JP2011077117A - Method of manufacturing capacitor element and arranging device for use therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a capacitor element wherein an anode is hardly warped in a manufacturing process. <P>SOLUTION: The method of manufacturing the capacitor element includes an arrangement step and a firing step. The arrangement step is a step where anode forming members 20 each having a rectangular parallelepiped powder molding 21 formed of metal powder and an anode lead 12 planted on the outer circumferential surface 213 different from two planes 211 and 212 having the largest area out of the six outer circumferential surfaces of the powder molding 21 is arranged on the mounting surface 41 of a firing table 40 in contact with the mounting surface 41 or separately therefrom. In the arrangement step, the anode forming members 20 are arranged on the mounting surface 41 in such a position as the planes 211 and 212 of the powder molding 21 stand substantially perpendicularly to the mounting surface 41. In the firing step, the anode forming members 20 are fired after the arrangement step, thus producing sintered anode compacts. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a capacitor element and an arrangement device used therefor.

  Among the capacitor elements, the lead type capacitor element includes an anode sintered body formed by planting anode leads on a rectangular parallelepiped anode body, and a dielectric formed on the outer peripheral surface of the anode body of the anode sintered body. A body layer, an electrolyte layer formed on the outer peripheral surface of the dielectric layer, and a cathode layer formed on the outer peripheral surface of the electrolyte layer (see, for example, Patent Document 1). The anode lead is planted on a surface different from the two planes having the largest area among the six outer peripheral surfaces of the anode body.

  The anode sintered body is produced by firing the anode forming body (300) shown in FIG. Here, as shown in FIG. 15, the anode-formed body (300) is a rectangular parallelepiped-shaped powder compact (310) formed from metal powder, and among the six outer peripheral surfaces of the powder compact (310), The anode lead (320) planted on the outer peripheral surface (313) different from the two flat surfaces (311) (312) having the largest area is constituted.

  When the anode formed body (300) is fired, as shown in FIG. 15, the anode formed body (300) is placed on the placement surface (341) of the firing table (340) provided in the firing apparatus. The Conventionally, the anode forming body (300) has one of the two flat surfaces (311) and (312) of the powder compact (310) facing the mounting surface (341) of the firing table (340). It was arrange | positioned on the mounting surface (341) with the contacted posture.

  However, in the mode shown in FIG. 15 (hereinafter referred to as mode 1), it takes time to arrange the anode forming body (300) on the mounting surface (341), and it may be arranged on the mounting surface (341). The number of anode forming bodies (300) that can be formed is reduced. For this reason, the manufacturing cost of the capacitor element has increased. Therefore, like a shogi piece, dozens to several hundreds of anode forming bodies (300) are randomly stacked on the mounting surface (341) (hereinafter referred to as embodiment 2) to form an anode forming body ( 300).

JP 2008-91784 A

  When the anode-formed body (300) is disposed and fired as in the above-described aspect 1, in the powder molded body (310) of the anode-formed body (300), a plane in contact with the mounting surface (341) of the firing table (340) There is a difference between the amount of heat given to (312) and the amount of heat given to the plane (311) in contact with the atmosphere in the baking apparatus. For this reason, the thermal contraction rates of the two planes (311) and (312) are different from each other. As a result, as shown in FIG. 16, the powder compact (310) is sintered to form the anode body (350). Further, warping in which the planes (351) and (352) were curved occurred.

Further, when the anode formed body (300) is disposed and fired as in the above aspect 2, the anode formed body (300) is randomly stacked, so that the two planes (311) (312) of the powder molded body (310) are stacked. ), And the plane (311) (312) of the powder molded body (310) of the anode forming body (300) has another anode forming body (300) stacked thereon. Gravity is applied unevenly. For this reason, the anode body (350) formed by sintering the powder molded body (310) is warped more than the anode body (350) produced in the arrangement of the first aspect.
Furthermore, since the anode lead (320) of the anode formed body (300) is in contact with the powder molded body (310) or anode lead (320) of another anode formed body (300), the anode lead (320) is bent. It has occurred.

  Conventionally, the anode body of the anode sintered body used for the capacitor element has a thickness dimension of 0.8 mm or more, and the warpage amount of the anode body manufactured by the arrangement of the above aspect 2 is about 5 μm. For this reason, the ratio (warpage rate) of the warpage amount to the thickness dimension of the anode body was about 0.6%.

  On the other hand, in recent years, the demand for thinner capacitor elements is increasing. For this reason, it is necessary to produce an anode sintered body having a small thickness of the anode body used for the capacitor element.

