JP2011145455A - Image heating device - Google Patents

Image heating device Download PDF

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JP2011145455A
JP2011145455A JP2010005702A JP2010005702A JP2011145455A JP 2011145455 A JP2011145455 A JP 2011145455A JP 2010005702 A JP2010005702 A JP 2010005702A JP 2010005702 A JP2010005702 A JP 2010005702A JP 2011145455 A JP2011145455 A JP 2011145455A
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substrate
insulating layer
film
heater
fixing
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Tetsuya Sano
哲也 佐野
Takaaki Tsuruya
鶴谷  貴明
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Canon Inc
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To secure insulation between each of the side surfaces or edge portions in a short-length direction of a conductive substrate of a heating member and a conductive base layer of a flexible member, even when an insulating layer is provided only at the longitudinal center part of the conductive substrate of the heating member which comes in contact with the conductive base layer of the flexible member. <P>SOLUTION: The image heating device includes: the heating member including a long narrow substrate having properties to generate heat when energized, and reduce its resistance value in accordance with a temperature rise, an electrode part provided inside each longitudinal end portion of the substrate, for supplying power to the substrate, and the insulating layer provided at the longitudinal center part of the substrate; a supporting member configured to support the heating member; and the flexible member which moves while being in contact with the insulating layer and includes the conductive base layer which comes in contact with the insulating layer, wherein an image carried on a recording material is heated by heat of the heating member through the flexible member. Both end surfaces in the short-length direction perpendicular to the longitudinal direction of the substrate, on the surface, coming in contact with the flexible member, of the insulating layer are covered with the supporting member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、電子写真複写機、電子写真プリンタなどの画像形成装置に搭載する定着装置(定着器)として用いれば好適な像加熱装置に関する。   The present invention relates to an image heating apparatus suitable for use as a fixing device (fixing device) mounted on an image forming apparatus such as an electrophotographic copying machine or an electrophotographic printer.

電子写真式のプリンタや複写機に搭載する定着装置(定着器)として、セラミックス製の基板上に発熱抵抗体を有するヒータ、このヒータに接触しつつ移動する耐熱性フィルム、耐熱性フィルムを介してヒータとニップ部を形成する加圧ローラを有するものがある。特許文献1にはこのタイプの定着装置が記載されている。未定着トナー画像を担持する記録材は定着器のニップ部で挟持搬送されつつ加熱され、これにより記録材上のトナー画像は記録材に加熱定着される。この定着器は、ヒータへの通電を開始し定着可能温度まで昇温するのに要する時間が短いというメリットを有する。従って、この定着器を搭載するプリンタは、プリント指令の入力後、1枚目の画像を出力するまでの時間(FPOT:First Print Out Time)を短くできる。またこのタイプの定着器は、プリント指令を待つ待機中の消費電力が少ないというメリットもある。   As a fixing device (fixing device) mounted on an electrophotographic printer or copying machine, a heater having a heating resistor on a ceramic substrate, a heat-resistant film that moves while contacting the heater, and a heat-resistant film Some have a pressure roller that forms a nip with a heater. Patent Document 1 describes this type of fixing device. The recording material carrying the unfixed toner image is heated while being nipped and conveyed by the nip portion of the fixing device, whereby the toner image on the recording material is heated and fixed to the recording material. This fixing device has an advantage that it takes a short time to start energizing the heater and raise the temperature to a fixable temperature. Therefore, a printer equipped with this fixing device can shorten the time (FPOT: First Print Out Time) from when a print command is input until the first image is output. This type of fixing device also has an advantage that power consumption during standby waiting for a print command is small.

一方、画像形成装置の高速化に伴い、耐熱性フィルムなどのフィルム部材の基層にステンレスやニッケル等の金属を用いた定着装置が提案されている(特許文献2、特許文献3)。これは、画像形成装置の高速化に適応させるため、フィルム部材の基層として、従来の耐熱性樹脂の代わりにより熱伝導率の高い金属を用い、フィルム部材の熱伝導率を高くすることで、ヒータの熱をより効率的に記録材に伝えるようにしたものである。   On the other hand, with the increase in the speed of image forming apparatuses, fixing apparatuses using metals such as stainless steel and nickel as a base layer of a film member such as a heat resistant film have been proposed (Patent Documents 2 and 3). In order to adapt to the speeding up of the image forming apparatus, a metal having a higher thermal conductivity is used as the base layer of the film member in place of the conventional heat-resistant resin, and the heat conductivity of the film member is increased to increase the heater. The heat is transferred to the recording material more efficiently.

ところで、フィルム部材を用いた定着器を搭載するプリンタで小サイズの記録材を大サイズの記録材と同じプリント間隔で連続プリントすると、ヒータの記録材が通過しない領域(非通紙部)が過度に昇温することが知られている。ヒータの非通紙領域が過昇温すると、ヒータを保持するホルダや加圧ローラが熱により損傷する場合がある。そこで、可撓性部材を用いた定着器を搭載するプリンタは、小サイズの記録材に連続プリントする場合、大サイズの記録材に連続プリントする場合よりもプリント間隔を広げる制御を行いヒータの非通紙部の過昇温を抑えている。しかしながら、プリント間隔を広げる制御は単位時間当りの出力枚数を減らすものであり、小サイズの記録材の単位時間当りの出力枚数を大サイズの記録材の場合と同等以上に抑えることが望まれる。   By the way, when a small-size recording material is continuously printed at the same print interval as a large-size recording material in a printer equipped with a fixing device using a film member, an area where the recording material of the heater does not pass (non-sheet passing portion) is excessive. It is known that the temperature rises. If the non-sheet passing area of the heater is excessively heated, the holder and the pressure roller that hold the heater may be damaged by heat. Therefore, a printer equipped with a fixing device using a flexible member has a control for widening the print interval when continuously printing on a small size recording material, compared with the case of continuously printing on a large size recording material. The excessive temperature rise in the paper passing section is suppressed. However, the control to increase the print interval is to reduce the number of output sheets per unit time, and it is desired to suppress the number of output sheets per unit time of a small size recording material to be equal to or greater than that in the case of a large size recording material.

そこで、上述した定着装置に用いるヒータとして、温度の上昇によって抵抗値の下がる特性(NTC=Negative Temperature Coefficient)を利用した構成のものが提案されている。特許文献4は、通電発熱体として炭化ケイ素(SiC)を主成分とする半円状のロッド部材を用い、炭化ケイ素の負の抵抗温度特性(NTC特性)を利用し、非通紙部昇温を抑制するというものである。特許文献5には、炭化ケイ素(SiC)を主成分とする通電発熱体を用い、この部材の長手方向両端部に金属成形体の給電電極を取り付けるという方法が開示されている。これは、常温から約800℃の温度領域では炭化ケイ素の負の抵抗温度特性(NTC特性)を利用し、非通紙部昇温を抑制するというものである。   In view of this, as a heater used in the above-described fixing device, a heater that uses a characteristic (NTC = Negative Temperature Coefficient) that decreases in resistance value due to an increase in temperature has been proposed. Patent Document 4 uses a semicircular rod member mainly composed of silicon carbide (SiC) as an energization heating element, and utilizes the negative resistance temperature characteristic (NTC characteristic) of silicon carbide to increase the temperature of the non-sheet passing portion. It is to suppress. Patent Document 5 discloses a method in which an energization heating element mainly composed of silicon carbide (SiC) is used, and power supply electrodes of a metal molded body are attached to both ends in the longitudinal direction of this member. This is to use the negative resistance temperature characteristic (NTC characteristic) of silicon carbide in the temperature range from room temperature to about 800 ° C. to suppress the temperature rise of the non-sheet passing portion.

特開昭63−313182号公報JP-A-63-313182 特開2003−045615号公報JP 2003-045615 A 特開2003−156954号公報JP 2003-156554 A 特開平06−019347号公報JP 06-019347 A 特開2006−134746号公報JP 2006-134746 A

上記のフィルム加熱方式の定着装置においては、ヒータの絶縁性の基板上に設けられる発熱抵抗体の材料として導電性の材料を用いている。このため、一般的には、導電性を有するフィルム部材と接触するヒータの表面に樹脂やガラスなどの保護層を設け、フィルム部材との絶縁性(ヒータ表面のフィルム部材が接触しつつ移動する摺動面は絶縁性と摺動性)を確保する構成としている。一方、ヒータの材料としてNTC特性を有する炭化ケイ素などを用いる場合は、ニップ幅及び所望の抵抗値を得やすくするために、絶縁性の基板上に導電性の薄膜発熱抵抗体を設ける代わりに、炭化ケイ素自体を細長い基板として用いる方が形態として好ましい。ただしこの場合、基板(SiC)自体が導電性を有するものとなるため、絶縁性の確保に注意が必要となる。特に、フィルム部材として導電性を有する金属製のフィルムなどを用いる場合は、基板のフィルムとの摺動面だけでなく、基板の長手方向と直交する短手方向の側面や、基板の側面と摺動面とが交差するエッジ部との絶縁性の確保も考慮した構成が必要となる。フィルムとの絶縁性を確保する構成としては、コーティングなどによって基板の側面やエッジ部を含む基板全体を覆うように保護層を設ける構成が考えられるものの、製造上、エッジ部に十分な強度の保護層を得るのは困難である。またコストの観点からも、基板の側面やエッジ部へのコーティングは好ましくない。   In the above-described film heating type fixing device, a conductive material is used as a material for the heating resistor provided on the insulating substrate of the heater. For this reason, in general, a protective layer such as resin or glass is provided on the surface of the heater that comes into contact with the conductive film member, and is insulated from the film member (slider that moves while the film member on the heater surface is in contact). The moving surface is configured to ensure insulation and slidability. On the other hand, when using silicon carbide having NTC characteristics as a heater material, in order to easily obtain a nip width and a desired resistance value, instead of providing a conductive thin film heating resistor on an insulating substrate, It is preferable to use silicon carbide itself as an elongated substrate. However, in this case, since the substrate (SiC) itself has conductivity, care must be taken to ensure insulation. In particular, when a conductive metal film or the like is used as the film member, not only the sliding surface with the substrate film but also the side surface in the short direction perpendicular to the longitudinal direction of the substrate or the side surface of the substrate is slid. A configuration is also required in consideration of ensuring insulation with the edge portion where the moving surface intersects. As a configuration for ensuring insulation from the film, a configuration in which a protective layer is provided so as to cover the entire side of the substrate including the side surface and edge portion of the substrate by coating or the like is considered. It is difficult to obtain a layer. Also, from the viewpoint of cost, coating on the side surface or edge portion of the substrate is not preferable.

