JP2011199115A - Diode module and terminal box for solar cell module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a diode module excellent in heat dissipation, and to provide a terminal box for a solar cell module.SOLUTION: The diode module 20 connected to a solar cell panel 100 includes: a plurality of terminal boards 21, and a diode 22 for a reverse load bypass connected to two corresponding terminal boards 21 among the terminal boards 21. At least the diode 22 is molded and covered by a resin portion 50. The resin portion 50 has an outer shape following the outer shape of the diode 22 by being thinly coated to the surface of the diode 22. The terminal box 10 for a solar cell module has a constitution including the diode module 20.

Description

  The present invention relates to a diode module and a terminal box for a solar cell module.

  A conventional diode module and a terminal box for a solar cell module are disclosed in Patent Document 1. The diode module includes a plurality of terminal boards, a reverse load bypass diode connected to the corresponding two terminal boards, and a resin portion that holds the terminal boards in parallel at a predetermined interval. And. On the other hand, the terminal box for a solar cell module is constituted by the above diode module and a housing that accommodates the entire diode module. In addition, a silicon resin is introduced into the casing so as to cover the diode, and after the silicone resin is cured, a cover is placed on the casing.

JP 2007-31714 A

  By the way, in the above case, when the diode generates heat during use, the heat is released to the atmosphere through the silicon resin. However, in the above configuration, since the silicon resin having low thermal conductivity is thickly enclosed in the housing, the heat generated by the diode may be trapped in the silicon resin and not sufficiently released to the atmosphere. As a result, there is a concern that the diode is damaged by heat.

  This invention is completed based on the above situations, Comprising: It aims at providing the diode module excellent in heat dissipation, and the terminal box for solar cell modules.

  As a means for achieving the above object, the invention of claim 1 is a diode module connected to a solar cell panel, comprising a plurality of terminal plates and two corresponding terminal plates of each terminal plate. A diode for bypassing at the time of reverse load connected, at least the diode is mold-coated with a resin part, and the resin part is thinly attached to the surface of the diode, thereby forming an outer shape of the diode. It has a feature in that it has an outer shape along.

  According to a second aspect of the present invention, in the device according to the first aspect, the terminal plate is connected to a lead connecting portion to which a lead from the solar cell panel is connected, and a cable for taking out electric power from the solar cell panel. The cable connecting portion is characterized in that the lead connecting portion and the cable connecting portion are exposed.

  According to a third aspect of the present invention, in the device according to the second aspect, the terminal plates are arranged in a line, and adjacent to the lead connection portions of the terminal plates located at both ends in the arrangement direction, the cable connection It is characterized in that the parts are connected together.

  The invention of claim 4 is characterized in that, in the apparatus of any one of claims 1 to 3, the terminal plate is an injection-molded product integrated with the resin portion by an insert.

  The invention of claim 5 is a terminal box for a solar cell module including the diode module according to any one of claims 2 to 4, wherein a cylindrical enclosure is retrofitted to the tip of the diode module, It is characterized in that the lead connecting portion is disposed so as to face the opening of the surrounding portion.

  Invention of Claim 6 is a terminal box for solar cell modules of Claim 5, Comprising: The insulating sealing material is introduce | transduced in the opening of the said surrounding part, and the said sealing is carried out in the said surrounding part It is characterized in that a cover is placed so as to cover the material.

<Invention of Claim 1>
Since the resin part is thinly deposited on the surface of the diode, it has an outer shape that follows the outer shape of the diode. Quickly released into the atmosphere.

<Invention of Claim 2>
Since the lead connecting portion and the cable connecting portion are exposed, the lead connecting operation and the cable connecting operation can be smoothly performed after the diode module is formed.

<Invention of Claim 3>
Since the terminal plates are arranged in a line and the cable connection portions are integrally connected adjacent to the lead connection portions of the terminal plates located at both ends in the alignment direction, the diode module is molded with the resin portion. And a region having a lead connection part and a cable connection part, and is excellent in moldability.

<Invention of Claim 4>
Since the terminal plate is an injection-molded product integrated with the resin part by the insert, molding is easy and the amount of the resin part attached to the terminal board can be finely adjusted.

<Invention of Claim 5>
Since a cylindrical enclosure is retrofitted to the tip of the diode module, a solar cell module terminal box can be easily manufactured from the diode module.

<Invention of Claim 6>
Since the sealing material is introduced into the opening of the surrounding portion and the cover is put on the surrounding portion so as to cover the sealing material, the introduction amount of the sealing material can be suppressed only to the surrounding portion.

