JP2011152675A - Transfer system and transfer method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To carry out transfer with efficiency improved in a transfer system for transferring a minute transfer pattern formed in a mold to a molded article. <P>SOLUTION: The transfer system 1 has a position adjusting device 5 for adjusting the relative positions of the mold M and the molded article W in order to transfer the minute transfer pattern formed in the mold M to an exact position of the molded article W, a transfer device 7 for transferring the minute transfer pattern formed in the mold M by pressing the molded article W by the mold M with the relative position adjusted to the molded article W, and a releasing device 9 for separating the mold M and the molded article W which are adhered to each other after the transfer with the use of the transfer device 7 is carried out from each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a transfer system and a transfer method, and more particularly to a method for transferring a fine transfer pattern formed on a mold onto a molded product.

  In recent years, a mold (mold) is formed by forming an ultrafine transfer pattern on a quartz substrate or the like by an electron beam drawing method or the like, and the mold is pressed to a molded product with a predetermined pressure, and the mold is formed. A nanoimprint technique for transferring a transfer pattern has been researched and developed (for example, see Non-Patent Document 1).

  As a method for forming a nano-order fine pattern (transfer pattern) at a low cost, an imprint method using a lithography technique has been devised. This molding method is roughly classified into a thermal imprint method and a UV imprint method.

  In the thermal imprint method, a mold is pressed against a substrate, heated to a temperature at which a resin made of a thermoplastic polymer (thermoplastic resin) can flow sufficiently, and the resin flows into a fine pattern. The resin is cooled to below the glass transition temperature, and after the fine pattern transferred to the substrate is solidified, the mold is pulled apart.

  In the UV imprint method, a transparent mold capable of transmitting light is used, and the UV radiation is applied by pressing the mold against the UV curable liquid. Radiant light is applied for an appropriate time to cure the solution and transfer the fine pattern, and then pull back the mold.

  Recently, in rotary storage devices such as hard disks, CDs, and DVDs, there is a high interest in methods that utilize such nanoimprint technology as a means for forming a storage medium (recording medium) for forming high-density data on a disk. It has become to.

  FIG. 28 and FIG. 29 are diagrams showing a schematic configuration of a conventional transfer apparatus 300 used in the thermal imprint method.

  The conventional transfer apparatus 300 includes a positioning unit 302, a molded product base installation body 304, a molded product base 306, a mold base pressing body 308, a mold base 310, and a bellows 312. A mold M is installed on the mold base 310, and a molded product W is installed on the molded product base 306.

  Further, the conventional transfer apparatus 300 is provided with a camera 314 for photographing the eye mark formed on the mold M and the eye mark formed on the molded product W. The camera 314 can move from the shooting position (shootable position; observation position) shown in FIG. 28 to the retracted position shown in FIG. 29 and from the retracted position to the shooting position.

  In the transfer device 300, as shown in FIG. 28, the camera 314 located at the photographing position is controlled under the control of the control device 316 in a state where the mold M and the molded product W before transfer are installed. Each eye mark is photographed, and the positioning unit 302 is operated in accordance with the photographing result, so that the position of the mold M with respect to the workpiece W is made accurate.

  Subsequently, the camera 314 is retracted to the retracted position, the mold M and the molded product W are heated, the mold base pressing body 308 is lowered, and the molded product W is pressed with the mold M for a predetermined time. M and the molded product W are cooled, and a fine transfer pattern formed on the mold M is transferred to the molded product W.

  Thereafter, when the mold base pressing body 308 is raised and the mold M is separated from the molded product W, the transfer of the fine transfer pattern to the molded product W is completed as shown in FIG.

  For example, Patent Document 1 can be cited as a document related to the prior art.

JP 2006-318773 A

Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology 25 (2001) 192-199

  By the way, the conventional transfer apparatus 300 has a problem that the transfer to the molding object is not performed efficiently.

  That is, after the mold or the molded product is heated and pressed with the mold, it is necessary to wait while the mold and the molded product are left until the mold or the molded product cools down. During this time, the camera cannot be moved to the observation position to photograph the mold or the molded product, and it is necessary to keep the camera in the retracted position, which reduces the transfer efficiency.

  Note that the above problem occurs similarly in the UV imprint method.

  The present invention has been made in view of the above problems, and in a transfer system and transfer method for transferring a fine transfer pattern formed on a mold to a molded product, the transfer can be performed more efficiently than before. The purpose is to provide what can be done.

  According to the first aspect of the present invention, the relative position between the mold and the molded product is adjusted in order to transfer a fine transfer pattern formed on the mold to an accurate position of the molded product. The position adjusting device and the position adjusting device are provided separately, and are formed on the mold by pressing the relative position-adjusted product with the mold whose relative position is adjusted. The transfer device that transfers the fine transfer pattern to the molding product and the transfer device are provided separately from the transfer device, and are attached to each other after being transferred using the transfer device and the molding device A transfer system having a release device for separating an article.

  According to a second aspect of the present invention, in the transfer system according to the first aspect, the position adjusting device and the release device are shared.

  According to a third aspect of the present invention, in the transfer system according to the first or second aspect, the transfer by the transfer device is configured to be performed in a vacuum molding chamber, and positioning is performed by the position adjusting device. A transfer system configured such that a relative shape of the mold and the molding object positioned by the position adjustment device are held in the vacuum molding chamber and supplied to the transfer device. is there.

  According to a fourth aspect of the present invention, there is provided a transfer device that transfers a fine transfer pattern formed on a mold onto the product by pressing the product to be molded with the mold and the transfer device. And a mold release device that separates the mold and the molded product that are adhered to each other after the transfer using the transfer apparatus.

  A fifth aspect of the present invention is a transfer method performed using the transfer system according to any one of the first to fourth aspects.

  The invention according to claim 6 adjusts the relative position between the mold and the molded product in order to transfer a fine transfer pattern formed on the mold to an accurate position of the molded product. The mold in which the relative position is adjusted by the position adjusting step in a mold in which the relative position is adjusted by the position adjusting step at a place different from the position adjusting step and the position adjusting step. The transfer process of pressing a product to transfer a fine transfer pattern formed on the mold to the product to be molded, and the transfer process are separated from each other after being transferred by the transfer process. And a mold release step for separating the mold from the molded product.

  According to the present invention, in a transfer system and a transfer method for transferring a fine transfer pattern formed on a mold to a molded product, there is an effect that transfer can be performed more efficiently than before.

