JP2011224807A - Book with ic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a book with an IC tag where the performance deterioration in the IC tag due to sliding or an impact is prevented, with a simple constitution.SOLUTION: The book with an IC tag (10) includes: a main text body (14) formed by binding a plurality of signatures; a cover (12) covering at least a part of the surface of the main text body (14); and an IC tag unit (16) including an IC chip (30), a dipole antenna (28) and a substrate (26) which supports the IC chip (30) and the dipole antenna (28). The main text body (14) includes a recess (38) formed by removing a part of the signatures so as to be open in the portion covered by the cover (12), and at least a part of the IC chip (30) is disposed inside the recess (38).

Description

  The present invention relates to a book with an IC tag.

  In a system for managing books, RFID (Radio Frequency IDentification) is generally used.

  More specifically, in a system employing RFID, an electronic tag (IC tag) is attached to each book. The IC tag has unique information and the like, and can perform wireless communication with an external reader / writer. The administrator can acquire the unique information of the IC tag through the reader / writer, and can manage the current position in addition to the production management and inventory management of the book based on the acquired information.

  The IC tag has, for example, a rectangular flexible substrate, and a dipole antenna is integrally provided over substantially the entire substrate. An IC chip is connected to the dipole antenna using a conductive adhesive. The external reader / writer can read out the unique information stored in the IC chip via the dipole antenna.

  This type of IC tag is, for example, disposed between a flat back of the body, which is an aggregate of printed paper pieces, and a spine that covers the back, and is fixed with an adhesive (for example, Patent Documents 1 to 5). reference).

JP 2004-351939 A JP 2002-326474 A JP 2003-63655 A JP 2009-73174 A JP 2009-76046 A

  In the books disclosed in Patent Documents 1 to 3, an IC tag is attached to the back or back cover of the text. In general, the thickness of the IC tag is large at the IC chip portion, and in these books, the portion of the back cover that covers the IC chip protrudes.

  The protruding spine portion is easily slid with other books when transporting or displaying books. This causes cracks in the connection between the IC chip and the antenna, reducing the communication performance of the IC tag. There is a risk of doing.

  On the other hand, in the books disclosed in Patent Documents 4 and 5, the IC tag is embedded in the adhesive layer between the flat back and the back cover of the main text, and the portion of the back cover that covers the IC chip protrudes. It seems not.

However, when an impact is applied from the outside to the portion of the spine that covers the IC chip, the impact is transmitted to the IC chip through the adhesive layer. For this reason, even in these books, there is a possibility that the connection portion between the IC chip and the dipole antenna will be cracked by the impact, and the communication performance of the IC tag may be lowered.
In these books, the adhesive layer must have a sufficient thickness to embed the IC tag, and a large amount of adhesive is required.

  The present invention has been made based on the above-described circumstances, and an object of the present invention is to provide a book with an IC tag that has a simple configuration and prevents the performance of the IC tag from being deteriorated due to sliding or impact.

  In order to achieve the above object, according to one aspect of the present invention, an aggregate formed by binding a plurality of paper pieces, a cover covering at least a part of the surface of the aggregate, an IC chip, a dipole antenna, In addition, in a book with an IC tag including an IC tag unit including a substrate that supports the IC chip and the dipole antenna, the aggregate is a part provided by removing a part of the paper piece and covered with the cover There is provided a book with an IC tag, characterized in that the IC chip has a recess opened at least, and at least a part of the IC chip is disposed inside the recess.

In the book with an IC tag according to the first aspect, at least a part of the IC chip is disposed inside the recess. For this reason, even if the thickness of the IC tag unit is large in the IC chip portion, the IC chip portion is suppressed from being raised in a state where the IC tag unit is addressed to the aggregate.
For this reason, it is suppressed that the part of the cover sheet which overlaps with the IC chip protrudes, and the sliding between the cover sheet part which overlaps with the IC chip and the outside is eased when the book is conveyed or displayed. As a result, in this book with an IC tag, it is possible to prevent a crack from occurring in the connection part connecting the IC chip and the dipole antenna, and to prevent the performance degradation of the IC tag unit.

  On the other hand, in this book with an IC tag, partial protrusion of the cover is suppressed without providing an adhesive layer for embedding the IC tag unit by arranging at least a part of the IC chip inside the recess. ing. For this reason, this IC-tagged book is manufactured with a small amount of adhesive.

