JP2012009233A - Insulating structure material and production method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To pulverize finely an organic filler extracted from wood-based resources so as to disperse it in a thermosetting resin uniformly.SOLUTION: An insulating structure material includes a thermosetting resin 5 such as epoxy resin, an organic filler 4 comprising one or more kinds of cellulose, hemicellulose, lignocellulose and lignin extracted from wood-based resources to be packed in the thermosetting resin 5, and an inorganic filler 3 comprising one or more kinds of silica, alumina and mullite to be packed in the thermosetting resin 5, and the organic filler 4 is swollen with a liquid acid anhydride and pulverized by agitation with the inorganic filler 3 so as to be dispersed uniformly.

Description

  Embodiments described herein relate generally to an insulating structure material containing a thermosetting resin as a component and a method for manufacturing the same, which are used when manufacturing a solid insulator that supports and insulates a main circuit such as a power device and a power receiving and distributing device.

  Thermosetting resins such as epoxy resins have excellent electrical characteristics, mechanical characteristics, thermal characteristics, and the like, and are widely used as insulating materials constituting electric and electronic parts. However, since it has excellent durability performance, the performance remains unchanged even after enduring use for many years, and reuse and disassembly are difficult. In addition, from the viewpoint of the global environment, there has been a need for an insulating material that has escaped from the society that relied on oil and added new functions.

  In response to such a demand, an insulating structure material has been proposed in which woody resources existing in nature are pulverized and filled into a thermosetting resin. That is, as a new function that does not depend on petroleum as much as possible, a function added with an organic filler extracted from a wood-based resource is known (for example, see Patent Document 1).

JP 2007-312489 A (FIG. 1)

  In the conventional insulating structure material described above, the organic filler is extracted from the wood-based resource and pulverized and filled. However, the organic filler is in a bulk state and pulverized to a size of several hundred μm or less, which is an appropriate size as the filling material. It required a lot of effort. In addition, if the classification after pulverization is insufficient and a large one more than a predetermined value is filled or agglomerates in the epoxy resin at the time of filling, it acts as a foreign substance and deteriorates electrical characteristics, mechanical characteristics, thermal characteristics, etc. It becomes a factor to make.

  The present invention has been made to solve the above problems, and provides an insulating structure material that can easily pulverize an organic filler and can be uniformly dispersed in a thermosetting resin, and a method for producing the same. Objective.

  In order to achieve the above object, the insulating structural material of the embodiment is a thermosetting resin and one of cellulose, hemicellulose, lignocellulose, and lignin extracted from a wood-based resource filled in the thermosetting resin. An organic filler comprising at least one kind and an inorganic filler comprising at least one kind of silica, alumina and mullite filled in the thermosetting resin, the organic filler being swollen with a liquid acid anhydride, It is characterized by being pulverized by stirring with a filler.

The figure explaining the manufacturing method of the insulating-structure material which concerns on Example 1 of this invention. The figure explaining the state of the swelled organic filler which concerns on Example 1 of this invention. The figure explaining the state stirred with the inorganic filler which concerns on Example 1 of this invention. The figure explaining the state filled with the epoxy resin which concerns on Example 1 of this invention. The figure explaining the manufacturing method of the insulation structural material which concerns on Example 2 of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, an insulating structure material according to Example 1 of the present invention will be described with reference to FIGS. FIG. 1 is a diagram illustrating a method for manufacturing an insulating structure material according to Example 1 of the present invention, FIG. 2 is a diagram illustrating a state of a swollen organic filler according to Example 1 of the present invention, and FIG. It is a figure explaining the state stirred with the inorganic filler which concerns on Example 1 of this invention.

  As shown in FIG. 1, first, the organic filler extracted from the wood resources is dried (st1). As the organic filler, for example, cellulose, hemicellulose, lignocellulose, or lignin extracted from corn cob by a critical water treatment or the like and pulverized to a particle size of about 300 μm is used. This is similar to that obtained with the prior art.

  Next, the organic filler is immersed in a liquid acid anhydride (manufactured by Nippon Kayaku Co., Ltd., Kayahard MCD) for several tens of minutes (st2). The organic filler is 50 parts by weight and the acid anhydride is 86 parts by weight. Then, as shown in FIG. 2, the liquid acid anhydride 1 penetrates into the organic filler, and the swollen organic filler 2 is swelled by several tens of percent. The liquid acid anhydride 1 is used as a curing agent for the epoxy resin described later.

  In the swollen state, 150 parts by weight of silica (manufactured by Electrochemical Industry, FB-24R) is added (st3). Silica has a particle size of 10 to 50 μm. In addition to silica, alumina, mullite, or the like can be mixed and used as an inorganic filler.

  And it stirs with a self-revolving mixing stirrer (st4). The rotation speed is 200 to 1000 rpm, and it is performed for several minutes. Then, as shown in FIG. 3, the swollen and softened organic filler 2 pulverized by the shearing force of the inorganic filler 3 becomes a pulverized organic filler 4 having a particle size of 50 to 100 μm.

  Next, 100 parts by weight of a bisphenol type epoxy resin (Japan Epoxy Resin, Epicoat 828) is mixed. At the same time, 350 parts by weight of silica is added and mixed (st5). Thereafter, the foam is defoamed and filled into a mold, heated at a temperature of 80 ° C. for primary curing, and after mold release, secondarily cured at a temperature of 150 ° C. (st6).

