JP2012008294A - Protective plate, joined body and method for manufacturing protective plate - Google Patents

Protective plate, joined body and method for manufacturing protective plate Download PDF

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JP2012008294A
JP2012008294A JP2010143292A JP2010143292A JP2012008294A JP 2012008294 A JP2012008294 A JP 2012008294A JP 2010143292 A JP2010143292 A JP 2010143292A JP 2010143292 A JP2010143292 A JP 2010143292A JP 2012008294 A JP2012008294 A JP 2012008294A
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substrate
predetermined region
region
thickness
predetermined
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JP2012008294A5 (en
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Masayuki Takahashi
政之 高橋
Maki Tsuji
真樹 辻
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To reduce stress caused by a coating layer when an electronic member and a protective plate are bonded with a joining member.SOLUTION: The protective plate comprises a substrate having a sticking surface where an electronic member is to be stuck with a joining member. The sticking surface of the substrate includes a first predetermined region coated with a coating layer and a third predetermined region including a part of the first predetermined region. The sticking surface of the substrate is formed in such a manner that the thickness of the substrate in the third predetermined region is smaller than that of the substrate in a region excluding the third predetermined region. The sticking surface is formed in such a manner that the sum of the thickness of the coating layer and of the substrate in a region overlapping a second predetermined region, which is included both in the first predetermined region and in the third predetermined region, is smaller than that of the thickness of the coating layer and of the substrate in a region in the first predetermined region of the substrate excluding the third predetermined region.

Description

本発明は、保護板、接合体及び保護板の製造方法に関する。   The present invention relates to a protective plate, a joined body, and a method for manufacturing the protective plate.

従来、例えば、表示パネルやタッチパネル等の電子部材の前側に保護板を配置した表示装置が知られている。このような表示装置には、電子部材と保護板とを、両面粘着シート等のシート状の接合部材によって一体的に貼り合わせたものが開発されている（例えば特許文献１参照）。   Conventionally, for example, a display device in which a protective plate is arranged on the front side of an electronic member such as a display panel or a touch panel is known. Such a display device has been developed in which an electronic member and a protective plate are integrally bonded together by a sheet-like joining member such as a double-sided pressure-sensitive adhesive sheet (see, for example, Patent Document 1).

特開２００８−９００５３号公報JP 2008-90053 A

ところで、保護板のうち、電子部材に対して貼り付けられる貼付面の所定部分、例えば表示パネルの表示エリア外の領域や、タッチパネルの操作エリア外の領域に重なる部分に、印刷層等の厚みを持った被覆層が形成されている場合がある。このような保護板を電子部材に接合部材を介して貼り合わせると、接合部材のうち被覆層に重なった部分が押しつぶされてしまう。この押しつぶされた部分は弾性復帰しようとするため応力を発生し、剥離等を生じさせる原因となっていた。
本発明の課題は、接合部材を介して電子部材と保護版とが貼り合わされた場合に、被覆層に起因する応力を緩和することである。 By the way, the thickness of the printed layer or the like is applied to a predetermined portion of the protective plate that is attached to the electronic member, for example, a region outside the display area of the display panel or a portion overlapping the region outside the operation area of the touch panel. In some cases, a covering layer is formed. When such a protective plate is bonded to an electronic member via a joining member, a portion of the joining member that overlaps the coating layer is crushed. The crushed portion generates a stress because it tries to return to elasticity, causing peeling and the like.
The subject of this invention is relieving the stress resulting from a coating layer, when an electronic member and a protective plate are bonded together via the joining member.

以上の課題を解決するため、本発明の一の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域及び前記第三所定領域に含まれる領域である第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記貼付面が形成されていることを特徴とする保護板が提供される。 In order to solve the above problems, according to one aspect of the present invention,
A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The sticking surface of the substrate has a first predetermined region covered by a coating layer covering the sticking surface, and a third predetermined region including a part of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the coating layer and the substrate in a portion overlapping the second predetermined region which is a region included in the first predetermined region and the third predetermined region of the substrate is the first predetermined region of the substrate. A protective plate is provided in which the affixing surface is formed so as to be smaller than the sum of the thickness of the covering layer and the substrate in a portion excluding the third predetermined region.

上記保護版において好ましくは、前記基板の前記第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記貼付面が形成されている。   Preferably, in the protective plate, a sum of thicknesses of the coating layer and the substrate in a portion overlapping the second predetermined region of the substrate is smaller than a thickness of the substrate in a region excluding the third predetermined region. Further, the affixing surface is formed.

また、本発明の他の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の厚さよりも小さくなるように、前記貼付面が形成されていることを特徴とする保護板が提供される。 According to another aspect of the invention,
A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The affixing surface of the substrate has a first predetermined region covered by a covering layer that covers the affixing surface, and a third predetermined region including the entire first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the covering layer and the substrate in a portion overlapping the first predetermined region of the substrate is the same as the thickness of the substrate in a region excluding the third predetermined region of the substrate, or of the substrate There is provided a protective plate in which the affixing surface is formed so as to be smaller than the thickness.

また、本発明の他の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部又は全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記第一所定領域の縁部が前記第三所定領域と重なることを特徴とする保護板が提供される。 According to another aspect of the invention,
A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The affixing surface of the substrate has a first predetermined region covered by a coating layer that covers the affixing surface, and a third predetermined region including a part or the whole of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
A protective plate is provided, wherein an edge of the first predetermined region overlaps the third predetermined region.

上記保護版において好ましくは、前記基板の前記第一所定領域及び前記第三所定領域はそれぞれが、全体が繋がった枠状となるように設けられていて、
前記基板の前記第三所定領域全体が前記第一所定領域に含まれている。
上記保護版において好ましくは、前記基板の前記第一所定領域及び前記第三所定領域はそれぞれが、全体が繋がった枠状となるように設けられていて、
前記基板の前記第一所定領域の内周縁全体が前記基板の前記第三所定領域に含まれている。
上記保護版において好ましくは、前記基板はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられている。 Preferably, in the protective plate, each of the first predetermined region and the third predetermined region of the substrate is provided in a frame shape in which the whole is connected,
The entire third predetermined area of the substrate is included in the first predetermined area.
Preferably, in the protective plate, each of the first predetermined region and the third predetermined region of the substrate is provided in a frame shape in which the whole is connected,
The entire inner peripheral edge of the first predetermined region of the substrate is included in the third predetermined region of the substrate.
Preferably in the protective plate, the substrate is a touch panel having a touch area,
The third predetermined area of the substrate is provided outside an area overlapping the touch area of the touch panel.

また、本発明の他の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域及び前記第三所定領域に含まれる領域である第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記貼付面が形成された保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体が提供される。 According to another aspect of the invention,
Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The application surface of the substrate has a first predetermined region covered with a coating layer covering the application surface, and a third predetermined region including a part of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the coating layer and the substrate in a portion overlapping the second predetermined region which is a region included in the first predetermined region and the third predetermined region of the substrate is the first predetermined region of the substrate. A protective plate on which the affixing surface is formed so as to be smaller than the sum of the thickness of the covering layer and the substrate in the portion excluding the third predetermined region,
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
A joined body is provided in which an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate.

また、本発明の他の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の厚さよりも小さくなるように、前記貼付面が形成された保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体が提供される。 According to another aspect of the invention,
Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The pasting surface of the substrate has a first predetermined region covered by a coating layer that covers the pasting surface, and a third predetermined region including the entire first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the covering layer and the substrate in a portion overlapping the first predetermined region of the substrate is the same as the thickness of the substrate in a region excluding the third predetermined region of the substrate, or of the substrate A protective plate on which the pasting surface is formed, so as to be smaller than the thickness;
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
A joined body is provided in which an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate.

また、本発明の他の態様によれば、
接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部又は全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記第一所定領域の縁部が前記第三所定領域と重なる保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体が提供される。 According to another aspect of the invention,
Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The pasting surface of the substrate has a first predetermined region covered by a coating layer that covers the pasting surface, and a third predetermined region including a part or the whole of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
A protective plate in which an edge of the first predetermined region overlaps the third predetermined region;
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
A joined body is provided in which an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate.

上記接合体において好ましくは、前記接合部材の周縁が前記基板の前記第三所定領域に重なっている。
上記接合体において好ましくは、前記接合部材の周縁が前記基板の前記第二所定領域に重なっている
上記接合体において好ましくは、前記基板の前記第一所定領域は、全体が繋がった枠状に設けられていて、
前記接合部材は、前記基板の前記第一所定領域が成す枠内の領域全体に重なるように設けられている。
上記接合体において好ましくは、前記電子部材は表示エリアを有する表示パネルであり、
前記保護板の前記第三所定領域は前記表示パネルの表示エリアに重なる領域よりも外側に設けられている。
上記接合体において好ましくは、前記基板はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられている。
上記接合体において好ましくは、前記表示パネルは、一対の透明基板間に液晶が封止され、該一対の透明基板の各外面に偏光板が貼り付けられた液晶表示パネルであり、
前記接合部材は全体が、前記一対の透明基板のうち、一方の透明基板の前記偏光板に重なるように配置されている。
上記接合体において好ましくは、前記電子部材はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられている。 In the joined body, preferably, a peripheral edge of the joining member overlaps the third predetermined region of the substrate.
In the joined body, preferably, a peripheral edge of the joining member overlaps the second predetermined region of the substrate. In the joined body, preferably, the first predetermined region of the substrate is provided in a frame shape in which the whole is connected. Being
The joining member is provided so as to overlap the entire region in the frame formed by the first predetermined region of the substrate.
Preferably in the joined body, the electronic member is a display panel having a display area,
The third predetermined area of the protection plate is provided outside an area overlapping the display area of the display panel.
Preferably in the joined body, the substrate is a touch panel having a touch area,
The third predetermined area of the substrate is provided outside an area overlapping the touch area of the touch panel.
Preferably, in the above bonded body, the display panel is a liquid crystal display panel in which liquid crystal is sealed between a pair of transparent substrates, and a polarizing plate is attached to each outer surface of the pair of transparent substrates.
The entire joining member is disposed so as to overlap the polarizing plate of one of the pair of transparent substrates.
Preferably in the joined body, the electronic member is a touch panel having a touch area,
The third predetermined area of the substrate is provided outside an area overlapping the touch area of the touch panel.

また、本発明の他の態様によれば、
一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に一部が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記凹部形成工程及び前記被覆層形成工程において、前記基板の前記第一所定領域及び前記第三所定領域に含まれる第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記凹部及び前記被覆層を形成することを特徴とする保護板の製造方法が提供される。 According to another aspect of the invention,
A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer covering the first predetermined region in a first predetermined region partially included in the third predetermined region of the substrate after the recess forming step;
In the concave portion forming step and the covering layer forming step, the sum of the thicknesses of the covering layer and the substrate in a portion overlapping the second predetermined region included in the first predetermined region and the third predetermined region of the substrate, The recess and the coating layer are formed so as to be smaller than the sum of the thickness of the coating layer and the substrate in a portion of the first predetermined region of the substrate excluding the third predetermined region. A method for manufacturing a protective plate is provided.

上記保護版の製造方法において好ましくは、前記被覆層形成工程は、前記基板の前記第三所定領域に隣接する隣接領域を被覆するように前記被覆層を形成する。   Preferably, in the method for manufacturing a protective plate, in the covering layer forming step, the covering layer is formed so as to cover an adjacent region adjacent to the third predetermined region of the substrate.

