JP2011249468A - Film capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration of insulation resistance of film in a film capacitor.SOLUTION: The film capacitor (10) includes a capacitor element (15) housed in a capacitor case (11). A metallized film (16) in which a metal film (18) is formed on a surface of a film (17) is wound around the capacitor element (15) and a metallikon (19) is connected to each width directional end of the wound metallized film (16). The film capacitor (10) further includes epoxide resin (12) filled in the capacitor case (11), and a solder coating (25) provided between the metallikon (19) and the epoxide resin (12) to prevent volatile solution from passing from the epoxide resin (12) to the capacitor element (15).

Description

    The present invention relates to a film capacitor, and particularly relates to measures for preventing a decrease in insulation resistance of a film.

    Conventionally, a film capacitor (a) shown in FIG. 9 is known. This film capacitor (a) is configured by accommodating a capacitor element (b) in a case (c).

    As shown in FIG. 10, the capacitor element (b) is a metallized film made of a dielectric film, and metallicons (d, d) are deposited on both ends of the wound metallized film in the left-right direction. I am letting. The lead terminals (e, e) are joined to the metallicons (d, d) by solder (f, f).

    The film capacitor (a) is configured by housing the capacitor element (b) in the case (c) and filling the case (c) with epoxy resin (g) or urethane resin (h). Yes. The epoxy resin (g) or the urethane resin (h) covers the periphery of the capacitor element (b), thereby preventing the capacitor element (b) from being hygroscopically deteriorated.

    By the way, as shown in Patent Document 1, the film used for the film capacitor (a) described above is made of a material such as polyvinylidene fluoride (PVDF) having a high relative dielectric constant. As a method for producing this high dielectric constant film, there is known a method (so-called coating method or cast method) in which a film material is dissolved in a solvent, applied, and dried to form a thin film. In the production of a film by the above coating method, since a polymer material or a high dielectric constant material is dissolved in a solvent to form a paint, a step of drying and removing the solvent after coating is essential.

JP 59-104911 A

    However, although the solvent contained in the film is volatilized by drying, minute voids are generated in the portion where the solvent is removed from the film (the portion where the solvent is volatilized). On the other hand, the epoxy resin (g) described above contains a volatile solvent, a reaction product, and the like. Since these substances pass through the metallicon (e, e) as shown in FIG. 11, the solvent and the reaction product enter the inside of the capacitor element (b). And in a capacitor | condenser element (b), a solvent and a reaction product enter into the space | gap which is an internal defect of a film. Since the solvent and the reaction product have low electric resistance, there is a problem that the leakage current of the film increases and the insulation resistance is lowered.

    This invention is made | formed in view of such a point, and it aims at resin-encapsulating a capacitor element, preventing the fall of the insulation resistance of a film.

    In the present invention, in the capacitor case (11), a metal blocking portion (25) is provided between the metallicon (19, 19) and the sealing member (12, 13).

    The first invention is a capacitor case (11) and a metallized film member (16) housed in the capacitor case (11) and having an electrode film (18) formed on the surface of the film member (17). And a capacitor element (15) configured by connecting electrode members (19, 19) to both ends in the width direction of the wound metallized film member (16), and the capacitor case ( 11) A film capacitor comprising a sealing member (12, 13) filled in and covering the capacitor element (15), wherein the sealing member (12, 13) and each electrode member ( 19) with each electrode member (19) being melted and bonded to the electrode member (19), made of a metal material, and blocking the entry from the sealing member (12, 13) to the capacitor element (15) Part (25).

    In the first invention, the metallized film member (16) having the electrode film (18) formed on the surface of the film member (17) is wound, and the both ends of the wound metallized film member (16) are wound. A capacitor element (15) configured by connecting electrode members (19, 19) is used.

    The capacitor case (11) accommodates the capacitor element (15), and is filled with sealing members (12, 13) so as to cover the periphery of the capacitor element (15). The sealing members (12, 13) cover the periphery of the capacitor element (15), thereby preventing moisture in the air from entering the capacitor element (15).

