JP2011132595A - Method for manufacturing resin-molded article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inexpensively manufacture a resin-molded article which is formed from a thermoplastic resin such as a polypropylene-based resin and has a metal film superior in adhesiveness formed thereon without using an etchant which gives a heavy load to the environment. <P>SOLUTION: The method for manufacturing the resin-molded article includes: a step of applying an electroconductive material to a porous sheet formed from the thermoplastic resin having a porous layer at least on one face side; and a step of treating the surface of the porous sheet having the porous layer to which the electroconductive material has been applied, with an electrochemical technique. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for producing a resin molded product. In particular, the present invention relates to a method for producing a resin molded product in which electrolytic plating or electrodeposition coating is applied to the surface of a porous sheet made of a thermoplastic resin.

  The needs for plating treatment and electrodeposition coating treatment on resin molded products for the purpose of decoration and functionality are extremely diverse. For example, in the field of automotive parts, resin molded products in which a metal film is formed on the surface by plating or electrodeposition coating on a resin molded product made of a thermoplastic resin are used to improve aesthetics and reduce weight. ing. When forming such a metal film, a base plating film is generally formed by an electroless plating method, and a non-conductor resin molded product is made conductive, and then subjected to electrochemical processes such as electrolytic plating and electrodeposition coating. Surface treatment by the technique is performed.

  The electroless plating method includes a cleaning process (eg, degreasing), an etching process, a neutralization process, a catalyst application process, a catalyst activation process, and an electroless plating process, and the catalyst applied in the catalyst application process. The adhesion of the final metal film is ensured by forming a structure in which the plating film is firmly attached to the inside of the surface of the resin molded product, which is the object to be plated, and the plating film is rooted in the resin molded product. It is necessary to do. Therefore, in the above etching process, the surface of the resin molded product is roughened by using an etching solution containing an oxidant having a large environmental load such as hexavalent chromic acid or permanganic acid, thereby forming irregularities on the surface of the resin molded product. is doing. Moreover, the resin molded product eroded by such an etching solution, that is, a resin molded product to which the electroless plating method can be applied is limited to a resin molded product containing an ABS resin. This is because the ABS resin contains a butadiene rubber component which is selectively corroded in the etching solution, the other resin is small components that are selectively eroded to such an etchant, the surface This is because unevenness is difficult to be formed. Therefore, when electroless plating is performed on resin molded products containing polycarbonate resin other than ABS resin as a resin component, plating grade products containing ABS resin and elastomer are used to enable electroless plating. ing. However, in such a plating grade product, deterioration of physical properties such as heat resistance of the main material cannot be avoided. Further, in automobile parts, in order to further reduce the weight from the viewpoint of energy saving, a method of surface-treating a resin molded product made of a resin that is lighter than an ABS resin (for example, a polypropylene resin) is required. Therefore, there is a demand for an alternative technique that can perform a surface treatment on a resin molded product by a method different from the conventional electroless plating method.

  On the other hand, a direct electroplating method (direct plating method) in which electroless plating is not performed has recently been proposed (for example, Patent Document 1). In this direct electrolytic plating method, after the surface of the resin molded product is roughened in the etching process, a catalyst such as palladium is adsorbed at a high concentration on the surface of the resin molded product in the catalyst application step and the activation step. In which the electroplating process is performed without conducting the electroless plating process. Therefore, greatly simplifying the number of steps, also it is possible to suppress the reduction in yield due to hard spots and roughness generated on the surface of the resin molded article in an electroless plating process.

JP 2008-31536 A

  However, the above-described conventional direct electroplating method has a problem that a large amount of palladium, which is an expensive rare metal, must be used to make the resin molded product conductive. Moreover, even in the direct electroplating method, it is necessary to roughen the surface using an etching solution in order to provide a catalyst, and it is an essential solution to the problem of environmental burden and the problem that the type of resin is limited. is not. In particular, since the surface of a thermoplastic resin other than the ABS resin is difficult to be roughened by the etching process, the physical anchoring effect between the metal film and the resin portion is lowered. As a result, when a resin molded product on which such a metal film with weak adhesion is formed is subjected to a heat cycle test involving thermal changes required for automobile parts, for example, the thermal expansion coefficient between the metal film and the resin part Due to the difference, there is a problem that peeling occurs at the interface.

  The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to use a thermoplastic resin such as a polypropylene resin in which a metal film having excellent adhesion is formed without using an etching solution having a large environmental load. It is providing the manufacturing method which manufactures the resin molded product which consists of resin cheaply.

The present invention includes a conductive material application step of applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
It is a manufacturing method of the resin molded product which has the surface treatment process which surface-treats the porous sheet by which the electroconductive material was provided to the said porous layer with an electrochemical method.

  According to the manufacturing method of the resin molded article, since the porous sheet conductive material having a porous layer is applied, without using an expensive palladium as a large etching solution and the catalyst environmental impact, porous sheet Can be made conductive. For this reason, the porous sheet provided with the conductive material can be directly surface-treated by an electrochemical method without performing an etching step or an electroless plating step. Further, the if the porous layer on a conductive material has been applied to the porous sheet by the surface treatment by an electrochemical technique, to grow the metal film from the inside of the porous layer, a metal film having excellent adhesion Since the porous layer functions not only as a buffer layer but also as a buffer layer, it is possible to suppress peeling at the interface between the metal film and the resin portion in the heat cycle test.

  In the above-described method for producing a resin molded product, after the conductive material application step and before the surface treatment step, further provided with a molding step of molding the porous layer on a conductive material is applied a porous sheet, The porous sheet in the surface treatment step may be a sheet formed in the forming step.

  Since the porous sheet of the present invention is made of a thermoplastic resin, it can be molded into an arbitrary shape by a molding process. Thereby, the aesthetics and functionality of the resin molded product can be improved.

The molding process is
A porous sheet provided with a conductive material in the porous layer is placed on a mold of an injection molding machine, and a molten resin is injected and filled into a cavity of the mold, and the porous sheet and the molten resin And an insert molding step of integrally molding so that the porous layer is exposed on one surface side.

  If the insert molding process is performed after the conductive material application process and before the surface treatment process, the porous sheet and the molten resin can be firmly and integrally molded, and the strength and functionality of the resin molded product can be improved. Can do.

  In the insert molding step, it is preferable that the porous sheet is disposed on the mold so that the porous layer faces the mold surface of the injection molding machine through a protective sheet.

