JP2011171866A - Camera device - Google Patents

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JP2011171866A
JP2011171866A JP2010031931A JP2010031931A JP2011171866A JP 2011171866 A JP2011171866 A JP 2011171866A JP 2010031931 A JP2010031931 A JP 2010031931A JP 2010031931 A JP2010031931 A JP 2010031931A JP 2011171866 A JP2011171866 A JP 2011171866A
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lens
holding member
circuit board
imaging
image pickup
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JP5250575B2 (en
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Masaaki Fukuhara
雅明 福原
Tomoyasu Fuse
智靖 布施
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and low-cost camera device without increasing components for a circuit and a drive device in order to control a drive means or a temperature detecting means. <P>SOLUTION: A camera device is composed of an image pickup lens, an image pickup element, a lens holding member, a circuit board, and screws. A focal-distance holding member is provided between the image pickup element and the circuit board. Alternatively, a clearance may be provided between the image pickup element and the circuit board. The material of a lead frame of the image pickup element may be the same as that of the lens holding member. Preferably, a clearance X may be provided between the image pickup element and the circuit board. The material of the lead frame of the image pickup element is different from that of the lens holding member. If a linear expansion coefficient of the lens holding member is α1 and that of the lead frame is α2, X=L1×α1/α2 is established. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、車載用のカメラ装置に関する。   The present invention relates to an in-vehicle camera device.

固定焦点カメラ装置は、一般的なカムコーダやデジタルスチルカメラで用いられているような、オートフォーカス機能を持たず、レンズと撮像素子が固定されている装置である。構造が単純であり、コスト，振動耐久性などに優れ、車載などに搭載されるカメラ装置は、この構成を用いるものが多い。   The fixed focus camera device is a device that does not have an autofocus function and is fixed to a lens and an image sensor, as used in a general camcorder or a digital still camera. Many camera devices that have a simple structure, are excellent in cost, vibration durability, etc. and are mounted on a vehicle or the like use this configuration.

近年、車載カメラを用いて、画像処理を行い、白線や障害物などを検出し、車両を制御する装置が普及しつつある。画像処理を行うカメラでは鮮明な画像を必要としており、温度変化に関わらず、常に焦点があっているものが、より高い性能を引き出せるものと考えられている。   In recent years, an apparatus for controlling a vehicle by performing image processing using an in-vehicle camera, detecting a white line, an obstacle, or the like is becoming widespread. A camera that performs image processing requires a clear image, and it is considered that a camera that is always in focus regardless of temperature changes can bring out higher performance.

ここで、撮像素子をカメラ本体に対して撮像光軸方向に前後移動可能に支持し、撮像素子を撮影光軸方向に移動させる駆動手段を備える固定焦点カメラ装置が開示されている（特許文献１参照）。駆動手段としては、圧電素子やステッピングモータが用いられ、温度検出手段としては、温度センサが用いられている。   Here, a fixed-focus camera device is disclosed that includes a driving unit that supports the imaging device so as to be movable back and forth in the imaging optical axis direction with respect to the camera body, and moves the imaging device in the imaging optical axis direction (Patent Document 1). reference). A piezoelectric element or a stepping motor is used as the driving means, and a temperature sensor is used as the temperature detecting means.

特開平８−１１４７３６号公報JP-A-8-114736

特許文献１によれば、駆動手段や温度検出手段を制御するための回路や駆動装置が必要なため、部品が増え、カメラ装置の小型化や低コスト化が困難、という課題がある。   According to Patent Document 1, since a circuit and a driving device for controlling the driving unit and the temperature detecting unit are necessary, there is a problem that the number of parts increases and it is difficult to reduce the size and cost of the camera device.

そこで本発明の目的は、部品数を増やすことなく、温度変化における性能劣化の少ないカメラ装置を提供することにある。   Therefore, an object of the present invention is to provide a camera device with little performance deterioration due to temperature change without increasing the number of parts.

上記課題を解決するため、本発明の望ましい態様の一つは次の通りである。   In order to solve the above problems, one of the desirable embodiments of the present invention is as follows.

本カメラ装置は、撮像レンズ，撮像素子，レンズ保持部材，回路基板、及び、ネジから構成され、撮像素子と回路基板の間に焦点距離保持部材を備える。   The camera device includes an imaging lens, an imaging element, a lens holding member, a circuit board, and a screw, and includes a focal length holding member between the imaging element and the circuit board.