  However, when an anode sintered body having a small thickness of the anode body is produced using a conventional manufacturing method, there is a problem that the amount of warpage of the anode body increases and the warpage rate of the anode body increases. Specifically, in the anode sintered body having the anode body having a thickness dimension of 0.65 mm or less and manufactured in the arrangement of the above aspect 2, the amount of warpage of the anode body is 45 μm or more, and therefore the warpage of the anode body is The rate exceeded 7%.

When the warpage rate of the anode body of the anode sintered body increases, when the anode sintered body is transported by the parts feeder, the anode sintered body may be clogged in the transport path of the parts feeder.
In addition, when the cathode layer of the capacitor element is electrically connected to the cathode lead frame with a conductive adhesive or the like, adhesion failure occurs between the cathode layer and the cathode lead frame, which increases the ESR (equivalent series resistance). There is a risk of doing. Further, in the molding process of covering the anode lead frame, cathode lead frame, and capacitor element with the exterior resin, the anode lead frame, cathode lead frame, and capacitor element are placed in the mold, and the molten exterior resin liquid is molded into the mold. When it is injected and solidified, the dielectric layer is damaged by the exterior resin liquid due to the warpage of the capacitor element, and the LC (leakage current) may be deteriorated.

  Accordingly, an object of the present invention is to provide a manufacturing method in which warpage of the anode body is unlikely to occur during the process of manufacturing an anode sintered body for a capacitor element, and an array device used in the manufacturing method.

The first manufacturing method according to the present invention is a method for manufacturing a capacitor element. The capacitor element is formed by anodic sintered body formed by implanting anode leads on a rectangular parallelepiped anode body, a dielectric layer formed on the outer circumferential surface of the anode body, and formed on the outer circumferential surface of the dielectric layer. The anode lead is planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the anode body.
Here, the said 1st manufacturing method has an arrangement | positioning process and a baking process. The arranging step includes a rectangular parallelepiped powder molded body formed of metal powder, and an anode lead planted on a surface different from the two planes having the largest area among the six outer peripheral surfaces of the powder molded body. A step of placing the anode forming body on the mounting surface of the firing table in contact with or away from the mounting surface, in the placing step, the anode forming body, The flat surface of the powder compact is placed on the placement surface in a posture standing substantially perpendicular to the placement surface. In the firing step, after the placement step, the anode forming body is fired to produce the anode sintered body.

  In the first manufacturing method, the anode forming body is fired in a posture in which the plane of the powder compact is set substantially perpendicular to the mounting surface of the firing table. Therefore, the difference in the amount of heat given to the two planes of the powder compact in the firing step is reduced. Therefore, in the anode formed body, the difference in thermal shrinkage between the two planes of the powder molded body is reduced, and as a result, the anode body formed by sintering the powder molded body has a curved curvature of the plane. Hard to occur.

The second manufacturing method according to the present invention is a method for manufacturing a capacitor element. The capacitor element is formed by anodic sintered body formed by implanting anode leads on a rectangular parallelepiped anode body, a dielectric layer formed on the outer circumferential surface of the anode body, and formed on the outer circumferential surface of the dielectric layer. The anode lead is planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the anode body.
Here, the said 2nd manufacturing method has an arrangement | positioning process and a baking process. The arranging step includes a rectangular parallelepiped powder molded body formed of metal powder, and an anode lead planted on a surface different from the two planes having the largest area among the six outer peripheral surfaces of the powder molded body. Is disposed on the mounting surface of the firing table, and in the placing step, the anode forming body may be disposed in contact with or spaced from the mounting surface of the firing table. Using a container that can accommodate a plurality of the anode-formed bodies, a plurality of anode-formed bodies are loaded and arranged in the container to arrange the anode-formed body into a powder compact The plane is arranged in a posture standing substantially perpendicular to the element mounting surface of the container. In the firing step, after the placement step, the anode forming body is fired to produce the anode sintered body.

  In the second manufacturing method, the anode forming body is fired in a posture in which the plane of the powder compact is set substantially perpendicular to the element mounting surface of the container. Therefore, the difference in the amount of heat given to the two planes of the powder compact in the firing step is reduced. Therefore, in the anode formed body, the difference in thermal shrinkage between the two planes of the powder molded body is reduced, and as a result, the anode body formed by sintering the powder molded body has a curved curvature of the plane. Hard to occur.

In the specific configuration of the second manufacturing method, the container is formed of the same metal as the metal powder forming the powder molded body of the anode forming body.
According to this specific configuration, a different type of metal from the metal powder forming the powder compact is prevented from entering the powder compact from the container during firing.

