JP2011095963A - Ic tag-equipped laminate body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag-equipped laminate body having an excellent communication distance as a non-contact IC tag, and allowing improvement of security such as forgery prevention while holding water resistance, impact resistance, and flexibility. <P>SOLUTION: A silicone-based resin layer is laminated on a face equipped with an IC chip of an IC tag including the IC chip, and an antenna or an antenna member on a support base material. The silicone-based resin layer is laminated by coating or a film. Pouching members are laminated on both faces thereof, pouch processing is applied, and the IC tag is sealed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laminated body in which an IC tag is encapsulated with a base material, and more particularly to a laminated body with an IC tag that has been subjected to pouching to improve water resistance.

  Conventionally, an IC tag with a built-in data carrier system for non-contact information storage and reading by external radio wave communication as a tag for process management and logistics management at manufacturing factories and distribution sites by attaching to articles etc. The individual recognition management system used is known, and is used for a wide range of applications as a management system for product tag labels or tags attached to packages or cases.

  For example, when an IC tag is attached to a product such as clothing, a bag, or shoes, solid identification information such as a unique identification number of the product, manufacturing history information, or distribution information is stored in an IC chip in the IC tag, By reading such information, it becomes possible to identify the individual and identify the distribution channel, contributing to traceability and security.

  However, these products must be considered for washing and getting wet when exposed to rain, and the IC tag needs to have water resistance. It is also necessary to maintain impact resistance and flexibility within the range of normal use. (Note that flexibility means that the material has high flexibility, flexibility, and flexibility.)

  For this reason, the IC tag is protected by sandwiching and sealing the IC tag with a water-resistant substrate. (See, for example, Patent Document 1 below.)

JP 2007-293739 A

  However, for example, when a plastic material is used as a protective base material to provide water resistance to the IC tag, the communication distance is shorter than the case without the protective base material due to a communication inhibition factor such as an increase in current loss during communication. As a result, there may be a problem in the traceability of information in the original use of the non-contact IC tag.

  Also, in order to obtain sufficient characteristics in terms of impact resistance and flexibility (flexibility), the thickness of the protective substrate must be increased accordingly. Depending on the product characteristics, the thickness may cause problems in handling during distribution. Furthermore, it did not contribute particularly in terms of security such as forgery prevention.

  The present invention has been made to solve the above problems, and provides a laminate with an IC tag that can further improve security such as forgery prevention while maintaining water resistance, impact resistance, and flexibility. With the goal.

The laminate with an IC tag according to the invention of claim 1 is:
A silicon-based resin layer is laminated on a surface of an IC tag having an IC chip and an antenna or an antenna member on a supporting substrate.

The laminate with an IC tag according to the invention of claim 2 is:
A pouch member is laminated on both sides and pouched to enclose the IC tag.

The laminated body with an IC tag according to the invention of claim 3
The silicon-based resin layer is laminated by coating (coating) or a film.

The laminate with an IC tag according to the invention of claim 4 is:
The IC tag has a hologram portion whose color and image change depending on the viewing direction.

According to the laminated body with an IC tag of the present invention, since the silicon-based resin layer is laminated on the surface having the IC chip and the antenna on the support base, the communication distance with the outside in a non-contact manner increases. Traceability is improved and it can be applied to various applications.
In addition, water resistance, chemical resistance, impact resistance, and flexibility are improved by laminating a pouch film or a silicon-based resin layer on both sides of the IC tag, thereby improving the durability of the IC tag. . Furthermore, by providing an optical change device such as a hologram in the IC tag, a beautiful appearance can be obtained, and at the same time counterfeiting becomes extremely difficult, so that security is improved.

It is a figure which shows the cross section of the 1st Example in the laminated body with an IC tag of this invention. It is a figure which shows the layer structure of the 1st Example in the laminated body with an IC tag of this invention. It is a figure which shows the cross section of the sample for a measurement in the laminated body with an IC tag of this invention. It is a figure which shows the cross section of the 2nd Example in the laminated body with an IC tag of this invention.

  Hereinafter, embodiments of the laminate with an IC tag according to the present invention will be described in detail with reference to the drawings.

