JP2011077074A - Thin-film solar cell and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin-film solar cell using a flexible glass substrate having small thickness, strong brittleness and high breakability wherein the glass substrate is prevented from being damaged and broken. <P>SOLUTION: The problem is solved by the thin-film solar cell 10 comprising at least a glass substrate 1 with a thickness of 30 to 200 μm, a damage prevention layer 7 formed on at least one surface of the glass substrate 1, an electrode layer 2 provided on the glass substrate 1 or the damage prevention layer 7, and a chalcopyrite compound semiconductor layer 3 provided on the electrode layer 2. A metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is preferable as the damage prevention layer 7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thin film solar cell and a method for manufacturing the same, and more particularly, in a thin film solar cell having flexibility and high conversion efficiency, a thin film solar cell that prevents damage to a glass substrate used as a substrate and a method for manufacturing the same About.

A solar cell (hereinafter referred to as a CIGS solar cell) including a CIGS (Cu (In, Ga) Se ₂ ) -based chalcopyrite compound semiconductor layer having a high conversion efficiency as a light absorption layer has been studied in various fields. ing. This CIGS solar cell is usually formed on a soda lime glass substrate. However, the glass substrate has a drawback that it lacks flexibility and is easily broken and difficult to handle. In order to solve these problems, it has been studied to use a metal sheet such as a stainless steel sheet and a carbon sheet, or a polymer film such as polyimide as a substrate (see Patent Documents 1 and 2).

In CIGS solar cells, a high temperature process of 450 ° C. or higher is required, and lowering the temperature is thought to cause a reduction in conversion efficiency. When a metal sheet is used for the substrate, there is no problem in terms of heat resistance, but because the substrate is conductive, a plurality of solar cells are formed and electrically connected in series, so-called monolithic In order to form a solar cell of a type, there is a possibility that the inconvenience that the wiring easily short-circuits. When a monolithic solar cell is intentionally formed, it is necessary to form an insulating film such as SiO ₂ on the metal sheet.

  In addition, when a polymer film is used for the substrate, there is a problem with heat resistance, and even when a heat resistant film such as polyimide is adopted, the process temperature is limited to about 400 ° C. at the maximum, and the conversion efficiency is high. A solar cell cannot be formed.

  On the other hand, if a rolled flexible substrate can be used, the manufacturing process of a solar cell can be made efficient and manufacturing cost can be reduced. In response to such demands, Patent Document 3 proposes a mica-containing substrate that can be preferably applied to a roll-to-roll process, but such a substrate is special and has a drawback of increasing costs.

JP 2001-339081 A JP 2000-114399 A JP 2007-35677 A JP 2006-192658 A JP 2006-208611 A

  In view of such a current situation, it can be said that it is desirable to obtain a flexible CIGS solar cell because a flexible glass substrate having a small thickness is considered to be excellent in insulation, heat resistance and cost.

  However, a flexible glass substrate having a small thickness has a problem that it is highly brittle and easily damaged. In particular, when there are scratches or cracks in the glass substrate, when an external force is applied to the glass substrate, the glass substrate is easily damaged. Such scratches or cracks are likely to occur on the front surface, back surface or edge of the thin film solar cell during the manufacturing process. In addition, when forming a chalcopyrite compound semiconductor layer, a high temperature of about 500 to 600 ° C. is required to obtain high conversion efficiency. Therefore, during this high temperature process, The glass substrate is likely to be damaged starting from the crack, and if the glass substrate remains strained in the high temperature process, the glass substrate is likely to be damaged starting from the scratch or crack after the high temperature process is completed.

  As a related technique, for example, in Patent Document 4, an acrylic cover is provided on the glass substrate surface or a film with an adhesive layer is bonded to the glass substrate surface as a technique for preventing the glass substrate from cracking. Further, Patent Document 5 proposes a glass substrate having an anti-scratch layer that covers the edge of the glass substrate, and prevents the glass substrate from cracking so as not to cause damage to the edge. .

  The present invention has been made in order to solve the above-mentioned problems, and its purpose is to break the glass substrate in a thin-film solar cell using a flexible glass substrate that is thin, strong in brittleness, and easily damaged. It is another object of the present invention to provide a thin film solar cell that prevents cracks and the like. Another object of the present invention is to provide a manufacturing method capable of manufacturing such a thin-film solar cell at a low cost without restricting the manufacturing process or causing a reduction in process yield.

  A thin-film solar cell according to the present invention for solving the above-described problems includes a glass substrate having a thickness of 30 to 200 μm, a breakage prevention layer formed on at least one surface of the glass substrate, and the glass substrate or the It has at least an electrode layer provided on the damage prevention layer and a chalcopyrite compound semiconductor layer provided on the electrode layer.