1 is a plan view showing a schematic configuration of a transfer system according to a first embodiment of the present invention. It is a figure which shows schematic structure of a position adjustment apparatus and a temporary holding unit. It is a figure which shows schematic structure of a position adjustment apparatus and a temporary holding unit. It is a figure which shows schematic structure of a position adjustment apparatus and a temporary holding unit. It is a figure which shows schematic structure of a position adjustment apparatus and a temporary holding unit. It is a figure which shows schematic structure of the transfer apparatus which transfers by a thermal imprint method. It is a figure which shows schematic structure of the transfer apparatus which transfers by a thermal imprint method. It is a figure which shows schematic structure of the transfer apparatus which transfers by a thermal imprint method. It is a figure which shows schematic structure of a mold release apparatus. It is a figure which shows schematic structure of a mold release apparatus. It is a figure which shows schematic structure of a mold release apparatus. It is a figure which shows schematic structure of a mold release apparatus. It is a top view which shows schematic structure of the transfer system which concerns on the 2nd Embodiment of this invention. It is a figure which shows the modification of a mold release apparatus and a temporary holding unit. It is a figure which shows the modification of a mold release apparatus and a temporary holding unit. It is a figure which shows the modified example and peeling apparatus of a mold release apparatus and a temporary holding unit. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a position adjustment apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a position adjustment apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a position adjustment apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a position adjustment apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a transfer apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a transfer apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a transfer apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a mold release apparatus. It is a figure which shows the case where the temporary holding unit etc. which are used with UV imprint method are used with a mold release apparatus. It is a figure which shows the structure of the temporary holding unit which maintains the positional relationship of a type | mold and a to-be-molded product using a maintenance apparatus instead of a bellows. It is a top view which shows schematic structure of the transfer system which concerns on the 3rd Embodiment of this invention. It is a figure which shows schematic structure of the conventional transfer apparatus used by the thermal imprint method. It is a figure which shows schematic structure of the conventional transfer apparatus used by the thermal imprint method.

[First Embodiment]
FIG. 1 is a plan view showing a schematic configuration of a transfer system 1 according to the first embodiment of the present invention.

  A transfer system (nanoimprint system) 1 is a system for transferring a fine transfer pattern (transfer pattern formed by fine irregularities) formed on a mold M to a product to be molded (transfer material) W. For example, it comprises a pre-transfer molded product stocker 3, a position adjusting device 5, a transfer device 7, a release device 9, and a post-transfer molded product stocker 11. In this specification, for convenience of explanation, one horizontal direction is defined as the X-axis direction, another horizontal direction that is orthogonal to the X-axis direction is defined as the Y-axis direction, and the vertical direction (up and down Direction) may be referred to as the Z-axis direction.

  The pre-transfer molded product stocker 3 is a stocker capable of storing a plurality of molded products W before a fine transfer pattern is transferred.

  The position adjustment device (position adjustment station) 5 adjusts the relative position between the mold M and the molding target W (mold) before transferring the fine transfer pattern formed on the mold M to the molding target W. This is a device that performs positioning of the workpiece W with respect to M). This adjustment of the position is for transferring a fine transfer pattern formed on the mold M to an accurate position of the molding target W.

  The transfer device (transfer station) 7 is provided separately from the position adjusting device 5, and is a molded product (relatively adjusted by the position adjusting device 5) with a mold M whose relative position is adjusted by the position adjusting device 5. This is an apparatus that presses a molded product (W) adjusted in a proper position) and transfers a fine transfer pattern formed on the mold M onto the molded product W.

  The mold M and the molded product W are formed in a flat plate shape such as a rectangular shape or a circular shape, for example. A fine transfer pattern is formed on one surface of the mold M in the thickness direction. In addition, a fine transfer pattern is transferred, and fine unevenness that is opposite to the fine unevenness of the mold M is formed on one surface in the thickness direction of the molded product W.

  The mold release device (release station) 9 is provided separately from the position adjusting device 5 and the transfer device 7, and after being transferred using the transfer device 7, the mold M and the product to be molded are adhered to each other. This is an apparatus for separating W from mold (separating mold M from article W).

  The post-transfer molded product stocker 11 is a stocker capable of storing a plurality of molded products W transferred with a fine transfer pattern.

  Position alignment between the mold M and the molded product W in the position adjusting device 5, transfer in the transfer device 7, separation of the mold M from the molded product W in the mold release device 9, position adjustment device 5 and transfer device 7 The conveyance of the mold M and the molded product W between the transfer device 7 and the transfer of the mold M and the molded product W between the transfer device 7 and the release device 9 will be described later in detail. A temporary holding unit (hereinafter referred to as “temporary holding unit”) 13 (see FIG. 2 and the like) is used.

  A transfer device (not shown) constituted by a robot or the like is provided between the pre-transfer molded product stocker 3 and the position adjusting device 5, and as shown by an arrow A11 in FIG. For example, the molded product W can be conveyed (supplied) from the molded product stocker 3 to the position adjusting device 5 in a single sheet.

  For example, a plurality of transfer devices 7 are provided for one position adjusting device 5 and one mold release device 9, and between the position adjusting device 5 and the mold release device 9 and each transfer device 7. Is provided with a transfer device 19 in which a robot (a robot that can be moved and positioned in a direction indicated by an arrow A12 in FIG. 1) 17 is arranged on a rail 15.

  Then, the mold M positioned by the position adjustment device 5 using the temporary holding unit 13 and the product W are transferred together with the temporary holding unit 13 by any one of the transfer devices 7 by the transport device 19. 7 is conveyed (supplied).

  In addition, the molded product W transferred by any one of the transfer devices 7 and the mold (mold attached to the molded product W) M used for the transfer are temporarily held. Together with the unit 13, the transfer device 19 transports (unloads) the transfer device 7 to the release device 9.

  Between the mold release device 9 and the position adjustment device 5, a transfer device (not shown) configured by a robot or the like is provided, and the position from the mold release device 9 is indicated by an arrow A <b> 13 in FIG. 1. The adjusting device 5 can be transported (supplied) the mold M and the temporary holding unit 13 that holds the mold M but has the molded product W removed. The supplied temporary holding unit 13 or the like is used again for positioning the mold M and the workpiece W or the like.

  A transfer device (not shown) constituted by a robot or the like is provided between the release device 9 and the post-transfer molded product stocker 11, and as shown by an arrow A14 in FIG. The transferred molded product W can be transported (unloaded), for example, as a single sheet from 9 to the post-transfer molded product stocker 11.

  Here, the temporary holding unit 13 will be described in detail (for example, see FIGS. 2 to 5).

  The temporary holding unit 13 includes a flat mold base 21 and a flat molded product base (material base) 23. A mold M is integrally installed on the mold base 21 using a mold fixture 25. In a state in which the mold M is installed on the mold base 21, the mold M is positioned almost at the center of the mold base 21, and the other surface (upper surface; fine transfer pattern) of the plate-shaped mold M in the thickness direction. The surface on the side opposite to the surface on which is formed is in surface contact with the planar lower surface of the mold base 21.

  A molded product W is placed and placed on the molded product base 23. Further, when the molded product W is installed on the molded product base 23, the molded product base 23 is molded by a molded product fixture (not shown) configured similarly to the mold fixture 25, for example. The product W is integrally held.

