JP2011066560A - Camera module and electronic information apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a better image by preventing dew formation and freezing, and to protect a camera from a low temperature as a whole for preventing the crack and breakage of a camera case caused by freezing. <P>SOLUTION: Transparent resistive films for a heater are formed on surfaces which face each other of a lens 6 and on the surface of a transparent support board 5 with a heating wire arranged inside the outer wall of a lens holder 7. Thus, a camera module 1 can be heated or can be kept warm as a whole. By this, better image can be obtained by preventing dew formation and freezing, and the camera can be protected from the low temperature as a whole, thus preventing the crack or breakage of the camera case caused by freezing. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is a camera module used for imaging in security cameras and in-vehicle cameras, fixed point observation, etc. as fixed imaging applications, and includes a solid-state imaging device, a wiring board, a lens, a low-pass filter, a lens barrel, etc. In particular, a camera module that requires condensation resistance and weather resistance such as temperature change due to outdoor installation and humidity, and this camera module, such as a digital video camera and a digital still camera used as an image input device in an imaging unit, etc. The present invention relates to an electronic information device such as a digital camera, an image input camera such as a surveillance camera, a scanner device, a facsimile device, a television phone device, and a camera-equipped mobile phone device.

As applications of conventional camera modules, the use of fixed imaging devices such as security cameras, in-vehicle cameras, and fixed point observation cameras has become widespread. As a security camera, home security as a suspicious person's approach, mischief, intrusion into a house, imaging to obtain evidence, confirmation of visitors with doorphones, monitoring street snatching, molesting, violent crime, etc. It can be used for crime prevention and proof as well as for on-vehicle use as well as prevention of car storms, as a drive recorder, recording driving and accident situations, measuring distance between vehicles, recognition of lanes and entering garages For example, driving assistance by confirming that there are no people or objects in the blind spot when starting.
In addition, fixed-point observation means academic use such as research and observation of biological ecology from commercial things such as ski slopes and snow cover, weather and lift congestion status distributed as status information on the Internet. And personal use for hobbies such as observation of wild birds flying to the garden of private homes and recording by moving images (publishing on the Internet as a video blog: VLOG = Video + Blog spread).
However, when shooting outdoors from a camera installed indoors or in a car, the number of blind spots increases.Therefore, cameras are installed at outdoor entrances, under eaves, blind spots at the garden, fenders and spoilers on the outside of the car. There are many cases.
What is required of these cameras is low-illumination imaging (i.e., night-vision function) even if the resolution is not high, but at night, the image appears dark and nothing appears. Even if the image is captured by a solid-state image sensor, there may be a case where the object is reflected when the brightness and contrast are adjusted.
Rather, it is necessary that the optical member is not fogged because there is no possibility that an image captured through fogging of the lens or optical member due to condensation or freezing can be recovered even after processing. This prevention of condensation is disclosed in Patent Document 1.

  FIG. 12 is an exploded perspective view of a conventional light receiving type semiconductor device disclosed in Patent Document 1. In FIG.

  As shown in FIG. 12, a conventional semiconductor device 100 includes a semiconductor chip 101 having a light receiving circuit, and a non-covered package in which the semiconductor chip 101 is fixed to a chip holding portion 102a having a concave cross section provided on the bottom surface by a fixing material 103. (Receiving container) 102 and the inside of the package 102, and has a window portion 106a in a region facing the light receiving region of the semiconductor chip 101, and the periphery of the window portion 106a is bent in one direction, that is, the bottom surface side of the package 102. A light-shielding dehumidifying member 106 having a light-shielding property and a hygroscopic property, and a plate-like light-transmitting member 108 fixed to at least the upper end portion of the package 102 by a sealing material 107. have.

The package 102 is provided with a plurality of leads 104 as external terminals. The inner portions 104 a exposed inside the package 102 of each lead 104 are electrically connected to the pad electrode 101 a of the semiconductor chip 101 by a linear conductive member 105.
This is an example of using a light-blocking dehumidifying member 106 as a desiccant inside the module to prevent condensation, but when the ambient temperature around the camera drops below freezing, moisture freezes and adheres to the optical member. In such a state, the desiccant cannot absorb moisture, and moisture freezing on the optical member cannot be removed.

  In order to solve this, Patent Document 2 discloses that the tip of the camera is partially heated to prevent fogging due to condensation.

  FIG. 13 is a cross-sectional view of the distal end portion of a conventional endoscope anti-fogging device disclosed in Patent Document 2. As shown in FIG.