The array device according to the present invention is planted on a plane different from the two flat surfaces having the largest area among the rectangular powder molded body formed of metal powder and the six outer peripheral surfaces of the powder molded body. A device in which a plurality of anode forming bodies each having an anode lead are loaded and arranged in a container capable of housing a plurality of the anode forming bodies.
Here, the arrangement device includes a transport device, a downstream shutter, an upstream shutter, and a storage device. The conveying device has a conveying surface for conveying the anode forming body in a predetermined direction, and an inclined surface that is inclined to the downstream side is formed in a downstream area of the conveying surface, and slides down on the inclined surface. The anode formed body is discharged from the downstream end of the transport surface. The downstream shutter is installed on the inclined surface, and is movable between a closed position where the anode forming body is prevented from moving along the inclined surface and an open position where the anode forming body is allowed to pass therethrough. . An upstream shutter is disposed on the inclined surface and upstream of the downstream shutter, and passes through the anode forming body and a closed position that prevents the anode forming body from moving along the inclined surface. It is possible to move between opening positions. The storage device moves the storage tool in one direction on the downstream end side of the transport surface.

  In the arrangement device, after the anode forming body is conveyed by the conveying device and reaches the inclined surface, the anode forming body is discharged from the downstream end of the conveying surface by sliding down the inclined surface. At this time, by alternately performing the opening and closing of the upstream shutter and the opening and closing of the downstream shutter, the anode forming bodies are discharged one by one from the downstream end of the transport surface. Therefore, the anode forming body discharged from the downstream end of the transport surface is loaded one by one in the container. Here, by moving the container in one direction in the container, the container is sequentially loaded with a plurality of anode forming bodies one by one on the side opposite to the sliding direction (one direction) of the container. As a result, a plurality of anode forming bodies are arranged in a line.

In the specific configuration of the array device, a guide groove is formed on the transport surface to define the posture of the anode forming body in a posture with the tip of the anode lead of the anode forming body facing upstream.
According to this specific configuration, the plurality of anode forming bodies on the transport surface are arranged in a line with the tip of the anode lead of each anode forming body facing upstream. Therefore, the anode forming bodies are loaded one by one in the same posture in the container. Therefore, the plurality of anode forming bodies loaded in the container are arranged in a line with the same posture.

In a more specific configuration, the upstream shutter has a pair of protrusions, and the pair of protrusions move along the inclined surface by the downstream shutter when the upstream shutter is set to the closed position. It has a position to be installed on both sides of the anode lead of the anode forming body from which this is prevented.
When the downstream shutter is set to the closed position in the arrangement device, the downstream shutter prevents movement of the anode forming body, and the anode lead of the anode forming body has an anode forming body positioned upstream. The powder compact is brought into contact. In such a situation, even when the upstream shutter is set to the closed position, the anode lead of the anode forming body whose movement is blocked by the downstream shutter has the pair of protrusions of the upstream shutter on both sides thereof. As a result, the upstream shutter does not come into contact. Therefore, the anode lead of the anode forming body is not damaged by the upstream shutter.

  According to the method for manufacturing a capacitor element according to the present invention, it is difficult for the anode body to warp in the process of manufacturing the anode sintered body.

FIG. 1 is a perspective view showing an anode sintered body produced by a manufacturing method according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a capacitor element manufactured using the anode sintered body. FIG. 3 is a perspective view illustrating a forming body manufacturing process of the manufacturing method. FIG. 4 is a perspective view for explaining an arrangement process of the manufacturing method. FIG. 5 is a perspective view for explaining an arrangement process of the manufacturing method. FIG. 6 is a top view showing an arrangement device used in the arrangement step. FIG. 7 is a cross-sectional view taken along the line AA shown in FIG. 6, and is a diagram illustrating a first setting state of the upstream and downstream shutters. FIG. 8 is a cross-sectional view taken along the line AA shown in FIG. 6 and is a diagram for explaining a second setting state of the upstream and downstream shutters. FIG. 9 is a cross-sectional view taken along the line AA shown in FIG. 6 and is a view for explaining a third setting state of the upstream and downstream shutters. FIG. 10 is a cross-sectional view taken along the line AA shown in FIG. 6 and is a view for explaining a fourth setting state of the upstream and downstream shutters. FIG. 11 is a cross-sectional view taken along the line AA shown in FIG. 6 and is a view for explaining a first setting state of the upstream and downstream shutters. FIG. 12 is a perspective view showing a metal jig that can be used in the arranging step. FIG. 13 is a perspective view for explaining the state of the metal jig after execution of the arrangement step. FIG. 14 is a cross-sectional view for explaining a modification of the arrangement step. FIG. 15 is a perspective view showing a conventional posture of the anode formed body when the anode formed body to be an anode sintered body is fired. FIG. 16 is a side view showing an anode sintered body in which warpage has occurred in the anode body.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a capacitor element manufacturing method according to the present invention and an array device used therefor will be specifically described below with reference to the drawings.
FIG. 1 is a perspective view showing an anode sintered body produced by the production method according to the present embodiment. As shown in FIG. 1, an anode sintered body (10) includes a rectangular parallelepiped anode body (11) and two planes (111) having the largest area among the six outer peripheral surfaces of the anode body (11). ) (112) and an anode lead (12) planted on a different outer peripheral surface (113).

