JP2012006047A - Jet stream type soldering apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attempt to raise yield and to achieve cost reduction by improving soldering performance regardless of the difference of soldering density and simplifying a dross removing and cleaning operation.SOLUTION: Only by appropriately sliding a movable metal plate 24 to a fixed metal plate 21, the sizes of hole parts 26 as a primary jetting nozzles 16' can be simply changed. Therefore, as the degree of density of parts to be soldered becomes larger on the substrate 2, the movable metal plate 24 is slid so as to make the hole parts 26 smaller, and by jetting the solder on the substrate 2 from the hole parts 26, it can respond also to soldering with a high density easily. In addition, on the contrary, by widening the hole parts 26, the dross attached on the hole parts 26 can be easily removed and cleaned.

Description

  The present invention relates to a jet-type soldering apparatus including a primary jet nozzle and a secondary jet nozzle, and more particularly to a jet-type soldering apparatus that improves solderability in a primary jet nozzle.

  As this type of jet soldering device, for example, Patent Document 1 discloses a primary jet nozzle in which a primary jet portion and a secondary jet portion are arranged in order along the substrate transport direction, and a large number of openings are formed in the primary jet portion. A method is disclosed in which melted solder is jetted to solder a substrate passing above.

  In another Patent Document 2, a slit-like jet port is formed between two jet plates, and a plurality of arc-shaped concave portions are arranged at the jet port side end of each jet plate to form sub-jet holes, The vertical and horizontal positions of the jet plate are adjusted, and solder erupts from the ridge-shaped main ridge formed by the solder erupting from the fountain and adjacent to the main ridge. Thus, there is disclosed a technique for changing a large number of sub-tops formed into various shapes.

  FIG. 5 shows an example of a general jet soldering apparatus. In the figure, reference numeral 1 denotes a solder bath body in which a transport path S for a substrate 2 to be soldered in the horizontal direction is formed. Inside the solder bath body 1, a substrate is disposed from the upstream of the transport path S. 2, a preheating zone 11 serving as a preheating portion for preheating, a jet solder zone 12 serving as a jet soldering portion for soldering the solder surface (lower surface) of the preheated substrate 2, and a substrate on which soldering has been performed. The cooling zone 13 serving as a cooling unit for lowering the temperature 2 is arranged side by side. The jet solder zone 12 is provided with a primary jet nozzle 16 corresponding to the primary jet part and a secondary jet nozzle 17 corresponding to the secondary jet part. The primary jet nozzle 16 is used for soldering even a minute portion of the substrate 2, and the secondary jet nozzle 17 is provided at the subsequent stage of the primary jet nozzle 16, for example, an undesirable solder bridge attached to the substrate 2. This is to correct the above and finish the soldering.

  6 and 7 are a plan view and a front view of the primary jet nozzle 16, respectively. As shown in each of these drawings, the primary jet nozzle 16 has a structure in which a large number of holes 22 are opened in a single metal plate 21, and molten solder jets from each hole 22, which is on the transport path S. The soldering is performed by hitting the soldering surface of the substrate 2 in FIG.

JP 2006-80439 A JP-A-8-148820

  In the above prior art, the dimensions of the solder jet holes 22 of the primary jet nozzle 16 installed in the jet soldering apparatus are fixed and fixed (about φ4 to 5 mm). Adjustment to a size suitable for the density of components mounted on the substrate 2 cannot be made.

  In general, the higher the soldering density, the smaller the diameter of the hole 22 is better. However, in order to change the size of the hole 22 in accordance with the soldering density, a solder tank (in which molten solder is stored ( (Not shown), the primary jet nozzle 16 must be replaced with a metal plate 21 having holes 22 of different diameters, which is not easy. For this reason, the solderability of the primary jet nozzle 16 is usually determined and improved through trial and error, such as the diameter, shape, number, and arrangement of the holes 22. However, since the soldering density of the substrate 2 transported to the transport path S is not constant, the diameter of the hole 22 once determined tends to cause a decrease in quality due to an increase in soldering failure.

  Further, when the size of the hole 22 is reduced corresponding to the substrate 2 having a high soldering density, dross which is an oxide of molten solder is likely to be clogged in the hole 22, which causes further deterioration of the soldering quality. Furthermore, lead-free solder used in recent years is more prone to dross than conventional lead-containing solder, and it is necessary to frequently remove and clean the dross manually.