  In the insert molding process, pressure is applied to the mold in order to integrally mold the porous sheet and the molten resin. For this reason, if the porous sheet is disposed on the mold so that the porous layer and the mold surface are in direct contact, the porous layer may be damaged. On the other hand, if the porous sheet is disposed on the mold so that the porous layer faces the mold surface of the injection molding machine through the protective sheet, the porous layer in such an insert molding process Breakage can be prevented.

In addition, the molding step is
The porous sheet may be disposed on a mold, and a vacuum / pressure forming step of forming the porous sheet by vacuum / pressure forming may be included.

  If the vacuum / pressure forming step is performed after the conductive material application step and before the surface treatment step, for example, a thin porous sheet can be easily formed into a predetermined shape.

Moreover, the manufacturing method of the resin molded product which has the said formation process is
After the conductive material application step and before the molding step,
A laminating step of laminating a porous sheet and a resin sheet provided with a conductive material on the porous layer so that the porous layer is exposed at least on one side;
The porous sheet in the forming step may be a sheet laminated in the laminating step.

  When an insert molding process or a vacuum / pressure forming process is provided, the porous sheet is likely to be deformed due to the pressure of the molten resin or pressurized air, but after the conductive material application process and before these molding processes, If the quality sheet and the resin sheet are laminated, deformation due to such pressure can be prevented. In the laminating process, because while pressure is applied to the surface of the porous sheet resin sheet is welded to the porous sheet, it is possible to reduce the opening formed in the surface of the porous layer, The porous surface can be flattened. For this reason, in a surface treatment process, it becomes difficult to detach | desorb an electroconductive material from a porous layer, and not only can a metal film with a higher anchoring effect be formed, but the surface of the metal film obtained can be planarized.

  The porous layer preferably has a continuous porous body communicating with the surface. If the porous layer has a continuous porous body communicating with the surface, not only can the conductive material be easily introduced into the surface of the porous sheet, but also the conductive material introduced into the continuous porous body is electrically connected. It becomes easy to do. As a result, the porous sheet can be highly electrified, with the metal film tends to grow after the surface treatment step, it is possible to form a metal film grown from the inside of the porous layer, high adhesion It is possible to uniformly form a metal film having

  The thermoplastic resin may contain a polypropylene resin. Polypropylene resins are generally known as resin materials that are difficult to plate. However, according to the method for producing a resin molded product of the present invention, a porous sheet can be made conductive simply by adding a conductive material to the porous layer. Can be Therefore, even if it is a porous sheet made of a resin material that is difficult to plate, a metal film having excellent adhesion can be directly formed by an electrochemical method without etching the surface. can do.

  The conductive material preferably contains at least one selected from the group consisting of carbon nanotubes, fullerenes, carbon nanohorns, carbon black, acetylene black, and graphite. These conductive materials are cheaper than palladium, and can sufficiently ensure the conductivity of the porous sheet when the surface treatment is performed by an electrochemical method.

  The conductive material is preferably chemically modified with a halogen atom-containing functional group. By chemically modifying the conductive material with a halogen atom-containing functional group, the conductive material can be charged with a negative charge. As a result, the conductive material is adsorbed on the outermost surface or inside of the porous layer not only by physical action such as catching of the conductive material but also by electrostatic interaction between the porous layer and the conductive material. be able to. As a result, the throwing power of the plating film can be improved in the surface treatment process.

  In the method for producing a resin molded product, a positive charging process step for charging the porous layer with a positive charge may be further provided before the conductive material application step. If the porous layer is positively charged, the conductive material can be adsorbed on the outermost surface or inside of the porous layer also by electrostatic interaction between the porous layer and the conductive material. In particular, when a conductive material chemically modified with a halogen atom-containing functional group is used, the electrostatic interaction between the porous layer and the conductive material becomes stronger, and further, the conductive material is electrically connected to the outermost surface or inside of the porous layer. The material can be adsorbed.

  As the surface treatment by the electrochemical method, electrolytic plating treatment or electrodeposition coating treatment can be used. According to the method for producing a resin molded product, since the porous sheet can be made conductive by applying a conductive material to the porous layer, the electroplating can be performed directly without performing electroless plating treatment. By performing the treatment or the electrodeposition coating treatment, a metal film can be formed on the surface of the porous sheet.

  As described above, according to the present invention, a resin molded product made of a thermoplastic resin such as a polypropylene resin on which a metal film having excellent adhesion is formed without using an etching solution having a large environmental load can be inexpensively produced. Can be manufactured.

FIG. 1 is an enlarged schematic cross-sectional view of a main part showing the state of a sheet in each manufacturing process of a manufacturing method according to Example 1 of the present invention. FIG. 1 (A) shows a conductive material applied by a conductive material application process. FIG. 1B shows a sheet laminated by a laminating process, FIG. 1C shows a sheet insert-molded by an insert molding process, and FIG. 1D shows a metal film formed by a surface treatment process. The formed sheet is shown. FIG. 2 is an enlarged schematic cross-sectional view showing the main part of the insert molding process according to the first embodiment of the present invention, and FIG. 2 (A) shows the state in which the sheet is placed on the mold. ) Shows a state in which molten resin is injected and filled in the cavity of the mold. FIG. 3 is an enlarged schematic cross-sectional view of the main part showing the state of the sheet in each manufacturing process of the manufacturing method according to Example 3 of the present invention, and FIG. 3 (A) shows a conductive material applied by the conductive material application process. FIG. 3B shows a sheet obtained by laminating the porous sheet, and FIG. 3C shows a sheet on which a metal film is formed by the surface treatment process. FIG. 4 is an enlarged schematic cross-sectional view of the main part showing the state of the vacuum / pressure forming process according to Example 3 of the present invention, and FIG. 4 (A) shows the state in which the sheet is arranged on the mold. FIG. 4B shows a state in which the sheet is vacuum-pressure formed with a mold, and FIG. 4C shows the formed sheet. FIG. 5: is a principal part expanded sectional schematic drawing which shows the state of the sheet | seat in each manufacturing process of the manufacturing method which concerns on Example 4 of this invention, FIG.5 (A) is a conductive material provision process by a conductive material provision process. 5B shows a sheet laminated by the laminating process, FIG. 5C shows a sheet insert-molded by the insert molding process, and FIG. 5D shows a metal film formed by the surface treatment process. The formed sheet is shown. FIG. 6 is a photograph of the surface of the porous sheet provided with the conductive material according to Example 4 of the present invention.