本発明によれば、部品数を増やすことなく、温度変化における性能劣化の少ないカメラ装置を提供することができる。   According to the present invention, it is possible to provide a camera device with little performance deterioration due to temperature change without increasing the number of components.

実施例１の説明図。FIG. 3 is an explanatory diagram of the first embodiment. レンズの解像度の説明図。Explanatory drawing of the resolution of a lens. 実施例２の説明図。Explanatory drawing of Example 2. FIG. ステレオカメラシステムの図。The figure of a stereo camera system. 従来構造による温度と解像度の変化を示す図。The figure which shows the change of the temperature by the conventional structure, and the resolution. 実施例１及び２による温度と解像度の変化を示す図。The figure which shows the change of the temperature and the resolution by Example 1 and 2. FIG.

以下、図面を用いて実施例について説明する。   Embodiments will be described below with reference to the drawings.

図１は固定焦点カメラ装置の構成図である。   FIG. 1 is a configuration diagram of a fixed focus camera apparatus.

固定焦点カメラ装置は、撮像レンズ１０，撮像素子２０，レンズ保持部材３０，焦点距離保持部材４０，回路基板５０、及び、ネジ６０から構成される。撮像レンズ１０は光を結像するためのレンズ玉１１、及び、レンズ玉１１を固定するレンズ鏡筒１２から構成される。   The fixed focus camera device includes an imaging lens 10, an imaging element 20, a lens holding member 30, a focal length holding member 40, a circuit board 50, and a screw 60. The imaging lens 10 includes a lens ball 11 for imaging light and a lens barrel 12 that fixes the lens ball 11.

撮像素子２０は、複数の光電変換画素を有し、画像転送する機能を持つ半導体（以下撮像チップ２１）と、撮像チップ２１を封印するパッケージ２２（但し光路はカバーガラス２３などで確保される）と、撮像チップを電気的に接続するためのワイヤーボンディング２４と、ワイヤーボンディング２４と回路基板５０と電気的に接続するリードフレーム２５から構成される。撮像チップ２１としては、例えば、ＣＣＤやＣＭＯＳセンサなどがある。   The image pickup device 20 includes a plurality of photoelectric conversion pixels and a semiconductor (hereinafter, an image pickup chip 21) having a function of transferring an image, and a package 22 that seals the image pickup chip 21 (however, the optical path is secured by a cover glass 23 or the like). And a wire bonding 24 for electrically connecting the imaging chip, and a lead frame 25 for electrically connecting the wire bonding 24 and the circuit board 50. Examples of the imaging chip 21 include a CCD and a CMOS sensor.

回路基板５０は、撮像レンズ１０を電気的に駆動し、撮像レンズ１０の出力を映像出力、或いは画像処理する回路を有する基板である。回路基板５０と撮像レンズ１０は半田により固定され、電気的な接続を確実のものにしている。   The circuit board 50 is a board having a circuit that electrically drives the imaging lens 10 and outputs an image of the imaging lens 10 or performs image processing. The circuit board 50 and the imaging lens 10 are fixed by soldering to ensure electrical connection.

焦点距離保持部材４０は、回路基板５０のＡ面と撮像素子２０のパッケージのＢの間に挟みこむように設置する。   The focal length holding member 40 is installed so as to be sandwiched between the A surface of the circuit board 50 and the B of the package of the imaging device 20.

ネジ６０はレンズ保持部材３０と回路基板５０を固定するためのものであり、これにより撮像チップ２１とレンズ玉１１は固定される。   The screw 60 is for fixing the lens holding member 30 and the circuit board 50, and thereby the imaging chip 21 and the lens ball 11 are fixed.

撮像レンズ１０とレンズ保持部材３０は、撮像レンズ１０と撮像素子２０のピントがあうよう、組立て時に位置決めされた後、接着剤などにより固定される。   The imaging lens 10 and the lens holding member 30 are fixed by an adhesive or the like after being positioned at the time of assembly so that the imaging lens 10 and the imaging element 20 are in focus.

ここでは、レンズ保持部材３０，レンズ鏡筒１２は、以後の計算の簡略化のために同材料とする。   Here, the lens holding member 30 and the lens barrel 12 are made of the same material in order to simplify subsequent calculations.

