JP2011145165A - Magnetic detection element, rotation angle detector using the same, and stroke detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic detection element reducing output fluctuation produced by piezoelectricity effect. <P>SOLUTION: In a magnetic detection element 11, a die lead 51 and each lead are arranged on a base flat plane S, and a first chip 201 and a second chip 202 are diphycercally arranged on the base flat plane S. Thereby, thermal expansion or thermal shrinkage of components thereof are symmetrically generated on the base flat plane S, and warpage of the whole magnetic detection element 11 in the thickness Z direction is suppressed. Therefore, stress applied to the chips 201 and 202 can be reduced, and detection error with output fluctuation produced by piezoelectricity effect can be reduced. Use of the magnetic detection element 11 for a rotation angle detector and stroke detector eliminates the need for the device to include a temperature characteristic compensation means for compensating influence of piezoelectricity effect. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a magnetic detection device mounted on a substrate, a terminal, or the like as a semiconductor package, a rotation angle device that detects the rotation angle of the rotating body using the same, and a stroke amount of the linear moving body using the same. The present invention relates to a stroke amount detection device to be detected.

  Patent Document 1 discloses a rotation angle detection device that detects a rotation angle of a rotating body using a magnet and a magnetic detection element. In this apparatus, a Hall IC in which a semiconductor chip in which a Hall element, an amplifier circuit and the like are integrated is molded with a resin as a semiconductor package is used as a magnetic detection element. Inside the semiconductor package, the chip is mounted on a lead frame, and the input terminal, the output terminal, and the ground terminal of the chip are electrically connected to the lead frame by wire bonding or the like.

  Patent Document 2 discloses a temperature characteristic correction method for a rotation angle detection device. The Hall IC has a DSP as a correction means and an EEPROM as a storage medium. The DSP performs correction using a temperature characteristic correction value stored in the EEPROM according to the magnetic flux density. Thereby, the output fluctuation | variation with respect to a temperature change is reduced.

  Patent Document 3 discloses a semiconductor package in which the thermal stress of a semiconductor chip is reduced. In this semiconductor package, in addition to (1) the substrate and (2) chip, (3) a dummy chip and (4) a metal layer are laminated and embedded in this order in the mold resin layer. Here, (1) the substrate and (4) the metal layer, and (2) the chip and (3) the dummy chip are each made of a material having an approximate thermal expansion coefficient. Warpage, deformation, etc. are reduced.

JP 2007-298364 A JP 2007-155516 A JP 2004-363187 A

In Patent Document 1, a chip of a magnetic detection element is mounted on a lead, and the stress applied to the chip changes at low and high temperatures due to the difference in thermal expansion coefficient between the chip and the lead. Then, an output fluctuation proportional to the stress applied to the chip occurs due to the piezoelectric effect (piezo effect) of the magnetic detection element, so that a detection error occurs.
In particular, when the magnetic detection element is used for automobiles, it is necessary to assume a wide temperature range of −40 ° C. to 150 ° C. as a use environment. The error is insignificant.

  Therefore, as in Patent Document 2, it is necessary to correct the temperature characteristics in the circuit for each magnetic detection element. However, there is a problem that a complicated correction circuit is required and man-hours for correction are generated. This problem is not limited to the rotation angle detection device, but also applies to the stroke amount detection device that detects the stroke amount of the linear moving body.

Further, the semiconductor package of Patent Document 3 is limited in expansion and contraction due to temperature change when the substrate is fixed to a printed circuit board or the like even though the thermal stress balance can be achieved as a single package. Since the uppermost metal layer freely expands and contracts, there is a problem that distortion occurs in the chip between the substrate and the metal layer.
Furthermore, since it consists of four-layer components including a dummy chip and a metal layer, there is a problem that the number of parts increases and the cost increases.

The present invention has been made in view of the above problems, and can reduce detection errors associated with output fluctuations caused by the piezoelectric effect by reducing stress due to thermal expansion or contraction without increasing the number of parts. An object is to provide an element.
It is another object of the present invention to provide a rotation angle detection device and a stroke amount detection device that do not require temperature characteristic correction means for compensating for the influence of the piezoelectric effect by using this magnetic detection element.