  In the method for producing a resin molded product according to the present embodiment, a porous sheet made of a thermoplastic resin having a porous layer on at least one side is brought into contact with a conductive material, and the conductive material is applied to the porous layer. A conductive material applying step of applying. By bringing the porous sheet having the porous layer into contact with the conductive material, the conductive material can be imparted to the porous layer. For this reason, the porous sheet can be made conductive without using expensive palladium as an etching solution or catalyst having a large environmental load. Thereby, the surface treatment of the porous sheet provided with the conductive material can be directly performed by an electrochemical method without performing an etching process or an electroless plating process. Further, the if the porous layer on a conductive material has been applied to the porous sheet by the surface treatment by an electrochemical technique, to grow the metal film from the inside of the porous layer, forming a metal film having a high adhesion In addition, since the porous layer functions as a buffer layer, peeling at the interface between the metal film and the resin portion can be suppressed even in the heat cycle test.

  The porous sheet may have a porous layer on one side, or may have a porous layer on both sides. Moreover, the porous sheet may be comprised only from the porous layer. Further, when the porous sheet having a porous layer on one side, underneath the porous layer, when the porous sheet having a porous layer on both sides, the porous interlayer, have a non-porous layer Also good. By providing the non-porous layer, the strength of the porous sheet can be increased, and thereby deformation of the porous sheet can be suppressed in the production method including a forming step. The porous layer preferably has a continuous porous body communicating with the surface. If the porous layer has a continuous porous body communicating with such a surface, when the porous sheet and the conductive material are brought into contact with each other, the conductive material can easily penetrate into the porous layer. Conductive materials that have entered the continuous porous body are likely to conduct each other. As a result, the porous sheet can be highly electrified, with the metal film tends to grow after the surface treatment step, it is possible to form a metal film grown from the inside of the porous layer, high adhesion It is possible to uniformly form a metal film having The thickness of the porous layer can be appropriately selected according to the target surface treatment, but is preferably 0.1 to 200 μm in order to introduce the conductive material into the porous layer. Preferably it is 50-200 micrometers. The thickness of the porous sheet is not particularly limited because it depends on the thickness of the porous layer or the non-porous layer, but is preferably 0.1 to 500 μm, more preferably 50 to 500 μm. Although the hole diameter of a porous layer can be suitably selected according to the kind and size of the electroconductive material to provide, Preferably it is 10 micrometers-1 mm.

  Such a porous sheet can be manufactured by, for example, a manufacturing method disclosed in JP2009-126881A. Specifically, a continuous porous body is obtained by mixing a thermoplastic resin composition and a nonionic surfactant, impregnating the mixture with a supercritical fluid, releasing pressure, and increasing the expansion ratio to 10 times or more. Can be obtained. In addition, in order to obtain the porous layer which has a continuous porous body in the outermost surface vicinity, you may perform a cutting process and a grinding process to the obtained porous sheet.

  As the resin material for the porous sheet, an amorphous or crystalline thermoplastic resin can be used. Specific examples of such thermoplastic resins include polypropylene resins; polyester resins; polyamide resins; polymethyl methacrylate resins; polycarbonate resins; polyetherimide resins; polyethylene terephthalate resins; Polymers; ABS resins; polyamideimide resins; polyphthalamide resins; polyphenylene sulfide resins; biodegradable plastics such as polylactic acid. Further, a composite material of these resins may be used. Furthermore, a resin material in which various inorganic fillers are kneaded with these resins can also be used. Among these, a porous sheet made of a thermoplastic resin containing a polypropylene resin, which is a general-purpose plastic, is preferable for cost reduction and weight reduction. In particular, a polypropylene resin is generally known as a resin material that is difficult to be plated. However, according to the method for producing a resin molded product of the present embodiment, a porous material can be obtained by simply adding a conductive material to a porous layer. Since a porous sheet can be made conductive, even a porous sheet made of a resin material that is difficult to be plated can be used to electrically connect a metal film with excellent adhesion without etching the surface. It can be formed directly by chemical methods.

  Moreover, in the manufacturing method of this Embodiment, you may perform the positive charge process process which charges a positive charge to a porous layer previously before the said electroconductive material provision process. By charging such a positive charge to the porous layer, electrostatic interaction occurs between the porous layer and the conductive material, and the adsorptivity of the conductive material can be improved. In particular, when using a chemically modified conductive material with a halogen atom-containing functional group to be described later, a strong electrostatic interaction between the porous layer and the conductive material occurs, Ya outermost surface of the porous layer The conductive material can be favorably adsorbed inside.

  The positive charging treatment step may include a solution treatment step in which a porous sheet and a solution containing a surface treatment agent are brought into contact with each other. According to the solution treatment step, since the solution containing the surface treatment agent penetrates into the porous layer, a positive charge can be charged deep inside the porous layer. Specific examples of the surface treatment agent used in such a solution treatment step include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane and N-2- (aminoethyl) -3- Aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine and its partial hydrolysates, 3- Trimethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine and its partial hydrolyzate, N-phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3- Examples include amino group-containing silane coupling agents such as aminopropyltrimethoxysilane hydrochloride.These may be used alone or in combination. When these amino group-containing silane coupling agents are used, the silane coupling agent reacts with the hydrophilic functional group of the porous layer, thereby imparting a positively charged amino group to the porous layer. . The solvent used for the solution treatment is preferably an aqueous or alcohol solvent that does not dissolve the porous layer made of the thermoplastic resin, although it depends on the type of the surface treatment agent to be used. Moreover, the density | concentration of a surface treating agent is although it does not specifically limit, Preferably it is 0.1-10 mass%. In addition, when a positive charge is imparted to the porous layer by the solution treatment step, the positive charge treatment step may further include a hydrophilic treatment step for imparting a hydrophilic group to the porous sheet before the solution treatment step. By hydrophilic treatment of the porous layer, the imparted hydrophilic functional group and the surface treatment agent can be reacted to efficiently charge the porous layer with a positive charge. As such a hydrophilic treatment step, a method of treating the porous sheet with ultraviolet rays or plasma can be preferably used. Moreover, you may process a porous sheet with an acid or an alkali.