  It is assumed that the mold fixture 25 and the molded product fixture are provided at positions where they do not interfere with each other when the molded product W is pressed with the mold M to transfer. For example, when viewed from the Z-axis direction, the molded product W is formed larger than the mold M, the mold M is located inside the molded product W, and the molded product fixture is molded. The periphery of the product W (near the edge) is gripped. Then, the mold fixture 25 and the molded product fixture do not interfere with each other. In addition, it may replace with the mold fixture 25 and a to-be-molded product fixture, and may be the structure which hold | maintains the type | mold M and the to-be-molded product W by vacuum suction.

  In a state where the molded product W is installed on the molded product base 23, the molded product W is positioned substantially at the center of the molded product base 23, and the thickness of the flat molded product W is increased. The other surface (the lower surface; the surface opposite to the surface to which the fine transfer pattern is transferred) is in surface contact with the planar upper surface of the molded product base 23.

  The mold base 21 is integrally provided with a cylindrical elastic body such as a bellows 27 or a cylindrical member that can be expanded and contracted in the axial direction. The mold base 21, the bellows 27, and the article base 23 to be molded are A vacuum molding chamber 29 (see FIG. 3 and the like) is formed in which the mold M and the workpiece W are inserted during transfer.

  More specifically, a ring-shaped upper bellows support 31 is integrally provided at one end (upper end) in the axial direction of the cylindrical bellows 27. In addition, a ring-shaped lower bellows support 33 is integrally provided at the other end (lower end) in the axial direction of the cylindrical bellows 27.

  Then, the upper bellows support 31 is formed on the lower surface of the mold base 21 so that the mold fixture 25 and the mold M installed integrally with the mold base 21 using the mold fixture 25 enter the inside of the bellows 27. It is integrally provided in the vicinity of the outer periphery. In addition, in order to ensure the airtightness between the upper bellows support 31 and the mold base 21, the upper bellows support 31 is provided with a seal member such as an O-ring 35. A seal member such as an O-ring 37 is also provided at the lower end of the lower bellows support 33.

  As shown in FIG. 2, when the mold M installed on the mold base 21 is far away from the molded product W installed on the molded product base 23 (the lower surface of the mold M installed on the mold base 21 is The O-ring 37 provided on the lower bellows support 33 is only a distance H2 from the molding base 23 when the distance H1 is away from the upper surface of the molding W placed on the molding base 23). The vacuum forming chamber 29 is not formed. Note that the value of the distance H2 is larger than the value of the distance H1.

  From the state shown in FIG. 2, the mold base 21 holding the mold M is lowered, and as shown in FIG. 3, the O-ring 37 provided on the lower bellows support 33 is attached to the molded product base 23. A vacuum molding chamber 29 (a vacuum molding chamber for preventing bubbles from entering fine irregularities of the molding target W during transfer) 29 in which the mold M and the molding target W enter the inside by contacting with the upper surface 29 Is to be formed. In the state shown in FIG. 3, the lower surface of the mold M installed on the mold base 21 is separated from the upper surface of the molded product W installed on the molded product base 23 by a distance H3 (distance H2−distance H1). .

  When the mold base 21 holding the mold M is further lowered from the state shown in FIG. 3, the bellows 27 is compressed and elastically deformed so that the length in the axial direction (vertical direction) becomes short, and is shown in FIG. In this way, the mold M installed on the mold base 21 comes into contact with the molded product W installed on the molded product base 23.

  The bellows 27 may be provided integrally with the molded product base 23 instead of the mold base 21, or two bellows 27 may be provided in the middle portion in the axial direction (vertical direction). The upper bellows may be provided integrally with the mold base 21, and the lower bellows may be provided integrally with the molded product base 23.

  The molding target base 23 is provided with an air path 39 for reducing the pressure in the vacuum molding chamber 29 until the vacuum is almost evacuated. One end of the air path 39 is connected to the vacuum forming chamber 29. For example, a pilot check valve 41 is provided at the other end of the air path 39, and a main path 43 and a pilot pressure supply path 45 extend from the pilot check valve 41. An open / close valve (for example, a one-touch joint) 43 is provided at the distal end of the main path 43, and an open / close valve (for example, a one-touch joint) 49 is also provided at the distal end of the pilot pressure supply path 45.

  2, 3, etc., a part of the air path 39, the pilot check valve 41, the main path 43, the pilot pressure supply path 45, and the open / close valves 47 and 49 are separated from the molded product base 23. Although shown as being provided, in practice, a part of the 39 air path described above is provided integrally with the base 23 to be molded.

  In the state shown in FIG. 3, a vacuum pump 51 is connected to the opening / closing valve 47 of the main path 43, the air pressure in the vacuum molding chamber 29 is reduced, and the mold base 21 provided with the mold M is lowered. As shown by 4, the mold M can be brought into contact with the workpiece W in a substantially vacuum atmosphere. Thereafter, even if the vacuum pump 51 is removed from the opening / closing valve 47, the vacuum atmosphere in the vacuum molding chamber 29 can be maintained.

  Next, the position adjusting device (alignment device) 5 will be described in detail.

  The position adjusting device 5 includes a base body 53, a positioning unit 55, a molded product base installation body (material base installation body) 57, and a mold base pressing body (mold base installation body) 59 (FIG. 2). Etc.).

  The positioning unit 55 is provided below the base body 53, and the base portion of the positioning unit 55 is provided integrally with the base body 53. On the upper surface of the movable portion of the positioning unit 55 (a plane orthogonal to the Z-axis direction), a plate-shaped molded product base installation body 57 is formed by using a molded product base attaching / detaching device 62 described later in detail. It is designed to be integrated. In a state where the molded product base installation body 57 is installed on the movable part of the positioning unit 55, the planar upper surface of the molded product base installation body 57 is orthogonal to the Z-axis direction.

  The positioning unit 55 is composed of, for example, an XY stage and a θ stage, and the molded product base installation body 57 provided in the movable part of the positioning unit 55 is controlled in the X-axis direction under the control of the control device 61. In addition to being moved and positioned in the Y-axis direction, it is rotationally positioned around the θ-axis (an axis extending in the Z-axis direction through the center of the positioning unit 55).

  The mold base pressing body 59 is provided on the base body 53 above the base body 53 and the molded product base installation body 57 and away from the molded product base installation body 57. The mold base pressing body 59 is provided on the base body 53 via a linear guide bearing (not shown), and is movable in the vertical direction (Z-axis direction) with respect to the base body 53. Further, the mold base pressing body 59 is moved and positioned under the control of the control device 61 using an actuator such as a servo motor (not shown) or a ball screw.

  Instead of or in addition to moving the mold base pressing body 59, the molded product base installation body 57 may be configured to be movable and positionable with respect to the base body 53 in the vertical direction. In other words, it is only necessary that the molded product base installation body 57 and the mold base pressing body 59 are relatively movable and positionable in the directions in which they approach and separate from each other.

