JP2011218397A - Laser beam machine and holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machine and a holding device enhancing working precision.SOLUTION: This holding device 10 for the laser beam machine 1 includes a reception member 32 mounted with a thin sheet W, a wall part 32b erected in a rear end side of a mounting face 32a of the reception member 32, an energizing member 35 arranged in an upper stage part 32c formed step-differently on the mounting face 32a, and a press member 33 having a long pressing face 33a opposed to the mounting face 32a while energized upwards by the energizing member 35, clamping is thereby allowed without generating a strain in the thin sheet W, between the press member 33 and the reception member 32, using a fastening member 34, and an elastic deformation amount of the thin sheet W is prevented from being dispersed to enhance the working precision. Further, the thin sheet W is prevented from butting against the wall part 32b, and sufficient tension is imparted to the thin sheet W, because a distance between wall parts of the first clamping part 20 and the second clamping part 30 is set to be larger than the maximum value of a dimensional tolerance of the thin sheet W. The working precision is enhanced by this manner.

Description

  The present invention relates to a laser beam machine and a holding device, and more particularly to a laser beam machine and a holding device that can improve machining accuracy.

  A laser processing machine is used when performing fine processing on a workpiece made of a thin metal plate. The laser processing machine cuts the thin plate by moving the thin plate in the XY directions and irradiating the focused laser beam from the processing head. The thin plate is attached to the holding device and held in tension, and is moved in the XY direction by moving the holding device.

  The applicant has previously developed a holding device that easily holds a thin plate in tension (Patent Document 1). Hereinafter, with reference to FIG. 6, a holding apparatus 100 for a laser beam machine disclosed in Patent Document 1 will be described. 6A is a plan view of a conventional holding device 100, and FIG. 6B is a front view of the holding device 100. FIG. As shown in FIG. 6A, the holding device 100 includes a long receiving member 101 on which both ends in the longitudinal direction of the thin plate W are mounted, and a plurality of pressing members 102 configured to be able to press the receiving member 101. I have. A plurality of pressing members 102 are adjacent to each other and are formed to have substantially the same length as the length of the receiving member 101, and a clamping lever 103 is connected to each pressing member 102. By pressing down the tightening lever 103 in order, each of the pressing members 102 is sequentially lowered onto the receiving member 101, and the thin plate W placed on the receiving member 101 is held between the receiving member 101.

  Moreover, as shown in FIG.6 (b), each receiving member 101 is standingly arranged so that the wall part 101a may face each other. By placing the thin plate W on the receiving member 101 so that the thin plate W is accommodated between the opposing wall portions 101a, the thin plate W placed on the receiving member 101 is restricted from moving in the left-right direction (left-right direction in FIG. 6). The For this reason, the distance L between the facing wall portions 101a is set to a substantially standard value of the dimensional tolerance of the thin plate W.

Japanese Unexamined Patent Application Publication No. 2004-174519 (FIG. 2, FIG. 4, etc.)

  Here, the laser processing is performed in a state where tension is applied to the thin plate W, the tension is released after the laser processing, and the thin plate W returns to the state before the tension. If the thin plate W is uniformly elastically deformed at a predetermined deformation ratio by applying tension, laser processing is performed based on a correction dimension obtained by multiplying the target dimension by the deformation ratio, so that the tension is released and elastic. The recovered thin plate W is processed according to the target dimension.

  On the other hand, conventionally, since the thin plate W is pressed against the receiving member 101 by a plurality of separate pressing members 102 (see FIG. 6), depending on how the pressing member 102 is pressed, the thin plate W is moved along the length direction of the receiving member 101. The thin plate W may be distorted. When the thin plate W is distorted along the longitudinal direction of the receiving member 101, the deformation ratio when the thin plate W is tensioned varies in the longitudinal direction of the receiving member 101, and the deformation ratio becomes irregular. It was difficult to calculate Therefore, the thin plate W cannot be processed according to the target dimension, and the processing accuracy of the thin plate W is lowered.

  Further, the dimension (length and width) of the thin plate W is stable within one production lot of the thin plate W, but varies within the range of tolerance between the production lots. If the dimension of the thin plate W becomes longer than the distance L between the wall portions 101a facing each other, both ends of the thin plate W abut against the wall portion 101a and the thin plate W is loosened. In this case, even if the thin plate W is sandwiched between the receiving member 101 and the holding member 102 and the thin plate W is tensioned, a sufficient tension cannot be applied to the thin plate W. Looseness sometimes remained. In such a case, since the deformation ratio of the thin plate W is changed as compared with the case where sufficient tension can be applied to the thin plate W, the processing accuracy is reduced as described above.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a laser processing machine and a holding device that can improve processing accuracy.