In Embodiment 1 of this invention, it is a top view of the terminal box for solar cell modules to which the cable was connected. It is a top view of the diode module before coat | covering each terminal board with a resin part. It is AA sectional drawing of FIG. It is a top view of a diode module. It is a top view of the terminal box for solar cell modules. It is BB sectional drawing of FIG. It is a conceptual diagram for demonstrating the thermal radiation path | route of a diode. In Embodiment 2, it is a top view of the terminal box for solar cell modules. It is CC sectional drawing of FIG.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. A terminal box for a solar cell module according to Embodiment 1 (hereinafter simply referred to as a terminal box 10) is provided on the back side of a solar cell panel 100 (see FIG. 7) in which a large number of solar cells connected in series are arranged. A plurality of terminal plates 21, a reverse load bypass diode 22 bridged between two corresponding terminal plates 21, and a primary resin layer covering each terminal plate 21 and the diode 22. 23. And this terminal box 10 is completed by carrying out the primary shaping | molding by using the diode module 20 as an intermediate | middle product, and carrying out secondary shaping | molding after that.

  The terminal plate 21 is formed in a band shape by cutting a conductive metal plate or the like, and as shown in FIG. 2, four terminal plates 21 are arranged side by side in the width direction. A lead connection portion 24 is formed at the front end portion of each terminal plate 21 to which a lead (not shown) from the solar cell group is connected by soldering. The lead connection portion 24 is formed with a horizontally long connection hole 25 into which a lead is inserted.

  Of each terminal plate 21, two terminal plates 21 positioned at both ends in the width direction are cable connection terminals 21A to which both a plus side cable 90 and a minus side cable 90 for taking out an electromotive force from the solar cell group are respectively connected. Has been. A pair of cable connection portions 26 are formed at the front end portion of the cable connection terminal 21 </ b> A so as to protrude outward in the width direction at positions adjacent to the lead connection portion 24. A bent portion 27 is formed at the middle portion of the cable connecting portion 26 and is shifted forward in a stepwise manner. Further, an open barrel-shaped barrel portion 28 is formed at the distal end portion of both cable connection portions 26. A pair of barrel pieces 29 are formed to rise on the barrel portion 28 (see FIG. 9), and both the barrel pieces 29 are wound around the core wire portion 91 in the end portion of the cable 90, so that the cable connection terminal 21 </ b> A is attached to the cable 90. It is designed to be connected by caulking.

  The diode 22 includes a flat bare chip 22A and a metal plate-like conductor piece 22B connected to the bare chip 22A, and is not itself packaged with a resin. The bare chip 22 </ b> A is formed by stacking a P-side region (anode region) and an N-side region (cathode region), and is directly mounted on the center of the surface of the terminal board 21 in the width direction. The bottom surface of the bare chip 22A is connected to the surface of the terminal board 21 by soldering. In the case of the present embodiment, the bare chip 22A is supported by the three terminal plates 21 on the right side of the four terminal plates 21 as shown in the drawing.

  As shown in FIG. 3, the conductor piece 22B is elongated in the width direction from one end to the other end, and one end in the width direction is soldered to the top surface of the bare chip 22A (polarity different from the bottom surface of the bare chip 22A). The other end in the width direction is connected by soldering to the terminal board 21 adjacent to the terminal board 21 that supports the bare chip 22A. That is, the conductor pieces 22B are bridged between the terminal plates 21 adjacent to each other, and three conductor pieces 22B are arranged between the four terminal plates 21 as a whole.

  Here, each terminal board 21 also has a function as a heat sink that releases heat when the bare chip 22A generates heat. Each terminal plate 21 has a step 31 formed between a portion supporting the bare chip 22A and a portion having the lead connection portion 24 and the cable connection portion 26, and a portion supporting the bare chip 22A with the step 31 as a boundary. The heat dissipation area has been expanded. However, the cable connection terminal 21 </ b> A on the left side in the drawing that does not support the bare chip 22 </ b> A has a smaller area than the other terminal plates 21 because the demand for heat dissipation is low. As a result, space efficiency is improved.

  As shown in FIG. 4, the diode module 20 includes a primary resin layer 23 that is mold-coated so as to cover the periphery of each diode 22 in addition to each terminal plate 21 and each diode 22 described above. In other words, the diode module 20 has a form in which each diode 22 is resin-packaged together with each terminal board 21 by the primary resin layer 23.