  The conductive material is not particularly limited as long as it can make the porous sheet conductive by being applied to the porous layer, but carbon nanotube, fullerene, carbon nanohorn, carbon black, acetylene black, and At least one selected from the group consisting of graphite is preferred. Since these conductive materials are cheaper than palladium, cost reduction can be achieved. In addition, since these conductive materials have excellent conductivity, the porous sheet can be made highly conductive. Among these, carbon nanotubes are more preferable. Since the carbon nanotube has a fiber shape with a large aspect ratio, the carbon nanotubes are likely to contact each other inside the porous layer. When carbon nanotubes are used, hopping conduction in which electrons hop between adjacent nanotubes occurs even if the nanotubes are not in physical contact. Therefore, even if a small amount of carbon nanotubes are used, excellent conductivity can be obtained. Further, the carbon nanotube may be a carbon nanotube having a multilayer structure, or may be a cylindrical carbon nanotube having an opening obtained by cutting the carbon nanotube. The amount of the conductive material applied can be appropriately changed according to the type of surface treatment.

  The conductive material may be chemically modified with a polar group. Among these, a conductive material chemically modified with a halogen atom-containing functional group is preferable. Since halogen atoms have high electronegativity, the conductive material can be negatively charged by chemically modifying the conductive material with a halogen atom-containing functional group. For this reason, not only the physical action caused by the trapping of the conductive material, but also electrostatic interaction between the porous layer and the conductive material occurs, and the conductive material is placed on the outermost surface or inside of the porous layer. Can be adsorbed. In addition, only by adsorption by physical action, the conductive material on the outermost surface of the porous layer easily drops off after the conductive material is applied to the porous layer, and the amount of the conductive material on the outermost surface of the porous layer. Is prone to decline. Therefore, for example, when the electrolytic plating process is performed in the surface treatment process, the plating film grows from the vicinity of the electrode in contact with the porous layer, and a plating film with a nonuniform thickness is easily formed. In contrast, if a conductive material chemically modified with a halogen atom-containing functional group is used, more conductive material can be adsorbed to the outermost surface of the porous layer by electrostatic interaction. The electrical conductivity of can be improved. As a result, when the plating film is formed in the surface treatment process, current easily flows from the electrode to the entire outermost surface of the porous layer, the throwing power of the plating film is improved, and the entire surface of the porous layer is formed. A uniform plating film can be formed. In particular, if a porous layer charged with a positive charge as described above is brought into contact with a conductive material chemically modified with a halogen atom-containing functional group, a strong electrostatic force is generated between the porous layer and the conductive material. This is preferable because of the interaction.

  Specific examples of the halogen atom-containing functional group include halogen atoms such as fluorine, chlorine, bromine and iodine, and organic groups such as alkyl groups having these halogen atoms, aryl groups, and arylalkyl groups. Among these, a functional group containing a fluorine atom or a chlorine atom having high electronegativity is preferable. As a method for producing a conductive material chemically modified with a halogen atom-containing functional group, a conventionally known production method can be used. For example, a method of chemically modifying carbon nanotubes with chlorine atoms or bromine atoms by contacting carbon nanotubes with hydrochloric acid or hydrobromic acid in supercritical water as described in JP-A-2005-263607, A method of chemically modifying a carbon nanotube with a perfluoroalkyl group by reacting the carbon nanotube with a perfluoroazoalkane under irradiation with ultraviolet light, which is described in Japanese Unexamined Patent Publication No. 2005-200272, can be mentioned.

  The method for bringing the porous sheet and the conductive material into contact with each other is not particularly limited, and any method can be used. For example, there is an ultrasonic treatment method in which a conductive material is applied to a porous layer while performing ultrasonic treatment in a dispersion liquid in which a conductive material is dispersed in a solvent. The solvent used for dispersion is preferably an aqueous or alcohol solvent that does not dissolve the porous layer made of a thermoplastic resin, although it depends on the type of conductive material used.

By such a conductive material application step, for example, the surface electrical resistance of a porous sheet made of polypropylene resin can be reduced to 10 ² Ω · cm ⁻¹ or less, which is suitable for surface treatment by an electrochemical technique. it can.

  In the method for producing a resin molded product of the present embodiment, a surface treatment step by electrochemical treatment may be directly performed after the above-described conductive material application step, but the surface treatment is performed for decoration or functionality. You may provide the shaping | molding process which shape | molds a porous sheet before a process. Since the porous sheet of the present embodiment is made of a thermoplastic resin, the porous sheet can be easily formed into an arbitrary shape.

  In the molding process, the porous sheet is placed on the mold of the injection molding machine, the molten resin is injected and filled into the cavity of the mold, and the porous layer is exposed on one side of the porous sheet and the molten resin. It may include an insert molding process in which the porous sheet is integrally molded, and a vacuum / pressure forming process in which the porous sheet is placed on a mold and the porous sheet is vacuum / pressure molded. If the insert molding process is performed before the surface treatment process, the porous sheet and the molten resin can be firmly and integrally molded, and not only can the strength of the resin molded product finally obtained be improved, but also various shapes. The resin molded product can be manufactured, and the functionality can be improved. In addition, by performing the vacuum / pressure forming before the surface treatment step, for example, a thin porous sheet can be easily formed into a predetermined shape. Furthermore, before these molding steps, a laminating step of laminating a porous sheet having a conductive material applied to the porous layer and the resin sheet so that the porous layer is exposed on one side may be further provided. . When the insert molding process or vacuum / pressure forming process is performed, the porous sheet is likely to be deformed due to the pressure of the molten resin or pressurized air. If the quality sheet and the resin sheet are laminated, deformation due to such pressure can be prevented. In the laminating step, the resin sheet is welded to the porous sheet while pressure is also applied to the surface of the porous sheet, so that the openings formed on the surface of the porous layer can be reduced, The porous surface can be flattened. For this reason, in a surface treatment process, it becomes difficult to detach | desorb an electroconductive material from a porous layer, and not only can a metal film with a higher anchoring effect be formed, but the surface of the metal film obtained can be planarized.

  The resin sheet used in the laminating process is not particularly limited as long as it can be welded to the porous sheet in the laminating process, but from the viewpoint of adhesive strength, the thermoplastic resin is the same as the above porous sheet. A resin sheet made of is preferable. Moreover, the resin sheet may have a porous layer or only a non-porous layer.