    Then, between each electrode member (19, 19) and the sealing member (12, 13), the blocking portion (25) made of a metal material is melted and bonded to each electrode member (19, 19). ing. An intruder (for example, a sealing member) from the sealing member (12, 13) to the capacitor element (15) through the electrode member (19, 19) by melting and bonding to the electrode member (19, 19) Volatile substances and reaction products). Inside the capacitor element (15), intruders (for example, volatile substances and reaction products contained in the sealing members (12, 13)) do not enter the voids inside the film member (17). There is no increase factor of leakage current of member (17), and insulation resistance does not decrease.

    Further, since the blocking portion (25) is melt-bonded to the electrode members (19, 19), heat transfer to the capacitor element (15) is alleviated. Thereby, a metal material having a melting point higher than that of the film member (17) can be used as the material of the blocking portion (25).

    In a second aspect based on the first aspect, the blocking section (25) is configured to block entry of a volatile substance or a reaction product into the capacitor element (15).

    In the second aspect of the invention, the blocking portion (25) prevents volatile substances and reaction products from entering the capacitor element (15). As a result, volatile substances and reaction products do not enter the voids inside the film member (17) inside the capacitor element (15), so there is no increase in the leakage current of the film member (17). Insulation resistance does not decrease.

    According to a third aspect of the present invention, in the first or second aspect of the invention, the blocking portion (25) is such that the temperature transmitted to the film member (17) through the electrode member (19) is the melting point of the film member (17). It is made of a metal material having a lower melting point.

    In the third aspect, the blocking portion (25) is melted and bonded to the electrode member (19, 19). The heat of the blocking portion (25) melted at the time of adhesion is transmitted to the film member (17) of the capacitor element (15) through the electrode member (19). At this time, the heat transferred from the blocking portion (25) to the film member (17) through the electrode member (19) is lower than the melting point of the film member (17).

    According to a fourth invention, in any one of the first to third inventions, the blocking portion (25) is made of a metal material whose melting point is lower than that of the film member (17). .

    In the fourth aspect of the invention, the blocking portion (25) is melted and bonded to the electrode member (19, 19). The heat of the blocking portion (25) melted at the time of bonding is transferred to the film member (17) of the capacitor element (15) through the electrode member (19). Since the melting point of the blocking part (25) is lower than the melting point of the film member (17), the film member (17) is not deformed by the heat of the blocking part (25).

    In a fifth aspect based on any one of the first to fourth aspects, the blocking portion (25) is made of solder.

    In the fifth aspect of the invention, the blocking portion (25) is made of solder. The blocking part (25) made of this solder blocks the entry of volatile substances and reaction products into the capacitor element (15). Inside the capacitor element (15), volatile substances and reaction products do not enter the voids inside the film member (17), so there is no increase in leakage current of the film member (17), and there is no insulation resistance. It does not decline.

    In a sixth aspect based on any one of the first to fifth aspects, each of the electrode members (19, 19) is made of a metallicon.

    In the sixth aspect of the invention, each electrode member (19, 19) is made of metallicon. Metallicons that make up the electrode member (19, 19) have a low structural density, so that intrusions from the sealing member (12, 13) to the capacitor element (15) (for example, volatile substances contained in the sealing member) And reaction products). However, since the blocking portion (25) covers the electrode member (19, 19) made of metallicon, the intruder does not enter the capacitor element (15) via the electrode member (19, 19).

    According to the first aspect of the present invention, since the blocking portion (25) is fused and bonded to each electrode member (19, 19), the capacitor element (12, 13) is passed through the electrode member (19). It is possible to prevent intruders (for example, volatile substances and reaction products contained in the sealing member) from entering the interior of 15). Thereby, it is possible to prevent the intruder from entering the void inside the film member (17) constituting the capacitor element (15). As a result, since there is no increase factor of the leakage current of the film member (17), it is possible to reliably prevent the insulation resistance from being lowered.