図１における固定焦点カメラ装置の構成図において、回路基板５０のＡ面からレンズの主点Ｓまでの距離をＬ１、レンズ保持部材３０とレンズ鏡筒１２の材料の線膨張係数をα１、焦点距離保持部材４０の線膨張係数をα２、撮像素子２０のパッケージ２２の線膨張率をα３、撮像チップ２１とパッケージ２２裏面Ｂまでの距離をｄ、及び、焦点距離保持部材４０の厚みをｔとする。この時、
Ｌ１×α１＝ｔ×α２＋ｄ×α３が成立する構造とする。 In the configuration diagram of the fixed focus camera device in FIG. 1, the distance from the A surface of the circuit board 50 to the principal point S of the lens is L1, the linear expansion coefficient of the material of the lens holding member 30 and the lens barrel 12 is α1, and the focal length. The linear expansion coefficient of the holding member 40 is α2, the linear expansion coefficient of the package 22 of the image sensor 20 is α3, the distance between the imaging chip 21 and the back surface B of the package 22 is d, and the thickness of the focal length holding member 40 is t. . At this time,
It is assumed that L1 × α1 = t × α2 + d × α3 holds.

具体例を挙げれば、レンズ保持部材３０とレンズ鏡筒１２の材質をアルミ（α１＝２１×１０-6）、Ｌ１を１０mm、撮像素子２０のパッケージ２２の材質をレジンモールド（α２＝１７×１０-6）、撮像チップ２１とパッケージ２２の裏面Ｂまでの距離ｄを１mm、及び、焦点距離保持部材の材質をＰＢＴ（α３＝１１０×１０-6）とした場合、焦点距離保持部材の厚みｔは、
ｔ＝（１０mm×２１×１０-6−１mm×１７×１０-6）／１１０×１０-6
＝１.７５mm
となる。 As a specific example, the material of the lens holding member 30 and the lens barrel 12 is aluminum (α1 = 21 × 10 −6 ), L1 is 10 mm, and the material of the package 22 of the image sensor 20 is a resin mold (α2 = 17 × 10). -6 ) When the distance d from the imaging chip 21 to the back surface B of the package 22 is 1 mm and the material of the focal length holding member is PBT (α3 = 110 × 10 −6 ), the thickness t of the focal length holding member Is
t = (10 mm × 21 × 10 −6 −1 mm × 17 × 10 −6 ) / 110 × 10 −6
= 1.75mm
It becomes.

次に、レンズの焦点距離と解像度の関係を図２に示す。   Next, the relationship between the focal length of the lens and the resolution is shown in FIG.

撮像レンズ１０の主点Ｓと撮像チップ２１の距離Ｌ１と解像度の関係を図２に示す。Ｌ１が撮像レンズ１０の持つ焦点距離ｆと一致すれば、焦点は合致する。組立て時は調整によって、理想位置に固定することが可能であるが、温度変化によってこの距離が保たれなくなり、近くなっても遠くなっても解像度が低下する。部材の温度収縮は、部材の材料の線膨張率と、部材の長さ（厚み）と、変化温度の比例関係にある。   The relationship between the principal point S of the imaging lens 10 and the distance L1 between the imaging chip 21 and the resolution is shown in FIG. If L1 matches the focal length f of the imaging lens 10, the focus will match. It can be fixed at an ideal position by adjustment at the time of assembly, but this distance cannot be maintained due to a temperature change, and the resolution is lowered regardless of whether it is closer or farther away. The temperature shrinkage of the member is proportional to the linear expansion coefficient of the member material, the length (thickness) of the member, and the change temperature.