  As shown in FIG. 13, an objective lens 207 is disposed behind the cover glass 206. In addition, a CCD 208 that is an image pickup element is disposed at the imaging position of the objective lens 207. Further, light guide fibers 212, which are optical fibers, are arranged along the axial direction of the sheath 202a. The distal end portion 212 a of the light guide fiber 212 is directly bonded and fixed to the illumination light irradiation unit 205.

  Further, the surface of the cover glass 206 is provided with a surface treatment portion 214 that has been subjected to a hydrophilic treatment. For example, the surface treatment unit 214 is formed by forming a thin film 215 containing a photocatalyst on the surface of the cover glass 206. As a result, the surface of the cover glass 206 has hydrophilicity, that is, good compatibility with water and wettability, so that sufficient antifogging properties can be obtained. Further, this hydrophilic property makes it possible to lift dirt adhering to the surface of the translucent member, so that good antifouling properties can be obtained.

  Furthermore, a heating means 216 is provided for heating the cover glass 206 to perform the anti-fogging treatment. The heating means 216 is provided with a heater (heat source) 217 for heating the cover glass 206 and a temperature control means (not shown) for controlling the heating temperature of the cover glass 206 to a predetermined set temperature.

  The heater 217 has a heating wire wound in a coil around the ring-shaped holding frame 219 that holds the cover glass 206. Alternatively, the heat source may be provided with a heating element in the vicinity of the cover glass 206 instead of the heater 217. Furthermore, the heater 217 or the thermal element is connected to an external power control unit via a lead wire.

  FIG. 14 is a perspective view showing a glass substrate mounted state of a conventional solid-state imaging device disclosed in Patent Document 3. As shown in FIG.

As shown in FIG. 14, in the conventional solid-state imaging device 300, the lower surface of the glass substrate 303 located above the light receiving area 302a has a substantially rectangular, colorless and transparent area having an area enough to cover the light receiving area 302a. A conductive thin film 305 is formed by sputtering. Terminal portions 307 are formed on the conductive thin film 305 at diagonal positions on the lower surface of the glass substrate 303. The terminal portion 307 is a connection terminal for electrical connection with the outside, and can be energized from here. Since the conductive thin film 305 can generate Joule heat by energization and directly heat the glass substrate 303, the glass substrate 303 can be quickly heated to effectively prevent dew condensation.
Note that the shape and area of the conductive thin film 305 can be determined as appropriate in accordance with an external use environment or the like. For example, when not used in a very high temperature environment, the conductive thin film 305 can be formed in a shape having a plurality of slits so that the temperature of the glass substrate 203 does not become too high. In this case, it is desirable to set the width between the slits to 5 μm or less so as not to affect subject light incident on the light receiving area 302a such as ghost reflection.

  As described above, in Patent Document 3, the light receiving area 302a where the image sensor is formed and the vicinity thereof are partially heated to prevent fogging due to condensation.

JP 2004-363511 A JP 2006-282 A JP 2008-141037 A

When the conventional desiccant of Patent Document 1 is used, it is necessary to seal the camera module. Although this is possible in principle, it is necessary to sufficiently seal (test) the seal when shipping the product as a product and to screen off a product with an insufficient seal. If moisture is contained in the sealed inside of the camera module, it freezes inside and the meaning of using a desiccant is lost. It is difficult to perform sealing verification from the viewpoint of productivity and cost.
As in the above-described conventional patent documents 2 and 3, when the heater is partially attached, when the entire camera is exposed to a cold environment, a local temperature difference occurs in the camera module internal space. When the temperature rises, the amount of saturated water vapor rises and takes in water vapor, and when the temperature falls, the amount of saturated water vapor falls to release water vapor and form dew condensation.
When this is applied to the camera module, there is a risk that the air will take in water vapor at the location where the heater is attached inside the module, and the water vapor will be emitted at the location where the heater is not attached, causing condensation. Condensation causes an electrical short circuit in addition to clouding the image.
In addition, for security and fixed observation cameras, it is important to have weather resistance so that failure does not occur in long-term outdoor use.
Considering the use environment of these cameras, the cause of the failure may be the deterioration of the camera housing due to exposure, but it is embedded in walls and doors for security camera applications and embedded in the car body for in-vehicle use. It is often installed in a hidden place protected from wind and rain. From this point of view, the most difficult to prevent in the outdoor environment is the temperature change, and the stress increases as the short-term temperature change such as morning-noon is larger than the long-term temperature change of summer-winter. This may include thermal stress (mainly for each material) with respect to temperature changes of the optical member inside the camera module and stress due to differences in thermal expansion of the adhesive, resin, and other optical members used in the module.
Furthermore, regarding stress on the adhesive and resin, the adhesive and resin absorb moisture, and the moisture absorbed by the volume expands due to freezing, causing cracks (cracks and tears) in the resin and adhesive. There is also a risk of malfunction.
In general, semiconductors such as solid-state imaging devices (CCD, CMOS sensors) and DSPs operate from a low temperature of -30 ° C to -20 ° C, but at such a low temperature, the resin cracks and the strength of the resin material becomes brittle. There is a nature that.
However, the resin used for the camera module uses a relatively heat-resistant material from the camera module assembly process (thermal curing process of about 80 ° C for curing the adhesive), while considering the low temperature. The current situation is not.
From the above, it is particularly necessary that the camera module has no condensation at low temperatures and that the temperature of each part of the module does not change with respect to the change of the outside air temperature where there is no temperature difference between the module parts.