    Further, since the blocking portion (25) is provided between the electrode member (19) and the sealing member (12, 13), the sealing member (12, 13) can be used without covering the entire surface of the capacitor element (15). It is possible to prevent intruders (for example, volatile substances and reaction products contained in the sealing member) from entering the capacitor element (15) through the electrode member (19). As a result, the amount of metal used for the blocking portion (25) can be reduced.

    Furthermore, since the electrode member (19, 19) is interposed between the blocking part (25) and the capacitor element (15), heat from the blocking part (25) is prevented from being directly transferred to the capacitor element (15). can do. Thereby, it is possible to prevent the film member (17) from being thermally deformed.

    According to the second aspect of the present invention, since the coating is formed of the metal that blocks volatile substances and reaction products, the inside of the capacitor element (15) from the sealing member (12, 13) through the electrode member (19). It is possible to prevent volatile substances and reaction products from entering. Thereby, it is possible to prevent the intruder from entering the void inside the film member (17) constituting the capacitor element (15). As a result, it is possible to reliably prevent the insulation resistance of the film member (17) from decreasing.

    According to the third aspect of the invention, the temperature of the heat transmitted to the film member (17) through the electrode member (19) through the metal material constituting the blocking portion (25) is lower than the melting point of the film member (17). Therefore, when the blocking portion (25) is melt bonded to the electrode member (19), the film member (17) can be reliably prevented from being thermally deformed.

    According to the fourth invention, since the melting point of the blocking part (25) is lower than the melting point of the film member (17), the film member is used when the blocking part (25) is melt bonded to the electrode member (19). (17) can be reliably prevented from being thermally deformed.

    According to the fifth aspect of the invention, since the blocking part (25) is made of solder, it is possible to reliably prevent volatile substances and reaction products from passing through the blocking part (25). That is, it is possible to prevent the volatile substance and reaction product contained in the sealing member (12, 13) from entering the capacitor element (15). Thereby, it is possible to prevent the intruder from entering the void inside the film member (17) constituting the capacitor element (15). As a result, since there is no increase factor of the leakage current of the film member (17), it is possible to reliably prevent the insulation resistance from being lowered.

    Further, since the blocking portion (25) is made of solder, the blocking portion (25) can be easily formed with solder between the sealing member (12, 13) and the electrode member (19).

    According to the sixth aspect, since the electrode member (19) is made of metallicon, the electrodes can be easily formed at both ends in the width direction of the wound metallized film member (16).

1 is a schematic cross-sectional view showing a film capacitor according to Embodiment 1. FIG. 1 is a schematic cross-sectional view showing a capacitor element according to Embodiment 1. FIG. 1 is a schematic perspective view showing a metallized film according to Embodiment 1. FIG. It is a figure which shows the solder material example which comprises the solder film which concerns on Embodiment 1. FIG. (A) is a graph showing the comparison of the insulation resistance value of the film before and after filling of the epoxy resin of the film capacitor according to Embodiment 1, and (B) is before and after filling of the epoxy resin of the film capacitor according to the conventional example. It is a graph showing the comparison of the insulation resistance value of the film. It is a graph showing the relationship between the insulation resistance value of the capacitor | condenser element which concerns on Embodiment 1, and time in the environment of temperature 60 degreeC / humidity 60%, and the relationship between the insulation resistance value of the capacitor element which concerns on a prior art example, and time. (A) is a graph showing the comparison of the insulation resistance value of the film before and after filling of the urethane resin of the film capacitor according to Embodiment 2, and (B) is before and after filling of the urethane resin of the film capacitor according to the conventional example. It is a graph showing the comparison of the insulation resistance value of the film. It is a figure which shows the solder material example which concerns on another form. It is general | schematic sectional drawing which shows the film capacitor which concerns on a prior art example. It is a schematic sectional drawing which shows the capacitor | condenser element which concerns on a prior art example. It is a figure explaining the subject of the film capacitor which concerns on a prior art example.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Embodiment 1 of the Invention
Embodiment 1 of this invention is demonstrated based on drawing. FIG. 1 shows a film capacitor (10) according to the first embodiment. The film capacitor (10) is configured by accommodating a capacitor element (15) inside a capacitor case (11) and filling an epoxy resin (12). This film capacitor (10) is used as a smoothing capacitor between an inverter circuit and a converter circuit, for example.