  1 and 2 are views showing a cross section and a layer structure of a laminate 1 with an IC tag according to a first embodiment of the present invention. In this embodiment, a silicon-based resin layer 5 is laminated on the surface of the IC tag 4 of the IC tag including the IC chip 4 and the antenna 3 on the support base 2, and both sides of the IC tag are completely covered. The pouch film 6 is overlaid so as to cover, and both sides are pouched by thermocompression bonding to enclose the IC tag.

  Such a non-contact type IC tag is generally configured with an IC chip 4, an antenna 3 and a support base 2 as basic elements. The antenna 3 is electrically connected to the IC chip 4, and when the antenna 3 receives a radio wave, an induced current is generated by the antenna coil, and the electronic circuit of the IC chip 4 works to perform data communication with the outside. Data can be read, written and stored.

  The supporting substrate 2 can be made of a known resin material, and for example, a film or sheet of polyester resin, epoxy resin, polyimide resin or the like is used. The antenna 3 may be made of a known conductive material. For example, a metal material such as a copper foil or a conductive paste is used.

  The silicon-based resin that is a material of the silicon-based resin layer 5 is a synthetic polymer compound having a main skeleton based on a siloxane bond (Si—O—Si), and is generally called silicon as a common name. It is necessary to distinguish this from silicon. A silicon-based resin is a material having high insulation and high flexibility (resin flexibility and flexibility), and when laminating, for example, the support group is formed via an adhesive. Adhere to material 2.

In the present invention, the size, shape, and thickness of the support substrate 2 and the pouch film 6 are not particularly limited, but the shape is a flat plate shape such as a rectangle, a circle, or an ellipse, or the central portion is thick in the cross section and the peripheral portion is It can be a stepped or inclined shape that is thinned. Further, the size can be appropriately selected according to the use of the IC tag.
Although the thickness can be appropriately selected according to the application of the product, it is desirable to ensure a thickness that can satisfy required characteristics such as water resistance, chemical resistance, and impact resistance.

The pouch processing is a process in which after the silicon-based resin layer 5 is laminated on the IC tag, both surfaces of the IC tag are covered with the pouch film 6 so that the whole is adhered and integrated by applying heat and pressure. Is the method.
There are various types of pouch processing methods and materials, and there is no particular limitation in the present invention. For example, a method using a polyester film to adhere by a thermocompression bonding method, a method using a laminated film of an aluminum vapor deposition film or a synthetic resin film, etc. Yes, it is preferable to select appropriately according to the use of the IC tag.

  Moreover, although the thickness of the pouch film 6 can also be selected suitably, the thicker one is preferable when tolerance is regarded as important depending on the application. The pouched outer shape may be a quadrangle or a circle, and is not particularly limited. In the case of a quadrangle, it is preferable to ensure safety by cutting off the four corners.

  Instead of using a polyester film or the like in the pouch processing, the silicon-based resin may be used as the pouch film 6 and laminated so as to cover both surfaces of the IC tag, and the pouch processing may be performed. In this case, an adhesive layer may be provided between the IC tag and the silicon-based resin layer 5 and pouched.

(Comparison measurement experiment of communication distance)
The inventors of the present invention actually performed a measurement experiment on the influence on the communication distance when the silicon-based resin was laminated on the non-contact IC tag.

In this measurement experiment, the following three types of samples were prepared as measurement targets.
Sample (A): A silicon-based resin layer is laminated on an IC tag and pouch processing is performed.
Sample (B): IC tag only and no laminate.
Sample (C): The IC tag was pouched.
Among these, the sample (A) is a laminate with an IC tag of the present invention, and the samples (B) and (C) are comparative objects of this experiment.
3A, 3B, and 3C are cross-sectional views showing the structures of these samples.

  In this experiment, the same type of IC chip and antenna were used. This is because the communication distance of the non-contact IC tag depends on the performance of the IC, the pattern of the antenna, the material, and the like, so that they are the same condition.

In this measurement experiment, 20 pieces of each of the three types of samples were prepared, and SEKON
IC handy reader-R001M is used as a measuring machine, the transmission output is 10 mW / MHz or less, the radio wave standard is ARIBSTD-T81, the use frequency is 2400-2483.5 MHz, the polarization method is circular polarization, The distance at which communication was normally performed under the conditions was measured.