  Further, in addition to providing the molded product base mounting body 57 so that it can be moved (rotated) around the X-axis direction, the Y-axis direction, and the θ-axis, it can be positioned freely. The mold base 21 provided integrally with the mold base pressing body 59 using the device 63 may be provided so as to be movable (rotatable) and positionable around the X axis direction, the Y axis direction, and the θ axis. . That is, the mold base 21 may be configured to be relatively movable (rotating) relative to the molded product base installation body 57 around the X axis direction, the Y axis direction, and the θ axis. .

  The lower surface of the mold base pressing body 59 is formed in a planar shape orthogonal to the Z-axis direction. As described above, the upper surface of the molded product base installation body 57 is also formed in a planar shape orthogonal to the Z-axis direction. The lower surface of the mold base pressing body 59 and the upper surface of the molded product base mounting body 57 are opposed to each other with a predetermined distance therebetween in parallel.

  The mold base pressing body 59 is provided with a mold base attaching / detaching device 63. The mold base attaching / detaching device 63 includes, for example, a holding member 65 formed in an “L” shape. A plurality of holding members 65 are provided on the periphery of the lower surface of the mold base pressing body 59. The holding member 65 includes a columnar base end portion that extends in the Z-axis direction, and a tip end portion that protrudes in the horizontal direction at the tip of the base end portion. It is formed in a letter shape.

  Under the control of the control device 61, an actuator such as a pneumatic cylinder (not shown) can be rotated and positioned with the axis Z1 extending in the Z-axis direction passing through the center of the base end side portion as the rotation center. In addition, it can be moved and positioned in the Z-axis direction. That is, it moves between the holding position P1 and the opening position P2 shown in FIG.

  The holding position P <b> 1 is a position where the holding member 65 holds the mold base 21, and by this holding, the mold base (the mold M and the bellows 27 held by the mold base 21) 21 is moved to the mold base pressing body 59. Are integrally installed at predetermined positions. The open position is a position when the holding member 65 opens the mold base 21.

  The molded product base installation body 57 is also provided with the molded product base installation / removal device 62, which is similar to the mold base attachment / detachment device 63. However, the molded product base installation / removal device of the molded product base installation body 57 is provided. The configuration may be such that 62 is deleted and the molded product base 23 is installed simply by placing it on the molded product base installation body 57.

  In a state where the temporary holding unit 13 is installed on the mold base pressing body 59 using the mold base attaching / detaching device 63, the upper surface of the mold base 21 of the temporary holding unit 13 comes into surface contact with the lower surface of the mold base pressing body 59, 21 (bellows 27, mold M) is integrally installed on the mold base pressing body 59. Further, in a state where the temporary holding unit 13 is installed using the molded product base attaching / detaching device 62, the lower surface of the molded product base 23 of the temporary holding unit 13 is in surface contact with the upper surface of the molded product base installation body 57, The molded product base 23 (molded product W) is integrally installed on the molded product base installation body 57.

  The position adjustment device 5 is provided with an imaging device (camera) 67. The camera 67 uses the camera moving device 69 to transfer the fine transfer pattern of the mold M from the position where the mold M and the molded article W can be photographed (observation position) to the molded article W. It moves to the retracted position where it does not interfere with W and the temporary holding unit 13, and can move from the retracted position to the observation position.

  More specifically, as shown in FIG. 2, the mold M and the molded product W are separated by a predetermined distance H2, and the O-ring 37 of the bellows 27 is separated from the molded product base 23 by a predetermined distance H1. The camera 67 can enter between the mold M and the molded product W in a state of being separated from the mold M or the molded product W, and can be positioned at a photographing position (observation position). ing.

  In the state shown in FIG. 2, the mold base pressing body 59 is located at the rising end, for example, the mold M and the product W are installed in the temporary holding unit 13, and the mold base of the temporary holding unit 13 is 21 is provided integrally with the mold base pressing body 59 by the mold base attaching / detaching device 63, and the molded product base 23 of the temporary holding unit 13 is integrated with the molded product base installing body 57 by the molded product base attaching / detaching device 62. Provided.

  An eye mark formed on the mold M and an eye mark formed on the molding target W can be photographed almost simultaneously by the camera 67 located at the photographing position. Then, using the photographing result of each camera 67 (the position of each eye mark), the positioning unit 55 is driven under the control of the control device 61 to position the workpiece W with respect to the mold M (X-axis direction, Y-axis direction). , Positioning around the θ axis).

  Further, after positioning the molded product W with respect to the mold M, the camera 67 is positioned at the retracted position, and the mold base pressing body 59 is lowered until the O-ring 37 of the bellows 27 and the molded product base 23 come into contact with each other. Then, as shown in FIG. 3, a vacuum forming chamber 29 is formed.

  The vacuum molding chamber 29 is depressurized, and as shown in FIG. 4, the mold base pressing body 59 is further lowered until the mold M comes into contact with the workpiece W, and the vacuum pump 51 is removed from the opening / closing valve 47. The mold M and the molded product W are held by the temporary holding unit 13 by atmospheric pressure, and the relative positions of the mold M, the molded product W, and the temporary holding unit 13 are maintained.

  When the attachment / detachment devices 62 and 63 are opened from the state shown in FIG. 4, the temporary holding unit 13 holding the mold M and the product W is maintained in the vacuum forming chamber 29 as shown in FIG. 5. (The vacuum molding chamber 29 is maintained in a substantially vacuum state) so that the relative positions of the mold M, the molded product W, and the temporary holding unit 13 can be maintained, and can be carried out from the position adjusting device 5. It has become.

  A transfer device (see FIG. 6) for transferring by a thermal imprint method includes a base body 71, a molded product base installation body (material base installation body; molded product side heating / cooling plate) 73, and a mold base pressing body (mold). Side heating / cooling plate) 75. The molded product base installation body 73 is provided integrally with the base body 71 below the base body 71. The mold base pressing body 75 is provided on the base body 71 away from the molded product base installation body 73 above the base body 71 and the molded product base installation body 73. The mold base pressing body 75 is provided on the base body 71 via a linear guide bearing (not shown), and is movable in the vertical direction (Z-axis direction) with respect to the base body 71. Further, the mold base pressing body 75 is moved and positioned under the control of the control device 77 using an actuator such as a servo motor (not shown) or a ball screw.

  Instead of or in addition to moving the mold base pressing body 75, the molded product base installation body 73 may be configured to be movable and positionable with respect to the base body 71 in the vertical direction. That is, it is only necessary that the molded product base installation body 73 and the mold base pressing body 75 are relatively movable and positionable in the direction in which they approach and separate from each other.

  The lower surface of the mold base pressing body 75 is formed in a planar shape orthogonal to the Z-axis direction. The upper surface of the molded product base installation body 71 is also formed in a planar shape orthogonal to the Z-axis direction. The lower surface of the mold base pressing body 75 and the upper surface of the molded product base installation body 71 are opposed to each other with a predetermined distance therebetween in parallel.