  The present invention solves the above-mentioned conventional problems, and prevents camera condensation and freezing to obtain a good image, and prevents the camera body from cracking and breakage due to freezing by preventing the entire camera from low temperature. An object of the present invention is to provide an electronic information device such as a security camera or an in-vehicle monitoring camera using the camera module as an image input device in an imaging unit.

  The camera module of the present invention includes an image pickup device chip having an image pickup region on a substrate, a transparent support substrate that covers the upper side of the image pickup region, and mounted on the substrate, covering the image pickup device chip and the transparent support substrate. Or a lens holder that is disposed above the transparent support substrate and that contains a lens, and has a heater mechanism that warms the surface of the lens, the surface of the transparent support substrate, and the wall surface of the lens holder. This achieves the above object.

  Preferably, as the heater mechanism in the camera module of the present invention, a transparent resistance film for the heater is disposed on each of the lens surface and the surface of the transparent support substrate facing each other, and a heating wire is provided inside the outer wall of the lens holder. Is arranged.

  Further preferably, in the camera module of the present invention, a resin sealing portion that covers each side surface of the imaging element chip and the transparent support substrate and is resin-sealed with only the upper surface of the transparent support substrate exposed. Further, as the heater mechanism, a heating wire is disposed in the same surface of the resin sealing portion as the surface of the transparent support substrate.

  Further preferably, transparent electrodes are respectively connected to both sides of the transparent resistance film in the camera module of the present invention.

  Further preferably, the heating wire in the camera module of the present invention is wound spirally inside the outer wall of the lens holder.

  Furthermore, preferably, the heating wire in the camera module of the present invention is arranged in a folded manner inside the outer wall of the lens holder.

  Furthermore, preferably, the heating wire disposed in the surface of the resin sealing portion in the camera module of the present invention is connected in series or in parallel to the heating wire through a transparent resistance film for a heater formed on the surface of the transparent support substrate. It is connected to the.

  Furthermore, preferably, the heating wire arranged inside the outer wall of the lens holder in the camera module of the present invention is connected in series or in parallel to the heating wire through a transparent resistance film for a heater formed on the surface of the lens. Yes.

  Further preferably, in the camera module having a zoom mechanism or an autofocus mechanism in the camera module of the present invention, the drive unit side of the member that limits and cushions the operation range of the movable part of the zoom mechanism or the autofocus mechanism is opposite. A heater is attached to the side.

  Further preferably, the limiting and buffering member in the camera module of the present invention is a rubber washer.

  Further preferably, the lens holder in the camera module of the present invention is made of resin.

  Further preferably, the lens holder in the camera module of the present invention is adhered to the substrate in an airtight or semi-sealed state with an adhesive.

  Further preferably, the lens holder in the camera module of the present invention is adhered to the resin sealing portion in an airtight or semi-sealed state with an adhesive.

  Further preferably, the heater mechanism in the camera module of the present invention generally warms a sealed or semi-enclosed space surrounded by the lens surface and the surface of the transparent support substrate.

  An electronic information device according to the present invention uses the camera module according to the present invention as an image input device in an imaging unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, a transparent resistance film for a heater is disposed on each of the lens surface and the surface of the transparent support substrate facing each other, and a heating wire is disposed inside the outer wall of the lens holder.