  Accordingly, in view of the above problems, the present invention is a jet type solder that can improve the soldering performance and simplify the dross removal cleaning operation regardless of the difference in soldering density, thereby improving the yield and reducing the cost. It is an object to provide an attaching device.

  In order to achieve the above object, the present invention comprises a primary jet part having a plurality of holes, and a secondary jet part, and attaches the solder jetted from the holes of the primary jet part to the object. In the jet-type soldering apparatus that finishes the solder attached to the object in the secondary jet part, the primary jet part includes a fixed material and a movable material provided slidably with respect to the fixed material. The fixing member is provided with a plurality of first holes, the moving member is provided with a second hole corresponding to each of the first holes, and the first hole and the second hole The overlapping portion is formed as the hole portion whose size changes according to the position of the moving material.

  In this case, when the actuator for sliding the moving material and the object do not exist at a position facing the primary jet part, the size of the hole is maximized, while the object is It is preferable to further include a control unit that operates the actuator so that the size of the hole portion corresponds to the object when present at a position facing the primary jet portion.

  In addition, the apparatus further includes a sensor that detects the position of the object and reads the size of the hole suitable for the object from the object, and the control unit detects from the sensor. It is preferable that the actuator is operated in response to a signal.

  According to the present invention, it is possible to easily change the size of the hole as the primary jet part by simply sliding the moving material with respect to the fixed material. The higher the degree, the easier it is to handle high-density soldering and widen the hole by sliding the moving material so that the hole is smaller and jetting solder from the hole to the object. Thus, the dross attached to the hole can be easily removed and cleaned. As a result, regardless of the difference in soldering density, it is possible to improve the soldering performance and simplify the dross removal cleaning operation, thereby improving the yield and reducing the cost.

  Also, depending on whether or not the object is in a position facing the primary jet part, the control unit can operate the actuator and slide the moving material to an appropriate position, so that the operator can Even without an operation of changing the size, it is possible to automatically perform the soldering corresponding to the object and the cleaning operation for removing the dross.

  Furthermore, the sensor can not only detect the position of the object, but also read the size of the hole suitable for the object, so even for various objects with different soldering densities, Soldering at a density suitable for each object can be performed, and dross removal and cleaning can be performed automatically.

It is a top view which shows the primary jet nozzle of the jet-type soldering apparatus in one Example of this invention. It is a front view of a primary jet nozzle same as the above. It is a top view of the principal part containing the primary jet nozzle of FIG. 1 same as the above. It is a front view of the state which shifted the movement metal plate with respect to the fixed metal plate same as the above. It is a front view of the conventional general jet-type soldering apparatus. It is a top view of a primary jet nozzle same as the above. It is a front view of a primary jet nozzle same as the above.

  Hereinafter, preferred embodiments of a jet soldering apparatus according to the present invention will be described with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to a common part with a prior art example, and description is abbreviate | omitted as much as possible in order to avoid duplication about a common location.

  1 and 2 show the structure of the primary jet nozzle 16 'proposed in this embodiment. In each of these drawings, reference numeral 21 denotes a fixed metal plate conventionally provided as the primary jet nozzle 16 '. As described above, a plurality of holes 22 are formed in the fixed metal plate 21. In the present embodiment, another movable metal plate 24 is additionally superimposed on the upper surface of the fixed metal plate 21 at a fixed position below the transport path S to constitute a two-layer primary jet nozzle 16 ′. . The moving metal plate 24 is formed with holes 25 having the same shape as the holes 22 corresponding to the holes 22 of the fixed metal plate 21, and the overlapping portions of the holes 22 and 25 are made of molten solder. It becomes the hole part 26 of primary jet nozzle 16 'which can pass.

  The structure of the moving metal plate 24 will be further described. The vertical thickness ta of the moving metal plate 24 is smaller than the thickness tb of the fixed metal plate 21. This is because once the molten solder that has passed through the hole 22 is squeezed from a solder tank (not shown) below the fixed metal plate 21, it spreads again and diffuses when it passes through the hole 25 of the moving metal plate 24. This is to prevent adhesion to the solder surface of the substrate 2 in the state. The thickness ta of the moving metal plate 24 is made thinner than the thickness tb of the fixed metal plate 21, and the conveyance path S of the substrate 2 is brought closer to each hole 22 of the fixed metal plate 21 that is an inlet for molten solder. As a result, it is possible to prevent quality deterioration due to diffusion of the molten solder after passing through the hole 22.