  The molded product base installation body 73 is provided with a heating unit 79 for heating the molded product W made of a thermoplastic resin and a cooling unit 81 for cooling the molded product W.

  For example, the molded product base installation body 73 is provided with a medium through-hole for flowing a temperature medium (for example, oil or water), and the molded product base installation body 73 is inserted into the through-hole for the medium. By passing a heating medium (warm medium) heated by a medium heating device (not shown) installed outside, the molded article base installation body 73 is heated to temporarily hold the molded article base installation body 73 (temporary holding). The temperature of the molded product base 23 of the unit 13 and the molded product W) can be raised.

  Further, for example, a heat medium (refrigerant) cooled by a medium cooling device (not shown) installed outside the molded article base installation body 73 is caused to flow in the medium through hole instead of the heat medium. As a result, the molded product base installation body 73 is cooled, and the temperature of the molded product base installation body (the molded product base 23 of the temporary holding unit 13 and the molded product W) can be lowered to, for example, room temperature. Yes.

  The mold base pressing body 75 is also provided with heating means 83 and cooling means 85 similar to the case of the molded product base installation body 73.

  The heating unit 83 and the cooling unit 85 provided on the mold base pressing body 75 and at least one of the heating unit 79 and the cooling unit 81 provided on the molded product base installation body 73 are omitted. Also good. That is, the structure which provided the heating means and the cooling means in at least one of the type | mold base press body 75 and the to-be-molded product base installation body 73 may be sufficient.

  Furthermore, the structure which deleted the cooling means may be sufficient, the structure which provided the heating means in the type | mold base press body 75, and provided the cooling means in the to-be-molded article base installation body 73, or a to-be-molded The product base installation body 73 may be provided with heating means, and the mold base pressing body 75 may be provided with cooling means.

  The transfer device 7 is provided with a temporary holding unit 13 carried out from the position adjusting device 5. In the temporary holding unit 13, as shown in FIG. 5, a vacuum forming chamber 29 in a substantially vacuum state is formed, and the mold M and the molded product W come into contact with each other so that the mold M and the molded product W are relative to each other. Position is maintained.

  More specifically, as shown in FIG. 6, in the state where the mold base pressing body 75 is located at the rising end, for example, the planar lower surface of the molded product base 23 of the temporary holding unit 13 is the molded product base installation body. The temporary holding unit 13 is placed on the molded product base installation body 73 so as to be in surface contact with the planar upper surface of 73. In this mounted state, there is a predetermined gap between the mold base 21 and the mold base pressing body 75 of the temporary holding unit 13. The vacuum molding chamber 29 in a substantially vacuum state is maintained until immediately before the mold M is separated from the molded product W by the mold release device 9.

  As shown in FIG. 6, with the temporary holding unit 13 placed on the transfer device 7, the mold M and the product W are molded by the heating means 79 and 83 under the control of the control device 77. The product W is heated until it becomes soft and has a hardness suitable for transfer. After the article to be molded W is softened moderately, as shown in FIG. 7, the mold base pressing body 75 is lowered to the position indicated by the two-dot chain line in FIG. 7, and the temporary holding unit 13 (the mold M and the article to be molded W). Is sandwiched between the molded product base installation body 73 and the mold base pressing body 75, and the molded product W is pressed by the mold M. In addition, you may be comprised so that the heating by the heating means 79 and 83 may be started when the type | mold base press body 75 descend | falls to the position shown with a dashed-two dotted line in FIG.

  In a state where the temporary holding unit 13 is sandwiched between the molded product base installation body 73 and the mold base pressing body 75, the upper surface of the mold base 21 of the temporary holding unit 13 is in surface contact with the lower surface of the mold base pressing body 75. The lower surface of the molded product base 23 of the temporary holding unit 13 is in surface contact with the upper surface of the molded product base installation body 73 so that the degree of softening of the molded product W for pressing is maintained. The heating means 79 and 83 are used for heating.

  After a predetermined time has elapsed from the start of pressing, the fine transfer pattern of the mold M is transferred to the softened molded product W (after the reverse pattern of the mold M is formed on the molded product W), and then cooled. The means 81 and 85 are configured to cool the temporary holding unit 13 until the temporary holding unit 13 (the mold M, the product to be molded W) reaches room temperature, and to solidify the product to be molded W. Further, after this solidification, the mold base pressing body 75 is raised to the position shown by the solid line in FIG. 7, and the mold base pressing body 75 is separated from the temporary holding unit 13. Then, as shown in FIG. 8, the temporary holding unit 13 can be carried out from the transfer device 7.

  The temporary holding unit 13 shown in FIG. 8 is provided with a mold M and a molded product W, the mold M is stuck to the molded product W, and the vacuum in the vacuum molding chamber 29 is maintained. Has been.

  Next, the release device 9 will be described in detail.

  The mold release device 9 includes a base body 87, a molded product base installation body (material base installation body) 89, and a mold base moving body (mold base installation body) 91 (see FIG. 9 and the like).

  The molded product base installation body 89 is provided integrally with the base body 87 below the base body 87. The mold base moving body 91 is provided on the base body 87 away from the molded product base installation body 89 above the base body 87 and above the molded product base installation body 89. The mold base moving body 91 is provided on the base body 87 via a linear guide bearing (not shown), and is movable in the vertical direction (Z-axis direction) with respect to the base body 87. Furthermore, the mold base moving body 91 is moved and positioned under the control of the control device 93 using an actuator such as a servo motor (not shown) and a ball screw.

  Instead of or in addition to moving the mold base moving body 91, the molded product base installation body 89 may be configured to be movable and positionable with respect to the base body 87 in the vertical direction. That is, it suffices that the molded product base installation body 89 and the mold base moving body 91 are relatively movable and positionable in the directions in which they approach and separate from each other.

  The lower surface of the mold base moving body 91 is formed in a planar shape orthogonal to the Z-axis direction. The upper surface of the molded product base installation body 89 is also formed in a planar shape orthogonal to the Z-axis direction. The lower surface of the mold base moving body 91 and the upper surface of the molded product base installation body 89 are opposed to each other with a predetermined distance therebetween in parallel.

  The mold base movable body 91 is provided with a mold base attaching / detaching device 95 similar to the case of the position adjusting device 5, and the molded product base installing body 89 is also similar to the case of the position adjusting device 5. An attachment / detachment device 97 is provided.

  Then, as shown in FIG. 9, with the mold base moving body 91 positioned at the rising end, for example, the temporary holding unit shown in FIG. 29 is formed, and the temporary holding unit 13) cooled to substantially room temperature is placed on the mold release device 9. Thereafter, the molded product base 23 of the temporary holding unit 13 is integrally held by the molded product base installation body 89 of the release device 9 using the molded product attachment / detachment device 97 under the control of the control device 93. It has become so. In a state where the temporary holding unit 13 is placed on the molded product base installation body 89, the lower surface of the molded product base 23 of the temporary holding unit 13 is in surface contact with the upper surface of the molded product base installation body 89.