本発明の目的は、可撓性部材の導電性の基層と接触する加熱部材の導電性の基板の長手方向中央部のみに絶縁層を設けた場合でも基板の短手方向の側面やエッジ部と可撓性部材の基層との絶縁性を確保できるようにした像加熱装置を提供することにある。   The object of the present invention is to provide a lateral side or edge portion in the short direction of the substrate even when an insulating layer is provided only in the longitudinal central portion of the conductive substrate of the heating member that contacts the conductive base layer of the flexible member. An object of the present invention is to provide an image heating apparatus capable of ensuring insulation from a base layer of a flexible member.

上記目的を達成するための本発明に係る像加熱装置の代表的な構成は、通電により発熱し温度の上昇に伴い抵抗値が下がる特性を有する細長い基板と前記基板の長手方向両端部の内側に設けられた電極部であり前記基板に給電するための電極部と前記基板の長手方向中央部に設けられた絶縁層とを有する加熱部材と、前記加熱部材を支持する支持部材と、前記絶縁層と接触しつつ移動する可撓性部材であり前記絶縁層と接触する導電性の基層を有する可撓性部材と、を有し、記録材が担持する画像を前記可撓性部材を介して前記基板の熱で加熱する像加熱装置において、前記絶縁層の前記可撓性部材と接触する表面における前記基板の長手方向と直交する短手方向の両端面を前記支持部材で覆うことを特徴とする。   In order to achieve the above object, a typical configuration of the image heating apparatus according to the present invention includes an elongated substrate having a characteristic that heat is generated by energization and a resistance value decreases as the temperature rises, and inside the longitudinal ends of the substrate. A heating member having an electrode portion for supplying power to the substrate and an insulating layer provided at a central portion in a longitudinal direction of the substrate; a support member for supporting the heating member; and the insulating layer A flexible member that moves in contact with the insulating layer and has a conductive base layer in contact with the insulating layer, and an image carried by a recording material is transmitted through the flexible member through the flexible member. In the image heating apparatus for heating with the heat of the substrate, both end surfaces in the short direction perpendicular to the longitudinal direction of the substrate on the surface of the insulating layer in contact with the flexible member are covered with the support member. .

本発明によれば、可撓性部材の導電性の基層と接触する加熱部材の導電性の基板の長手方向中央部のみに絶縁層を設けた場合でも基板の短手方向の側面やエッジ部と可撓性部材の基層との絶縁性を確保できるようにした像加熱装置を提供することができる。   According to the present invention, even when an insulating layer is provided only in the longitudinal center of the conductive substrate of the heating member that contacts the conductive base layer of the flexible member, It is possible to provide an image heating apparatus that can ensure insulation from the base layer of the flexible member.

画像形成装置の構成を表わす横断面模式図である。1 is a schematic cross-sectional view illustrating a configuration of an image forming apparatus. 定着装置の横断面模式図、(b)は定着装置の縦断面模式図である。FIG. 2B is a schematic cross-sectional view of the fixing device, and FIG. (a)はヒータの裏面を表した図、(b)はヒータの表面を表した図である。(c)は(a)に示す矢印C−C線矢視拡大断面図である。(A) is the figure showing the back surface of a heater, (b) is the figure showing the surface of the heater. (C) is an enlarged sectional view taken along arrow CC in FIG. (a)はヒータの発熱領域を表す説明図、(b)はヒータの発熱領域における通紙部と非通紙部の発熱量を説明するためのモデル図である。(A) is explanatory drawing showing the heat_generation | fever area | region of a heater, (b) is a model figure for demonstrating the emitted-heat amount of the paper passing part and non-sheet passing part in the heat_generation | fever area | region of a heater. (a)はフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図、(b)はフィルムガイドの他の例とこのフィルムガイドに支持されているヒータの横断面模式図である。(A) is a cross-sectional schematic diagram of the film guide and the heater supported by this film guide, (b) is another example of the film guide and a schematic cross-sectional view of the heater supported by this film guide. (a)はフィルムガイドにオーバーラップ部が形成されている場合の定着フィルムの定着ニップ部における変形形状の説明図である。(b)はフィルムガイドにオーバーラップ部が形成されていない場合の定着フィルムの定着ニップ部における変形形状の説明図である。(A) is explanatory drawing of the deformation | transformation shape in the fixing nip part of a fixing film in case the overlap part is formed in the film guide. (B) is an explanatory view of a deformed shape in the fixing nip portion of the fixing film when the overlap portion is not formed on the film guide. (a)は比較例定着装置(1)のフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図、(b)は比較例定着装置(2)のフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図である。(A) is a schematic cross-sectional view of the film guide of the comparative fixing device (1) and the heater supported by this film guide, and (b) is the film guide of the comparative fixing device (2) and supported by this film guide. It is a cross-sectional schematic diagram of the heater made. (a)はフィルムガイドとこのフィルムガイドにヒータを支持させるためにフィルムガイドに取り付けられた部材とこの部材によりフィルムガイドに支持させたヒータの横断面模式図、(b)は部材の長手方向中央部を省略した外観斜視図である。(A) is a cross-sectional schematic diagram of a film guide, a member attached to the film guide for supporting the heater on the film guide, and a heater supported on the film guide by this member, and (b) is a longitudinal center of the member. It is the external appearance perspective view which abbreviate | omitted the part.

[実施例1]
(1)画像形成装置例
図1は本発明に係る像加熱装置を定着装置として搭載する画像形成装置の構成を表わす横断面模式図である。この画像形成装置は電子写真式のレーザービームプリンタである。このプリンタはA4縦及びLTR縦サイズ紙対応のプリンタであり、プリントスピードは50枚/分である。このプリンタの記録材の搬送基準は、記録材の搬送方向と直交する方向(長手方向)における記録材搬送路(シートパス)の略中央とこの方向における記録材の端部間の略中央とを一致させて搬送する中央搬送基準である。
[Example 1]
(1) Example of Image Forming Apparatus FIG. 1 is a schematic cross-sectional view showing the configuration of an image forming apparatus in which the image heating apparatus according to the present invention is mounted as a fixing device. This image forming apparatus is an electrophotographic laser beam printer. This printer is a printer compatible with A4 portrait and LTR portrait paper, and the print speed is 50 sheets / minute. The recording material conveyance reference of this printer is defined as the approximate center of the recording material conveyance path (sheet path) in the direction (longitudinal direction) orthogonal to the recording material conveyance direction and the approximate center between the ends of the recording material in this direction. This is the central transport standard for transporting in a consistent manner.

本実施例1に示すプリンタは、ホストコンピュータなどの外部装置(不図示)から出力されるプリント指令に応じて制御部(制御手段)50が所定の画像形成制御シーケンスを実行し、この画像形成制御シーケンスに従って所定の画像形成動作を行う。制御部50はCPUとROMやRAMなどのメモリとからなり、メモリには画像形成制御シーケンスや画像形成に必要な各種プログラムが記憶されている。   In the printer shown in the first embodiment, the control unit (control unit) 50 executes a predetermined image formation control sequence in accordance with a print command output from an external device (not shown) such as a host computer, and this image formation control. A predetermined image forming operation is performed according to the sequence. The control unit 50 includes a CPU and a memory such as a ROM and a RAM, and stores an image formation control sequence and various programs necessary for image formation.

本実施例1のプリンタは、記録材上に画像を形成する画像形成部と、記録材が担持する画像を記録材上に加熱定着する定着部(以下、定着装置)と、を有している。画像形成シーケンスが実行されると、画像形成部において、先ず像担持体としての回転ドラム型の電子写真感光体(以下、感光ドラムと記す)1が矢印方向に所定の周速度(プロセススピード)にて回転される。感光ドラム1は、アルミニウムやニッケルなどにより形成されたシリンダ(ドラム)状のドラム基体を有し、このドラム基体の外周面にOPC・アモルファスSe・アモルファスSi等の感光材料層を形成したものである。感光材料層が形成されている感光ドラム1の外周面(表面)は、帯電手段としての帯電ローラ2により所定の極性・電位に一様に帯電処理される。この感光ドラム1表面の帯電面に対して露光手段としてのレーザービームスキャナ3が画像情報に応じて変調制御(ON/OFF制御)されたレーザービームLを走査露光する。これによって感光ドラム1表面に目的の画像情報に応じた静電潜像が形成される。この潜像は現像手段としての現像装置4によりトナーtを用いて現像され可視化される。   The printer according to the first exemplary embodiment includes an image forming unit that forms an image on a recording material, and a fixing unit (hereinafter, a fixing device) that heat-fixes an image carried by the recording material on the recording material. . When the image forming sequence is executed, in the image forming unit, first, a rotating drum type electrophotographic photosensitive member (hereinafter referred to as a photosensitive drum) 1 as an image carrier is set to a predetermined peripheral speed (process speed) in the direction of the arrow. Is rotated. The photosensitive drum 1 has a cylindrical drum base formed of aluminum, nickel, or the like, and a photosensitive material layer such as OPC, amorphous Se, or amorphous Si is formed on the outer peripheral surface of the drum base. . The outer peripheral surface (surface) of the photosensitive drum 1 on which the photosensitive material layer is formed is uniformly charged to a predetermined polarity and potential by a charging roller 2 as a charging unit. A laser beam scanner 3 as an exposure unit scans and exposes a charged surface on the surface of the photosensitive drum 1 with a laser beam L that is modulated (ON / OFF controlled) in accordance with image information. As a result, an electrostatic latent image corresponding to the target image information is formed on the surface of the photosensitive drum 1. This latent image is developed and visualized using the toner t by the developing device 4 as a developing means.