Preferably, the plurality of paper pieces are bound by one of a perfect binding and a flat binding, the opening is opened to the back of the aggregate, and the substrate is disposed along the back of the aggregate (claim). Item 2).
In the book with an IC tag according to claim 2, even if the back of the bundle of the perfect binding or the flat binding is flat, at least a part of the IC chip is arranged inside the recess so that the cover of the cover covering the IC chip It is reliably suppressed that the portion is raised.
As a result, in this book with an IC tag, even if the aggregate is formed by wireless binding or flat binding, it is reliably prevented that the connection portion connecting the IC chip and the dipole antenna is cracked. It is possible to reliably prevent performance degradation.

Preferably, the dent has a shape obtained by cutting a part from one of a cylinder and a prism (Claim 3).
The dent in the IC-tagged book according to claim 3 is easily made by cutting or scraping the back of the assembly obtained by collating the paper pieces in which circular or polygonal holes are formed. For this reason, it is easy to manufacture the book with the IC tag.

Preferably, the opening of the recess is narrower than the inside of the recess (Claim 4).
According to the IC-tagged book of claim 4, since the opening that is the entrance of the dent is formed smaller than the inside of the dent, the impact from the outside is absorbed by the opening edge that defines the opening of the dent. The For this reason, it is reliably prevented that a crack is generated in the connection portion connecting the IC chip and the dipole antenna, and the performance degradation of the IC tag unit is surely prevented.

Preferably, the recess has a groove shape extending in the stacking direction of the paper pieces.
The dents in the IC-tagged book according to claim 5 are easily made by scraping the back of the collated assembly. For this reason, it is easy to manufacture the book with the IC tag.

Preferably, the plurality of paper pieces are saddle-stitched, and the opening is located in the vicinity of the back of the aggregate (claim 6).
According to the IC-tagged book of claim 6, even if the backside of the saddle-stitched assembly is configured by a curved surface, at least a part of the IC chip is disposed inside the recess, It is suppressed that the part of the covering cover covers up. In addition, even if the saddle stitched assembly has a curved back surface, the IC chip is not directly directed to the curved surface, and stress is concentrated on the connection between the IC chip and the dipole antenna. Nor.
As a result, in this book with an IC tag, even if the aggregate is formed by saddle stitching, it is possible to prevent the connection portion connecting the IC chip and the dipole antenna from being cracked, and the performance of the IC tag unit is reduced. Is prevented.

Preferably, the substrate has flexibility and is bent so that a part of the substrate is disposed inside the recess, and the entire IC chip is disposed inside the recess. 7).
According to the book with an IC tag of the seventh aspect, since the IC chip is disposed inside the recess, it is reliably prevented that an external force is applied to the IC chip. As a result, in this book with an IC tag, even if the aggregate is formed by saddle stitching, it is reliably prevented that a crack is generated at the connection portion connecting the IC chip and the dipole antenna, and the performance of the IC tag unit A drop is reliably prevented.

Preferably, the substrate and the IC chip are separated from the wall surface of the recess.
According to the book with an IC tag according to the eighth aspect, the IC chip is elastically supported by the flexible substrate inside the recess. In this case, even if an impact is applied to the book from the outside, the impact is absorbed by the elastic deformation of the substrate, and the impact is not directly transmitted to the IC chip. For this reason, it is reliably prevented that a crack is generated in the connection portion connecting the IC chip and the dipole antenna, and the performance degradation of the IC tag unit is surely prevented.

  According to the present invention, it is possible to provide a book with an IC tag which has a simple configuration and prevents the performance degradation of the IC tag unit due to sliding or impact.