  The moving metal plate 24 has the same shape as that of the fixed metal plate 21 when viewed on a plane, and is provided on the fixed metal plate 21 so as to be slidable. As a result, the size of all the holes 26 of the primary jet nozzle 16 ′ changes uniformly. When the positions of the holes 25 of the movable metal plate 24 coincide with the holes 22 of the fixed metal plate 21, the diameter D1 of the hole portion 26 serving as the primary jet nozzle 16 'is maximized. In this embodiment, each of the twelve holes 22 and 25 is arranged in three rows orthogonal to the transport direction of the substrate 2. However, the number of the holes 22 and 25 and the number per row are appropriately changed. Alternatively, the holes 22 and 25 may be arranged in a staggered manner, for example. Furthermore, each hole 22 and 25 may be, for example, an elliptical shape, a rectangular shape or a polygonal shape other than a circular shape, and the sizes thereof may not be the same but may be different.

  FIG. 3 is a plan view showing the configuration of the primary jet nozzle 16 'and its periphery. In the figure, reference numeral 31 denotes an actuator for sliding the movable metal plate 24 in the horizontal direction. Here, a support piece 32 fixedly attached to both sides of the movable metal plate 24 and its movable portion 33 support it. An air cylinder 34 connected to the piece 32 and a solenoid 35 for controlling the air pressure to the air cylinder 34 are configured. Among them, the air cylinder 34 serving as a driving source for the sliding operation may alternatively use an electric motor (motor) or an electromagnetic valve. The solenoid 35 operates in response to a drive signal from a control unit 36 described later, whereby the movable unit 33 of the air cylinder 34 expands and contracts, so that the movable metal plate 24 is transported on the fixed metal plate 21 to the substrate 2. It is possible to perform a sliding operation along the direction.

  The control unit 36 determines whether or not to send a drive signal to the solenoid 35 in accordance with a detection signal from the sensor 41 or an operation signal from the operation unit 42. Specifically, for example, the sensor 41 or the operation unit 42 including an input / output interface connected to 42, a storage unit for storing a program, and an arithmetic processing unit (none of which is shown) that executes a function as the control unit 36 according to a program read from the storage unit. Consists of a computer. The sensor 41 as a detection unit detects the position of the substrate 2 on the transport path S. Here, the substrate 2 is transported to a position facing the primary jet nozzle 16 ′, and a bar attached to the substrate 2 is mounted. When the sensor 44 reads the code 44, a detection signal is sent from the sensor 41 to the control unit 36.

  In the barcode 44 attached to the substrate 2, information relating to the soldering density on the substrate 2 is encoded and embedded, and a detection signal including the information is sent from the sensor 41 to the control unit 36. Is done. Therefore, the control unit 36 receives the detection signal from the sensor 41 and not only the substrate 2 is positioned opposite to the primary jet nozzle 16 ′ but also the soldering density of the substrate 2. Can be recognized. The sensor 41 of this embodiment uses a non-contact type optically reading the barcode 44. For example, a switch that is turned on and off according to the transport position of the substrate 2 and the soldering density is used. A contact sensor may be used.

  When the detection signal is sent from the sensor 41, that is, when the substrate 2 is at a position facing the primary jet nozzle 16 ′, the control unit 36 makes each hole of the fixed metal plate 21 by a drive signal sent to the solenoid 35. As shown in FIG. 4, the diameter D2 of the hole portion 26 as the primary jet nozzle 16 ′ is made smaller than the maximum diameter D1. The function of operating the movable portion 33 of the air cylinder 34 is provided. The diameter D2 of each hole 26 here can be freely changed according to the information regarding the soldering density included in the detection signal. That is, when the soldering density on the substrate 2 is high, the control unit 36 increases the shift amount of the movable metal plate 24 so that the upper and lower holes 22 and 25 coincide with each other as the primary jet nozzle 16 ′. In the case where the diameter D2 is reduced and the soldering density on the substrate 2 is low, the shift amount of the moving metal plate 24 is reduced, and the diameter D2 of the hole 26 as the primary jet nozzle 16 ′ is increased. On the contrary, at the timing other than the soldering at which the detection signal is not sent from the sensor 41, the control unit 36 does not shift right above the fixed metal plate 21 by the drive signal sent to the solenoid 35 as shown in FIG. The movable metal plate 24 is moved, and the movable portion 33 of the air cylinder 34 is operated so that the diameter D1 of the hole portion 26 serving as the primary jet nozzle 16 ′ is maximized. The dross attached to 25 can be easily discharged.