The magnetic detection element according to claim 1 has a central plane that is unlikely to be distorted when thermally expanded or contracted as a “reference plane”. Specifically, for example, if the magnetic detection element has a rectangular parallelepiped shape, a plane passing through the center in the thickness direction becomes the reference plane. With the following configuration, when the magnetic detection element thermally expands or contracts, distortion hardly occurs on the reference plane.
The magnetic detection element includes the components (a) to (d). Here, “:” and the following components will be described.
(A) Mold resin layer: formed by embedding the first chip, the second chip, and the die lead. Specifically, the first chip, the second chip, and the die lead are formed by insert resin molding.
(B) Die lead: Arranged so that the center in the thickness direction coincides with the reference plane.
(C-1) First chip: Mounted on the die lead on one side with respect to the reference plane. It has a power supply terminal, an output terminal, and a ground terminal, detects magnetism, and outputs an electrical signal.
(C-2) Second chip: mounted on the die lead on the other side at a position symmetrical with respect to the reference plane. It has a power supply terminal, an output terminal, and a ground terminal, detects magnetism, and outputs an electrical signal.
(D) A plurality of leads: disposed outside the die leads on the reference plane. The first chip and the second chip are electrically connected to correspond to the power supply terminal, the output terminal, and the ground terminal. It is conductive.

  With the above configuration, the die lead and the lead are arranged symmetrically on the reference plane, and the first chip and the second chip are symmetrically arranged above and below the reference plane. Therefore, the warp in the thickness direction can be suppressed as a whole of the magnetic detection element. Therefore, the stress applied to the chip can be reduced, and the detection error accompanying the output fluctuation caused by the piezoelectric effect can be reduced.

  In Patent Document 3, four layers of components are used for one chip for the purpose of reducing thermal stress, whereas the present invention is configured of three layers including die leads for two chips. . Therefore, the number of parts is small, the cost can be suppressed, and two outputs can be obtained with one magnetic detection element. By obtaining two outputs, two systems of magnetic detection functions can be integrated, or one chip can be used as a backup in case of failure.

In the magnetic detection element according to the second and third aspects, the attributes of the die lead and the relationship between the die lead and the lead in the magnetic detection element according to the first aspect are limited.
In the magnetic detection element according to claim 2, the die lead is electrically conductive. The ground terminals of the first chip and the second chip are electrically connected to the die lead. The lead corresponding to the ground terminal is formed integrally with the die lead. On the other hand, the leads corresponding to the power supply terminal and the output terminal of the first chip and the second chip are formed separately from the die lead, and both are electrically connected to the power supply terminal and the output terminal by wire bonding.

Specifically, in each chip, a ground surface as a ground terminal is formed to be exposed on a bottom surface that is a contact surface with the die lead. The ground surface and the die lead are bonded together with a conductive adhesive to be electrically connected.
The die lead is formed integrally with the ground lead. That is, a die lead is cut out from a single copper plate in a shape including the ground lead portion. By doing in this way, at the time of resin molding, a ground lead part which is not molded can be supported and die lead can be positioned, and it is convenient on manufacture.

  In the magnetic detection element according to claim 3, each of the plurality of leads is formed separately from the die lead. The power supply terminals, output terminals, and ground terminals of the first chip and the second chip are all electrically connected to the leads corresponding to the terminals by wire bonding.

  In this configuration, the function of the die lead is only to mount a chip, and it does not matter whether it is conductive or non-conductive. Since three sets of terminals and leads per chip are uniformly connected by wire bonding, the configuration is simple.

The magnetic detection elements according to the fourth and fifth aspects show the connection relationship between each terminal of the chip and the lead in the magnetic detection element according to any one of the above claims.
In the magnetic detection element according to claim 4, the power supply terminals, the output terminals, and the ground terminals of the first chip and the second chip are all connected to the same number of leads as the terminals in a one-to-one correspondence. The

In this configuration, since the first chip and the second chip are electrically connected completely independently, even if one of them fails, the other is not affected. That is, it has excellent fail properties.
In addition, the three leads for the first chip are arranged on one side of the package and the three leads for the second chip are arranged on the other side of the package, and all the leads are bent in a direction perpendicular to the reference plane. Therefore, it is suitable for mounting on a substrate. When mounted in this way, since the two chips are mounted in an overlapping manner, the substantial device mounting area can be reduced, and the mountability is improved.

  In the magnetic detection element according to claim 5, at least one of the power terminal of the first chip and the power terminal of the second chip, or the ground terminal of the first chip and the ground terminal of the second chip corresponds to the terminal. Share the leads you want to use.