  When the mold base moving body 91 is lowered from the state shown in FIG. 9 until the mold base moving body 91 contacts the mold base 21 of the temporary holding unit 13, as shown in FIG. 10, the mold base attaching / detaching device 95 is moved to the temporary holding unit. Thirteen mold bases 21 are held. Here, when compressed air is supplied to the pilot pressure supply passage 45, the pilot check valve 41 is opened, and the air enters the vacuum forming chamber 29 through the main passage 43 and the air passage 39. The pressure can be set to atmospheric pressure.

  When the mold base moving body 91 is raised after the inside of the vacuum forming chamber 29 is brought to atmospheric pressure, the O-ring 37 on the lower side of the bellows 27 is separated from the base 23 to be molded as shown in FIG. In addition, the mold M is separated from the workpiece W and released from the mold.

  When the temporary holding unit 13 or the like is removed from the mold release device 9 in the state shown in FIG. 11, the state shown in FIG. In the state shown in FIG. 12, the mold M is provided in the temporary holding unit 13, the bellows 27 of the temporary holding unit 13 is separated from the molded product base 23, the vacuum molding chamber 29 is opened, and the transfer is performed. The molded product W is removed from the molded product base 23.

  Thereafter, using a conveying device (not shown), the mold base 21 on which the bellows 27 and the mold M are installed and the molded product base 23 from which the molded product W is removed are indicated by an arrow A13 in FIG. As shown in FIG. 1, the molded product W, which has been transferred to the position adjusting device 5 and onto which the fine transfer pattern has been transferred, is transferred to the post-transfer molded product stocker 11 as indicated by an arrow A14 in FIG. .

  The transfer system 1 shown in FIG. 1 is provided with a control device (not shown). The control device controls each transport device, and each control device provided in each of the devices 5, 7, 9. It is assumed that 61, 77, and 93 are controlled.

  By the way, the release device 9 may be provided with a peeling device (release auxiliary device) 99. The peeling device 99 is for separating the mold M with a smaller force when separating the mold M from the workpiece W. For example, as shown in FIG. Has been. Then, under the control of the control device 93, the wedge-shaped instrument 101 is moved by a moving device (not shown), and the sharp tip of the wedge-shaped instrument 101 is placed around the boundary between the mold M to be molded and the article W to be molded. The mold is slightly peeled off from the workpiece W at the peripheral portion and the vicinity thereof. Thereby, even if the mold base moving body 91 is raised with a small force, the mold M can be separated from the product W.

  In the state where the vacuum molding chamber 29 is formed, the wedge-shaped instrument 101 cannot contact the mold M or the workpiece W. Accordingly, the temporary holding unit 13 shown in FIGS. 14 to 16 is provided with an actuator (for example, a single-acting pneumatic cylinder 103) for contracting the bellows 27.

  In a state where compressed air is not supplied to the pneumatic cylinder 103, the temporary holding unit 13 shown in FIGS. 14 to 16 operates in the same manner as the temporary holding unit 13 shown in FIGS. 9 to 12 (the mold release device 9 and the temporary holding unit 13). The holding unit 13 and the like operate in the same manner. However, when compressed air is supplied to the pneumatic cylinder 103, the bellows 27 of the temporary holding unit 13 is contracted.

  That is, in the state shown in FIG. 15, when the inside of the vacuum forming chamber 29 is brought to atmospheric pressure and compressed air is supplied to the pneumatic cylinder 103, the bellows 27 can be moved without raising the mold base moving body 91 as shown in FIG. Shrinking, the vacuum molding chamber 29 is released (lost), and the wedge-shaped tool 101 can come into contact with the mold M and the molded product W even when the mold M is attached to the molded product W. Yes.

  The temporary holding unit 13 shown in FIGS. 14 to 16 has a configuration in which the molded product base 23 holds the molded product W, but the molded product base 23 holds the molded product W. Instead, the molded product W may only be placed on the molded product base 23. Then, after the bellows 27 is lifted (compressed) by the pneumatic cylinder 103 and before the mold base moving body 91 is lifted to separate the mold M from the molded product W, a holding device (not shown) (for example, a mold release device). 9), the molded product W may be integrally held on the molded product base 23.

  Here, the number of the position adjusting device 5, the transfer device 7, and the release device 9 constituting the transfer system 1 shown in FIG. 1 will be described. Note that the mold M and the molded product W are transferred by, for example, a single sheet in one apparatus, and one temporary holding unit 13 includes one mold M and one sheet. It is assumed that the product to be molded W is installed.

  The ratio of the number of the position adjusting device 5, the transfer device 7, and the release device 9 is determined when the transfer system 1 transfers the fine transfer pattern formed on the mold M to the molding product W. , 9 has a minimum waiting time, or a value that is less than the conventional waiting time.

  For example, in the position adjusting device 5, one mold M, one molded product W, and one temporary holding unit 13 are installed, the mold M and the molded product W are positioned, and the vacuum molding chamber 29 is formed. It takes about 1 minute to do this (see FIGS. 2 to 5).

  Further, in the transfer device 7, one mold M and one molded product W are heated, the molded product W is pressed by the mold M, and the mold M and the molded product W are cooled (FIG. 6). (See FIG. 8) It takes about 10 minutes.

  Further, in the mold release device 9, it takes about 1 minute to separate one mold M attached to one molded article W from the molded article W (see FIGS. 9 to 12). Is required.

  In this case, the transfer system 1 includes one position adjusting device 5, ten transfer devices 7, and one release device 9. Note that the number of transfer devices 7 may be a plurality of nine or less or one.

  In addition, one of the plurality of transfer devices 7 has a pressing function (a function of pressing the molded product W with the mold M for transfer) and a heating function (the mold M or the molded product for transfer). (A function of heating W), and some of the plurality of transfer devices 7 (one or more) may have only a heating function. Still another part of the transfer devices 7 (one or a plurality of transfer devices) may have only a cooling function (a function of cooling a mold or a molded product for transfer). It may be a configuration.

  In this case, the mold M, the workpiece W, and the temporary holding unit 13 supplied from the position adjusting device 5 are first supplied to the transfer device 7 having only the heating function and heated, and then the pressing function and heating. It is assumed that it is supplied to a transfer device 7 having a function and pressed while being heated, and subsequently cooled by a transfer device 7 having only a cooling function.

  Furthermore, the transfer device 7 having only a cooling function is not provided with a cooling function, and is configured by a simple mounting table for the temporary holding unit 13, and the temporary holding unit 13 and the mold M are formed by natural cooling that is not forced cooling. Alternatively, the molded product W may be cooled.

  Here, the operation of the transfer system 1 will be described.