  The anode body (11) is composed of a porous sintered body formed from a valve action metal powder. Here, tantalum is used as the valve action metal. As the valve action metal forming the anode body (11), it is possible to use various metals other than tantalum, such as niobium, titanium, and aluminum. The thickness dimension of the anode body (11), that is, the distance between the two planes (111) and (112) is 0.65 mm or less.

  The anode lead (12) has a base end (122) embedded in the anode body (11), while a tip end (121) is drawn out from the outer peripheral surface (113) of the anode body (11). Yes. The anode lead (12) is made of a valve metal and is electrically connected to the anode body (11). As the valve metal that forms the anode lead (12), the same type of metal as the valve metal that forms the anode body (11), that is, tantalum is used. As the valve metal that forms the anode lead (12), a different type of metal from the valve metal that forms the anode body (11) may be used.

  FIG. 2 is a cross-sectional view showing a capacitor element manufactured using the anode sintered body (10). As shown in FIG. 2, the capacitor element (1) includes an anode sintered body (10) and a dielectric layer (13) formed on the outer peripheral surface of the anode body (11) of the anode sintered body (10). And an electrolyte layer (14) formed on the outer peripheral surface of the dielectric layer (13), and a cathode layer (15) formed on the outer peripheral surface of the electrolyte layer (14).

  The dielectric layer (13) is composed of oxide films formed on the six outer peripheral surfaces of the anode body (11). The oxide film is formed by immersing the anode body (11) in an electrolytic solution such as a phosphoric acid aqueous solution or an adipic acid aqueous solution, and oxidizing the surface of the anode body (11) electrochemically.

  The electrolyte layer (14) is formed on the outer peripheral surface of the dielectric layer (13) using a conductive organic material such as a conductive inorganic material such as manganese dioxide, a TCNQ (Tetracyano-quinodimethane) complex salt, or a conductive polymer. Yes.

  Although not shown, the cathode layer (15) includes a carbon layer formed on the outer peripheral surface of the electrolyte layer (14), and a silver paste layer formed on the carbon layer and electrically connected to the carbon layer. Is included.

Next, a method for producing the anode sintered body (10) will be described.
FIG. 3 is a perspective view for explaining a forming body manufacturing process of the method for manufacturing an anode sintered body. As shown in FIG. 3, first, in the forming body manufacturing step, an anode forming body (20) to be an anode sintered body (10) is manufactured. Here, the anode forming body (20) includes a rectangular powder shaped body (21) formed from tantalum powder and two of the six outer peripheral surfaces of the powder shaped body (21) having the largest area. The anode lead (12) planted on the outer peripheral surface (213) different from the flat surfaces (211) (212) is constituted. The powder compact (21) is formed by filling a mold with tantalum powder and then compacting it.

  FIG. 4 is a perspective view for explaining an arranging step of the method for manufacturing an anode sintered body. The arranging step is performed after the forming body producing step. As shown in FIG. 4, in the arranging step, first, a metal tray (3) capable of accommodating a plurality of anode forming bodies (20) is prepared. Here, the metal tray (3) is made of the same metal as the metal powder forming the powder molded body (21) of the anode forming body (20), that is, tantalum.

Subsequently, a plurality of anode forming bodies (20) to (20) are connected to the metal tray (3) from the inlet (32), and the anode leads (12) to (12) are connected to the metal tray (3). Loading is performed in the direction opposite to the bottom (31). At this time, the plurality of anode forming bodies (20) to (20) are arranged on the metal tray (3) with the planes (211) and (212) facing each other.
As a result, as shown in FIG. 4, the plurality of anode forming bodies (20) to (20) are arranged in a row on the metal tray (3) while maintaining the same posture. As a result, each anode forming body (20) has two flat surfaces (211) (212) of the powder compact (21) substantially perpendicular to the element mounting surface (35) of the metal tray (3). It will be placed in a standing posture.