  As a result, a heating element is arranged on each member inside the camera module to heat or keep the entire module, so that not only condensation and freezing can be prevented and a good image can be obtained, but the entire camera can be prevented from low temperature. It is possible to prevent cracking and breakage of the camera housing due to freezing.

  As described above, according to the present invention, a heating element is arranged on each member inside the camera module to heat or keep the whole module, so that not only dew condensation and freezing can be prevented, but also a good image can be obtained. Preventing the camera from low temperature can prevent cracking and breakage of the camera housing due to freezing.

(A) is a longitudinal cross-sectional view which shows the principal part structural example of the camera module of this Embodiment 1, (b) is a longitudinal cross-sectional view which shows the principal part structural example of the camera module of this Embodiment 2. FIG. (A) is a longitudinal cross-sectional view which shows the heater installation location of the camera module of FIG. 1 (a) with a broken line part, (b) is a side view which shows the state in which the image pick-up element chip unit was formed on the board | substrate. (A) is a schematic perspective view which shows the heater structure of the imaging part in the camera module of Fig.1 (a), (b) is a longitudinal cross-sectional view of the imaging part. (A) is an external view of a lens holder in the camera module of FIG. 1 (a), (b) is a sectional view of the lens holder, and (c) is a perspective view showing the arrangement of heaters of the lens holder. . (A) is a top view of the lens holder in the camera module of Fig.1 (a), (b) is a perspective view which shows arrangement | positioning of the heater of the lens holder. (A) is sectional drawing of the lens in the camera module of Fig.1 (a), (b) is a top view of the heater part formed in the lower surface of the lens. (A) is a longitudinal sectional view showing a heater installation location of the camera module of FIG. 1 (b) by a broken line part, and (b) is a cross section showing a state in which the imaging element chip unit is resin-sealed by a resin sealing part. FIG. (A) is a schematic plan view which shows the heater structure of the imaging part in the camera module of FIG.1 (b), (b) is the plane perspective drawing. FIG. 9 is a perspective view showing a heater arrangement structure different from the planar perspective view of FIG. It is a principal part longitudinal cross-sectional view which shows the case where a heater mechanism is applied to the camera module which has a zoom mechanism and an auto-focus mechanism. It is a block diagram which shows the schematic structural example of the electronic information apparatus which used the solid-state imaging device containing the camera module 1, 1A or 1B of Embodiment 1, 2 of this invention for the imaging part as Embodiment 3 of this invention. FIG. 10 is an exploded perspective view of a conventional light receiving type semiconductor device disclosed in Patent Document 1. FIG. 10 is a cross-sectional view of a distal end portion of a conventional endoscope anti-fogging device disclosed in Patent Document 2. It is a perspective view which shows the glass substrate mounting state of the conventional solid-state imaging device currently disclosed by patent document 3. FIG.

Embodiments 1 and 2 of the camera module of the present invention, and implementation of an electronic information device such as a security camera or a vehicle-mounted surveillance camera using the camera module embodiments 1 and 2 as an image input device in an imaging unit The third embodiment will be described in detail with reference to the drawings.
(Embodiment 1)
FIG. 1A is a longitudinal cross-sectional view illustrating an exemplary configuration of a main part of the camera module according to the first embodiment.

  In FIG. 1A, the camera module 1 according to the first embodiment includes an image pickup device chip 3 having an image pickup region 3a in which a plurality of light receiving units are arranged in a matrix on a substrate 2, and a periphery of the image pickup region. The disposed adhesive resin portion 4, the transparent support substrate 5 such as a transparent glass plate disposed on the adhesive resin portion 4 and covering the upper side of the imaging region, and the image pickup element chip 3 and the transparent support substrate 5 mounted on the substrate 2. And a lens holder 7 in which the lens 6 is accommodated. These lenses 6 and the imaging region 3a are provided at positions corresponding to each other.

  The lens holder 7 is bonded to the substrate 2 with an adhesive in a sealed or semi-sealed state.

In the camera module 1 of the first embodiment, in order to provide a camera module 1 that prevents condensation or freezing at low temperatures, protects the camera module 1 from temperature stress due to changes in the outside air temperature, and reduces the frequency of occurrence of defects. A heating element is installed on each member.
In addition, a so-called heating wire can be used in the housing of the camera module 1 (the lens holder 7 made of black resin). If electricity (current) is passed through a conductor (heating element) having a resistance component, the electrical energy becomes thermal energy, and the inside of the camera module 1 and the housing itself can be warmed.
Furthermore, the optical member such as the lens 6 and the translucent support substrate 5 (transparent glass plate) on the imaging element chip 3 can use a conductive film having a transparent resistance component. In general, a tin oxide transparent film can be used, and this material is used for a transparent electrode of a solar cell, but it is also used for heat generation such as a heater.
In addition, as a transparent resin sheet heater, for example, Leftel of Teijin Ltd. or a transparent heater (transparent resistance film) of Yu Corporation Ltd. can be used.