    The capacitor case (11) is formed in a substantially rectangular box. A capacitor element (15) is accommodated in the capacitor case (11), and an epoxy resin (12) is filled so as to cover the periphery of the capacitor element (15). By covering the periphery of the capacitor element (15) with an epoxy resin (12), the capacitor element (15) is prevented from being absorbed by moisture or the like contained in the external air of the capacitor case (11).

    The epoxy resin (12) is a thermosetting synthetic resin (trade name: EX-664 / H390, manufactured by Sanyu Rec Co., Ltd.) having an epoxy group, and constitutes a sealing member according to the present invention. . The epoxy resin (12) contains a volatile solvent constituting the volatile substance according to the present invention and a reaction product constituting the reaction product. Moreover, these substances constitute the intruder according to the present invention. As the sealing member, a urethane resin (13) described later and other curable resins can be used instead of the epoxy resin (12).

    As shown in FIGS. 2 and 3, the capacitor element (15) has two metallized films (16) formed by vapor-depositing a metal film (18) on both sides of a belt-like film (17). These are wound into a columnar shape, and metallicons (19, 19) are connected to both ends of the wound metallized films (16, 16) in the width direction, and solder coatings are applied to the metallicons (19, 19). (25, 25) is formed and configured. At this time, the two metallized films (16, 16) are overlapped with each other being shifted by about 1 mm in the left-right direction. The wound metallized film (16) is wound with a protective film (22) having a width substantially the same as the width in the left-right direction. This protective film (22) partitions the epoxy resin (12) and the capacitor element (15), and prevents the passage of the solvent and reaction product contained in the epoxy resin (12). The protective film (22) is made of, for example, a polyethylene terephthalate (PET) film.

    Each said film (17) is formed in the thickness of about 3-10 micrometers using the polyvinylidene fluoride (PVDF) which added the inorganic oxide, and comprises the film member based on this invention. This polyvinylidene fluoride (PVDF) is a polymer material having a glass transition point of −39 ° C. and a melting point of 210 ° C. as characteristics. A metal film (18) such as aluminum (Al) is vapor-deposited on the surfaces on both sides of each film (17). This metal film (18) is formed to a thickness of about 50 to 400 mm.

    The metallicon (19) electrically connects the metal film (18) and the copper wire (20), which is an electrode extending to the outside, and constitutes an electrode member according to the present invention. The metallicon (19, 19) is formed by melting and spraying the end of a metallized film (16, 16) wound with a metal such as zinc (Zn). Specifically, each metallized film (16) is fixedly supported by the metallicon (19, 19) by being buried in the metallicon (19, 19) sprayed at both ends in the width direction. Further, as shown in FIG. 1, a solder film (25) is formed between the metallicon (19, 19) and the epoxy resin (12).

    The solder film (25) is a film formed by solder (trade name: Eco Solder, product number: M705-GWS, manufactured by Senju Metal Industry Co., Ltd.) applied to cover the metallicon (19, 19). Thus, the blocking unit according to the present invention is configured. This solder material has a melting temperature (melting point) of 220 ° C. The solder coating (25) is formed by applying melted paste-like solder so as to cover the exposed portion of each metallicon (19, 19) with respect to the epoxy resin (12). That is, in the capacitor case (11), the solder coating (25) is interposed between the metallicon (19, 19) of the capacitor element (15) and the epoxy resin (12). The temperature of the paste solder is about 220 ° C., but since the metallicon (19) is interposed, the temperature transmitted to the film (17) of the capacitor element (15) is the melting point (about 210) of the film (17). ° C).

    In addition to the above, as the solder material, as shown in FIG. 4, low melting point alloy 1 (trade name: U Alloy 138G, manufactured by Osaka Asahi Metal Factory) or low melting point alloy 2 (trade name Craft) Alloy, manufactured by Nissin Resin Co., Ltd.) can also be used. When the solder coating (25) is composed of the above low melting point alloys, the melting point of each low melting point alloy is lower than the melting point of the film (17). Therefore, when the solder coating (25) is melt-bonded to the metallicon (19) In addition, it is possible to reliably prevent the film (17) from being thermally deformed.

