b, 222b, 231b, 232b. The precursors 221cx, 222cx, 231cx, 232cx of 231c, 232c are formed. Note that the alignment mark 51 does not necessarily remain on the glass substrate 21 after development. However, when the second exposure mask 42 is used for the second exposure, the alignment mark 51 is also exposed through the positioning hole of the second exposure mask 42. Therefore, the alignment mark 51 is usually on the glass substrate 21. Remain.

  Next, as shown in FIG. 3 (f), the precursors 221bx, 222bx, 231bx, and 232bx of the black layers 221b, 222b, 231b, and 232b and the precursors 221cx, 222cx of the conductive layers 221c, 222c, 231c, and 232c, The glass substrate 21 on which 231cx and 232cx are formed is baked to form bus electrodes 221, 222, 231 and 232. The peak temperature of the firing at this time is desirably 550 ° C. to 600 ° C., and is 580 ° C. in the present embodiment. The thickness of the bus electrodes 221, 222, 231, 232 is preferably 1 μm to 6 μm, and in this embodiment, 4 μm.

  In the present invention, the “precursor” refers to a material obtained by applying a paste for a constituent member such as a black photosensitive paste and heat-treating the organic component contained therein to a state where the inorganic component is not melted. .

(5th step)
In the fifth step, as shown in FIG. 3G, a dielectric paste is applied on the glass substrate 21 on which the bus electrodes 221, 222, 231, 232 are formed by a screen printing method, a die coating method, Drying forms a precursor (not shown) of the dielectric layer 26. Then, a precursor (not shown) of the dielectric layer 26 is baked to form the dielectric layer 26 having a thickness of 20 μm to 50 μm. In the present embodiment, the precursor (not shown) of the dielectric layer 26 is baked at about 590 ° C. to form the dielectric layer 26 having a thickness of about 40 μm.

  Next, as shown in FIG. 3H, a protective layer 27 mainly composed of magnesium oxide was formed on the dielectric layer 26 by a known technique such as vacuum deposition. In this way, the front plate 20 is completed.

  Next, a method for manufacturing the back plate 30 will be described. FIG. 6 is a diagram for explaining a method of manufacturing the back plate 30 of the PDP 10 according to Embodiment 1 of the present invention.

  First, as shown in FIG. 6A, the glass substrate 31 on the back side is subjected to alkali cleaning.

  Next, as shown in FIG. 6B, a conductive photosensitive paste mainly composed of silver is formed in stripes at regular intervals on the glass substrate 31 by using a screen printing method, a photolithography method, or the like. Then, a precursor (not shown) of the data electrode 32 is formed. Next, the glass substrate 31 on which the precursor (not shown) of the data electrode 32 is formed is baked to form the data electrode 32. The thickness of the data electrode 32 is 2 μm to 10 μm, for example, and is 3 μm in the present embodiment.

  Subsequently, as shown in FIG. 6C, a dielectric paste is applied on the glass substrate 31 on which the data electrodes 32 are formed, and then baked to form a dielectric layer 33. The thickness of the dielectric layer 33 is, for example, about 5 μm to 15 μm, and is 10 μm in the present embodiment.

  Subsequently, as shown in FIG. 6D, a photosensitive dielectric paste is applied on the glass substrate 31 on which the dielectric layer 33 is formed, and then baked to form a precursor (not shown) of the partition wall 34. Form. Thereafter, exposure is performed using an exposure mask, and development is performed to form partition walls 34. The height of the partition wall 34 thus formed is, for example, 100 μm to 150 μm, and 120 μm in the present embodiment.

  Then, as shown in FIG. 6 (e), a phosphor ink containing any one of a red phosphor, a green phosphor, and a blue phosphor is applied to the wall surface of the partition wall 34 and the surface of the dielectric layer 33. Thereafter, the phosphor layer 35 is formed by drying and baking.

Examples of the red phosphor include (Y, Gd) BO ₃ : Eu, (Y, V) PO ₄ : Eu, and examples of the green phosphor include Zn ₂ SiO ₄ : Mn and (Y, Gd) BO _3. : Tb, (Y, Gd) Al ₃ (BO ₃ ) ₄ : Tb, etc., and as the blue phosphor, for example, BaMgAl ₁₀ O ₁₇ : Eu, Sr ₃ MgSi ₂ O ₈ : Eu, etc. can be used. In this way, the back plate 30 is completed.