In this configuration, since the first chip and the second chip share some leads, the number of leads can be reduced.
Further, by arranging all the leads on one side of the package, it is suitable for mounting of the through-hole type in the form of standing the package. In this case, the element mounting area can be reduced, and the mountability is improved.

The rotation angle detection device according to claim 6 includes: a magnet that rotates integrally with a rotating body; and the magnetic detection element according to claim 1 that detects a change in a magnetic field generated by the magnet. And detecting the rotation angle of the rotating body.
The stroke amount detection device according to claim 7 detects a change of a magnetic field generated by the magnet that linearly moves integrally with the linear moving body, and a magnetic detection element according to any one of claims 1 to 5. The stroke amount of the linear moving body is detected.

  By using the magnetic detection element of the present invention in the rotation angle detection device and the stroke amount detection device, the detection accuracy can be improved without requiring a temperature characteristic correction means for compensating for the influence of the piezoelectric effect.

It is a cross-sectional schematic diagram of the thickness direction of the magnetic detection element of 1st Embodiment of this invention. (A): It is A arrow view of FIG. (B): It is a B arrow view of FIG. It is a cross-sectional schematic diagram of the thickness direction of the magnetic detection element of 2nd Embodiment of this invention. (A): It is a D arrow line view of FIG. (B): It is an E arrow line view of FIG. (A): It is a schematic diagram which shows the state which mounted the magnetic detection element of 2nd Embodiment of this invention on the board | substrate. (B): It is a schematic diagram which shows the state which welded the magnetic detection element of 2nd Embodiment of this invention to the terminal. It is a cross-sectional schematic diagram of the thickness direction of the magnetic detection element of 3rd Embodiment of this invention. (A): It is a G arrow line view of FIG. (B): It is a H arrow line view of FIG. (A): It is a schematic diagram which shows the state which used the magnetic detection element of 3rd Embodiment of this invention as a through-hole type. (B): It is a schematic diagram which shows the state which welded the magnetic detection element of 3rd Embodiment of this invention to the terminal. (A): It is sectional drawing of the thickness direction of the magnetic detection element of a comparative example. (B): It is explanatory drawing which shows the stress by the thermal expansion at the time of the high temperature of (a). (C): It is explanatory drawing which shows the stress by the thermal contraction at the time of the low temperature of (a). (A) It is a top view of the rotation angle detection apparatus of 4th Embodiment using the magnetic detection element of 2nd Embodiment of this invention. (B): It is JJ sectional drawing of (a). (A) It is a top view of the rotation angle detection apparatus of 5th Embodiment using the magnetic detection element of 3rd Embodiment of this invention. (B): It is KK sectional drawing of (a). (A) It is a top view of the rotation angle detection apparatus of 6th Embodiment using the magnetic detection element of 2nd Embodiment of this invention. (B): It is LL sectional drawing of (a). (A) It is a top view of the rotation angle detection apparatus of 7th Embodiment using the magnetic detection element of 3rd Embodiment of this invention. (B): It is MM sectional drawing of (a). (A) It is a top view of the stroke amount detection apparatus of 8th Embodiment using the magnetic detection element of 2nd Embodiment of this invention. (B): It is PP sectional drawing of (a). (A) It is a top view of the stroke amount detection apparatus of 9th Embodiment using the magnetic detection element of 3rd Embodiment of this invention. (B): It is QQ sectional drawing of (a).

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a schematic cross-sectional view in the thickness direction of the magnetic detection element 11 according to the first embodiment of the present invention, and is a cross-sectional view taken along the line CC in FIG. 2A is a view as viewed from the arrow A in FIG. 1, and FIG. 2B is a view as viewed from the arrow B in FIG.
The magnetic detection element 11 has a rectangular parallelepiped shape having a width X, a depth Y, and a thickness Z. The thickness Z is shorter than the width X and the depth Y. A plane passing through the center in the thickness Z direction is defined as a “reference plane S”. The reference plane S is a plane that is offset in parallel by (Z / 2) from one end face in the thickness Z direction.
The die lead 51 is arranged so that the center in the thickness direction coincides with the reference plane S. A first chip 201 is mounted on the upper side of the die lead 51, and a second chip 202 is mounted on the lower side of the die lead 51, and is embedded in the mold resin layer 15.
Specifically, the first chip 201 and the second chip are semiconductor chips in which Hall elements, amplifier circuits, and the like are integrated. The Hall element may be a magnetoresistive element.