今、前述した材料，寸法で温度変化ΔＴ＝６０℃あった場合を考えると、撮像レンズ１０の焦点Ｓが回路基板５０のＡ面から膨張する距離をΔＬ１とすると、
ΔＬ１＝α１×Ｌ１×ΔＴ
＝２１×１０-6×１０mm×６０＝１２.６μｍ
撮像チップ２１が回路基板５０のＡ面から膨張する距離をΔＬ２とすると、
ΔＬ２＝（α２×ｄ＋α３×ｔ）×ΔＴ
＝（１７×１０-6×１mm＋１１０×１０-6×１.７５mm）
＝１２.６μｍ
ΔＬ１＝ΔＬ２
よって回路基板５０のＡ面からの膨張距離は撮像レンズ１０の焦点Ｓと撮像チップ２１は等しくあり、これらの位置関係は保たれることがわかる。 Considering the case where the temperature change ΔT = 60 ° C. with the materials and dimensions described above, if the distance at which the focal point S of the imaging lens 10 expands from the A surface of the circuit board 50 is ΔL1,
ΔL1 = α1 × L1 × ΔT
= 21 × 10 −6 × 10 mm × 60 = 12.6 μm
When the distance that the imaging chip 21 expands from the A surface of the circuit board 50 is ΔL2,
ΔL2 = (α2 × d + α3 × t) × ΔT
= (17 × 10 −6 × 1 mm + 110 × 10 −6 × 1.75 mm)
= 12.6μm
ΔL1 = ΔL2
Therefore, it can be seen that the expansion distance from the A surface of the circuit board 50 is the same between the focal point S of the imaging lens 10 and the imaging chip 21, and the positional relationship between these is maintained.

以下、図面３を用いて実施例２について説明する。   Hereinafter, Example 2 will be described with reference to FIG.

図３は固定焦点カメラ装置の構成図である。   FIG. 3 is a configuration diagram of the fixed focus camera apparatus.

固定焦点カメラ装置は、撮像レンズ１０，撮像素子２０，レンズ保持部材３０，回路基板５０、及び、ネジから６０構成される。回路基板５０と撮像素子２０のパッケージは雇などを用いてクリアランスＸを確保する。   The fixed focus camera device includes an imaging lens 10, an imaging element 20, a lens holding member 30, a circuit board 50, and a screw 60. The package of the circuit board 50 and the image sensor 20 secures the clearance X by using hiring or the like.

撮像素子２０のリードフレーム２５の材料は、レンズ鏡筒１２とレンズ保持部材３０と同じ材料である。クリアランスＸは、Ｌ１と同寸法とする。   The material of the lead frame 25 of the image sensor 20 is the same material as the lens barrel 12 and the lens holding member 30. The clearance X has the same dimensions as L1.

撮像素子２０のリードフレーム２５及びレンズ鏡筒１２とレンズ保持部材３０がアルミであり、その線膨張率をα１＝２１×１０-6とし、Ｘ＝Ｌ１＝１０mm、温度変化ΔＴ＝６０℃とし、撮像レンズ１０の焦点Ｓが回路基板５０のＡ面から膨張する距離をΔＬ１とすると、
ΔＬ１＝α１×Ｌ１×ΔＴ
ΔＸ＝α１×Ｘ×ΔＴ
Ｌ１＝Ｘ
よって
ΔＬ１＝ΔＸ
よって回路基板５０のＡ面からの膨張距離は撮像レンズ１０の焦点Ｓと撮像チップ２１は等しくあり、これらの位置関係は保たれることがわかる。 The lead frame 25 and the lens barrel 12 and the lens holding member 30 of the image sensor 20 are made of aluminum, and the linear expansion coefficient is α1 = 21 × 10 −6 , X = L1 = 10 mm, and the temperature change ΔT = 60 ° C. When the distance that the focal point S of the imaging lens 10 expands from the A surface of the circuit board 50 is ΔL1,
ΔL1 = α1 × L1 × ΔT
ΔX = α1 × X × ΔT
L1 = X
Therefore, ΔL1 = ΔX
Therefore, it can be seen that the expansion distance from the A surface of the circuit board 50 is the same between the focal point S of the imaging lens 10 and the imaging chip 21, and the positional relationship between these is maintained.

図１における固定焦点カメラの構成図において、回路基板のＡ面から、レンズの主点におけるまでの距離をＬ１とし、前記レンズ保持部材及び前記レンズ鏡筒の材料の線膨張係数はα１とする。リードフレームの線膨張係数をα２とする。   In the configuration diagram of the fixed focus camera in FIG. 1, the distance from the A surface of the circuit board to the principal point of the lens is L1, and the linear expansion coefficient of the material of the lens holding member and the lens barrel is α1. The linear expansion coefficient of the lead frame is α2.