It is a perspective view which shows roughly the book with an IC tag of 1st Embodiment. FIG. 2 is a perspective view schematically showing the book with an IC tag of FIG. 1 in a state where a back cover is peeled off. It is a schematic fragmentary sectional view which follows the III-III line of FIG. It is a flowchart which shows schematically the manufacturing method of the IC tag attached book of FIG. It is a perspective view which shows roughly the some signature collated in the collation process of the manufacturing method of the book with an IC tag of FIG. FIG. 5 is a perspective view schematically showing an aggregate obtained by collating a plurality of signatures after being collated in the method for producing a book with an IC tag in FIG. 4. FIG. 5 is a perspective view schematically showing a state in which milling is performed on an assembly of a plurality of signatures in the back surface cutting step of the method for producing a book with an IC tag in FIG. 4. FIG. 5 is a perspective view schematically showing a state in which grooves are formed on one side surface of an assembly in the groove forming step of the method for manufacturing a book with an IC tag in FIG. 4. FIG. 5 is a perspective view schematically showing a state in which an adhesive is applied to one side surface of an assembly in which grooves are formed in the adhesive application step of the manufacturing method of the IC tag-attached book of FIG. FIG. 4 is a perspective view schematically showing a state in which an IC tag unit and a back cover are bonded to one side surface of an assembly to which an adhesive is applied in the IC tag attaching step and the cover attaching step of the method for producing a book with an IC tag in FIG. FIG. FIG. 5 is a perspective view schematically showing a book with an IC tag obtained by performing trimming on three sides of an assembly and a cover in a finishing step of the method for producing a book with an IC tag in FIG. 4. It is a perspective view which shows roughly the book with an IC tag of 2nd Embodiment in the state which peeled the spine. It is a perspective view which shows roughly the text of the IC tag attached book of FIG. It is a side view which shows roughly the text of the IC tag attached book of FIG. FIG. 13 is a schematic partial cross-sectional view of the IC-tagged book of FIG. 12 corresponding to FIG. 3 of the first embodiment. It is a flowchart which shows schematically the manufacturing method of the IC tag attached book of FIG. FIG. 17 is a plan view schematically showing a state of a printed book in which holes are formed in the hole making step of the method for producing a book with an IC tag in FIG. 16. FIG. 17 is a perspective view schematically showing a state in which a signature obtained by folding a printed book is collated in the collation process of the method for producing a book with an IC tag in FIG. 16. FIG. 17 is a perspective view schematically showing an assembly obtained by clamping a plurality of signatures after collating them in the method for producing a book with an IC tag in FIG. 16. FIG. 17 is a perspective view schematically showing how milling is performed on one side portion of a collection of signatures in a back surface cutting step of the method for producing a book with an IC tag in FIG. 16. It is a perspective view which shows roughly the book with an IC tag of 3rd Embodiment in the state which peeled off the IC tag unit. It is a flowchart which shows schematically the manufacturing method of the IC tag attached book of FIG. FIG. 23 is a plan view for explaining the positions of holes to be formed in a printed book in the hole making step of the method for producing a book with an IC tag in FIG. 22. It is a perspective view which shows roughly the book with an IC tag of 4th Embodiment in the state which peeled the spine.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First embodiment]
FIG. 1 is a perspective view schematically showing a book 10 with an IC tag according to the first embodiment. The IC-tagged book 10 is, for example, a perfect binding book such as a comic book.
More specifically, the IC tag-attached book 10 includes a cover 12, a body 14, and an IC tag unit 16. The text 14 is an aggregate of a plurality of paper pieces and has a flat rectangular parallelepiped shape. The cover 12 covers three portions of the body 14 except the top, the ground, and the front forehead.

  Accordingly, the front cover 12 includes a front cover 18 and a back cover 20 that cover two wide surfaces of the text 14, and a spine cover 24 that covers the spine 22 of the text 14. The front cover 12 has a rectangular shape when unfolded, and the spine cover 24 is located between the front cover 18 and the back cover 20. The spine cover 24 has a rectangular shape corresponding to the spine 22 of the text 14, and the IC tag unit 16 is disposed between the spine cover 24 and the spine 22 of the text 14.

  The IC tag unit 16 and the spine cover 24 are fixed to the spine 22 with an adhesive. In the present embodiment, the text 14 is stapled without using a thread or wire, and the papers of the text 14 are also fixed to each other by an adhesive applied to the spine 22 of the text 14.

FIG. 2 is a schematic perspective view showing a state in which the spine cover 24 is peeled off from the spine 22 of the text 14.
As shown in FIG. 2, the IC tag unit 16 includes a flexible resin substrate 26, a dipole antenna 28 provided integrally with the substrate 26, and an IC chip 30 connected to the dipole antenna 28. Have In the present embodiment, the IC tag unit 16 is a passive type having no power source.

  The original shape of the substrate 26 is a rectangle, but the substrate 26 is bent so that the central portion 32 of the substrate 26 and the wing portions 34 on both sides are stepped. Specifically, the central portion 32 and the wing portion 34 are connected to each other via an inclined portion 36, and creases are formed on both sides of the inclined portion 36.

Therefore, on one surface of the substrate 26, the central portion 32 is recessed with respect to the wing portion 34, and the dipole antenna 28 is made of, for example, aluminum and is formed on one surface side of the substrate 26 by an etching method. ing. The dipole antenna 28 extends over substantially the entire substrate 26, and extends from the central portion 32 to the wing portion 34 via the inclined portion 36.
As the dipole antenna 28, an antenna pattern formed by a vapor deposition method of vapor-depositing aluminum, a printed antenna provided by printing, or a wound antenna may be used.

  The IC chip 30 is attached to one surface side of the substrate 26 so as to be positioned at the central portion 32 and is electrically connected to the dipole antenna 28. The IC chip 30 has a memory for storing data such as unique information, a communication function for performing wireless communication with an external reader / writer via the dipole antenna 28, and reading of data in the memory based on the communication result. And a function of performing rewriting.