  Returning to FIG. 3 again, the control unit 36 receives an operation signal from the operation unit 42 in addition to the presence or absence of the detection signal from the sensor 41, sends a drive signal to the solenoid 35, and moves on the fixed metal plate 21. It also has a function of operating the movable portion 33 of the air cylinder 34 so as to move the metal plate 24 to an appropriate position. Therefore, in this embodiment, the shifting operation of the moving metal plate 24 is performed not only by the detection signal from the sensor 41 and the program of the control unit 36 that executes processing based on the detection signal, but also by a manual operation using the operation unit 42. It becomes possible to respond in real time. The remaining structure of the jet-type soldering apparatus is as shown in FIG.

  Next, the operation of the above configuration will be described. As shown in FIG. 5, the substrate S moving along the direction of the arrow on the transport path S first passes through the preheating zone 11 and is preheated to a predetermined temperature, and then enters the next jet solder zone 12. . In the jet solder zone 12, as shown in FIG. 3, when the substrate 2 on the transport path S moves immediately above the primary jet nozzle 16 ′, a barcode 44 formed in advance on the non-soldered portion of the substrate 2 The sensor 41 connected to the control unit 36 faces. Here, the sensor 41 reads information regarding the soldering density on the substrate 2 from the barcode 44 and sends a detection signal including the information to the control unit 36.

  When the control unit 36 receives the detection signal from the sensor 41, the control unit 36 determines a shift amount of the movable metal plate 24 with respect to the fixed metal plate 21 from information included in the detection signal, and outputs a drive signal corresponding to the shift amount to the solenoid. Then, the movable part 33 of the air cylinder 34 is operated. In this case, the higher the soldering density on the substrate 2 is, the larger the shift amount of the moving metal plate 24 is, so that the diameter D2 of the hole 26 as the primary jet nozzle 16 ′ is decreased. The lower the attachment density, the smaller the shift amount of the moving metal plate 24 and the larger the diameter D2 of the hole 26 as the primary jet nozzle 16 ′. When the diameter D2 of the hole 26 of the primary jet nozzle 16 ′ reaches a desired size, the molten solder jetted from the lower side of the primary jet nozzle 16 ′ through the communicating portions of the holes 22 and 25 is on the transport path S. Soldering is performed on the solder surface of the substrate 2, but here the primary jet nozzle 16 'can be freely changed to a diameter D2 suitable for various component mounting densities, so that the quality of soldering to the substrate 2 is improved. And cost reduction.

  When the main soldering to the substrate 2 is completed through the primary jet nozzle 16 ', the substrate 2 is transferred to the subsequent secondary jet nozzle 17 where the soldering finish is performed. The finished substrate 2 is transferred from the secondary jet nozzle 17 to the cooling zone 13 and cooled there, and a series of operations as the jet soldering apparatus is completed.

  In the above-described series of operations, when the substrate 2 is not present on the primary jet nozzle 16 ′ and the detection signal is not sent from the sensor 41 to the control unit 36, there is no deviation immediately above the fixed metal plate 21. The moving part 33 of the air cylinder 34 can be operated by the control part 36 so that the moving metal plate 24 is moved and the diameter D1 of the hole part 26 as the primary jet nozzle 16 ′ is maximized. In this way, the primary jet nozzle 16 'automatically maximizes the diameter D1 of the hole 26 at a timing other than soldering, and the dross attached to the holes 22 and 25 can be easily discharged. Simplification can improve yield and reduce costs at the same time.

  Further, in this embodiment, the control unit 36 can change the shift amount of the movable metal plate 24 with respect to the fixed metal plate 21 also by an operation signal from the operation unit 42. In this case, for example, each time the operation unit 42 is pressed, the sliding direction of the moving metal plate 24 is switched, and the control unit 36 increases the sliding amount of the moving metal plate 24 as the pressing time becomes longer. The movable part 33 may be operated.

  As described above, in the present embodiment, the primary jet nozzle 16 ′ as the primary jet part having the plurality of holes 26 and the secondary jet nozzle 17 as the secondary jet part separately from the primary jet nozzle 16 ′. The solder jetted from the hole of the primary jet nozzle 16 ′ is attached to the solder surface of the substrate 2 that is the object to be soldered, and the solder attached to the substrate 2 at the secondary jet 17 is In the jet-type soldering apparatus that performs correction and finishes, the primary jet nozzle 16 ′ includes a fixed metal plate 21 as a fixed material, and a movable metal as a moving material provided to be slidable relative to the fixed metal plate 21. The fixed metal plate 21 is provided with a plurality of holes 22 as first holes, and the movable metal plate 24 is provided with a hole 25 as a second hole corresponding to each hole 22. , Holes 22 and 25 overlap Min, is formed as a hole 26 of a size (dimension in diameter) primary jet nozzle 16 which varies' depending on the position of the moving metal plate 24.

