JP2011165717A5 - - Google Patents

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Publication number
JP2011165717A5
JP2011165717A5 JP2010023461A JP2010023461A JP2011165717A5 JP 2011165717 A5 JP2011165717 A5 JP 2011165717A5 JP 2010023461 A JP2010023461 A JP 2010023461A JP 2010023461 A JP2010023461 A JP 2010023461A JP 2011165717 A5 JP2011165717 A5 JP 2011165717A5
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JP
Japan
Prior art keywords
thin film
film transistor
laser beam
continuous wave
wave laser
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JP2010023461A
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Japanese (ja)
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JP2011165717A (en
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Priority to JP2010023461A priority Critical patent/JP2011165717A/en
Priority claimed from JP2010023461A external-priority patent/JP2011165717A/en
Publication of JP2011165717A publication Critical patent/JP2011165717A/en
Publication of JP2011165717A5 publication Critical patent/JP2011165717A5/ja
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Claims (8)

薄膜トランジスタ基板を製造する薄膜トランジスタ基板製造工程を備え、
前記薄膜トランジスタ基板製造工程は、
絶縁基板上に非晶質シリコン薄膜を形成する非晶質シリコン薄膜形成工程と、
前記非晶質シリコン薄膜に第1の連続発振レーザ光を照射して、微結晶シリコン膜を形成する微結晶シリコン膜形成工程と、
を有する、ことを特徴とする表示装置の製造方法。
A thin film transistor substrate manufacturing process for manufacturing a thin film transistor substrate,
The thin film transistor substrate manufacturing process includes:
An amorphous silicon thin film forming step of forming an amorphous silicon thin film on an insulating substrate;
Irradiating the amorphous silicon thin film with a first continuous wave laser beam to form a microcrystalline silicon film; and
A method for manufacturing a display device, comprising:
前記微結晶シリコン膜形成工程における前記連続発振レーザ光の一領域あたりの照射時間は100マイクロ秒以上である、ことを特徴とする請求項1に記載の表示装置の製造方法。 2. The method of manufacturing a display device according to claim 1, wherein an irradiation time per region of the continuous wave laser beam in the microcrystalline silicon film forming step is 100 microseconds or more. 前記微結晶シリコン膜に第2の連続発振レーザ光を照射して、前記微結晶シリコン膜の結晶よりも粒径の大きい結晶のシリコン膜を形成する結晶シリコン膜形成工程を更に有する、ことを特徴とする請求項1または請求項2に記載の表示装置の製造方法。   A crystal silicon film forming step of irradiating the microcrystalline silicon film with a second continuous wave laser beam to form a silicon film having a crystal grain size larger than that of the crystal of the microcrystalline silicon film; A method for manufacturing a display device according to claim 1 or 2. 前記結晶シリコン膜形成工程では、多結晶シリコン膜が形成され、
前記第2の連続発振レーザ光の強度は、前記第1の連続発振レーザ光の強度よりも大きく、
前記第2の連続発振レーザ光の走査速度は、前記第1の連続発振レーザ光の走査速度よりも速い、ことを特徴とする請求項3に記載の表示装置の製造方法。
In the crystalline silicon film forming step, a polycrystalline silicon film is formed,
The intensity of the second continuous wave laser beam is greater than the intensity of the first continuous wave laser beam,
The method for manufacturing a display device according to claim 3, wherein a scanning speed of the second continuous wave laser beam is higher than a scanning speed of the first continuous wave laser beam.
前記第2の連続発振レーザ光の走査速度は、前記第1の連続発振レーザ光走査速度の10倍以上である、こと特徴とする請求項4に記載の表示装置の製造方法。   5. The method of manufacturing a display device according to claim 4, wherein the scanning speed of the second continuous wave laser beam is 10 times or more the scanning speed of the first continuous wave laser beam. 前記微結晶シリコン膜を使用した薄膜トランジスタは、前記薄膜トランジスタ基板の表示領域内の薄膜トランジスタであり、前記粒径の大きい結晶のシリコン膜を使用したトランジスタは、前記薄膜トランジスタ基板の表示領域外の薄膜トランジスタである、ことを特徴とする請求項1乃至5のいずれか一項に記載の表示装置の製造方法。 The thin film transistor using the microcrystalline silicon film is a thin film transistor in the display region of the thin film transistor substrate, and the transistor using the crystal silicon film having a large particle size is a thin film transistor outside the display region of the thin film transistor substrate. method of manufacturing a display device according to any one of claims 1 to 5, characterized in that. 薄膜トランジスタ基板を備える表示装置であって、
前記薄膜トランジスタ基板は、
微結晶シリコン膜により形成された表示領域内の第1薄膜トランジスタと、
前記微結晶シリコン膜の結晶より大きな結晶のシリコン膜により形成された表示領域外の第2薄膜トランジスタと、を有することを特徴とする表示装置。
A display device comprising a thin film transistor substrate,
The thin film transistor substrate is
A first thin film transistor in a display region formed of a microcrystalline silicon film;
And a second thin film transistor outside a display region formed by a silicon film having a crystal larger than the crystal of the microcrystalline silicon film.
前記第1薄膜トランジスタは、画素のスイッチングに用いられ、前記第2薄膜トランジスタは、表示用の駆動回路の一部である、ことを特徴とする請求項7に記載の表示装置。   The display device according to claim 7, wherein the first thin film transistor is used for pixel switching, and the second thin film transistor is a part of a display driving circuit.
JP2010023461A 2010-02-04 2010-02-04 Display device and method of manufacturing the same Pending JP2011165717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010023461A JP2011165717A (en) 2010-02-04 2010-02-04 Display device and method of manufacturing the same

