JP2011249987A - Dielectric resonance component, and mounting structure using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dielectric resonance component capable of improving environmental resistance of a ceramic dielectric block and excellent in electric characteristics.SOLUTION: A dielectric resonance component 1 comprises a functional electronic component 2, a metal cover 3, and a cylindrical shield conductor 4. The functional electronic component 2 includes a dielectric block 21, a plurality of through holes 22, an internal conductor 23, an external conductor 24, a coupling electrode 25, an input and output electrode 26, and an input and output terminal 27. The metal cover 3 has a first portion 31 attached to the functional electronic component 2 and connected to the external conductor 24, and a second portion 32 in which a cut-out portion 33 located at a distance from a first face 21a of the dielectric block 21 to pass the input and output terminal 27 is formed. The shield conductor 4 is disposed so as to surround a portion of the input and output terminal 27 extending further to a distance than the second portion 32 of the metal cover 3. One fringe part of the shield conductor 4 is electrically connected to the metal cover 3.

Description

  The present invention relates to a dielectric resonant component including functional electronic components such as a dielectric filter and a dielectric duplexer formed by forming a plurality of resonators in a dielectric block, and a mounting formed by mounting the dielectric resonant component on a mounting substrate. Concerning the structure.

  Dielectric filters and dielectric duplexers, which are functional electronic components used in mobile communication devices such as mobile phones, use a dielectric block and are integrated into a plurality of resonators. Is often used.

  When such a functional electronic component is mounted on a mounting board, surface mounting by soldering or the like is used as described in Patent Document 1.

  However, in recent years, there has been a demand for higher performance in mobile communication devices, particularly those for base stations. Accordingly, functional electronic components used in mobile communication devices are also required to have higher performance. For this purpose, a method of improving the performance of functional electronic components by increasing the number of resonators to be built and increasing the size of the dielectric block can be considered.

  However, when such a large functional electronic component is used, for example, by being surface-mounted by soldering on a resin mounting board, the coefficient of linear expansion between the ceramic dielectric block and the resin mounting board is different. For example, there is a problem that stress is applied to the mounting portion due to a change in use environment such as a temperature change, and the solder or ceramic dielectric block breaks.

  In order to solve such a problem and improve the environmental resistance of the functional electronic component using the ceramic dielectric block, the dielectric block is not directly mounted on the mounting substrate, but Patent Documents 2 and 3 As described in the above, a method has been devised in which a metal case or a metal cover having a joining protrusion is attached to a dielectric block and mounted on a mounting substrate via the metal case or metal cover. In this method, for example, a hermetic seal type lead terminal attached to a metal cover is used as an output terminal, one end of which is connected to an input / output electrode formed in a dielectric block, and the other end is Connected to the mounting board.

JP-A-6-164207 JP-A-7-202516 JP 7-254804 A

  However, as described in Patent Documents 2 and 3, a dielectric resonant component is composed of a functional electronic component using a dielectric block and a metal case or metal cover, and the dielectric resonant component is mounted on a mounting substrate. In this method, although the environmental resistance of the ceramic dielectric block is improved, there is a gap between the metal case or the metal cover and the mounting substrate, so that the lead terminal is exposed outside the metal cover, so that radio waves are not emitted. There was a problem that leakage and electrical characteristics, particularly attenuation characteristics deteriorated.

  An object of the present invention is to provide a dielectric resonant component that can improve the environmental resistance of a ceramic dielectric block and has good electrical characteristics, and a mounting structure using the dielectric resonant component.

According to the present invention, the object as described above is achieved.
A dielectric block having first and second surfaces opposite to each other; a plurality of through holes formed in the dielectric block from the first surface to the second surface; An inner conductor formed on the inner surface of the hole, an outer conductor formed on the outer surface of the dielectric block excluding the first surface, and extends from the inner conductor on the first surface and corresponds to the through hole A coupling electrode that couples the resonators formed with each other, an input / output electrode that is formed on the first surface and is coupled to any one of the resonators, and is joined to the input / output electrode and the first surface An input / output terminal extending so as to protrude from the functional electronic component,
A first portion attached to the functional electronic component and connected to an outer conductor of the functional electronic component is separated from the first surface so as to face the first surface of the dielectric block. A metal cover having a second portion that is positioned and formed with a cut-out portion through which the input / output terminal is inserted;
A dielectric resonant component comprising:
The dielectric resonant component includes a cylindrical shield conductor disposed so as to surround the input / output terminal portion extending farther than the second portion of the metal cover when viewed from the first surface of the dielectric block. A dielectric resonant component, wherein one end edge of the shield conductor is electrically connected to the metal cover;
Is provided.