一方、給送カセット9内に積載収納されている記録材Pが給送ローラ8の回転により一枚ずつ繰り出される。この記録材Pはガイド10を有するシートパスを通ってレジストローラ11に搬送される。レジストローラ11は記録材Pを所定のタイミングで感光ドラム1表面と転写ローラ5の外周面(表面)との間の転写ニップ部TNに送り出す。記録材Pは転写ニップ部TNで感光ドラム1表面と転写ローラ5表面により挟持搬送される。そしてこの搬送過程で転写ローラ5に印加される転写バイアスにより感光ドラム1表面のトナー画像が記録材Pの面上に転写されていく。これによって記録材Pは未定着のトナー画像を担持する。トナー画像を担持した記録材Pは感光ドラム1表面から順次に分離して転写ニップ部TNから排出され、搬送ガイド12を通じて定着装置(定着器)6の後述する可撓性フィルム23と加圧ローラ24との間の定着ニップ部(ニップ部)Nに導入される。この記録材Pは定着ニップ部Nで可撓性フィルム23と加圧ローラ24とにより挟持搬送されながら熱と圧力を受けることによってトナー画像が記録材P上に加熱定着される。定着装置6を出た記録材Pは、搬送ローラ13によりガイド14を有するシートパスを通って排出ローラ15に搬送される。そしてこの排出ローラ15によって排出トレイ16に排出される。トナー画像転写後の感光ドラム1表面は、感光ドラム1表面に残留している転写残トナーがクリーニング手段としてのクリーニング装置7により除去され、次の画像形成に供される。   On the other hand, the recording materials P stacked and stored in the feeding cassette 9 are fed out one by one by the rotation of the feeding roller 8. The recording material P is conveyed to a registration roller 11 through a sheet path having a guide 10. The registration roller 11 feeds the recording material P to the transfer nip TN between the surface of the photosensitive drum 1 and the outer peripheral surface (surface) of the transfer roller 5 at a predetermined timing. The recording material P is nipped and conveyed by the surface of the photosensitive drum 1 and the surface of the transfer roller 5 at the transfer nip portion TN. Then, the toner image on the surface of the photosensitive drum 1 is transferred onto the surface of the recording material P by the transfer bias applied to the transfer roller 5 during this conveyance process. As a result, the recording material P carries an unfixed toner image. The recording material P carrying the toner image is sequentially separated from the surface of the photosensitive drum 1 and discharged from the transfer nip portion TN. Through the conveyance guide 12, a flexible film 23 and a pressure roller (described later) of the fixing device (fixing device) 6 are used. 24 is introduced into a fixing nip portion (nip portion) N. The recording material P is heated and fixed on the recording material P by receiving heat and pressure while being nipped and conveyed by the flexible film 23 and the pressure roller 24 at the fixing nip portion N. The recording material P exiting the fixing device 6 is conveyed by the conveying roller 13 to the discharge roller 15 through the sheet path having the guide 14. The paper is discharged to a discharge tray 16 by the discharge roller 15. The surface of the photosensitive drum 1 after the transfer of the toner image is removed from the transfer residual toner remaining on the surface of the photosensitive drum 1 by a cleaning device 7 as a cleaning unit, and is used for the next image formation.

給送カセット9は給送カセット9の内部にサイズの異なる各種記録材Pを積載収容するための移動可能な規制ガイド(不図示)を有している。ユーザーはこの規制ガイドを記録材Pのサイズに応じて変位させその記録材Pを給送カセット5内に積載収容する。これにより、サイズの異なる各種記録材Pを給送カセット9から中央搬送基準で送り出すことができる。   The feeding cassette 9 has a movable regulation guide (not shown) for loading and storing various recording materials P of different sizes inside the feeding cassette 9. The user displaces the regulation guide according to the size of the recording material P, and loads and stores the recording material P in the feeding cassette 5. Accordingly, various types of recording materials P having different sizes can be sent out from the feeding cassette 9 on the basis of the central conveyance reference.

(2)定着装置
以下の説明において、定着装置及び定着装置を構成する部材に関し、長手方向とは記録材の面において記録材搬送方向と直交する方向をいう。短手方向とは記録材の面において記録材搬送方向と平行な方向をいう。長さとは長手方向の寸法をいう。幅とは短手方向の寸法をいう。記録材に関し、長手方向とは記録材搬送方向と平行な方向をいう。短手方向とは記録材搬送方向と直交する方向をいう。長手幅とは短手方向の寸法をいう。
(2) Fixing Device In the following description, regarding the fixing device and the members constituting the fixing device, the longitudinal direction means a direction orthogonal to the recording material conveyance direction on the surface of the recording material. The short side direction is a direction parallel to the recording material conveyance direction on the surface of the recording material. The length is a dimension in the longitudinal direction. The width is a dimension in the short direction. Regarding the recording material, the longitudinal direction means a direction parallel to the recording material conveyance direction. The short direction refers to a direction orthogonal to the recording material conveyance direction. Longitudinal width means the dimension of a transversal direction.

図2の(a)は定着装置の横断面模式図、(b)は定着装置の縦断面模式図である。この定着装置はフィルム加熱方式の定着装置である。本実施例1に示す定着装置6は、フィルムガイド(支持部材)21と、ヒータ(加熱部材)22と、耐熱性フィルム(可撓性部材)23と、加圧ローラ(バックアップ部材)24などを有している。フィルムガイド21と、ヒータ22と、耐熱性フィルム(以下、定着フィルムと記す)23と、加圧ローラ24は、何れも長手方向に長い部材である。各部材の長さは、画像形成装置に用いられる最大サイズの記録材Pの長手幅よりも長い。以下に各部材の構成を説明する。   2A is a schematic cross-sectional view of the fixing device, and FIG. 2B is a schematic vertical cross-sectional view of the fixing device. This fixing device is a film heating type fixing device. The fixing device 6 shown in the first embodiment includes a film guide (support member) 21, a heater (heating member) 22, a heat resistant film (flexible member) 23, a pressure roller (backup member) 24, and the like. Have. The film guide 21, the heater 22, the heat resistant film (hereinafter referred to as a fixing film) 23, and the pressure roller 24 are all members that are long in the longitudinal direction. The length of each member is longer than the longitudinal width of the maximum size recording material P used in the image forming apparatus. The configuration of each member will be described below.

図3の(a)はヒータの裏面を表した図、(b)はヒータの表面を表した図である。(c)は(a)に示す矢印C−C線矢視拡大断面図である。ヒータ22は、通電により発熱し温度の上昇に伴い抵抗値が下がる特性(NTC特性)を有する横断面長方形の細長い板状のヒータ基板(以下、基板と記す)22aを有している。基板22aは、基板22a自体が通電により発熱するよう抵抗調整されたセラミックス抵抗発熱体を主体とする低熱容量の発熱基板である。基板22aの材料としては、炭化ケイ素質(SiC)、ランタンクロマイト質(LaCrO)、炭素(C)質等の非金属発熱体の中でも常温(25℃)から300℃の範囲で抵抗温度係数が負特性を示すものが好ましい。その中でも酸化などの影響が少ない、或いは工業的な入手容易性より炭化ケイ素質(SiC)が好適である。本実施例1の基板22aの材料は炭化ケイ素質発熱体である。一般に炭化ケイ素は通電発熱による温度上昇に伴って800℃以下の温度域では比抵抗が急激に低下する(NTC特性)。この理由は、炭化ケイ素は半導体であるため不純物準位から伝導体へ励起できる伝導電子の数が温度上昇に伴って増大するためであると言われている。炭化ケイ素質発熱体からなる基板22aの構成材料は上述のものに限られない。例えば、炭化ケイ素質発熱体として下記イ)、ロ)に示す商品名の材料を適宜必要な形状に加工した成形品などを基板22aとして用いても良い。 3A is a view showing the back surface of the heater, and FIG. 3B is a view showing the surface of the heater. (C) is an enlarged sectional view taken along arrow CC in FIG. The heater 22 has an elongated plate-like heater substrate (hereinafter referred to as a substrate) 22a having a rectangular cross section having a characteristic (NTC characteristic) that generates heat when energized and the resistance value decreases as the temperature increases. The substrate 22a is a low heat capacity heat generation substrate mainly composed of a ceramic resistance heating element whose resistance is adjusted so that the substrate 22a itself generates heat when energized. Among the non-metallic heating elements such as silicon carbide (SiC), lanthanum chromite (LaCrO 3 ), and carbon (C), the material of the substrate 22a has a temperature coefficient of resistance in the range of room temperature (25 ° C.) to 300 ° C. Those exhibiting negative characteristics are preferred. Of these, silicon carbide (SiC) is preferred because it is less affected by oxidation and the like, or industrially available. The material of the substrate 22a of the first embodiment is a silicon carbide heating element. In general, the resistivity of silicon carbide rapidly decreases in the temperature range of 800 ° C. or less as the temperature rises due to energization heat generation (NTC characteristics). The reason for this is said to be that since silicon carbide is a semiconductor, the number of conduction electrons that can be excited from the impurity level to the conductor increases as the temperature rises. The constituent material of the substrate 22a made of a silicon carbide heating element is not limited to the above. For example, as the silicon carbide heating element, a molded product obtained by processing a material having a trade name shown in the following a) and b) into a necessary shape may be used as the substrate 22a.

