JP2011200399A - Endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope in which a part of an insertion part to be inserted into a subject is a bendable bending part, the endoscope obtaining a high radiation effect inexpensively.SOLUTION: A distal end part 14a having a cylindrical body inner space 65 storing an imaging module 69 is provided at the distal end of the endoscope 10. The bending part 14b where a plurality of substantially cylindrical bending pieces 40 are serially connected is provided at the proximal end side of the distal end part 14a. A portion from the cylindrical body inner space 65 to a piece inner space 63a of a head bending piece 40a at the most distal end is filled with a high thermal conductive resin 81 with high insulating property and thermal conductivity, and the resin is solidified. Heat generated from the imaging module 69, etc., is radiated in the substantially whole part of the head bending piece 40a.

Description

  The present invention relates to an endoscope in which a part of an insertion portion inserted into a subject is a bending portion that can be bent.

  Conventionally, medical diagnosis using an endoscope has been performed in the medical field. The endoscope includes an insertion portion that is inserted into a patient's body and an operation portion that is provided at a proximal end of the insertion portion. At the distal end portion of the insertion portion, an imaging module including an imaging element and a circuit board, a light guide that guides illumination light from the light source device to the distal end surface of the distal end portion, and the like are provided.

  The tip of the insertion portion rises in temperature as heat generated from the imaging module, light guide, and the like is trapped inside. If the temperature of the tip portion is excessively increased, there is a risk that a burn will occur at the site to be observed in the patient.

  In order to solve such a problem, in the endoscope of Patent Document 1, the internal space of the cylindrical tip portion is filled with a high thermal conductivity resin containing metal powder or the like, and this high thermal conductivity resin is filled. The heat generated from the imaging module etc. is radiated to the outside of the endoscope via the. Further, in the endoscope of Patent Document 2, heat is radiated to the outside in the same manner as the endoscope of Patent Document 1 by filling the space between the inner periphery of the distal end portion and the imaging module with a high thermal conductive resin. is doing.

Japanese Patent Laid-Open No. 11-032985 Japanese Patent No. 2665441

  However, since the endoscope of Patent Document 1 fills the internal space of the distal end portion with a conductive high thermal conductive resin, it is necessary to insulate the imaging element and the circuit board, which increases the number of manufacturing steps and costs. . Further, in the endoscope of Patent Document 2, since the high thermal conductive resin is partially filled in the vicinity of the imaging module in the distal end portion, a heat radiation path for heat generated from the imaging module or the like is limited. For this reason, the endoscope of Patent Document 2 cannot obtain a high heat dissipation effect.

  Furthermore, in recent years, in order to obtain a high-quality endoscopic image for accurate medical diagnosis, a high-resolution imaging device is mounted on the endoscope and the amount of illumination light is increased. In such an endoscope, the heat generated from the imaging module and the light guide increases, so that heat dissipation is not achieved simply by filling the internal space of the tip with a high thermal conductive resin as described in Patent Documents 1 and 2. May be sufficient. For this reason, there is still a possibility that the temperature of the tip portion will rise excessively and burns will occur at the site to be observed.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an endoscope capable of obtaining a high heat dissipation effect at low cost.

  In order to achieve the above object, an endoscope according to the present invention is provided at a distal end of an insertion portion to be inserted into a subject and has a distal end portion having a first internal space in which an imaging portion is incorporated, and a rear end of the distal end portion. A curved portion formed by connecting a plurality of substantially cylindrical curved pieces having high thermal conductivity connected in series, and a second internal space communicating with the first internal space is formed on an inner periphery of the curved piece; A bending portion that is filled and solidified from the first internal space to the second internal space of the first bending piece at the forefront of the bending piece, and a resin having insulating properties and high thermal conductivity, It is characterized by providing.

  In the second internal space, the resin is preferably filled and solidified in a space excluding a connecting portion between the first bending piece and the bending piece adjacent to the first bending piece. It is preferable that a cable connected to the imaging unit is inserted in the first internal space, and the resin fixes the position of the cable. Furthermore, it is preferable that the resin covers and fixes a connection portion between the imaging unit and the cable.

  It is preferable that the resin is formed by adding a plurality of types of high thermal conductivity fillers having different aspect ratios to an insulating resin.