  Then, the front plate 20 and the back plate 30 are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are three-dimensionally crossed, and low melting glass is used at a position outside the image display area where the discharge cells are formed. Seal. Thereafter, a discharge gas containing xenon is sealed in the internal discharge space, and the PDP 10 is completed.

  Thus, in the present embodiment, the first step of forming the black photosensitive film bx on the glass substrate 21 and the second step of forming the alignment mark 51 by exposing the black photosensitive film bx. And a third step of detecting the position of the glass substrate 21 by recognizing the alignment mark 51 in a state before developing the black photosensitive film bx.

  By this method, it is possible to easily form an alignment mark having high accuracy and good visibility without modifying the production line and without greatly increasing the number of man-hours, and manufacturing a PDP with low cost and high productivity. Can do.

  Further, the alignment mark 51 can be formed simultaneously with the first exposure only by changing the pattern of the first exposure mask 41 used when the display electrode pair 24 is formed. Therefore, a new exposure mask is not required, and a PDP can be manufactured at a lower cost.

(Embodiment 2)
The structure of the PDP in the second embodiment is the same as the structure shown in FIG. 1, FIG. 2 (a) and FIG. 2 (b). Various pastes used are the same as those in the first embodiment. The second embodiment is different from the first embodiment in that a black photosensitive paste is applied on the glass substrate 21 and dried, and then exposure for forming alignment marks is performed, and then the conductive photosensitive paste is applied. It is a point to do.

  FIG. 7 is a diagram for explaining a method of manufacturing the front plate 20 of the PDP 10 in the second embodiment of the present invention. The manufacturing process of the front plate 20 is divided into the following five steps, and each will be described in detail.

(First step)
In the first step, a black photosensitive paste is applied on the front glass substrate 21 and dried to form a black photosensitive film bx as a first photosensitive film.

  First, the glass substrate 21 is alkali cleaned. Next, as shown in FIG. 7A, a black photosensitive film bx is formed on the glass substrate 21. The black photosensitive film bx is formed by applying a black photosensitive paste to the entire surface of the glass substrate 21 and drying using a known technique such as a screen printing method.

  At this time, a black photosensitive paste is applied to a region where the display electrode pair 24 on the glass substrate 21 is not to be formed and where an alignment mark is to be formed. In the present embodiment, the four corner regions of the glass substrate 21 correspond. The steps so far are the same as in the first embodiment.

(Second step)
In the second step, as shown in FIG. 7B, the black photosensitive film bx is exposed to form at least a first alignment mark and a second alignment mark.

Specifically, exposure for forming the first alignment mark 56 and the second alignment mark 57 is performed using the first exposure mask 45 dedicated to the alignment mark. At this time, two alignment marks 56 and 57 are formed for each of the four corner positions of the glass substrate 21 in response to performing exposure twice when forming the electrodes. The first alignment mark 56 and the second alignment mark 57 thus formed appear on the black photosensitive film bx. The exposure intensity at this time is, for example, 300 mJ / cm ² .

  Next, as shown in FIG. 7C, a conductive photosensitive film cx as a second photosensitive film is formed in a region on the black photosensitive film bx where the first alignment mark and the second alignment mark are not formed. Form. The conductive photosensitive film cx is formed by applying the above-described conductive photosensitive paste onto the black photosensitive film bx of the glass substrate 21 using a known technique such as a screen printing method and drying. At this time, the conductive photosensitive paste is not applied to the region where the alignment mark is formed.

  As described above, the unevenness on the surface of the black photosensitive film bx is relatively small immediately after the exposure of the alignment mark, and a certain amount of time is required until the alignment mark can be used. However, in the second embodiment, after the exposure for forming the alignment mark is performed, the glass substrate 21 is dried when the conductive photosensitive film cx is formed, so that the alignment mark is formed in a short time. .

(Third step)
In the third step, as shown in FIG. 7D, the first alignment mark 56 is recognized, the second exposure mask 46 is aligned, and the scan electrode 22 and the sustain electrode 23 are formed for the first time. Exposure. Specifically, the first alignment mark 56 formed on the surface of the black photosensitive film bx is irradiated with light, the first alignment mark 56 is imaged with a camera, and the second exposure mask 46 is positioned. Do. Also in this case, it is desirable to use coaxial epi-illumination. On the second exposure mask 46, a pattern for forming the bus electrodes 221, 222, 231, 232 is formed. The exposure intensity at this time is, for example, 200 mJ / cm ² .

