JP2011174175A - Method and apparatus for removing coating layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method and an apparatus for removing a coating layer in which the removal rate of the coating layer can be improved irrespective of the shape of a copper member on which the coating layer is formed or the quality of a resin material. <P>SOLUTION: A heating furnace 28 provided with a heater 30 is provided in a heating device 14, and a coating member 12 charged from a feeder 20 is conveyed to the heating furnace 28 by a conveyance member 24. The coating member 12 has a chip shape, and has a copper member and an enamel coating layer formed on the surface of the copper member. Nitrogen gas or superheated steam is allowed to flow into the heating furnace 28 from a gas flowing part 26 to heat the copper member of the coating member 12 to about 900°C to carbonize the enamel coating layer. After the heating, the coating member 12 is charged into cooling water 17 in a cooling device 16 from an outlet port 44A to rapidly cool the coating member 12. Subsequently, the coating member 12 is stirred in the cooling water in a peeling device to allow the carbonized enamel coating layers to collide with each other to thereby peel the enamel coating layer from the surface of the copper member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a coating layer removing method and a coating layer removing apparatus for removing a coating layer from a copper member having a coating layer formed on the surface thereof.

  Conventionally, a method for removing a coated portion from a coated conductor has been proposed.

  In Patent Document 1 below, a part of a coated conductor in which a synthetic resin coating is bonded to the surface of a metal conductor is heated to 100 ° C. to 400 ° C., and the coated conductor is immediately put into a cryogen to remove an embrittled coating portion. A method is disclosed.

  In Patent Document 2 below, a wire obtained by laminating an organic compound-based coating layer on a metal-based baseline is heated in an inert gas atmosphere to evaporate the coating layer, and the baseline in which the coating layer has evaporated is defined as an inert gas. A method of removing a coating layer without forming an oxide film on the surface of the base line by cooling in an atmosphere is disclosed.

  In Patent Document 3 below, a waste wire including an oil-filled wire, which is a raw material roughly cut in advance, is placed in a rotary kiln and heated using superheated steam to carbonize a portion other than the metal, and then the waste wire. Has been disclosed to separate the powder into a powder mainly composed of carbide and a granular material made of other metals.

JP-A-57-20110 JP 2001-275222 A JP 2009-249665 A

  However, in the above-mentioned Patent Document 1, the covered conductor made of a wire is targeted, and the embrittled covered portion of the covered conductor is removed by mechanically pulling or rubbing. When this method is applied to a chip-shaped or nugget-shaped coated conductor, it is difficult to pull or rub the coated portion, and there is room for improvement. Further, at a heating temperature of 100 ° C. to 400 ° C., carbonization of the coating portion as examined by the present inventors is difficult, and the removal rate of the coating portion may be reduced.

  Further, in Patent Document 2, the wire formed by laminating an organic compound-based coating layer is heated in an inert gas atmosphere to evaporate the coating layer, so that the heating temperature and the type of the coating layer are limited, There is a problem that the device cost increases. Further, if the coating layer is not sufficiently evaporated during heating, the removal rate of the coating layer may be reduced.

  In addition, in the method and temperature condition (350 ° C. to 800 ° C.) for removing the coating layer disclosed in Patent Document 3, the metal surface of the coated conductor and the carbide interface adhered to the metal surface are not completely destroyed depending on the type of metal. And there was a problem with the quality of the metal that could be recovered. In addition, there is a problem in that the scale of the apparatus and the movement and maintenance of the apparatus are costly in the process of crushing the carbonized waste wire and magnetically sorting the metal particulates and the powdered carbide.

  The present invention has been made in view of the above-mentioned facts and aims to solve the problems. That is, by a relatively inexpensive method, a coating layer removal method and a coating layer removal apparatus that can improve the removal rate of the coating layer regardless of the shape of the copper member on which the coating layer is formed and the material of the resin material are provided. It is an object of the present invention.

  In order to solve the above-described problem of improving the removal rate of the coating layer, the inventors focused on promoting the destruction of the interface between the metal surface of the coated conductor and the carbide adhering to the metal surface. And by repeating trials, it has been found that the removal rate of the carbonized coating layer can be improved by rapid heating / cooling of the coated conductor and heating and holding at a temperature higher than that performed by the conventional method.

  According to a first aspect of the present invention, there is provided a method for removing a coating layer, wherein the coating member having the coating layer formed on the surface of the copper member is carbonized at a temperature at which the coating layer is carbonized in an inert gas atmosphere or superheated steam. A heating step for heating to a temperature at which the coating member does not melt, a cooling step for cooling the covering member, and a peeling step for peeling the covering layer from the surface of the copper member.

  According to said invention, a coating member is heated to the temperature which carbonizes a coating layer, and the said copper member does not fuse | melt in an inert gas atmosphere or superheated steam by a heating process. By heating the coating member, the surface of the copper member inside the coating layer is activated and the coating layer is carbonized, whereby the interface (such as an oxide film) between the copper member and the coating layer is easily destroyed. Then, a coating member is cooled at a cooling process, and a coating layer is removed from a copper member with a high removal rate by peeling a coating layer from the surface of a copper member at a peeling process.

  In the invention according to claim 1, the coating layer removing method according to claim 2 is heated until the temperature of the copper member reaches 700 ° C. to 1000 ° C. in the heating step.

  According to said invention, while heating the temperature of a copper member to 700 to 1000 degreeC lower than melting | fusing point (1083 degreeC) of copper by a heating process, while activating the copper member surface inside a coating layer, The coating layer is carbonized. Thereby, the interface between the copper member and the coating layer is easily broken, and the coating layer can be removed with a high removal rate.

  According to a third aspect of the present invention, there is provided a coating layer removing method according to the first or second aspect of the invention, wherein the heating step is performed until the temperature of the copper member reaches 900 ° C. or more, and the carbonization of the coating layer Is completed, the temperature of the copper member is further maintained at 900 ° C. or higher for at least 3 minutes.