  The endoscope of the present invention is filled and solidified with a resin having insulating properties and high thermal conductivity from the first internal space at the distal end of the endoscope to the second internal space of the most advanced first bending piece. Therefore, the heat generated inside the tip can be released through the resin in the second internal space and the first bending piece. Thereby, a higher heat dissipation effect can be obtained than when only the first internal space is filled with resin. Furthermore, since this resin has an insulating property, it is not necessary to insulate the image sensor or the circuit board in the first internal space, so that the manufacturing cost can be reduced and the manufacturing process can be reduced. Can do.

  Further, in the second internal space, heat can be radiated in almost the entire first bending piece by filling and solidifying resin in a space excluding the connecting portion between the first bending piece and the adjacent bending piece. Thereby, the heat dissipation effect higher than the case where resin is filled in a part in 2nd interior space is acquired. Moreover, since the said connection part is not covered with resin, the bending operation | movement of a bending part is not prevented.

It is a perspective view which shows the structure of an endoscope system. It is a front view of the front-end | tip cover of the insertion part of an endoscope. It is sectional drawing of the flexible tube part of an insertion part. It is sectional drawing of the curved part of an insertion part. It is an external appearance perspective view of a bending piece. It is sectional drawing of the front-end | tip part of an insertion part. It is an expanded sectional view of highly heat conductive resin. It is explanatory drawing which shows the front-end | tip cover before the adhesion fixing of a cylindrical body. It is explanatory drawing which shows the state which piled up the high heat conductive resin around the built-in thing. It is explanatory drawing for demonstrating the adhesion fixation of a cylindrical body. It is explanatory drawing for demonstrating a thermal radiation path | route. It is sectional drawing of the front-end | tip part of other embodiment.

  As shown in FIG. 1, the endoscope system 2 includes an endoscope 10, a processor device 11, a light source device 12, an air / water supply device 13, and the like. The air / water supply device 13 is built in the light source device 12 and is provided outside the light source device 12 and a well-known air supply pump 13a that generates a delivery pressure of fluid such as air or cleaning water, and stores cleaning water. It is comprised from the water tank 13b. The endoscope 10 is connected to an insertion unit 14 that is inserted into a subject, an operation unit 15 that is connected to a proximal end (rear end) portion of the insertion unit 14, and a processor device 11 and a light source device 12. And a universal cord 16.

  The insertion portion 14 is provided at the distal end thereof, and is continuously provided at a distal end portion 14a in which a CCD image sensor (hereinafter simply referred to as CCD, see FIG. 6) 71 for in-subject imaging is incorporated, and a proximal end of the distal end portion 14a. The bendable bendable portion 14b and the flexible flexible tube portion 14c connected to the base end of the bendable portion 14b. Hereinafter, the distal end side of the insertion portion 14 is simply referred to as “distal end side”, and the proximal end side of the insertion portion 14 is simply referred to as “proximal end side”.

  As shown in FIG. 2, the distal end cover 20 of the distal end portion 14a is provided with an observation window 21, illumination windows 22a and 22b, a forceps outlet 23, and an ejection nozzle 24. A CCD 71 and the like are attached to the back of the observation window 21. Two illumination windows 22a and 22b are arranged at symmetrical positions with respect to the observation window 21, and irradiate the observation site in the subject with illumination light from the light source device 12. The forceps outlet 23 communicates with a forceps port 26 (see FIG. 1) of the operation unit 15. The injection nozzle 24 injects air and cleaning water supplied from the air / water supply device 13 toward the observation window 21 to wipe away dirt adhering to the observation window 21.

  Returning to FIG. 1, a connector 28 is attached to one end of the universal cord 16. The connector 28 is a composite type connector, and is connected to the processor device 11 and the light source device 12.

  The processor device 11 performs various kinds of image processing on the image pickup signal input from the CCD 71 via the universal cord 16 and the connector 28 to generate an endoscopic image. The endoscopic image generated by the processor device 11 is displayed on a monitor 29 connected to the processor device 11 by a cable. The processor device 11 is connected to the light source device 12 via a communication cable, and communicates various control information with the light source device 12.

  As shown in FIG. 3, a plurality of built-in objects such as light guides 31a and 31b, forceps channel 32, air / water supply channel 33, and multi-core cable 34 are loosely inserted into the flexible tube portion 14c. It has become. The light guides 31a and 31b guide the light from the light source device 12 to the illumination windows 22a and 22b. The forceps channel 32 communicates the forceps outlet 23 and the forceps opening 26. The air / water supply channel 33 sends the air and washing water supplied from the air / water supply device 13 to the spray nozzle 24. The multi-core cable 34 electrically connects the processor device 11 and the CCD 71.