回路基板のＡ面と撮像チップまでの距離は前述したようにクリアランスＸをとる。又、レンズ鏡筒１２及びレンズ保持部材３０とリードフレーム２５が異種材料で有る場合は、レンズ鏡筒１２及びレンズ保持部材３０の線膨張率α１とし、リードフレーム２５の線膨張率α２とした場合は、
Ｘ＝Ｌ１×α１／α２
が成立するようなクリアランスとした場合でも同様の効果が得られる。 The distance between the A surface of the circuit board and the imaging chip takes clearance X as described above. When the lens barrel 12 and the lens holding member 30 and the lead frame 25 are made of different materials, the linear expansion coefficient α1 of the lens barrel 12 and the lens holding member 30 is set, and the linear expansion coefficient α2 of the lead frame 25 is set. Is
X = L1 × α1 / α2
The same effect can be obtained even when the clearance is such that is satisfied.

上記実施例は、２つのカメラでステレオ視するシステムに効果がある。図４にステレオカメラシステムの図を示す。ステレオカメラシステムは右カメラ１００と左カメラ１０１とそれらを構造的に支えるベース１０２から構成される。   The above-described embodiment is effective for a system that performs stereo viewing with two cameras. FIG. 4 shows a diagram of a stereo camera system. The stereo camera system includes a right camera 100, a left camera 101, and a base 102 that structurally supports them.

ステレオカメラシステムは、一方のカメラに映る対象物をもう一方のカメラで同じ形状の対象物を探索し、視差値を求め、対象物までの距離を算出する。よって左右の解像度が異なると、対象物が同じ物と認識されず、探索ができない。   The stereo camera system searches for an object reflected in one camera with the other camera having the same shape, obtains a parallax value, and calculates a distance to the object. Therefore, if the left and right resolutions are different, the object is not recognized as the same object and cannot be searched.

従来の構造による解像度とレンズ主点Ｓと撮像チップ２１までの距離と温度変化の関係を図５（Ａ），図５（Ｂ）に示す。   5A and 5B show the relationship among the resolution, the lens principal point S, the distance to the imaging chip 21, and the temperature change according to the conventional structure.

図５（Ａ）は右カメラの解像度とレンズ主点Ｓと撮像チップ２１までの距離の関係図を、図５（Ｂ）は左カメラの解像度とレンズ主点Ｓと撮像チップ２１までの距離の関係図を示す。初期状態（組立状態）では、いずれも同じ解像度であり、レンズ主点Ｓと撮像チップ２１までの距離と理想焦点距離との差の絶対値は同じであり、右カメラは理想焦点距離に対して距離が短く、左カメラは長い状態である。   FIG. 5A is a relationship diagram between the resolution of the right camera and the distance between the lens principal point S and the imaging chip 21, and FIG. 5B is the relationship between the resolution of the left camera and the distance between the lens principal point S and the imaging chip 21. The relationship diagram is shown. In the initial state (assembled state), all have the same resolution, the absolute value of the difference between the distance between the lens principal point S and the imaging chip 21 and the ideal focal length is the same, and the right camera has the ideal focal length. The distance is short and the left camera is long.

固定焦点のカメラ装置のピント調整は、レンズ主点Ｓと撮像チップ２１までの距離を調整するわけではなく、撮像素子に映る画質で調整しているため、誤差がある場合、このような状態が発生し得る。   The focus adjustment of the fixed-focus camera device does not adjust the distance between the lens principal point S and the imaging chip 21 but adjusts the image quality reflected on the imaging device. Can occur.

温度変化があると、右カメラはレンズ主点Ｓと撮像チップ２１までの距離は理想の焦点距離に近づき解像度が向上する方向にあり、左カメラはレンズ主点Ｓと撮像チップ２１までの距離は理想の焦点距離から離れる方向にあり、解像度が低下する。左右のカメラの解像度は著しく異なると、対象物が同じ物と認識されず、測距性能が温度変化により低下する。   When there is a temperature change, the distance between the lens principal point S and the imaging chip 21 is closer to the ideal focal length and the resolution is improved in the right camera, and the distance between the lens principal point S and the imaging chip 21 is in the left camera. In the direction away from the ideal focal length, the resolution decreases. If the resolutions of the left and right cameras are significantly different, the object is not recognized as the same object, and the ranging performance is degraded due to a temperature change.