On the other hand, a recess 38 is formed in the center of the back 22 of the body 14 corresponding to the bending of the substrate 26. The recess 38 is open at the center of the spine 22, and when viewed from the back 22, the shape of the recess 38 is a rectangular shape. The opening area of the recess 38 is preferably set to a size that allows the IC chip 30 to be accommodated in the recess 38 through the opening of the recess 38.
Moreover, the dent 38 is also open on two wide surfaces of the text 14, and the shape of the dent 38 is rectangular when viewed in the thickness direction. Therefore, the recess 38 has a groove shape with a rectangular cross section.

FIG. 3 is a schematic partial cross-sectional view around the IC chip 30 of the IC-tagged book 10 along the line III-III in FIG. As shown in FIG. 3, the recess 38 receives the central portion 32 and the inclined portion 36 of the substrate 26 in a state where the wing portion 34 is attached to the spine 22 by the adhesive 40.
In the present embodiment, the depth of the recess 38 is set to a sufficient size so that the central portion 32 of the substrate 26 does not contact the bottom of the recess 38. Accordingly, the central portion 32 of the substrate 26 and the IC chip 30 are suspended by the inclined portion 36 of the substrate 26.

  Preferably, the depth of the recess 38 is set to 1 mm or more and 5 mm or less, more preferably 3 mm or less. If the depth of the recess 38 is 1 mm or more, the IC chip 30 can be reliably accommodated. On the other hand, if the depth of the dent 38 is 5 mm or less, the rigidity of the book 10 with the IC tag is ensured, and the dent 38 does not stand out in the throat when the book 10 with the IC tag is opened. The beauty of the book 10 is not impaired.

  The connection portion 42 between the IC chip 30 chip and the dipole antenna 28 is formed of, for example, ACP (anisotropic conductive paste). However, the IC chip 30 chip and the dipole antenna can be formed using other known methods. 28 may be connected.

Hereinafter, a method for manufacturing the IC-tagged book 10 will be described.
FIG. 4 is a flowchart schematically showing a method for manufacturing the IC-tagged book 10. In the method for manufacturing the IC-tagged book 10, the paper folding step S10 is first executed. In the paper folding step S10, the signature 50 is produced by folding the printed book.

  Then, the collation process S12 is performed. In the collation process S12, a plurality of signatures 50 are collated as shown in FIG. After the collated signatures 50 are aligned, they are held and fixed by a clamp (not shown), whereby an aggregate 52 of signatures 50 is obtained as shown in FIG.

  Then, back surface cutting process S14 is performed. In the back cutting step S14, as shown in FIG. 7, one side portion of the assembly 52 of clamped signatures 50 is cut or cut to fix the signatures 50 with a hot melt adhesive. Back surface cutting process S14 is performed by milling one side part of the assembly 52 about 3 mm using the milling blade (rotating saw blade) 54, for example.

  Thereafter, as a removing process for forming the recess 38, a groove forming process S16 is performed. In the groove forming step S <b> 16, a groove having a certain depth extending in a direction orthogonal to the one side surface is formed at the center of one side surface of the assembly 52 corresponding to the spine 22 of the main text 14 formed by the back surface cutting step 14. . This groove can also be formed by milling using a milling blade 54 as shown in FIG.

  The width of the groove is set to, for example, about 4 mm to 5 mm so as to be larger than the width of the IC chip 30. On the other hand, the depth of the groove is set to, for example, about 5 mm so that the dent 38 does not stand out in the throat of the main text 14 when the completed book 10 with the IC tag is opened.

  Then, in order to bond the signatures 50 with a hot melt adhesive, an adhesive application step S18 is performed. Specifically, in the adhesive application step S18, a thermoplastic hot material is formed on one side of the aggregate 52 in which the grooves, that is, the recesses 38 are formed, using a roll coater device 56, for example, as shown in FIG. A melt adhesive is applied. The roll coater 56 includes a pan 58 for storing hot melt adhesive while heating, and a plurality of rollers 60 whose lower side is partially immersed in the hot melt adhesive stored in the pan 58.

  The hot melt adhesive is applied by moving the aggregate 52 along the roller 60 row while bringing one side surface of the aggregate 52 into contact with the upper side of the roller 60. In this manner, by applying the hot melt adhesive from the lower side to one side surface of the aggregate 52, the hot melt adhesive is applied at a constant thickness. However, the hot melt adhesive is applied so as not to fill the recess 38.

  Thereafter, before the hot melt adhesive is cured, the IC tag attaching step S20 and the cover attaching step S22 are performed simultaneously or sequentially. In the IC tag attaching step S20 and the cover attaching step S22, for example, as shown in FIG. 10, one side surface of the assembly 52 to which the hot melt adhesive is applied to the spine cover 24 of the cover 12 so as to wrap the IC tag unit 16. The cover 12 is attached to the assembly 52.