  The die lead 51 is formed from a copper plate and is conductive. Further, in the first chip 201 and the second chip 202, the ground surface 21 as a ground terminal is exposed and formed on the bottom surface that is a contact surface with the die lead 51. The ground surface 21 and the die lead 51 are bonded together by the conductive adhesive 22 and are electrically connected. The conductive adhesive 22 is a paste-like adhesive in which metal particles such as silver are mixed.

  The die lead 51 is formed integrally with the ground lead. That is, the die lead 51 is cut out from a single copper plate in a shape including the ground lead portion. By doing in this way, in the case of resin molding, the die lead 51 can be positioned by supporting the ungrounded ground lead portion, which is convenient for manufacturing.

The other leads, that is, the first power supply lead 411, the first output lead 421, the second power supply lead 412, and the second output lead 422 are separated from the die lead 51 and arranged on the reference plane S.
The power supply terminal 31 and the output terminal 32 of the first chip 201 are connected to the first power supply lead 411 and the first output lead 421 by bonding wires 55, respectively. The power supply terminal 31 and the output terminal 32 of the second chip 202 are connected to the second power supply lead 412 and the second output lead 422 by bonding wires 55, respectively.

  With the above configuration, the die lead 51 and each lead are arranged on the reference plane S, and the first chip 201 and the second chip 202 are arranged symmetrically above and below the reference plane S. Occurs at the same level above and below the reference plane S, and the warp in the thickness Z direction can be suppressed as a whole of the magnetic detection element 11. Therefore, the stress applied to the chips 201 and 202 can be reduced, and detection errors accompanying output fluctuations caused by the piezoelectric effect can be reduced.

  In addition, since the two chips 201 and 202 are composed of three layers including the die lead 51, the number of components is small, the cost can be suppressed, and two outputs can be obtained by one magnetic detection element 11. By obtaining two outputs, two systems of magnetic detection functions can be integrated, or one chip can be used as a backup in case of failure.

(Second Embodiment)
FIG. 3 is a schematic cross-sectional view in the thickness direction of the magnetic detection element 11 according to the second embodiment of the present invention, and is a cross-sectional view taken along line FF in FIG. 4A is a view as viewed from an arrow D in FIG. 3, and FIG. 4B is a view as viewed from an arrow E in FIG.
As in the first embodiment, the magnetic detection element 11 has a rectangular parallelepiped shape having a width X, a depth Y, and a thickness Z. The thickness Z is shorter than the width X and the depth Y. The die lead 52 is disposed so that the center in the thickness direction coincides with the reference plane S. A first chip 201 is mounted on the upper side of the die lead 52, and a second chip 202 is mounted on the lower side of the die lead 52, and is embedded in the mold resin layer 15.
Therefore, also in the second embodiment, the thermal expansion or contraction of the component parts occurs to the same extent above and below the reference plane S, and the warp in the thickness Z direction can be suppressed as the entire magnetic detection element 11. Therefore, the stress applied to the chips 201 and 202 can be reduced, and detection errors accompanying output fluctuations caused by the piezoelectric effect can be reduced.

Unlike the first embodiment, the die lead 52 may be conductive or non-conductive. The first chip 201 and the second chip 202 are not energized at the contact surface with the die lead 52.
In addition, all the leads, that is, the first power supply lead 411, the first output lead 421, the first ground lead 431, the second power supply lead 412, the second output lead 422, and the second ground lead 432 are connected to the die lead 52. They are separated and arranged on the reference plane S.
The power supply terminal 31, the output terminal 32, and the ground terminal 33 of the first chip 201 are connected to the first power supply lead 411, the first output lead 421, and the first ground lead 431 by bonding wires 55, respectively. The power supply terminal 31, the output terminal 32, and the ground terminal 33 of the second chip 202 are connected to the second power supply lead 412, the second output lead 422, and the second ground lead 432 by bonding wires 55, respectively. .
Thus, since the first chip 201 and the second chip 202 are electrically connected completely independently, even if one fails, the other is not affected. That is, it has excellent fail properties.