  FIG. 5 is a perspective view for explaining an arrangement step of the method for manufacturing an anode sintered body. The arranging step is executed after the arranging step. As shown in FIG. 5, in the arranging step, first, a metal baking case (4) capable of accommodating a plurality of metal trays (3) is prepared. Subsequently, a metal tray (3) in which a plurality of anode forming bodies (20) to (20) are accommodated in a firing case (4), and its bottom (31) is the bottom of the firing case (4). A plurality of devices are arranged in a posture in surface contact with (42).

  Thereafter, the firing case (4) is placed on the placement surface (41) of the firing table (40) provided in the firing apparatus. At this time, the firing case (4) is arranged in a posture in which the bottom (42) is in surface contact with the placement surface (41). Here, the mounting surface (41) faces substantially vertically upward and extends in the horizontal direction. Accordingly, each anode forming body (20) has the two flat surfaces (211) (212) of the powder compact (21) standing substantially perpendicular to the mounting surface (41) and the tip of the anode lead (12). The part (121) is disposed on the placement surface (41) in a posture in which the part (121) is directed substantially vertically upward.

  A firing process is performed after execution of an arrangement process. In the firing step, the temperature of the atmosphere on the placement surface (41) of the firing table (40) is raised to 1200 ° C. to 1400 ° C., and a plurality of anode forming bodies (20 ) To (20) are fired. Thereby, the powder molded body (21) is sintered to form the anode body (11), and as a result, the anode sintered body (10) having the anode body (11) and the anode lead (12) is completed. become.

  In the above manufacturing method, each anode forming body (20) has two planes (211) (212) of the powder compact (21) substantially perpendicular to the mounting surface (41) of the firing table (40). Baked in a standing position. Each anode forming body (20) has two flat surfaces (211) (212) of the powder compact (21) standing substantially perpendicular to the element mounting surface (35) of the metal tray (3). Baked in a different posture. Therefore, the difference in the amount of heat given to the two flat surfaces (211) (212) of the powder compact (21) in the firing step is reduced. Therefore, in each anode forming body (20), the difference in thermal shrinkage between the two planes (211) and (212) of the powder compact (21) is reduced, and as a result, the powder compact (21) is sintered. In the anode body (11) formed in this manner, warping with the curved planes (111) and (112) is unlikely to occur.

  Further, in the above manufacturing method, each anode formed body (20) is fired in a posture in which the anode lead (12) is directed substantially vertically upward, so that the anode lead (12) of each anode formed body (20) However, it does not come into contact with the powder molded body (21) or anode lead (12) of another anode forming body (20). Therefore, the anode lead (12) is unlikely to be bent.

  Further, in the above manufacturing method, the metal tray (3) is made of the same metal as the metal powder forming the powder molded body (21) of the anode forming body (20), that is, tantalum. Therefore, a metal different from tantalum is prevented from entering the powder compact (21) from the metal tray (3) during firing.

Next, the arrangement apparatus used in the arrangement step will be described.
FIG. 6 is a top view showing the arrangement device. 7 to 11 are cross-sectional views taken along the line AA shown in FIG. 6 and explain the operation of the arrangement device. As shown in FIGS. 6 and 7, the arranging device includes a conveying device (61) such as a vibration feeder, a downstream shutter (62), an upstream shutter (63), and a storage device (64). Yes.

The transport device (61) has a transport surface (611) for transporting the plurality of anode forming bodies (20) to (20) in a predetermined direction (91), and a downstream area of the transport surface (611) An inclined surface (612) that is inclined downward to the side is formed. Here, a guide groove (613) extending in a predetermined direction (91) is formed on the transport surface (611), and the anode forming body (20) on the transport surface (611) is formed as a guide groove (613). Move in a predetermined direction (91). At this time, the posture of the anode formed body (20) is defined by the guide groove (613) such that the tip (121) of the anode lead (12) of the anode formed body (20) faces the upstream side. .
Therefore, the plurality of anode forming bodies (20) to (20) moving in the predetermined direction (91) on the transport surface (611) is the tip (121) of the anode lead (12) of each anode forming body (20). ) Will be lined up in the upstream direction.

  Each anode forming body (20) moving in a predetermined direction (91) on the transport surface (611) reaches the inclined surface (612), and then slides down along the inclined surface (612), thereby forming an anode lead. The sheet is discharged from the downstream end (614) of the conveying surface (611) with the tip (121) of (12) facing the upstream side.

  In the transport device (61), a notch (615) extending upstream is formed at a substantially central position of the guide groove (613) at the downstream end (614) of the transport surface (611). Therefore, when each anode forming body (20) is discharged from the downstream end (614) of the conveying surface (611), the anode lead (12) facing the upstream side passes through the inside of the notch (615). Become. Therefore, the anode lead (12) does not collide with the transport surface (611) when the anode forming body (20) is discharged, and as a result, the anode lead (12) is prevented from being damaged or bent.