イ):(株)ブリヂストン社製、商品名:ピュアベータ−R
体積抵抗率:四探針法で約1×10−1Ω・cm(25℃環境)
抵抗温度係数:室温(25℃)付近〜225℃の範囲で約−3000ppm/℃
ロ):(株)ブリヂストン社製、商品名:ピュアベータ−R改良品
体積抵抗率:四探針法で約1×10−2Ω・cm(25℃環境)
抵抗温度係数:室温(25℃)付近〜225℃の範囲で約−3000ppm/℃
ここで、本実施例1の基板22aにおける抵抗温度係数について説明する。抵抗温度係数(TCR)は、基板22aの長辺方向端部間抵抗値について、25℃環境における抵抗値R1、炉内225℃環境における抵抗値R2を計測し、単位温度変化当りの抵抗変化率を以下の式で算出した値である。
(R2−R1)/R1/(225℃−25℃)×10 [ppm/℃]
NTC特性は、一般には、温度抵抗係数が負となる特性をいうが、25℃から300℃の温度範囲で負、より好ましくは150℃から250℃の高温域での温度抵抗係数が−2500[ppm/℃]以上の炭化ケイ素質発熱体を基板の材料に使用すると好適である。定着装置6に用いる基板22aの体積抵抗率は3×10−1Ω・cm以下に抑えることが好ましい。この積抵抗率3×10−1Ω・cm以上の体積抵抗率であると基板22aを非常に幅が広い、或いは厚いものにする必要がある。または、寸法を標準的なものにするならば基板22aは発熱しないといった不具合が生じる。一方、体積抵抗率の下限側としては、基板22aのサイズによるが、体積抵抗率が低すぎて発熱しないといったことに留意する必要がある。上述したブリヂストン社製ピュアベータ−R改良品の体積抵抗率1×10−2Ω・cm品では後述する基板サイズにおいて発熱することを確認しており何ら問題無い。
A): Made by Bridgestone Corporation, trade name: Pure Beta-R
Volume resistivity: About 1 × 10 −1 Ω · cm (25 ° C. environment) by the four-probe method
Resistance temperature coefficient: about −3000 ppm / ° C. in the range of room temperature (25 ° C.) to 225 ° C.
B): manufactured by Bridgestone Corporation, trade name: Pure Beta-R improved product volume resistivity: about 1 × 10 −2 Ω · cm (25 ° C. environment) by four-probe method
Resistance temperature coefficient: about −3000 ppm / ° C. in the range of room temperature (25 ° C.) to 225 ° C.
Here, the temperature coefficient of resistance in the substrate 22a of the first embodiment will be described. For the resistance temperature coefficient (TCR), the resistance value R1 in the 25 ° C. environment and the resistance value R 2 in the furnace 225 ° C. environment are measured for the resistance value between the long side ends of the substrate 22a, and the resistance change rate per unit temperature change Is a value calculated by the following equation.
(R2-R1) / R1 / (225 ° C.-25 ° C.) × 10 6 [ppm / ° C.]
The NTC characteristic generally refers to a characteristic in which the temperature resistance coefficient is negative, but is negative in a temperature range of 25 ° C. to 300 ° C., more preferably a temperature resistance coefficient in a high temperature range of 150 ° C. to 250 ° C. is −2500 [ It is preferable to use a silicon carbide heating element of [ppm / ° C.] or more as the substrate material. The volume resistivity of the substrate 22a used in the fixing device 6 is preferably suppressed to 3 × 10 −1 Ω · cm or less. When the volume resistivity is 3 × 10 −1 Ω · cm or more, the substrate 22a needs to be very wide or thick. Or, if the dimensions are standard, there is a problem that the substrate 22a does not generate heat. On the other hand, the lower limit of the volume resistivity depends on the size of the substrate 22a, but it should be noted that the volume resistivity is too low to generate heat. It is confirmed that the above-mentioned volume resistivity 1 × 10 −2 Ω · cm product of the Bridgestone Pure Beta-R improved product generates heat at the substrate size described later, and there is no problem.

ヒータ22において、基板22aの表面22a1には、定着フィルム23の後述する導電性の基層23aと接触する領域(以下、接触領域と記す)Arに表面保護層22hが設けられている。ここで、基板22aの表面とは定着フィルム23が摺動する面(定着フィルム摺動面)をいう。表面保護層22hを設ける主な目的は、基板22aと定着フィルム23の基層23aとの電気的な絶縁性を確保するとともに基板22aに対する定着フィルム23の基層23aの摺動性を確保することにある。表面保護層22hは、例えば酸化ケイ素(SiO)を主成分としたガラスペーストを、基板22aの表面22a1の接触領域Arに塗膜し所定の温度で焼成することで得られる。基板22aの裏面22a2には、基板22aの表面22a1の接触領域Arと対応する領域Ar´と隣り合う長手方向一端部22aRと長手方向他端部22aLに、基板22aに給電するための電極部22d,22eが形成してある。ここで、基板22aの裏面とは定着フィルム23が摺動しない面(定着フィルム非摺動面))をいう。電極部22d,22eの材料としては、銀(Ag)、白金(Pt)、金(Au)などを主体とする導電ペーストを用いている。電極部22d,22eの材料はこれに限られず銀・白金(Ag・Pt)合金、銀・パラジウム(Ag・Pd)合金などを主体とする導電ペーストを用いてもよい。図3の(a)、(b)において、25,25は電極部22d,22eと結合する給電用コネクタである。 In the heater 22, a surface protective layer 22 h is provided on a surface 22 a 1 of the substrate 22 a in a region Ar (hereinafter referred to as a contact region) Ar that contacts a conductive base layer 23 a described later of the fixing film 23. Here, the surface of the substrate 22a is a surface on which the fixing film 23 slides (fixing film sliding surface). The main purpose of providing the surface protective layer 22h is to ensure electrical insulation between the substrate 22a and the base layer 23a of the fixing film 23 and to ensure the slidability of the base layer 23a of the fixing film 23 with respect to the substrate 22a. . The surface protective layer 22h is obtained, for example, by coating a glass paste mainly composed of silicon oxide (SiO 2 ) on the contact region Ar of the surface 22a1 of the substrate 22a and baking it at a predetermined temperature. On the back surface 22a2 of the substrate 22a, an electrode portion 22d for supplying power to the substrate 22a to the longitudinal end portion 22aR and the longitudinal end portion 22aL adjacent to the region Ar ′ corresponding to the contact region Ar of the front surface 22a1 of the substrate 22a. , 22e are formed. Here, the back surface of the substrate 22a refers to a surface on which the fixing film 23 does not slide (fixing film non-sliding surface). As a material for the electrode portions 22d and 22e, a conductive paste mainly composed of silver (Ag), platinum (Pt), gold (Au), or the like is used. The material of the electrode portions 22d and 22e is not limited to this, and a conductive paste mainly composed of silver / platinum (Ag / Pt) alloy, silver / palladium (Ag / Pd) alloy, or the like may be used. In FIGS. 3A and 3B, reference numerals 25 and 25 denote power feeding connectors coupled to the electrode portions 22d and 22e.

ヒータ22の発熱領域について説明する。図4の(a)はヒータの発熱領域を表す説明図、(b)はヒータの発熱領域における通紙部と非通紙部の発熱量を説明するためのモデル図である。図4の(a)に示すように、電力制御回路(給電制御部)31から給電用コネクタ25,25を通じてヒータ22の電極部22d,22eに電力が供給されると、基板22aの電極部22d,22e間に電流が流れる。これによって基板22aの電極部22d,22e間が迅速に昇温する。つまり、基板22aにおいて電極部22d,22e間の領域が発熱領域(以下、発熱部と記す)Hとなる。そしてこの発熱部Hの温度が基板22aの裏面において発熱部Hの長手方向中央に設けられているサーミスタなどの検温素子(温度検出部材)22i(図3の(a)参照)により検出される。この検温素子22iの出力信号(温度検出信号)に基づいてヒータ22は所定の定着温度(目標温度)を維持するように温度制御される。ここで、ヒータ22のNTC特性の非通紙部昇温への効果について図4の(b)を参照して説明する。ここでは、発熱部Hを長さa(=55mm)に4分割してヒータ22の非通紙部昇温の効果を考える。発熱部Hの長手方向中央部2箇所の抵抗をそれぞれr1、長手方向端部2箇所の抵抗をそれぞれr2とする(長手方向中央部と長手方向端部の温度が同じであればr1=r2)。2(r1+r2)が発熱部Hの総抵抗である。発熱部Hに流れる電流をiとすると、発熱部Hの長手方向中央部2箇所のうち1箇所の発熱量q1はi×r1であり、長手方向端部2箇所のうち1箇所の発熱量q2はi×r2である。簡単のため、長手幅2a(=110mm)の小サイズ紙が定着ニップ部Nに通紙(導入)された場合を考えると、発熱部Hの長手方向中央部の抵抗がr1の部分は小サイズ紙の記録材が通過する領域(通紙部)となる。発熱部Hの長手方向端部の抵抗がr2の部分は小サイズ紙の記録材が通過しない領域(非通紙部)となる。ヒータ22の温度制御は通紙部に設けられた検温素子22iで行われるので、小サイズ紙に熱を奪われる通紙部に比べて、小サイズ紙に熱を奪われない非通紙部の温度は上昇する。炭化ケイ素質発熱体からなる基板22aは実使用温度域(250℃以下)ではNTC特性を有するため、小サイズ紙通紙時はr1>r2となる。電流iは通紙部と非通紙部で同じであるためq1>q2となり、非通紙部の発熱量は長手方向中央部の発熱量よりも小さくなり非通紙部昇温を抑えることが可能となる。 The heat generation area of the heater 22 will be described. 4A is an explanatory diagram showing the heat generation area of the heater, and FIG. 4B is a model diagram for explaining the heat generation amount of the sheet passing portion and the non-sheet passing portion in the heat generation area of the heater. As shown in FIG. 4A, when power is supplied from the power control circuit (power supply control unit) 31 to the electrode portions 22d and 22e of the heater 22 through the power supply connectors 25 and 25, the electrode portion 22d of the substrate 22a. , 22e. As a result, the temperature between the electrode portions 22d and 22e of the substrate 22a quickly rises. That is, a region between the electrode portions 22d and 22e in the substrate 22a becomes a heat generation region (hereinafter referred to as a heat generation portion) H. The temperature of the heat generating portion H is detected by a temperature measuring element (temperature detection member) 22i (see FIG. 3A) such as a thermistor provided at the center in the longitudinal direction of the heat generating portion H on the back surface of the substrate 22a. Based on the output signal (temperature detection signal) of the temperature detecting element 22i, the heater 22 is temperature-controlled so as to maintain a predetermined fixing temperature (target temperature). Here, the effect of the NTC characteristic of the heater 22 on the temperature increase of the non-sheet passing portion will be described with reference to FIG. Here, the heating part H is divided into four parts of length a (= 55 mm), and the effect of increasing the temperature of the non-sheet passing part of the heater 22 is considered. The resistances at the two longitudinal center portions of the heat generating part H are r1 and the resistances at the two longitudinal end portions are r2, respectively (r1 = r2 if the temperatures at the longitudinal central portion and the longitudinal end portions are the same). . 2 (r1 + r2) is the total resistance of the heat generating portion H. Assuming that the current flowing through the heat generating portion H is i, the heat generation amount q1 at one of the two longitudinal central portions of the heat generating portion H is i 2 × r1, and the heat generation at one of the two longitudinal end portions. q2 is i 2 × r2. For the sake of simplicity, considering the case where a small size paper having a longitudinal width 2a (= 110 mm) is passed (introduced) through the fixing nip N, the portion of the heat generating portion H where the resistance in the longitudinal direction is r1 is small. This is an area (paper passing portion) through which the paper recording material passes. A portion where the resistance at the longitudinal end of the heat generating portion H is r2 is a region (non-sheet passing portion) through which the recording material of small size paper does not pass. Since the temperature control of the heater 22 is performed by the temperature detecting element 22i provided in the sheet passing portion, the non-sheet passing portion that does not lose heat to the small size paper compared to the sheet passing portion that takes heat to the small size paper. The temperature rises. Since the substrate 22a made of a silicon carbide heating element has NTC characteristics in the actual use temperature range (250 ° C. or less), r1> r2 when small-size paper is passed. Since the current i is the same in the sheet passing portion and the non-sheet passing portion, q1> q2, and the heat generation amount in the non-sheet passing portion is smaller than the heat generation amount in the central portion in the longitudinal direction, thereby suppressing the temperature rise in the non-sheet passing portion. It becomes possible.