    The copper wire (20) is a φ1.0 mm soft copper wire. The copper wire (20) serves as a connection terminal extending to the outside of the capacitor case (11). The copper wire (20) is connected to the metallicon (19, 19) by the solder coating (25).

    FIG. 5A shows a comparison of the insulation resistance values of the film (17) before and after the epoxy resin (12) is filled in the capacitor case (11) of the film capacitor (10) according to the first embodiment. This insulation resistance value was measured by applying a voltage of 100 V in a temperature environment of 30 ° C. In the film capacitor (10) of Embodiment 1, the insulation resistance value hardly changes before and after filling with the epoxy resin (12). That is, even if the solvent or reaction product contained in the epoxy resin (12) volatilizes, the solder film (25) prevents the solvent or reaction product from passing through. For this reason, these substances can be prevented from entering the inside of the capacitor element (15). Thereby, since there is no increase factor of the leakage current of the film (17) after filling with the epoxy resin (12), it is possible to reliably prevent the insulation resistance from being lowered.

-Production method of film capacitor (10)-
A method for producing the film capacitor (10) will be specifically described.

    In the production of the film capacitor (10), first, a film (17) is produced using polyvinylidene fluoride (PVDF) produced by a coating method (cast method). In film formation of the film (17), polyvinylidene fluoride (PVDF) to which an inorganic oxide is added is coated on the substrate, dried, and peeled from the substrate to obtain the film (17). The dielectric constant can be increased by adding an inorganic oxide to the film (17).

    A metal film (16) is deposited on the film (17) to form a metallized film (16). Then, the metallized film (16) is rolled up in two layers, and metal such as zinc (Zn) is melt-sprayed at both ends of the wound metallized film (16) to form the metallicon (19, 19). Formed. In the first embodiment, the capacitance of the capacitor element (15) is about 14 μF.

    Next, solder (product name: Eco Solder, product number: M705-GWS, manufactured by Senju Metal Industry Co., Ltd.) so as to cover the exposed part of the metallicon (19, 19) on the outer surface of the capacitor element (15) Apply. Specifically, solder paste (25) is formed by applying paste so as to cover the entire exposed metallicon (19, 19) by applying heat. Next, the copper wire (20) is soldered (21, 21) to the solder coating (25) to connect the terminals.

    Thereafter, the capacitor element (15) is accommodated in the capacitor case (11). Then, an epoxy resin (trade name: EX-664 / H390, manufactured by Sanyu Rec Co., Ltd.) is poured into the capacitor case (11) and heated in a temperature environment of 100 ° C. for about 2 hours to cure the epoxy resin.

<Comparative example 1>
A comparative example 1 for the first embodiment will be described.

    In the film capacitor (a) according to the conventional example according to Comparative Example 1, the solder film (25) is not formed on the surface of the metallicon (d, d) as compared with the film capacitor (10) of Embodiment 1 above. Is different.

    FIG. 5B shows a comparison of insulation resistance values before and after filling the case (c) of the film capacitor (a) according to the conventional example with the epoxy resin (g). This insulation resistance value was measured by applying a voltage of 100 V in a temperature environment of 30 ° C. In the film capacitor (a) of the conventional example, the insulation resistance value of the film is greatly reduced by filling the epoxy resin (g). That is, the solvent and reaction product contained in the epoxy resin (g) volatilize, pass through the metallicon (d, d), and enter the capacitor element (b). Then, the volatilized solvent or the like enters the gaps in the film. Thereby, after filling the epoxy resin (g), the leakage current of the film increases and the insulation resistance value decreases.

<Comparative example 2>
In Comparative Example 2, the result of a comparative experiment between the capacitor element (15) according to the first embodiment and the capacitor element (15) according to the conventional example will be described.