  Here, a heater mechanism for heating the surface of the lens 6, the surface of the transparent support substrate 5, and the wall surface of the lens holder 7 is provided. As this heater mechanism, a transparent resistance film (not shown) for the heater is disposed on the surface of the lens 6 and the surface of the transparent support substrate 5 facing each other, and a heating wire (not shown) is provided inside the outer wall of the lens holder 7. ) Is arranged. Below, the heater mechanism of each member is demonstrated in detail.

2A is a longitudinal sectional view showing a heater installation location of the camera module 1 of FIG. 1A by a broken line portion, and FIG. 2B shows a state in which the imaging element chip unit 10 is formed on the substrate. FIG.
As shown in FIG. 2A, heaters are installed at various locations on the constituent members of the camera module 1. The inside of a broken line part has shown the heater installation location. However, in FIG. 2A, only the position is shown and the heater is not shown. Specifically, a heating wire is disposed in the wall of the lens holder 7, the surface of the transparent support substrate 5 (transparent glass plate) on the lens 6 side that is bonded onto the image sensor chip 3, and the image sensor of the lens 6. A transparent resistance film (not shown), which is a tin oxide transparent film, is applied to the lens surface on the chip 3 side.
FIG. 3A is a schematic perspective view showing a heater configuration of the imaging unit in the camera module 1 of FIG. 1A, and FIG. 3B is a longitudinal sectional view of the imaging unit.

As shown in FIG. 3A and FIG. 3B, in the imaging element chip unit 10, both ends are formed on a transparent support substrate 5 such as a transparent glass plate adhered on the imaging element chip 3 by an adhesive resin portion 4. A transparent electrode 11 is disposed at the edge, and a transparent resistance portion 12 (transparent resistance film) is formed between the transparent electrodes 11. By applying a predetermined voltage between the transparent electrodes 11, a current flows through the transparent resistance portion 12 and acts as a heater. The transparent resistance portion 12 has a resistance value of about 10Ω / □.
4A is an external view of the lens holder 7 in the camera module 1 of FIG. 1A, FIG. 4B is a cross-sectional view of the lens holder 7, and FIG. 4C is the lens holder 7. It is a perspective view which shows arrangement | positioning of this heater.
As shown in FIG. 4C, the heating wire 13 is spirally wound around the wall of the lens holder 7 so that the entire wall surface of the lens holder 7 is heated.

5A is a plan view of the lens holder 7 in the camera module 1 of FIG. 1A, and FIG. 5B is a perspective view showing the arrangement of the heaters of the lens holder 7. FIG.
As shown in FIGS. 5A and 5B, the lens holder 7 is provided with a cylindrical upper portion and a rectangular cylindrical lower portion combined vertically and provided in the wall of the lens holder 7. The heating wire 13 is spirally wound for wiring. The wiring of the heating wire 13 is connected to the transparent electrode 16 of the lens 6 so that the heater 14 on the lens lower surface side of the lens 6 described later can be energized.

6A is a cross-sectional view of the lens 6 in the camera module 1 of FIG. 1A, and FIG. 6B is a plan view of a heater portion formed on the lower surface of the lens 6.
As shown in FIG. 6A and FIG. 6B, the heater section 14 includes two transparent resistance sections 15 formed of a transparent resistance film as a circular heat source, and two heater sections on the outer peripheral side of the transparent resistance section 15. And both semicircular arc-shaped transparent electrodes 16 provided apart from each other. In this way, the transparent electrodes 15 are formed on the peripheral edge of the lens 6 on the image sensor chip 3 side, and the transparent resistors 16 serving as heat sources are formed on the other portions.

  A heating wire 13 arranged inside the outer wall of the lens holder 7 is connected to a transparent electrode 16 formed on the lower surface of the lens 6, and passes from the transparent electrode 16 through another transparent electrode 16 through a transparent resistance film 15 for a heater. What is necessary is just to be connected to the heating wire 13 in series or in parallel.