フィルムガイド21は、横断面略半円弧状の樋型に形成してある。このフィルムガイド21は、例えばPPS(ポリフェニレンサルファイト)やLCP(液晶ポリマー)等の耐熱性樹脂の成形品である。このフィルムガイド21は、フィルムガイド21の長手方向一端部と長手方向他端部がそれぞれ定着装置6の装置フレーム(不図示)に支持されている。フィルムガイド21の下面の短手方向中央には長手方向に沿って溝21aが形成されている。このフィルムガイド21の溝21aにはヒータ22が表面保護層22hの定着フィルム23と接触する表面22hsを表出させた状態に支持されている。図5の(a)にフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図を示す。フィルムガイド21の下面には、フィルムガイド21の短手方向において溝21aの左右の内側面21aR,21aLの下端からヒータ22の基板22aの短手方向の中心線22cに向けて張り出す2つのオーバーラップ部22bR,22bLが形成してある。そしてヒータ22の表面保護層22hの表面22hsにおける基板22aの短手方向の両端面22hsR,22hsLを対応するオーバーラップ部22bR,22bLで覆っている。フィルムガイド21はこれに限られず図5の(b)に示すように構成したものであってもよい。図5の(b)にフィルムガイドの他の例とこのフィルムガイドに支持されているヒータの横断面模式図を示す。図5の(b)に示すフィルムガイド21は、フィルムガイド21の短手方向の中心線21cに対して左右対称の2つの部品215,216により構成されている。そしてこの2つの部品215,216を組み立てることによって溝21a及びオーバーラップ部22bR,22bLを形成するように構成してある。   The film guide 21 is formed in a saddle shape having a substantially semicircular cross section. The film guide 21 is a molded product of a heat resistant resin such as PPS (polyphenylene sulfite) or LCP (liquid crystal polymer). The film guide 21 is supported by an apparatus frame (not shown) of the fixing device 6 at one end in the longitudinal direction and the other end in the longitudinal direction of the film guide 21. A groove 21 a is formed along the longitudinal direction at the center in the short direction of the lower surface of the film guide 21. In the groove 21a of the film guide 21, a heater 22 is supported in a state in which a surface 22hs contacting the fixing film 23 of the surface protective layer 22h is exposed. FIG. 5A shows a schematic cross-sectional view of a film guide and a heater supported by the film guide. On the lower surface of the film guide 21, two overhangs projecting from the lower ends of the left and right inner surfaces 21aR and 21aL of the groove 21a toward the center line 22c of the substrate 22a of the heater 22 in the short direction of the film guide 21. Wrap portions 22bR and 22bL are formed. Then, both end surfaces 22hsR, 22hsL in the short direction of the substrate 22a on the surface 22hs of the surface protective layer 22h of the heater 22 are covered with corresponding overlap portions 22bR, 22bL. The film guide 21 is not limited to this, and may be configured as shown in FIG. FIG. 5B shows another example of the film guide and a schematic cross-sectional view of the heater supported by the film guide. The film guide 21 shown in FIG. 5B is composed of two parts 215 and 216 that are symmetrical with respect to the center line 21 c in the short direction of the film guide 21. The two parts 215 and 216 are assembled to form the groove 21a and the overlap portions 22bR and 22bL.

定着フィルム23は、ヒータ22を支持しているフィルムガイド21にルーズに外嵌させた筒状の部材である。この定着フィルム23は、熱容量を小さくして装置のクイックスタート性を向上させるために、膜厚を総厚100μm以下に設定した筒状のベースフィルム(基層)23aの表面に離型層23bをコーティングした複合層フィルムである(図2参照)。ベースフィルム23aの総厚は好ましくは60μm以下20μm以上がよい。ベースフィルム23aの材料としては、PI(ポリイミド)、PAI(ポリアミドイミド)、PEEK(ポリエーテルエーテルケトン)、PES(ポリエーテルスルホン)等の樹脂材料や、SUS、Niなどの金属材料が用いられる。離型層23bの材料としては、PTFE(ポリテトラフルオロエチレン)、PFA(テトラフルオロエチレンーパーフルオロアルキルビニルエーテル)、FEP(テトラフルオロエチレン−ヘキサフルオロプロピレン)等のフッ素樹脂が用いられる。   The fixing film 23 is a cylindrical member loosely fitted on the film guide 21 that supports the heater 22. This fixing film 23 is coated with a release layer 23b on the surface of a cylindrical base film (base layer) 23a whose total thickness is set to 100 μm or less in order to reduce the heat capacity and improve the quick start performance of the apparatus. The composite layer film (see FIG. 2). The total thickness of the base film 23a is preferably 60 μm or less and 20 μm or more. As the material of the base film 23a, resin materials such as PI (polyimide), PAI (polyamideimide), PEEK (polyetheretherketone), and PES (polyethersulfone), and metal materials such as SUS and Ni are used. As the material of the release layer 23b, a fluororesin such as PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether), FEP (tetrafluoroethylene-hexafluoropropylene), or the like is used.

加圧ローラ24は、鉄やアルミニウム等の材料により丸軸状に作製された芯金24aと、その芯金24aの外周面上に設けられたシリコーンゴム等の弾性層24bと、この弾性層24bの外周面上に設けられたフッ素樹脂等の離型層24cなどを有している。この加圧ローラ24は、定着フィルム23の下方で定着フィルム23と平行に配置され、芯金24aの長手方向一端部と長手方向他端部がそれぞれ装置フレームに軸受を介して回転自在に支持されている。そしてこの軸受を加圧バネ(不図示)で加圧ローラ24の母線方向と直交する方向へ付勢し加圧ローラ24の外周面(表面)を定着フィルム23の外周面(表面)に加圧した状態に接触させている。これにより加圧ローラ24は定着フィルム23を挟んでヒータ22の表面保護層22hに加圧され定着フィルム23の内周面(内面)が表面保護層22hの表面22hsと加圧状態に接触する。これにより加圧ローラ24の弾性層24bが弾性変形し加圧ローラ24表面と定着フィルム23表面との間に所定幅の定着ニップ部Nが形成される。   The pressure roller 24 includes a cored bar 24a made of a material such as iron or aluminum, an elastic layer 24b made of silicone rubber or the like provided on the outer peripheral surface of the cored bar 24a, and the elastic layer 24b. And a release layer 24c made of a fluororesin or the like provided on the outer peripheral surface of the substrate. The pressure roller 24 is disposed below the fixing film 23 in parallel with the fixing film 23, and one end in the longitudinal direction and the other end in the longitudinal direction of the cored bar 24a are rotatably supported by the apparatus frame via bearings. ing. The bearing is urged by a pressure spring (not shown) in a direction orthogonal to the direction of the generatrix of the pressure roller 24 to press the outer peripheral surface (surface) of the pressure roller 24 against the outer peripheral surface (surface) of the fixing film 23. In contact with As a result, the pressure roller 24 is pressed against the surface protective layer 22h of the heater 22 with the fixing film 23 interposed therebetween, and the inner peripheral surface (inner surface) of the fixing film 23 contacts the surface 22hs of the surface protective layer 22h in a pressurized state. As a result, the elastic layer 24 b of the pressure roller 24 is elastically deformed, and a fixing nip portion N having a predetermined width is formed between the surface of the pressure roller 24 and the surface of the fixing film 23.