  In one aspect of the present invention, the shield conductor has a plurality of slit portions in the side surface portion. In one embodiment of the present invention, an interval between the shield conductor and the input / output terminal is 1 mm or more and 5 mm or less, and a length of the shield conductor is 0.5 mm or more and 10 mm or less. Furthermore, in one aspect of the present invention, the metal cover has a plurality of protrusions extending farther than the second portion when viewed from the first surface of the dielectric block.

Furthermore, according to the present invention, the object as described above is achieved.
A mounting structure in which the above-described dielectric resonant component is mounted on a mounting board,
The mounting substrate has a wiring connection terminal portion formed on a surface located opposite to the second portion of the metal cover of the dielectric resonant component,
The wiring connection terminal portion is composed of an input / output signal wiring connection terminal and a ground wiring connection terminal.
The input / output terminal portion of the dielectric resonant component is connected to the input / output signal wiring connection terminal, and the other edge portion of the shield conductor of the dielectric resonant component is connected to the ground wiring connection terminal. Mounting structure of dielectric resonant component characterized by
Is provided.

  In one aspect of the present invention, the metal cover of the dielectric resonant component has a plurality of protrusions extending farther than the second portion when viewed from the first surface of the dielectric block, and the mounting substrate Has holes for inserting the input / output terminals of the dielectric resonant component and the plurality of protrusions, respectively, and the input / output terminals and the protrusions of the dielectric resonant component inserted into the holes. Is bonded to the mounting substrate. In one aspect of the present invention, the protrusion of the dielectric resonant component inserted into the hole is connected to the ground wiring connection terminal.

  According to the present invention, the cylindrical shield conductor surrounding the input / output terminals has one end edge portion electrically connected to the metal cover and the other end edge portion electrically connected to the ground wiring connection terminal of the mounting board. Therefore, even if there is a gap between the metal cover and the mounting substrate, there is provided a dielectric resonant component that does not leak radio waves and has high performance and good environmental resistance, and a mounting structure using the dielectric resonant component.

1 is a schematic exploded perspective view of an embodiment of a dielectric resonant component according to the present invention. FIG. 2 is a schematic exploded perspective view showing an embodiment of a mounting structure according to the present invention using the dielectric resonant component of FIG. 1. It is a fragmentary sectional view of the mounting structure of FIG. FIG. 3 is a perspective view of input / output terminals of a dielectric resonant component used in the mounting structure of FIG. 2. It is a perspective view of the shield conductor used with the mounting structure of FIG. It is a perspective view which shows the modification of a shield conductor. It is a perspective view which shows the modification of a shield conductor. FIG. 6 is a schematic exploded perspective view of still another embodiment of a dielectric resonant component according to the present invention. It is a figure which shows the frequency characteristic of a dielectric material duplexer. It is a figure which shows the frequency characteristic of a dielectric material duplexer.

[First Embodiment]
FIG. 1 is a schematic exploded perspective view of an embodiment of a dielectric resonant component according to the present invention. FIG. 2 is a schematic exploded perspective view showing an embodiment of a mounting structure according to the present invention using this dielectric resonant component. FIG. 3 is a partial cross-sectional view of this mounting structure. FIG. 4 is a perspective view of input / output terminals of a dielectric resonant component used in this mounting structure. FIG. 5 is a perspective view of a shield conductor used in this mounting structure.

  The dielectric resonant component 1 of the present embodiment includes a functional electronic component 2 and a metal cover 3 attached by being connected to the functional electronic component 2 by soldering or the like. In the present embodiment, the functional electronic component 2 constitutes a four-stage dielectric filter made using one dielectric block.