Means for Solving the Problems and Effects of the Invention

  To achieve this object, according to the laser processing machine of the first aspect, the holding device stands on the receiving member having a mounting surface on which the thin plate is mounted and on the rear end side of the mounting surface of the receiving member. While being biased upward by the biasing member, the biasing member disposed at one end side of the wall portion to be installed, the upper step portion connected to the upper end of the wall portion and formed in a stepped shape with the mounting surface, A pressing member having a pressing surface facing the mounting surface at a predetermined interval along the longitudinal direction of the mounting surface, and a thin plate is provided in the gap between the receiving member and the pressing member formed by the urging member. Can be easily inserted.

  In addition, since the one end side of the urging member is disposed on the upper portion formed stepwise with the mounting surface by the wall portion, when the thin plate is inserted between the receiving member and the pressing member, the thin plate is attached to the wall portion. It is obstructed and cannot reach the biasing member. Thereby, it can prevent that the urging | biasing member is damaged by the edge part of a thin plate colliding. Further, since the fastener is provided, the thin plate can be held by the holding device by inserting the thin plate and placing it on the mounting surface of the receiving member and then pressing the pressing surface of the pressing member against the thin plate.

  Further, since the pressing member has a pressing surface formed longer than the width of the thin plate in the direction orthogonal to the relative movement direction of the second holding portion, the entire width of the thin plate can be pressed by a single pressing member. The thin plate can be held without distortion between the pressing surface of the pressing member and the mounting surface of the receiving member. As a result, it is possible to prevent variation in the amount of elastic deformation of the thin plate along the longitudinal direction of the receiving member and to improve the processing accuracy.

  In addition, the distance between the lower end portions of the wall portions erected on the receiving members of the first sandwiching portion and the second sandwiching portion in a state before the second sandwiching portion relatively moves in the direction away from the first sandwiching portion. Is set to be larger than the maximum value of the dimensional tolerance of the thin plate, so even if the size of the thin plate fluctuates to the maximum value within the tolerance range, the end of the thin plate inserted between the receiving member and the holding member The part can be prevented from hitting the wall part. As a result, the thin plate can be sandwiched between the receiving member and the presser member without causing slack, and sufficient tension can be stably applied to the thin plate by tensioning the thin plate. Therefore, there is an effect that processing accuracy can be improved.

  According to the laser processing machine of claim 2, the receiving surface of the receiving member and the pressing surface of the pressing member are disposed on the side far from the receiving member or the one wall portion of the pressing member where the pressing surface of the pressing member overlaps vertically. Alternatively, a light beam irradiating unit that irradiates a light beam toward the other side of the holding member and a through hole that is formed on the other of the receiving member or the holding member and that receives the irradiated light beam are provided. By detecting the presence or absence of an incident light beam, it is possible to detect whether the dimension of the thin plate is short enough not to reach the position of the through hole. When the dimensions of the thin plate are short, pinching and tension between the mounting surface of the receiving member and the pressing surface of the holding member may be incomplete, and the processing accuracy may be reduced. Therefore, in addition to the effect of the laser processing machine according to claim 1, there is an effect of preventing a reduction in processing accuracy due to processing performed without realizing that the dimension of the thin plate is short.

  According to the laser processing machine of claim 3, since the pressing surface of the pressing member or the mounting surface of the receiving member is inclined in a direction approaching each other as the distance from the wall portion increases along the pulling direction of the second clamping portion, By holding the thin plate between the receiving member and the pressing member and separating the second holding portion and the first holding portion, a force that causes the inner edge of the pressing surface or the mounting surface to bite into the thin plate acts and can hold the thin plate. As a result, a tensile force can be applied to the thin plate sandwiched between the receiving member and the pressing member without loss, and the thin plate can be elastically deformed in a controlled state. As a result, in addition to the effect produced by the laser beam machine according to claim 1 or 2, there is an effect that machining accuracy can be improved.

  According to the laser processing machine according to claim 4, since the upper portion of the wall portion protrudes toward the processing head with respect to the lower portion side, the tip of the thin plate inserted between the receiving member and the pressing member However, it is prevented from striking the wall portion and being received by the receiving member and overcoming the wall portion. Thereby, in addition to the effect which the laser processing machine in any one of Claims 1-3 shows, there exists an effect which can prevent that the thin plate pinched | interposed into a receiving member and a pressing member is bent by a wall part. .

  According to the holding device of the fifth aspect, there is an effect equivalent to that of the holding device used in the laser processing machine according to any one of the first to fourth aspects.