  According to said invention, by heating until the temperature of a copper member becomes 900 degreeC or more by a heating process, and carbonization of a coating layer is completed, the temperature of a copper member is further hold | maintained at 900 degreeC or more for at least 3 minutes. The surface of the copper member inside the carbonized coating layer is activated, and the interface between the carbonized coating layer and the copper member can be more reliably destroyed.

  According to a fourth aspect of the present invention, there is provided a coating layer removing method according to any one of the first to third aspects, wherein, in the heating step, the copper member is heated from a temperature at the start of heating. The time until the temperature at which the layer is carbonized and the temperature at which the copper member does not melt is reached within 5 minutes.

  According to said invention, the resin contained in the inside of a coating layer is made into less than 5 minutes until it reaches the temperature which a copper member starts heating and carbonizes a coating layer, and the temperature which a copper member does not fuse | melt. The component is vaporized before reacting with copper, and the interface between the copper member and the coating layer is more easily broken. For this reason, it becomes possible to remove a coating layer with a higher removal rate.

  According to a fifth aspect of the present invention, in the method for removing a coating layer according to any one of the first to fourth aspects, the coating member is cooled with a cooling liquid in the cooling step.

  According to said invention, a coating | coated member can be rapidly cooled by cooling a coating | coated member with a cooling fluid. Thereby, a coating layer becomes easy to peel from a copper member from the difference of the thermal expansion coefficient of a copper member and a coating layer, and it becomes possible to remove a coating layer with a high removal rate.

  The method for removing a coating layer according to the invention of claim 6 is the invention according to any one of claims 1 to 5, wherein the coating member is stirred in a liquid in the peeling step, and the coating member is removed. The coating layers are made to collide with each other to peel the coating layers from the surface of the copper member.

  According to the above invention, the coating member adhering to the surface of the copper member by the anchor effect or intermolecular force is obtained by stirring the coating member in the liquid in the peeling step and causing the coating layers of the coating member to collide with each other. It becomes easy to peel. For this reason, it becomes possible to remove a coating layer with a still higher removal rate.

  According to a seventh aspect of the present invention, there is provided a coating layer removing method according to any one of the first to sixth aspects, wherein a protrusion is attached to an inner surface of a heating device used in the heating step, and the copper is removed. It is assumed that the temperature rise of the copper member is promoted by expanding the area that the member or the covering member contacts.

  According to the above invention, by increasing the area where the copper member or the covering member contacts the protrusion, the temperature rise of the copper member is promoted, and the entire copper member or the covering member reaches the high temperature state earlier in the heating device. Can be made.

  According to an eighth aspect of the present invention, there is provided a method for removing a coating layer according to any one of the first to seventh aspects, wherein a metal is formed at a tip of the protrusion in the heating device used in the heating step. A structure is provided to increase the amount of heat in the heating device.

  According to said invention, the temperature in a heating apparatus can be hold | maintained by providing the metal structure for enlarging the calorie | heat amount in a heating apparatus in the front-end | tip of a projection part, and the whole copper member in a heating apparatus Or a covering member can be made to reach a high temperature state earlier.

  According to a ninth aspect of the present invention, there is provided the coating layer removing method according to any one of the first to eighth aspects, wherein a preheated metal body is disposed in a heating device used in the heating step. Thus, the temperature rise of the copper member is promoted.

  According to the above invention, by preheating and arranging the metal body in the heating device, the temperature rise of the entire copper member or the covering member can be promoted, and the entire copper member or the covering is covered in the heating device. The member can reach the high temperature state sooner.

  A covering layer removing method according to a tenth aspect of the present invention is the method according to any one of the first to ninth aspects, wherein the heating device used in the heating step is put into the heating device. A stopper for retaining a part of the copper member heated to a predetermined temperature in the heating device is provided.

  According to said invention, by providing a stopper in a heating apparatus, the one part copper member already thrown into the heating apparatus and heated to predetermined temperature can be made to stay in a heating apparatus. For this reason, the temperature rise of the covering member newly thrown into the heating device can be promoted, and the entire copper member or the covering member can reach the high temperature state earlier in the heating device.

  A covering layer removing apparatus according to an eleventh aspect of the present invention is a covering layer removing apparatus to which the covering layer removing method according to any one of claims 1 to 6 is applied, wherein the covering layer of the covering member is applied. A heating device for heating to a temperature at which carbon is heated and a temperature at which copper does not melt, a gas inflow device for allowing an inert gas or superheated steam to flow into the heating device, an exhaust unit for exhausting the gas in the heating device, The covering member discharged from the heating device is charged, a cooling device for cooling the covering member with a cooling liquid, and the covering member discharged from the cooling device is charged, and the covering member is stirred in the liquid, And a peeling device that peels the coating layer by causing the coating layers to collide with each other.

  According to the above invention, an inert gas or superheated steam flows into the heating device by the gas inflow device, the temperature of carbonizing the coating member in the inert gas atmosphere or under the superheated steam, and copper does not melt. Heat to temperature. While heating the copper member surface inside a coating layer by heating and carbonizing a coating layer, the interface of a copper member and a coating layer becomes easy to be destroyed. The gas generated when the covering member is heated in the heating device is exhausted to the outside from the exhaust part. The covering member discharged from the heating device after heating is put into a cooling device and rapidly cooled with a coolant. Further, the covering member is put into a peeling device, and the covering layer is peeled from the surface of the copper member by stirring the covering member in the liquid and causing the covering layers to collide with each other. Thereby, the coating layer is removed from the copper member with a high removal rate.

  A coating layer removing apparatus according to a twelfth aspect of the invention is the coating layer removing apparatus according to the eleventh aspect of the invention, wherein a projection is provided on the inner surface of the heating device.

  According to said invention, the protrusion part is attached to the longitudinal direction of the inner surface of a heating apparatus, and the temperature rise of a copper member is accelerated | stimulated by expanding the area which a copper member or a covering member contacts, The entire copper member or the covering member can reach the high temperature state sooner.

  A covering layer removing apparatus according to a thirteenth aspect of the present invention is the covering layer removing apparatus according to the twelfth aspect of the present invention, wherein a metal structure is provided at the tip of the protrusion.