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Application Number Priority Date Filing Date Title
JP2010023461A JP2011165717A (en) 2010-02-04 2010-02-04 Display device and method of manufacturing the same

Publications (2)

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JP2011165717A JP2011165717A (en) 2011-08-25
JP2011165717A5 true JP2011165717A5 (en) 2013-01-17

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013030885A1 (en) * 2011-08-30 2013-03-07 パナソニック株式会社 Thin-film-formation-substrate manufacturing method and thin-film substrate
WO2013031198A1 (en) 2011-08-30 2013-03-07 パナソニック株式会社 Method for manufacturing thin-film-formation substrate, method for manufacturing thin-film-element substrate, thin-film substrate, and thin-film-element substrate
WO2013080252A1 (en) 2011-11-29 2013-06-06 パナソニック株式会社 Method for forming crystalline thin film, and method for manufacturing thin film transistor
JP6941473B2 (en) * 2017-04-26 2021-09-29 株式会社日本製鋼所 Display manufacturing method, display and LCD TV
JP2021034693A (en) * 2019-08-29 2021-03-01 株式会社ブイ・テクノロジー Laser annealing device and formation method of crystallized film
WO2021039310A1 (en) * 2019-08-29 2021-03-04 株式会社ブイ・テクノロジー Laser annealing device and laser annealing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4116465B2 (en) * 2003-02-20 2008-07-09 株式会社日立製作所 Panel-type display device, manufacturing method thereof, and manufacturing device
JP4413569B2 (en) * 2003-09-25 2010-02-10 株式会社 日立ディスプレイズ Display panel manufacturing method and display panel
JP2008053528A (en) * 2006-08-25 2008-03-06 Hitachi Displays Ltd Manufacturing method of display device
JP2009081383A (en) * 2007-09-27 2009-04-16 Hitachi Displays Ltd Display unit equipped with thin-film semiconductor device and manufacturing method of thin-film semiconductor device
JP2009218524A (en) * 2008-03-13 2009-09-24 Hitachi Displays Ltd Manufacturing method of flat display device, and flat display device

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