It is a top view of XY stage of the laser beam machine in one embodiment of the present invention. It is the elements on larger scale of the XY stage of a laser beam machine. It is sectional drawing of the holding | maintenance apparatus in the III-III line of FIG. It is sectional drawing of the holding | maintenance apparatus in the IV-IV line of FIG. (A) is sectional drawing of the holding | maintenance apparatus in the Va-Va line | wire of FIG. 2, (b) is sectional drawing of a pressing member and a receiving member when a fastener is open | released. (A) is a top view of the conventional holding | maintenance apparatus, (b) is a front view of a holding | maintenance apparatus.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of an XY stage 3 of a laser beam machine 1 according to an embodiment of the present invention. The laser processing machine 1 is an apparatus that cuts a thin plate W by irradiating a metal thin plate W as a workpiece with laser light. In the laser processing machine 1, a processing head (not shown) for irradiating the thin plate W with condensed laser light and a processing table 2 for sandwiching the thin plate W between the processing head are fixedly arranged with respect to the surface plate. At the same time, the XY stage 3 is mounted so as to be movable in a plane perpendicular to the optical axis of the laser beam emitted from the machining head, and the laser beam is emitted from the machining head and the XY stage 3 is moved in the XY direction. Alternatively, the driving force of the cylinder 40 is controlled by a control device (not shown).

  As shown in FIG. 1, the XY stage 3 is formed by connecting the ends of two long frame members 3 a and 3 b facing each other at a predetermined interval with two short frame members 3 c and 3 d so as to have a substantially frame shape in plan view. It is formed in a shape. The XY stage 3 has a plurality of reinforcing members (not shown) connected to the long frame members 3a and 3b and the short frame members 3c and 3d, and is formed into a box shape by each of the reinforcing members, so that as a whole The rigidity of is reinforced.

  The XY stage 3 is provided with a holding device 10 that holds the thin plate W. The holding device 10 includes a first clamping unit 20 and a second clamping unit 30. The first clamping part 20 and the second clamping part 30 are each provided with a fixed member 21 and a movable member 31 arranged in parallel to the short frame members 3c and 3d, and the fixed member 21 is inside the short frame member 3c. Are installed between the long frame members 3a and 3b, and are fastened and fixed to the long frame members 3a and 3b by fastening bolts 31a. The long frame members 3a and 3b are formed with fastening holes (not shown) at predetermined intervals along the longitudinal direction (left and right direction in FIG. 1), and the fixing member 21 corresponds to the size of the thin plate W. It is fixed at the position. The movable member 31 is provided along the inner side of the short frame member 3d, and both longitudinal end portions (vertical end portions in FIG. 1) are slidably held on a guide surface (not shown) of the guide member 4. Yes.

  The first clamping unit 20 and the second clamping unit 30 are elongated plate-shaped receiving members 22 and 32 (see FIG. 3) disposed along the upper edge of the fixed member 21 and the movable member 31, and the receiving member. The holding members 23 and 33 are provided on the upper portions of the holding members 22 and 32, and the fastening tools 24 and 34 that apply a pressing force to the holding members 23 and 33. Four fasteners 24 and 34 are symmetric with respect to an imaginary line (not shown) passing through the center of the XY stage 3 in the width direction (vertical direction in FIG. 1). It is arranged.

  A cylinder 40 attached to the short frame member 3d is connected to a side surface of the movable member 31 on the short frame member 3d side via a link L. Further, the movable member 31 and the short frame member 3d are connected by a connecting member 50. The cylinder 40 is symmetric with respect to a virtual line (not shown) that is located outside the movable member 31 in the width direction of the XY stage 3 and passes through the center of the XY stage 3 in the width direction (vertical direction in FIG. 1). One is disposed at each position. One connecting member 50 (see FIG. 2) is disposed at a position that is inward of the cylinder 40 in the width direction of the XY stage 3 and symmetrical with respect to the imaginary line.

  Next, a detailed configuration near the movable member 31 will be described with reference to FIG. FIG. 2 is a partially enlarged plan view of the XY stage 3 of the laser processing machine 1. As shown in FIG. 2, the cylinder 40 is attached to the short frame member 3 d with the rod 41 facing the movable member 31, and one end side of the link L is pivotally coupled to the tip of the rod 41. ing. On the other hand, a stay member 42 fastened and fixed to the side surface of the movable member is pin-coupled to the other end side of the link L so as to be swingable.