  According to said invention, the temperature in a heating apparatus can be hold | maintained by providing the metal structure for enlarging the calorie | heat amount in a heating furnace in the front-end | tip of a projection part, and the whole copper member in a heating apparatus Or a covering member can be made to reach a high temperature state earlier.

  A coating layer removing apparatus according to a fourteenth aspect of the present invention is the coating according to any one of the eleventh to thirteenth aspects, wherein a preheated metal body is disposed in the heating apparatus. It is a layer removal apparatus.

  According to said invention, the temperature rise of a copper member or a coating | coated member can be promoted by heating and arrange | positioning a metal body beforehand in a heating apparatus.

  The coating layer removing apparatus according to a fifteenth aspect of the invention is the invention according to any one of the eleventh to fourteenth aspects, wherein the heating device is already put into the heating device and has a predetermined temperature. It is assumed that a stopper is provided for retaining a part of the copper member heated up to the upstream side in the heating device.

  According to the above invention, by providing the stopper in the heating device, a part of the copper member that has been charged into the heating device and heated to a predetermined temperature can be retained upstream in the heating device. . For this reason, the temperature rise of the covering member newly thrown into the heating device can be promoted, and the entire copper member or the covering member can reach the high temperature state earlier in the heating device.

  According to the coating layer removing method or the coating layer removing apparatus according to the present invention, the coating layer is formed from the surface of the copper member by a relatively inexpensive method regardless of the shape of the copper member on which the coating layer is formed and the material of the resin material. Can be removed at a high removal rate.

It is a block diagram which shows the heating apparatus and cooling device of a coating layer removal apparatus to which the coating layer removal method which is 1st Embodiment of this invention is applied. It is a block diagram which shows the 1st Example of the heating apparatus of the coating layer removal apparatus with which the coating layer removal method which is 1st Embodiment of this invention is applied. It is a block diagram which shows the 2nd Example of the heating apparatus of the coating layer removal apparatus with which the coating layer removal method which is 1st Embodiment of this invention is applied. It is a block diagram which shows the 3rd Example of the heating apparatus of the coating layer removal apparatus with which the coating layer removal method which is 1st Embodiment of this invention is applied. It is a block diagram which shows the peeling apparatus of the coating layer removal apparatus with which the coating layer removal method which is 1st Embodiment of this invention is applied. It is a graph which shows the result of having performed the differential thermal-thermogravimetric simultaneous measurement (TG-DTA) of the enamel coating layer during the heating of a coating member. It is a figure which shows the infrared absorption spectrum which measured the enamel coating layer before the heating of a coating | coated member using an infrared spectroscopy. It is a figure which shows the infrared absorption spectrum which measured the enamel coating layer after the heating of a coating | coated member using an infrared spectroscopy. It is a graph which shows the ratio of the weight of the enamel coating layer to the total amount of the coating | coated member before a process. It is a graph which shows the ratio of the removal amount of the enamel coating layer to the total amount of the coating | coated member after a process. It is a figure which shows the spectrum which measured the enamel coating layer carbonized by heating using the Raman spectroscopy. It is a block diagram which shows the heating apparatus and cooling device of a coating layer removal apparatus to which the coating layer removal method which is 2nd Embodiment of this invention is applied. It is a top view which shows the peeling apparatus of the coating layer removal apparatus with which the coating layer removal method which is 2nd Embodiment of this invention is applied. It is a side view which shows the peeling apparatus of the coating layer removal apparatus with which the coating layer removal method which is 2nd Embodiment of this invention is applied. It is a block diagram which shows the heating apparatus and cooling device of a coating layer removal apparatus to which the coating layer removal method which is 3rd Embodiment of this invention is applied. It is a block diagram which shows the melting furnace which melts the copper member after a process.

  Hereinafter, the coating layer removing apparatus to which the coating layer removing method according to the first embodiment of the present invention is applied will be described with reference to FIGS.

  FIG. 1-1 shows a heating device and a cooling device used in the coating layer removing apparatus of the present embodiment. Moreover, the 1st Example of the heating apparatus used for the coating layer removal apparatus of this embodiment is shown by FIGS. 1-2. 1-3 shows a second example of the heating device used in the coating layer removing apparatus of the present embodiment. 1-4 shows a third example of the heating device used in the coating layer removing apparatus of the present embodiment. Moreover, the peeling apparatus used for the coating layer removal apparatus of this embodiment is shown by FIG.

  As shown in FIG. 1-1, the coating layer removing apparatus 10 includes a heating device 14 that heats the coating member 12 in an inert gas atmosphere, and a cooling device 16 that rapidly cools the coating member 12 after heating. Yes. The covering member 12 has an enamel coating layer formed on the surface of a copper member, and is formed into a plurality of chip shapes (or nugget shapes) by finely cutting the enamel wire with a pulverizer or the like in advance.

  The heating device 14 includes a feeder 20 into which the covering member 12 is charged, a transport member 24 that transports the covering member 12 in the axial direction by rotation within the tubular portion 22 connected to the lower portion of the feeder 20, and the tubular portion 22. And a cylindrical heating furnace 28 connected to the downstream side of the gas inflow portion 26 in the transport direction. A heater 30 for heating the inside of the heating furnace 28 is provided around the heating furnace 28.

  The heating furnace 28 has a configuration similar to a rotary kiln, and the heating device 14 is provided with a rotating device 32 that rotates the heating furnace 28 in the circumferential direction. The rotating device 32 includes a gear 34 at one end in the longitudinal direction of the heating furnace 28, a gear 38 connected to the motor 36 is engaged with the gear 34, and the heating furnace 28 is rotated by driving the motor 36. A flange portion 40 is provided at the end of the heating furnace 28 opposite to the gear 34 in the longitudinal direction, and the flange portion 40 is in contact with the roller 42 supported by the support body 43. The heating furnace 28 has a certain inclination and conveys the covering member 12 in the axial direction in accordance with the rotational speed.