Specifically, the IC tag unit 16 is attached to one side surface of the assembly 52 while being separated from the IC tag roll in which the plurality of IC tag units 16 are connected, and supported by the plurality of suction pads.
At this time, the substrate 26 of the IC tag unit 16 has already been folded, and the central portion 32 of the substrate 26 and the IC chip 30 are accommodated in the recess 38 of the assembly 52.

  The substrate 26 of the IC tag unit 16 does not need to be creased. In this case, the portion of the substrate 26 corresponding to the recess 38 is bent by attaching the IC tag unit 16 to one side surface of the assembly 52 while adjusting the interval between the suction pads to bend the substrate 26. 30 is received in the recess 38.

  And finally, finishing process S24 is performed. In the finishing step S24, the text 14 is formed by trimming the three sides of the assembly 52 together with the cover 12, and the IC tag-attached book 10 is manufactured as shown in FIG.

  In the IC-tagged book 10 of the first embodiment described above, the entire IC chip 30 is disposed inside the recess 38. Thereby, even if the thickness of the IC tag unit 16 is large at the portion of the IC chip 30, the portion of the IC chip 30 may be raised in a state where the IC tag unit 16 is addressed to the spine 22 of the text 14. Is prevented.

For this reason, it is possible to prevent the portion of the cover 12 that overlaps the IC chip 30 from being projected, that is, the portion of the spine 24 that overlaps the IC chip 30 when the book 10 with the IC tag is conveyed or displayed. And sliding with the outside is eased.
As a result, in the book 10 with the IC tag, it is possible to prevent the connection portion 42 that connects the IC chip 30 and the dipole antenna 28 from being cracked, and the performance of the IC tag unit 16 is prevented from being deteriorated.

  On the other hand, in the IC tag-attached book 10, the entire IC chip 30 is disposed inside the recess 38, so that a partial protrusion of the spine cover 24 can be achieved without providing an adhesive layer for embedding the IC tag unit 16. Is suppressed. For this reason, the IC-tagged book 10 is manufactured with a small amount of adhesive.

In the IC-tagged book 10 according to the first embodiment described above, even if the spine 22 of the body 14 is flat, the entire IC chip 30 is disposed inside the recess 38 to cover the IC chip 30. It is reliably prevented that the portion of the spine cover 24 is raised.
As a result, in the IC tag-attached book 10, even if the text 14 is formed by the perfect binding, it is reliably prevented that the connection portion 42 connecting the IC chip 30 and the dipole antenna 28 is cracked, and the IC tag unit 16 performance degradation is reliably prevented.

  Moreover, in the IC tag-attached book 10 of the first embodiment described above, the dent 38 is easily produced by scraping the back of the assembly 52 composed of a plurality of collated signatures 50. Therefore, it is easy to manufacture the book 10 with the IC tag.

  Furthermore, according to the above-described IC-tagged book 10 of the first embodiment, since the IC chip 30 is disposed inside the recess 38, it is possible to reliably prevent external force from being applied to the IC chip 30. As a result, in the book 10 with the IC tag, it is reliably prevented that the connection part 42 connecting the IC chip 30 and the dipole antenna 28 is cracked, and the performance degradation of the IC tag unit 16 is surely prevented.

  Furthermore, according to the IC tag-attached book 10 of the first embodiment described above, the IC chip 30 is elastically supported by the flexible substrate 26 inside the recess 38. In this case, even if an impact is applied to the IC tag-attached book 10 from the outside, the impact is absorbed by the elastic deformation of the substrate 26 and the impact is not directly transmitted to the IC chip 30. For this reason, it is reliably prevented that the connection portion 42 connecting the IC chip 30 and the dipole antenna 28 is cracked, and the performance degradation of the IC tag unit 16 is surely prevented.

  On the other hand, according to the manufacturing method of the IC tagged book 10 of the first embodiment described above, the portion of the assembly 52 corresponding to the recess 38 is removed before the cover attaching step S22. 10 is easily manufactured.

  And according to the manufacturing method of the book 10 with an IC tag of 1st Embodiment mentioned above, since the part of the assembly 52 corresponding to the dent 38 is removed by forming a groove | channel, formation of the dent 38 is easy. It is.