  The primary resin layer 23 is not formed at the front end portion of each terminal plate 21, but is attached to the entire portion of each terminal plate 21 except the front end portion. Thus, the lead connection portion 24 and the cable connection portion 26 are exposed and disposed in the diode module 20. The primary resin layer 23 has a flat mat shape with a rectangular shape in plan view, and is thinly applied to both the front and back surfaces of each terminal board 21 from the position immediately before the step 31 to the rear part. The primary resin layer 23 maintains a predetermined distance between the terminal plates 21, avoids excessive stress acting between the terminal plates 21 and the diodes 22, and prevents each terminal plate 21 and each It plays a role of insulatingly covering the diode 22.

  On the surface of the primary resin layer 23, an adherend portion 32 having a convex outer shape along the outer shape of the diode 22 is formed. The adherend portion 32 is configured to extend linearly over substantially the entire width in the width direction at the substantially central portion in the front-rear direction of the primary resin layer 23. The thickness of the primary resin layer 23 including the adherend portion 32 is substantially constant from the surface of the terminal board 21 to the surface of the diode 22 (see FIG. 6).

  A claw-like protrusion 33 is formed on the surface of the primary resin layer 23 in front of the adherend 32. The protrusion 33 has a form extending linearly over substantially the entire width in the width direction. Further, on the surface of the primary resin layer 23, a horizontally elongated slit 34 is formed at the front end portion in front of the protrusion portion 33. The concave groove 34 has a form extending linearly over substantially the entire width in the width direction, and the surface of each terminal plate 21 is exposed through the concave groove 34.

  The primary resin layer 23 is made of a thermoplastic resin having excellent heat resistance such as polyphenylene sulfide (hereinafter referred to as PPS). In addition, the primary resin layer 23 contains glass fibers, thereby improving heat resistance.

  Next, the terminal box 10 will be described. The terminal box 10 includes a surrounding portion 42 made of the secondary resin layer 41 in addition to the diode module 20 described above. Furthermore, the surrounding part 42 surrounds the periphery of each lead connection part 24 and both the cable connection parts 26 in front of the connection part 43 and the flat connection part 43 integrally connected to the front end part of the primary resin layer 23. And a cylindrical tube portion 44 standing up. In the present embodiment, the resin part 50 is configured by the primary resin layer 23 and the secondary resin layer 41.

As shown in FIG. 6, the connecting portion 43 is thinly attached to the surface of the front end portion of the primary resin layer 23, and its rear end is in close contact with the protruding portion 33, and its surface is substantially the same as the protruding end of the protruding portion 33. They are arranged at the same height. When the secondary resin layer 41 is molded, the molten resin is blocked by the protrusions 33.
The secondary resin layer 41 is made of a thermoplastic resin having excellent weather resistance and mechanical properties such as polyphenylene ether (hereinafter referred to as PPE), and does not include glass fibers. The PPS that constitutes the primary resin layer 23 has a smaller linear expansion coefficient than the PPE that constitutes the secondary resin layer 41, and is made of a metal such as a copper alloy that constitutes the conductor pieces 22B of the terminal plates 21 and the diodes 22. It has a close linear expansion coefficient.

  The cylindrical portion 44 has an opening 45 that is horizontally long in plan view and exceeds the entire width of the diode module 20, and the lead connection portions 24 and both cable connection portions 26 are disposed in the opening 45 so as to face each other. . The root portion of the rear portion of the cylindrical portion 44 enters the concave groove 34, whereby the secondary resin layer 41 is brought into close contact with the primary resin layer 23.

  As shown in FIG. 5, cylindrical cable insertion portions 46 are formed on the outer surfaces of both ends in the width direction of the cylindrical portion 44 so as to protrude. An insertion hole 47 into which the cable 90 is inserted is formed in the cable insertion portion 46 so as to penetrate in the width direction. The cable 90 is drawn out from the insertion hole 47 of the cylindrical portion 44 to both ends in the width direction. In addition, an annular groove 48 is formed over the entire outer peripheral surface of the cable insertion portion 46, and a rubber plug 80 is fitted (see FIG. 1). The rubber plug 80 serves to prevent water from entering the cylindrical portion 44 by filling a gap between the insertion hole 47 and the cable 90.

  The opening 45 of the tube portion 44 is closed at the bottom face portions at both ends in the width direction by a closing plate 49, and the barrel portion 28 of both cable connection terminals 21 </ b> A is placed on the closing plate 49. A jig hole 61 is formed in the closing plate 49 at a position corresponding to the barrel portion 28. At the upper end of the opening 45 of the cylindrical portion 44, a stepped receiving portion 62 is formed over the entire circumference, and the receiving portion 62 can support a peripheral portion of a cover (not shown). .