  When the insert molding process is performed after the laminating process, among the resin sheets made of the thermoplastic resin, a resin sheet having a property of being melted by a molten resin is preferable. If the resin sheet is melted by the molten resin, a melt-bonded portion is formed between the resin sheet and the molten resin, so that a resin molded product having high adhesive strength can be obtained. The thermoplastic resin used for the resin sheet may be the same as or different from the thermoplastic resin used for the porous sheet. However, if the same kind of thermoplastic resin is used, the adhesive strength can be further increased. The thickness of the resin sheet is not particularly limited because it depends on the type of the target resin molded product, but is usually 50 to 500 μm. If the thickness of the resin sheet is too thin, the resin sheet is likely to be partially broken in the molding process, and mass productivity is impaired. On the other hand, when the too large thickness of the resin sheet, in the molding process, a sheet laminated with a resin sheet hardly disposed along the mold shape, there is a case where the mold surface sheet floats. As a result, the sheet is easily broken by pressure.

  As a method for laminating the porous sheet and the resin sheet, a conventionally known laminating method can be used. For example, there is a method in which a porous sheet and a resin sheet are superposed and laminated while being heated and pressed by a pressing means such as a rolling roll. The pressure and temperature at the time of laminating can be appropriately changed depending on the kind and thickness of the porous sheet and the resin sheet. In addition, when using the porous sheet which consists only of a porous layer, you may laminate by laminating | stacking the resin sheet which has only a non-porous layer with two porous sheets.

In the insert molding process, for example, when placing a thin porous sheet of 150 μm or less (a sheet laminated with a resin sheet when the lamination process is performed before the insert molding process) on a mold of an injection molding machine, Prior to filling the mold cavity with the molten resin, the porous sheet disposed on the mold may be brought into close contact with the mold by at least one method selected from the group consisting of heating, pressurization, and vacuum suction. . For example, the heating of the porous sheet disposed on the mold may be performed by applying hot air to the porous sheet in a state where the porous sheet is disposed on the mold. Further, if the mold temperature is high to some extent or the applied pressure is high, the porous sheet may be traced on the mold surface by blowing a pressurized gas such as pressurized air or N ₂ on the porous sheet. Furthermore, using a mold having a suction groove, with the porous sheet placed on the mold, the porous sheet is brought into close contact with the mold by vacuum suction from the suction groove for a short time. May be.

  In addition, since a thin porous sheet is easily softened by heat, after placing the porous sheet on the mold, hot air is applied to the porous sheet to make the porous sheet thin on the mold surface like blow molding. It can be fixed as a film. As a result, the molten sheet can be filled into the cavity with the porous sheet in close contact with the mold, so that the surface shape of the mold can be transferred to the porous sheet while preventing the porous sheet from being damaged. it can. Moreover, since the porous sheet is molded on the mold using hot air, it is not necessary to mold the porous sheet before placing the porous sheet on the mold (ie, there is no need for a preform). The porous sheet can be molded with high accuracy according to the shape of the mold. In addition, when the thickness of a porous sheet becomes thick, even if a hot air is applied to a porous sheet in a metal mold | die, it becomes difficult for a porous sheet to closely_contact | adhere with respect to the metal mold | die which has a complicated surface shape. Therefore, when using a thicker porous sheet, molded into a desired shape to suit the porous sheet to the shape of the mold prior to placing a porous sheet on a mold (i.e., preform) and then The preformed porous sheet is preferably placed on a mold of an injection molding machine.

  In the insert molding process, a resin material in a molten resin used to be integrated with the porous sheet, the kind as long as it is a thermoplastic resin is arbitrary, specifically, for example, synthetic fibers of polyester or the like; Polypropylene resin; Polymethylmethacrylate resin; Polycarbonate resin; Amorphous polyolefin resin; Polyetherimide resin; Polyethylene terephthalate resin; Liquid crystal polymer; ABS resin; Polyamideimide resin; Biodegradable plastic such as polylactic acid These composite materials and the like. Moreover, you may use the resin material which knead | mixed various inorganic fillers, such as glass fiber, carbon fiber, and nanocarbon, to these resins. In addition, the thermoplastic resin used for the molten resin may be the same as or different from the thermoplastic resin used for the porous sheet. However, if the same kind of thermoplastic resin is used, the adhesive strength can be further increased.

  In the insert molding process, it is preferable to dispose a protective sheet between the porous layer and the mold surface. Since at least one surface side of the porous layer needs to be exposed for surface treatment in the surface treatment step, the porous layer cannot be protected in the mold. There is a possibility that the porous layer and the mold surface come into contact with each other and the porous layer is damaged. For this reason, the damage of such a porous layer can be prevented by previously disposing a protective sheet between the porous layer and the mold surface. As such a protective sheet, a protective sheet made of a resin that is difficult to weld to the porous sheet can be used even when pressure and temperature are applied in the insert molding process.

  In integrating the porous sheet and the molten resin in the insert molding step, a conventionally known injection molding machine and molding method can be used. For example, the resin is melted in a plasticizing cylinder communicating with the cavity of the mold in which the porous sheet is disposed as described above, and the molten resin is injected and filled into the cavity to thereby obtain the porous sheet and the molten resin. Can be integrated. In particular, the molten resin when insert molding, since the formed porous sheet melted joint to melt in contact with the molten resin and the porous sheet and the molten resin are integrated, it is possible to obtain a high adhesive strength .

  In forming a porous sheet (a sheet in which a resin sheet is laminated when the lamination process is performed before the vacuum / pressure forming process) in the vacuum / pressure forming process, a conventionally known forming machine and forming method should be used. Can do. For example, a porous sheet that is semi-melted by irradiating infrared rays is placed on a mold having a vacuuming groove, and pressurized air is applied from the opposite side while vacuum suction is performed from the vacuuming groove. In addition, the porous sheet can be traced to the shape of the mold surface.

  In the present embodiment, a conventionally known electrolytic plating treatment, electrodeposition coating treatment, or the like can be used as the surface treatment by an electrochemical method. Since the porous sheet of the present embodiment has excellent conductivity by applying a conductive material to the porous layer, the porous sheet (before the surface treatment process) is performed without performing an electroless plating process. When a molding process is performed, a resin molded product in which a metal film such as an electrolytic plating film or an electrodeposition coating film is formed on a molded sheet) can be produced. These electrolytic plating treatment and electrodeposition coating treatment may be performed a plurality of times. For example, after performing an electrolytic copper plating process, an electrolytic nickel plating process or an electrolytic chromium plating process can be further performed. Conventionally known cationic electrodeposition paints and anion electrodeposition paints can be used as the electrodeposition paint.