また、本発明の他の態様によれば、
一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に全体が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記凹部形成工程及び前記被覆層形成工程において、前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の該厚さよりも小さくなるように、前記凹部及び前記被覆層を形成することを特徴とする保護板の製造方法が提供される。 According to another aspect of the invention,
A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer that covers the first predetermined region in a first predetermined region that is entirely included in the third predetermined region of the substrate after the recess forming step;
In the recess forming step and the covering layer forming step, the sum of the thickness of the covering layer and the substrate in the portion overlapping the first predetermined region of the substrate is the region in the region excluding the third predetermined region of the substrate. There is provided a method for manufacturing a protective plate, characterized in that the concave portion and the covering layer are formed so as to be the same as the thickness of the substrate or smaller than the thickness of the substrate.

また、本発明の他の態様によれば、
一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に一部又は全体が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記被覆層形成工程において、前記第一所定領域の縁部が前記第三所定領域と重なるように前記被覆層を形成することを特徴とする保護板の製造方法が提供される。 According to another aspect of the invention,
A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer that covers the first predetermined region in a first predetermined region that is partially or wholly included in the third predetermined region of the substrate after the recess forming step;
In the covering layer forming step, the protective layer is formed such that the edge of the first predetermined region overlaps the third predetermined region.

上記保護版の製造方法において好ましくは、前記凹部形成工程は、前記基板の前記第三所定領域を切削して又はエッチングして溝を形成することを含む。
上記保護版の製造方法において好ましくは、前記被覆層形成工程は、前記基板の前記一方の主面に対して被覆材をスクリーン印刷又はスピンコートを施すことにより前記被覆層を形成することを含む。 Preferably, in the manufacturing method of the protective plate, the recess forming step includes cutting or etching the third predetermined region of the substrate to form a groove.
Preferably, in the method for producing a protective plate, the coating layer forming step includes forming the coating layer by screen printing or spin coating a coating material on the one main surface of the substrate.

本発明によれば、接合部材を介して電子部材と保護板とが貼り合わされた場合に、被覆層に起因する応力を緩和することができる。   According to the present invention, when the electronic member and the protective plate are bonded to each other via the joining member, the stress caused by the coating layer can be relaxed.

第一の実施の形態に係る表示装置の概略構成を模式的に示す図であり、図２のI−I切断面から見た断面図である。It is a figure which shows typically schematic structure of the display apparatus which concerns on 1st embodiment, and is sectional drawing seen from the II cut surface of FIG. 図１の表示装置の概略構成を模式的に示す正面図である。It is a front view which shows typically schematic structure of the display apparatus of FIG. 図１の表示装置に備わる保護板の製造方法を示す説明図である。It is explanatory drawing which shows the manufacturing method of the protection board with which the display apparatus of FIG. 1 is equipped. 第二の実施の形態に係る表示装置の概略構成を模式的に示す図であり、図５のIV−IV切断面から見た断面図である。It is a figure which shows typically schematic structure of the display apparatus which concerns on 2nd embodiment, and is sectional drawing seen from the IV-IV cut surface of FIG. 図４の表示装置の概略構成を模式的に示す正面図である。It is a front view which shows typically schematic structure of the display apparatus of FIG. 図４の表示装置に備わる保護板の製造方法を示す説明図である。It is explanatory drawing which shows the manufacturing method of the protection board with which the display apparatus of FIG. 4 is equipped. 第一の実施の形態で例示した表示装置に対してタッチパネルを搭載したものを模式的に示す断面図である。It is sectional drawing which shows typically what mounted the touch panel with respect to the display apparatus illustrated in 1st embodiment. 第二の実施の形態で例示した表示装置に対してタッチパネルを搭載したものを模式的に示す断面図である。It is sectional drawing which shows typically what mounted the touch panel with respect to the display apparatus illustrated in 2nd embodiment. （ａ）〜（ｄ）はそれぞれ本発明の変形例に係る表示装置が有する保護板の断面図である。(A)-(d) is sectional drawing of the protection board which the display apparatus which concerns on the modification of this invention has, respectively. （ａ）〜（ｃ）はそれぞれ本発明の変形例に係る表示装置が有する保護板の断面図である。(A)-(c) is sectional drawing of the protection board which the display apparatus which concerns on the modification of this invention has, respectively.

以下に、本発明を実施するための最良の形態について図面を用いて説明する。ただし、以下に述べる実施形態には、本発明を実施するために技術的に好ましい種々の限定が付されているが、発明の範囲を以下の実施形態及び図示例に限定するものではない。   The best mode for carrying out the present invention will be described below with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

［第一の実施の形態］
図１は、第一の実施の形態に係る表示装置の概略構成を模式的に示す図であり、図２のI−I切断面から見た断面図である。また、図２は表示装置の正面図である。この表示装置１は、液晶表示ユニット２と、液晶表示ユニット２に向けて照射光を照射する面光源３とを有する。以下、液晶表示ユニット２のうち保護板２３が配置された側（図１における上側）を「前側」と称し、この前側とは反対側（図１における下側）を「後側」と称する。 [First embodiment]
FIG. 1 is a diagram schematically showing a schematic configuration of the display device according to the first embodiment, and is a cross-sectional view as seen from a II cut plane in FIG. FIG. 2 is a front view of the display device. The display device 1 includes a liquid crystal display unit 2 and a surface light source 3 that emits irradiation light toward the liquid crystal display unit 2. Hereinafter, the side (upper side in FIG. 1) on which the protective plate 23 is disposed in the liquid crystal display unit 2 is referred to as “front side”, and the opposite side (lower side in FIG. 1) is referred to as “rear side”.

以下、液晶表示ユニット２について詳細に説明する。図１及び図２に示すように、液晶表示ユニット２は、電子部材としての液晶表示パネル２１と、液晶表示パネル２１の表示エリア２１ａの全体に重ねられた接合シート２２と、接合シート２２を介して液晶表示パネル２１の前側に配置された保護板２３とを備えた接合体である。   Hereinafter, the liquid crystal display unit 2 will be described in detail. As shown in FIGS. 1 and 2, the liquid crystal display unit 2 includes a liquid crystal display panel 21 as an electronic member, a bonding sheet 22 overlaid on the entire display area 21 a of the liquid crystal display panel 21, and a bonding sheet 22. And a protective plate 23 disposed on the front side of the liquid crystal display panel 21.

液晶表示パネル２１は、画像を表示する表示パネルである。この液晶表示パネル２１は、予め定めた間隙を設けて対向配置された前側と後側の一対の透明基板２１２，２１３と、これら透明基板２１２，２１３間の間隙に封止された液晶層（図示省略）と、一対の透明基板２１２，２１３の互いに向き合う内面にそれぞれ設けられ、電圧の印加により液晶層の液晶分子の配向状態を変化させて光の透過を制御する複数の画素を形成するための第一と第二の透明電極（図示省略）と、前側の透明基板（第二の透明基板）２１２の外面（前面）に貼り付けられた偏光板２１４と、後側の透明基板２１３の外面（後面）に貼り付けられた偏光板２１５とを備えている。   The liquid crystal display panel 21 is a display panel that displays an image. The liquid crystal display panel 21 includes a pair of front and rear transparent substrates 212 and 213 arranged to face each other with a predetermined gap, and a liquid crystal layer sealed in the gap between the transparent substrates 212 and 213 (illustrated). And a plurality of pixels for controlling light transmission by changing the alignment state of the liquid crystal molecules of the liquid crystal layer by applying a voltage. First and second transparent electrodes (not shown), a polarizing plate 214 attached to an outer surface (front surface) of a front transparent substrate (second transparent substrate) 212, and an outer surface of a rear transparent substrate 213 ( And a polarizing plate 215 attached to the rear surface.

この液晶表示パネル２１は、ＴＦＴ（薄膜トランジスタ）をアクティブ素子としたアクティブマトリックス液晶素子である。図では省略しているが、一対の透明基板２１２，２１３のうちの一方の透明基板（例えば後側の透明基板２１３）の内面（前面）には、行及び列方向にマトリクス状に配列させて形成された複数の画素電極（第一の電極）と、複数の画素電極にそれぞれ対応させて配置され、対応する画素電極に接続された複数のＴＦＴと、各行の複数のＴＦＴにそれぞれゲート信号を供給する複数の走査線と、各列の複数のＴＦＴにそれぞれデータ信号を供給する複数の信号線とが設けられている。一方、他方の透明基板（例えば前側の透明基板２１２）の内面（後面）には、複数の画素電極の配列領域全体に対向させて形成された対向電極（第二の電極）と、複数の画素電極と対向電極とが互いに対向する領域からなる複数の画素にそれぞれ対応させて形成された赤、緑、青の３色のカラーフィルタとが設けられている。
そして、一対の透明基板２１２，２１３の内面にはそれぞれ、電極を覆う配向膜（図示省略）が形成されており、この配向膜により液晶層の液晶分子は初期配向状態に保持され配向されている。 The liquid crystal display panel 21 is an active matrix liquid crystal element using TFTs (thin film transistors) as active elements. Although not shown in the figure, the inner surface (front surface) of one of the pair of transparent substrates 212 and 213 (for example, the rear transparent substrate 213) is arranged in a matrix in the row and column directions. Gate signals are respectively applied to the plurality of formed pixel electrodes (first electrodes), the plurality of TFTs arranged corresponding to the plurality of pixel electrodes, and connected to the corresponding pixel electrodes, and the plurality of TFTs in each row. A plurality of scanning lines to be supplied and a plurality of signal lines to supply data signals to the plurality of TFTs in each column are provided. On the other hand, on the inner surface (rear surface) of the other transparent substrate (for example, the front transparent substrate 212), a counter electrode (second electrode) formed to face the entire array region of the plurality of pixel electrodes, and a plurality of pixels There are provided color filters of three colors, red, green, and blue, which are formed so as to correspond to a plurality of pixels each having a region in which the electrode and the counter electrode face each other.
An alignment film (not shown) that covers the electrodes is formed on the inner surfaces of the pair of transparent substrates 212 and 213, and the liquid crystal molecules of the liquid crystal layer are held in the initial alignment state and are aligned by the alignment film. .

さらに、上記液晶表示パネル２１は、後側の透明基板２１３の内面に複数の画素電極を設け、前側の透明基板２１２の内面に対向電極を設けたものであるが、液晶表示パネルとしては、これ以外にも例えば、一対の透明基板２１２，２１３のうちの一方の透明基板の内面に、複数の画素をマトリクス状に配列させて形成するための複数の第一の電極と、それよりも液晶層側又は一方の透明基板側に第１の電極と絶縁して形成された複数の細長電極部とを有する第二の電極と、複数の第一の電極にそれぞれ対応させて配置され、対応する第一の電極に接続された複数のＴＦＴと、各行の複数のＴＦＴにそれぞれゲート信号を供給する複数の走査線と、各列の複数のＴＦＴにそれぞれデータ信号を供給する複数の信号線とを設け、複数の第一の電極と第二の電極との間に横電界（基板の内面に沿う方向の電界）を生じさせて液晶分子の配向状態を変化させる横電界制御型のものでもよい。   Further, the liquid crystal display panel 21 is provided with a plurality of pixel electrodes on the inner surface of the rear transparent substrate 213 and a counter electrode on the inner surface of the front transparent substrate 212. In addition, for example, a plurality of first electrodes for forming a plurality of pixels arranged in a matrix on the inner surface of one of the pair of transparent substrates 212 and 213, and a liquid crystal layer more than that A second electrode having a plurality of elongated electrode portions formed on the side or one transparent substrate side and insulated from the first electrode, and a second electrode corresponding to each of the plurality of first electrodes. A plurality of TFTs connected to one electrode, a plurality of scanning lines for supplying gate signals to the plurality of TFTs in each row, and a plurality of signal lines for supplying data signals to the plurality of TFTs in each column are provided. Multiple first electric When the transverse electric field may be one to cause (electric field in a direction along the inner surface of the substrate) of the transverse electric field control type for changing the orientation state of the liquid crystal molecules between the second electrode.