Next, a method for manufacturing the diode module 20 and the terminal box 10 according to the present embodiment will be described.
First, the diode 22 is connected to each terminal board 21 by soldering (see FIG. 2). At this time, it is preferable that the terminal plates 21 are integrally connected by a carrier so that excessive stress does not act on a connection portion between each terminal plate 21 and each diode 22. Such a carrier can be cut and removed after forming the primary resin layer 23.

  Subsequently, the integrated terminal plate 21 and each diode 22 are set in a primary molding die (not shown), and molten resin is injected and filled into the die. Then, the molten resin is thinly deposited around the portions of each terminal plate 21 excluding the lead connection portion 24 and the cable connection portion 26 and around each diode 22, and the primary resin layer 23 is formed after the molten resin is cured. Thus, the diode module 20 is manufactured (see FIG. 4).

  Next, the diode module 20 is set in a mold (not shown) for secondary molding, and molten resin is injected and filled into the mold. After the molten resin is cured, a surrounding portion 42 as a secondary resin layer 41 is integrally formed at the front end portion of the primary resin layer 23 so as to surround the lead connection portion 24 and the cable connection portion 26. Thus, the terminal box 10 is manufactured (see FIGS. 5 and 6).

  Thereafter, the cable 90 is inserted into the insertion hole 47 of the cable insertion portion 46 from both sides outward. With the core portion 91 of the cable 90 supported by the barrel portion 28, a caulking jig (not shown) is inserted into the jig hole 61 from below, and the barrel piece 29 is bent by the operation of the caulking jig. As a result, the cable 90 is connected and fixed to the cable connecting portion 26. Then, the rubber plug 80 previously penetrated through the cable 90 is pulled up to the cable insertion portion 46 side, and the rubber plug 80 is fitted to the outer peripheral surface of the cable insertion portion 46 (see FIG. 1). At this time, since the inner peripheral portion of the rubber plug 80 enters the annular groove 48 of the cable insertion portion 46, the adhesion of the rubber plug 80 to the cable insertion portion 46 is enhanced.

  Next, the bottom surface of the terminal box 10 is attached to the back surface of the solar cell panel 100 with an adhesive or the like. In the process of attachment, the lead is drawn into the opening 45 of the cylindrical portion 44, and the tip end portion of the lead is connected to the lead connection portion 24 of the corresponding terminal plate 21 through the connection hole 25 by soldering. Subsequently, a sealing material made of an insulating resin such as silicon resin is introduced and filled into the cylindrical portion 44, and after the sealing material is cured, a cover is fitted to the receiving portion 62, and the cylindrical portion 44 is closed with a lid. . Thus, the mounting of the terminal box 10 to the solar cell panel 100 is completed.

  By the way, since the diode 22 becomes high temperature during use, there is a concern that the diode 22 may be damaged by its own heat and interfere with the rectifying function. However, according to the present embodiment, as schematically shown in FIG. 7, heat generated in the diode 22 is quickly released from the bottom surface of the primary resin layer 23 to the solar cell panel 100 side via each terminal plate 21. At the same time, since heat is quickly released from the top surface of the primary resin layer 23 to the atmosphere side, it is avoided that heat is trapped in the diode module 20 (terminal box 10). Moreover, since the adherend portion 32 is attached around the diode 22 and the adherend portion 32 has an outer shape along the outer shape of the diode 22, the thickness of the adherend portion 32 can be suppressed to be extremely small, and heat dissipation can be achieved. Is significantly improved.

  Moreover, since the lead connection part 24 and the cable connection part 26 are exposed and disposed in the diode module 20, the lead connection work and the cable 90 connection work can be smoothly performed after the diode module 20 is formed. it can.

  Further, since the terminal plates 21 are arranged in a horizontal row and the cable connection portions 26 are integrally connected adjacent to the lead connection portions 24 of the cable connection terminals 21A located at both ends in the arrangement direction, the diode module 20 However, it is divided into a region that is mold-coated with the primary resin layer 23 and a region that has the lead connection portion 24 and the cable connection portion 26 and is excellent in moldability.

  Further, since each terminal plate 21 is an injection-molded product integrated with the primary resin layer 23 by an insert, molding is easy and a small amount of the primary resin layer 23 is attached to each terminal plate 21. Can be adjusted.

  Further, since the cylindrical surrounding portion 42 is formed later on the tip portion of the diode module 20, the terminal box 10 can be easily manufactured from the diode module 20.

  Further, an insulating sealing material is introduced into the opening 45 of the cylindrical portion 44, and a cover is placed on the cylindrical portion 44 so as to cover the sealing material. It can be reduced to the inside only.

  Furthermore, according to this embodiment, since the resin part 50 has the secondary resin layer 41 separately from the primary resin layer 23, the secondary resin layer 41 supplements a function that cannot be covered by the primary resin layer 23. can do.