  In the resin molded product obtained as described above, a metal film is formed on the basis of the conductive material applied to the porous layer, so that the metal film grows from the inside of the porous layer and has excellent adhesion. A metal film having the same can be obtained. For this reason, when the resin molded product which formed the metal film in the heat cycle test is provided, the peeling which arises in the interface of a metal film and a resin part can be suppressed, for example.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further in detail, this invention is not limited to these Examples.

[Example 1]
In this example, a manufacturing method including a conductive material application process, a lamination process, an insert molding process, and an electrolytic plating process was used. FIG. 1 is a principal enlarged sectional schematic view showing a state of a sheet in each manufacturing process of the present embodiment, and FIG. 2 is a principal enlarged sectional schematic view showing a state of an insert molding process. Hereinafter, the manufacturing method of the present embodiment will be described with reference to the drawings.

<Conductive material application process>
A porous sheet 1 made of a polypropylene resin composed of only a porous layer 2 having a continuous porous body 21 communicating with the surface (manufactured by INOAC Corporation, FOLEC-OP, thickness: 300 μm, surface electric resistance: 3 × 10 ³ Ω · cm ^-1 ) is immersed in an ethanol solution in which multi-layered carbon nanotubes 3 (manufactured by Showa Denko KK, VGCF-H) are dispersed and subjected to ultrasonic treatment for 1 hour. To the porous layer 2 (FIG. 1A).

After the ultrasonic treatment, the porous sheet was taken out from the ethanol solution, dried, and then the surface electrical resistance of the porous sheet was measured. The surface electrical resistance was reduced to 9 × 10 ² Ω · cm ^−1. Was confirmed.

<Lamination process>
A sheet 10 in which a non-porous resin sheet 4 (thickness: 200 μm) made of polypropylene resin is superimposed on one side of a porous sheet provided with carbon nanotubes 3 and the porous sheet and the resin sheet are laminated using a rolling roll. (Total thickness: 400 μm) was produced (FIG. 1B).

<Insert molding process>
Next, using the sheet 10 laminated with the porous sheet and the resin sheet as described above, insert molding for integrating the molten resin on the resin sheet surface was performed by an insert molding method. Specifically, first, the laminated sheet is placed on a preform mold (not shown) imitating the movable mold shown in FIG. 2, the sheet is softened by infrared heating, and then pressurized and boxed. Preformed into a mold shape.

  Next, as shown in FIG. 2A, the preformed sheet 10 is placed on the movable mold 201 so that the porous layer (not shown) faces the surface of the movable mold 201, and vacuum drawing is performed. The sheet 10 was fixed by vacuum suction from the groove 203 for use. At this time, a protective sheet P made of nylon resin was interposed between the surface of the movable mold 201 and the sheet 10. Thereafter, as shown in FIG. 2B, the movable mold 201 and the fixed mold 202 are brought into contact with each other, and the polypropylene resin 205 melted in the plasticizing cylinder 204 is injected and filled into the cavity 210 by the advancement of the screw S. did. Thereby, the sheet | seat 11 which insert-molded the molding resin layer 6 which consists of a polypropylene resin through the fusion | melting junction part 5 was produced (FIG.1 (C)). In addition, since the resin sheet laminated with the molten resin at the time of injection molding may be melted and thinned at the time of insert molding, if the sheet is in close contact with the mold surface to some extent, a mold having a bent shape such as deep drawing Even if is used, a resin molded product to which the mold shape is transferred can be obtained. When the surface of the porous layer 2 of the sheet 11 obtained as described above was visually observed, no damage was confirmed.

<Electrolytic plating process>
Next, the molded sheet 11 having the porous layer 2 provided with the carbon nanotubes 3 was subjected to an electrolytic plating process to produce a sheet 12 having an electrolytic plating film 7 (FIG. 1D). In this example, a copper plating film was first formed. Rebco 300 manufactured by Uemura Kogyo was used as an additive (brightening agent) for the copper sulfate plating solution. The electrode is brought into contact with the outer peripheral portions at both ends of the surface of the sheet 11 on which the porous layer 2 is formed, so that a copper plating film having a thickness of about 20 μm is formed. ^{2. The} sheet 11 was electrolytically plated in a plating time of 30 minutes. Next, electrolytic plating films (electrolytic nickel plating film and electrolytic chromium plating film) conforming to the plating standard for automobile parts were formed on the copper plating film formed as described above. A Watt bath is used as the electrolytic nickel plating solution, Asahi Base SB-1H manufactured by Uemura Kogyo as an additive (brightening agent) for semi-bright nickel plating solution, and Asahilite N-11 manufactured by Uemura Kogyo as an additive for bright nickel plating solution. , N-22. Using the above electrolytic nickel plating solution, copper plating was performed at a processing temperature of 55 ° C., a current density of 3 A / dm ² , and a plating time of 15 minutes so that a semi-bright nickel film and a bright nickel film each having a thickness of about 10 μm were formed. The sheet on which the film was formed was subjected to electrolytic plating.

Next, Asahi Chrome NC manufactured by Uemura Kogyo Co., Ltd. is used as the electrolytic chromium plating solution, so that an electrolytic chromium plating film having a thickness of about 0.3 μm is formed, a processing temperature of 40 ° C., a current density of 10 A / dm ² m, and a plating time. The sheet on which the nickel plating film was formed was electroplated in 1 minute 30 seconds.

  As described above, the adhesion of the sheet 12 on which the electrolytic plating film 7 was formed was evaluated by a heat cycle test. The test was carried out in accordance with a plating standard for automobile parts for evaluating the adhesion of a plating film of a resin molded product using an ABS-based resin, after holding the sheet at −40 ° C. for 1 hour in a test tank, and then at 80 ° C. for 1 hour. The holding cycle was repeated 3 cycles. After the test, visual inspection was performed. As a result, it was confirmed that the electrolytic plating film did not swell or peel off, and good adhesion was obtained.

[Example 2]
In Example 1, a sheet having an electrodeposition coating film was produced in the same manner as in Example 1 except that electrodeposition coating was performed instead of electrolytic plating. As the electrodeposition paint, a cationic electrodeposition paint (manufactured by Kansai Paint Co., Ltd., ELECRON 9600) was used. . After washing with water, the electrodeposition coating film was cured by heating at 170 ° C. for 30 minutes, and the electrodeposition coating film was formed so that the film thickness of the flat portion was 20 μm. When the adhesion evaluation of the obtained sheet was carried out by the same heat cycle test as in Example 1, it was confirmed that the electrodeposition coating film was not swollen or peeled off, and good adhesion was obtained. .