[Second Embodiment]
Hereinafter, the IC-tagged book 70 of the second embodiment will be described with reference to the drawings. In addition, about the structure same or similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.
FIG. 12 is a perspective view schematically showing a book 70 with an IC tag in a state where the spine cover 24 is peeled off from the spine 22 of the text 14. The IC-tagged book 70 has a recess 72 having a shape different from that of the recess 38 of the IC-tagged book 10. In response to the difference in shape between the recesses 38 and 72, the IC tag unit book 70 and the IC tag book 10 differ in how the substrate 26 of the IC tag unit 16 bends.

  13 and 14 are a schematic perspective view and a side view of the main text 14, respectively, and the recess 72 has a substantially semi-cylindrical shape with a part of a columnar shape cut out. The axis of the dent 72 extends in the thickness direction of the text 14, but both ends of the dent 72 do not reach the two wide surfaces of the text 14. The radial direction of the recess 72 is parallel to the paper piece of the text 14.

  The width of the opening of the recess 72 is shorter than the maximum length of the internal space of the recess 72 when viewed in the longitudinal direction of the spine 22 of the body 14. In other words, the opening area of the recess 72 is smaller than the maximum value of the cross-sectional area of the recess 72 defined by the surface parallel to the spine 22 and the wall surface of the recess 72. For this reason, the inside of the recess 72 is wider than the opening.

FIG. 15 is a schematic partial cross-sectional view around the IC chip 30 of the IC-tagged book 70 corresponding to FIG. 3 of the IC-tagged book 10.
Also in the IC-tagged book 70, the IC chip 30 is disposed inside the recess 72. However, the opening of the recess 72 is narrower than that of the recess 38, and the bending of the substrate 26 at the boundary between the central portion 32 and the wing portion 34 and the inclined portion 36 is large.

Hereinafter, a method for manufacturing the above-described IC-tagged book 70 will be described.
FIG. 16 is a flowchart schematically showing a method for manufacturing the IC-tagged book 70. Since the manufacturing method of the IC-tagged book 70 is mainly different from the manufacturing method of the IC-tagged book 10 in the method of manufacturing the recess 72, the steps related to the method of manufacturing the recess 72 will be mainly described.

  In the manufacturing method of the IC-tagged book 70, a punching step S26 for removing a portion corresponding to the dent 72 is executed before the collation step S12. In the punching step S26, as shown in FIG. 17, a circular hole 76 is formed at a predetermined position of the printed book 74 that constitutes the intermediate layer of the text 14.

  More specifically, in the present embodiment, a hole 76 is formed at the center of the vertical direction on the side of each page arranged on the throat side of the body 14. The number of printed books 74 or the number of pages in which the holes 76 are formed is determined corresponding to the width of the substrate 26 of the IC tag unit 16. The hole 76 is separated from the crease of the printed book 74 by a predetermined distance.

  The hole 76 can be formed using a punching blade, for example. In the present embodiment, the hole 76 is circular, but may be a polygon such as a triangle or a rectangle, an ellipse, or the like. The diameter of the hole 76 is set to, for example, about 5 mm so that the dent 72 does not stand out in the throat of the body 14 when the IC-tagged book 70 is opened. If the hole 76 is a square, one side is set to about 5 mm, for example.

  As shown in FIG. 18, the signature 78 obtained by folding the printed book 74 is collated so as to be sandwiched between the signatures 80 in which the holes 76 are not formed in the collation step S12. Then, the collated signatures 78 and 80 are aligned, held and fixed by a clamp (not shown), and as a result, an aggregate 82 of signatures 78 and 80 is obtained as shown in FIG. In the aggregate 82, the holes 76 are connected to each other to form a cylindrical closed space.

  Thereafter, the back cutting step S <b> 14 is performed to fix the signatures 78 and 80 with an adhesive and to open the closed space formed by the hole 76. In the back cutting step S14, one side portion of the aggregate 82 is cut or cut. As shown in FIG. 20, the back surface cutting step S <b> 14 is performed by milling one side portion of the assembly 82 by about 3 mm using, for example, a milling blade 54. By this back surface cutting step S14, the closed space of the hole 76 is opened, and the recess 72 is formed. That is, the distance of the hole 76 from the crease of the printed book 74 is determined in accordance with the amount of milling on one side of the assembly 82.

  According to the IC-tagged book 70 described above, since the opening that is the entrance of the recess 72 is formed smaller than the interior of the recess 72, the impact from the outside defines the opening of the recess 72. It is absorbed by the opening edge of the facing saddle shape. For this reason, it is reliably prevented that the connection portion 42 connecting the IC chip 30 and the dipole antenna 28 is cracked, and the performance degradation of the IC tag unit 16 is surely prevented.

  On the other hand, according to the manufacturing method of the IC-tagged book 70 of the second embodiment described above, the dent 72 cuts or cuts one side portion of the assembly 82 that collates the signature 78 in which the circular hole 76 is formed. It is easily manufactured by cutting. For this reason, according to this manufacturing method, the IC-tagged book 70 is easily manufactured.