    In Comparative Example 2, first, the capacitor element (15) according to Embodiment 1 was not sealed with the epoxy resin (12), and a moisture resistance test was performed in an environment of a temperature of 60 ° C./humidity of 60%. As shown in FIG. 6, the capacitor element (15) according to the first embodiment has a metallicon (19, 19) portion exposed to the outside covered with a solder film (25, 25). ) Does not allow moisture contained in the outside air to enter. For this reason, the water | moisture content which penetrate | invaded the space | gap inside a film (17) cannot enter. As a result, even if time elapses, there is no increase factor of the leakage current of the film (17), so that the insulation resistance value does not decrease.

    Next, the capacitor element (b) according to the conventional example was not sealed with an epoxy resin (g), and a moisture resistance test was performed in an environment of a temperature of 60 ° C./humidity of 60%. As shown in FIG. 6, in the capacitor element (b) according to the conventional example, since the metallicon (d, d) is exposed to the outside, the inside of the capacitor element (b) is connected via the metallicon (d, d). Moisture contained in the outside air enters. For this reason, the water | moisture content which penetrate | invaded into the space | gap inside a film enters. As a result, with the passage of time, the leakage current of the film increases and the insulation resistance value decreases.

-Effect of Embodiment 1-
According to the first embodiment, since the solder coating (25) is provided between the metallicon (19, 19) and the epoxy resin (12), the capacitor element is passed from the epoxy resin (12) through the metallicon (19, 19). It is possible to prevent the volatile solvent and reaction product contained in the epoxy resin (12) from entering the inside of (15). In addition, since a film is formed with solder that blocks volatile substances and reaction products, volatile solvents and reaction products are transferred from the epoxy resin (12) to the inside of the capacitor element (15) through the metallicon (19, 19). Can be prevented from entering. Accordingly, it is possible to prevent the solvent and the reaction product from entering the voids inside the film (17) constituting the capacitor element (15). As a result, since there is no increase factor of the leakage current of the film (17), it is possible to reliably prevent the insulation resistance from being lowered.

    Next, since the solder coating (25) is provided between the metallicon (19) and the epoxy resin (12), the metallicon (19,19) is formed from the epoxy resin (12) without covering the entire surface of the capacitor element (15). It is possible to prevent the solvent and the reaction product from entering the capacitor element (15) via the. As a result, the amount of metal used for the solder coating (25) can be reduced.

    Next, since the coating is composed of solder, the solder coating (25) can be easily formed with solder between the epoxy resin (12) and the metallicon (19, 19).

    Furthermore, since the metal material constituting the solder coating (25) has a melting point at which the temperature of heat transmitted to the film (17) through the metallicon (19) is lower than the melting point of the film (17), It is possible to reliably prevent the film (17) from being thermally deformed when the (25) is melt bonded to the metallicon (19).

    Finally, since the electrode member is composed of the metallicon (19), the electrodes can be easily formed at both ends in the width direction of the wound metallized film (16).

<< Embodiment 2 of the Invention >>
Next, a second embodiment of the present invention will be described in detail based on the drawings. In the film capacitor (10) according to the second embodiment, the film capacitor (10) according to the first embodiment uses an urethane resin (trade name: SU-1000A) instead of the epoxy resin as the sealing member. / B, manufactured by San Yulec Co., Ltd.).

    Specifically, in the film capacitor (10) according to the second embodiment, the capacitor case (11) is filled with urethane resin (13), and the metallicon (19, 19) and urethane of the capacitor element (15). A solder coating (25) is interposed between the resin (13) and the resin (13).

    In the production of the film capacitor (10) according to the second embodiment, first, a film (17) is produced using polyvinylidene fluoride (PVDF) produced by a coating method (cast method).

    A metal film (16) is deposited on the film (17) to form a metallized film (16). Then, the metallized film (16) is rolled up in two layers, and metal such as zinc (Zn) is melt-sprayed at both ends of the wound metallized film (16) to form the metallicon (19, 19). Formed. In the second embodiment, the capacitance of the capacitor element (15) is about 14 μF.