Thereafter, as shown in FIG. 7E, the second alignment mark 57 is recognized, the third exposure mask 47 is aligned, and the second exposure for forming the scan electrode 22 and the sustain electrode 23 is performed. Do. Specifically, the second alignment mark 57 formed on the surface of the black photosensitive film bx is read by a camera, and the third exposure mask 47 is positioned. Also in this case, it is desirable to use coaxial epi-illumination. On the third exposure mask 47, a pattern for forming bus electrodes 221, 222, 231, 232 is formed. However, the pattern formed on the third exposure mask 47 is designed to be slightly narrower than the pattern width of the second exposure mask 46. The exposure intensity at this time is, for example, 200 mJ / cm ² .

(4th step)
In the fourth step, as shown in FIG. 7 (f), the black layers 221b, 222b, 231b, and 232b precursors 221bx, 222bx, 231bx, 232bx and the conductive layers 221c, 222c, 231c, The precursors 221cx, 222cx, 231cx, and 232cx of 232c are formed.

  Next, as shown in FIG. 7G, the precursors 221bx, 222bx, 231bx, and 232bx of the black layers 221b, 222b, 231b, and 232b and the precursors 221cx, 222cx of the conductive layers 221c, 222c, 231c, and 232c, The glass substrate 21 on which 231cx and 232cx are formed is baked to form bus electrodes 221, 222, 231 and 232.

(5th step)
In the fifth step, as shown in FIG. 7 (h), a dielectric paste is applied to the glass substrate 21 on which the bus electrodes 221, 222, 231, and 232 are formed by a known technique such as a screen printing method or a die coating method. The precursor (not shown) of the dielectric layer 26 is formed by applying and drying. Then, a precursor (not shown) of the dielectric layer 26 is baked to form the dielectric layer 26 having a thickness of 20 μm to 50 μm.

  Next, as shown in FIG. 7I, a protective layer 27 containing magnesium oxide as a main component was formed on the dielectric layer 26 by a known technique such as vacuum deposition.

  Subsequently, the front panel 20 and the rear panel 30 created in the same manner as in the first embodiment are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are three-dimensionally crossed, and an image display in which discharge cells are formed is displayed. Seal with low-melting glass at a position outside the area. Thereafter, a discharge gas containing xenon is sealed in the internal discharge space, and the PDP 10 is completed.

  As described above, the second embodiment has an advantage that the exposure can be performed without providing a standing time, although the number of steps for forming the first alignment mark 56 and the second alignment mark 57 is increased. The manufacturing method according to the second embodiment is particularly useful when manufacturing a PDP in which black stripes are provided between adjacent display electrode pairs 24. By providing the alignment mark pattern on the exposure mask for forming the black stripe, the alignment mark can be formed simultaneously with the exposure of the black stripe, so that the PDP can be manufactured without increasing the number of steps.

  In the first or second embodiment of the present invention, as shown in FIGS. 2A and 2B, the scanning electrode 22 is composed of a bus electrode 221 and a bus electrode 222. The sustain electrode 23 is also composed of a bus electrode 231 and a bus electrode 232. However, the present invention is not limited to this.

  FIG. 8 is a diagram showing details of another shape of the display electrode pair of the PDP manufactured in the first or second embodiment of the present invention. The scan electrode 62 corresponds to one of the ladder-shaped long trees and defines the discharge gap MG, and the scan electrode 62 corresponds to the other of the ladder-shaped long trees and the bus electrode for increasing the conductivity of the scan electrode 62. 622 and a bus electrode 623 which corresponds to a ladder-shaped cross and for reducing the resistance between the bus electrode 621 and the bus electrode 622. Similarly, sustain electrode 63 corresponds to one of the ladder-shaped long vertical trees and corresponds to the other one of the ladder-shaped long vertical trees and the other of the long ladder-shaped vertical trees, and increases the conductivity of sustain electrode 63. The bus electrode 632 corresponds to a ladder-shaped cross, and includes a bus electrode 633 for reducing resistance between the bus electrode 631 and the bus electrode 632.