  Thereby, when the cylinder 40 is operated and the rod 41 is contracted and driven, the contracting force causes the movable member 31 to be drawn to the cylinder 40 side (right side in FIG. 2) via the link L, and tension is applied to the thin plate W. Therefore, the thin plate W can be held on the XY stage 3 (see FIG. 1) in a tensioned state. Further, in this case, both end portions in the longitudinal direction of the movable member 31 are held on the guide surface of the guide member 4 so as to be slidable in the front-rear and left-right directions, and through the two links L (see FIG. 1). Is connected to the cylinder 40, even if the thin plate W is fixed in a slightly slack state, the movable member 31 can be tilted in the horizontal direction to uniformly tension the thin plate W.

  Note that the cylinder 40 is an air cylinder that extends and contracts the rod 41 by using air pressure, and is configured as a backward-acting cylinder that operates both the extension drive and the contraction drive of the rod 41 by air pressure. Therefore, the driving force applied from the cylinder 40 to the movable member 31 can be released by releasing the driving pressure of the cylinder 40 (releasing to the atmosphere).

  The connecting member 50 is a member that connects the movable member 31 and the short frame member 3d, and is a flat stopper member 51 that is fastened and fixed to the side surface of the movable member 31 by a fastening bolt and protrudes toward the short frame member 3d. The flat base member 52 with which the bottom surface abuts, the bottom surface of the stopper member 51, and the top surface of the base member 52 are slidable.

  The stopper member 51 and the base member 52 are formed as flat surfaces whose upper surface and bottom surface are parallel to each other, and are disposed so that their upper surface and bottom surface are parallel to the expansion / contraction direction of the cylinder 40. Therefore, the bottom surface of the stopper member 51 and the top surface of the base member 52 are slidable when the movable member moves in parallel with the expansion and contraction of the cylinder 40.

  The stopper member 51 is formed with a long hole 51a having a plan view oval shape extending in parallel with the expansion and contraction direction of the rod 41 in the cylinder 40, and the base member 52 has a length of the stopper member 51. A shaft insertion hole (not shown) having a circular shape in plan view is formed penetrating in the thickness direction at a position corresponding to the hole 51a. The short frame member 3d is formed with a through hole (not shown) having a circular shape in plan view at a position corresponding to the shaft insertion hole of the base member 52 in the plate thickness direction. The handle portion 53 is screwed onto the upper portion of the fastening shaft member 54, and the fastening shaft member 54 is inserted through each of the elongated holes 51a and the through holes (perpendicular to the plane of FIG. 2), and a fastening nut having a double nut function at the lower end. A portion (not shown) is screwed so as not to rotate.

  Accordingly, the handle portion 53 is rotated and the handle portion 53 is screwed with respect to the fastening shaft member 54, whereby the stopper member 51 and the base member 52 are connected to the fastening nut portion (short frame member 3 d) and the handle portion 53. The movable member 31 and the short frame member 3d can be fastened by the connecting member 50 (hereinafter, this state is referred to as a “fastened state”). That is, when cutting the thin plate W, the movable member 31 is pulled toward the short frame member 3d side by the contraction force of the cylinder 40, and a tension state is formed by applying the tension of the thin plate W. The member 50 is brought into a fastening state, and the movable member 31 and the short frame member 3d are connected by the connecting member 50. As a result, the amount of elongation of the thin plate W during the process of cutting the thin plate W can be regulated.

  Next, the detailed configuration of the holding device 10 will be described with reference to FIGS. 3 to 5. FIG. 3 is a cross-sectional view of the holding device 10 (second clamping unit 30) taken along line III-III in FIG. In addition, the structure of the 2nd clamping part 30 is demonstrated here and description is abbreviate | omitted about the 1st clamping part 20 comprised similarly.

  As shown in FIG. 3, the second clamping unit 30 includes a receiving member 32 in which a mounting surface 32 a on which the thin plate W is mounted is formed on the inner side (left side in FIG. 3), and a rear surface of the receiving member 32. A wall portion 32b erected on the end side (right side in FIG. 3), and a biasing member 35 which is connected to the upper end of the wall portion 32b and fixed at one end side to an upper step portion 32c formed in a step shape with the mounting surface 32a; The pressing member 33 includes a pressing member 33 that is fixed (abutted) on the other end side of the biasing member 35 and biased upward while facing the mounting surface 32a at a predetermined interval along the longitudinal direction of the mounting surface 32a. Configured.

  The receiving member 32 is fixed by bolts or the like in the vicinity of the inner edge (left side in FIG. 3) of the upper surface of the movable member 31, and the mounting surface 32 a is the width of the thin plate W in the longitudinal direction of the receiving member 32 (upper and lower sides in FIG. Direction). On the mounting surface 32a, a groove 32a1 is formed so as to be an uneven surface in the longitudinal direction. At the inner end of the mounting surface 32a, a protrusion 32d formed in a ridge shape is provided so as to protrude upward in the longitudinal direction.