  The flexible tube portion 14c includes a screw tube 36 called a flex that protects the inside while maintaining flexibility in order from the inside, and a net 37 called a blade that covers the screw tube 36 and prevents the extension of the screw tube 36. And a flexible rubber 38 coated on the net 37.

  As shown in FIGS. 1 and 4, the bending portion 14 b connects a plurality of substantially cylindrical bending pieces 40 in series, covers the outer periphery of the bending piece 40 with a bendable cylindrical body 41, and The outer periphery of the shaped body 41 is covered with rubber 38. In FIG. 4, in order to prevent complication of the drawing, the illustration of components other than the bending piece 40 is omitted as appropriate.

  The cylindrical body 41 is made of a material having good thermal conductivity. When this material is, for example, metal, a bendable metal bellows tube or the like is used as the cylindrical body 41. The cylindrical body 41 extends to the tip cover 20 of the tip portion 14a (see FIG. 6).

  The bending piece 40 is formed of a metal having good thermal conductivity. A leading bending piece 40 (hereinafter referred to as a leading bending piece 40a) corresponding to the first bending piece of the present invention is fixed to the cylindrical body 41 within the distal end portion 14a. Further, the last bending piece 40 is fixed to the flexible tube portion 14 c via the connection member 43 and the fixing member 44. The bending portion 14b bends in the up and down direction and the left and right direction in conjunction with the up and down operation of the operation unit 15 or the operation of the left and right angle knobs 45a and 45b. Thereby, the front-end | tip part 14a can be orient | assigned to the desired direction in a body.

  In FIG. 5 showing the vicinity of the VV cross section of FIG. 4, the bending piece 40 includes a cylindrical portion 47, a pair of inner tongues 48 and an outer tongue 49. The inner tongue 48 protrudes from the end of the cylindrical portion 47, and the outer tongue 49 protrudes from a position at the proximal end of the cylindrical portion 47 facing each other.

  The inner tongue 48 is formed in a substantially disc shape, and a connection hole 50 is formed in the center thereof. The outer tongue 49 is formed in a substantially disk shape that is slightly smaller than the inner tongue 48, and has a connection hole 51 that is slightly smaller than the connection hole 50 of the inner tongue 48. The inner tongues 48 and the outer tongues 49 are alternately arranged at intervals of 90 ° in the circumferential direction of the cylindrical portion 47. The inner tongue 48 is located one step away from the outer tongue 49 on the inner side in the radial direction of the cylindrical portion 47. The amount of deviation is about the thickness of the cylindrical portion 47.

  The bending pieces 40 are connected to each other via connecting pins 53 and 54. The connecting pin 53 includes a small diameter portion 55, a large diameter portion 56, a contact portion 57, and a frustoconical wire guide portion 58 each formed in a cylindrical shape. The connecting pin 54 has the same configuration as the connecting pin 53.

  The connecting pin 53 is configured such that the outer tongue 49 of the bending piece 40 on the distal end side and the inner tongue 48 of the bending piece 40 on the proximal end side overlap with each other. Are inserted into the connecting holes 50 and the end surfaces of the large-diameter portions 56 are brought into contact with the inner surfaces of the outer tongues 49 so that the bending pieces 40 are rotatably connected. After the bending pieces 40 are connected to each other, the rear end of the small diameter portion 55 is crimped, and the connection pin 53 is prevented from falling off the bending pieces 40. The connecting pin 54 also connects the bending pieces 40 in the same manner as the connecting pin 53.

  A guide hole 60 penetrating in the radial direction is formed in the wire guide portion 58 of each of the connecting pins 53 and 54. Up and down or left and right operation wires 61 a and 61 b are inserted into the respective guide holes 60. One end of each operation wire 61a, 61b is fixed to the distal end portion 14a, passes through the bending portion 14b and the flexible tube portion 14c, and rotates in the operation portion 15 together with the upper and lower or left and right angle knobs 45a, 45b (not shown). And the other end is also fixed to the tip end portion 14a. When the up / down angle knob 45a is operated, the up / down operation wire 61a is pushed and pulled, and when the left / right angle knob 45b is operated, the left / right operation wire 61b is pushed and pulled.

  In addition to the operation wires 61a and 61b, in the piece internal space (second internal space) 63 formed by the inner periphery of each bending piece 40, the light guides 31a and 31b, the forceps channel 32, The air / water supply channel 33, the multi-core cable 34 and the like are inserted.