  According to this invention, since the damage prevention layer is formed on at least one surface of the glass substrate, the thickness is thin, the brittleness is strong, and even when a flexible glass substrate that is easily damaged is used, It is possible to provide a thin film solar cell that prevents breakage and cracking of a glass substrate. The glass substrate may be a soda lime glass substrate or a non-alkali glass substrate.

  In the thin film solar cell according to the present invention, (1) a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed on the electrode layer side surface of the glass substrate as the damage prevention layer. (2) In the case of (1), a resin layer is further provided on the surface opposite to the electrode layer side surface of the glass substrate as the damage prevention layer, or (3) as the damage prevention layer, A metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed on the surface opposite to the electrode layer side surface of the glass substrate.

  In the inventions of these (1) to (3), since the respective damage prevention layers are formed or provided on the electrode layer side surface of the glass substrate or the surface opposite to the electrode layer side surface of the glass substrate, The anti-breakage layer acts to prevent generation of scratches and cracks on the glass substrate surface. As a result, it is possible to prevent breakage and breakage of the glass substrate based on such scratches and cracks.

  The method for manufacturing a thin-film solar cell according to the present invention for solving the above-described problems includes a step of forming a damage prevention layer on at least one surface of a glass substrate having a thickness of 30 to 200 μm, and the glass substrate or the damage prevention layer. At least a step of forming an electrode layer and a step of forming a chalcopyrite compound semiconductor layer on the electrode layer.

  In the method for manufacturing a thin-film solar cell according to the present invention, as the damage prevention layer, a metal oxide layer, a metal nitride layer, a surface on the electrode layer side of the glass substrate and / or a surface opposite to the surface on the electrode layer side, A metal oxynitride layer or a metal carbide layer is formed.

  In the method for manufacturing a thin film solar cell according to the present invention, a resin layer is provided on the surface opposite to the electrode layer side surface of the glass substrate after the step of forming the chalcopyrite compound semiconductor layer.

  According to the thin film solar cell and the method for manufacturing the same according to the present invention, since the damage prevention layer is formed on at least one surface of the glass substrate, the flexible glass substrate is thin, strong in brittleness, and easily damaged. Even if it is a case, the thin film solar cell which prevented the failure | damage of the glass substrate, a crack, etc. can be provided.

It is a schematic cross section which shows an example of the thin film solar cell concerning this invention. It is a schematic cross section which shows another example of the thin film solar cell which concerns on this invention. It is a schematic cross section which shows another example of the thin film solar cell which concerns on this invention. It is a schematic cross section which shows another example of the thin film solar cell which concerns on this invention. It is explanatory drawing which shows an example of the manufacturing process of the thin film solar cell which concerns on this invention.

  Hereinafter, the thin film solar cell and the manufacturing method thereof according to the present invention will be described in detail. Note that the present invention is not limited to the form of the drawings and the following description as long as the technical features are included.

[Thin film solar cell]
1-4, the thin film solar cell 10 according to the present invention includes a glass substrate 1 having a thickness of 30 to 200 μm, a damage prevention layer 7 formed on at least one surface of the glass substrate 1, and a glass. An electrode layer 2 provided on the substrate 1 or the breakage prevention layer 7, a chalcopyrite compound semiconductor layer 3 provided on the electrode layer 2, a buffer layer 4 provided on the chalcopyrite compound semiconductor layer 3, And a transparent electrode layer 5 provided on the buffer layer 4. A collecting electrode 6 is provided on the transparent electrode layer 5.

  A thin film solar cell 10 shown in FIG. 1 includes a glass substrate 1, a damage prevention layer 7, an electrode layer 2, a chalcopyrite compound semiconductor layer 3, a buffer layer 4, a transparent electrode layer 5, and a collecting electrode 6 stacked in that order. This is an embodiment. A thin film solar cell 10 shown in FIG. 2 is an example in which a damage preventing layer 7 is further provided on the surface opposite to the electrode layer side surface of the glass substrate 1 in the thin film solar cell 10 of FIG. The thin film solar cell 10 shown in FIG. 3 is the same as the thin film solar cell 10 of FIG. 1, but does not form the damage prevention layer 7 on the electrode layer side surface of the glass substrate 1 and is opposite to the electrode layer side surface of the glass substrate 1. This is an example in which a damage prevention layer 7 is provided on the surface. A thin film solar cell 10 shown in FIG. 4 is an example in which a doped layer 8 is provided between the electrode layer 2 and the chalcopyrite compound semiconductor layer 3 in the thin film solar cell 10 of FIG.