  The wall portion 32b is erected on the rear end side (right side in FIG. 3) of the mounting surface 32a in the longitudinal direction (perpendicular to the paper surface in FIG. 3) of the receiving member 32, and is higher than the lower portion (lower side in FIG. 3). Is formed protruding to the inside (left side in FIG. 3). Since the upper portion of the wall portion 32b protrudes from the lower portion, when the thin plate W is inserted between the mounting surface 32a and the pressing surface 33a of the pressing member 33, the tip of the inserted thin plate W gets over the wall portion 32b. Is prevented. If the thin plate W gets over the wall portion 32b, when the pressing member 33 is pressed against the receiving member 32, the leading end of the thin plate W is bent at the wall portion 32b or the upper step portion 32c. Laser processing of the thin plate W may be performed by irradiating a laser beam from one surface of the thin plate W and then cutting it, and then turning the thin plate W upside down and engraving letters or the like on the opposite surface with the laser beam. If the tip is bent, it becomes difficult to sandwich the inverted thin plate W, and it is necessary to prevent this.

  The upper step portion 32c is a portion that is connected to the upper end of the wall portion 32b and is formed in a step shape with the mounting surface 32a. Through holes 32e are formed at two locations near both ends (the vertical direction in FIG. 1) of the receiving member 32. A penetration is formed from the upper surface of the portion 32 c to the bottom surface of the receiving member 32. The urging member 35 is formed of a compression coil spring, is inserted into the through hole 32 e from one end side, and is compressed between the upper surface of the movable member 31 and the lower surface of the pressing member 33. Since the urging member 35 is accommodated in the upper step portion 32c formed in a step shape with the mounting surface 32a by the wall portion 32b, the thin plate W is inserted when the thin plate W is inserted between the receiving member 32 and the pressing member 33. W is obstructed by the wall 32b and cannot reach the urging member 35. Therefore, it is possible to prevent the urging member 35 from being damaged due to the end of the thin plate W hitting.

  In the pressing member 33, a concave groove 33b in which the upper step portion 32c of the receiving member 32 is accommodated is formed in the longitudinal direction. A concave groove 33b is formed in the pressing member 33, and the upper step portion 32c of the receiving member 32 is accommodated in the concave groove 33b. Therefore, it is possible to prevent the pressing member 33 from being displaced in the short direction (left and right direction in FIG. 3) with respect to the receiving member 32. Further, the other end portion of the urging member 35 is brought into contact with the bottom surface of the concave groove 33b, and the urging member 35 is compressed between the movable member 31 and the pressing member 33, whereby the pressing member 33 is applied upward. Be forced. Thus, since the pressing member 33 is urged upward by the urging member 35, a gap can be provided between the mounting surface 32a and the pressing surface 33a. When the thin plate W is held by the holding device 10, the thin plate W may be inserted into the gap first, so that the operation can be easily performed.

  The pressing surface 33a is formed in the longitudinal direction on the inner side (left side in FIG. 3) from the concave groove 33b. The pressing surface 33a is a portion pressed against the mounting surface 32a of the receiving member 32, and a groove portion 33a1 is formed so as to be an uneven surface over the longitudinal direction. Since the groove portions 33a1 and 32a1 are formed in the pressing surface 33a and the mounting surface 32a, when the thin plate W is sandwiched, the frictional resistance between these surfaces and the thin plate W can be increased. As a result, when the cylinder 40 (see FIGS. 1 and 2) is driven to contract and the thin plate W is tensioned, the tensioned thin plate W may slip between the pressing surface 33a and the mounting surface 32a. It is suppressed.

  The length of the pressing surface 33a in the longitudinal direction is longer than the width of the thin plate W in the direction orthogonal to the relative movement direction (left and right direction in FIG. 3) of the movable member 31 (see FIGS. 1 and 2). Accordingly, the thin plate W can be sandwiched between the pressing surface 33a of the pressing member 33 and the mounting surface 32a of the receiving member 32 without being distorted. As a result, it is possible to prevent variation in the amount of elastic deformation of the thin plate W over the longitudinal direction of the receiving member 32 and improve processing accuracy.

  The length of the pressing surface 33a in the short direction is smaller than the length of the mounting surface 32a in the short direction. Thus, after the thin plate W is placed on the mounting surface 32a of the receiving member 32, when the pressing surface 33a of the pressing member 33 is pressed against the thin plate W, the thin plate W protrudes inside the mounting surface 32a as shown in FIG. It contacts the provided convex part 32d, and inclines from the convex part 32d to the pressing surface 33a. Thereby, when the cylinder 40 (refer FIG.1 and FIG.2) is driven and the thin plate W is tensioned, the component force of the tension force acts on the press surface 33a and the mounting surface 32a. As a result, since the frictional resistance can be further increased, the tensioned thin plate W is prevented from slipping and coming out from between the pressing surface 33a and the mounting surface 32a.