(3)定着装置の加熱定着動作
制御部50は、プリント指令に応じて定着モータM(図2(a)参照)を回転駆動する。定着モータMの出力軸の回転は所定のギア列を介して加圧ローラ24の芯金24aに設けられている駆動ギアG(図2(b)参照)に伝達される。これにより加圧ローラ24は所定の周速度(プロセススピード)で矢印方向へ回転する。加圧ローラ24の回転は定着ニップ部Nにおいて加圧ローラ24表面と定着フィルム23表面との摩擦力によって定着フィルム23に伝達される。これにより定着フィルム23は定着フィルム23の内周面(内面)がヒータ22の表面保護層22hの表面22hsと接触しながら加圧ローラ24の回転に追従して回転(移動)する。また制御部50は、プリント指令に応じて電力制御回路31を立ち上げる。これにより電力制御回路31は給電用コネクタ25,25を介してヒータ22の電極部22d,22eに給電する。この電極部22d,22eを通じて基板22aの電極部22d,22e間に通電され発熱部Hが発熱して定着フィルム23を加熱する。基板22aの温度は検温素子22iにより検出される。制御部50は検温素子22iからの出力信号を取り込み、この出力信号に基づいてヒータ22を所定の定着温度(目標温度)に維持するように電力制御回路31を制御する。定着モータMを回転駆動し、かつ、ヒータ22に給電している状態において、未定着のトナー画像Tを担持する記録材Pがトナー画像担持面を上向きにして定着ニップ部Nに導入される。この記録材Pは定着ニップ部Nで定着フィルム23表面と加圧ローラ24表面により挟持されその状態に搬送(挟持搬送)される。この搬送過程において記録材P上のトナー画像Tは定着フィルム23を介してヒータ22により加熱されて溶融し定着ニップ部Nで加圧されることにより記録材上に加熱定着される。そしてトナー画像Tが加熱定着された記録材Pは定着ニップ部Nから排出され搬送ローラ13に向けて搬送される。
(3) Heat Fixing Operation of Fixing Device The control unit 50 rotationally drives the fixing motor M (see FIG. 2A) in response to a print command. The rotation of the output shaft of the fixing motor M is transmitted to a driving gear G (see FIG. 2B) provided on the cored bar 24a of the pressure roller 24 through a predetermined gear train. As a result, the pressure roller 24 rotates in the direction of the arrow at a predetermined peripheral speed (process speed). The rotation of the pressure roller 24 is transmitted to the fixing film 23 by the frictional force between the surface of the pressure roller 24 and the surface of the fixing film 23 at the fixing nip portion N. As a result, the fixing film 23 rotates (moves) following the rotation of the pressure roller 24 while the inner peripheral surface (inner surface) of the fixing film 23 contacts the surface 22 hs of the surface protective layer 22 h of the heater 22. The control unit 50 starts up the power control circuit 31 in response to the print command. As a result, the power control circuit 31 supplies power to the electrode portions 22 d and 22 e of the heater 22 via the power supply connectors 25 and 25. Electricity is passed between the electrode portions 22d and 22e of the substrate 22a through the electrode portions 22d and 22e, and the heat generating portion H generates heat to heat the fixing film 23. The temperature of the substrate 22a is detected by the temperature measuring element 22i. The control unit 50 takes in an output signal from the temperature sensing element 22i, and controls the power control circuit 31 so as to maintain the heater 22 at a predetermined fixing temperature (target temperature) based on the output signal. In a state where the fixing motor M is rotationally driven and the heater 22 is supplied with power, the recording material P carrying the unfixed toner image T is introduced into the fixing nip portion N with the toner image carrying surface facing upward. The recording material P is sandwiched between the surface of the fixing film 23 and the surface of the pressure roller 24 at the fixing nip portion N, and is transported to the state (nip transport). In this conveyance process, the toner image T on the recording material P is heated and melted by the heater 22 through the fixing film 23 and is heated and fixed on the recording material by being pressurized at the fixing nip N. Then, the recording material P on which the toner image T is heated and fixed is discharged from the fixing nip portion N and conveyed toward the conveying roller 13.

(4)フィルムガイドのオーバーラップ部の作用効果
本実施例1の定着装置6は、フィルムガイド21のオーバーラップ部22bR,22bLがヒータ22の表面保護層22hの表面22hsにおける両端面22hsR,22hsLを覆っている。このため、フィルムガイド21のオーバーラップ部22bR,22bLによって、定着フィルム23の基層23aとヒータ22の表面保護層22の表面22hsにおける両端面22hsR,22hsLとを接触させない状態即ち非接触状態に維持することができる。よって、定着フィルム23の基層23aと接触するヒータ22の基板22aの長手方向中央部のみに表面保護層22hを設けた場合でも基板23aの短手方向の側面やエッジ部と定着フィルム23の基層23aとの絶縁性を確保できる。またフィルムガイド21がオーバーラップ部22bR,22bLを有することによって、定着ニップ部Nにおける定着フィルム23の変形形状を安定させることができる。このため、定着フィルム23の基層23aとして剛性のある薄い金属フィルムを用いた場合においても、耐久を通じて定着フィルム23の回転動作中の挙動が安定する。即ち、フラットな定着ニップ部Nでの定着フィルム23の変形に対し、フィルムガイド21の短手方向においてオーバーラップ部22bR,22bLが定着フィルム23の定着ニップ部Nでの変形を誘導するガイドの役割をする。これにより定着フィルム23を安定させて定着ニップ部Nに進入させることが可能となり定着フィルム23の回転動作中の挙動も安定する。図6を参照して定着フィルム23の定着ニップ部Nにおける変形形状を説明する。図6の(a)はフィルムガイドにオーバーラップ部が形成されている場合の定着フィルムの定着ニップ部における変形形状の説明図である。(b)はフィルムガイドにオーバーラップ部が形成されていない場合の定着フィルムの定着ニップ部における変形形状の説明図である。定着フィルム23の基層23aとして剛性のある薄い金属フィルムを用いた場合、図6の(a)、(b)に示すように、定着フィルム23はフィルムガイド21の短手方向において定着ニップ部N近傍で波型に変形する。フィルムガイド21にオーバーラップ部22bR,22bLが形成されている場合は、図6の(a)に示すように、定着フィルム23の波型形状に沿うようにオーバーラップ部22bR,22bLの厚さと幅を最適化する。これによりオーバーラップ部22bR,22bLは定着フィルム23の定着ニップ部Nでの変形を誘導するガイドとしての役割を担う。つまり、オーバーラップ部22bR,22bLはフラットな定着ニップ部Nでの定着フィルム23の変形に対し、フィルムガイド21の短手方向において定着ニップ部Nでの変形を誘導するガイドの役割をする。これによりフィルムガイド21の短手方向においてヒータ22に対する定着フィルム23の位置が規制され、定着フィルム23の回転動作中の挙動が安定する。フィルムガイド21にオーバーラップ部22bR,22bLが形成されていない場合には、図6の(b)に示すように、定着フィルム23の波型形状によってヒータ22に対する定着フィルム23の位置が規制できない。このため、定着フィルム23は図の矢印方向へ変動しやすく、定着フィルム23の回転動作中の挙動が安定しなくなる。
(4) Effects of Overlap Portion of Film Guide In fixing device 6 of the first embodiment, overlap portions 22bR and 22bL of film guide 21 have both end faces 22hsR and 22hsL on surface 22hs of surface protective layer 22h of heater 22 respectively. Covering. Therefore, the overlap portions 22bR and 22bL of the film guide 21 keep the base layer 23a of the fixing film 23 and the both end faces 22hsR and 22hsL of the surface 22hs of the surface protective layer 22 of the heater 22 in a non-contact state, that is, in a non-contact state. be able to. Therefore, even when the surface protective layer 22h is provided only in the longitudinal center portion of the substrate 22a of the heater 22 that is in contact with the base layer 23a of the fixing film 23, the lateral side or edge portion of the substrate 23a and the base layer 23a of the fixing film 23 are provided. Can be secured. Further, since the film guide 21 has the overlap portions 22bR and 22bL, the deformed shape of the fixing film 23 in the fixing nip portion N can be stabilized. Therefore, even when a rigid thin metal film is used as the base layer 23a of the fixing film 23, the behavior during the rotation operation of the fixing film 23 is stabilized through durability. That is, in contrast to the deformation of the fixing film 23 at the flat fixing nip N, the overlap portions 22bR and 22bL in the short direction of the film guide 21 serve as guides for inducing the deformation at the fixing nip N of the fixing film 23. do. As a result, the fixing film 23 can be stabilized to enter the fixing nip portion N, and the behavior of the fixing film 23 during the rotating operation is also stabilized. The deformation shape of the fixing film 23 at the fixing nip portion N will be described with reference to FIG. FIG. 6A is an explanatory diagram of a deformed shape in the fixing nip portion of the fixing film when an overlap portion is formed on the film guide. (B) is an explanatory view of a deformed shape in the fixing nip portion of the fixing film when the overlap portion is not formed on the film guide. When a rigid thin metal film is used as the base layer 23a of the fixing film 23, as shown in FIGS. 6A and 6B, the fixing film 23 is in the vicinity of the fixing nip portion N in the short direction of the film guide 21. It transforms into a wave shape. When the overlap portions 22bR and 22bL are formed on the film guide 21, as shown in FIG. 6A, the thickness and width of the overlap portions 22bR and 22bL along the corrugated shape of the fixing film 23. To optimize. Thus, the overlap portions 22bR and 22bL serve as guides for inducing deformation of the fixing film 23 at the fixing nip portion N. That is, the overlap portions 22bR and 22bL serve as guides for inducing deformation at the fixing nip portion N in the short direction of the film guide 21 with respect to the deformation of the fixing film 23 at the flat fixing nip portion N. As a result, the position of the fixing film 23 relative to the heater 22 in the short direction of the film guide 21 is restricted, and the behavior of the fixing film 23 during the rotating operation is stabilized. When the overlap portions 22bR and 22bL are not formed on the film guide 21, the position of the fixing film 23 relative to the heater 22 cannot be regulated by the corrugated shape of the fixing film 23 as shown in FIG. For this reason, the fixing film 23 tends to fluctuate in the direction of the arrow in the figure, and the behavior of the fixing film 23 during the rotation operation becomes unstable.