  According to each of these thin-film solar cells 10, even when the flexible glass substrate 1 is thin, brittle, and easily damaged, the surface on the electrode layer side and / or the electrode layer side of the glass substrate Scratches and cracks are unlikely to occur on the surface opposite to the surface. As a result, even when an external force is applied to the glass substrate, it is difficult to break from the scratch or crack as a starting point. Further, in the thin film solar cell 10 according to the present invention, such scratches and cracks are caused by forming the damage prevention layer 7 on the glass substrate 1, so that the surface on the electrode layer side during the manufacturing process of the thin film solar cell 10, It hardly occurs on the surface opposite to the surface on the electrode layer side or on the edge. As a result, for example, during the high temperature process when forming the chalcopyrite compound semiconductor layer 3, no damage to the glass substrate starting from scratches or cracks occurs, and even if distortion remains in the glass substrate 1 in the high temperature process, The glass substrate 1 is not damaged starting from scratches or cracks after completion of the high temperature process.

[Configuration of thin film solar cell]
The structure of the thin film solar cell 10 of Examples 1 to 4 illustrated in FIGS. 1 to 4 will be described in the order of the manufacturing process of the thin film solar cell 10.

  The glass substrate 1 may be a soda lime glass substrate or a non-alkali glass substrate, and is not particularly limited. Any glass substrate is preferably used because it has both insulation and heat resistance compared to a metal substrate or a resin substrate. Moreover, it is preferable that the thickness is 30-200 micrometers. The glass substrate 1 in this thickness range is flexible, can be rolled, and can be supplied to the manufacturing process in a rolled form. Moreover, since the thin film solar cell 10 after completion can be given flexibility by using such a glass substrate 1, it can also be laid on a structure having a curved surface.

  If the thickness of the glass substrate 1 is less than 30 μm, the production of the glass substrate itself becomes difficult and the cost is increased, and if it is too thin, the glass substrate 1 may be damaged by itself and handling becomes difficult. On the other hand, when the thickness of the glass substrate 1 exceeds 200 μm, flexibility is lost, and the glass substrate 1 is easily damaged when bent. In addition, from a viewpoint of flexibility, handling property, and availability, a thickness of 50 to 100 μm is preferable.

  The electrode layer 2 is provided on the glass substrate 1 or on the damage prevention layer 7 when a damage prevention layer 7 described later is formed on the glass substrate 1. As the electrode layer 2, a metal layer made of molybdenum or the like, or a transparent conductive layer made of ITO (indium tin oxide) or the like can be preferably applied. The electrode layer 2 can be formed by a vacuum deposition method, a sputtering method, a CVD method, or the like, and the thickness is usually about 0.1 to 1 μm.

  As shown in FIGS. 1 and 2, the breakage prevention layer 7 is formed on at least one surface (one surface or both surfaces) of the glass substrate 1. By forming such a breakage prevention layer 7 on at least one surface of the glass substrate 1, the glass substrate 1 can be used even when the flexible glass substrate 1 is thin, brittle, and easily broken. It is possible to manufacture a thin film solar cell that prevents breakage, cracking, and the like.

  Specifically, (1) a mode in which a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed only on the surface of the glass substrate 1 on the electrode layer 2 side, (2) glass A metal oxide layer, a metal nitride layer, a metal oxynitride layer or a metal carbide layer is formed on the surface of the substrate 1 on the electrode layer 2 side, and a resin is disposed on the surface opposite to the surface of the glass substrate 1 on the electrode layer 2 side. (3) A metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed only on the surface opposite to the surface on the electrode layer 2 side of the glass substrate 1 Embodiments can be mentioned. In these (1) to (3), each damage prevention layer 7 is formed or provided on the surface of the glass substrate 1 on the electrode layer 2 side or on the surface opposite to the surface on the electrode layer 2 side. The layer 7 acts to prevent generation of scratches and cracks on the surface of the glass substrate 1 on the electrode layer 2 side or on the surface opposite to the surface on the electrode layer 2 side. As a result, it is possible to prevent the glass substrate 1 from being cracked and broken based on such scratches or cracks.

  In the present application, “film formation” means a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer, a sputtering method such as RF sputtering and DC sputtering, or a CVD method such as plasma CVD. It means the thin film formation mode formed on the glass substrate 1 by the above. Further, “providing” refers to a thin film formation aspect including film formation, and means to include a coating formation aspect or a print formation aspect.