  The downstream shutter (62) is installed on the inclined surface (612), and the closed position for preventing the anode forming body (20) from moving along the inclined surface (612) as shown in FIG. As shown in FIG. 8, it can be moved between an open position through which the anode forming body (20) passes.

The upstream shutter (63) is installed on the inclined surface (612) and upstream of the downstream shutter (62), and the anode forming body (20) moves along the inclined surface (612). As shown in FIG. 8, it can move between a closed position for blocking and an open position for passing the anode forming body (20) as shown in FIG.
Here, the upstream shutter (63) is installed at a position where only one powder molded body (21) of the anode forming body (20) is accommodated between the upstream shutter (62). The upstream shutter (63) has a pair of protrusions (631) and (631). As shown in FIG. 6, when the upstream shutter (63) is set at the closed position, the pair of protrusions (631) and (631) are formed along the inclined surface (612) by the downstream shutter (62). It has positions to be placed on both sides of the anode lead (12) of the anode forming body (20) that is prevented from moving.

  The storage device (64) moves the metal tray (3) in one direction on the downstream end (614) side of the transport surface (611). Specifically, as shown in FIG. 7, the storage device (64) has the metal tray (3), the inlet (32) thereof to the downstream end (614) of the transfer surface (611) of the transfer device (61). At the same time, it is supported in such a posture that its longitudinal direction is directed vertically upward (92). In addition, the storage device (64) moves the metal tray (3) by a predetermined distance L0 (see FIG. 9) at a predetermined timing in the direction opposite to the vertically upward direction (92).

Next, the operations of the downstream shutter (62) and the upstream shutter (63) of the arrangement device and the operation of the storage device (64) will be described.
First, as shown in FIG. 7, both the downstream shutter (62) and the upstream shutter (63) are set to the closed position (first setting state). By this setting, the movement of one anode forming body (20) positioned immediately upstream of the downstream shutter (62) is prevented by the downstream shutter (62). Accordingly, the movement of the plurality of anode forming bodies (20) to (20) arranged on the upstream side of the anode forming body (20) is prevented. At this time, the powder molded body (21) of the anode forming body (20) located on the upstream side comes into contact with the anode lead (12) of each anode forming body (20).

  In the first setting state, the upstream shutter (63) is set to the closed position in such a situation. However, the anode lead (12) of the anode forming body (20) that is prevented from moving by the downstream shutter (62) has a pair of protrusions (631) and (631) of the upstream shutter (63) on both sides thereof. Therefore, the upstream shutter (63) does not come into contact. Therefore, the anode lead (12) of the anode forming body (20) is not damaged by the upstream shutter (63).

  In the first setting state, the tip end portion of the anode lead (12) protrudes from the upstream shutter (63) to the upstream side by a length (projection length) L. Therefore, one anode forming body (20) positioned immediately upstream of the upstream shutter (63) contacts the tip of the anode lead (12) protruding from the upstream shutter (63), thereby causing the upstream side It stays at a position separated from the shutter (63) by the protrusion length L upstream.

  Subsequently, as shown in FIG. 8, the downstream shutter (62) is set to the open position (second setting state). With this setting, the anode forming body (20) that has been prevented from moving by the downstream shutter (62) slides down along the inclined surface (612), and the tip (121) of the anode lead (12) is moved upstream. The sheet is discharged from the downstream end (614) of the conveying surface (611) while maintaining the posture toward the side. The discharged anode forming body (20) is loaded into the metal tray (3) with its anode lead (12) facing away from the bottom (31) of the metal tray (3). As a result, the anode formed body (20) has the two flat surfaces (211) (212) of the powder molded body (21) standing substantially perpendicular to the element mounting surface (35) of the metal tray (3). Will be placed in a different posture.

  On the other hand, the anode forming body (20) positioned immediately above the upstream side of the upstream shutter (63) moves to the downstream side by the protruding length L, and the pair of protrusions (631) of the upstream shutter (63). ) (631) prevents movement. Accordingly, the movement of the plurality of anode forming bodies (20) to (20) arranged on the upstream side of the anode forming body (20) is prevented.

  Next, as shown in FIG. 9, the downstream shutter (62) is set to the closed position, and the metal tray (3) is placed in a direction opposite to the vertically upward direction (92) by the storage device (64). Move by a fixed distance L0 (third setting state). As a result, a space in which the next anode forming body (20) discharged from the downstream end (614) of the transport surface (611) is to be accommodated is set at the loading position P of the anode forming body (20). .