  The restricting portion 36 (see FIGS. 1 and 2) is a member that restricts the upward movement amount of the presser member 33 biased upward, and 2 near the both ends (vertical direction in FIG. 1) of the presser member 33. It is arranged at the place. In the present embodiment, the restricting portion 36 is formed by a bolt having a shaft portion 36a and a head portion 36b, and is formed in a through hole formed through the presser member 33 in the thickness direction (vertical direction in FIG. 3). The shaft portion 36 a is inserted, and the lower end portion of the shaft portion 36 a is screwed to the receiving member 32. The outer diameter of the head portion 36b is set larger than the inner diameter of the through hole of the pressing member 33 through which the shaft portion 36a is inserted, and the height from the upper surface of the movable member 31 to the lower surface of the head portion 36b is biased. The height of the pressing member 33 is set to a height at which the pressing member 33 comes into contact therewith. As a result, the upper surface of the presser member 33 comes into contact with the lower surface of the head portion 36b, so that further upward movement of the pressed presser member 33 is restricted.

  Next, with reference to FIG. 4, the fastener of the 2nd clamping part 30 is demonstrated. 4 is a cross-sectional view of the holding device 10 (second clamping unit 30) taken along line IV-IV in FIG. In FIG. 4, the description of the stay member 42 that can be seen on the right side of the movable member 31 is omitted.

  As shown in FIG. 4, the second clamping unit 30 includes a fastening tool 34 fixed with a bolt or the like in the vicinity of the outer edge (right side of FIG. 4) of the upper surface of the movable member 31. In the fastener 34, a pressing body 34 a that presses the upper portion of the pressing surface 33 a formed on the pressing member 33 is attached to the link 34 b, and the link 34 b is pinned to a bracket 34 c fixed to the upper surface of the movable member 31. It is connected with. Further, the handle 34e is connected to the link 34b by a pin 34f, and is connected to the bracket 34c by a pin 34h through the link 34g.

  Since the fastening tool 34 is configured as described above, when the handle 34e is pushed down, as shown in FIG. 4, the pressing body 34a presses the pressing member 33, and the mounting surface 32a and the pressing surface 33a The thin plate W inserted therebetween is sandwiched. Further, when the handle 34e is raised upward, the link 34b rotates clockwise and the pressurizing member 34a moves upward, so that the pressing member 33 is raised by the urging force of the urging member 35 (see FIG. 3). A gap is formed between the mounting surface 32a and the pressing surface 33a. As a result, in order to sandwich the thin plate W between the mounting surface 32a and the pressing surface 33a, it is possible to insert the thin plate W therebetween.

  Here, in order to sandwich the thin plate W between the receiving member 32 and the pressing member 33, the state before the second sandwiching portion 30 is relatively moved in the direction away from the first sandwiching portion 20 (see FIG. 1) (cylinder In the state where the distance between the second clamping unit 30 and the first clamping unit 20 is reduced by extending 40, the thin plate W is inserted between the mounting surface 32a and the pressing surface 33a. The distance between the lower end portion of the wall portion (not shown) standing on the receiving member 21 and the lower end portion of the wall portion 32b standing on the receiving member 32 of the second holding portion 30 is the dimension of the thin plate W. It is set to be larger than the maximum tolerance. Therefore, even if the dimension of the thin plate W fluctuates to the maximum value within a tolerance range (about ± 3 mm), the end portion of the thin plate W inserted between the receiving member 32 and the pressing member 33 hits the wall portion 32b. Can be prevented.

  Accordingly, the thin plate W can be sandwiched between the first sandwiching portion 20 and the second sandwiching portion 30 without causing slack, and by tensioning the thin plate W, sufficient tension can be stably applied to the thin plate W. Can be granted. Therefore, it can prevent that the tension | tensile_strength provided to the thin plate W fluctuates for every thin plate, and the amount of elastic deformations fluctuates. Therefore, the processing accuracy by the laser beam can be improved.

  Next, the light beam irradiation unit 60 will be described with reference to FIG. FIG. 5A is a cross-sectional view of the holding device 10 (second clamping unit 30) taken along the line Va-Va in FIG. As shown in FIG. 5 (a), the second clamping unit 30 is moved up and down on the receiving member 32 and the pressing member 33 in a portion where the mounting surface 32a of the receiving member 32 and the pressing surface 33a of the pressing member 33 overlap vertically. The communicating through holes 30a and 30b are formed through.