  When the damage prevention layer 7 is formed on the surface of the glass substrate 1 on the electrode layer 2 side, the thin film solar cell 10 (electrode layer 2, chalcopyrite compound semiconductor layer 3, buffer layer 4, transparent layer is formed on the damage prevention layer 7. It is preferable that the breakage prevention layer 7 has heat resistance to a high temperature of about 500 to 600 ° C. when the chalcopyrite compound semiconductor layer 3 is formed. Examples of the heat-resistant breakage prevention layer 7 include a metal oxide layer, a metal nitride layer, a metal oxynitride layer, and a metal carbide layer. The insulating layer 7 is preferably an insulating layer, but may be conductive. In general, a metal oxide layer, a metal nitride layer, or a metal oxynitride layer often has an insulating property, and a metal carbide layer often has a conductivity or a semiconductor property.

Examples of the metal oxide include silicon oxide, titanium oxide, aluminum oxide, zirconium oxide, niobium oxide, tantalum oxide, and silicate glass (SiO ₂ —Na ₂ O system), and examples of the metal nitride include silicon nitride. Examples of the metal oxynitride include silicon oxynitride and aluminum oxynitride. Examples of the metal carbide include silicon carbide, aluminum carbide, and titanium carbide. be able to. In addition to these inorganic compound layers, a relatively heat-resistant polymer material such as polyimide can also be used. However, after the damage prevention layer 7 is formed of a polymer material, the thin film solar cell 10 (electrode layer 2, chalcopyrite compound semiconductor layer) 3), the formation temperature of the chalcopyrite compound semiconductor layer 3 must be limited to a temperature (for example, 400 ° C. to 500 ° C.) corresponding to the heat resistance of the polymer material.

  On the other hand, as shown in FIG. 3, when the damage prevention layer 7 is formed on the surface opposite to the surface on the electrode layer 2 side of the glass substrate 1, the thin film solar cell 10 ( Since the electrode layer 2 and the chalcopyrite compound semiconductor layer 3 etc. are not formed, the damage prevention layer 7 is placed on the electrode layer 2 side before forming each layer (electrode layer 2, chalcopyrite compound semiconductor layer 3 etc.) on the glass substrate 1. The anti-breakage layer 7 may be formed on the surface opposite to the surface on the electrode layer 2 side after forming each layer.

  In the case of the former (formation of the breakage prevention layer 7 on the surface opposite to the surface on the electrode layer 2 side before forming each layer on the glass substrate 1), since it is exposed to the high temperature process of the chalcopyrite compound semiconductor layer 3, The breakage prevention layer 7 needs to be heat resistant. On the other hand, in the latter case (after each layer is formed on the glass substrate 1, the damage prevention layer 7 is formed on the surface opposite to the surface on the electrode layer 2 side), the glass substrate 1 during the manufacturing process of the thin film solar cell 10 Although there is no effect of preventing breakage, breakage of the completed thin film solar cell 10 can be prevented. In this case, since the heat resistance is not required for the breakage prevention layer 7, a resin layer made of a polymer material that is flexible, inexpensive, and versatile can be used.

  As shown in FIG. 3, the resin layer formed as the damage prevention layer 7 on the surface opposite to the electrode layer 2 side of the glass substrate 1 is polyethylene, polypropylene, polystyrene, nylon, polyethylene terephthalate, vinyl chloride, polyimide, ethylene. -What consists of polymer materials, such as a vinyl acetate copolymer and an ethylene vinyl alcohol copolymer, can be mentioned. The resin layer may be formed by coating, printing, or the like on the surface opposite to the surface on the electrode layer 2 side of the glass substrate 1, or resin on the surface opposite to the surface on the electrode layer 2 side of the glass substrate 1. It may be a laminate of films.

  The effect of preventing damage and breakage of the substrate increases as the thickness of the breakage prevention layer 7 increases. When the damage preventing layer 7 is an inorganic compound layer such as a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer, the thickness is preferably 0.1 to 10 μm. If the thickness of the breakage prevention layer 7 is less than 0.1 μm, the effect of preventing the substrate from being scratched and broken is reduced. On the other hand, if the thickness of the breakage prevention layer 7 is too thick, it takes materials and time to form the film. Furthermore, since the internal stress of the film deforms the substrate, 10 μm or less is appropriate. The thickness is more preferably 0.5 to 3 μm from the viewpoint of sufficiently preventing the substrate from being damaged and not deforming the substrate. Moreover, when the damage prevention layer 7 is a resin layer (a resin film is included), it is preferable that the thickness is 10-100 micrometers. A resin layer (resin film) having a thickness of less than 10 μm is not strong and has insufficient functions to prevent damage and breakage of the substrate. On the other hand, if the thickness exceeds 100 μm, the resin layer (resin film) If it itself becomes a hard plate shape and adhere | attaches with a glass substrate, the flexibility of a photovoltaic cell will be impaired.