  Further, the heating device 14 is provided with a discharge portion 44 on the downstream side in the conveying direction of the heating furnace 28, and the heated covering member 12 is discharged from an extraction port 44 </ b> A formed in the lower portion of the discharge portion 44. A box-shaped cooling device 16 having an upper opening is disposed below the outlet 44 </ b> A, and cooling water 17 is stored inside the cooling device 16. An exhaust port 48 through which gas is exhausted is provided at the upper portion of the discharge unit 44.

  In the present embodiment, nitrogen gas is introduced as a carrier gas in the direction of the arrow from an inlet 26A formed at the upper part of the gas inflow portion 26. Note that an inert gas such as a rare gas or heated steam may flow in place of the nitrogen gas. By flowing in the inert gas, the coating member 12 is processed in an inert gas atmosphere without being exposed to the atmosphere until it is discharged from the gas inflow portion 26 through the heating furnace 28 and discharged at the discharge portion 44. .

  In the heating furnace 28, the heater 30 is heated so that the internal atmospheric temperature is lower than the melting point of copper (1083 ° C.) and higher than 900 ° C. This ambient temperature is a temperature at which the enamel coating layer of the coating member 12 is carbonized and a temperature at which the copper member does not melt. In this embodiment, the surface of the copper member is activated and the enamel coating layer is carbonized by heating the covering member 12 in the heating furnace 28 at 900 ° C. or more for about 30 minutes or more. For example, after the temperature of the copper member itself of the covering member 12 is heated to 900 ° C. or higher and the chemical reaction of the enamel coating layer is completed (after the enamel coating layer is carbonized), the temperature of the copper member is further 900 ° C. or higher. By holding for at least 3 minutes, the interface between the copper member and the enamel coating layer can be broken, that is, the adhesion at the interface between the copper member and the enamel coating layer can be decomposed.

  The temperature of the copper member of the covering member 12 is preferably heated to 700 ° C to 1000 ° C, more preferably 800 ° C to 1000 ° C, and still more preferably 900 ° C to 1000 ° C. If the temperature of the copper member of the covering member 12 is 700 ° C. or more and not more than the melting point of copper, it can correspond to various kinds of enamel coating layers. Further, it is desirable that the entire copper member is heated to about 900 ° C. within about 5 minutes from the start of heating so that the resin component contained in the enamel coating layer of the covering member 12 is vaporized before reacting with copper. .

  By rotating the heating furnace 28 in the circumferential direction by the rotating device 32, heat is applied to the covering member 12 in the heating furnace 28 almost uniformly. By using the chip-shaped covering member 12 obtained by finely cutting the enameled wire, introduction into the heating furnace 28 is facilitated, and the chip-shaped covering members 12 come into contact with each other and heat is easily transmitted.

  Further, when the covering member 12 is heated in a region where oxygen intervenes, combustion occurs, and the enamel coating layer and copper undergo a chemical reaction (oxidation) and adhere to each other, so that the enamel coating layer is in an inert gas atmosphere or under superheated steam. Is carbonized. As a result, the combustion reaction does not occur, and the interface between the enamel coating layer and the copper member is easily broken.

  As shown in FIG. 1-2, in the heating furnace 28, a protrusion 202 is provided along the longitudinal direction of the inner peripheral surface of the heating furnace 28 so that the entire copper member reaches a high temperature state earlier, and the inside of the heating furnace It is good also as a structure which accelerates | stimulates the temperature rise of a copper member by expanding the area which a copper member (or covering member 12) contacts. The protrusion 202 also has a function of stirring the copper member while the heating furnace 28 rotates in the circumferential direction. Thereby, since the impact can be given to the copper member dropped from the protrusion 202, there is also an effect of promoting peeling of the carbonized enamel coating layer adhering to the surface of the copper member. This protrusion 202 may be attached as a separate body to the inner surface of the heating furnace, or may be formed integrally with the inner surface of the heating furnace. The shape of the protrusion 202 is not particularly limited as long as it protrudes from the inner surface of the heating furnace, and may be a rod-shaped protrusion, or a plate-like protrusion extending in the longitudinal direction of the inner peripheral surface of the heating furnace 28. May be part. That is, the shape of the copper member (or the covering member 12) is not limited as long as the contact area can be increased and the copper member can be stirred.

  In addition, as shown in FIG. 1B, in order to firmly maintain the temperature in the heating furnace 28 even if a room temperature copper member (covering member 12) is put into the heating furnace 28, A structure 204 for holding the amount of heat may be provided at the tip. The structure 204 is preferably made of, for example, a metal and is provided over substantially the entire length of the protrusion 202 in the longitudinal direction. The structure 204 may be attached to the protrusion 202 as a separate body, or may be formed integrally. Further, the shape of the structure 204 can be changed as appropriate. In this example, the projecting portion 202 is a plate-shaped projecting portion, and the structure 204 is formed of a columnar member.

  As shown in FIG. 1C, as a means for promoting the temperature rise of the copper member, a metal ball 206, which is an example of a metal body, is preheated in a heating furnace 28, and the introduced copper member (covering member 12) is used. ). It goes without saying that the metal balls 206 are not discharged from the discharge port of the heating furnace 28 together with the copper member. Further, as the metal body, for example, a metal rod may be used instead of the metal sphere 206. Furthermore, the shape of the metal body may be appropriately changed so as to match the structure inside the apparatus.

  Alternatively, as shown in FIG. 1-4, a part of the copper member (cover member 12) that has already been put into the heating furnace 28 and heated to a predetermined temperature stays in the moving direction in the heating furnace 28 for a while. It is also possible to increase the amount of heat by providing a stopper 208. That is, the copper member (covering member 12) immediately after being introduced into the heating furnace 28 from the cylindrical portion 22 is hardly heated, but the copper member (covering member 12) moves in the direction of the arrow and is stopped by the stopper 208. It comes into contact with a part of the copper member (covering member 12) heated to a predetermined temperature. As a result, the temperature rise of the copper member (covering member 12) newly introduced into the heating furnace 28 can be promoted, and the entire copper member can be quickly reached a high temperature state in the heating furnace 28.