  Subsequently, as shown in FIG. 10, the upstream shutter (63) is set to the open position (fourth setting state). With this setting, the anode forming body (20) that has been prevented from moving by the upstream shutter (63) slides down along the inclined surface (612), and is then prevented from moving again by the downstream shutter (62). Will be.

  After that, as shown in FIG. 11, the upstream shutter (63) is set to the closed position, and the downstream shutter (62) and the upstream shutter (63) are returned to the first setting state again. Then, by repeatedly performing the operation from the first setting state to the fourth setting state, the plurality of anode forming bodies (20) to (20) are moved to the downstream end ( 614) are discharged one by one at a predetermined timing. At this time, any discharged anode forming body (20) is discharged in a posture in which the tip end portion (121) of the anode lead (12) faces the upstream side.

  Further, the metal tray (3) is moved by the accommodating device (64) by a certain distance L0 at the same timing as the timing at which the plurality of anode forming bodies (20) to (20) are discharged, thereby making the metal tray (3). A plurality of anode forming bodies (20) to (20) are sequentially loaded on the tray (3) one by one in the same posture on the side opposite to the sliding direction of the metal tray (3). As a result, the plurality of anode forming bodies (20) to (20) loaded in the metal tray (3) are connected to the anode lead (12) to (12) at the bottom (31) of the metal tray (3). Will be arranged in a row with the same posture toward the opposite side. Each anode forming body (20) has two flat surfaces (211) (212) of the powder compact (21) standing substantially perpendicular to the element mounting surface (35) of the metal tray (3). Will be placed in a different posture.

In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim.
In the arranging step of the manufacturing method, a plurality of anode forming bodies (20) to (20) are arranged in a row using a metal tray (3), but the present invention is not limited to this. Absent. For example, as shown in FIG. 12, a metal jig (5) having a plurality of rows of grooves (51) to (51) recessed may be used. In this case, as shown in FIG. 13, a plurality of anode forming bodies (20) to (20) are accommodated in the grooves (51) of the metal jig (5), and the plurality of anode forming bodies (20) to (20) 20) will be arranged in multiple columns. The metal jig (5) is preferably formed from the same metal as the metal powder forming the powder molded body (21) of the anode forming body (20), like the metal tray (3).

  The arrangement process of the manufacturing method is not limited to the metal tray (3) and the metal jig (5), and a plurality of anode forming bodies (20) to (20) can be arranged in one or a plurality of rows. A container may be used.

In the arrangement step of the manufacturing method, the bottom portion (42) of the firing case (4) is in surface contact with the placement surface (41), but the present invention is not limited to this. For example, the bottom portion (42) of the firing case (4) may be in point contact or line contact with the placement surface (41).
Further, as shown in FIG. 14, the bottom (42) of the firing case (4) may be separated from the mounting surface (41). Specifically, a pair of left and right support portions (45) and (45) are provided on both sides of the firing case (4), and the firing case (4) is placed on the mounting surface by the pair of support portions (45) and (45). (41) Support above. Here, each support portion (45) is formed integrally with the firing case (4) and extends downward from the upper end of the side wall (46) of the firing case (4) along the side wall (46). The support (45) has a height dimension T that is greater than the height dimension T0 of the side wall (46). Thus, even when the bottom portion (42) of the firing case (4) is separated from the mounting surface (41), each anode forming body (20) in the metal tray (3) is a powder compact ( The two flat surfaces (211) and (212) of 21) are arranged in a posture in which they stand substantially perpendicular to the element mounting surface (35) of the metal tray (3).

In the arrangement step of the above manufacturing method, the anode forming body (20) is configured such that the two flat surfaces (211) (212) of the powder molded body (21) stand substantially perpendicular to the mounting surface (41) and Although the lead (12) is disposed on the placement surface (41) in a posture in which the lead (12) is directed substantially vertically upward, the present invention is not limited to this. For example, the anode forming body (20) has the two flat surfaces (211) (212) of the powder compact (21) standing substantially perpendicular to the mounting surface (41) and the anode lead (12) substantially vertically. You may arrange | position on this mounting surface (41) with the attitude | position facing downward.
According to the above arrangement, the anode lead (12) is unlikely to be bent in the firing step. Further, since the anode lead (12) is directed substantially vertically downward, the anode forming body (20) is difficult to receive the load of the anode lead (12). Accordingly, stress is hardly generated in the anode formed body (20), and as a result, cracks and the like are hardly generated in the anode formed body (20).