  By configuring the scan electrode 62 and the sustain electrode 63 in such a shape, the resistance between the bus electrode 621 and the bus electrode 622 and the resistance between the bus electrode 631 and the bus electrode 632 can be lowered. A more stable discharge can be generated. FIG. 8 shows an example in which one bus electrode 623 and 633 is provided for each discharge cell. However, the bus electrodes 623 and 633 may be appropriately provided as necessary, for example, one for each of the three discharge cells.

  FIG. 9 is a diagram showing details of an alignment mark 81 having another shape according to Embodiment 1 or 2 of the present invention. FIG. 9A is a schematic diagram of an image obtained by capturing the alignment mark 81 with a camera. FIG. 9B is a diagram showing the relationship between the first exposure mask 71 and the alignment mark 81 of the glass substrate 21. FIG.9 (c) is a figure which shows the result of having measured the shape of the surface along the AA line of Fig.9 (a) with the surface roughness meter. The feature of the alignment mark 81 is that the cross-shaped contour is an unexposed portion. When exposure is performed using the first exposure mask 71 having the cross-shaped contour as an unexposed portion as shown in FIG. 9B, the cross-shaped contour has a deep concave portion as shown in FIG. 9C. Become. Therefore, when the alignment mark 81 is imaged with a camera, a clear image of the alignment mark 81 can be obtained. In particular, when the alignment mark 81 is irradiated with linear light using coaxial epi-illumination, the illumination light is not regularly reflected at the inclined portion such as the side wall of the alignment mark 81. Therefore, the density of the reflected light becomes clear and the alignment mark 81 is easily recognized.

  In the first and second embodiments of the present invention, the PDP manufacturing method in which the front plate 20 and the back plate 30 are manufactured for each PDP using a glass substrate that is the size of one PDP has been described as an example. However, the present invention is not limited to this. For example, a method of manufacturing a PDP by so-called multi-chamfering, in which a plurality of front plates 20 and a back plate 30 are manufactured at a time using a glass substrate having a size corresponding to a plurality of PDPs such as four PDPs or six PDPs. Can also be applied.

(About alignment mark shape)
From here, the shape of the alignment mark in the embodiment of the present invention will be described. As described above, in the embodiment of the present invention, the alignment marks having the shapes shown in FIGS. 5 and 9 are employed. In addition to this, the recognition rate of the alignment mark also increases in the following shapes. The reason will be described.

  10 and 11 show the shape of the alignment mark in the prior art and the curve calculated therefrom. Thus, the alignment mark generally has a cross shape, and it is necessary to recognize the x and y coordinates of the center position of the cross shape. The method for recognizing the center position is as follows.

  In the alignment mark 101 of FIG. 10, when the white portion is the exposed portion and the black portion is the non-exposed portion, as described with reference to FIGS. The shape of the unevenness at this time is the same as the state of FIG. Then, linear light is projected onto the alignment mark 101 using coaxial epi-illumination to obtain reflected light. At this time, since the alignment mark 101 has a concavo-convex shape, there are places where incident light becomes reflected light and a sufficient amount of light is obtained, and places where incident light becomes scattered light and a quantity of light as reflected light cannot be obtained. A light quantity distribution is obtained.

  For example, in order to obtain the center position coordinate of the x-axis in the figure from this light amount distribution, the gradation of each pixel of the light amount distribution is differentiated, and the value is integrated in the y direction to obtain a floor in the x axis direction. A tone curve (differential curve) is calculated, and the center position x coordinate of the cross shape is obtained from this peak position. FIG. 10B shows the gradation difference curve. Thus, the midpoint of the two maximum peak positions is recognized as the x coordinate of the center position of the alignment mark 101.

  However, in the case of the alignment mark shown in FIG. 10A, there are possibilities that the peak positions of the gradation difference curve are calculated at four points, and there is a possibility of recognizing a position shifted from the original center position x coordinate.

  Also, with the alignment mark 201 in FIG. 11, a gradation difference curve as shown in FIG. 11B is obtained, from which the center position is recognized. Here, the number of peak positions is two points, but the portion located in the convex shape of the exposed portion has further irregularities, so that the peak positions of the two points cannot be separated. Cannot recognize.