  The material of the protrusion 202 and the stopper 208 is the same material as that of the heating furnace 28 or a material that can be easily fixed in the heating furnace 28, has high heat conduction efficiency, and can withstand the heating temperature. Any material can be used. For example, stainless steel or steel material may be used.

Even if the material of the metal sphere 206 and the structure 204 has a high amount of heat per unit volume and a part of the material becomes a fine powder during the heat treatment, it is mixed as an impurity in the heating furnace 28. Materials that are relatively easy to exclude are good. For example, it is not necessary to exclude copper materials even if they are mixed, and it is preferable to use carbon steel materials because they are relatively easy to exclude.
In FIGS. 1-2 to 1-4, in order to make the configuration of the heating furnace 28 easy to understand, the covering member 12 is schematically shown in a spherical shape. Nugget shape) and irregular shape.

  Furthermore, the structures in the heating furnace described in FIGS. 1-2 to 1-4 can be used in combination.

  After the coating member 12 is heated, the coating member 12 is rapidly cooled with the cooling water 17 inside the cooling device 16, so that the contraction force (difference in linear expansion coefficient between the copper member and the enamel coating layer) is utilized to remove the coating member 12 The enamel coating layer can be peeled off. By cooling the covering member 12 in the cooling water 17, the enamel coating layer (carbide) is not scattered and the copper member can be washed.

  As shown in FIG. 2, the coating layer removing apparatus 10 includes a peeling device 50 that peels the enamel coating layer on the surface of the copper member after the coating member 12 is cooled. The peeling device 50 includes a hopper 56 supported by a support portion 55 at the tip of a columnar member 54 erected on a base 52. The cross section of the hopper 56 is formed in a substantially hexagonal shape, corners of the substantially hexagonal shape are arranged along the substantially vertical direction, and an opening 56 </ b> A is provided at an oblique upper portion of the hopper 56. Cooling water 57 is stored at the bottom 56 </ b> B of the hopper 56.

  A stirring bar 58 is inserted in an oblique direction on the bottom 56B side of the hopper 56 from the opening 56A, and a blade part 58A is provided at the tip of the stirring bar 58 facing the bottom 56B. A motor 60 is fixedly supported on the upper portion of the stirring rod 58 by a support member (not shown), and the stirring rod 58 is rotated by driving the motor 60. By rotation of the stirring rod 58, the covering member 12 in the cooling water 57 is stirred, the enamel covering layers of the covering member 12 collide with each other, and the enamel covering layer is peeled off.

  Next, an operation of the coating layer removing apparatus 10 and a coating layer removing method according to the first embodiment of the present invention will be described.

  As shown in FIG. 1-1, a plurality of chip-shaped covering members 12 are put into the feeder 20, and the covering member 12 is transported through the cylindrical portion 22 by the rotation of the transport member 24 and introduced into the heating furnace 28. The An inert gas (nitrogen gas in this embodiment) is introduced into the heating furnace 28 from the inlet 26A of the gas inflow portion 26, and the covering member 12 is heated at a temperature of about 900 ° C. for 30 minutes in an inert gas atmosphere. Heated above. Thereby, the temperature of the copper member itself inside the enamel coating layer of the coating member 12 is heated to about 900 ° C., the surface of the copper member inside the enamel coating layer is activated, and the enamel coating layer is carbonized. After carbonization of the enamel coating layer is complete, the temperature of the copper member itself is held at about 900 ° C. for at least 3 minutes. Thereby, the interface between the carbonized enamel coating layer and the copper member is easily broken. To explain this phenomenon more specifically, the outer layer of the enamel coating layer of the coating member 12 is carbonized by heating, and at the same time, the internal adhesive layer in contact with the copper member is softened. The adhesive layer contained inside is taken into the outer layer and carbonized in the same manner as the outer layer. Thereby, the interface between the copper member and the enamel coating layer is decomposed.

  After the heating, the covering member 12 is conveyed to the discharge portion 44 by a conveying member (not shown), and the covering member 12 falls into the cooling water 17 inside the cooling device 16 from the outlet 44A. By rapidly cooling the covering member 12 with the cooling water 17, the enamel coating layer is peeled from the surface of the copper member by using the shrinkage force (difference in linear expansion coefficient between the copper member and the enamel coating layer).

  After the covering member 12 is rapidly cooled by the cooling device 16, the covering member 12 is put into the hopper 56 of the peeling device 50 from the opening 56A as shown in FIG. And the enamel coating layer of the coating | coated member 12 is made to collide by rotating the stirring rod 58 within the hopper 56, and stirring the coating | coated member 12 in the cooling water 57. FIG. As a result, the enamel coating layer adhering to the copper member surface due to the anchor effect or intermolecular force is peeled (separated), and the enamel coating layer can be removed from the copper member surface with a high removal rate.

In the case of a linear covering member, the enamel coating layer can be peeled off by rubbing with a brush or the like after heating and cooling. Have difficulty. For this reason, the enamel coating layer (carbide) which penetrated into the unevenness | corrugation of the copper member surface can be peeled by stirring in the cooling water 57 and making the enamel coating layers of the coating member 12 collide.
In the present embodiment, the heating furnace 28 is a continuous type, but a batch type heating furnace may be used.

  In order to separate copper and carbide contained in the cooling water 57 after stirring, the copper and carbide are separated by passing through a fine mesh filter. Alternatively, it may be dried so that only a lighter weight carbide is blown or sucked.

  In the said embodiment, although the coating | coated member 12 was put and cooled in the cooling water 17, coating | coated removal can be performed by putting the coating | coated member 12 in liquid nitrogen and cooling other than this method. By using liquid nitrogen, there is an effect that the labor of drying in the subsequent process can be saved.

  Here, in order to confirm the effect by the coating layer removal method of this embodiment, various analyzes of the enamel coating layer by heating and evaluation of the removal rate of the enamel coating layer from the copper member surface were performed.