  When the molded product W is supplied from the pre-transfer molded product stocker 3 to the position adjusting device 5 (temporary holding unit 13), the position adjusting device 5 forms the mold M at an accurate position of the molded product W. In order to transfer a fine transfer pattern, the relative positions of the mold M and the workpiece W are adjusted using the temporary holding unit 13.

  Subsequently, the transfer device 7 provided at a location different from the position adjustment device 5 is used, and the position adjustment device 5 adjusts the relative position with the mold M whose relative position has been adjusted. The molded product W is pressed to transfer a fine transfer pattern formed on the mold M onto the molded product W.

  Subsequently, a mold release device 9 provided at a location different from the position adjustment device 5 and the transfer device 7 is used to separate the mold M and the molding product W that are adhered to each other after being transferred (the coated product). Separate the mold M from the molded product W).

  Subsequently, the transferred molded product W is transferred to the molded product stocker 11 after transfer, and the temporary holding unit 13 is transferred (returned) to the position adjusting device 5.

  According to the transfer system 1, the transfer system 1 is configured by being divided into the position adjusting device 5, the transfer device 7, and the mold release device 9. For example, the transfer device 7 cools the mold M and the product W to be molded. Even during the operation, the position adjusting device 5, the positioning unit 55, and the release device 9 can be operated, and transfer can be performed more efficiently than in the past.

  This will be described in detail with specific examples. When a fine transfer pattern formed on the mold M is transferred to a single workpiece W using the conventional transfer apparatus 300, one transfer target 300 is placed on the transfer apparatus 300 on which the single mold M is installed. For example, it is assumed that it takes about one minute to install the molded product W and position the installed molding target W and the mold M.

  After this positioning, the mold M and the molded product W are heated, the mold base pressing body 308 is lowered, the molded product W is pressed with the mold M for a predetermined time, and then the mold M and the molded product W are moved. For example, it takes about 10 minutes to transfer the fine transfer pattern onto the workpiece W after cooling.

  After this transfer, it takes, for example, about 1 minute to raise the mold base pressing body 308 to separate the mold M from the molded product W and to remove the transferred molded product W from the transfer device 300. Shall.

  That is, it takes about 12 minutes to form a fine transfer pattern on one molded product W. In order to form a fine transfer pattern on a single workpiece W in a time of about 1 minute, a transfer system using 12 conventional transfer apparatuses 300 is required.

  In each of the 12 transfer devices 300, for example, the camera 314, the positioning unit 302, and the like are on standby for 10 minutes for the transfer, and the transfer configured by the 12 transfer devices 300 is performed. In the system, it cannot be said that the transfer to the molded product W is efficiently performed.

  On the other hand, it takes a time of 1 minute for positioning the mold M and the workpiece W, a time of about 10 minutes for the transfer, and a time of about 1 minute for the mold release. In the system 1, in order to form a fine transfer pattern on one molded product W in about 1 minute, one position adjusting device 5, ten transfer devices 7, and one release device 9 are provided. In addition, the waiting time of the camera 67, the positioning unit 55, and the mold release device 9 of the position adjusting device 5 is reduced, and more efficient transfer than before can be performed.

  In the transfer system 1, the position adjusting device 5 has only a position adjusting function, the transfer device 7 has only a transfer function including a heating function, and the release device 9 has only a release function. In other words, since each function is provided in a distributed manner, the overall system configuration is simplified, and a transfer system that is less expensive than the conventional one can be obtained.

  Moreover, in the mold release apparatus 9, the peeling apparatus 99 (refer FIG. 16) for peeling the type | mold M from the to-be-molded product W easily may be provided. As described above, when the peeling device 99 is provided, the conventional transfer device 300 must be provided with a peeling device in addition to the camera 314 and the like, and the peeling device can be provided without interfering with the camera 314 and the like. Have difficulty. Furthermore, it is more difficult to provide a peeling device having a complicated configuration for separating the firmly attached die M from the workpiece W.

  On the other hand, in the transfer system 1, it is only necessary to provide the peeling device 99 in the release device 9 that is configured separately from the position adjusting device 5, so that the peeling device 99 can be easily installed. Even if the configuration of the peeling device 99 is complicated, the peeling device 99 can be easily installed.

  Further, as described above, the temporary holding unit 13 including the bellows 27 and the like is used, so that the transfer by the transfer device 7 is performed in the vacuum forming chamber 29, and the position adjusting device. The mold M positioned at 5 and the molding target W positioned by the position adjusting device 5 are configured such that their relative positions are held in the vacuum molding chamber 29 and supplied to the transfer device 7. Has been.

  Thereby, it is possible to prevent generation of fine bubbles in the molded product W during the transfer, and the positional relationship between the positioned mold M and the positioned molded product W is separately It can maintain without providing the apparatus, mechanism, and instrument.

  Incidentally, instead of or in addition to the bellows 27 (vacuum molding chamber 29), a maintenance device 105 may be provided for maintaining the positional relationship between the positioned mold M and the positioned molding target W.

  Here, the maintenance device 105 will be described in detail with reference to FIG.

  FIG. 26 is a diagram showing the configuration of the temporary holding unit 13a that maintains the positional relationship between the mold M and the product W by using the maintenance device 105 instead of the bellows 27 (vacuum molding chamber 29). FIG. 26A is a diagram showing a state in which the maintenance device 105 is separated from the mold base 21 and the like, and FIG. 26B is a diagram showing the mold M ( FIG. 26C is a diagram showing a state in which the positional relationship between the mold base 21) and the molded product W (molded product base 23) is maintained (maintained), and FIG. 26C is a view of XXVI in FIG. It is a partial arrow view.

  In the temporary holding unit 13 a, an engaged portion 107 configured by a notch provided with a step 113 is provided in the mold base 21 and the molded product base 23. The temporary holding unit 13a includes, for example, a single-acting pneumatic cylinder 111, a hook-like engagement portion 109A provided on a head (cylinder tip) of the pneumatic cylinder 111 via an elongated rod-like member, a pneumatic cylinder 111 and a rod-shaped engagement portion 109B provided at the tip of a rod (piston rod).

  In a state where compressed air is supplied to the pneumatic cylinder 111, the distance L2 between the engaging portions 109A and 109B is larger than the distance L1 between the steps 113A and 113B in the engaged portions 107. On the other hand, in a state in which compressed air is not supplied to the pneumatic cylinder 111 and the cylinder chamber of the pneumatic cylinder 111 is at atmospheric pressure, the distance L2 between the engaging portions 109A and 109B is The distance between the steps 113A and 113B is smaller than the distance L1.

  Therefore, when the maintenance device 105 is appropriately installed on the mold base 21 or the molded product base 23 in the state shown in FIG. 26A and the supply of compressed air to the pneumatic cylinder 111 is stopped, the spring of the single acting pneumatic cylinder 111 As shown in FIG. 26 (b), the engaging portions 109A and 109B come into contact with the respective steps 113A and 113B, and the die base 21 and the base 23 to be molded receive a force in a direction approaching each other. 21 (type M) and the molded product base 23 (molded product W) are integrated.