また、偏光板２１４は、前側の透明基板２１２の外形よりも小さく、且つ表示エリア２１ａよりも大きい略矩形状に形成されていて、当該透明基板２１２の周縁部と重ならないように、周縁部を除いた領域に貼り付けられている。一方、偏光板２１５は、偏光板２１４と実質的に同じ形状に形成されていて、後側の透明基板２１３の周縁部を除いた領域に貼り付けられている。   The polarizing plate 214 is formed in a substantially rectangular shape that is smaller than the outer shape of the transparent substrate 212 on the front side and larger than the display area 21a, and has a peripheral portion that does not overlap with the peripheral portion of the transparent substrate 212. It is pasted in the excluded area. On the other hand, the polarizing plate 215 is formed in substantially the same shape as the polarizing plate 214 and is attached to a region excluding the peripheral portion of the rear transparent substrate 213.

保護板２３は、強化ガラス又は高強度の透明樹脂板からなる透光性を有する矩形状の基板２３０を含む。そして、保護板２３は、液晶表示パネル２１の前側の透明基板２１２の全体を覆う大きさを有するように形成されている。具体的には、保護板２３は、液晶表示パネル２１における前側の透明基板２１２の外形よりも大きい形状を有するように形成され、偏光板２１４の前面（偏光板の外面のうち前側の面）と透明基板２１２のうち偏光板２１４から露出した周縁部の外面とに対向させて配置されている。   The protective plate 23 includes a rectangular substrate 230 having translucency made of tempered glass or a high-strength transparent resin plate. The protective plate 23 is formed to have a size that covers the entire transparent substrate 212 on the front side of the liquid crystal display panel 21. Specifically, the protective plate 23 is formed to have a shape larger than the outer shape of the front transparent substrate 212 in the liquid crystal display panel 21, and the front surface of the polarizing plate 214 (the front surface among the outer surfaces of the polarizing plate). The transparent substrate 212 is disposed to face the outer surface of the peripheral edge exposed from the polarizing plate 214.

ここで、保護板２３が有する基板２３０の一対の主面のうち、接合シート２２を介して液晶表示パネル２１が貼り付けられる主面（後面）を貼付面２３１とする。基板２３０の貼付面２３１には、液晶表示パネル２１の表示エリア２１ａの周囲を囲むように、矩形状の基板２３０の各辺に沿って全体が繋がって１つの閉領域を形成するように枠状の溝２３２が形成されている。溝２３２の内周縁２３２ａは表示エリア２１ａよりも外側に配置され、所定の間隔Ｈ１を空けて表示エリア２１ａと離間している。一方、溝２３２の外周縁２３２ｂは、基板２３０の外周縁よりも内側に形成され、所定の間隔Ｈ２を空けて基板２３０の外周縁と離間している。このように、基板２３０に形成された溝２３２は表示パネル２１の表示エリア２１ａに重なる領域よりも外側に設けられている。   Here, a main surface (rear surface) to which the liquid crystal display panel 21 is bonded via the bonding sheet 22 among the pair of main surfaces of the substrate 230 included in the protective plate 23 is referred to as a bonding surface 231. The pasting surface 231 of the substrate 230 has a frame shape so as to surround the display area 21a of the liquid crystal display panel 21 so as to be connected together along each side of the rectangular substrate 230 to form one closed region. The groove 232 is formed. The inner peripheral edge 232a of the groove 232 is disposed outside the display area 21a, and is separated from the display area 21a with a predetermined interval H1. On the other hand, the outer peripheral edge 232b of the groove 232 is formed inside the outer peripheral edge of the substrate 230, and is separated from the outer peripheral edge of the substrate 230 with a predetermined interval H2. As described above, the groove 232 formed in the substrate 230 is provided outside the region overlapping the display area 21 a of the display panel 21.

また、基板２３０の貼付面２３１には、当該貼付面２３１を被覆する被覆層２３３が形成されている。被覆層２３３は、液晶表示パネル２１の表示エリア２１ａの周囲を囲むように、矩形状の基板２３０の各辺に沿って全体が繋がって１つの閉領域を形成するように枠状に形成されている。被覆層２３３の内周縁２３３ａは、その全体が、溝２３２の内周縁２３２ａよりも内側であって且つ表示エリア２１ａよりも外側に配置されていて、所定の間隔Ｈ３を空けて表示エリア２１ａと離間している。一方、被覆層２３３の外周縁２３３ｂは、溝２３２の外周縁２３２ｂよりも外側であって且つ基板２３０の外周縁よりも内側に配置されていて、所定の間隔Ｈ４を空けて基板２３０の外周縁と離間している。   In addition, a coating layer 233 that covers the pasting surface 231 is formed on the pasting surface 231 of the substrate 230. The covering layer 233 is formed in a frame shape so as to surround the display area 21a of the liquid crystal display panel 21 so as to be connected together along each side of the rectangular substrate 230 to form one closed region. Yes. The entire inner peripheral edge 233a of the coating layer 233 is disposed inside the inner peripheral edge 232a of the groove 232 and outside the display area 21a, and is separated from the display area 21a with a predetermined interval H3. is doing. On the other hand, the outer peripheral edge 233b of the coating layer 233 is disposed outside the outer peripheral edge 232b of the groove 232 and inside the outer peripheral edge of the substrate 230, and has a predetermined interval H4 with an outer peripheral edge of the substrate 230. And separated.

この被覆層２３３は、例えばスクリーン印刷により形成された印刷膜である。被覆層２３３は、その形成時に貼付面２３１にほぼ均一な厚みに形成されるので、貼付面２３１の表面形状に対応した形状となる。つまり、溝２３２が形成されていない部分を覆う被覆層２３３は平面形状となり、溝２３２を覆う被覆層２３３は凹曲面状となっている。被覆層２３３の厚みは最も深い箇所における溝２３２の深さよりも薄くなるように形成されている。
貼付面２３１のうち、被覆層２３３が密着して形成されることにより被覆層２３３により被覆された領域が第一所定領域Ａ１であり、溝２３２が形成されている領域が第三所定領域Ａ３である。第一の実施の形態の場合、第三所定領域Ａ３の全体が第一所定領域Ａ１に含まれている。
本実施形態の保護板２３は、基板２３０の貼付面２３１の第三所定領域Ａ３における基板２３０の厚さが、第三所定領域Ａ３を除く領域における基板２３０の厚さよりも小さくなるように、基板２３０の貼付面２３１が形成されている。尚、基板２３０は、その貼付面２３１の第三所定領域Ａ３における厚さの最小値がＴ３（Ｔ３＜Ｔ０）となっている。ここで、第三所定領域Ａ３を除く領域における基板２３０の厚さをＴ０とする。 The coating layer 233 is a printed film formed by screen printing, for example. Since the coating layer 233 is formed with a substantially uniform thickness on the pasting surface 231 when it is formed, the coating layer 233 has a shape corresponding to the surface shape of the pasting surface 231. That is, the coating layer 233 that covers the portion where the groove 232 is not formed has a planar shape, and the coating layer 233 that covers the groove 232 has a concave curved surface shape. The thickness of the coating layer 233 is formed to be thinner than the depth of the groove 232 at the deepest portion.
Of the affixing surface 231, the region covered with the coating layer 233 when the coating layer 233 is formed in close contact is the first predetermined region A1, and the region where the groove 232 is formed is the third predetermined region A3. is there. In the case of the first embodiment, the entire third predetermined area A3 is included in the first predetermined area A1.
The protection plate 23 of the present embodiment is such that the thickness of the substrate 230 in the third predetermined area A3 of the sticking surface 231 of the substrate 230 is smaller than the thickness of the substrate 230 in the area excluding the third predetermined area A3. 230 affixing surface 231 is formed. In addition, the minimum value of the thickness in the 3rd predetermined area | region A3 of the sticking surface 231 is T3 (T3 <T0). Here, the thickness of the substrate 230 in the region excluding the third predetermined region A3 is T0.

また、本実施形態の保護板２３は、基板２３０の貼付面２３１のうち第一所定領域Ａ１及び第三所定領域Ａ３に含まれる領域である第二所定領域Ａ２と重なる部分における被覆層２３３及び基板２３０の厚さの和の最小値Ｔ２が、基板２３０の第一所定領域Ａ１のうち第三所定領域Ａ３を除く部分における被覆層２３３及び基板２３０の厚さの和Ｔ１よりも小さくなるように、貼付面２３１が形成されている。
特に、本実施形態の保護板２３は、基板２３０の貼付面２３１の第二所定領域Ａ２と重なる部分における被覆層２３３及び基板２３０の厚さの和の最小値Ｔ２が、第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも小さくなるように、貼付面２３１が形成されている。 Further, the protective plate 23 of the present embodiment includes the covering layer 233 and the substrate in a portion overlapping the second predetermined region A2 which is a region included in the first predetermined region A1 and the third predetermined region A3 on the pasting surface 231 of the substrate 230. 230 so that the minimum value T2 of the sum of the thicknesses 230 is smaller than the sum T1 of the thicknesses of the covering layer 233 and the substrate 230 in the portion of the first predetermined region A1 of the substrate 230 excluding the third predetermined region A3. An affixing surface 231 is formed.
In particular, the protective plate 23 of the present embodiment is such that the minimum value T2 of the sum of the thicknesses of the coating layer 233 and the substrate 230 in the portion overlapping the second predetermined region A2 of the pasting surface 231 of the substrate 230 is the third predetermined region A3. The pasting surface 231 is formed so as to be smaller than the thickness T0 of the substrate 230 in the excluded region.

接合シート２２は、液晶表示パネル２１と保護板２３とを貼り合わせるものである。接合シート２２は、透光性を有したシート状の接合部材であり、例えば微粘着シリコンやフッ素化合物等の粘着剤から矩形状に形成されている。接合シート２２は、液晶表示パネル２１と保護板２３との間に介在するように、その全体が液晶表示パネル２１における前側の偏光板２１４の前面に重ねられて配置されている。この接合シート２２の外周縁２２ｂは、被覆層２３３の外周縁２３３ｂよりも内側であって且つ溝２３２の外周縁２３２ｂよりも外側に配置されていて、所定の間隔Ｈ５を空けて溝２３２の外周縁２３２ｂと離間している。また、接合シート２２の外周縁２２ｂは基板２３０の第一所定領域Ａ１に重なっており、第三所定領域Ａ３の全体が接合シート２２の周縁部に重なっている。さらに、接合シート２２は、基板２３０の枠状をなす第一所定領域Ａ１に形成された被覆層２３３によって取り囲まれた閉領域全体に重なっている。   The bonding sheet 22 is for bonding the liquid crystal display panel 21 and the protective plate 23 together. The joining sheet 22 is a sheet-like joining member having translucency, and is formed in a rectangular shape from an adhesive such as slightly adhesive silicon or a fluorine compound, for example. The entire bonding sheet 22 is disposed so as to overlap the front surface of the front polarizing plate 214 in the liquid crystal display panel 21 so as to be interposed between the liquid crystal display panel 21 and the protective plate 23. The outer peripheral edge 22b of the bonding sheet 22 is disposed on the inner side of the outer peripheral edge 233b of the coating layer 233 and on the outer side of the outer peripheral edge 232b of the groove 232, and is outside the groove 232 with a predetermined interval H5. It is separated from the peripheral edge 232b. Further, the outer peripheral edge 22 b of the bonding sheet 22 overlaps the first predetermined area A <b> 1 of the substrate 230, and the entire third predetermined area A <b> 3 overlaps the peripheral edge of the bonding sheet 22. Further, the bonding sheet 22 overlaps the entire closed region surrounded by the coating layer 233 formed in the first predetermined region A1 that forms the frame shape of the substrate 230.