  First, the thermal decomposition behavior of the enamel coating layer during the heating of the coating member 12 was investigated. FIG. 3 shows the result of differential thermal-thermogravimetric measurement (TG-DTA) of the enamel coating layer during heating of the covering member 12. Thermogravimetry (TG) is a recording of the change in weight of the enamel coating layer with respect to time and temperature due to an increase in ambient temperature, and is shown by the TG curve in FIG. In differential thermal analysis (DTA), the temperature difference with the reference material changes when the enamel coating layer reacts with the change in temperature, and the temperature difference is detected. This is shown by the DTA curve in FIG. Has been. FIG. 3 shows the temperature change of the enamel coating layer with respect to time.

  As shown in the TG curve and DTA curve in FIG. 3, the enamel coating layer reacts rapidly in the range of 300 ° C. to 500 ° C., and the enamel coating material is vaporized or liquefied, and the residue is carbonized. Further, the enamel coating layer continues to react even at 500 ° C. or higher, and the weight of the enamel coating layer decreases. The reaction of the enamel coating layer is a carbonization phenomenon, and no exothermic reaction or endothermic reaction occurs.

  Next, the organic substance contained in the enamel coating layer before and after heating the covering member 12 was analyzed. FIG. 4 shows an infrared absorption spectrum obtained by measuring an example of the enamel coating layer before heating using infrared spectroscopy (IR). FIG. 5 shows an infrared absorption spectrum obtained by measuring the enamel coating layer after heating using infrared spectroscopy (IR). As shown in FIG. 5, after heating, the enamel coating layer was completely carbonized, and the enamel coating layer contained no organic matter. FIG. 4 shows an example of the enamel coating layer, but this embodiment is a coating layer removing method that can handle a large number of enamel coating layers.

  Next, the weight of the enamel coating layer before the treatment of the covering member 12 and the removal amount of the enamel coating layer after the treatment were measured. FIG. 6 shows the ratio (%) of the weight of the enamel coating layer to the total amount of the coating member 12 before processing (before heating, cooling, and peeling treatment). FIG. 7 shows the ratio (%) of the removal amount of the enamel coating layer to the total amount of the coating member 12 after the treatment (after heating, cooling, and peeling treatment).

  In this experiment, after the covering member 12 was introduced into the heating furnace 28, the temperature of the copper member was heated to 900 ° C. within 5 minutes, held at that temperature for 10 minutes, and then cooled with cooling water within 30 seconds. The experiment was performed three times, and the weight of the enamel coating layer before treatment and the weight of the copper member after treatment were measured for each. The weight of the enamel coating layer contained in 100 g of the covering member 12 before the treatment was 1.37% (average of three times) of the total weight of the covering member 12 including the copper member. When the weight of the copper member taken out after the treatment was measured, the coating removal rate of the enamel coating layer was 1.34% (average of 3 times), and the enamel coating layer (carbide) remaining in the copper member after the treatment remained The amount was 0.03% (average of 3 times). Thereby, in this embodiment, it turns out that the enamel coating layer of the copper member surface which comprises the coating member 12 can be removed with a high removal rate.

  Next, the structure of the enamel coating layer carbonized by heating the coating member 12 was analyzed. FIG. 8 shows a spectrum obtained by measuring the enamel coating layer after the coating member 12 is heated using Raman spectroscopy. As shown in FIG. 8, it can be seen that the structure of the enamel coating layer carbonized by heating has a porous structure similar to activated carbon.

  When the chip-shaped coating member 12 is used according to the coating layer removal method of the present embodiment, based on the analysis result of the structure of the enamel coating layer after heating, the measurement result of the removal rate of the enamel coating layer, etc. However, the enamel coating layer can be removed from the copper member with a high removal rate by carbonizing the enamel coating layer by heating.

  Next, a coating layer removing apparatus to which the coating layer removing method according to the second embodiment of the present invention is applied will be described with reference to FIGS. 9 and 10. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 9, the coating layer removing device 70 includes a heating device 72 that heats the coating member 12 in an inert gas atmosphere, and a cooling device 16 that rapidly cools the coating member 12 after heating. The heating device 72 includes a cylindrical heating furnace 74 having a glass tube 76 at the center instead of the heating furnace 28 of the first embodiment. In this heating device 72, since the feeder into which the covering member 12 is charged and the conveying member that conveys the covering member 12 are the same as those in the first embodiment, illustration is omitted.

  A lamp 78 is disposed inside the wall portion 74 </ b> A of the heating furnace 74 so as to surround the cylindrical glass tube 76. The lamp 78 emits light and is introduced into the glass tube 76. The covering member 12 is heated. The heating furnace 74 is a batch type, and a rotating device 80 for inclining the heating furnace 74 and putting the coating member 12 in the glass tube 76 into the cooling device 16 is provided at an end 74B on the downstream side in the longitudinal direction of the heating furnace 74. Is provided. The rotating device 80 includes a pair of supports 84 erected on the base 82, and a shaft portion 86 that spans the support 84 and rotatably supports the heating furnace 74. After the heating of the covering member 12, the upstream side in the longitudinal direction of the heating furnace 74 is rotated upward about the shaft portion 86. During the rotation of the heating furnace 74, the downstream end portion 76 </ b> A of the glass tube 76 moves to the upper side of the cooling water 17 stored in the cooling device 16, and the covering member 12 in the glass tube 76 falls into the cooling water 17. .

  Moreover, nitrogen gas flows into the glass tube 76 in the direction of arrow A at 1 ml / min as an inert gas. Above the downstream end portion 76 </ b> A of the glass tube 76, an exhaust device 88 that collects gas discharged from the glass tube 76 is provided. The exhaust device 88 includes an umbrella-shaped introduction portion 88A and a duct 88B connected to the introduction portion 88A, and a fan (not shown) is provided on the downstream side of the duct 88B. And gas is collect | recovered from 88 A of introduction parts by rotation of a fan.

  As shown in FIGS. 10A and 10B, the coating layer removing device 70 includes a peeling device 90 that peels the enamel coating layer of the coating member 12 after the coating member 12 is cooled. The peeling device 90 includes a rotating tank 92 in which cooling water 98 is stored, a substantially cylindrical protruding portion 94 protruding from the center of the rotating tank 92, and a shaft portion 95 disposed inside the protruding portion 94. And a motor 96 for rotating the rotating tank 92 at the center. By rotating the rotating tank 92, impact is applied to the covering members 12 in the cooling water 98 by centrifugal force, and the enamel coating layer on the surface of the copper member of the covering member 12 is peeled off.