(5)評価
本実施例1の定着装置6の特性について更に詳細に説明する。下記の比較例1及び比較例2のように構成した定着装置を用いて、本実施例1の定着装置6の効果を確認した。本評価では、比較例1及び比較例2の定着装置について、本実施例1の定着装置6と共通する部材・部分には同じ符号を付している。以下の説明において、本実施例1の定着装置を実施例定着装置(1)と記し、比較例1の定着装置を比較例定着装置(1)と記し、比較例2の定着装置を比較例定着装置(2)と記す。
(5) Evaluation The characteristics of the fixing device 6 of the first embodiment will be described in more detail. The effects of the fixing device 6 of Example 1 were confirmed using fixing devices configured as in Comparative Examples 1 and 2 below. In this evaluation, for the fixing devices of Comparative Example 1 and Comparative Example 2, members / portions common to the fixing device 6 of Example 1 are denoted by the same reference numerals. In the following description, the fixing device of Example 1 is referred to as Example fixing device (1), the fixing device of Comparative Example 1 is referred to as Comparative Example Fixing Device (1), and the fixing device of Comparative Example 2 is referred to as Comparative Example Fixing. It is described as device (2).

実施例定着装置(1)では、ヒータ22の基板22aとして、上述したブリヂストン社製ピュアベータ−R改良品を用いている。そしてこの基板22aは幅5mm・長さ270mm・厚さ0.5mmの細長い板状に成形されている。基板22aの裏面22a2には、銀(Ag)を用いて電極部22d,22eを10μmの厚みで成形した。このとき電極部22d,22e間に形成される発熱部Hの長さは220mmとした。そして基板22aの表面22a1には表面絶縁層22hを50μmの厚みで成形した。フィルムガイド21のオーバーラップ部22bR,22bLの形状としては、厚さ1mm、幅はヒータ22の基板22aの短手方向一端部及び短手方向他端部からそれぞれ少なくとも1.5mm内側にオーバーラップさせる形状とした。図7の(a)は比較例定着装置(1)のフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図である。比較例定着装置(1)は、オーバーラップ部が形成されていないフィルムガイド31を用いた点を除いて、実施例定着装置(1)と同じ構成としてある。図7の(b)は比較例定着装置(2)のフィルムガイドとこのフィルムガイドに支持されているヒータの横断面模式図である。比較例定着装置(2)は、ヒータ22に代えて下記の構成のヒータ722を用いた点を除いて、実施例定着装置(1)と同じ構成としてある。ヒータ722は、酸化アルミニウム(Al)製の基板722aの表面上にAg/Pdペーストを帯状に塗布して通電発熱抵抗体722bを形成するとともにこの通電発熱抵抗体722bを覆うようにフッ素樹脂保護層722cを形成した構成である。また、実施例定着装置(1)と、比較例定着装置(1)と、比較例定着装置(2)をそれぞれ搭載する画像形成装置も同じ構成してある。この3つの画像形成装置において、実施例定着装置(1)、比較例定着装置(1)、比較例定着装置(2)がそれぞれ十分室温(25℃)になじんだ状態からB5サイズの小サイズ紙(坪量128g/mm)を定着ニップ部に200枚連続して通紙(導入)した。そしてこのときの実施例定着装置(1)、比較例定着装置(1)、比較例定着装置(2)の各ヒータの非通紙部の温度を測定した。非通紙部の温度は基板の裏面に長手方向に沿って配設した多数の検温素子によって測定した。入力電圧は120Vとし、定着温度は200℃とした。また、実施例定着装置(1)と、比較例定着装置(1)については、10万枚の通紙試験による耐久試験も行った。
結果を表1に示す。
In the exemplary fixing device (1), the above-described Pure Beta-R improved product manufactured by Bridgestone is used as the substrate 22a of the heater 22. The substrate 22a is formed into an elongated plate shape having a width of 5 mm, a length of 270 mm, and a thickness of 0.5 mm. On the back surface 22a2 of the substrate 22a, electrode portions 22d and 22e were formed with a thickness of 10 μm using silver (Ag). At this time, the length of the heat generating portion H formed between the electrode portions 22d and 22e was 220 mm. A surface insulating layer 22h was formed to a thickness of 50 μm on the surface 22a1 of the substrate 22a. The overlap portions 22bR and 22bL of the film guide 21 have a thickness of 1 mm and a width that overlaps at least 1.5 mm from the short-side end and the short-side end of the substrate 22a of the heater 22, respectively. Shaped. FIG. 7A is a schematic cross-sectional view of the film guide of the comparative fixing device (1) and the heater supported by the film guide. The comparative fixing device (1) has the same configuration as that of the exemplary fixing device (1) except that a film guide 31 having no overlap portion is used. FIG. 7B is a schematic cross-sectional view of the film guide of the comparative fixing device (2) and the heater supported by the film guide. The comparative fixing device (2) has the same configuration as that of the exemplary fixing device (1) except that a heater 722 having the following configuration is used instead of the heater 22. The heater 722 forms a conductive heating resistor 722b by applying Ag / Pd paste in a strip shape on the surface of a substrate 722a made of aluminum oxide (Al 2 O 3 ), and fluorine so as to cover the conductive heating resistor 722b. The resin protective layer 722c is formed. Further, the image forming apparatus on which the embodiment fixing device (1), the comparative example fixing device (1), and the comparative example fixing device (2) are respectively mounted has the same configuration. In these three image forming apparatuses, the B5 size small-size paper from the state in which the example fixing device (1), the comparative example fixing device (1), and the comparative example fixing device (2) are each sufficiently adapted to room temperature (25 ° C.). (Basis weight 128 g / mm 2 ) was continuously fed (introduced) into the fixing nip part by 200 sheets. At this time, the temperatures of the non-sheet passing portions of the heaters of the example fixing device (1), the comparative example fixing device (1), and the comparative example fixing device (2) were measured. The temperature of the non-sheet passing portion was measured by a number of temperature measuring elements disposed along the longitudinal direction on the back surface of the substrate. The input voltage was 120V and the fixing temperature was 200 ° C. In addition, with respect to the example fixing device (1) and the comparative example fixing device (1), a durability test was conducted by a 100,000 sheet passing test.
The results are shown in Table 1.


NTC特性を有するヒータを用いた比較例定着装置(1)の場合は、非通紙部の昇温が抑制されるため、200枚通紙後も、210℃であり、問題なかった。一方、比較例定着装置(2)は、小サイズ紙の連続通紙によって、通紙枚数とともに非通紙部の温度が高くなり、200枚通紙後は加圧ローラゴム(加圧ローラ24の弾性層24b)の耐熱温度(230℃)を超えて、加圧ローラ表面に一部変形が見られた。耐久寿命試験の結果は、5万枚通紙時点(1)では、実施例定着装置(1)、比較例定着装置(1)ともに、問題なく良好であった。これに対して、10万枚通紙時点(2)では、比較例定着装置(1)は、ヒータの表面保護層が定着フィルムの摺動により基板の短手方向のエッジ部の表面保護層が摩耗した。このため、定着フィルムの基層とヒータの基板との絶縁性が保たれず、基板への電力の供給が不安定となり、発熱不良などの不具合が発生した。一方、実施例定着装置(1)では、10万枚通紙後もヒータは安定して発熱し、10万枚通紙後に行った耐圧試験(1kV印加)においても問題なかった。 In the case of the comparative fixing device (1) using the heater having the NTC characteristic, since the temperature rise in the non-sheet passing portion is suppressed, the temperature is 210 ° C. even after passing 200 sheets, and there is no problem. On the other hand, in the comparative fixing device (2), the temperature of the non-sheet passing portion is increased along with the number of sheets passed by continuous passing of small size paper, and after 200 sheets are passed, the pressure roller rubber (the elasticity of the pressure roller 24) Some deformation was observed on the pressure roller surface beyond the heat resistance temperature (230 ° C.) of the layer 24b). As a result of the endurance life test, both the example fixing device (1) and the comparative example fixing device (1) were good with no problems at the time of passing 50,000 sheets (1). On the other hand, at the time of passing 100,000 sheets (2), in the comparative fixing device (1), the surface protective layer of the heater has the surface protective layer at the edge in the short direction of the substrate due to the sliding of the fixing film. Worn out. For this reason, insulation between the base layer of the fixing film and the substrate of the heater is not maintained, power supply to the substrate becomes unstable, and problems such as defective heat generation occur. On the other hand, in the example fixing device (1), the heater stably generated heat even after passing 100,000 sheets, and there was no problem in the pressure resistance test (1 kV application) performed after passing 100,000 sheets.

[実施例2]
定着装置の他の例を説明する。本実施例2では、本実施例2の定着装置について、実施例1の定着装置と同じ部材・部分に同一の符号を付して再度の説明を省略する。図8の(a)は、フィルムガイドとこのフィルムガイドにヒータを支持させるためにフィルムガイドに取り付けられる部材とこの部材によりフィルムガイドに支持させたヒータの横断面模式図、(b)は部材の長手方向中央部を省略した外観斜視図である。
[Example 2]
Another example of the fixing device will be described. In the second embodiment, the same reference numerals are given to the same members and portions as those of the fixing device of the first embodiment, and the description thereof is omitted. 8A is a schematic cross-sectional view of a film guide, a member attached to the film guide for supporting the heater on the film guide, and a heater supported on the film guide by this member, and FIG. It is the external appearance perspective view which abbreviate | omitted the longitudinal direction center part.

本実施例2の定着装置6は、フィルムガイド21にヒータ22を支持させるためにフィルムガイドに取り付けられる部材25を用いて、ヒータの表面保護層22hの表面22hsにおける短手方向の両端面22hsR,22hsLを覆うように構成したものである。部材25は、フィルムガイド21の溝21aに嵌合可能な細長い部材である。この部材25は、部材25の短手方向に一対の側壁25aR,25aLを有している。この一対の側壁25aR,25aLは部材25の長手方向両端部で連結されている。そしてこの一対の側壁25aR,25aLの下端にはこの下端の内面側からヒータ22の基板22aの短手方向の中心線22cに張り出すオーバーラップ部25R,25Lが形成してある。そしてこのオーバーラップ部間にはヒータ22の表面保護層22hの表面22hsを表出させるための開口部25wが形成してある。   The fixing device 6 according to the second exemplary embodiment uses the member 25 attached to the film guide in order to support the heater 22 on the film guide 21, and both end surfaces 22 hsR in the short direction on the surface 22 hs of the surface protective layer 22 h of the heater. It is configured to cover 22 hsL. The member 25 is an elongated member that can be fitted into the groove 21 a of the film guide 21. The member 25 has a pair of side walls 25aR and 25aL in the short direction of the member 25. The pair of side walls 25aR and 25aL are connected at both ends of the member 25 in the longitudinal direction. Overlap portions 25R and 25L are formed at the lower ends of the pair of side walls 25aR and 25aL so as to protrude from the inner surface side of the lower ends to the center line 22c in the short direction of the substrate 22a of the heater 22. An opening 25w for exposing the surface 22hs of the surface protective layer 22h of the heater 22 is formed between the overlap portions.