一方、上記実施例によれば、図６（Ａ），図６（Ｂ）に示すように温度変化は極力抑えられ、温度変化があっても安定した性能を提供することが可能である。   On the other hand, according to the above embodiment, as shown in FIGS. 6 (A) and 6 (B), the temperature change is suppressed as much as possible, and stable performance can be provided even if there is a temperature change.

１０ 撮像レンズ
１１ レンズ玉
１２ レンズ鏡筒
２０ 撮像素子
２１ 撮像チップ
２２ パッケージ
２３ カバーガラス
２４ ワイヤーボンディング
２５ リードフレーム
３０ レンズ保持部材
４０ 焦点距離保持部材
５０ 回路基板
６０ ネジ DESCRIPTION OF SYMBOLS 10 Imaging lens 11 Lens ball 12 Lens barrel 20 Imaging element 21 Imaging chip 22 Package 23 Cover glass 24 Wire bonding 25 Lead frame 30 Lens holding member 40 Focal length holding member 50 Circuit board 60 Screw

Claims (4)

撮像レンズ，撮像素子，レンズ保持部材，回路基板、及び、ネジから構成されるカメラ装置において、前記撮像素子と前記回路基板の間に焦点距離保持部材を備える、カメラ装置。   A camera apparatus comprising an imaging lens, an imaging element, a lens holding member, a circuit board, and a screw, comprising a focal length holding member between the imaging element and the circuit board. 前記焦点距離保持部材はプラスチックを材料とする、請求項１記載のカメラ装置。   The camera apparatus according to claim 1, wherein the focal length holding member is made of plastic. 撮像レンズ，撮像素子，レンズ保持部材，回路基板，ネジから構成される固定焦点カメラ装置において、前記撮像素子と前記回路基板の間にクリアランスを備え、前記撮像素子のリードフレームと前記レンズ保持部材の材料を同一とする、カメラ装置。   In a fixed focus camera device including an imaging lens, an imaging element, a lens holding member, a circuit board, and a screw, a clearance is provided between the imaging element and the circuit board, and the lead frame of the imaging element and the lens holding member Camera device with the same material. 撮像レンズ，撮像素子，レンズ保持部材，回路基板，ネジから構成される固定焦点カメラ装置において、前記撮像素子と前記回路基板の間にクリアランスＸを設け、前記撮像素子のリードフレームと前記レンズ保持部材が異種材料であり、前記レンズ保持部材の線膨張率をα１、前記リードフレームの線膨張率をα２とすると、Ｘ＝Ｌ１×α１／α２とする、カメラ装置。   In a fixed focus camera device including an imaging lens, an imaging element, a lens holding member, a circuit board, and screws, a clearance X is provided between the imaging element and the circuit board, and the lead frame of the imaging element and the lens holding member Is a different material, and X = L1 × α1 / α2 where α1 is the linear expansion coefficient of the lens holding member and α2 is the linear expansion coefficient of the lead frame.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021066118A1 (en) * 2019-10-03 2021-04-08 京セラ株式会社 Imaging device, moving body, and imaging device manufacturing method
US11942494B2 (en) 2018-04-04 2024-03-26 Sony Semiconductor Solutions Corporation Imaging device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004147188A (en) * 2002-10-25 2004-05-20 Fuji Photo Film Co Ltd Digital camera
JP2008209913A (en) * 2007-01-30 2008-09-11 Kyocera Corp Imaging device and information code-reading device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004147188A (en) * 2002-10-25 2004-05-20 Fuji Photo Film Co Ltd Digital camera
JP2008209913A (en) * 2007-01-30 2008-09-11 Kyocera Corp Imaging device and information code-reading device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11942494B2 (en) 2018-04-04 2024-03-26 Sony Semiconductor Solutions Corporation Imaging device
WO2021066118A1 (en) * 2019-10-03 2021-04-08 京セラ株式会社 Imaging device, moving body, and imaging device manufacturing method
JP2021060468A (en) * 2019-10-03 2021-04-15 京セラ株式会社 Imaging apparatus, movable body, and method for manufacturing imaging apparatus
JP7239435B2 (en) 2019-10-03 2023-03-14 京セラ株式会社 IMAGING DEVICE, MOVING OBJECT, AND METHOD FOR MANUFACTURING IMAGING DEVICE

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