  Next, the coating layer removing method according to the second embodiment of the present invention, which is an operation of the coating layer removing apparatus 70, will be described.

  As shown in FIG. 9, the covering member 12 is introduced into the inside of the glass tube 76 of the heating furnace 74, and the covering member 12 is placed near the central portion in the longitudinal direction of the glass tube 76. At that time, the height of the covering member 12 is set to 2/3 or less of the diameter of the glass tube 76 so as not to block the glass tube 76, and the covering member 12 is heated by causing the lamp 78 to emit light. At this time, the lamp 78 is caused to emit light with an output capable of raising the temperature of the copper member of the covering member 12 to about 900 ° C. within 5 minutes. Thereby, the temperature of the copper member itself inside the enamel coating layer of the coating member 12 is heated to about 900 ° C., the surface of the copper member inside the enamel coating layer is activated, and the enamel coating layer is carbonized. After carbonization of the enamel coating layer is complete, the temperature of the copper member itself is held at about 900 ° C. for at least 3 minutes. Thereby, the interface between the carbonized enamel coating layer and the copper member is easily broken.

Thereafter, the heating furnace 74 is tilted by the rotating device 80, and the covering member 12 in the glass tube 76 is dropped into the cooling water 17 of the cooling device 16 within about 30 seconds.
In the present embodiment, the rotating device 80 for tilting the heating furnace 74 is provided. However, the present invention is not limited to this, and the covering member 12 may be taken out by inserting a scraping bar into the glass tube 76.

  After the covering member 12 is cooled by the cooling device 16, the covering member 12 is put into the rotating tank 92 of the peeling device 90. Then, the rotating tank 92 is rotated, and the coating member 12 in the cooling water 98 is impacted by the centrifugal force to peel the enamel coating layer from the copper member surface of the coating member 12.

  In such a coating layer removing apparatus 70, even when the chip-shaped coating member 12 is used, the enamel coating layer can be removed from the copper member with a high removal rate by carbonizing the enamel coating layer by heating.

  Next, a coating layer removing apparatus to which the coating layer removing method according to the third embodiment of the present invention is applied will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment and 2nd Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 11, the coating layer removing device 110 includes a continuous heating device 112 that heats the coating member 140 in an inert gas atmosphere, and a cooling device 16 that rapidly cools the coating member 140 after heating. ing. As the peeling device, either the peeling device 50 of the first embodiment or the peeling device 90 of the second embodiment may be used, and the description thereof is omitted.

  The covering member 140 is a linear member obtained by finely cutting an enameled wire in advance in a direction substantially orthogonal to the axial direction with a cutter.

  The heating device 112 includes a feeder 20 into which a plurality of covering members 140 are charged, a heating furnace 114 connected to a lower portion of the feeder 20, and a covering member 140 that is charged from the feeder 20 inside the heating furnace 114. A conveying belt 116 that conveys the toner to the other end side. The conveyor belt 116 is an endless belt and is wound around a pair of rollers 118 and 119. The conveyance belt 116 rotates in the direction of arrow B by the rotation of one roller 118, and conveys the covering member 140 on the conveyance belt 116. Around the heating furnace 114, a heater 120 for heating the covering member 140 on the transport belt 116 is provided.

  In the lower wall portion of the heating furnace 114, a discharge port 114 </ b> A that discharges the covering member 140 that has dropped from the transport belt 116 is provided on the downstream side of the transport belt 116 in the transport direction. A cooling device 16 is disposed below the discharge port 114A. In addition, an inlet 114B through which a carrier gas (nitrogen gas in the present embodiment) flows is provided on the side wall of the heating furnace 114 on the feeder 20 side, and the upper side of the heating furnace 114 in the conveying direction (on the outlet 114A side) is provided. An exhaust port 114C for exhausting the gas in the heating furnace 114 is provided in the wall portion. The feeder 20 is configured to be able to purge nitrogen gas.

  Next, the coating layer removing method according to the second embodiment of the present invention, which is an operation of the coating layer removing apparatus 110, will be described.

  In the heating device 112, the covering member 140 is put into the heating furnace 114 from the feeder 20, and the covering member 140 is transported on the transport belt 116 in the arrow B direction. At that time, the copper member inside the enamel coating layer of the coating member 140 is heated to about 900 ° C. by the heater 120 and allowed to pass through the heating furnace 114 at that temperature for 5 minutes or more. As a result, the covering member 140 is heated in an inert gas atmosphere without being exposed to the air, and the enamel covering layer is carbonized. After carbonization of the enamel coating layer is complete, the temperature of the copper member itself is held at about 900 ° C. for at least 3 minutes. Then, the covering member 140 falls into the cooling water 17 of the cooling device 16 from the discharge port 114 </ b> A at the conveyance direction end of the conveyance belt 116.

  After cooling the covering member 140 by the cooling device 16, the covering member 140 is put into the peeling device 50 of the first embodiment or the peeling device 90 of the second embodiment, and the enamel coating layer on the surface of the copper member of the covering member 140 is peeled off. .

  In such a coating layer removing apparatus 110, the enamel coating layer of the coating member 140 is carbonized by heating, whereby the enamel coating layer can be removed from the copper member with a high removal rate.

  In this embodiment, the linear covering member 140 is used. However, the enamel covering layer is made higher from the copper member even if the chip-shaped covering member 12 is used as in the first and second embodiments. It can be removed at a removal rate.