部材25を用いてフィルムガイド21にヒータ22を支持させる場合には、ヒータ22の表面保護層22hの表面22hsにおける両端面22hsR,22hsLを部材25のオーバーラップ部25R,25Lの裏面上に載せてヒータ22を部材25に保持させる。そしてこの部材25の側壁25aR,25aLをフィルムガイド21の下面側からフィルムガイド21の溝21aに嵌め込むことにより部材25を溝21a内に支持させる。これにより部材25がヒータ22を支持した状態にフィルムガイド21の溝21aに取り付けられる。この状態において、部材25のオーバーラップ部25R,25Lがヒータ22の表面保護層22hの表面22hsにおける両端面22hsR,22hsLを覆っている。従って本実施例2の定着装置6においても、実施例1の定着装置6と同じ作用効果を得ることができる。   When the film guide 21 is used to support the heater 22 using the member 25, both end surfaces 22hsR and 22hsL of the surface 22hs of the surface protective layer 22h of the heater 22 are placed on the back surfaces of the overlap portions 25R and 25L of the member 25. The heater 22 is held by the member 25. Then, the side walls 25aR and 25aL of the member 25 are fitted into the groove 21a of the film guide 21 from the lower surface side of the film guide 21, thereby supporting the member 25 in the groove 21a. Thereby, the member 25 is attached to the groove 21 a of the film guide 21 in a state where the heater 22 is supported. In this state, the overlap portions 25R and 25L of the member 25 cover both end faces 22hsR and 22hsL of the surface 22hs of the surface protective layer 22h of the heater 22. Therefore, the fixing device 6 of the second embodiment can obtain the same effects as the fixing device 6 of the first embodiment.

[その他の実施例]
実施例1及び実施例2の定着装置は、未定着トナー画像を記録材に加熱定着する定着装置(像加熱装置)としての使用に限られるものではない。例えば未定着のトナー画像を記録材に仮定着する像加熱装置、或いは記録材に加熱定着されているトナー画像表面の光沢を増大させる像加熱装置としても使用できる。
[Other examples]
The fixing devices according to the first and second embodiments are not limited to use as a fixing device (image heating device) that heat-fixes an unfixed toner image on a recording material. For example, it can also be used as an image heating device that presupposes an unfixed toner image on a recording material, or an image heating device that increases the gloss of the surface of a toner image that is heat-fixed on a recording material.

22‥ヒータ、22a‥ヒータ基板、22d,22e‥電極部、23‥耐熱性フィルム、24‥加圧ローラ、P‥記録材、N‥定着ニップ部、T‥トナー画像、22bR,22bL‥オーバーラップ部、22h‥表面保護層、22hs‥表面、25‥部材、25R,25L‥オーバーラップ部 22 Heater, 22a Heater substrate, 22d, 22e Electrode, 23 Heat resistant film, 24 Pressure roller, P Recording material, N Fixing nip, T Toner image, 22bR, 22bL Overlapping Part, 22h ... surface protective layer, 22hs ... surface, 25 ... member, 25R, 25L ... overlap part

Claims (7)

通電により発熱し温度の上昇に伴い抵抗値が下がる特性を有する細長い基板と前記基板の長手方向両端部の内側に設けられた電極部であり前記基板に給電するための電極部と前記基板の長手方向中央部に設けられた絶縁層とを有する加熱部材と、前記加熱部材を支持する支持部材と、前記絶縁層と接触しつつ移動する可撓性部材であり前記絶縁層と接触する導電性の基層を有する可撓性部材と、を有し、記録材が担持する画像を前記可撓性部材を介して前記加熱部材の熱で加熱する像加熱装置において、
前記絶縁層の前記可撓性部材と接触する表面における前記基板の長手方向と直交する短手方向の両端面を前記支持部材で覆うことを特徴とする像加熱装置。
An elongated substrate having a characteristic of generating heat when energized and having a resistance value decreasing with an increase in temperature, and an electrode portion provided inside both longitudinal ends of the substrate, the electrode portion for supplying power to the substrate, and the longitudinal direction of the substrate A heating member having an insulating layer provided in a central portion in the direction, a supporting member for supporting the heating member, and a flexible member that moves while being in contact with the insulating layer and is in contact with the insulating layer. An image heating apparatus that heats an image carried by a recording material with the heat of the heating member via the flexible member, and a flexible member having a base layer.
An image heating apparatus, wherein both end surfaces of the insulating layer on the surface in contact with the flexible member are covered with the support member at both end surfaces in a short direction perpendicular to the longitudinal direction of the substrate.
前記支持部材は、前記基板の長手方向と直交する短手方向の中心線に向けて張り出すオーバーラップ部を有し、前記オーバーラップ部で前記絶縁層の前記可撓性部材と接触する表面における前記基板の長手方向と直交する短手方向の両端面を覆うことを特徴とする請求項1に記載の像加熱装置。   The support member has an overlap portion that protrudes toward a center line in a short direction perpendicular to the longitudinal direction of the substrate, and the support member has a surface that contacts the flexible member of the insulating layer at the overlap portion. The image heating apparatus according to claim 1, wherein both end faces in a short direction perpendicular to the longitudinal direction of the substrate are covered. 通電により発熱し温度の上昇に伴い抵抗値が下がる特性を有する細長い基板と前記基板の長手方向両端部の内側に設けられた電極部であり前記基板に給電するための電極部と前記基板の長手方向中央部に設けられた絶縁層とを有する加熱部材と、前記加熱部材を支持する支持部材と、前記絶縁層と接触しつつ移動する可撓性部材であり前記絶縁層と接触する導電性の基層を有する可撓性部材と、を有し、記録材が担持する画像を前記可撓性部材を介して前記加熱部材の熱で加熱する像加熱装置において、
前記支持部材に前記加熱部材を支持させるために前記支持部材に取り付けられる部材)を有し、前記絶縁層の前記可撓性部材と接触する表面における前記基板の長手方向と直交する短手方向の両端面を前記部材で覆うことを特徴とする像加熱装置。
An elongated substrate having a characteristic of generating heat when energized and having a resistance value decreasing with an increase in temperature, and an electrode portion provided inside both longitudinal ends of the substrate, the electrode portion for supplying power to the substrate, and the longitudinal direction of the substrate A heating member having an insulating layer provided in a central portion in the direction, a supporting member for supporting the heating member, and a flexible member that moves while being in contact with the insulating layer and is in contact with the insulating layer. An image heating apparatus that heats an image carried by a recording material with the heat of the heating member via the flexible member, and a flexible member having a base layer.
A member attached to the support member for supporting the heating member on the support member, and in a short direction perpendicular to the longitudinal direction of the substrate on the surface of the insulating layer in contact with the flexible member. An image heating apparatus, wherein both end faces are covered with the member.
前記部材は、前記基板の長手方向と直交する短手方向の中心線に向けて張り出すオーバーラップ部と、前記オーバーラップ部間に前記絶縁層の前記可撓性部材と接触する表面を表出させるための開口部と、を有し、前記支持部材に取り付けられた際に前記オーバーラップ部で前記絶縁層の前記可撓性部材と接触する表面における前記基板の長手方向と直交する短手方向の両端面を覆うことを特徴とする請求項3に記載の像加熱装置。   The member exposes an overlap portion that projects toward a center line in a short direction perpendicular to the longitudinal direction of the substrate, and a surface that contacts the flexible member of the insulating layer between the overlap portions. A short direction perpendicular to the longitudinal direction of the substrate on the surface of the insulating layer that contacts the flexible member at the overlap portion when attached to the support member. The image heating apparatus according to claim 3, wherein both end faces of the image heating apparatus are covered. 前記基板の材料は、セラミックス抵抗発熱体であることを特徴とする請求項1又は請求項3に記載の像加熱装置。   The image heating apparatus according to claim 1, wherein the material of the substrate is a ceramic resistance heating element. 前記基板の材料は、炭化ケイ素質発熱体であることを特徴とする請求項1又は請求項3に記載の像加熱装置。   The image heating apparatus according to claim 1, wherein a material of the substrate is a silicon carbide heating element. 前記基板の抵抗温度係数は25℃から250℃の範囲において負であることを特徴とする請求項1又は請求項3に記載の像加熱装置。   The image heating apparatus according to claim 1 or 3, wherein the temperature coefficient of resistance of the substrate is negative in a range of 25 ° C to 250 ° C.
JP2010005702A 2010-01-14 2010-01-14 Image heating device Pending JP2011145455A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103186086A (en) * 2011-12-27 2013-07-03 株式会社理光 Fixing device and image forming device
JP2017116571A (en) * 2015-12-21 2017-06-29 株式会社リコー Fixing device and image forming apparatus
US11991790B2 (en) 2020-01-29 2024-05-21 Brother Kogyo Kabushiki Kaisha Fuser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103186086A (en) * 2011-12-27 2013-07-03 株式会社理光 Fixing device and image forming device
US9367010B2 (en) 2011-12-27 2016-06-14 Ricoii Company, Limited Fixing device and image forming device
JP2017116571A (en) * 2015-12-21 2017-06-29 株式会社リコー Fixing device and image forming apparatus
US11991790B2 (en) 2020-01-29 2024-05-21 Brother Kogyo Kabushiki Kaisha Fuser

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