    Next, paste solder (trade name: Ecosolder, product number: M705-GWS, Senju Metal Industry Co., Ltd.) covering the exposed surface of the metallicon (19, 19) on the outer surface of the capacitor element (15). )) Is applied. Then, heat is applied to melt the solder, and a solder coating (25) is formed so that the entire exposed metallicon (19, 19) is covered with the solder. Next, a copper wire (20, 20) as a terminal was soldered and connected to the metallicon (19, 19) to produce a capacitor element (15).

    Thereafter, the capacitor element (15) is accommodated in the capacitor case (11). Then, a urethane resin (trade name: SU-1000A / B, manufactured by Sanyu Rec Co., Ltd.) is poured into the capacitor case (11), and left in a room temperature environment for about 24 hours to cure the urethane resin.

    FIG. 7A shows a comparison of the insulation resistance values of the film (17) before and after filling the urethane resin (13) in the capacitor case (11) of the film capacitor (10) according to the second embodiment. This insulation resistance value was measured by applying a voltage of 100 V in a temperature environment of 30 ° C. In the film capacitor (10) of Embodiment 2, the insulation resistance value hardly changes before and after filling with the urethane resin (13). That is, even if the solvent or reaction product contained in the urethane resin (13) volatilizes, the solder film (25) prevents the solvent or reaction product from passing through. For this reason, these substances can be prevented from entering the inside of the capacitor element (15). Thereby, since there is no increase factor of the leakage current of the film (17) after filling with the urethane resin (13), it is possible to reliably prevent the insulation resistance from being lowered.

    On the other hand, FIG. 7B shows a comparison of insulation resistance values before and after filling the urethane resin (h) in the case (c) of the film capacitor (a) according to the conventional example. This insulation resistance value was measured by applying a voltage of 100 V in a temperature environment of 30 ° C. In the film capacitor (a) of the conventional example, the insulation resistance value of the film is greatly reduced by filling the urethane resin (h). That is, the solvent and reaction product contained in the urethane resin (h) volatilize and pass through the metallicon (d, d) and enter the capacitor element (b). Then, the volatilized solvent or the like enters the gaps in the film. Thereby, after filling urethane resin (h), the leakage current of a film increases and an insulation resistance value falls. Other configurations, operations and effects are the same as those of the first embodiment.

<Other embodiments>
The present invention may be configured as follows for the first and second embodiments.

    In the first and second embodiments, a low-melting-point material is used as the solder material constituting the blocking portion according to the present invention. However, in the present invention, as shown in FIG. Alloys or other alloys shown in FIG. 8 can be used.

    In addition, the above embodiment is an essentially preferable illustration, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, or its use.

    As described above, the present invention is useful as a countermeasure for preventing a decrease in insulation resistance of a film of a film capacitor.

11 Capacitor case 12 Epoxy resin 13 Urethane resin 15 Capacitor element 16 Metallized film 17 Film 19 Metallicon 25 Solder coating

Claims (6)

Capacitor case (11),
A metallized film member 16 is wound around the surface of the film member 17 while being accommodated in the capacitor case 11, and the wound metallized film. A capacitor element (15) configured by connecting electrode members (19, 19) to both ends in the width direction of the member (16);
A film capacitor comprising a sealing member (12, 13) filled in the capacitor case (11) and covering the periphery of the capacitor element (15),
The sealing member (12, 13) and each electrode member (19) are melted and bonded to each electrode member (19), and are made of a metal material. ) To a capacitor element (15) is provided with a blocking portion (25). In claim 1,
The film capacitor is characterized in that the blocking part (25) is configured to prevent a volatile substance or a reaction product from entering the capacitor element (15). In claim 1 or 2,
The blocking portion (25) is made of a metal material having a melting point at which the temperature transmitted to the film member (17) through the electrode member (19) is lower than the melting point of the film member (17). Film capacitor. In any one of Claims 1-3,
The film capacitor, wherein the blocking portion (25) is made of a metal material whose melting point is lower than that of the film member (17). In any one of Claims 1-4,
The film capacitor, wherein the blocking portion (25) is made of solder. In any one of Claims 1-5,
Each of the electrode members (19, 19) is made of a metallicon.

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