  Further, the diode 22 itself is composed of the bare chip 22A and the conductor piece 22B, and is not packaged by the resin. Therefore, the heat generated by the diode 22 is directly transmitted to the primary resin layer 23, and the heat dissipation is further improved.

  Moreover, since the primary resin layer 23 has higher heat resistance than the secondary resin layer 41 and has an expansion coefficient closer to the expansion coefficient of the diode 22, it can dissipate heat even when the diode 22 becomes hot, The load applied to the diode 22 due to thermal expansion can be reduced. On the other hand, the secondary resin layer 41 which does not require such characteristics strongly can be cheaper than the primary resin layer 23.

  Further, each terminal plate 21 has a lead connection portion 24, the lead connection portion 24 is disposed so as to face the opening 45 of the cylindrical portion 44, and the surrounding portion 42 including the cylindrical portion 44 is only the secondary resin layer 41. Therefore, the periphery of the lead connection portion 24 with low heat dissipation requirement is surrounded by the secondary resin layer 41, and the primary resin layer 23 is covered with the diode 22 with high heat dissipation requirement. Thereby, the primary resin layer 23 and the secondary resin layer 41 are appropriately distributed to the necessary portions.

<Embodiment 2>
8 and 9 show Embodiment 2 of the present invention. The terminal box 10A according to the second embodiment has a shape that approximates that of the first embodiment. For this reason, in the following, differences from the first embodiment will be mainly described, and the same reference numerals are given to the same configurations as those of the first embodiment.

  The area of the closing plate 49A is larger than that of the first embodiment, and the bent portions 27 of both cable connecting portions 26 are also supported by the closing plate 49A.

  In the second embodiment, the primary resin layer 23 and the secondary resin layer 41 are not formed separately, and the integral resin portion 50A surrounding each diode 22 is molded. For this reason, as shown in FIG. 9, the resin portion 50 </ b> A is made of the same resin as a whole, and does not have portions corresponding to the protruding portion 33 and the groove 34 of the first embodiment. The adherend 32A is formed slightly thicker than the first embodiment. The basic configuration of the cylindrical portion 44 is substantially the same as that of the first embodiment.

  Thus, in the second embodiment, when the terminal box 10A is manufactured, the diode module 20 is not taken out as an intermediate product, and the diode module 20A itself constitutes the terminal box 10A.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The resin part may be configured to be attached only around the diode.
(2) The cable connection portion may be formed at the front end portion of the cable connection terminal opposite to the formation side of the lead connection portion.
(3) In Embodiment 1, thermosetting resins such as epoxy resins and unsaturated polyester resins can be used instead of PPS.
(4) As the diode, it is possible to use a package diode in which a bare chip and a conductor piece are packaged in a resin package.
(5) Each terminal plate may be composed of only two cable connection terminals, and only one diode may be formed by bridging between both cable connection terminals.

10 ... Terminal box for solar cell module (terminal box)
DESCRIPTION OF SYMBOLS 20 ... Diode module 21 ... Terminal board 22 ... Diode 23 ... Primary resin layer 24 ... Lead connection part 26 ... Cable connection part 41 ... Secondary resin layer 42 ... Surrounding part 50 ... Resin part 90 ... Cable 100 ... Solar cell panel

Claims (6)

A diode module connected to a solar panel,
A plurality of terminal plates, and a reverse load bypass diode connected to the corresponding two of the terminal plates,
At least the diode is mold-coated with a resin part,
2. The diode module according to claim 1, wherein the resin portion is thinly attached to the surface of the diode, thereby having an outer shape along the outer shape of the diode.   The terminal plate has a lead connection portion to which a lead from the solar cell panel is connected, and a cable connection portion to which a cable for taking out electric power from the solar cell panel is connected, and the lead connection portion and the cable connection The diode module according to claim 1, wherein the portion is exposed.   The diode module according to claim 2, wherein the terminal plates are arranged in a line, and the cable connection portions are integrally connected adjacent to the lead connection portions of the terminal plates located at both ends in the arrangement direction.   The diode module according to any one of claims 1 to 3, wherein the terminal plate is an injection-molded product integrated with the resin portion by an insert. A terminal box for a solar cell module comprising the diode module according to any one of claims 2 to 4,
A solar cell module terminal box in which a cylindrical surrounding portion is retrofitted to a tip portion of the diode module, and the lead connection portion faces the opening of the surrounding portion.   The solar cell module terminal box according to claim 5, wherein an insulating sealing material is introduced into the opening of the surrounding portion, and a cover is placed on the surrounding portion so as to cover the sealing material.

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