Also, the three leads 411, 421, 431 for the first chip 201 are arranged on the right side of the figure, and the three leads 412, 422, 432 for the second chip 202 are arranged on the left side of the figure. All these leads are bent in the direction perpendicular to the reference plane S and to the lower side of the figure.
FIG. 5A is a schematic diagram illustrating a state where the magnetic detection element 11 according to the second embodiment is mounted on the substrate 12. Each lead bent downward is soldered to the surface of the substrate 12, and the magnetic detection element 11 is mounted on the substrate 12. FIG. 5B is a schematic diagram showing a state in which the magnetic detection element 11 of the second embodiment is welded to the terminal 13. Here, “welding” refers to electric welding. In the figure, the “*” mark at the joint between the lead and the terminal indicates the welding location. When soldering or welding is performed as described above, the two chips 201 and 202 are mounted so as to overlap each other, so that a substantial element mounting area can be reduced and mountability is improved.

(Third embodiment)
FIG. 6 is a schematic cross-sectional view in the thickness direction of the magnetic detection element 11 according to the third embodiment of the present invention, and is a cross-sectional view taken along the line II in FIG. FIG. 7A is a view taken in the direction of arrow G in FIG. 6, and FIG. 7B is a view taken in the direction of arrow H in FIG.
As in the first embodiment, the magnetic detection element 11 has a rectangular parallelepiped shape having a width X, a depth Y, and a thickness Z. The thickness Z is shorter than the width X and the depth Y. The die lead 52 is disposed so that the center in the thickness direction coincides with the reference plane S. A first chip 201 is mounted on the upper side of the die lead 52, and a second chip 202 is mounted on the lower side of the die lead 52, and is embedded in the mold resin layer 15.
Therefore, also in the third embodiment, the thermal expansion or contraction of the component parts occurs to the same extent above and below the reference plane S, and the warp in the thickness Z direction can be suppressed as a whole of the magnetic detection element 11. Therefore, the stress applied to the chips 201 and 202 can be reduced, and detection errors accompanying output fluctuations caused by the piezoelectric effect can be reduced.
Similarly to the second embodiment, the first chip 201 and the second chip 202 are not energized on the contact surface with the die lead 52, and all the leads are separated from the die lead 52 and arranged on the reference plane S.

Unlike the second embodiment, the power supply terminal 31 of the first chip 201 and the power supply terminal 31 of the second chip 202 are connected to the common power supply lead 410, the ground terminal 33 of the first chip 201, and the ground terminal of the second chip 202. 33 is connected to a common common ground lead 430 by a bonding wire 55.
As for the output terminal, as in the second embodiment, the output terminal 32 of the first chip 201 is connected to the first output lead 421, and the output terminal 32 of the second chip 202 is connected to the second output lead 422 by the bonding wire 55. Connected.
Thus, the first chip 201 and the second chip 202 share some leads, so the number of leads can be reduced.

Also, the four leads 410, 421, 422, 430 are all arranged on the right side of the figure, and are longer than the second embodiment and extend straight.
FIG. 8A is a schematic diagram showing a state in which the magnetic detection element 11 of the third embodiment is mounted on the substrate 12 as a through-hole type. Each lead passes through a hole in the substrate 12, is soldered at the base, and is mounted on the substrate 12 in a form in which the magnetic detection element 11 is erected. FIG. 8B is a schematic diagram showing a state in which the magnetic detection element 11 of the third embodiment is welded to the terminal 13. As in FIG. 5 (b), the “*” mark at the joint between the lead and the terminal indicates the weld location. Even when soldering or welding is performed as described above, the element mounting area can be reduced, and the mountability is improved.

(Comparative example)
Here, a package in which a chip is arranged on one side of a lead will be described as a comparative example.
FIG. 9A is a cross-sectional view in the thickness direction of the magnetic detection element 61 at normal temperature. The chip 62 is mounted on the lead 63 and embedded in the mold resin layer 65 to form a package. The length of the lead 63 is L _0. Illustration of wire bonding is omitted.
The main material of the chip 62 is silicon (Si), the material of the lead 63 is copper (Cu), and the material of the mold resin layer 65 is epoxy resin. The thermal expansion coefficients of these materials are as follows.
Si: 4.5 × 10 ⁻⁶ (1 / K)
Cu: 18 × 10 ⁻⁶ (1 / K)
Epoxy resin: 9 × 10 ⁻⁶ (1 / K)

  FIG. 9B is an explanatory diagram showing stress due to thermal expansion at a high temperature. The length of the lead 63 is increased by ΔL1 from L0 to L1 due to thermal expansion. For example, when the lead 63 is 10 mm and the temperature difference is 100 ° C., the lead 63 extends about 0.02 mm. Since the extension of the chip 62 is smaller than the extension of the lead 63, the upper side of the magnetic detection element 61 warps in a concave shape as shown in the figure. At this time, the stress σx1 in the pulling direction is applied to the chip 62.