The functional electronic component 2 includes a rectangular parallelepiped dielectric block 21. As a material of the dielectric block 21, for example, an alumina ceramic mainly composed of Al ₂ O ₃ and having a relative dielectric constant ε _r of about 13 can be used. The dielectric block 21 has a first surface 21a and a second surface 21b located on opposite sides.

  The functional electronic component 2 also includes a plurality of through holes 22 formed in the dielectric block 21 from the first surface 21a to the second surface 21b. The functional electronic component 2 also includes an inner conductor 23 formed on the inner surface of the through hole 22. The functional electronic component 2 also includes an outer conductor 24 formed on the outer surface of the dielectric block 21 excluding the first surface 21a. The functional electronic component 2 also includes a coupling electrode 25 that extends from the inner conductor 23 on the first surface 21 a and couples the quarter-wave resonators formed corresponding to the through holes 22. The functional electronic component 2 also includes an input / output electrode 26 formed on the first surface 21a and coupled to one of the resonators. The functional electronic component 2 also includes an input / output terminal 27 joined to the input / output electrode 26 and extending so as to protrude from the first surface 21a.

  As shown in FIG. 4, the input / output terminal 27 includes a conductive line 8X1, a metal shell 8X2 disposed so as to surround the conductive line 8X1 at a required position in the longitudinal direction, and the metal shell 8X2 and the conductive line. It consists of the glass-type insulating part 8X3 filled between 8X1.

  The metal cover 3 is positioned so as to be separated from the first surface 31 so as to face the first portion 31 connected to the outer conductor 24 of the functional electronic component 2 and the first surface 21 a of the dielectric block 21. Second portion 32. The second portion 32 and the first portion 31 are orthogonal to each other, and therefore the metal cover 3 has a generally channel shape. The second portion 32 is formed with a cutout portion 33 through which the input / output terminal 27 of the functional electronic component 2 is inserted. The metal shell 8 </ b> X <b> 2 of the input / output terminal 27 is connected to the inner edge of the opening that forms the cutout portion 33 of the metal cover 3 by soldering or the like. That is, the input / output terminal 27 is a hermetic seal type lead pin terminal. The metal cover 3 further includes four protrusions 34 extending farther than the second portion 32 when viewed from the first surface 21 a of the dielectric block 21. The material of the metal cover 3 is, for example, an iron-based alloy, but is not limited to this, and may be a conductor.

  The dielectric resonant component 1 further has a cylindrical shape arranged so as to surround a portion of the input / output terminal 27 extending far from the second portion 32 of the metal cover 3 when viewed from the first surface 21 a of the dielectric block 21. The shield conductor 4 is provided. One end edge portion 41 of the shield conductor 4 is connected to the vicinity of the inner end edge portion of the opening that forms the cutout portion 33 of the metal cover 3 by soldering or the like. It is connected to the. As a material of the shield conductor 4, for example, a copper-based alloy is used. However, the material is not limited to this, and any conductor may be used. The distance A between the shield conductor 4 and the conductive wire 8X1 of the input / output terminal 27 is preferably 1 mm or more from the viewpoint of improving the assembly stability, and is preferably 5 mm or less from the viewpoint of improving the stability of the electrical characteristics. The length B of the shield conductor 4 is preferably 0.5 mm or more from the viewpoint of enhancing the effectiveness of stress relaxation, and is preferably 10 mm or less from the viewpoint of enhancing the stability of electrical characteristics.

  The mounting structure 10 of the present embodiment is obtained by mounting the dielectric resonant component 1 as described above on a mounting substrate 5.

  The mounting substrate 5 has a wiring connection terminal portion 51 on the surface thereof. The wiring connection terminal portion 51 is positioned to face the second portion 32 of the metal cover 3. The wiring connection terminal portion includes an input / output signal wiring connection terminal 51a and a ground wiring connection terminal 51b.

  As shown in FIG. 3, the input / output terminal portion 27 is connected to the input / output signal wiring connection terminal 51a of the mounting substrate 5 by soldering or the like. Further, the other end edge portion 42 of the shield conductor 4 is connected to the ground wiring connection terminal 51b by soldering or the like.