  The heating wire 13 and the transparent electrode 11 are connected to the wiring layer of the substrate 2.

(Embodiment 2)
In the first embodiment, the image pickup device chip 3 having the image pickup region on the substrate 2, the transparent support substrate 5 covering the upper portion of the image pickup region 3a, and the image pickup device chip 3 and the transparent support substrate 5 mounted on the substrate 2. In the second embodiment, the imaging element chip 3 having the imaging area and the upper area of the imaging area 3a are covered on the substrate 2 in the present embodiment. A case will be described in which a transparent support substrate 5 and a lens holder 7A, which will be described later, are mounted on the substrate 2 and are disposed above the imaging element chip 3 and the transparent support substrate 5 and in which a lens 6 is accommodated.

  FIG. 1B is a vertical cross-sectional view showing the main configuration of the camera module according to the second embodiment.

  In FIG. 1B, the camera module 1A according to the second embodiment includes an imaging element chip 3 having an imaging area 3a in which a plurality of light receiving units are arranged in a matrix on a substrate 2, and the periphery of the imaging area. Mounted on the substrate 2, the transparent support substrate 5 such as a transparent glass plate disposed on the adhesive resin portion 4 and covering the upper side of the imaging region, and the imaging element chip 3 and the transparent support substrate. 5, the lens holder 7 </ b> A in which the lens 6 is accommodated, the imaging element chip 3, the adhesive resin portion 4, and the side surfaces of the transparent support substrate 5, and the resin sealing with the upper surface of the transparent support substrate 5 exposed. It has the resin sealing part 8 stopped.

  The lens holder 7 </ b> A is adhered to the resin sealing portion 8 with an adhesive in a sealed or semi-sealed state.

  Here, a transparent resistance film (not shown) for the heater is disposed on the surface of the lens 6 and the surfaces of the transparent support substrate 5 and the resin sealing portion 8 that are opposed to each other, and the electric power is provided inside the outer wall of the lens holder 7A. A hot wire (not shown) is arranged. Below, the heater structure of each member is demonstrated in detail.

FIG. 7A is a longitudinal sectional view showing a heater installation portion of the camera module 1A of FIG. FIG. 7B is a cross-sectional view showing a state in which the imaging element chip unit 10 is resin-sealed with the resin sealing portion 8.
As shown in FIG. 7A, heater portions are installed at various locations on the constituent members of the camera module 1A. The inside of a broken line part has shown the heater installation location. However, in FIG. 7A, only the position of the heater portion is indicated by a broken line portion, and the heater portion is not specifically illustrated. Specifically, a heating wire (not shown) is disposed in the wall of the lens holder 7A, and the surface on the lens 6 side of the transparent support substrate 5 (transparent glass plate) adhered on the imaging element chip 3, A transparent resistance film (not shown), which is a tin oxide transparent film, is applied to the surface of the lens 6 on the imaging element chip 3 side.
As shown in FIG. 7B, the camera module 1 </ b> A has a resin sealing portion 8, and a heating wire 17 is arranged on the surface portion side in the resin sealing portion 8, and this is attached to the transparent support substrate 5. It is connected to the transparent electrode 12 formed on the surface.
FIG. 8A is a schematic plan view showing a heater configuration of the imaging unit in the camera module 1A of FIG. 1B, and FIG. 8B is a plan perspective view thereof.
As shown in FIG. 8A and FIG. 8B, the heating wire 17 arranged in the surface portion in the resin sealing portion 8 is wound around the outer peripheral side of the transparent support substrate 5 in a spiral shape. Yes. As described above, the heating wire 17 is spirally arranged so as to surround the transparent support substrate 5, and then connected to the transparent electrode 12 formed on the transparent support substrate 5, and the transparent resistance portion 11 is energized from the transparent electrode 12. It has come to be.
FIG. 9 is a perspective view showing a heater arrangement structure different from the planar perspective view of FIG.

  As shown in FIG. 9, the heating wire 17 disposed on the surface portion (inside) in the resin sealing portion 8 on the outer periphery of the transparent support substrate 5 is folded back multiple times along one side of the quadrangle. Are arranged by being folded back multiple times in the vertical direction along the other side of the quadrilateral. Thereafter, the transparent resistance portion 11 is energized by being connected to one transparent electrode 12 formed on the transparent support substrate 5. Further, the other transparent electrode 12 formed on the transparent support substrate 5 is connected to the heating wire 17 in the resin sealing portion 8. Furthermore, the heating wire 17 in the resin sealing portion 8 is arranged by being folded back multiple times in the vertical direction. In this way, the heating wire 17 is enclosed in a bellows shape so as to surround the transparent support substrate 5, and is similarly connected to the transparent electrode 12 formed on the transparent support substrate 5 so that the transparent resistance portion 11 is energized. It has become.