  Therefore, in an embodiment of the present invention, a flat panel display having a display electrode formed of a photosensitive film on a substrate, the display electrode having a black layer and a conductive layer, and the photosensitive film on the substrate. The boundary between the exposed portion and the non-exposed portion that exposes the photosensitive film is aligned with a first axis parallel to any one of two axes in the orthogonal coordinate system in the substrate plane. The straight line and the second straight line that are parallel to the first straight line and have different coordinates on the other axis and the curved line or the straight line shorter than the first straight line and the second straight line are included.

  Specifically, the shape of the alignment mark in the embodiment of the present invention is, for example, the shape shown in FIG. In FIGS. 12A to 12E, the white portion is the exposed portion and the black portion is the non-exposed portion. Consider the x-axis direction and the y-axis direction in FIG.

  In the same figure, a straight line A that is a straight line in the y-axis direction and a straight line B that is parallel to the straight line A and have different x-axis coordinates are located at the boundary between the exposed portion and the non-exposed portion of the alignment mark 91. Is provided. Further, the boundary between the exposed portion and the non-exposed portion other than that is configured by a curve or a straight line shorter than the straight line A and the straight line B.

  In this case, by changing the shape of the boundary between the exposed part and the non-exposed part, when the differential value in the x direction is integrated in the y direction, they cancel each other, and the strength of the differential curve becomes weak. For this reason, the boundary between the exposed portion and the non-exposed portion can be clearly recognized, and the center position in the x direction can be recognized without shifting.

  FIGS. 13A to 13E show differential curves with respect to the shape of the alignment mark 91 in the embodiment of the present invention shown in FIGS. 12A to 12E. At the boundary where the straight line A and the straight line B exist, a peak occurs in the differential curve. The midpoint of these peak positions is the x coordinate of the center of the alignment mark 91. Peaks corresponding to these peak intensities are not calculated, and the peak positions can be easily separated from each other, so that the x coordinate can be easily recognized.

(About drying temperature)
From here, the optimal conditions of the drying process after apply | coating the black photosensitive paste performed at the 1st step in the said Embodiment 1 and Embodiment 2 are demonstrated. As a result of investigations by the inventors, it has been found that there is a correlation between the drying condition and the recognition rate of the alignment mark.

  In the drying step, as described above, a black photosensitive paste is applied to the entire surface of the glass substrate 21 using a known technique such as a screen printing method and dried to form the black photosensitive film bx. At this time, a black photosensitive paste is applied to a region where the display electrode pair 24 on the glass substrate 21 is not to be formed and where an alignment mark is to be formed.

  And the unevenness | corrugation of an alignment mark is formed by a later exposure process. Here, the waveform intensity ratio of the differential curve was used as an index of the recognition degree of the alignment mark. The waveform intensity ratio is a comparison of the maximum peak values of the differential curves under the respective drying temperature conditions after the application of the black photosensitive paste. The drying temperature referred to here is the temperature on the glass substrate at the time of keeping the temperature in the drying step, and here refers to the temperature in the alignment mark formation region.

  FIG. 14 shows the relationship between the drying temperature of the black photosensitive paste and the waveform intensity ratio. Thus, the change in which the drying temperature has a maximum value in the vicinity of 100 ° C. to 110 ° C. is shown. That is, in order to increase the recognition rate of the alignment mark, it has been found that it is effective to dry the black photosensitive paste at around 100 ° C to 110 ° C.

  Further, in order to elucidate the cause of the change in the recognition rate of the alignment mark in this way, the change in the remaining amount of the organic material of the black photosensitive paste during the drying process was examined. FIG. 15 is a diagram showing changes in the temperature of the black photosensitive paste and the weight reduction rate of the paste at that time. Under the same conditions as above, a black photosensitive paste was applied on a glass substrate, and a drying step was performed under each drying condition. They were measured by thermogravimetric analysis and differential thermal analysis (TG-DTA). And it was measured how the mass decreased with respect to the sample left at room temperature, and the ratio was calculated with the drying condition of 120 ° C. as 1.

  As a result, the sample with a drying temperature of 120 ° C. was expected to have a larger amount of decrease in the mass of the coating film. On the contrary, the sample had a maximum value when the drying temperature was around 100 ° C. to 110 ° C. Indicated. It can be seen that this is the same as the change in the waveform intensity ratio.

  That is, in order to increase the recognition rate of the alignment mark, it can be said that it is necessary to increase the reduction amount of the organic material in the drying process of the black photosensitive paste coating film. Furthermore, it can be said that it is not always required to increase the drying temperature in order to reduce the amount of the organic material.