  Then, as shown in FIG. 4, the finely pulverized organic filler 4 and the inorganic filler 3 are uniformly dispersed in the thermosetting matrix 5, and excellent electrical characteristics, mechanical characteristics, and thermal characteristics are obtained. It is possible to manufacture a cast insulator having the following. The term “uniform” means that the pulverized organic filler 4 and the inorganic filler 3 are aggregated or there is no larger than a predetermined size. The thermosetting resin 5 contains an epoxy resin and a curing agent acid anhydride. Examples of thermosetting resins include polyester resins and phenol resins.

  Here, in FIGS. 2 to 4, the swelling organic filler 2 and the pulverized organic filler 4 are represented by a square shape, and the inorganic filler 3 is represented by a round shape, but the shape is not limited thereto. Further, in the case of a quadrangular shape, the length on the long side is represented as the particle size (diameter), and in the case of a round shape, the length on the ellipse side is represented.

  The pulverized organic filler 4 displayed in this way is pulverized with a particle size of 50 to 100 μm due to the effect of the inorganic filler 3 such as a ball mill, and has the same size as that of the inorganic filler 3 with a particle size of 10 to 50 μm. This is defined as the organic filler being crushed to the same size as the inorganic filler 3.

  In consideration of the fluidity of the epoxy resin 5 filled in the mold, the organic filler can be 200 parts by weight or less and the inorganic filler 600 parts by weight or less with respect to 100 parts by weight of the epoxy resin. That is, the organic filler obtained from the wood resources can be easily pulverized by swelling and softening, and can be filled more than the epoxy resin. As a result, it can be set as the solid insulator in consideration of petroleum resources.

  According to the insulating structure material of Example 1, the organic filler extracted from the wood resources is swollen with the liquid acid anhydride 1 and pulverized while stirring with the inorganic filler 3 to obtain the pulverized organic filler 4, and the thermosetting resin. 5 is mixed and heat-cured, the finely pulverized organic filler 4 and the inorganic filler 3 are uniformly dispersed in the thermosetting resin 5 to obtain a solid insulator having excellent characteristics. be able to.

  Next, an insulating structure material according to Example 2 of the present invention will be described with reference to FIG. FIG. 5 is a diagram illustrating a method for manufacturing an insulating structure material according to Example 2 of the present invention.

In addition, the point from which Example 2 differs from Example 1 is the swelling method of an organic filler. In FIG. 5, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 5, after drying the organic filler (st1), it is immersed in a low boiling point solvent such as acetone (st2-1) to swell the organic filler. After swelling, acetone is blown off and dried (st2-2), an inorganic filler is added (st3), and the organic filler is finely pulverized. In addition, the acid anhydride used as a hardening | curing agent shall be added at the time of epoxy resin mixing (st5).

  According to the insulating structure material of Example 2, in addition to the same effects as in Example 1, the penetration of acetone is smooth, and the organic filler can be reliably swelled.

  In the embodiment as described above, the organic filler extracted from the wood resource is swollen with an acid anhydride and the organic filler is pulverized while stirring with the inorganic filler. A uniformly dispersed insulating structure material can be obtained.

  Several embodiments have been described above, but these embodiments are merely given as examples and are not intended to limit the scope of the present invention. Indeed, the novel materials and methods described herein may be embodied in a variety of other forms and further without departing from the spirit or spirit of the invention. Various omissions, substitutions and changes may be made. The appended claims and their equivalents or equivalent methods are intended to include such forms or modifications as fall within the scope and spirit or spirit of the invention.

DESCRIPTION OF SYMBOLS 1 Liquid acid anhydride 2 Swelling organic filler 3 Inorganic filler 4 Ground organic filler 5 Thermosetting resin

Claims (6)

A thermosetting resin;
An organic filler composed of one or more of cellulose, hemicellulose, lignocellulose, and lignin extracted from the wood resources filled in the thermosetting resin;
Comprising an inorganic filler composed of one or more of silica, alumina, and mullite filled in the thermosetting resin;
An insulating structure material, wherein the organic filler is swelled with a liquid acid anhydride and pulverized by stirring with the inorganic filler. A thermosetting resin;
An organic filler composed of one or more of cellulose, hemicellulose, lignocellulose, and lignin extracted from the wood resources filled in the thermosetting resin;
Comprising an inorganic filler composed of one or more of silica, alumina, and mullite filled in the thermosetting resin;
An insulating structural material, wherein the organic filler is swelled with a low boiling point solvent, and is pulverized by removing the low boiling point solvent and stirring with the inorganic filler.   The insulating structure material according to claim 1 or 2, wherein the pulverized organic filler and the inorganic filler have the same size.   The insulating structural material according to any one of claims 1 to 3, wherein the organic filler is filled in a larger amount than the thermosetting resin. Extracting organic fillers containing cellulose, hemicellulose, lignocellulose, lignin from wood resources,
This organic filler is immersed in a liquid acid anhydride to swell,
Add inorganic filler to swollen organic filler,
The organic filler is pulverized by stirring them,
A method for producing an insulating structure material, wherein a pulverized organic filler is filled with a thermosetting resin. Extracting organic fillers containing cellulose, hemicellulose, lignocellulose, lignin from wood resources,
This organic filler is immersed in a low boiling point solvent to swell,
After drying the swollen organic filler, add inorganic filler,
The organic filler is pulverized by stirring them,
A method for producing an insulating structure material, wherein a pulverized organic filler is filled with a thermosetting resin.

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