In the thin film solar cell 10 of the present invention, a layer containing a group Ia element (referred to as a doped layer 8 in the present application) can be provided as necessary. As shown in FIG. 4, the doped layer 8 is a layer provided for doping a chalcopyrite compound semiconductor layer 3 described later with a group Ia element. Group Ia elements are elements such as Li, Na, and K, and when these elements diffuse and are doped into the chalcopyrite compound semiconductor layer 3, the conversion efficiency after the thin film solar cell 10 is configured is increased. Examples of the doped layer 8 include an oxide layer of Na such as soda lime glass and a compound layer such as NaF and Na ₂ S, and can be formed by a vapor deposition method, a sputtering method, or a CVD method. . The thickness of the doped layer 8 is usually about 0.005 to 0.2 μm.

  When a soda lime glass substrate is used as the glass substrate 1, Na in the soda lime glass substrate diffuses and is contained in the chalcopyrite compound semiconductor layer 3, so that the dope layer 8 may not be provided. . On the other hand, in order to prevent indefinite amount of Na from diffusing into the chalcopyrite compound semiconductor layer 3 from the soda lime glass substrate, a blocking layer for blocking the diffusion of Na is provided between the soda lime glass substrate and the chalcopyrite compound semiconductor layer 3. You may provide in arbitrary positions. The position where the blocking layer is provided may be between the soda lime glass substrate and the electrode layer 2 or between the electrode layer 2 and the chalcopyrite compound semiconductor layer 3. Further, when the breakage prevention layer 7 is provided, it may be between the soda lime glass substrate and the breakage prevention layer 7 or between the breakage prevention layer 7 and the electrode layer 2. . Examples of the barrier layer include oxides or nitrides such as aluminum, silicon, titanium, and zirconium, or layers made of metals such as titanium, zirconium, tantalum, tungsten, and hafnium. It can be formed by a CVD method. When the blocking layer is provided between the electrode layer 2 and the chalcopyrite compound semiconductor layer 3, the blocking layer is preferably a layer made of metal in order to ensure conductivity. The thickness of this blocking layer is usually about 0.05 to 1 μm.

The chalcopyrite compound semiconductor layer 3 is formed on the electrode layer 2 (if the doped layer 8 is provided, see FIG. 4). The chalcopyrite compound semiconductor layer 3 is a so-called light absorption layer, and is a layer made of a semiconductor containing a group Ib element, a group IIIb element, and a group VIb element. Specifically, a chalcopyrite compound semiconductor layer 3 containing Cu, one or both of In and Ga, and one or both of Se and S can be preferably exemplified. As an example, CuInSe ₂ , CuIn (Se, S) ₂ , Cu (In, Ga) Se ₂ , or Cu (In, Ga) (Se, S) ₂ can be exemplified.

Various methods can be applied as the method for forming the chalcopyrite compound semiconductor layer 3. For example, in the case of Cu (In, Ga) Se ₂ , the substrate temperature is set to about 300 ° C., and Se, In, and Ga are changed. For example, deposition is performed by a co-evaporation method while controlling the pressure range to about 10 ⁻⁴ to 10 ⁻⁵ Pa, and then the substrate temperature is raised to, for example, about 600 ° C., and Se and Cu are, for example, about 10 ⁻⁴ to 10 ⁻⁵ Pa. It is possible to deposit In, Ga and Se under the same pressure control while keeping the substrate temperature at, for example, about 600 ° C. Thus, the chalcopyrite compound semiconductor layer 3 made of Cu (In, Ga) Se ₂ can be formed. The chalcopyrite compound semiconductor layer 3 can be formed by sputtering, while controlling Cu, In, and Ga within a pressure range of about 10 ⁻³ to 10 ⁻⁵ Pa, in addition to the above co-evaporation method. After the deposition, a method of converting the metal layer into selenide by setting the substrate temperature to, for example, about 600 ° C. in an atmosphere containing Se is also possible.

  The buffer layer 4 is a semiconductor layer provided on the chalcopyrite compound semiconductor layer 3 in order to form a pn junction. Examples of the buffer layer 4 include a layer made of a compound containing CdS or Zn. Examples of the compound containing Zn include Zn (O, S) and ZnMgO. The buffer layer 4 can be formed by a solution growth (CBD) method, a sputtering method or a CVD method, and its thickness is not particularly limited, but is usually about 0.01 to 0.1 μm.

  Further, a second semiconductor layer may be further stacked as a part of the buffer layer 4. As such a second semiconductor layer, a layer made of ZnO or a material containing ZnO can be given. This layer can also be formed by sputtering or CVD, and its thickness is not particularly limited, but is usually about 0.01 to 0.1 μm.