  FIG. 16 is a diagram showing the relationship between the drying temperature and the glossiness of the panel center and edges with respect to the black photosensitive paste used in FIGS. 14 and 15. As an index for determining the drying state of the coating film, the glossiness of the film is used in the embodiment of the present invention. Here, FIG. 16A shows the prior art, and FIG. 16B shows the result under the conditions of the embodiment of the present invention.

  The glossiness is measured using a gloss meter PG-1M manufactured by Nippon Denshoku Industries Co., Ltd., measured on the film after applying a black photosensitive paste and drying it at each temperature condition. Yes. The glossiness is determined by determining the angle at which light from the light source is incident and the reflection angle toward the detector on the surface of the film to be measured, and quantifying the ratio. The figure shows the results when the incident reflection angle is 60 °.

  In FIG. 16A, there is a difference in gloss between the panel center and the edge even at the same drying temperature. That is, if a photosensitive monomer that scatters depending on the drying temperature is used, regions with different degrees of drying are mixed in the surface.

  On the other hand, in FIG. 16B, the difference in glossiness between the panel center and the edge is small. That is, it can be seen that the variation in the in-plane drying degree is reduced by using a photosensitive monomer that is not easily scattered by the drying temperature. As described above, since the drying variation is reduced, it can be understood that the sensitivity variation depending on the location can be reduced wherever the alignment mark exists.

  Based on these findings, in the embodiment of the present invention, alignment is performed by applying a photosensitive paste on a substrate, drying the applied film to form a photosensitive film, and exposing the photosensitive film. A step of forming a mark and a step of detecting the position of the substrate by recognizing the alignment mark in a state before developing the photosensitive film, and the step of drying has a range of 100 ° C. to 110 ° C. And dried.

  In an embodiment of the present invention, a step of applying a photosensitive paste on a substrate, a step of drying the applied film to form a photosensitive film, and a step of measuring the reflectance of the dried photosensitive film; A step of forming an alignment mark by exposing the photosensitive film, and a step of detecting the position of the substrate by recognizing the alignment mark in a state before developing the photosensitive film. The degree was evaluated by the reflectance of the dry film, and the drying condition was changed based on the evaluation result.

  Thereby, the organic material in the black photosensitive paste coating film can be sufficiently reduced, and the recognition rate of the alignment mark can be increased. In addition, the dry state can be recognized in the manufacturing process, and can be fed back to the manufacturing conditions according to the situation, so that the manufacturing yield can be kept high.

  It should be noted that the specific numerical values used in the embodiments are merely examples, and it is desirable to set them to optimal values as appropriate according to the PDP specifications and the like.

  According to the flat panel display manufacturing method of the present invention, it is possible to easily form an alignment mark having high accuracy and good visibility without remodeling the manufacturing line and without greatly increasing the number of steps. This is useful as a method for producing a flat panel display such as a plasma display panel.

10 PDP
DESCRIPTION OF SYMBOLS 20 Front plate 21 (Front side) glass substrate 22, 62 Scan electrode 23, 63 Sustain electrode 24 Display electrode pair 26 Dielectric layer 27 Protective layer 30 Back plate 31 (Back side) Glass substrate 32 Data electrode 33 Dielectric layer 34 partition wall 35 phosphor layer 41, 45, 71 (first) exposure mask 42, 46 (second) exposure mask 47 third exposure mask 51, 56, 57, 81, 91 alignment mark 221, 222, 231 232 Bus electrode 221b, 222b, 231b, 232b Black layer 221bx, 222bx, 231bx, 232bx Black layer precursor 221c, 222c, 231c, 232c Conductive layer 221cx, 222cx, 231cx, 232cx Conductive layer precursor bx Black photosensitivity Film cx conductive photosensitive film MG discharge gap

Claims (1)

A flat panel display manufacturing method including a step of forming an alignment mark for recognizing a position of a substrate, wherein the alignment mark includes a step of applying the photosensitive paste on the substrate, and a step of applying the applied film. Drying to form a photosensitive film, and exposing the photosensitive film to form an alignment mark,
And a step of measuring the reflectance of the dried photosensitive film, and changing the conditions of the drying step based on the measurement result of the reflectance of the dried photosensitive film. Method.

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