  In short, if the heating wire 17 disposed in the surface portion of the resin sealing portion 8 is connected in series or in parallel to the heating wire 17 through the heater transparent resistance film 11 formed on the surface of the transparent support substrate 5. Good.

  The heating wire 17 may be connected to the wiring layer of the substrate 2 through the resin sealing portion 8. In addition, the heating wire 17 may be disposed in the wall of the lens holder 7 </ b> A from within the resin sealing portion 8.

In the first and second embodiments, the case of the camera module 1 or 1A having no zoom mechanism or autofocus mechanism has been described. However, the present invention is not limited to this, and the case of a camera module having a zoom mechanism or autofocus mechanism is also possible. Needless to say, a heater mechanism for preventing condensation or freezing can be arranged. A camera module having this zoom mechanism and autofocus mechanism will be described with reference to FIG.
FIG. 10 is a longitudinal sectional view of a main part showing a case where a heater mechanism is applied to a camera module having a zoom mechanism and an autofocus mechanism. Here, a portion for driving a mechanism such as a motor or an actuator is not shown.
As shown in FIG. 10, in the case of having an optical mechanism including a zoom mechanism and an autofocus mechanism, it is difficult for the camera module 1B to energize the lens 6B and the movable portion with a heater. Therefore, the operating range of the movable part of the zoom mechanism or the autofocus mechanism is limited, and the heater part 19a is attached to the side opposite to the driving part side of the buffering member to obtain the rubber washer type heater 19. The rubber washer heater 19 is energized by wiring to the heating wire 18 in the lens holder 7B.

  As described above, according to the first and second embodiments, since the heating element is arranged on each member inside the camera module 1, 1A or 1B, the entire module can be heated or kept warm. As a result, the camera module 1, 1A or 1B that is fixedly installed outdoors, that is, security, surveillance, in-vehicle drive recorder, driving assist, fixed point observation camera, etc., is prevented from dew condensation and freezing. In addition to obtaining images, it is possible to prevent cracking and breakage of the camera housing due to freezing by preventing the entire camera from low temperatures. As described above, a security camera, a camera module for in-vehicle use, and the like prevent condensation and freezing due to a change in temperature, and further, a heating element (heater) is arranged on the entire camera module 1, 1A, or 1B. It is possible to prevent stress and deterioration due to temperature change of each module member.

  In addition, by incorporating a heater in the camera module 1, 1A or 1B itself, the camera system becomes compact and the range of applications for security applications and in-vehicle applications is widened. With the camera module 1, 1A, or 1B having a resin housing with excellent processability, it is possible to increase the degree of freedom of design and design of security devices.

  In addition, maintenance is facilitated even in security and in-vehicle applications that are installed in places where maintenance and repair are relatively difficult.

(Embodiment 3)
FIG. 11 is a block diagram illustrating a schematic configuration example of an electronic information device using a solid-state imaging device including the camera module 1, 1A, or 1B of Embodiments 1 and 2 of the present invention as an imaging unit as Embodiment 3 of the present invention. It is.

  In FIG. 11, the electronic information device 90 according to the third embodiment performs a predetermined signal processing on the imaging signal from the camera module 1, 1 </ b> A, or 1 </ b> B according to the first and second embodiments to obtain a color image signal. A memory unit 92 such as a recording medium capable of recording data after a predetermined signal processing for recording the color image signal from the solid-state image pickup device 91, and the color image signal from the solid-state image pickup device 91 for display. After performing predetermined signal processing for communication on the display means 93 such as a liquid crystal display device which can be displayed on a display screen such as a liquid crystal display screen after predetermined signal processing, and the color image signal from the solid-state imaging device 91 The communication means 94 such as a transmission / reception device that enables communication processing and the color image signal from the solid-state imaging device 91 are subjected to predetermined print signal processing for printing, and then the printing process is performed. And an image output means 95 such as a printer that enables. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic device having an image input device such as an image input camera, a scanner device, a facsimile device, a camera-equipped mobile phone device, and a portable terminal device (PDA) is conceivable.