  As shown in FIG. 6, the distal end portion 14a includes the distal end portion of the tubular body 41, the above-described distal end cover 20 (see FIG. 2) that closes the opening on the distal end side of the tubular body 41, and the tubular body. 41 and rubber 38 covering the outer periphery of the tip cover 20 and various built-in objects built in a cylindrical body internal space (first internal space) 65 formed by the inner periphery of the cylindrical body 41.

  The light guides 31a and 31b, the forceps channel 32, the air / water supply channel 33, and the multi-core cable 34 are inserted into the cylindrical body internal space 65, and the objective optical system 67, the prism 68, and the imaging are taken. A module 69 is accommodated.

  A forceps channel 32 is connected to the forceps outlet 23 of the tip cover 20. Although not shown in FIG. 6, an illumination lens is incorporated behind the illumination windows 22a and 22b, and the exit ends of the light guides 31a and 31b face the illumination lens. Further, an air / water supply channel 33 is connected to the injection nozzle 24. One end of each of the forceps channel 32, the light guides 31a and 31b, and the air / water supply channel 33 is fixed to the tip cover 20, and the other end passes through the inside of the bending portion 14b, the flexible tube portion 14c, the operation portion 15, and the like. The forceps port 26, the light source device 12, and the air / water supply device 13 are respectively connected.

  In the back of the observation window 21, an objective optical system 67, a prism 68, and an imaging module 69 are disposed. The imaging module 69 includes a CCD 71, a circuit board 72, and the like. A CMOS image sensor may be provided instead of the CCD 71. The objective optical system 67 makes the image light of the observation site incident from the observation window 21 enter the prism 68. The prism 68 forms an image on the imaging surface 71 a of the CCD 71 by bending the image light from the objective optical system 67 inside.

  The CCD 71 is composed of, for example, an interline type CCD, and a bare chip having an imaging surface 71a provided on the surface is used. A rectangular plate-like cover glass 73 is attached on the imaging surface 71a. The CCD 71 is connected to the prism 68 through the cover glass 73.

  The circuit board 72 is bonded and fixed to the base end side of the CCD 71. The circuit board 72 is used for connection between the CCD 71 and the multicore cable 34. A plurality of terminals (not shown) are provided at adjacent ends of the CCD 71 and the circuit board 72, and both terminals are connected by bonding wires (not shown). Thereby, the CCD 71 and the circuit board 72 are electrically connected. An input / output terminal 74 is provided at the base end of the circuit board 72.

  The multi-core cable 34 has a configuration in which a plurality of signal cables 76 are bundled, the bundle of signal cables 76 is covered with a braided wire that functions as an electric shield layer, and the outer periphery of the braided wire is covered with an outer skin. In the multi-core cable 34, the braided wire and the outer sheath are removed in the vicinity of the circuit board 72, and a plurality of signal cables 76 are exposed. Note that only two signal cables 76 are shown in order to avoid complication of the drawing.

  One end of one signal cable 76 is solder-connected to an input / output terminal 74 of the circuit board 72. One end of the other signal cable 76 is soldered to a circuit board 78 on which various semiconductor chips for driving the CCD 71 and image processing are mounted. The other end portions of both signal cables 76 are connected to the processor device 11 through the inside of the bending portion 14b, the flexible tube portion 14c, the operation portion 15, the universal cord 16, and the connector 28. Accordingly, the CCD 71 is electrically connected to the processor device 11 via the circuit board 72 and the signal cable 76. The circuit board 78 is also electrically connected to the processor device 11 via the signal cable 76. With this connection, power is supplied from the processor device 11 to the CCD 71 and the circuit board 78, and various signals are exchanged between the processor device 11 and the CCD 71 and the circuit board 78.

  On the inner peripheral surface of the cylindrical body 41, a fixing member 79 for fixing the leading bending piece 40a to the tip end portion 14a is provided. The method of fixing the leading bending piece 40a is not particularly limited, and may be fixed with, for example, an adhesive, and the fixing position is not particularly limited. Thereby, the cylindrical body 41 and each bending piece 40 are integrated. The distal end portion of the cylindrical body 41 is fixed to the distal end cover 20 with an adhesive or the like.

  A highly thermally conductive resin 81 (indicated by dots) having high insulation and thermal conductivity is filled and solidified from the cylindrical body internal space 65 to the piece internal space 63a of the leading bending piece 40a. The high thermal conductive resin 81 is filled in the cylindrical body internal space 65 with almost no gap. Further, in the piece internal space 63a, the connecting portion 82 (the outer tongue 49, the inner portion of the connecting piece 82 between the leading bending piece 40a and the bending piece 40 adjacent thereto is provided. The space except for the tongue 48) is filled with almost no gap. In the drawing, the end surface on the base end side of the high thermal conductive resin 81 is almost smooth, but may be uneven, and further on the base end side if the movement of the connecting portion 82 is not hindered. It may be protruding.