次に、表示装置１の製造方法について説明する。まず、保護板２３の製造方法について説明する。図３は保護板２３の製造方法を示す説明図である。   Next, a method for manufacturing the display device 1 will be described. First, a method for manufacturing the protective plate 23 will be described. FIG. 3 is an explanatory view showing a method for manufacturing the protective plate 23.

始めに、強化ガラス又は高強度の透明樹脂板を所定の大きさに切り出して、一対の主面の間に全面にわたって所定の厚みＴ０を有する矩形状の成形前の基板２３０を準備する（図３（ａ）参照）。
次いで、成形前の基板２３０の一対の主面のうち貼付面２３１とする一方の主面の一部（第三所定領域Ａ３）を、他の領域よりも厚みが小さくなるように削って溝２３２（凹部）を形成する（図３（ｂ）参照：凹部形成工程）。尚、基板２３０は、その貼付面２３１の第三所定領域Ａ３における厚さの最小値がＴ３（Ｔ３＜Ｔ０）となっている。具体的には、例えばドリル５１の先端にダイヤモンド粉を電解メッキ法又は無電解メッキ法によって固着された切削装置５０に対して、基板２３０を設置する。このとき、ドリル５１は、その先端が溝２３２の幅と同幅のものとする。そして、切削装置５０を駆動して、ドリル５１で基板２３０の貼付面２３１の一部を切削することで、溝２３２を形成する。このとき、基板２３０の貼付面２３１の第三所定領域Ａ３における基板２３０の厚さが、第三所定領域Ａ３を除く領域における基板２３０の厚さよりも小さくなるように、基板２３０の貼付面２３１を切削する。この際、基板２３０は、その貼付面２３１の第三所定領域Ａ３における厚さの最小値がＴ３（Ｔ３＜Ｔ０）となるように切削する。また、溝２３２が、矩形状の基板２３０の各辺に沿って全体が繋がって１つの閉領域を形成する枠状となるように、基板２３０の貼付面２３１を切削している。 First, a tempered glass or a high-strength transparent resin plate is cut into a predetermined size, and a rectangular pre-molding substrate 230 having a predetermined thickness T0 is prepared between the pair of main surfaces (FIG. 3). (See (a)).
Next, a part of the one main surface (third predetermined region A3), which is the pasting surface 231 of the pair of main surfaces of the substrate 230 before molding, is cut so that the thickness is smaller than the other region, and the groove 232 is formed. (Recesses) are formed (see FIG. 3B: recess formation step). In addition, the minimum value of the thickness in the 3rd predetermined area | region A3 of the sticking surface 231 is T3 (T3 <T0). Specifically, for example, the substrate 230 is installed on the cutting device 50 in which diamond powder is fixed to the tip of the drill 51 by electrolytic plating or electroless plating. At this time, the drill 51 has a tip that is the same width as the width of the groove 232. And the groove | channel 232 is formed by driving the cutting device 50 and cutting a part of the sticking surface 231 of the board | substrate 230 with the drill 51. FIG. At this time, the attachment surface 231 of the substrate 230 is set so that the thickness of the substrate 230 in the third predetermined region A3 of the attachment surface 231 of the substrate 230 is smaller than the thickness of the substrate 230 in the region excluding the third predetermined region A3. To cut. At this time, the substrate 230 is cut so that the minimum value of the thickness in the third predetermined region A3 of the pasting surface 231 is T3 (T3 <T0). In addition, the pasting surface 231 of the substrate 230 is cut so that the groove 232 has a frame shape that is connected together along each side of the rectangular substrate 230 to form one closed region.

溝２３２の形成後においては、基板２３０の貼付面２３１にマイクロクラックや傷が発生している。これを取り除くため、当該貼付面２３１に対して研磨装置６０でポリッシュ加工を施し研磨する（図３（ｃ）参照）。ここで用いられる研磨剤としては、例えば酸化セリウム、酸化ジルコニウム、酸化アルミニウム等が挙げられる。研磨後においては、基板２３０を洗浄して研磨剤やガラス粉を取り除く。その後、基板２３０に対してイオン交換による強化処理を施す。   After the formation of the groove 232, microcracks and scratches are generated on the pasting surface 231 of the substrate 230. In order to remove this, the affixing surface 231 is polished by the polishing device 60 and polished (see FIG. 3C). Examples of the abrasive used here include cerium oxide, zirconium oxide, and aluminum oxide. After polishing, the substrate 230 is washed to remove the abrasive and glass powder. Thereafter, the substrate 230 is reinforced by ion exchange.

そして、溝２３２が形成された第三所定領域Ａ３全体と該第三所定領域Ａ３に隣接する隣接領域とを含む第一所定領域Ａ１を被覆するように、基板２３０の貼付面２３１に対して印刷を施し、被覆層２３３を形成する（図３（ｄ）参照：被覆層形成工程）。この被覆層形成工程では、基板２３０の貼付面２３１に対してスクリーン印刷を施すことにより被覆層２３３を形成している。また、被覆層２３３が、溝２３２全体に重なるように、貼付面２３１に枠状に印刷を施している。これにより、保護板２３が完成する。このとき、上述の凹部形成工程及び被覆層形成工程において、基板２３０の第一所定領域Ａ１及び第三所定領域Ａ３に含まれる第二所定領域Ａ２と重なる部分における被覆層２３３及び基板２３０の厚さの和の最小値Ｔ２が、基板２３０の第一所定領域Ａ１のうち第三所定領域Ａ３を除く部分における被覆層２３３及び基板２３０の厚さの和Ｔ１よりも小さくなるように、凹部及び被覆層を形成している。   And it prints with respect to the sticking surface 231 of the board | substrate 230 so that the 1st predetermined area | region A1 containing the whole 3rd predetermined area | region A3 in which the groove | channel 232 was formed, and the adjacent area | region adjacent to this 3rd predetermined area | region A3 may be coat | covered. To form a coating layer 233 (see FIG. 3D: coating layer forming step). In this coating layer forming step, the coating layer 233 is formed by performing screen printing on the pasting surface 231 of the substrate 230. In addition, the pasting surface 231 is printed in a frame shape so that the covering layer 233 overlaps the entire groove 232. Thereby, the protective plate 23 is completed. At this time, in the above-described recess forming step and covering layer forming step, the thickness of the covering layer 233 and the substrate 230 in the portion overlapping the second predetermined region A2 included in the first predetermined region A1 and the third predetermined region A3 of the substrate 230. And the coating layer 233 so that the minimum value T2 of the sum of the thicknesses of the substrate 230 is smaller than the sum T1 of the thickness of the coating layer 233 and the substrate 230 in the portion of the first predetermined region A1 excluding the third predetermined region A3. Is forming.

保護板２３が完成すると、基板２３０の貼付面２３１上に、接合シート２２を図示しない貼り付けローラにより貼り合わせる。接合シート２２は、枠状の溝２３２の外周縁２３２ｂによって形成される矩形よりも大きい矩形状であり、貼り合わせ後においては、接合シート２２の外周縁２２ｂの全体が溝２３２の外周縁２３２ｂと被覆層２３３の外周縁２３３ｂとの間に配置されるように設けられる。従って、接合シート２２は、基板２３０のうち被覆層２３３の内周縁２３３ａに囲まれた領域全体と、被覆層２３３のうち被覆層２３３の外周縁２３３ｂを除く領域とを覆うこととなる。   When the protective plate 23 is completed, the bonding sheet 22 is bonded onto the bonding surface 231 of the substrate 230 by a bonding roller (not shown). The bonding sheet 22 has a rectangular shape larger than the rectangle formed by the outer peripheral edge 232b of the frame-shaped groove 232, and after bonding, the entire outer peripheral edge 22b of the bonding sheet 22 is the same as the outer peripheral edge 232b of the groove 232. It is provided so as to be disposed between the outer peripheral edge 233 b of the covering layer 233. Therefore, the bonding sheet 22 covers the entire region of the substrate 230 surrounded by the inner periphery 233a of the coating layer 233 and the region of the coating layer 233 excluding the outer periphery 233b of the coating layer 233.

その後、真空中で、接合シート２２のうち、該接合シート２２に対して保護板２３が配置された側とは反対側の面に、液晶表示パネル２１を貼り合わせる。これにより、接合シート２２が液晶表示パネル２１及び保護板２３の間に介在されて液晶表示パネル２１及び保護板２３を貼り合わせることとなる。これらの接合体に対して、オートクレーブによって加熱加圧処理し、気泡を取り除く。以上の工程によって表示装置１が製造される。   Thereafter, in a vacuum, the liquid crystal display panel 21 is bonded to the surface of the bonding sheet 22 opposite to the side on which the protective plate 23 is disposed with respect to the bonding sheet 22. Thereby, the joining sheet 22 is interposed between the liquid crystal display panel 21 and the protective plate 23 and the liquid crystal display panel 21 and the protective plate 23 are bonded together. These bonded bodies are heated and pressurized by an autoclave to remove bubbles. The display device 1 is manufactured through the above steps.

以上のように本実施形態によれば、基板２３０の第一所定領域Ａ１及び第三所定領域Ａ３に含まれる領域である第二所定領域Ａ２と重なる部分における被覆層２３３及び基板２３０の厚さの和Ｔ２が、基板２３０の第一所定領域Ａ１のうち第三所定領域Ａ３を除く部分における被覆層２３３及び基板２３０の厚さの和Ｔ１よりも小さくなるように、基板２３０の貼付面２３１が形成されているので、接合シート２２を介して表示パネル２１が保護板２３に貼り合わされた場合に、第二所定領域Ａ２と重なる部分において被覆層２３３が接合シート２２を押圧する力を小さくすることができる。これにより、接合シート２２を介して表示パネル２１と保護板２３とが貼り合わされた場合に、被覆層２３３に起因する応力を緩和することができる。   As described above, according to the present embodiment, the thickness of the coating layer 233 and the substrate 230 in the portion overlapping the second predetermined region A2 that is a region included in the first predetermined region A1 and the third predetermined region A3 of the substrate 230. The pasting surface 231 of the substrate 230 is formed so that the sum T2 is smaller than the sum T1 of the thickness of the coating layer 233 and the substrate 230 in the portion of the first predetermined region A1 of the substrate 230 excluding the third predetermined region A3. Therefore, when the display panel 21 is bonded to the protective plate 23 via the bonding sheet 22, the force with which the coating layer 233 presses the bonding sheet 22 in a portion overlapping the second predetermined region A2 can be reduced. it can. Thereby, when the display panel 21 and the protective plate 23 are bonded together via the joining sheet 22, the stress resulting from the coating layer 233 can be relieved.

また、本実施形態によれば、基板２３０の第二所定領域Ａ２と重なる部分における被覆層２３３及び基板２３０の厚さの和が、第三所定領域Ａ３を除く領域における基板２３０の厚さよりも小さくなるように、貼付面２３１が形成されているので、これによっても、接合シート２２を介して表示パネル２１と保護板２３とが貼り合わされた場合に、被覆層２３３に起因する応力を緩和することができる。   Further, according to the present embodiment, the sum of the thicknesses of the coating layer 233 and the substrate 230 in the portion overlapping the second predetermined region A2 of the substrate 230 is smaller than the thickness of the substrate 230 in the region excluding the third predetermined region A3. Thus, since the pasting surface 231 is formed, this also relieves stress caused by the coating layer 233 when the display panel 21 and the protective plate 23 are pasted together via the joining sheet 22. Can do.

また、本実施形態によれば、第三所定領域Ａ３の全体が第一所定領域Ａ１に含まれているので、第二所定領域Ａ２と接合シート２２との間に気泡が介在したとしても、この気泡は被覆層２３３により覆われることとなり、気泡が保護板２３の前側から視認されてしまうことを防止することができる。   Further, according to the present embodiment, since the entire third predetermined area A3 is included in the first predetermined area A1, even if air bubbles are interposed between the second predetermined area A2 and the joining sheet 22, The bubbles are covered with the coating layer 233, and the bubbles can be prevented from being visually recognized from the front side of the protective plate 23.