  The anode forming body (20) has the two flat surfaces (211) (212) of the powder compact (21) standing substantially perpendicular to the mounting surface (41) and the anode lead (12) in a substantially horizontal direction. You may arrange | position on this mounting surface (41) in the direction which faced.

  In the above embodiment, the powder molded body (21) of the anode formed body (20) was formed from tantalum powder, and the anode lead (12) was planted in the powder molded body (21). Is not limited to this. For example, the powder molded body (21) of the anode forming body (20) may be formed from various metal powders such as niobium powder, titanium powder, and aluminum powder. Various anode leads such as niobium leads, titanium leads, aluminum leads, etc. may be planted in the powder compact (21).

(1) Capacitor element
(10) Anode sintered body
(11) Anode body
(111) plane
(112) Plane
(113) Outer surface
(12) Anode lead
(13) Dielectric layer
(14) Electrolyte layer
(20) Anode former
(21) Powder compact
(211) Plane
(212) Plane
(213) Outer surface
(3) Metal tray (container)
(40) Firing stand
(41) Mounting surface
(5) Metal jig (container)
(51) Groove
(61) Transfer device
(611) Transport surface
(612) Inclined surface
(613) Guide groove
(614) Downstream end
(62) Downstream shutter
(63) Upstream shutter
(631) Projection
(64) Containment device
(91) Predetermined direction

Claims (6)

An anode sintered body formed by planting anode leads on a rectangular parallelepiped anode body, a dielectric layer formed on the outer peripheral surface of the anode body, and an electrolyte layer formed on the outer peripheral surface of the dielectric layer The anode lead is a method of manufacturing a capacitor element planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the anode body,
Anode formation comprising a rectangular parallelepiped powder molded body formed from metal powder and an anode lead planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the powder molded body A body is placed on the mounting surface of the firing table in contact with the mounting surface or spaced from the mounting surface, the anode forming body being placed in front of the plane of the powder compact An arrangement step of arranging on the placement surface in a posture standing substantially perpendicular to the placement surface;
A method of manufacturing a capacitor element, comprising: a firing step of firing the anode formed body to produce the anode sintered body after the placement step. An anode sintered body formed by planting anode leads on a rectangular parallelepiped anode body, a dielectric layer formed on the outer peripheral surface of the anode body, and an electrolyte layer formed on the outer peripheral surface of the dielectric layer The anode lead is a method of manufacturing a capacitor element planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the anode body,
Anode formation comprising a rectangular parallelepiped powder molded body formed from metal powder and an anode lead planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the powder molded body A body is placed on the mounting surface of the firing table, and can be placed in contact with or spaced from the mounting surface of the firing table, and the anode forming body A plurality of anode forming bodies are loaded and arranged in a container using a container capable of housing a plurality of the anode forming body, and the flat surface of the powder compact is placed on the element of the container. An arrangement step of arranging in a posture standing substantially perpendicular to the mounting surface;
A method of manufacturing a capacitor element, comprising: a firing step of firing the anode formed body to produce the anode sintered body after the placement step.   The method for manufacturing a capacitor element according to claim 2, wherein the container is made of the same metal as the metal powder forming the powder molded body of the anode forming body. Anode formation comprising a rectangular parallelepiped powder molded body formed from metal powder and an anode lead planted on a surface different from two planes having the largest area among the six outer peripheral surfaces of the powder molded body An arrangement device for arranging a plurality of bodies in a container that can accommodate a plurality of the anode-forming bodies,
An anode forming body having a conveying surface that conveys the anode forming body in a predetermined direction, and an inclined surface that is inclined downward toward the downstream side is formed in a downstream area of the conveying surface, and slides down the inclined surface A transport device that discharges from the downstream end of the transport surface;
A downstream shutter installed on the inclined surface and movable between a closed position for preventing the anode forming body from moving along the inclined surface and an open position for allowing the anode forming body to pass through;
A closed position that is installed on the inclined surface and upstream of the downstream shutter and prevents the anode forming body from moving along the inclined surface; and an open position through which the anode forming body passes. An upstream shutter movable between,
An array device comprising: a storage device that moves the storage device in one direction on the downstream end side of the transport surface.   The arrangement device according to claim 4, wherein a guide groove is formed on the transport surface to define a posture of the anode forming body in a posture in which a tip portion of an anode lead of the anode forming body faces an upstream side.   The upstream shutter has a pair of protrusions, and the pair of protrusions is formed with an anode that is prevented from moving along the inclined surface by the downstream shutter when the upstream shutter is set to the closed position. 6. Arrangement device according to claim 5, having a position to be placed on both sides of the anode lead of the body.

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