FIG. 9C is an explanatory diagram showing stress due to thermal shrinkage at a low temperature. The length of the lead 63 is reduced by ΔL2 from L0 to L2 due to thermal expansion. Since the contraction of the chip 62 is smaller than the contraction of the lead 63, the upper side of the magnetic detection element 61 warps in a convex shape as shown in the figure. At this time, the stress σx2 in the compression direction is applied to the chip 62.
When stress is applied to the chip 62 in this way, an output fluctuation proportional to the applied stress occurs due to the piezoelectric effect (piezo effect), so that a detection error occurs.

(4th, 5th embodiment of a rotation angle detection apparatus)
FIG. 10A is a plan view of the rotation angle detection device of the fourth embodiment using the magnetic detection element of the second embodiment of the present invention, and FIG. 10B is a diagram of J in FIG. -J sectional drawing. The same applies when the magnetic detection element of the first embodiment is used instead of the second embodiment.
FIG. 11A is a plan view of the rotation angle detection device of the fifth embodiment using the magnetic detection element of the third embodiment of the present invention, and FIG. 11B is K in FIG. 11A. It is -K sectional drawing.

  The rotation angle detection device 90 is a device that detects the rotation angle of a rotating body that is a detection target, such as a throttle device that adjusts the intake air amount. The rotation angle detection device 90 includes a rotor core 91, a permanent magnet 92, and a magnetic detection element 11. The cylindrical rotor core 91 rotates together with a rotating body that is a detection target. Two permanent magnets 92 are attached to the opposite side of the rotor core 91 in the radial direction, and rotate integrally with the rotor core 91. The magnetic detection element 11 is installed on the inner peripheral side of the rotor core 91, and detects the rotation angle of the rotating body by detecting a change in the magnetic field of the permanent magnet 92 accompanying the rotation of the rotor core 91.

Conventionally, when the environmental temperature of the rotation angle detection device 90 changes greatly, thermal stress is applied to the chip in the magnetic detection element, and output fluctuation occurs due to the piezoelectric effect. Therefore, it is necessary to use temperature characteristic correction means. It was.
On the other hand, since the magnetic detection element 11 of the present invention can reduce thermal stress and output fluctuation caused by the piezoelectric effect, it is not necessary to use temperature characteristic correction means in the rotation angle detection device 90 using this. Therefore, it is possible to eliminate complicated correction circuits and man-hours for correction.

  In the fourth embodiment, an installation space for the magnetic detection element 11 is required in the radial direction of the rotation angle detection device, whereas in the fifth embodiment, an installation space is required in the axial direction of the rotation angle detection device. Therefore, when selecting the embodiment, the size and shape of the rotation angle detection device are also taken into consideration.

(6th, 7th embodiment of a rotation angle detection apparatus)
FIG. 12A is a plan view of a rotation angle detection device of the sixth embodiment using the magnetic detection element of the second embodiment of the present invention, and FIG. It is -L sectional drawing. The same applies when the magnetic detection element of the first embodiment is used instead of the second embodiment.
FIG. 13A is a plan view of the rotation angle detection device of the seventh embodiment using the magnetic detection element of the third embodiment of the present invention, and FIG. 13B is M of FIG. 13A. FIG.
In the rotation angle detection device 95, the permanent magnet 96 is a detection target by a link means (not shown) in a plane that is arranged immediately above the magnetic detection element 11 and parallel to the paper surface of FIG. 12 (a) or FIG. 13 (a). It rotates with the rotating body. The magnetic detection element 11 detects the rotation angle of the rotating body by detecting a change in the magnetic field of the permanent magnet 96.
Also in this case, the same effect as the fourth and fifth embodiments can be obtained.

(Eighth and ninth embodiments of stroke amount detection device)
FIG. 14A is a plan view of a stroke amount detection device according to the eighth embodiment using the magnetic detection element according to the second embodiment of the present invention, and FIG. 14B is a plan view of FIG. It is -P sectional drawing. The same applies when the magnetic detection element of the first embodiment is used instead of the second embodiment.
FIG. 15A is a plan view of the stroke amount detection device of the ninth embodiment using the magnetic detection element of the third embodiment of the present invention, and FIG. It is -Q sectional drawing.