また、本実施形態によれば、接合シート２２の外周縁が基板２３０の第一所定領域Ａ１に重なっている。また、基板２３０の第一所定領域Ａ１は、全体が繋がった枠状に設けられていて、接合シート２２は、基板２３０の第一所定領域Ａ１が成す枠内の領域全体に重なるように設けられている。いずれの場合も、表示装置１を前側から見たときに接合シート２２の外周縁が見えなくすることで、表示装置１の見栄えを良くすることができる。   Further, according to the present embodiment, the outer peripheral edge of the bonding sheet 22 overlaps the first predetermined region A1 of the substrate 230. Further, the first predetermined area A1 of the substrate 230 is provided in a frame shape in which the whole is connected, and the bonding sheet 22 is provided so as to overlap the entire area in the frame formed by the first predetermined area A1 of the substrate 230. ing. In any case, the appearance of the display device 1 can be improved by making the outer peripheral edge of the bonding sheet 22 invisible when the display device 1 is viewed from the front side.

また、本実施形態によれば、保護板２３の第三所定領域Ａ３は表示パネルの表示エリアに重なる領域よりも外側に設けられているので、表示装置１を前側から見たときの表示エリア内の視認性を低下させることがない。   Further, according to the present embodiment, the third predetermined area A3 of the protection plate 23 is provided outside the area overlapping the display area of the display panel, so that the inside of the display area when the display device 1 is viewed from the front side. The visibility is not reduced.

また、接合シート２２は全体が、一対の透明基板２３０のうち、一方の透明基板２３０の偏光板に重なるように配置されている。即ち、接合シート２２の周縁部が偏光板２１４と透明基板２１２との接合部が露出した偏光板２１４の外周縁に接触しないので、例えば、接合シート２２が劣化して接合シート２２に含まれる化学物質が溶出し、偏光板２１４と透明基板２１２との接合部にまで浸透し、偏光板２１４と透明基板２１２との接合強度を弱めるおそれを低減することができる。
さらに、表示パネル２１と保護板２３との接合が完了した後も弾性を有したままの状態である接合シート（粘着シート）を接合シート２２として用いた場合には、以下の状態が発生するおそれがあった。接合シート２２を個片化する前の接合シート形成用の原シートを準備し、これをカッターなどを用いて切断して個片化すると、切断箇所、即ち、個片化された接合シート２２の周縁部において、その中央部よりも該接合シート２２の厚みが大きくなる場合があった。このような状態の接合シート２２を介在させて表示パネル２１と保護板２３とを接合した場合、接合シート２２の周縁部において特に応力が発生しやすかった。上述の第一の実施の形態によれば、接合シート２２の外周縁２２ｂよりも内側に溝２３２が形成されているので、接合シート２２の周縁部においてその中央部よりも大きくなっている応力を効果的に緩和することができる。
尚、上述の第一の実施の形態においては、接合シート２２の外周縁全体が一方の透明基板２１２の偏光板２１４に重なるように配置されているため、接合シート２２の周縁部においてより一層応力が発生しやすい。このような場合であっても、接合シート２２の外周縁２２ｂよりも内側に溝２３２が形成されているので、接合シート２２の周縁部においてその中央部よりも大きくなっている応力を効果的に緩和することができる。 In addition, the entire bonding sheet 22 is disposed so as to overlap the polarizing plate of one transparent substrate 230 out of the pair of transparent substrates 230. That is, the peripheral portion of the bonding sheet 22 does not contact the outer peripheral edge of the polarizing plate 214 where the bonding portion between the polarizing plate 214 and the transparent substrate 212 is exposed. It is possible to reduce the possibility that the substance elutes and penetrates to the bonding portion between the polarizing plate 214 and the transparent substrate 212 and weakens the bonding strength between the polarizing plate 214 and the transparent substrate 212.
Further, when a bonding sheet (adhesive sheet) that remains elastic after bonding of the display panel 21 and the protective plate 23 is used as the bonding sheet 22, the following state may occur. was there. When the original sheet for forming the joining sheet before the joining sheet 22 is divided into pieces is prepared and cut into pieces by using a cutter or the like, the cut portion, that is, the piece of the joining sheet 22 separated into pieces is obtained. In the peripheral part, the thickness of the joining sheet 22 may be larger than that of the central part. When the display panel 21 and the protective plate 23 are joined with the joining sheet 22 in such a state interposed therebetween, stress is particularly likely to occur at the peripheral portion of the joining sheet 22. According to the first embodiment described above, since the groove 232 is formed on the inner side of the outer peripheral edge 22b of the bonding sheet 22, the stress that is greater at the peripheral edge of the bonding sheet 22 than at the center thereof is applied. Can be effectively mitigated.
In the above-described first embodiment, since the entire outer peripheral edge of the bonding sheet 22 is disposed so as to overlap the polarizing plate 214 of the one transparent substrate 212, more stress is applied to the peripheral edge of the bonding sheet 22. Is likely to occur. Even in such a case, since the groove 232 is formed on the inner side of the outer peripheral edge 22b of the bonding sheet 22, the stress that is larger than the central part at the peripheral edge of the bonding sheet 22 is effectively applied. Can be relaxed.

［第二の実施の形態］
第一の実施の形態では、第三所定領域Ａ３の全体が第一所定領域Ａ１に含まれている場合を例示して説明したが、この第二の実施の形態では、第三所定領域Ａ３の一部が第一所定領域Ａ１外に設けられている場合について説明する。なお、以下の説明において、第一の実施の形態と同一部分においては、同一符号を付してその説明を省略する。 [Second Embodiment]
In the first embodiment, the case where the entire third predetermined area A3 is included in the first predetermined area A1 has been described as an example. However, in the second embodiment, the third predetermined area A3 A case where a part is provided outside the first predetermined area A1 will be described. In the following description, the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

図４は、第二の実施の形態に係る表示装置の概略構成を模式的に示す図であり、図５のIV−IV切断面から見た断面図である。また図５は表示装置の正面図である。これら図４及び図５に示すように、表示装置１Ａに備わる保護板２３Ａが有する基板２３０の貼付面２３１には、当該貼付面２３１を被覆する被覆層２３６が形成されている。被覆層２３６は、液晶表示パネル２１の表示エリア２１ａの周囲を囲み、保護板２３Ａの各辺に沿って全体が繋がって一つの閉鎖領域を形成するように枠状に形成されている。被覆層２３６の内周縁２３６ａは、その全体が、表示エリア２１ａの外側に配置されるとともに、溝２３２と重なるように、即ち、溝２３２の内周縁２３２ａと外周縁２３２ｂとの間に配置されている。一方、被覆層２３６の外周縁２３６ｂは、溝２３２の外周縁２３２ｂよりも外側であって且つ基板２３０の外周縁よりも内側に配置されていて、所定の間隔Ｈ４を空けて基板２３０の外周縁と離間している。
そして、貼付面２３１のうち、被覆層２３６が密着して形成された領域が第一所定領域Ａ１であり、溝２３２が形成されている領域が第三所定領域Ａ３である。第二の実施の形態の場合、第三所定領域Ａ３の一部が第一所定領域Ａ１外に設けられるとともに、第一所定領域Ａ１の内周縁２３６ａ全体が第三所定領域Ａ３と重なるように設けられている。 FIG. 4 is a diagram schematically illustrating a schematic configuration of the display device according to the second embodiment, and is a cross-sectional view taken along the line IV-IV in FIG. 5. FIG. 5 is a front view of the display device. As shown in FIGS. 4 and 5, a covering layer 236 that covers the sticking surface 231 is formed on the sticking surface 231 of the substrate 230 included in the protective plate 23 </ b> A provided in the display device 1 </ b> A. The covering layer 236 surrounds the display area 21a of the liquid crystal display panel 21 and is formed in a frame shape so as to be connected together along each side of the protective plate 23A to form one closed region. The entire inner peripheral edge 236a of the covering layer 236 is disposed outside the display area 21a and overlaps with the groove 232, that is, between the inner peripheral edge 232a and the outer peripheral edge 232b of the groove 232. Yes. On the other hand, the outer peripheral edge 236b of the coating layer 236 is disposed outside the outer peripheral edge 232b of the groove 232 and inside the outer peripheral edge of the substrate 230, and is spaced from the outer peripheral edge of the substrate 230 by a predetermined interval H4. And separated.
And the area | region in which the coating layer 236 closely_contact | adhered and formed among the sticking surfaces 231 is 1st predetermined area | region A1, and the area | region in which the groove | channel 232 is formed is 3rd predetermined area | region A3. In the case of the second embodiment, a part of the third predetermined area A3 is provided outside the first predetermined area A1, and the entire inner peripheral edge 236a of the first predetermined area A1 is provided so as to overlap the third predetermined area A3. It has been.

本実施形態においても、第一の実施の形態と同様、基板２３０の貼付面２３１のうち第一所定領域Ａ１及び第三所定領域Ａ３に含まれる領域である第二所定領域Ａ２と重なる部分における被覆層２３６及び基板２３０の厚さの和の最小値Ｔ２が、基板２３０の第一所定領域Ａ１のうち第三所定領域Ａ３を除く部分における被覆層２３６及び基板２３０の厚さの和Ｔ１よりも小さくなるように、貼付面２３１が形成されている。特に、本実施形態の保護板２３は、基板２３０の貼付面２３１の第二所定領域Ａ２と重なる部分における被覆層２３６及び基板２３０の厚さの和の最小値Ｔ２が、第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも小さくなるように、貼付面２３１が形成されている。   Also in the present embodiment, as in the first embodiment, the covering of the pasting surface 231 of the substrate 230 in a portion overlapping the second predetermined area A2 that is an area included in the first predetermined area A1 and the third predetermined area A3. The minimum value T2 of the sum of the thicknesses of the layer 236 and the substrate 230 is smaller than the sum T1 of the thicknesses of the covering layer 236 and the substrate 230 in the portion of the first predetermined region A1 of the substrate 230 excluding the third predetermined region A3. The sticking surface 231 is formed so that it may become. In particular, the protective plate 23 of the present embodiment is such that the minimum value T2 of the sum of the thicknesses of the coating layer 236 and the substrate 230 in the portion overlapping the second predetermined region A2 of the pasting surface 231 of the substrate 230 is the third predetermined region A3. The pasting surface 231 is formed so as to be smaller than the thickness T0 of the substrate 230 in the excluded region.

接合シート２６の外周縁２６ｂは、被覆層２３６の内周縁２３６ａよりも外側であって且つ溝２３２の外周縁２３２ｂよりも内側に配置されていて、所定の間隔Ｈ７を空けて溝２３２の外周縁２３２ｂと離間している。また、接合シート２６の外周縁２６ｂは基板２３０の第一所定領域Ａ１、第二所定領域Ａ２及び第三所定領域Ａ３のそれぞれに重なっており、第三所定領域Ａ３の一部が接合シート２６の周縁部に重なっている。さらに、接合シート２６は、基板２３０の枠状をなす第一所定領域Ａ１に形成された被覆層２３６によって取り囲まれた閉領域全体に重なっている。   The outer peripheral edge 26b of the bonding sheet 26 is disposed outside the inner peripheral edge 236a of the coating layer 236 and inside the outer peripheral edge 232b of the groove 232, and has an outer periphery of the groove 232 with a predetermined interval H7. 232b. In addition, the outer peripheral edge 26b of the bonding sheet 26 overlaps each of the first predetermined area A1, the second predetermined area A2, and the third predetermined area A3 of the substrate 230, and a part of the third predetermined area A3 is part of the bonding sheet 26. It overlaps the periphery. Further, the bonding sheet 26 overlaps the entire closed region surrounded by the coating layer 236 formed in the first predetermined region A1 that forms the frame shape of the substrate 230.