  As shown in FIG. 7, the high thermal conductive resin 81 is obtained by adding a plurality of types of fillers having different aspect ratios to an insulating resin 84 having a high insulating property such as silicone or a flexible epoxy resin. Here, the aspect ratio is the ratio of the major axis to the thickness of the filler. The filler of the present embodiment includes a low aspect ratio shape filler 85 and a high aspect ratio shape filler 86. Three or more fillers having different aspect ratios may be added.

  As the low aspect ratio filler 85, for example, aluminum nitride, alumina, magnesium oxide, or the like is used, and the particle diameter thereof is several μm to several tens μm. The filler 85 is preferably spherical. The high aspect ratio shape filler 86 preferably has an aspect ratio of 10 or more. For example, hexagonal boron nitride is used, and the grain size in the plane direction is several tens to several hundreds of micrometers.

Since both the fillers 85 and 86 have high thermal conductivity, heat is transmitted along the transmission path S (indicated by a solid line) passing through either of the fillers 85 and 86 in the insulating resin 84. By adding the high aspect ratio shape filler 86 in addition to the low aspect ratio shape filler 85, compared with the case where only the low aspect ratio shape filler 85 is added, the high thermal conductivity is obtained even when the filling rate of the filler is lowered. Is obtained. For example, the filling rate of both fillers 85 and 86 in the high thermal conductive resin 81 is 30 to 60 vol%, the thermal conductivity is 2 W / mK or more, and the insulation (resistance value) is 10 ¹² Ω / m or more.

  Next, an example of a filling process for filling the cylindrical body internal space 65 and the piece internal space 63a with the high thermal conductive resin 81 will be described. First, as shown in FIG. 8, the objective cover 67, the prism 68, the CCD 71 and the circuit board 72, the forceps channel 32, the light guides 31 a and 31 b (not shown), the air supply,・ Attach a water supply channel 33 (not shown). In addition, one signal cable 76 of the multicore cable 34 is solder-connected to the circuit board 72 and the other signal cable 76 is solder-connected to the circuit board 78. Thereby, the preparation process before the cylindrical body 41 is bonded and fixed to the tip cover 20 is completed.

  As shown in FIG. 9, before the cylindrical body 41 is bonded and fixed, the high thermal conductive resin 81 is placed around or around the built-in components of the distal end portion 14 a and the curved portion 14 b using, for example, an injection needle. . Thereby, the substantially cylindrical highly heat conductive resin 81 is formed so as to cover each built-in object from the position corresponding to the cylindrical body internal space 65 to the position corresponding to the piece internal space 63a. At this time, the diameter of the high thermal conductive resin 81 is made larger than the diameters of the distal end portion 14a and the curved portion 14b. In addition, when the high thermal conductive resin 81 is stacked at a position corresponding to the internal space 63a, the high thermal conductive resin 81 is stacked so as to exclude the position corresponding to the connecting portion 82 described above.

  Next, as shown in FIG. 10A, in a state where the forceps channel 32 and the like are inserted into the cylindrical body 41 and the bending piece 40, the cylindrical body 41 is moved from the proximal end side to the distal end side of the insertion portion 14. , And the front end cover 20 is fitted into the opening of the cylindrical body 41, and then the cylindrical body 41 is bonded and fixed to the front end cover 20. At this time, since the diameter of the high thermal conductive resin 81 accumulated earlier is larger than the diameters of the tip portion 14a and the curved portion 14b, a part of the high thermal conductive resin 81 is a cylindrical body as shown in FIG. It protrudes to the outer peripheral side of 41.

  After wiping off the high thermal conductive resin 81 protruding to the outer peripheral side of the cylindrical body 41, the high thermal conductive resin 81 is solidified by performing a drying process or the like. Since the connecting portion 82 of the internal space 63a is not filled with the high thermal conductive resin 81, the bending operation of the bending portion 14b is not affected. Thus, the filling process of the high thermal conductive resin 81 is completed. After this filling process is completed, the outer periphery of the cylindrical body 41 and the tip cover 20 is covered with rubber 38, and the tip portion 14a as shown in FIG. 6 is obtained.