  The transparent electrode layer 5 is formed on the buffer layer 4. Examples of the transparent electrode layer 5 include ZnO and ITO (indium tin oxide) doped with a group III element such as Al, and can be formed by a sputtering method or a CVD method. Although the thickness is not specifically limited, Usually, it is 0.1-1 micrometer.

  The collecting electrode 6 is a metal layer with good conductivity formed on the transparent electrode layer 5. Examples of the collecting electrode 6 include Au, Ag, Cu, Al, and Ni, and can be formed by vapor deposition or sputtering. Although the thickness is not specifically limited, Usually, it is 0.5-1 micrometer. Alternatively, a paste-like material containing these metal powder, resin, and solvent can be applied by screen printing and then dried to further reduce the resistance value by firing, for example, at about 500 to 600 ° C. In this case, the thickness is usually 10 to 100 μm.

  As shown in FIGS. 1 to 4, the thin-film solar cell 10 according to the present invention having such a configuration is formed with the damage prevention layer 7 on at least one surface of the glass substrate 1. Even when the flexible glass substrate 1 that is brittle and easily damaged is used, the thin film solar cell 10 can be provided in which the glass substrate 1 is prevented from being damaged or broken. In addition, the thin film solar cell 20 which connected the thin film solar cell demonstrated in FIG. 5 in series may be sufficient as the thin film solar cell of this invention.

[Method for Manufacturing Thin Film Solar Cell]
Next, the manufacturing method of a thin film solar cell is demonstrated. As shown in FIG. 5, the method for manufacturing the thin-film solar cell 10 according to the present invention includes a step of forming a damage prevention layer 7 on at least one surface of a glass substrate 1 having a thickness of 30 to 200 μm, and the glass substrate 1. It includes at least a step of forming the electrode layer 2 on the upper or damage prevention layer 7 and a step of forming the chalcopyrite compound semiconductor layer 3 on the electrode layer 2. A metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed on the electrode layer side surface of the glass substrate 1 and / or the surface opposite to the electrode layer side surface as the damage prevention layer 7. Alternatively, after the step of forming the chalcopyrite compound semiconductor layer 3, a resin layer is provided on the surface of the glass substrate 1 opposite to the surface on the electrode layer 2 side.

  Hereinafter, the steps will be described in the order of the steps of FIGS.

  First, the step shown in FIG. 5A includes a step of forming the breakage prevention layer 7 on the glass substrate 1 having a thickness of 30 to 200 μm, a step of forming the electrode layer 2 on the breakage prevention layer 7, and an electrode layer. 2 includes a step of removing a part of 2 in a stripe shape and dividing the electrode layer 2 into a plurality of strips in that order. A laser scribing method is used as a method of dividing the electrode layer 2 into a plurality of strips.

  Next, in the step shown in FIG. 5B, the chalcopyrite compound semiconductor layer 3 is formed on the electrode layer 2 divided into a plurality of parts (including the portion removed in a stripe shape) so as to cover the whole. And the step of forming the buffer layer 4 on the chalcopyrite compound semiconductor layer 3 in that order.

  Next, the step shown in FIG. 5C includes a step of dividing the chalcopyrite compound semiconductor layer 3 and the buffer layer 4 into a plurality of strips. The striped removal position at this time is preferably a position adjacent to the removal position performed in FIG. 5A from the viewpoint of avoiding a useless area. As a method of dividing the chalcopyrite compound semiconductor layer 3 and the buffer layer 4 into a plurality of strips, a mechanical scribing method using a metal needle is used, unlike the method performed in FIG.

  Next, the step shown in FIG. 5D is a step of forming the transparent electrode layer 5 on the buffer layer 4 divided into a plurality of parts (including a portion removed in a stripe shape) so as to cover the whole, and And a step of dividing the chalcopyrite compound semiconductor layer 3, the buffer layer 4, and the transparent electrode layer 5 into a plurality of strips. The striped removal position at this time is preferably a position adjacent to the removal position performed in FIG. 5B from the viewpoint of avoiding a useless area. As a method of dividing the chalcopyrite compound semiconductor layer 3, the buffer layer 4, and the transparent electrode layer 5 into a plurality of strips, a mechanical scribing method using a metal needle is used as in the method performed in FIG. Thus, the thin film solar cells 9, 9, 9 are connected in series with the electrode layer 2 and the transparent electrode layer 5.

  Finally, in the step shown in FIG. 5E, the stacked body (laminated body composed of the chalcopyrite compound semiconductor layer 3, the buffer layer 4, and the transparent electrode layer 5) at both ends connected in series is removed and exposed. A step of forming the current collecting electrode 6 on the electrode layer 2 and a step of forming the damage prevention layer 7 on the surface opposite to the surface of the glass substrate 1 on the electrode layer 2 side thereafter. Thus, an integrated thin film solar cell 20 in which the thin film solar cells 9 are connected in series can be manufactured.