  FIG. 12 shows a melting furnace 150 for heating and melting the copper member from which the enamel coating layer has been removed. FIG. 12 shows an example in which the copper member 12A from which the enamel coating layer is removed from the chip-shaped coating member 12 is melted. The melting furnace 150 is provided with a housing 152 provided with a heating chamber 154 for heating the copper member 12A, and an introduction port 156 for introducing the copper member 12A into the heating chamber 154 at the top of the housing 152. A lid member 158 that can be opened and closed is provided above the introduction port 156. An exhaust port 160 for exhausting the gas in the heating chamber 154 is provided in the wall portion of the housing 152 obliquely above the heating chamber 154. A heater 162 for heating the inside of the heating chamber 154 is provided around the housing 152 provided with the heating chamber 154, and the inside of the heating chamber 154 is heated by the heater 162 to melt the copper member 12A.

  Using such a melting furnace 150, the copper member 12A from which the enamel coating layer was removed was introduced into the heating chamber 154 from the inlet 156, the lid member 158 was closed, and the copper member 12A was melted. At this time, when the gas exhausted from the exhaust port 160 was examined, it was confirmed that no black smoke or dioxin (DXN) was generated from the inside of the heating chamber 154. The same result was obtained when the copper member from which the enamel coating layer was peeled off from the linear coating member 140 was heated and melted.

  In the recycling of enameled wire, when an untreated enameled wire is melted, chlorine and bromine components contained in the enamel coating layer may be synthesized in the exhaust gas and become a source of dioxin (DXN). In the said 1st-3rd embodiment, since an enamel coating layer is carbonized by heating and an enamel coating layer can be removed from a copper member with a high removal rate, when a copper member is heat-melted, dioxin (DXN) etc. Can be prevented.

  In addition, in the said 1st-3rd embodiment, although the covering members 12 and 140 by which the enamel coating layer was formed on the surface of the copper member were used, it is not limited to this, Other organic compounds etc. are on the surface of a copper member. The same can be applied to a covering member on which a covering layer made of is formed.

  In addition, in the said 1st-3rd embodiment, although the cooling device and the peeling apparatus are provided separately, it is not limited to this, The structure which combines a cooling device and a peeling apparatus may be sufficient. That is, you may make it peel the peeling layer from the copper member surface, stirring simultaneously, cooling the heated coating | coated member with the cooling water stored in the peeling apparatus.

DESCRIPTION OF SYMBOLS 10 Coating layer removal apparatus 12 Coating member 12A Copper member 14 Heating device 16 Cooling device 17 Cooling water 26 Gas inflow part (gas inflow device)
28 Heating furnace 48 Exhaust port (exhaust part)
50 Peeling device 57 Cooling water (liquid)
58 Stirring bar 70 Coating layer removing device 72 Heating device 74 Heating furnace 88 Exhaust device (exhaust part)
90 Peeling device 92 Rotating tank 98 Cooling water (liquid)
110 Covering layer removal device 112 Heating device 114 Heating furnace 114C Exhaust port (exhaust part)
114B inlet (gas inflow device)
140 Cover member 202 Protrusion 204 Structure (metal structure)
206 Metal sphere (metal body)
208 stopper

Claims (15)

A heating step of heating the coating member having a coating layer formed on the surface of the copper member to a temperature at which the coating layer is carbonized and a temperature at which the copper member does not melt in an inert gas atmosphere or superheated steam;
A cooling step for cooling the covering member;
A peeling step of peeling the coating layer from the surface of the copper member;
The coating layer removal method which has this.   The coating layer removing method according to claim 1, wherein heating is performed until the temperature of the copper member reaches 700 ° C. to 1000 ° C. in the heating step.   The temperature of the said copper member is heated at the said heating process until it becomes 900 degreeC or more, and the carbonization of the said coating layer is completed, The temperature of the said copper member is further hold | maintained at 900 degreeC or more for at least 3 minutes. Item 3. The coating layer removing method according to Item 2.   The time from the temperature at which the copper member starts heating to the temperature at which the coating layer is carbonized and the temperature at which the copper member does not melt is within 5 minutes in the heating step. The coating layer removing method according to any one of the above.   The coating layer removing method according to any one of claims 1 to 4, wherein the coating member is cooled with a coolant in the cooling step.   The said covering member is stirred in a liquid at the said peeling process, The said coating layers of the said covering member are made to collide, The said coating layer is peeled from the surface of the said copper member, The any one of Claim 1-5 The coating layer removing method according to item.   The temperature rise of the said copper member is promoted by providing a projection part in the inner surface of the heating apparatus used at the said heating process, and expanding the area which the said copper member or the said covering member contacts. The covering layer removing method according to any one of Items 6 to 6.   The metal structure is provided at the tip of the protrusion in the heating device used in the heating step, and the amount of heat in the heating device is increased. The coating layer removal method as described.   The metal body heated beforehand is arrange | positioned in the heating apparatus used at the said heating process, The temperature rise of the said copper member is accelerated | stimulated, The any one of Claim 1-8 characterized by the above-mentioned. Coating layer removal method.   The heating device used in the heating step is provided with a stopper for retaining a part of the copper member that has been charged into the heating device and heated to a predetermined temperature in the heating device. The coating layer removing method according to any one of claims 1 to 9. A coating layer removing apparatus to which the coating layer removing method according to any one of claims 1 to 6 is applied,
A heating device for heating to a temperature at which the coating layer of the coating member is carbonized and a temperature at which the copper member does not melt;
A gas inflow device for flowing an inert gas or superheated steam into the heating device;
An exhaust section for exhausting the gas in the heating device;
A cooling device for charging the covering member discharged from the heating device and cooling the covering member with a coolant;
A peeling device for charging the covering member discharged from the cooling device, stirring the covering member in a liquid, causing the covering layers to collide with each other, and peeling the covering layer;
A coating layer removing apparatus.   The coating layer removing device according to claim 11, wherein a protrusion is provided on an inner surface of the heating device.   13. The coating layer removing apparatus according to claim 12, wherein a metal structure is provided at the tip of the protrusion.   The coating layer removing apparatus according to any one of claims 11 to 13, wherein a metal body heated in advance is disposed in the heating apparatus.   A stopper for retaining a part of the copper member that has been charged into the heating device and heated to a predetermined temperature in the heating device is provided in the heating device. The coating layer removing apparatus according to any one of claims 11 to 14.

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