次に、第二の実施の形態に係る保護板２３Ａの製造方法について説明する。なお、溝２３２を形成するまでの工程は、第一の実施の形態と同工程であるので、ここでは、第一の実施の形態とは異なる被覆層形成工程について説明する。図６は、第二の実施の形態に係る被覆層形成工程を示す説明図である。図６に示すように、被覆層形成工程では、基板２３０の貼付面２３１のうち溝２３２が形成された第三所定領域Ａ３の一部と該第三所定領域Ａ３に隣接する隣接領域とを被覆するように、基板２３０の貼付面２３１に対して印刷を施し、被覆層２３６を形成する。このとき、被覆層２３６が枠状となり、且つ枠状の被覆層２３６の内周縁２３６ａ全体が溝２３２（凹部）に重なるとともに枠状の被覆層２３６の外周縁２３６ｂ全体が溝２３２の外側に配置されるように、貼付面２３１に枠状に印刷を施している。これにより、保護板２３Ａが完成する。   Next, a manufacturing method of the protective plate 23A according to the second embodiment will be described. In addition, since the process until it forms the groove | channel 232 is the same process as 1st Embodiment, the coating layer formation process different from 1st Embodiment is demonstrated here. FIG. 6 is an explanatory view showing a coating layer forming step according to the second embodiment. As shown in FIG. 6, in the covering layer forming step, a part of the third predetermined area A3 in which the groove 232 is formed and the adjacent area adjacent to the third predetermined area A3 are covered in the pasting surface 231 of the substrate 230. As described above, printing is performed on the pasting surface 231 of the substrate 230 to form the covering layer 236. At this time, the coating layer 236 has a frame shape, and the entire inner peripheral edge 236 a of the frame-shaped coating layer 236 overlaps the groove 232 (recess), and the entire outer peripheral edge 236 b of the frame-shaped coating layer 236 is disposed outside the groove 232. As shown, the pasting surface 231 is printed in a frame shape. Thereby, the protective plate 23A is completed.

以上のように、本実施形態によれば、基板２３０の第一所定領域Ａ１及び第三所定領域Ａ３はそれぞれが、全体が繋がった枠状となるように設けられていて、基板２３０の第一所定領域Ａ１の内周縁全体が基板２３０の第三所定領域Ａ３に含まれているので、溝２３２の内側の領域全体を表示エリア２１ａとして使用することが可能となる。このため、同じ平面形状を有する第一の実施の形態で例示した表示装置１と比べると、表示エリア２１ａを広範囲にすることができる。   As described above, according to the present embodiment, the first predetermined region A1 and the third predetermined region A3 of the substrate 230 are provided so as to have a frame shape in which the entirety is connected. Since the entire inner peripheral edge of the predetermined area A1 is included in the third predetermined area A3 of the substrate 230, the entire area inside the groove 232 can be used as the display area 21a. For this reason, compared with the display device 1 exemplified in the first embodiment having the same planar shape, the display area 21a can be widened.

また、本実施形態によれば、接合シート２２の周縁が基板２３０の第三所定領域Ａ３に重なっている。また、接合シート２２の周縁が基板２３０の第二所定領域Ａ２に重なっている。上述の粘着シートを接合シート２２として用いた場合には、接合シート２２の周縁部において特に応力が発生しやすかったが、いずれの場合においても、接合シート２２の周縁部においてその中央部よりも大きくなっている応力を効果的に緩和することができる。   Further, according to the present embodiment, the peripheral edge of the bonding sheet 22 overlaps the third predetermined region A3 of the substrate 230. Further, the periphery of the bonding sheet 22 overlaps the second predetermined area A2 of the substrate 230. When the above-mentioned pressure-sensitive adhesive sheet was used as the bonding sheet 22, stress was particularly likely to occur at the peripheral portion of the bonding sheet 22, but in any case, the peripheral portion of the bonding sheet 22 was larger than the central portion thereof. The stress which has become can be relieved effectively.

なお、本発明は上記実施形態に限らず適宜変更可能である。
例えば、本実施形態では、電子部材である表示パネルとして液晶表示パネル２１を例示して説明したが、表示パネルは透明基板を有する表示パネルであれば如何なるものでもよく、これ以外としては有機ＥＬ表示パネル、プラズマ表示パネル及びフィールドエミッション表示パネル等の自発光型表示パネルや、電子ペーパー等の反射型表示パネルが挙げられる。 Note that the present invention is not limited to the above embodiment, and can be modified as appropriate.
For example, in the present embodiment, the liquid crystal display panel 21 has been described as an example of a display panel that is an electronic member. However, the display panel may be any display panel having a transparent substrate. Examples thereof include self-luminous display panels such as panels, plasma display panels, and field emission display panels, and reflective display panels such as electronic paper.

また、上記実施形態では、保護板２３，２３Ａに覆われる電子部材として、液晶表示パネル２１を例示して説明したが、電子部材はタッチパネルであっても構わない。図７は、第一の実施の形態で例示した表示装置に対してタッチパネルを搭載したものを模式的に示す断面図であり、図８は、第二の実施の形態で例示した表示装置に対してタッチパネルを搭載したものを模式的に示す断面図である。図７及び図８に示すように、表示装置１Ｂ，１Ｃの液晶表示ユニット２ｂ、２ｃには、液晶表示パネル２１と接合シート２２，２６との間にタッチパネル８が介在しており、このタッチパネル８と保護板２３，２３Ａとを接合シート２２，２６がそれぞれ貼り合わせている。タッチパネル８のタッチエリア８ａは、液晶表示パネル２１の表示エリア２１ａとほぼ同じサイズであり、タッチパネル８のタッチエリア８ａのほぼ全体が液晶表示パネル２１の表示エリア２１ａのほぼ全体に重なっている。これにより、タッチエリア８ａは溝２３２に重ならないことになる。即ち、保護板２３，２３Ａの溝２３２はタッチパネル８のタッチエリア８ａに重なる領域よりも外側に設けられている。これにより、本発明を表示装置に適用した際にタッチパネルの性能に影響を及ぼさないようにすることができる。   Moreover, in the said embodiment, although the liquid crystal display panel 21 was illustrated and demonstrated as an electronic member covered with the protective plates 23 and 23A, an electronic member may be a touch panel. FIG. 7 is a cross-sectional view schematically showing a display device mounted with a touch panel on the display device exemplified in the first embodiment, and FIG. 8 shows the display device exemplified in the second embodiment. It is sectional drawing which shows typically what mounted the touch panel. 7 and 8, the liquid crystal display units 2b and 2c of the display devices 1B and 1C have a touch panel 8 interposed between the liquid crystal display panel 21 and the bonding sheets 22 and 26. And the protective plates 23 and 23A are bonded to the bonding sheets 22 and 26, respectively. The touch area 8a of the touch panel 8 is substantially the same size as the display area 21a of the liquid crystal display panel 21, and almost the entire touch area 8a of the touch panel 8 overlaps the almost entire display area 21a of the liquid crystal display panel 21. As a result, the touch area 8 a does not overlap the groove 232. That is, the grooves 232 of the protective plates 23 and 23 </ b> A are provided outside the area overlapping the touch area 8 a of the touch panel 8. Thereby, when the present invention is applied to the display device, it is possible to prevent the performance of the touch panel from being affected.

また、上述した各実施形態の保護板に限らず、図９（ａ）〜（ｄ）、図１０（ａ）〜（ｃ）に示すような形状となるように溝２３２及び被覆層２３３を形成した保護板を各実施形態に適用してもよい。
図９（ａ）に示す第一変形例では、溝２３２が形成された第三所定領域全体にわたって被覆層２３３Ａが形成されており、被覆層２３３Ａのうち電子部材が貼り付けられる側の面の中央部が凹んだ形状となっている。このとき、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ａ及び基板２３０の厚さの和Ｔ１’が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも小さくなるように、貼付面２３１が形成されている。
図９（ｂ）に示す第二変形例では、溝２３２が形成された第三所定領域全体にわたって被覆層２３３Ｂが形成されており、被覆層２３３Ｂのうち電子部材が貼り付けられる側の面が平坦であり、且つ該平坦面と基板２３０の貼付面２３１とが面一となっている。即ち、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｂ及び基板２３０の厚さの和Ｔ１’が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０と同じとなるように、貼付面２３１が形成されている。
図９（ｃ）に示す第三変形例では、溝２３２が形成された第三所定領域の一部に被覆層２３３Ｃが形成されており、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｃ及び基板２３０の厚さの和Ｔ１’が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも小さくなるように、貼付面２３１が形成されている。
図９（ｄ）、図１０（ａ）にそれぞれ示す第四変形例及び第五変形例では、溝２３２が形成された第三所定領域の一部に被覆層２３３Ｄ，２３３Ｅが形成されており、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｄ，２３３Ｅ及び基板２３０の厚さの和Ｔ１’の最大値がそれぞれ、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０と同じになるように、貼付面２３１が形成されている。
上述した第一乃至第五変形例においては、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ａ〜２３３Ｅ及び基板２３０の厚さの和Ｔ１’の最大値が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０と同じであるか又は基板２３０の該厚さＴ０を超えないように、貼付面２３１が形成されているので、接合シート２２の周縁部が被覆層２３３Ａ〜２３３Ｅによって圧迫されることがない。これにより、接合シート２２を介して表示パネル２１と保護板２３とが貼り合わされた場合に、被覆層２３３Ａ〜２３３Ｅに起因する応力を緩和することができる。 Moreover, not only the protective plate of each embodiment mentioned above but the groove | channel 232 and the coating layer 233 are formed so that it may become a shape as shown to Fig.9 (a)-(d) and FIG. The protective plate may be applied to each embodiment.
In the first modification shown in FIG. 9A, the coating layer 233A is formed over the entire third predetermined region where the groove 232 is formed, and the center of the surface of the coating layer 233A on the side where the electronic member is attached is formed. The part has a concave shape. At this time, the sum T1 ′ of the thickness of the covering layer 233A and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is larger than the thickness T0 of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230. A sticking surface 231 is formed so as to be small.
In the second modification shown in FIG. 9B, the coating layer 233B is formed over the entire third predetermined region where the groove 232 is formed, and the surface of the coating layer 233B on which the electronic member is attached is flat. The flat surface and the pasting surface 231 of the substrate 230 are flush with each other. That is, the sum T1 ′ of the thickness of the coating layer 233B and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is the same as the thickness T0 of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230. The sticking surface 231 is formed so that it may become.
In the third modified example shown in FIG. 9C, the coating layer 233C is formed in a part of the third predetermined region where the groove 232 is formed, and the coating layer in a portion overlapping the first predetermined region A1 of the substrate 230. The pasting surface 231 is formed so that the sum T1 ′ of the thickness of 233C and the substrate 230 is smaller than the thickness T0 of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230.
In the fourth modified example and the fifth modified example shown in FIG. 9D and FIG. 10A, the coating layers 233D and 233E are formed in a part of the third predetermined region in which the groove 232 is formed. The maximum value of the sum T1 ′ of the thicknesses of the coating layers 233D and 233E and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is the thickness of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230, respectively. A pasting surface 231 is formed so as to be the same as T0.
In the first to fifth modifications described above, the maximum value of the sum T1 ′ of the thicknesses of the coating layers 233A to 233E and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is the third predetermined value of the substrate 230. Since the pasting surface 231 is formed so as to be the same as the thickness T0 of the substrate 230 in the region excluding the region A3 or not exceeding the thickness T0 of the substrate 230, the peripheral portion of the bonding sheet 22 is the coating layer. There is no pressure by 233A-233E. Thereby, when the display panel 21 and the protective plate 23 are bonded together via the joining sheet 22, the stress resulting from the coating layers 233A to 233E can be relaxed.