  In this case, the size of the hole 26 as the primary jet nozzle 16 ′ can be easily changed by simply sliding the movable metal plate 24 relative to the fixed metal plate 21. Therefore, the higher the density of components to be soldered to the substrate 2, the higher the density of the moving metal plate 24 is slid so as to make the hole 26 smaller and the solder is jetted from the hole 26 to the substrate 2. In addition, it is possible to easily cope with soldering, and by expanding the hole 26, dross attached to the hole 26 can be easily removed and cleaned. As a result, regardless of the difference in soldering density, it is possible to improve the soldering performance and simplify the dross removal cleaning operation, thereby improving the yield and reducing the cost.

  Further, in the above configuration, in this embodiment, when the actuator 31 for sliding the movable metal plate 24 and the substrate 2 are not present at positions facing the primary jet nozzle 16 ′, the size of the hole 26 is maximized. On the other hand, when the substrate 2 is present at a position facing the primary jet nozzle 16 ′, the control unit 36 that operates the actuator 31 so that the size of the hole 26 corresponds to the substrate 2 is further provided. I have.

  In this case, the control unit 36 can operate the actuator 31 to slide the movable metal plate 24 to an appropriate position depending on whether or not the substrate 2 is at a position facing the primary jet nozzle 16 ′. Even if the person does not need to change the size of the hole 26 one by one, it is possible to automatically perform soldering corresponding to the substrate 2 and removing and cleaning the dross.

  Further, in this embodiment, the position of the board 2 is detected, and the size of the hole 26 suitable for the board 2 is used as information on the soldering density on the board 2 as an identifier provided on the board 2. A sensor 41 that reads from the code 44 is further provided, and the control unit 36 receives the detection signal from the sensor 41 and the actuator 31 that slides the moving metal plate 24 and the substrate 2 face the primary jet nozzle 16 ′. When there is no position, the size of the hole 26 is maximized, while when the substrate 2 exists at a position facing the primary jet nozzle 16 ′, the size of the hole 26 corresponds to the substrate 2. The actuator 31 is operated so as to be a thing.

  That is, the sensor 41 not only detects the position of the substrate 2 but also can read the size of the hole 26 suitable for the substrate 2, so that it can be used with various substrates 2 having different soldering densities. Even in such a case, it is possible to perform soldering at a density suitable for each substrate 2 and automatically perform dross removal and cleaning work.

  The present invention is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present invention. In the embodiment, the substrates 2 are sent to the primary jet nozzle 16 'one by one along the transport path S. However, a plurality of substrates 2 may be sent to the primary jet nozzle 16' at the same time. Further, the fixed metal plate 21 and the movable metal plate 24 do not have to be a metal plate, but may be any one that functions as a fixed material and a movable material, respectively.

2 Substrate (object)
16 'Primary jet nozzle (primary jet part)
17 Secondary jet nozzle (secondary jet section)
21 Fixed metal plate (fixing material)
22 holes (1st hole)
24 Moving metal plate (moving material)
25 holes (second hole)
26 Hole 31 Actuator 36 Control Unit 41 Sensor

Claims (3)

A primary jet part having a plurality of holes, and a secondary jet part,
In the jet type soldering apparatus for attaching the solder jetted from the hole of the primary jet part to the object, and finishing the solder attached to the object in the secondary jet part,
The primary jet part is composed of a fixed material and a moving material provided to be slidable with respect to the fixed material,
The fixing member is provided with a plurality of first holes, and the moving member is provided with second holes corresponding to the first holes,
The jet soldering apparatus is characterized in that an overlapping portion of the first hole and the second hole is formed as the hole portion whose size changes depending on the position of the moving material. An actuator for sliding the moving material;
When the object does not exist at a position facing the primary jet part, the size of the hole is maximized, while the object exists at a position facing the primary jet part. The jet soldering device according to claim 1, further comprising a control unit that operates the actuator so that a size of the hole portion corresponds to the object. A sensor for detecting the position of the object and reading the size of the hole suitable for the object from the object;
The jet flow soldering device according to claim 2, wherein the control unit receives the detection signal from the sensor and operates the actuator.

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