  The mounting board 5 has holes 52 and 53 for inserting the input / output terminals 27 and the plurality of protrusions 34, respectively. The input / output terminal portion 27 inserted into the holes 52 and 53 and the protruding portion 34 of the metal cover 3 are joined to the mounting substrate 5. By this bonding, the functional electronic component 2 is more firmly connected to the mounting substrate 5. By adopting such a structure, even if there is a gap between the metal cover 3 and the mounting substrate 5, the presence of the shield conductor 4 can prevent radio wave leakage, and the high-performance dielectric resonant component 1 And the mounting structure 10 is provided.

  6 and 7 show modifications of the shield conductor 4.

  In the modified example of FIG. 6, the shield conductor 4 is provided with flanges on both one and the other end edges 41 and 42. You may attach a flange only to one edge part. By attaching the flange, the shield conductor 4, the metal cover 3, and the mounting substrate 5 are more reliably joined, and the shielding effect is further enhanced.

  In the modification of FIG. 7, the shield conductor 4 is provided with a plurality of slits S in the length direction from the side surface portion to one end edge portion 41. The shielding effect is maintained by setting the dimension of the slit S to be equal to or less than the wavelength of the cutoff frequency. Since the shield conductor 4 of this modification is provided with slits on the side surfaces, the dielectric resonant component 1 is configured by using the shield conductor 4, so that the stress applied to the mounting portion is more affected by the usage environment such as temperature change. Provided are a dielectric resonant component that is relaxed and has better environmental resistance, and a mounting structure thereof. In this modification, the flange portion may be connected to the metal cover 3 or to the mounting substrate 5. Moreover, you may attach | subject a flange to both the one edge parts 41 and 42 of the other side.

  In addition, as a method of connecting (fitting) the metal cover 3 to the functional electronic component 2, the first portion 31, that is, the central portion in the longitudinal direction of the two side surface portions is recessed in addition to the solder bonding as described above. With the shape (convex shape toward the dielectric block 21), the metal cover 3 can be firmly bonded to the functional electronic component 2 by caulking.

  Further, the metal cover 3 can further include protrusions (blades) at both ends of the second portion 32 so as to be orthogonal to the first portion 31. This protrusion touches the outer conductor 24 on the two end faces of the dielectric block. Thereby, the metal cover 3 and the functional electronic component 2 can be combined more firmly.

[Second Embodiment]
FIG. 8 is a schematic exploded perspective view of still another embodiment of the dielectric resonant component according to the present invention. In FIG. 8, the same code | symbol is attached | subjected to the member or part which has a function similar to the thing in FIGS.

  In the present embodiment, the functional electronic component 2 constitutes a dielectric transmission / reception duplexer built using one dielectric block. In this dielectric duplexer, the dielectric resonant component 1 has three input / output terminals 27.

  The dielectric duplexer has a 5-stage transmission filter section Tx and a 5-stage reception filter section Rx. The basic configuration of the transmission filter unit Tx and the reception filter unit Rx is the same as that of the first embodiment. However, the input / output electrode 26 and the input / output terminal (common terminal) 27 common to the transmission filter unit Tx and the reception filter unit Rx are located between the transmission filter unit Tx and the reception filter unit Rx.

  The dielectric block 21 has a length L of, for example, about 8 mm, a width W of, for example, about 74 mm, and a height H of, for example, about 16 mm.

  The metal cover 3 of the dielectric resonant component 1 of the present embodiment is provided with five protrusions 34 for joining with the mounting substrate, but is not limited to this.

  In the present embodiment, the input / output terminal 27 includes three terminals: a transmission input terminal, a reception output terminal, and a common terminal. These input / output terminals are hermetic seals as in the first embodiment. Pins are used. Similarly to the first embodiment, each of the transmission input terminal, the reception output terminal, and the common terminal is connected to the output electrode 26 including one end of the transmission input electrode, the reception output electrode, and the common electrode. The other end is inserted into a hole provided in the mounting substrate and joined by, for example, soldering.