  In particular, in the present invention, since the flexible glass substrate 1 having a thickness of 30 to 200 μm is used, the glass substrate 1 can be supplied to the manufacturing process in a rolled state. Supplying in a rolled state can facilitate the manufacturing process. Specifically, the breakage prevention layer 7 forming step, the electrode layer 2 forming step, and the plural division step shown in FIG. 5A are preferably performed by roll-to-roll. After that, it may be performed by roll, toe, and roll as it is, or after cutting into single sheets, individual sheets may be supplied to each step and sequentially performed.

  According to the manufacturing method of the thin film solar cell 10 described above, the breakage prevention layer 7 is formed on the glass substrate 1 before forming each layer (electrode layer 2, chalcopyrite compound semiconductor layer 3 and the like) constituting the thin film solar cell 10. It is formed (see FIG. 5A). Therefore, it is possible to prevent scratches and cracks from occurring on the surface of the glass substrate 1 on the electrode layer 2 side during the manufacturing process of the thin film solar cell 10. As a result, it is possible to prevent cracks and breakage due to scratches or cracks in the manufacturing process.

  Moreover, when the damage prevention layer 7 is formed on the surface opposite to the surface on the electrode layer 2 side of the glass substrate 1 (see FIG. 5E), the damage prevention layer 7 on the opposite surface to the surface on the electrode layer 2 side is Although there is no effect of preventing the glass substrate 1 from being damaged during the manufacturing process of the thin film solar cell 10, the thin film solar cell 10 after completion can be prevented from being damaged.

  In the method for manufacturing the thin-film solar cell 10, the damage prevention layer 7 is formed on or provided on the surface of the glass substrate 1 on the electrode layer 2 side and / or on the surface opposite to the electrode layer 2 side, thereby reducing the thickness. Even when the flexible glass substrate 1 that is brittle and easily damaged is used, it is possible to manufacture a thin film solar cell that prevents the glass substrate 1 from being damaged or cracked.

  The present invention will be described in more detail with reference to examples. In addition, the following Examples are examples and this invention is not limited to the following Examples.

[Example 1]
The CIGS thin film solar cell 10 according to the embodiment shown in FIG. 4 was produced, and the presence / absence of breakage, conversion efficiency, and the like were evaluated.

A non-alkali glass substrate (manufactured by Nippon Electric Glass Co., Ltd.) having a thickness of 100 μm was prepared as the glass substrate 1, and a silicon oxide layer having a thickness of 1 μm was formed thereon as the damage preventing layer 7 by RF sputtering. Next, a Mo layer having a thickness of 0.5 μm was formed as the electrode layer 2 on the breakage prevention layer 7 by a DC sputtering method. Subsequently, a NaF layer having a thickness of 100 nm was formed as a doped layer 8 on the electrode layer 2 by a vacuum deposition method. Subsequently, the substrate temperature was set to 350 ° C., In, Ga, and Se were deposited while controlling the pressure with an ionization vacuum gauge, then the substrate temperature was raised to 600 ° C., Cu and Se were deposited, and the substrate temperature was further increased. While maintaining the temperature at 600 ° C., In, Ga and Se are deposited to form a 1.7 μm thick CIGS (Cu (In, Ga) Se ₂ ) film as the chalcopyrite compound semiconductor layer 3 (light absorption layer). did. Next, a 50 nm thick CdS film was formed as a high resistance buffer layer 4 on the CIGS film by a solution growth method (CBD method). Further, a 0.1 μm-thick high-resistance ZnO layer not containing a dopant is formed as a transparent electrode layer 5 on the buffer layer 4 by RF sputtering, and then 0.6 μm-thick ZnO: Al is RF-sputtered. Then, an Au electrode having a thickness of 0.5 μm was formed as a collecting electrode 6 on the ZnO: Al by vacuum deposition. Thus, the thin film solar cell 10 having an effective area of 0.96 cm ² was completed.

When the conversion efficiency of the completed thin film solar cell 10 was measured using an air mass (AM) = 1.5 and a simulated solar cell of 100 mW / cm ² , it was 14 to 16%. This conversion efficiency was higher than that of about 11 to 13% of the resin (polyimide) substrate in which the substrate temperature during CIGS film formation was limited to about 400 ° C. Moreover, the remarkable damage | wound and crack did not arise in the glass substrate 1 which comprises a thin film solar cell, and the crack and damage of the glass substrate 1 did not arise.