  The engaged portions 107 are provided at a plurality of locations around the mold base 21 and the molded product base 23, and the maintenance device 105 is installed in each of the engaged portions 107. Yes.

  Here, transfer and the like by the UV imprint method will be described.

  17-20 is a figure which shows the case where the temporary holding unit 13 grade | etc., Used with UV imprint method is used with the position adjustment apparatus 5, and is a figure corresponding to FIGS. 21 to 23 are diagrams showing a case where the temporary holding unit 13 or the like used in the UV imprint method is used in the transfer device 7a, and corresponds to FIGS. FIGS. 24 and 25 are diagrams showing a case where the temporary holding unit 13 or the like used in the UV imprint method is used in the mold release device 9 and corresponds to FIGS. 9 and 12.

  The molded product W of the UV imprint method is provided with a thin film of an ultraviolet curable resin W2 on one surface (upper surface) in the thickness direction of a flat substrate W1 made of a material such as glass or silicon. Configured. Then, the uncured ultraviolet curable resin W2 is pressed with a mold (mold composed of quartz or the like that transmits ultraviolet rays) as shown in FIG. 22, irradiated with ultraviolet rays, and the ultraviolet curable resin W2 is cured to mold the mold. The fine transfer pattern formed on M is transferred to the product W.

  The position adjustment device 5 used in the UV imprint method is provided with an ultraviolet curable resin installation device (not shown) for providing the ultraviolet curable resin W2 before curing on the upper surface of the substrate W1. Unlike the position adjusting device used in the imprint method, the other points are substantially the same as the position adjusting device used in the thermal imprint method. Note that the ultraviolet curable resin installation device may be omitted and the ultraviolet curable resin W2 may be manually provided.

  The temporary holding unit 13 used in the UV imprinting method is, for example, that at least a part of the mold base 21 is composed of a member (for example, quartz glass) 115 that transmits ultraviolet rays. This is different from the temporary holding unit used in

  Further, the transfer device 7a used in the UV imprint method is provided with a through hole 75b that transmits ultraviolet rays and an ultraviolet ray generator 117 in the mold base pressing body 75a, and furthermore, heating means 79, 83 and cooling means 81. , 85 is different from the transfer device 7 used in the thermal imprint method, and the other points are configured in substantially the same manner as the transfer device 7 used in the thermal imprint method.

  In addition, since the molded article W may be heated or cooled after being irradiated with ultraviolet rays, the transfer device 7a used in the UV imprint method includes heating means 79 and 83 and cooling means 81 and 85. It may be provided.

  The mold release device 9 used in the UV imprint method is configured in substantially the same manner as the mold release device used in the thermal imprint method.

  In the UV imprint method, generally, the mold M and the molded product W are more firmly attached after transfer, and therefore the operation of separating the mold M from the molded product W after transfer is the case of the thermal imprint method. Although it is more difficult, since even the release device 9 used in the UV imprint method is not provided with a camera or the like, it is easy to install a peeling device having a complicated configuration.

[Second Embodiment]
FIG. 13 is a plan view showing a schematic configuration of a transfer system 1a according to the second embodiment of the present invention.

  The transfer system 1a is configured in substantially the same manner as the first transfer system 1 except that the position adjusting device 5 and the release device 9 used in the first transfer system 1 are shared. Yes.

  That is, the configuration of the position adjusting device 5 used in the transfer system 1 according to the first embodiment and the release device 9 used in the transfer system 1 according to the first embodiment are similar to each other. is doing. Focusing on this, the transfer system 1a according to the second embodiment has functions of the position adjusting device 5 and the release device 9 instead of the position adjusting device 5 and the release device 9 (position). A position adjusting / releasing device 119 (in which the adjusting device 5 and the releasing device 9 are combined) is arranged.

  In the transfer system 1a, since the position adjusting device and the release device are shared, either the position adjusting device or the release device is almost unnecessary compared to the mode shown in FIG. 1, and the system configuration is simplified. In addition, the number of transfer devices 7 can be reduced as compared with the embodiment shown in FIG. 1, and the scale of the entire system can be reduced.

[Third Embodiment]
FIG. 27 is a plan view showing a schematic configuration of a transfer system 1b according to the third embodiment of the present invention.

  The transfer system 1b is configured in substantially the same manner as the first transfer system 1 except that the position adjusting device 5 and the transfer device 7 used in the first transfer system 1 are shared. .

  That is, in the transfer system 1b according to the third embodiment, instead of the position adjustment device 5 and the transfer device 7, functions of the position adjustment 5 and the transfer device 7 are provided (the position adjustment device 5 and the transfer device 7). The position adjustment / transfer device 121 is arranged.

  Further, depending on the transfer mode (type), a position adjusting device (precise position adjustment between the mold M and the workpiece W) may be unnecessary. In this case, the position adjusting device may be deleted.

DESCRIPTION OF SYMBOLS 1, 1a, 1b Transfer system 5 Position adjusting device 7, 7a Transfer device 9 Mold release device 29 Vacuum molding chamber M type W Molded product

Claims (6)

A position adjusting device for adjusting a relative position between the mold and the molding product in order to transfer a fine transfer pattern formed on the mold to an accurate position of the molding product;
A fine transfer that is provided separately from the position adjusting device, and is formed on the mold by pressing the molded article whose relative position is adjusted with the mold whose relative position is adjusted. A transfer device for transferring a pattern to the molded product;
A mold release device that is provided separately from the transfer device and separates the mold and the molded product that are attached to each other after being transferred using the transfer device;
A transfer system comprising: The transfer system according to claim 1.
The transfer system, wherein the position adjusting device and the release device are shared. The transfer system according to claim 1 or 2,
Transfer by the transfer device is configured to be performed in a vacuum molding chamber,
The mold positioned by the position adjusting device and the molding object positioned by the position adjusting device are held in the vacuum forming chamber and supplied to the transfer device. A transfer system characterized by being configured. A transfer device for transferring a fine transfer pattern formed on the mold to the molded article by pressing the molded article with the mold;
A mold release device that is provided separately from the transfer device, and that separates the mold and the molded product that are attached to each other after transfer using the transfer device;
A transfer system comprising:   A transfer method comprising the transfer system according to any one of claims 1 to 4. A position adjusting step for adjusting a relative position between the mold and the molded product in order to transfer a fine transfer pattern formed on the mold to an accurate position of the molded product;
At a place different from the position adjusting step, the mold whose relative position has been adjusted by the position adjusting step is pressed on the molded product whose relative position has been adjusted by the position adjusting step. A transfer step of transferring a fine transfer pattern formed on the mold to the molded product;
A mold release step for separating the mold and the article to be molded, which are attached to each other after being transferred by the transfer step at a place different from the transfer step,
A transfer method characterized by comprising:

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