さらに、図１０（ｂ）及び（ｃ）に示すような形状となるように溝２３２及び被覆層２３３Ｆ，２３３Ｇを形成してもよい。
図１０（ｂ）に示す第六変形例では、溝２３２が形成された第三所定領域Ａ３の一部と該第三所定領域Ａ３に隣接する隣接領域とに被覆層２３３Ｅが形成されており、被覆層２３３Ｅのうち電子部材が貼り付けられる側の面が平坦になっている。このとき、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｅ及び基板２３０の厚さの和Ｔ１’の最大値が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも大きくなるように、貼付面２３１が形成されている。
図１０（ｃ）に示す第七変形例では、溝２３２が形成された第三所定領域Ａ３の一部に被覆層２３３Ｇが形成されており、上述の第六変形例と同様、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｇ及び基板２３０の厚さの和Ｔ１’の最大値が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも大きくなるように、貼付面２３１が形成されている。
上述した第六及び第七変形例においては、基板２３０の第一所定領域Ａ１と重なる部分における被覆層２３３Ｆ，２３３Ｇ及び基板２３０の厚さの和Ｔ１’の最大値が、基板２３０の第三所定領域Ａ３を除く領域における基板２３０の厚さＴ０よりも大きくなるように、貼付面２３１が形成されていたとしても、第一所定領域Ａ１の縁部が第三所定領域Ａ３と重なるように被覆層２３３Ｆ，２３３Ｇを形成しているので、溝２３２と重なる領域には被覆層２３３Ｆ，２３３Ｇが形成されていない領域が存在することになる。この第三所定領域Ａ３のうち第一所定領域Ａ１を除く部分に接合シート２２の周縁部が配置されることにより、接合シート２２を介して表示パネル２１と保護板２３とが貼り合わされた場合に、被覆層２３３Ｆ，２３３Ｇに起因する応力を緩和することができる。また、上述した第三乃至第五変形例においても、第一所定領域Ａ１の縁部が第三所定領域Ａ３と重なるので、第六及び第七変形例と同様、接合シート２２を介して表示パネル２１と保護板２３とが貼り合わされた場合に、被覆層２３３Ｃ〜２３３Ｅに起因する応力を緩和することができる。 Further, the groove 232 and the covering layers 233F and 233G may be formed so as to have a shape as shown in FIGS.
In the sixth modification shown in FIG. 10B, a coating layer 233E is formed in a part of the third predetermined region A3 in which the groove 232 is formed and an adjacent region adjacent to the third predetermined region A3. The surface of the covering layer 233E on which the electronic member is attached is flat. At this time, the maximum value of the sum T1 ′ of the thickness of the covering layer 233E and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is the thickness of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230. A pasting surface 231 is formed so as to be larger than T0.
In the seventh modified example shown in FIG. 10C, a coating layer 233G is formed in a part of the third predetermined region A3 in which the groove 232 is formed. Similar to the sixth modified example described above, The maximum value of the sum T1 ′ of the thicknesses of the coating layer 233G and the substrate 230 in the portion overlapping the one predetermined region A1 is larger than the thickness T0 of the substrate 230 in the region excluding the third predetermined region A3 of the substrate 230. A pasting surface 231 is formed.
In the sixth and seventh modified examples described above, the maximum value of the sum T1 ′ of the thicknesses of the coating layers 233F and 233G and the substrate 230 in the portion overlapping the first predetermined region A1 of the substrate 230 is the third predetermined value of the substrate 230. Even if the pasting surface 231 is formed so as to be larger than the thickness T0 of the substrate 230 in the region excluding the region A3, the coating layer is formed so that the edge of the first predetermined region A1 overlaps the third predetermined region A3. Since 233F and 233G are formed, a region where the coating layers 233F and 233G are not formed exists in a region overlapping with the groove 232. When the display panel 21 and the protective plate 23 are bonded to each other through the bonding sheet 22 by arranging the peripheral edge portion of the bonding sheet 22 in the third predetermined area A3 excluding the first predetermined area A1. The stress caused by the coating layers 233F and 233G can be relaxed. In the third to fifth modifications described above, since the edge of the first predetermined area A1 overlaps the third predetermined area A3, the display panel is interposed via the joining sheet 22 as in the sixth and seventh modifications. When 21 and the protective plate 23 are bonded together, the stress caused by the coating layers 233C to 233E can be relaxed.

また、上述の凹部形成工程において、切削装置５０を用いてドリル５１で基板２３０の貼付面２３１の一部を切削することで、切削成形前の基板２３０の貼付面２３１に溝２３２を形成したが、上述の溝２３２を形成する方法はこれに限らず、溝２３２を形成する領域を除く領域にマスクを施した状態で、サンドブラスト法により基板２３０を切削してもよいし、また、溝２３２を形成する領域を除く領域にマスクを施した状態で、基板２３０をエッチング液に浸漬することで、基板２３０の貼付面２３１に溝２３２を形成するようにしてもよい。   Moreover, in the above-mentioned recessed part formation process, although the groove | channel 232 was formed in the sticking surface 231 of the board | substrate 230 before cutting shaping | molding by cutting a part of the sticking surface 231 of the board | substrate 230 with the drill 51 using the cutting device 50. FIG. The above-described method for forming the groove 232 is not limited to this, and the substrate 230 may be cut by a sandblasting method in a state where a mask is applied to a region excluding the region where the groove 232 is formed. The groove 232 may be formed on the affixing surface 231 of the substrate 230 by immersing the substrate 230 in an etching solution in a state where a region other than the region to be formed is masked.

また、上記実施形態では、被覆層２３３をスクリーン印刷により形成したが、これに限らず、被覆層２３３を形成する領域を除く領域をマスクで覆ってから、スピンコート法により成形前の被覆層２３３を形成し、被覆層２３３のうち溝２３２に重なる領域を除去することにより、被覆層２３３を形成するようにしてもよい。さらに、いずれの被覆層２３３形成方法においても、被覆層２３３形成後にその一部を除去することで被覆層２３３が所望の形状となるようにしてもよい。   In the above embodiment, the coating layer 233 is formed by screen printing. However, the present invention is not limited to this, and the region excluding the region where the coating layer 233 is formed is covered with a mask, and then the coating layer 233 before being formed by spin coating. The covering layer 233 may be formed by removing the region of the covering layer 233 that overlaps the groove 232. Further, in any method for forming the coating layer 233, the coating layer 233 may have a desired shape by removing a part thereof after the coating layer 233 is formed.

また、上記実施形態では、保護板２３の基板２３０は単に透光性を有する基板であるとしたが、保護板を兼ねるタッチパネルを本発明の保護板２３の基板２３０に適用しても良い。これにより、接合部材を介して表示パネルと保護板を兼ねるタッチパネルとが貼り合わされた場合に、被覆層に起因する応力を緩和することができる。またこのとき、保護板２３，２３Ａの溝２３２はタッチパネル８のタッチエリア８ａに重なる領域よりも外側に設けることにより、本発明を表示装置に適用した際にタッチパネルの性能に影響を及ぼさないようにすることができる。   Moreover, in the said embodiment, although the board | substrate 230 of the protection board 23 was only the board | substrate which has translucency, you may apply the touch panel which serves as a protection board to the board | substrate 230 of the protection board 23 of this invention. Thereby, when the display panel and the touch panel which serves also as a protective plate are bonded together via the joining member, the stress caused by the coating layer can be relaxed. At this time, the grooves 232 of the protective plates 23 and 23A are provided outside the region overlapping the touch area 8a of the touch panel 8, so that the performance of the touch panel is not affected when the present invention is applied to the display device. can do.

また、上記実施形態では、保護板２３，２３Ａは、液晶表示パネル２１における前側の透明基板２１２の外形よりも大きい形状を有するようにそれぞれ形成されるものとしたが、これに限らず、接合シート２２，２６の外形と同じ形状を有するようにそれぞれ形成されていれば良く、または、接合シート２２，２６の外形それよりも大きい形状を有するようにそれぞれ形成されていれば良い。   Moreover, in the said embodiment, although the protective plates 23 and 23A shall be each formed so that it may have a shape larger than the external shape of the transparent substrate 212 of the front side in the liquid crystal display panel 21, it does not restrict to this but a joining sheet | seat The outer shape of the bonding sheets 22 and 26 may be formed so as to have the same shape, or the bonding sheets 22 and 26 may be formed so as to have a larger shape than that of the bonding sheets 22 and 26, respectively.

１ 表示装置
２ 液晶表示ユニット（接合体）
３ 面光源
８ タッチパネル（電子部材）
２１ 液晶表示パネル（電子部材）
２１ａ 表示エリア
２２ 接合シート（接合部材）
２３ 保護板
２１２ 透明基板
２１３ 透明基板
２１４ 偏光板
２１５ 偏光板
２３０ 基板
２３１ 貼付面
２３２ 溝（凹部）
２３３、２３６ 被覆層
Ａ１ 第一所定領域
Ａ２ 第二所定領域
Ａ３ 第三所定領域
Ｔ０ 第三所定領域を除く領域における基板の厚さ
Ｔ１ 第一所定領域のうち第三所定領域を除く部分における被覆層及び基板の厚さの和
Ｔ１’ 第一所定領域における被覆層及び基板の厚さの和
Ｔ２ 第一所定領域及び第三所定領域に含まれる領域である第二所定領域と重なる部分における被覆層及び基板の厚さの和の最小値
Ｔ３ 第三所定領域Ａ３における基板の厚さの最小値 1 Display device 2 Liquid crystal display unit (joint)
3 Surface light source 8 Touch panel (electronic member)
21 Liquid crystal display panel (electronic component)
21a Display area 22 Joining sheet (joining member)
23 protective plate 212 transparent substrate 213 transparent substrate 214 polarizing plate 215 polarizing plate 230 substrate 231 sticking surface 232 groove (concave portion)
233, 236 Covering layer A1 First predetermined region A2 Second predetermined region A3 Third predetermined region T0 Thickness of substrate in region excluding third predetermined region T1 Covering layer in portion excluding third predetermined region in first predetermined region And the sum of the thickness of the substrate T1 ′ the sum of the coating layer and the thickness of the substrate in the first predetermined region T2 and the coating layer in the portion overlapping the second predetermined region which is the region included in the first predetermined region and the third predetermined region; Minimum value of the sum of the substrate thicknesses T3 Minimum value of the substrate thicknesses in the third predetermined region A3

Claims (23)