[Example 3]
In this example, a manufacturing method including a conductive material applying step, a laminating step, a vacuum / pressure forming step, and an electrolytic plating step was used. FIG. 3 is a principal enlarged cross-sectional schematic view showing the state of the sheet in each manufacturing process of this embodiment, and FIG. 4 is a principal enlarged cross-sectional schematic view showing the state of the vacuum / pressure forming process. Hereinafter, the manufacturing method of the present embodiment will be described with reference to the drawings.

<Conductive material application process>
In the same manner as in Example 1, a porous sheet 31 made of a polypropylene resin consisting of only a porous layer 32 having a continuous porous body 321 communicating with the surface (FONOC Corporation, FOLEC-OP, thickness: 300 μm, surface electric resistance) : 3 × 10 ³ Ω · cm ⁻¹ ) was added with carbon nanotubes 33 having a multilayer structure (FIG. 3A).

<Lamination process>
Next, using two porous sheets provided with carbon nanotubes as described above, a non-porous resin sheet 34 made of polypropylene resin is sandwiched between the porous layers 32, and the sheets are heated while being heated and pressurized. By laminating, a laminated sheet 310 having a three-layer structure (total thickness: 500 μm) was produced (FIG. 3B).

<Vacuum / Pneumatic forming process>
Next, using the laminated sheet 310, a vacuum / pressure forming process for forming a sheet by vacuum / pressure forming was performed. Specifically, first, a sheet 310 semi-melted by irradiating infrared rays from both sides is placed on an aluminum mold 41 having an uneven surface as shown in FIG. While vacuuming from 42, pressurized air was applied to the sheet from above the mold 41. Thereby, as shown in FIG. 4B, the sheet 310 was traced in the shape of the surface of the mold 41. Then, as shown in FIG. 4C, the sheet 310 that was plastically deformed from the mold 41 was taken out, and the sheet 310 was formed into a concavo-convex shape.

<Electrolytic plating process>
Next, using the sheet 310 formed as described above, a copper plating film 37 was formed on both surfaces of the sheet 310 in the same manner as in Example 1 so as to have a thickness of about 20 μm (FIG. 3C )). It was confirmed that the obtained composite sheet 311 of the copper plating film and the sheet was imparted with heat dissipation and had a heat sink function. The method for producing a resin molded product of this example is more excellent in formability when deep drawing than press molding a thin metal plate, and it is not necessary to use a plurality of molds, so the shape is complicated. Thin metal parts can be obtained.

[Example 4]
In this example, a manufacturing method including a positive charging process, a conductive material application process, a lamination process, an insert molding process, and an electrolytic plating process was used. FIG. 5 is an enlarged schematic cross-sectional view of the main part showing the state of the sheet in each manufacturing process of this example. FIG. 6 shows the surface of the porous sheet to which the conductive material has been applied using a laser microscope (VK -9700). Hereinafter, the manufacturing method of the present embodiment will be described with reference to the drawings.

<Positive charging process>
A porous sheet similar to that of Example 1 was prepared. This porous sheet was subjected to an ultraviolet treatment for 5 minutes using a low-pressure mercury lamp (main wavelength: 254 nm, irradiation distance: 50 mm) to make it hydrophilic. This hydrophilized porous sheet was immersed in a solution in which a silane coupling agent having an amino group (manufactured by Shin-Etsu Silicone, KBM-903) was dissolved in water at a concentration of 1% by mass at 50 ° C. for 5 minutes. Then, solution treatment was performed to charge the porous layer with a positive charge.

<Conductive material application process>
Example 1 except that a porous sheet charged with a positive charge as described above and a carbon nanotube having a multilayer structure having an opening chemically modified with chlorine atoms (major axis length: about 1 μm) were used. Similarly, carbon nanotubes 53 were imparted to the porous layer 52 of the porous sheet 51 (FIG. 5A).

  When the surface of the obtained porous sheet 51 was observed with a laser microscope, as shown in FIG. 6, not only the inside of the porous layer 52 but also the cage-like carbon nanotubes 53 were adsorbed on the outermost surface. Was observed.

<Lamination process>
A sheet 510 (total thickness: 400 μm) obtained by laminating a porous sheet and a resin sheet was produced in the same manner as in Example 1 except that the porous sheet provided with the carbon nanotube 53 obtained above was used ( FIG. 5 (B)).

<Insert molding process>
Except for using the laminated sheet 510 obtained above, a sheet 511 in which the molded resin layer 56 was insert-molded on the resin sheet surface via the melt-bonded portion 55 was produced in the same manner as in Example 1 (FIG. 5 (C)).

<Electrolytic plating process>
Except for using the molded sheet 511, electrolytic plating was performed in the same manner as in Example 1 to produce a sheet 512 having an electrolytic plating film 57 (FIG. 5D). When the adhesion evaluation of the obtained sheet was conducted by the same heat cycle test as in Example 1, it was confirmed that the electrolytic plating film 57 was not swollen or peeled off and had good adhesion. .

  In addition, after forming a copper plating film by the above electrolytic plating treatment, when the film thickness of the copper plating film was measured with an electrolytic film thickness meter (manufactured by Chuo Seisakusho, TH-11), the outer periphery in contact with the electrode The thickness of the copper plating film at the center is 25.5 μm, the thickness of the copper plating film at the center away from the electrode is 19.4 μm, and the thickness of the copper plating film at the outer periphery is 1 with respect to that at the center. About 3 times.

  On the other hand, when the film thickness of the copper plating film of the sheet 12 produced in Example 1 was measured in the same manner, the film thickness of the copper plating film on the outer peripheral portion that was in contact with the electrode was 29.9 μm. The film thickness of the copper plating film in the central part away from the film was 16.6 μm, and the film thickness of the copper plating film in the outer peripheral part was about 1.8 times that of the central part. This means that if with a porous sheet obtained by charging a positive charge to the porous layer, with chemically modified conductive material with a halogen atom-containing functional groups, as shown in FIG. 6, the porous layer In addition, it is considered that the conductive material is adsorbed on the outermost surface, current flows easily over the entire outermost surface of the porous layer during the electrolytic plating process, and the throwing power of the plating film is improved.