  The through holes 30a and 30b are formed at the position of the clamping limit line on the side farther from the wall portion 32b of the receiving member 32 and the pressing member 33 (left side in FIG. 5). If the end of the inserted thin plate W is on the side of the wall 32b beyond the clamping limit line, the sandwiching limit line can be moved between the mounting surface 32a and the pressing surface 33a even when the thin plate W is tensioned. It is a line which shows the limit which can be clamped. On the other hand, if the end of the inserted thin plate W does not exceed the clamping limit line, that is, if the area of the thin plate W sandwiched between the mounting surface 32a and the pressing surface 33a is reduced, the thin plate W is tensioned. There is a risk that the thin plate W may come off between the mounting surface 32a and the pressing surface 33a.

  In the present embodiment, a light beam irradiating unit 60 that irradiates a light beam toward the other through hole 30 b is accommodated in the through hole 30 a formed in the receiving member 32 a, and is formed in the holding member 33. The light receiving portion 61 that receives the light beam incident on the through hole 30b is accommodated in the through hole 30b. The light receiving unit 61 inputs the presence / absence of detection of the light beam via the cable C to an output circuit (not shown), and the output circuit processes the detection result and outputs it to a control device (not shown).

  The control device is a device that controls the irradiation of the laser beam from the processing head, the movement of the XY stage 3 in the X and Y directions, or the driving force of the cylinder 40. If the light receiving unit 61 detects a light beam, the mounting surface Since the area of the thin plate W sandwiched between 32a and the pressing surface 33a is small, it is judged that the thin plate W may come out from between the mounting surface 32a and the pressing surface 33a when the thin plate W is tensioned. The operator is notified by a warning sound or the like, and the operation of the laser processing machine 1 is set in a standby state.

  On the other hand, when the light receiving unit 61 does not detect the light beam, it is determined that the inserted thin plate W exceeds the clamping limit line (the positions of the through holes 30a and 30b), so the cylinder 40 (see FIG. 1). ) To tension the thin plate W and continue the laser processing. When the dimension of the thin plate W is short, pinching and tension of the thin plate W by the mounting surface 32a of the receiving member 32 and the pressing surface 33a of the pressing member 33 become incomplete, resulting in a problem that the thin plate W comes off or processing accuracy. May decrease. However, since the laser processing machine 1 includes the light beam irradiation unit 60 and can determine whether the dimension of the thin plate W is short before laser processing, the processing is performed without noticing that the dimension of the thin plate W is short. Defects and processing accuracy can be prevented from decreasing.

  Next, the shapes of the pressing member 33 and the receiving member 32 will be described with reference to FIG. FIG. 5B is a cross-sectional view of the pressing member 33 and the receiving member 32 when the fastener 34 (see FIG. 4) is opened. As shown in FIG. 5B, the pressing surface 33 a of the pressing member 33 is placed on the mounting surface of the receiving member 32 as it moves away from the wall portion 32 b along the relative movement direction (left and right direction in FIG. 5) of the second clamping unit 30. It is configured to be inclined in a direction approaching 32a.

  Thus, when the pressing member 33 is lowered using the fastening tool 34 (see FIG. 4) after the thin plate W is placed on the mounting surface 32a, first, the inner side (left side in FIG. 5) of the pressing surface 33b contacts the thin plate W. As the pressing member 33 is lowered, the contact area between the pressing surface 33a and the thin plate W gradually increases. Therefore, the inner side strongly presses the thin plate W as compared with the outer side (right side in FIG. 5) of the pressing surface 33a. When the cylinder 40 (see FIG. 1) is contracted to separate the second clamping part 30 and the first clamping part 20, a force is applied so that the inner edge of the pressing surface 33a bites into the thin plate W to push the thin plate W. Stop. As a result, the tensioned thin plate W can be prevented from slipping between the receiving member 32 and the pressing member 33, and a tensile force can be applied to the thin plate W without loss, and the thin plate W is elastically deformed in a controlled state. be able to. As a result, processing accuracy can be improved.

  The present invention has been described above based on the embodiments. However, the present invention is not limited to the above embodiments, and various improvements and modifications can be made without departing from the spirit of the present invention. It can be easily guessed. For example, the numerical values (for example, the quantity of each component) given in the above embodiment are examples, and other numerical values can naturally be adopted.