[Example 2]
A thin film solar cell of Example 2 was fabricated in the same manner as in Example 1 except that the damage prevention layer 7 was changed to a silicon nitride (Si ₃ N ₄ ) layer having a thickness of 1 μm. Note that the silicon nitride (Si ₃ N ₄ ) layer was formed by RF sputtering in an Ar gas atmosphere using a Si ₃ N ₄ target. As in Example 1, the conversion efficiency of the completed thin film solar cell is about the same as that of Example 1, and the glass substrate constituting the thin film solar cell is also free from significant scratches and cracks. And no damage occurred.

[Example 3]
A thin film solar cell of Example 3 was fabricated in the same manner as in Example 1 except that the breakage prevention layer 7 was changed to a silicon oxynitride (SiO _x N _y ) layer having a thickness of 1 μm. The silicon oxynitride (SiO _x N _y ) layer was formed by a reactive sputtering method using a Si target and introducing oxygen and nitrogen into Ar gas at a ratio of 50:50. As in Example 1, the conversion efficiency of the completed thin film solar cell is about the same as that of Example 1, and the glass substrate constituting the thin film solar cell is also free from significant scratches and cracks. And no damage occurred.

[Example 4]
A thin film solar cell of Example 4 was produced in the same manner as in Example 1 except that the titanium carbide (TiC) layer having a thickness of 1 μm was used as the damage prevention layer 7 in Example 1. Note that the titanium carbide (TiC) layer was formed by RF sputtering in an Ar gas atmosphere using a TiC target. As in Example 1, the conversion efficiency of the completed thin film solar cell is about the same as that of Example 1, and the glass substrate constituting the thin film solar cell is also free from significant scratches and cracks. And no damage occurred.

[Example 5]
In Examples 1 to 4, a glass substrate having a thickness of 100 μm was used, but here, other glass substrates having a thickness of 30 μm, 50 μm, 200 μm, and 300 μm were obtained, and Example 1 and A similar thin film solar cell was produced.

  Table 1 shows the flexibility and strength of the glass substrate as obtained. The flexibility was evaluated by cutting a glass substrate into a strip of 100 mm × 10 mm, bending the glass substrate with a load while supporting both ends in the longitudinal direction. The glass substrate having a thickness of 30 μm to 200 μm was relatively flexible and bent, but the glass substrate having a thickness of 300 μm was hard and cracked when attempting to bend strongly. Further, the glass substrate having a thickness of 30 μm was quite thin and difficult to handle and easily broken. On the other hand, as shown in Table 1, each thin-film solar cell in which the breakage prevention layer 7 was formed on the surface of the glass substrate on the electrode layer side did not break or break the glass substrate. In addition, by providing the breakage prevention layer 7 on a glass substrate having a thickness of 30 μm, handling becomes easy and cracks during the process are less likely to occur.

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Electrode layer 3 Chalcopyrite compound semiconductor layer 4 Buffer layer 5 Transparent electrode layer 6 Current collection electrode 7 Damage prevention layer (surface on the electrode layer side, surface opposite to the surface on the electrode layer side)
8 Doped layer 9 Unit cell 10,20 Thin film solar cell (thin film solar cell sheet)

Claims (7)

  A glass substrate having a thickness of 30 to 200 μm, a breakage prevention layer formed on at least one surface of the glass substrate, an electrode layer provided on the glass substrate or on the breakage prevention layer, and the electrode layer And a chalcopyrite compound semiconductor layer provided on the thin film solar cell.   The thin film solar according to claim 1, wherein a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed on the surface of the glass substrate on the electrode layer side as the damage prevention layer. battery.   The thin film solar cell according to claim 2, wherein a resin layer is provided on the surface opposite to the electrode layer side surface of the glass substrate as the damage prevention layer.   The metal oxide layer, the metal nitride layer, the metal oxynitride, or the metal carbide layer is formed on the surface opposite to the surface on the electrode layer side of the glass substrate as the breakage prevention layer. The thin film solar cell described.   Forming a damage prevention layer on at least one surface of a glass substrate having a thickness of 30 to 200 μm; forming an electrode layer on the glass substrate or on the damage prevention layer; and a chalcopyrite compound on the electrode layer A method of manufacturing a thin film solar cell, comprising: forming a semiconductor layer.   As the damage prevention layer, a metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is formed on the surface on the electrode layer side of the glass substrate and / or the surface opposite to the surface on the electrode layer side. The thin film solar cell according to claim 5.   The manufacturing method of the thin film solar cell of Claim 5 or 6 which provides a resin layer in the surface opposite to the surface by the side of the electrode layer of the said glass substrate after the formation process of the said chalcopyrite compound semiconductor layer.

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