  And according to the manufacturing method of the IC-tagged book 70 of the second embodiment described above, the shape of the hole 76 is selected from a circle, an ellipse, and a polygon, so that it can be used according to the application of the recess 72. Thus, the shape of the recess 72 is easily selected.

  Moreover, according to the manufacturing method of the IC-tagged book 70 of the second embodiment described above, the formation position of the hole 76 in the punching step S26 and the removal amount of one side portion of the aggregate 82 in the back surface cutting step S14 are determined. By adjusting, the opening of the recess 72 is easily formed narrower than the inside.

[Third Embodiment]
Hereinafter, the IC-tagged book 90 of the third embodiment will be described with reference to the drawings. The IC tagged book 90 is, for example, a magazine.
FIG. 21 is a perspective view schematically showing a book 90 with an IC tag in a state where the IC tag unit 16 is peeled off. The body 92 of the IC-tagged book 90 is formed by saddle stitching and therefore does not have a flat back. The front cover 94 does not have a spine cover, and consists only of a front cover 96 and a back cover 98. Even in the IC-tagged book 90, a dent 100 is formed in the text 92, but the dent 100 opens near the back of the text 92.

  FIG. 22 is a flowchart schematically showing a method of manufacturing the IC-tagged book 90. As shown in FIG. 22, the dent 100 can be produced by making a hole in a printed book in advance, like the dent 72.

  Here, FIG. 23 is a plan view schematically showing a signature 102 used for a book 90 with an IC tag. In the signature 102, a hole 104 constituting the recess 100 is formed. In the case of saddle stitching, the nearer the front cover 96 or the back cover 98 near the back of the body 92, the greater the bending of the page. For this reason, when the hole 104 is opened at the same position on each page, the position of the hole 104 is not aligned when the signature 102 is collated.

  Therefore, in the present embodiment, as shown by the alternate long and short dash line in FIG. 23, in the signature 102 arranged on the inner side, the hole 104 is formed closer to the back than the signature 102 arranged on the outer side. Thereby, when collated, the positions of the holes 104 coincide with each other, and the recess 100 having a predetermined shape is reliably formed.

According to the IC-tagged book 90 of the third embodiment described above, the IC chip 30 is arranged inside the recess 100 even if the back portion of the saddle-stitched text 92 is formed by a curved surface, so that the IC Raising of the portion of the cover 94 covering the chip 30 is reliably suppressed.
Further, even if the saddle-stitched body 92 has a curved surface near the back, the IC chip 30 is not directly addressed to the curved surface, and stress is applied to the connecting portion 42 between the IC chip 30 and the dipole antenna 28. Does not concentrate.

As a result, in this IC-tagged book 90, even if the text 92 is formed by saddle stitching, it is reliably prevented that the connection portion 42 that connects the IC chip 30 and the dipole antenna 28 is cracked. The performance degradation of the tag unit 16 is surely prevented.
On the other hand, according to the manufacturing method of the IC-tagged book 90 of the third embodiment described above, the dent 100 is formed by opening the hole, so that the dent 100 is formed even if the back portion of the body 92 is formed by a curved surface. Is easily formed.

[Fourth Embodiment]
Hereinafter, the IC-tagged book 110 according to the fourth embodiment will be described with reference to the drawings.
FIG. 24 is a perspective view schematically showing a book 110 with an IC tag in a state where the back cover 24 is peeled off from the spine 22 of the text 14. The IC-tagged book 110 has the same configuration as the IC-tagged book 10 of the first embodiment except that the IC-tagged book 110 further includes a dent 112.

The dent 112 opens to the back 22 of the text 14, and the wing portion 34 of the substrate 26 and the dipole antenna 28 extend over the opening of the dent 112. That is, nothing is accommodated inside the recess 112.
In addition, the dent 112 can be produced by the same method as the dent 38, for example.

The above-described IC-tagged book 110 according to the fourth embodiment has the same function as the IC-tagged book 110 according to the first embodiment. In addition, in the IC tag book 110, the function of the IC tag unit 16 is easily reduced.
Specifically, when the function of the IC tag unit 16 is lowered, a tool having a tip that is narrower than the opening of the recess 112 may be used to push the portion of the spine cover 24 that overlaps the recess 112 from the outside. Thus, when the spine 24, the wing 24, and the dipole antenna 28 are pushed into the recess 112 by the tip of the tool, the dipole antenna 28 is cut and the effective length of the dipole antenna 28 changes. As a result, the alignment of the IC tag unit 16 is shifted, and the function of the IC tag unit 16 is significantly deteriorated.