  Although the manufacturing method of the resin molded product of the present invention has been described in detail above, a preferred embodiment of the present invention will be described as follows.

(1) In one aspect of the present invention, a conductive material applying step of applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
The manufacturing method of the resin molded product which has the surface treatment process which surface-treats the porous sheet by which the electroconductive material was provided to the said porous layer with an electrochemical method can be used. The conductive material preferably contains at least one selected from the group consisting of carbon nanotubes, fullerenes, carbon nanohorns, carbon black, acetylene black, and graphite. In particular, a conductive material chemically modified with a halogen atom-containing functional group is preferably used.

(2) In the present invention, in an embodiment in which an insert molding process is performed for the purpose of decoration or functionality,
A conductive material applying step for applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
A porous sheet in which a conductive material is applied to the porous layer is placed on a mold of an injection molding machine, a molten resin is injected and filled into a cavity of the mold, and the porous sheet, the molten resin, Insert molding step of obtaining a molded sheet by integrally molding the porous layer so that the porous layer is exposed on one side,
A method for producing a resin molded article having a surface treatment step of surface-treating a molded sheet having a porous layer provided with the conductive material by an electrochemical method is preferable.

(3) Moreover, in the said insert molding process, it is preferable to arrange | position a porous sheet so that a porous layer may oppose a metal mold | die surface through a protective sheet.

(4) In the present invention, in an aspect in which a vacuum / pressure forming process is performed for the purpose of decoration or functionality,
A conductive material applying step for applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
A vacuum sheeting process in which a porous sheet provided with a conductive material in the porous layer is placed on a mold, and the porous sheet is vacuum-compressed to obtain a molded sheet;
A method for producing a resin molded article having a surface treatment step of surface-treating a molded sheet having a porous layer provided with the conductive material by an electrochemical method is preferable.

(5) Further, in the present invention, in the aspect of performing the laminating step of laminating the porous sheet and the resin sheet before the insert molding step,
A conductive material applying step for applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
A laminating step of laminating a porous sheet provided with a conductive material on the porous layer and a resin sheet so that the porous layer is exposed on one side, and obtaining a laminated sheet;
A laminated sheet having a porous layer provided with the conductive material is placed on a mold of an injection molding machine, and a molten resin is injected and filled into a cavity of the mold, and the porous sheet and the melt An insert molding step of integrally molding the resin so that the porous layer is exposed on one side, and obtaining a molded sheet;
A method for producing a resin molded article having a surface treatment step of surface-treating a molded sheet having a porous layer provided with the conductive material by an electrochemical method is preferable.

(6) In the present invention, in the aspect of performing the laminating step of laminating the porous sheet and the resin sheet before the vacuum / pressure forming step,
A conductive material applying step for applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
Laminating step of obtaining a laminated sheet by laminating a porous sheet having a conductive material applied to the porous layer and a resin sheet so that the porous layer is exposed on at least one surface side;
A laminated sheet having a porous layer provided with the conductive material is placed on a mold, and the laminated sheet is vacuum-pressure formed to obtain a formed sheet;
A method for producing a resin molded article having a surface treatment step of surface-treating a molded sheet having a porous layer provided with the conductive material by an electrochemical method is preferable.

(7) In the manufacturing method including the laminating step and the vacuum / pressure forming step, the laminating step includes two porous sheets each having a conductive material applied to the porous layer and the porous layer on both sides. A laminating step of obtaining a laminated sheet by laminating through the resin sheet so that the quality layer is exposed may be included.

(8) In the manufacturing method of said (1)-(7), you may further provide the positive charge process process which charges a positive charge to a porous layer before an electroconductive material provision process.

1,31,51 Porous sheet 2,32,52 Porous layer 21,321 Continuous porous body 3,33,53 Carbon nanotube (conductive material)
4, 34, 54 Resin sheet 7, 37, 57 Electroplated film 201 Mold 204 Cylinder 205 Molten resin 210 Cavity P Protective sheet

Claims (12)

A conductive material applying step for applying a conductive material to a porous sheet made of a thermoplastic resin having a porous layer on at least one surface side;
A method for producing a resin molded article, comprising: a surface treatment step of surface-treating a porous sheet having a conductive material applied to the porous layer by an electrochemical technique. After the conductive material application step and before the surface treatment step,
Further comprising a molding step of molding a porous sheet provided with a conductive material in the porous layer;
The method for producing a resin molded product according to claim 1, wherein the porous sheet in the surface treatment step is a sheet molded in the molding step. The molding step includes
A porous sheet provided with a conductive material in the porous layer is placed on a mold of an injection molding machine, and a molten resin is injected and filled into a cavity of the mold, and the porous sheet and the molten resin The manufacturing method of the resin molded product of Claim 2 including the insert molding process which integrally molds so that the said porous layer may be exposed to one surface side. In the insert molding step,
The manufacturing method of the resin molded product of Claim 3 which arrange | positions the said porous sheet on the said metal mold | die so that the said porous layer may face the said metal mold | die surface through a protective sheet. The molding step includes
The method for producing a resin molded article according to claim 2, further comprising a vacuum / pressure forming step in which a porous sheet having a conductive material applied to the porous layer is disposed on a mold, and the porous sheet is formed by vacuum / pressure forming. . After the conductive material application step and before the molding step,
A laminating step of laminating a porous sheet and a resin sheet provided with a conductive material on the porous layer so that the porous layer is exposed at least on one side;
The method for producing a resin molded product according to claim 2, wherein the porous sheet in the molding step is a sheet laminated in the laminating step.   The said porous layer is a manufacturing method of the resin molded product of any one of Claims 1-6 which have a continuous porous body connected with the surface.   The said thermoplastic resin is a manufacturing method of the resin molded product of any one of Claims 1-7 containing a polypropylene resin.   The resin molded product according to any one of claims 1 to 8, wherein the conductive material contains at least one selected from the group consisting of carbon nanotubes, fullerenes, carbon nanohorns, carbon black, acetylene black, and graphite. Manufacturing method.   The method for producing a resin molded product according to claim 9, wherein the conductive material is chemically modified with a halogen atom-containing functional group. Before the conductive material application step,
The method for producing a resin molded product according to any one of claims 1 to 10, further comprising a positive charging treatment step of charging the porous layer with a positive charge. The method for producing a resin molded product according to any one of claims 1 to 11, wherein the surface treatment by the electrochemical method is an electrolytic plating treatment or an electrodeposition coating treatment.