  In FIG. 11, heat generated from the CCD 71, the circuit boards 72 and 78, the light guides 31a and 31b, and the like in the cylindrical body internal space 65 is transmitted through the cylindrical body internal space 65 as indicated by straight arrows, and high heat is generated. The heat is transferred from the conductive resin 81 to the cylindrical body 41 and the rubber 38 to be radiated to the outside, and is also transferred to the high heat conductive resin 81 in the internal space 63a. Further, the heat transmitted to the cylindrical body 41 is transmitted back through the cylindrical body. The heat transmitted to the high thermal conductive resin 81 in the internal space 63a is transmitted to the leading bending piece 40a having high thermal conductivity, and is transferred to the rear bending piece 40 through the connecting portion 82 to be radiated. Further, heat is radiated to the rear and outside of the tubular body 41 through the tubular body 41 and the rubber 38.

  Thus, the heat generated inside the tip end portion 14a can be released through the high thermal conductive resin 81 and the leading bending piece 40a in the internal space 63a. At this time, the space excluding the connecting portion 82 in the internal space 63a is filled and solidified with the high thermal conductive resin 81 with almost no gap, so that heat can be dissipated in almost the entire leading curved piece 40a. As a result, a higher heat dissipation effect can be obtained than when the high thermal conductive resin 81 is simply filled and solidified in a part of the internal space 63a.

  In addition, by using an insulating resin 84 and fillers 85 and 86 as the high thermal conductive resin 81, the insulation processing (for example, insulating resin molding) of the CCD 71 and the circuit boards 72 and 78 becomes unnecessary, so that the manufacturing cost is increased. Can be suppressed at a low cost, and the manufacturing process can be further reduced.

  Furthermore, since the position of the multicore cable 34 in the cylindrical body inner space 65 can be fixed by the high thermal conductive resin 81, the movement of the multicore cable 34 can be regulated. As a result, the durability of the connection portion between the circuit boards 72 and 78 and each signal cable 76 can be improved. Moreover, since this connection part is also covered and fixed by the high thermal conductive resin 81, the durability of the connection part can be further improved.

  In the above-described embodiment, the high thermal conductive resin 81 has been described by taking as an example a material obtained by adding fillers 85 and 86 having different aspect ratios to the insulating insulating resin 84. If it is resin which has heat conductivity, there will be no limitation in particular.

  In the above embodiment, the space excluding the connecting portion 82 in the internal space 63a is filled and solidified with the high thermal conductive resin 81. However, when this is performed manually, the connecting portion 82 is made of the high thermal conductive resin 81. There is a risk of being covered. For this reason, as shown in FIG. 12, a restricting member 89 that restricts the flow of the high thermal conductive resin 81 to the connecting portion 82 may be provided on the distal end side of the connecting portion 82. The regulating member 89 is formed in a substantially bank shape, but the shape is not particularly limited as long as the high thermal conductive resin 81 can be regulated. Thereby, it is prevented that the connection part 82 is more reliably covered with the high thermal conductive resin 81.

DESCRIPTION OF SYMBOLS 10 Endoscope 14 Insertion part 14a Tip part 14b Bending part 40 Bending piece 40a Leading bending piece 41 Cylindrical body 63,63a Internal space 65 Cylindrical internal space 71 CCD
72 Circuit board 81 High thermal conductivity resin 82 Connection part

Claims (5)

A distal end portion provided at the distal end of the insertion portion to be inserted into the subject and having a first internal space in which the imaging portion is incorporated;
A bending portion that is connected to the rear end of the tip portion and has a plurality of substantially cylindrical bending pieces having high thermal conductivity connected in series, and the inner periphery of the bending piece is connected to the first internal space. 2 a curved portion in which an internal space is formed;
A resin that is filled and solidified from the first internal space to the second internal space of the first bending piece at the forefront of the bending pieces, and having an insulating property and high thermal conductivity;
An endoscope comprising:   2. The resin is filled and solidified in a space excluding a connecting portion between the first bending piece and the bending piece adjacent to the first bending piece in the second internal space. Endoscope. In the first internal space, a cable connecting to the imaging unit is inserted,
The endoscope according to claim 1, wherein the resin fixes a position of the cable.   The endoscope according to claim 3, wherein the resin covers and fixes a connection portion between the imaging unit and the cable.   The endoscope according to any one of claims 1 to 4, wherein the resin is obtained by adding a plurality of high thermal conductivity fillers having different aspect ratios to an insulating resin.

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