  Therefore, according to the third embodiment, on the basis of the color image signal from the solid-state imaging device 91, the image is displayed on the display screen, or the image is output by the image output means 95 on the paper. (Printing), communicating this as communication data in a wired or wireless manner, performing a predetermined data compression process in the memory unit 92 and storing it in a good manner, or performing various data processings satisfactorily Can do.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-3 of this invention, this invention should not be limited and limited to this Embodiment 1-3. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 3 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention is a camera module used for imaging in security cameras and in-vehicle cameras, fixed point observation, etc. as fixed imaging applications, and includes a solid-state imaging device, a wiring board, a lens, a low-pass filter, a lens barrel, etc. In particular, a camera module that requires condensation resistance and weather resistance such as temperature change due to outdoor installation and humidity, and this camera module, such as a digital video camera and a digital still camera used as an image input device in an imaging unit, etc. In the field of electronic information equipment such as digital cameras, image input cameras such as surveillance cameras, scanner devices, facsimile devices, television phone devices, camera-equipped mobile phone devices, etc., a heating element is arranged on each member inside the camera module. , Heating or keeping the whole module Therefore, it is possible to prevent condensation and to prevent freezing not only obtain a good image, the camera housing by frozen to prevent the entire camera from a low temperature crack or breakage.

DESCRIPTION OF SYMBOLS 1, 1A, 1B Camera module 2 Substrate 3a Image pick-up area 3 Image pick-up element chip 4 Adhesive resin part 5 Transparent support substrate (transparent glass plate)
6 Lens (Condenser lens)
7, 7A, 7B Lens holder 8 Resin sealing part 10 Imaging element chip unit 11 Transparent electrode 12 Transparent resistance part 13, 17, 18 Heating wire 14 Heater part 15 Transparent resistance part 16 Transparent electrode 19a Heater part 19 Rubber washer type heater 90 Electronic information equipment 91 Solid-state imaging device 92 Memory unit 93 Display means 94 Communication means 95 Image output means

Claims (15)

An image pickup device chip having an image pickup region on the substrate, a transparent support substrate covering the upper side of the image pickup region, and mounted on the substrate, covering the image pickup device chip and the transparent support substrate, or of the transparent support substrate. A lens holder disposed above and having a lens accommodated therein;
A camera module having a heater mechanism for heating the surface of the lens, the surface of the transparent support substrate, and the wall surface of the lens holder.   2. The heater mechanism includes a transparent resistance film for a heater disposed on each of a lens surface and a surface of the transparent support substrate facing each other, and a heating wire is disposed inside an outer wall of the lens holder. Camera module.   Covering each side surface of the imaging element chip and the transparent support substrate, further comprising a resin sealing portion resin-sealed in a state where only the top surface of the transparent support substrate is exposed, The camera module according to claim 1, wherein a heating wire is disposed in the surface of the resin sealing portion that is the same as the surface of the transparent support substrate.   The camera module according to claim 2, wherein transparent electrodes are respectively connected to both sides of the transparent resistance film.   The camera module according to claim 1, wherein the heating wire is spirally wound inside the outer wall of the lens holder.   The camera module according to any one of claims 1 to 3, wherein the heating wire is folded back inside the outer wall of the lens holder.   The heating wire arranged in the surface of the resin sealing part is connected to the heating wire in series or in parallel through a transparent resistance film for a heater formed on the surface of the transparent support substrate. Camera module.   The heating wire arranged inside the outer wall of the lens holder is connected in series or in parallel to the heating wire through a transparent resistance film for a heater formed on the surface of the lens. The camera module described. In camera modules with zoom and autofocus mechanisms,
The camera module according to claim 1, wherein a heater unit is attached to a side opposite to a driving unit side of a member that limits and cushions an operation range of a movable unit of the zoom mechanism or the autofocus mechanism.   The camera module according to claim 9, wherein the restricting and buffering member is a rubber washer.   The camera module according to claim 1, wherein the lens holder is made of resin.   3. The camera module according to claim 1, wherein the lens holder is adhered to the substrate in an airtight or semi-hermetic state with an adhesive. 4.   The camera module according to claim 3, wherein the lens holder is bonded to the resin sealing portion with an adhesive in a sealed or semi-sealed state.   The camera module according to claim 12 or 13, wherein the heater mechanism warms a sealed or semi-enclosed space surrounded by the lens surface and the surface of the transparent support substrate as a whole.   An electronic information device using the camera module according to claim 1 as an image input device in an imaging unit.