  In the above embodiment, the light receiving unit 61 is accommodated in the through hole 30b formed in the holding member 33, and the control device performs laser processing depending on the presence or absence of incident light from the light beam irradiation unit 60 disposed in the receiving member 32. Although the case where the machine 1 is operated has been described, the present invention is not necessarily limited thereto, and it is naturally possible to arrange the light beam irradiation unit 60 on the pressing member 33 and the light receiving unit 61 on the receiving member 32. is there.

  In addition, the light receiving portion 61 is not always necessary, and the light receiving portion 61 may not be accommodated in the through hole 30 b formed in the pressing member 33. In this case, the person who operates the laser beam machine 1 can determine the presence or absence of the thin plate W by visually recognizing the light beam passing through the through hole 30b. When the operator can visually recognize the light beam passing through the through hole 30b despite the operation of holding the thin plate W (when the dimension of the thin plate W is short), the operator operates the laser beam machine. By stopping the operation 1, it is possible to prevent a problem from occurring.

  In the above-described embodiment, the holding device 10 includes the fixed member 21 and the movable member 31, and when the movable member 31 moves in a plane with respect to the fixed member 21, that is, the second relative to the fixed first clamping unit 20. Although the case where the clamping unit 30 moves in a plane has been described, the present invention is not necessarily limited thereto, and both the first clamping unit 20 and the second clamping unit 30 move to apply tension to the held thin plate W. It is also possible. In this case, the same effect can be obtained.

  In the above-described embodiment, the case where the pressing surface 33a of the pressing member 33 is inclined toward the inner side (left side in FIG. 5) is not necessarily limited to this, and the mounting surface 32a of the receiving member 32 is on the inner side. Of course, it is also possible to incline towards. Also in this case, the thin plate W can be pressed and held firmly inside the mounting surface 32a and the pressing surface 33a (on the processing head side).

  In the above embodiment, the case where the urging member 35 is formed of a compression coil spring has been described. However, the urging member 35 is not necessarily limited thereto, and other urging members can be employed. Examples of other urging members include a leaf spring, a disc spring, a synthetic resin, and a rubber elastic body.

DESCRIPTION OF SYMBOLS 1 Laser beam machine 2 Processing stand 3 XY stage 10 Holding device 20 1st clamping part 22 Receiving member 23 Holding member 24 Fastening tool 30 2nd clamping part 30b Through-hole 32 Receiving member 32a Loading surface 32b Wall part 32c Upper step part 33 Holding Member 33a Pressing surface 34 Fastening tool 35 Biasing member 60 Light beam irradiation part W Thin plate

Claims (5)

A processing head that irradiates a thin plate as a workpiece with laser light, an XY stage that moves in a plane perpendicular to the optical axis of the laser light irradiated from the processing head, and an XY stage that is attached to the processing head And a holding device for holding the thin plate, the holding device holding a first holding portion for holding one end of the thin plate, and a second end opposite to one end of the thin plate held by the first holding portion. And a second clamping unit that relatively moves in a direction away from the first clamping unit and applies tension to the thin plate,
The first clamping part and the second clamping part are
A receiving member having a mounting surface on which the thin plate is mounted;
A wall portion erected on the rear end side of the upper surface of the receiving member,
A biasing member that is in communication with the upper end of the wall and has an upper end portion that is formed in a stepped shape with the upper surface;
While being urged upward by the urging member, the thin plate in the direction perpendicular to the relative movement direction of the second holding portion is opposed to the upper surface described above with a predetermined interval along the longitudinal direction of the upper surface described above. A pressing member having a pressing surface formed longer than the width;
A clamp that lowers the pressing member against the biasing force of the biasing member and presses the pressing surface of the pressing member against the thin plate placed on the mounting surface of the receiving member;
Between the lower end portions of the wall portions erected on the receiving members of the first clamping portion and the second clamping portion, respectively, in a state before the second clamping portion relatively moves in a direction away from the first clamping portion. Is set to be greater than the maximum value of the dimensional tolerance of the thin plate. At least one of the first clamping part or the second clamping part is
The receiving surface of the receiving member and the pressing surface of the pressing member are arranged on a side far from the wall portion of the receiving member or the pressing member, and the other of the receiving member or the pressing member. A light beam irradiation unit for irradiating a light beam toward
The laser processing machine according to claim 1, further comprising a through hole formed on the other of the receiving member or the pressing member and into which the irradiated light beam is incident. The pressing surface of the pressing member or the mounting surface of the receiving member is
3. The laser beam machine according to claim 1, wherein the laser beam machine is inclined in a direction approaching each other as the distance from the wall portion increases along a relative movement direction of the second holding portion.   4. The laser processing machine according to claim 1, wherein an upper side of each of the wall portions protrudes toward a direction of the processing head with respect to a lower side.   A holding device used in the laser processing machine according to claim 1.

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