Degrading the function of the IC tag unit 16 in this way is effective as a means for preventing leakage of unique information in the IC chip 30 after management of the IC tag-attached book 110 becomes unnecessary.
Further, it is possible to improve the matching of the IC tag unit 16 by changing the pattern area of the dipole antenna 28 and changing the stray capacitance of the capacitor. That is, the characteristics of the electric circuit can be adjusted.
In addition, you may form the mark which shows the pushing position in the part of the spine cover 24 which overlaps with the dent 112, or its periphery by printing.

  In addition, the number of the recesses 112 for reducing the function of the IC tag unit 16 is not limited to one, and is spaced apart from each other in the longitudinal direction of the spine 22 of the body 14 along the wing portion 24. A plurality of them may be formed. In this case, the degree to which the function of the IC tag unit 112 is reduced can be selected depending on which of the plurality of recesses 112 the tool tip is pushed into.

  For example, the function of the IC tag unit 16 can be almost stopped by pushing the tip of the tool into the recess 112 on the IC chip 30 side among the plurality of recesses 112. On the other hand, the alignment of the IC tag unit 16 can be finely adjusted by pushing the tip of the tool into the recess 112 on the side opposite to the IC chip 30 among the plurality of recesses 112.

The present invention is not limited to the first to fourth embodiments described above, and includes forms obtained by changing these embodiments and forms obtained by combining these embodiments.
For example, in the first embodiment, the second embodiment, and the fourth embodiment, as a preferred mode, the text 14 is cut and stapled. It may be bound. In addition, in the first embodiment, the second embodiment, and the fourth embodiment, the IC-tagged books 10, 70, and 110 are manufactured by parallel bookbinding, but may be manufactured by upper bookbinding. That is, the book binding to which the present invention is applied is not particularly limited.

  In the first to fourth embodiments, the entire IC chip 30 is disposed inside the recesses 38, 72, 100. However, at least a part of the IC chip 30 is disposed inside the recesses 38, 72, 100. It only has to be arranged.

In the first to fourth embodiments, as a preferred mode, the IC chip 30 and the central portion 32 of the substrate 26 are separated from the wall surfaces of the recesses 38, 72, 100, but may be in close contact.
Furthermore, in 1st thru | or 4th embodiment, as a preferable aspect, although the inside of the dent 38,72,100 was not filled with the adhesive agent, the inside of the dent 38,72,100 was filled with the adhesive agent. Also good.

  Furthermore, in the first to fourth embodiments, the pattern of the dipole antenna 28 and the position of the IC chip 30 in the IC tag unit 16 are not particularly limited, and the recesses 38 and 72 are determined according to the position of the IC chip 30. , 100, 112 can be changed.

In the second embodiment, the hole 76 is formed in the printing book 74. However, a hole may be formed in a signature obtained by folding the printing book.
Finally, it goes without saying that the types of books to which the present invention is applied are not limited to comics and magazines.

10, 70, 90, 110 IC-tagged books 12 Cover 14 Text (Aggregate)
16 IC tag unit 22 Back 24 Back cover 26 Substrate 28 Dipole antenna 30 IC chip 38, 72, 100, 112 Recess 42 Connection part 50 Signature 54 Milling blade 56 Roll coater device

Claims (8)

An assembly formed by binding a plurality of pieces of paper;
A cover covering at least a part of the surface of the aggregate;
In a book with an IC tag comprising an IC chip, a dipole antenna, and an IC tag unit including a substrate that supports the IC chip and the dipole antenna.
The assembly is provided by removing a part of the paper piece, and has a recess opened in a portion covered with the cover.
At least a part of the IC chip is disposed in the recess, and the IC tag-attached book. The plurality of paper pieces are bound by one of simple binding and flat binding,
The opening opens to the back of the assembly;
2. The book with an IC tag according to claim 1, wherein the substrate is arranged along a back of the aggregate.   The book with an IC tag according to claim 2, wherein the dent has a shape obtained by cutting a part from one of a cylinder and a prism.   The book with an IC tag according to claim 2 or 3, wherein the opening of the recess is narrower than the inside of the recess.   The book with an IC tag according to claim 2, wherein the recess has a groove shape extending in a stacking direction of the paper pieces. The plurality of paper pieces are saddle-stitched,
The book with an IC tag according to claim 1, wherein the opening is located in the vicinity of the back of the assembly.   The substrate has flexibility and is bent so that a part of the substrate is disposed inside the recess, and the entire IC chip is disposed inside the recess. Item 7. A book with an IC tag according to any one of Items 1 to 6. The book with an IC tag according to claim 7, wherein the substrate and the IC chip are separated from a wall surface of the recess.

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