Also, depending on the direction in which the sample is placed, there is a difference in the communication distance in the measurement method, but the difference depends on the shape design of the antenna pattern and is related to the difference depending on the target sample configuration. There is no. In order to distinguish this, the sample mounting direction with respect to the measuring instrument electrode was set to parallel and vertical, and the maximum communicable distance was measured for each.
Table 1 below shows the results of the communication distance measured under these conditions.

  According to the measurement results in Table 1, the average value of the communication distance of the sample (A) is compared with the sample (B) and the sample (C) when the sample is placed in the parallel direction or the vertical direction. Was also big. From these results, it was found that the effect of increasing the communication distance of the IC tag can be obtained by laminating the silicon-based resin layer.

  Moreover, in the measurement result of Table 1, since the communication distance of the sample (C) is larger than that of the sample (B), the communication distance is not increased only by pouching with the pouch film, and the effect is reversed. It turns out that it will reduce.

  Next, as a second embodiment of the present invention, an example using an IC tag having a hologram portion which is an optical change device will be described. The IC tag having such a configuration may be referred to as an IC hologram.

  FIG. 4 is a diagram showing the configuration of the laminated body 21 with an IC tag according to the second embodiment of the present invention. FIG. 4 (a) shows a cross-sectional structure of the IC hologram 20, and a hologram layer 11, an aluminum vapor deposition portion 10, a mask layer 12, and a concealing layer 14 are provided below a PET substrate 13 as a supporting substrate. The printed strap 15 that is an antenna, the IC chip 4, the silicon-based resin layer 5, and the adhesive layer 16 are further laminated thereunder. In this configuration, the aluminum vapor deposition unit 10 plays a role as an antenna.

  FIG. 4B shows a laminate 21 with an IC tag that is laminated on both sides of the IC hologram 20 shown in FIG. 4A so as to completely cover the pouch film 6 and is pouched. It is.

The hologram is a kind of optical variable device (OVD), which is a multilayer thin film that changes color depending on the viewing angle of the user. For IC tag applications, forgery of credit cards, securities, certificates, etc. Used as prevention means.
Further, since the hologram can express a stereoscopic image or a special decoration image using the light interference effect, it can be used for the purpose of enhancing the decoration effect in addition to the forgery prevention means.

  Using this IC hologram, a non-contact communication distance measurement experiment was performed in the same manner as in the first embodiment, and the same result as described above was obtained in the measurement result. That is, the effect of increasing the communication distance by laminating the silicon-based resin layer was obtained.

  Furthermore, as another embodiment of the laminate with an IC tag of the present invention, an outer layer base material can be further laminated as an intermediate layer between the silicon-based resin layer and the pouch film. For example, the resistance can be further improved by using a synthetic resin such as polystyrene or PET (polyethylene terephthalate) as the outer layer base material.

  The laminated body with an IC tag according to the present invention can improve the water resistance, chemical resistance, and impact resistance as well as the effect of increasing the communication distance as a non-contact type IC tag, and is used for a wider range of applications. be able to.

DESCRIPTION OF SYMBOLS 1 Laminated body with IC tag 2 Support base material 3 Antenna 4 IC chip 5 Silicon-type resin layer 6 Pouch film 10 Aluminum vapor deposition part 11 Hologram layer 12 Mask layer 13 PET base material 14 Concealing layer 15 Print strap (antenna)
16 Adhesive layer 20 IC hologram 21 Laminated body with IC tag

Claims (4)

A laminated body equipped with an IC tag having a non-contact communication function,
A laminated body with an IC tag, wherein a silicon-based resin layer is laminated on a surface of an IC tag having an IC chip and an antenna or an antenna member on a supporting substrate.   The laminated body with an IC tag according to claim 1, wherein a pouch member is laminated on both sides and pouched to enclose the IC tag.   The laminated body with an IC tag according to claim 1 or 2, wherein the silicon-based resin layer is laminated by coating (coating) or a film.   The laminate with an IC tag according to any one of claims 1 to 3, wherein the IC tag has a hologram portion whose color and image change depending on a viewing direction.

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