  The stroke amount detection device 97 is a device that detects the stroke amount of the linear moving body that is the detection target. In the stroke amount detection device 97, the permanent magnet 96 is disposed immediately above the magnetic detection element 11, and is detected by link means (not shown) in a plane parallel to the paper surface of FIG. 14 (a) or FIG. 15 (a). It moves linearly with the linear moving body. The magnetic detection element 11 detects the stroke of the linear moving body by detecting a change in the magnetic field of the permanent magnet 96.

  Also in the stroke amount detection device 97, the magnetic detection element 11 of the present invention can reduce the thermal stress and reduce the output fluctuation caused by the piezoelectric effect. The need to use correction means can be eliminated.

As mentioned above, this invention is not limited to such embodiment, In the range which does not deviate from the meaning of invention, it can implement with a various form.
For example, the shape of the magnetic detection element 11 is not limited to a rectangular parallelepiped, and may be any shape that is symmetric with respect to the reference plane.

  11: Magnetic detection element, 12: Substrate, 13: Terminal, 15: Mold resin layer, 201: First chip, 202: Second chip, 21: Ground plane (ground terminal), 22: Conductive adhesive, 31: Power supply terminal, 32: output terminal, 33: ground terminal, 410: common power supply lead, 411: first power supply lead, 412: second power supply lead, 421: first output lead, 422: second output lead, 430: common Ground lead, 431: First ground lead, 432: Second ground lead, 51, 52: Die lead, 55: Bonding wire, 90, 95: Rotation angle detector, 91: Rotor core, 92, 96: Permanent magnet, 97: Stroke amount detection device

Claims (7)

A magnetic detection element in which the first chip, the second chip, and the die lead are molded by insert resin,
When the magnetic sensing element is thermally expanded or contracted, it has a central plane that is not easily distorted as a reference plane,
A mold resin layer formed by embedding the first chip, the second chip, and the die lead;
A plate-like die lead disposed so that the center in the thickness direction coincides with the reference plane;
A first chip mounted on the die lead on one side with respect to the reference plane, having a power terminal, an output terminal, and a ground terminal, for detecting magnetism and outputting an electrical signal;
A second chip mounted on the die lead on the other side at a position symmetric with respect to the reference plane, having a power supply terminal, an output terminal, and a ground terminal, detecting a magnetism and outputting an electric signal;
A plurality of conductive leads disposed outside the die lead on the reference plane and electrically connected to the power supply terminal, the output terminal, and the ground terminal of the first chip and the second chip; ,
A magnetic detection element comprising: The die lead is electrically conductive, and ground terminals of the first chip and the second chip are electrically connected to the die lead;
The lead corresponding to the ground terminal is formed integrally with the die lead,
The leads corresponding to the power supply terminal and the output terminal of the first chip and the second chip are formed separately from the die lead, and both are electrically connected to the power supply terminal and the output terminal by wire bonding. The magnetic detection element according to claim 1, wherein the magnetic detection element is a magnetic detection element. Each of the plurality of leads is formed separately from the die lead,
The power supply terminal, the output terminal, and the ground terminal of the first chip and the second chip and the leads corresponding to the terminals are all electrically connected by wire bonding. Item 2. The magnetic detection element according to Item 1.   The power supply terminal, the output terminal, and the ground terminal of the first chip and the second chip are all connected to the same number of leads as the terminals in a one-to-one correspondence. The magnetic detection element as described in any one of 1-3. At least one of the power terminal of the first chip and the power terminal of the second chip, or the ground terminal of the first chip and the ground terminal of the second chip,
The magnetic detection element according to claim 1, wherein the lead corresponding to each terminal is shared. A rotation angle detection device for detecting a rotation angle of a rotating body,
A magnet that rotates integrally with the rotating body;
The magnetic detection element according to any one of claims 1 to 5, which detects a change in a magnetic field generated by the magnet.
A rotation angle detection device comprising: A stroke amount detection device for detecting a stroke amount of a linear moving body,
A magnet that linearly moves together with the linear moving body;
The magnetic detection element according to any one of claims 1 to 5, which detects a change in a magnetic field generated by the magnet.
A stroke amount detection device comprising:

Images