  9 and 10 show frequency characteristics of the dielectric duplexer according to the second embodiment (FIG. 8). The shield conductor 4 is the same as that shown in FIG. 5, the distance A between the shield conductor 4 and the conductive wire 8X1 of the input / output terminal 27 is 2.5 mm, and the length B of the shield conductor 4 is 1 mm. . FIG. 9 shows frequency characteristics of the transmission filter unit Tx, and FIG. 10 shows frequency characteristics of the reception filter unit Rx. Here, the characteristic according to the present embodiment is indicated by X, and the characteristic when the shield conductor 4 is not provided is indicated by Y for comparison. From comparison of these figures, it can be seen that when the shield conductor 4 is provided, the leakage of radio waves is reduced and a high attenuation filter characteristic can be obtained.

DESCRIPTION OF SYMBOLS 1 Dielectric resonant component 2 Functional electronic component 21 Dielectric block 21a 1st surface 21b 2nd surface 22 Through-hole 23 Inner conductor 24 Outer conductor 25 Coupling electrode 26 Input / output electrode 27 Input / output terminal 8X1 Conductive wire 8X2 Metal shell 8X3 Glass-based insulating part 3 Metal cover 31 First part 32 Second part 33 Cut part 34 Projection part 4 Shield conductor 41 One end edge part 42 The other edge part 5 Mounting substrate 51 Wiring connection terminal part 51a Input / output Signal wiring connection terminal 51b Ground wiring connection terminals 52, 53 Hole 10 Mounting structure S Slit Tx Transmission filter Rx Reception filter

Claims (7)

A dielectric block having first and second surfaces opposite to each other; a plurality of through holes formed in the dielectric block from the first surface to the second surface; An inner conductor formed on the inner surface of the hole, an outer conductor formed on the outer surface of the dielectric block excluding the first surface, and extends from the inner conductor on the first surface and corresponds to the through hole A coupling electrode that couples the resonators formed with each other, an input / output electrode that is formed on the first surface and is coupled to any one of the resonators, and is joined to the input / output electrode and the first surface An input / output terminal extending so as to protrude from the functional electronic component,
A first portion attached to the functional electronic component and connected to an outer conductor of the functional electronic component is separated from the first surface so as to face the first surface of the dielectric block. A metal cover having a second portion that is positioned and formed with a cut-out portion through which the input / output terminal is inserted;
A dielectric resonant component comprising:
The dielectric resonant component includes a cylindrical shield conductor disposed so as to surround the input / output terminal portion extending farther than the second portion of the metal cover when viewed from the first surface of the dielectric block. A dielectric resonant component comprising: a shield conductor, wherein one end edge portion of the shield conductor is electrically connected to the metal cover.   The dielectric resonant component according to claim 1, wherein the shield conductor has a plurality of slit portions on a side surface portion.   The dielectric according to claim 1 or 2, wherein a distance between the shield conductor and the input / output terminal is 1 mm or more and 5 mm or less, and a length of the shield conductor is 0.5 mm or more and 10 mm or less. Resonant component.   4. The metal cover according to claim 1, wherein the metal cover has a plurality of protrusions extending farther than the second portion when viewed from the first surface of the dielectric block. 5. Dielectric resonant component. A mounting structure formed by mounting the dielectric resonant component according to claim 1 on a mounting substrate,
The mounting substrate has a wiring connection terminal portion formed on a surface located opposite to the second portion of the metal cover of the dielectric resonant component,
The wiring connection terminal portion is composed of an input / output signal wiring connection terminal and a ground wiring connection terminal.
The input / output terminal portion of the dielectric resonant component is connected to the input / output signal wiring connection terminal, and the other edge portion of the shield conductor of the dielectric resonant component is connected to the ground wiring connection terminal. A dielectric resonant component mounting structure characterized by the above. The metal cover of the dielectric resonant component has a plurality of protrusions extending farther than the second portion when viewed from the first surface of the dielectric block,
The mounting board has holes for inserting the input / output terminals of the dielectric resonant component and the plurality of protrusions,
6. The dielectric resonant component mounting structure according to claim 5, wherein an input / output terminal and a protruding portion of the dielectric resonant component inserted into the hole are joined to the mounting substrate.   7. The dielectric resonant component mounting structure according to claim 6, wherein a protruding portion of the dielectric resonant component inserted into the hole is connected to the ground wiring connection terminal.

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