接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域及び前記第三所定領域に含まれる領域である第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記貼付面が形成されていることを特徴とする保護板。 A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The sticking surface of the substrate has a first predetermined region covered by a coating layer covering the sticking surface, and a third predetermined region including a part of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the coating layer and the substrate in a portion overlapping the second predetermined region which is a region included in the first predetermined region and the third predetermined region of the substrate is the first predetermined region of the substrate. The protective plate, wherein the sticking surface is formed so as to be smaller than the sum of the thicknesses of the covering layer and the substrate in a portion excluding the third predetermined region. 請求項１記載の保護板において、
前記基板の前記第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記貼付面が形成されていることを特徴とする保護板。 The protection plate according to claim 1,
The affixing surface is formed such that the sum of the thickness of the covering layer and the substrate in a portion overlapping the second predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region. A protective plate characterized by being made. 接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の厚さよりも小さくなるように、前記貼付面が形成されていることを特徴とする保護板。 A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The affixing surface of the substrate has a first predetermined region covered by a covering layer that covers the affixing surface, and a third predetermined region including the entire first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the covering layer and the substrate in a portion overlapping the first predetermined region of the substrate is the same as the thickness of the substrate in a region excluding the third predetermined region of the substrate, or of the substrate The protective plate, wherein the affixing surface is formed so as to be smaller than the thickness. 接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含む保護板であって、
前記基板の前記貼付面は、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部又は全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記第一所定領域の縁部が前記第三所定領域と重なることを特徴とする保護板。 A protective plate including a substrate having a pasting surface to which an electronic member is pasted via a joining member,
The affixing surface of the substrate has a first predetermined region covered by a coating layer that covers the affixing surface, and a third predetermined region including a part or the whole of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The protective plate according to claim 1, wherein an edge of the first predetermined region overlaps the third predetermined region. 請求項１〜４のいずれか一項に記載の保護板において、
前記基板の前記第一所定領域及び前記第三所定領域はそれぞれが、全体が繋がった枠状となるように設けられていて、
前記基板の前記第三所定領域全体が前記第一所定領域に含まれていることを特徴とする保護板。 In the protection board as described in any one of Claims 1-4,
Each of the first predetermined region and the third predetermined region of the substrate is provided so as to have a frame shape in which the whole is connected,
The protective plate according to claim 1, wherein the entire third predetermined area of the substrate is included in the first predetermined area. 請求項１〜４のいずれか一項に記載の保護板において、
前記基板の前記第一所定領域及び前記第三所定領域はそれぞれが、全体が繋がった枠状となるように設けられていて、
前記基板の前記第一所定領域の内周縁全体が前記基板の前記第三所定領域に含まれていることを特徴とする保護板。 In the protection board as described in any one of Claims 1-4,
Each of the first predetermined region and the third predetermined region of the substrate is provided so as to have a frame shape in which the whole is connected,
The protective plate according to claim 1, wherein an entire inner peripheral edge of the first predetermined region of the substrate is included in the third predetermined region of the substrate. 請求項１〜５のいずれか一項に記載の保護板において、
前記基板はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられていることを特徴とする保護板。 In the protection board as described in any one of Claims 1-5,
The substrate is a touch panel having a touch area;
The third predetermined region of the substrate is provided outside the region overlapping the touch area of the touch panel. 接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域及び前記第三所定領域に含まれる領域である第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記貼付面が形成された保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体。 Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The application surface of the substrate has a first predetermined region covered with a coating layer covering the application surface, and a third predetermined region including a part of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the coating layer and the substrate in a portion overlapping the second predetermined region which is a region included in the first predetermined region and the third predetermined region of the substrate is the first predetermined region of the substrate. A protective plate on which the affixing surface is formed so as to be smaller than the sum of the thickness of the covering layer and the substrate in the portion excluding the third predetermined region,
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
The joined body, wherein an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate. 接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の厚さよりも小さくなるように、前記貼付面が形成された保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体。 Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The pasting surface of the substrate has a first predetermined region covered by a coating layer that covers the pasting surface, and a third predetermined region including the entire first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
The sum of the thicknesses of the covering layer and the substrate in a portion overlapping the first predetermined region of the substrate is the same as the thickness of the substrate in a region excluding the third predetermined region of the substrate, or of the substrate A protective plate on which the pasting surface is formed, so as to be smaller than the thickness;
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
The joined body, wherein an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate. 接合部材を介して電子部材が貼り付けられる貼付面を有する基板を含み、
前記基板の前記貼付面が、該貼付面を被覆する被覆層によって被覆された第一所定領域と、前記第一所定領域の一部又は全体を含む第三所定領域とを有し、
前記基板の前記第三所定領域における前記基板の厚さが、前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように、前記基板の前記貼付面が形成されていて、
前記第一所定領域の縁部が前記第三所定領域と重なる保護板と、
前記電子部材と、
前記電子部材及び前記保護板の間に介在されて前記電子部材及び前記保護板を貼り合わせるシート状の接合部材とを備え、
前記接合部材の外周縁が前記基板の前記第一所定領域に重なっていることを特徴とする接合体。 Including a substrate having a pasting surface to which an electronic member is pasted via a joining member;
The pasting surface of the substrate has a first predetermined region covered by a coating layer that covers the pasting surface, and a third predetermined region including a part or the whole of the first predetermined region,
The attachment surface of the substrate is formed such that the thickness of the substrate in the third predetermined region of the substrate is smaller than the thickness of the substrate in a region excluding the third predetermined region,
A protective plate in which an edge of the first predetermined region overlaps the third predetermined region;
The electronic member;
A sheet-like joining member that is interposed between the electronic member and the protective plate and bonds the electronic member and the protective plate;
The joined body, wherein an outer peripheral edge of the joining member overlaps the first predetermined region of the substrate. 請求項８〜１０のいずれか一項に記載の接合体において、
前記接合部材の周縁が前記基板の前記第三所定領域に重なっていることを特徴とする接合体。 In the joined body according to any one of claims 8 to 10,
A joined body, wherein a peripheral edge of the joining member overlaps the third predetermined region of the substrate. 請求項８記載の接合体において、
前記接合部材の周縁が前記基板の前記第二所定領域に重なっていることを特徴とする接合体。 The joined body according to claim 8,
A joined body, wherein a peripheral edge of the joining member overlaps the second predetermined region of the substrate. 請求項８〜１２のいずれか一項に記載の接合体において、
前記基板の前記第一所定領域は、全体が繋がった枠状に設けられていて、
前記接合部材は、前記基板の前記第一所定領域が成す枠内の領域全体に重なるように設けられていることを特徴とする接合体。 In the joined body according to any one of claims 8 to 12,
The first predetermined region of the substrate is provided in a frame shape that is connected to the whole,
The joined member is provided so as to overlap an entire region in a frame formed by the first predetermined region of the substrate. 請求項８〜１３のいずれか一項に記載の接合体において、
前記電子部材は表示エリアを有する表示パネルであり、
前記保護板の前記第三所定領域は前記表示パネルの表示エリアに重なる領域よりも外側に設けられていることを特徴とする接合体。 In the joined body according to any one of claims 8 to 13,
The electronic member is a display panel having a display area,
The joined body, wherein the third predetermined region of the protection plate is provided outside a region overlapping the display area of the display panel. 請求項１４記載の接合体において、
前記基板はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられていることを特徴とする接合体。 The joined body according to claim 14, wherein
The substrate is a touch panel having a touch area;
The joined body, wherein the third predetermined area of the substrate is provided outside an area overlapping with a touch area of the touch panel. 請求項１４又は１５記載の接合体において、
前記表示パネルは、一対の透明基板間に液晶が封止され、該一対の透明基板の各外面に偏光板が貼り付けられた液晶表示パネルであり、
前記接合部材は全体が、前記一対の透明基板のうち、一方の透明基板の前記偏光板に重なるように配置されていることを特徴とする接合体。 The joined body according to claim 14 or 15,
The display panel is a liquid crystal display panel in which liquid crystal is sealed between a pair of transparent substrates, and a polarizing plate is attached to each outer surface of the pair of transparent substrates,
The joined member is disposed so that the entire joining member overlaps the polarizing plate of one of the pair of transparent substrates. 請求項８〜１２のいずれか一項に記載の接合体において、
前記電子部材はタッチエリアを有するタッチパネルであり、
前記基板の前記第三所定領域は前記タッチパネルのタッチエリアに重なる領域よりも外側に設けられていることを特徴とする接合体。 In the joined body according to any one of claims 8 to 12,
The electronic member is a touch panel having a touch area,
The joined body, wherein the third predetermined area of the substrate is provided outside an area overlapping with a touch area of the touch panel. 一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に一部が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記凹部形成工程及び前記被覆層形成工程において、前記基板の前記第一所定領域及び前記第三所定領域に含まれる第二所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第一所定領域のうち前記第三所定領域を除く部分における前記被覆層及び前記基板の厚さの和よりも小さくなるように、前記凹部及び前記被覆層を形成することを特徴とする保護板の製造方法。 A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer covering the first predetermined region in a first predetermined region partially included in the third predetermined region of the substrate after the recess forming step;
In the concave portion forming step and the covering layer forming step, the sum of the thicknesses of the covering layer and the substrate in a portion overlapping the second predetermined region included in the first predetermined region and the third predetermined region of the substrate, The recess and the coating layer are formed so as to be smaller than the sum of the thickness of the coating layer and the substrate in a portion of the first predetermined region of the substrate excluding the third predetermined region. Manufacturing method of protective plate. 請求項１８記載の保護板の製造方法において、
前記被覆層形成工程は、前記基板の前記第三所定領域に隣接する隣接領域を被覆するように前記被覆層を形成することを含むことを特徴とする保護板の製造方法。 In the manufacturing method of the protection board of Claim 18,
The covering layer forming step includes forming the covering layer so as to cover an adjacent region adjacent to the third predetermined region of the substrate. 一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に全体が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記凹部形成工程及び前記被覆層形成工程において、前記基板の前記第一所定領域と重なる部分における前記被覆層及び前記基板の厚さの和が、前記基板の前記第三所定領域を除く領域における前記基板の厚さと同じであるか又は前記基板の該厚さよりも小さくなるように、前記凹部及び前記被覆層を形成することを特徴とする保護板の製造方法。 A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer that covers the first predetermined region in a first predetermined region that is entirely included in the third predetermined region of the substrate after the recess forming step;
In the recess forming step and the covering layer forming step, the sum of the thickness of the covering layer and the substrate in the portion overlapping the first predetermined region of the substrate is the region in the region excluding the third predetermined region of the substrate. A method of manufacturing a protective plate, comprising forming the recess and the covering layer so as to be the same as a thickness of the substrate or smaller than the thickness of the substrate. 一対の主面の間に所定の厚みを有する基板の該一対の主面のうち一方の主面の第三所定領域に、前記基板の該第三所定領域における前記基板の厚さが、前記基板の前記第三所定領域を除く領域における前記基板の厚さよりも小さくなるように凹部を形成する凹部形成工程と、
前記凹部形成工程の後、前記基板の前記第三所定領域に一部又は全体が含まれる第一所定領域に該第一所定領域を被覆する被覆層を形成する被覆層形成工程とを含み、
前記被覆層形成工程において、前記第一所定領域の縁部が前記第三所定領域と重なるように前記被覆層を形成することを特徴とする保護板の製造方法。 A thickness of the substrate in the third predetermined region of the substrate is equal to a third predetermined region of one main surface of the pair of main surfaces of the substrate having a predetermined thickness between the pair of main surfaces. Forming a recess so as to be smaller than the thickness of the substrate in the region excluding the third predetermined region,
A coating layer forming step of forming a coating layer that covers the first predetermined region in a first predetermined region that is partially or wholly included in the third predetermined region of the substrate after the recess forming step;
In the covering layer forming step, the covering layer is formed so that an edge portion of the first predetermined region overlaps the third predetermined region. 請求項１８〜２１のいずれか一項に記載の保護板の製造方法において、
前記凹部形成工程は、前記基板の前記第三所定領域を切削して又はエッチングして溝を形成することを含むことを特徴とする保護板の製造方法。 In the manufacturing method of the protection board as described in any one of Claims 18-21,
The method for manufacturing a protection plate, wherein the recess forming step includes cutting or etching the third predetermined region of the substrate to form a groove. 請求項１８〜２２のいずれか一項に記載の保護板の製造方法において、
前記被覆層形成工程は、前記基板の前記一方の主面に対して被覆材をスクリーン印刷又はスピンコートを施すことにより前記被覆層を形成することを含むことを特徴とする保護板の製造方法。 In the manufacturing method of the protection board as described in any one of Claims 18-22,
The covering layer forming step includes forming the covering layer by screen-printing or spin-coating a covering material on the one main surface of the substrate.
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