JP2011066509A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of easily and surely fixing a light receiving surface of an imaging element on a predetermined position with respect to a holding member. <P>SOLUTION: The imaging apparatus includes: an imaging element 2 for imaging subject light inputted through a photographing lens 4; a holding member 10 for holding the photographing lens 4; and a substrate 6 for fixing the imaging element 2. The holding member 10 and the substrate 6 are fixed by solder 12 in a state that the light receiving surface 2a of the imaging element 2 is arranged on the predetermined position with respect to the holding member 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an imaging apparatus.

  There has been proposed an imaging apparatus having an opening facing the back surface of the mounting surface of the imaging element mounted on the electric substrate, and a fixing member fixed to the imaging element by attaching an adhesive in the opening. (For example, refer to Patent Document 1).

JP 2007-227673 A

  By the way, in the imaging apparatus, the light receiving surface of the imaging element needs to be disposed at a predetermined position with respect to a holding member that holds a photographing lens or the like. However, for example, when the electric substrate on which the image sensor is mounted with ball solder or the like is fixed to the holding member, there is an individual difference in the position of the image sensor with respect to the electric substrate. There were cases where it was difficult to place in. In addition, for example, when fixing the image pickup element to the holding member using an ultraviolet curable adhesive, the adhesive is softened by heat generated from a heating element such as the image pickup element because the adhesive has a low heat-resistant temperature. In some cases, the position of the light receiving surface with respect to the holding member deviates from a predetermined position.

  The objective of this invention is providing the imaging device which can fix the light-receiving surface of an image pick-up element to a predetermined position easily and reliably with respect to a holding member.

  An image pickup apparatus according to the present invention includes an image pickup device that picks up subject light through a photographing lens, a holding member that holds the photographing lens, and a substrate that fixes the image pickup device, and the holding member and the substrate include The light receiving surface of the imaging element is fixed by solder in a state of being disposed at a predetermined position with respect to the holding member.

  According to the imaging device of the present invention, the light receiving surface of the imaging element can be easily and reliably fixed to a predetermined position with respect to the holding member.

It is sectional drawing which shows the structure of the holding mechanism of the image pick-up element which comprises the imaging device which concerns on embodiment.

  Hereinafter, an imaging device according to an embodiment of the present invention will be described with reference to the drawings. The image pickup apparatus according to the present embodiment generates image data from an image pickup device 2 (see FIG. 1) that picks up subject light that has passed through the photographing lens 4 (see FIG. 1) and an image pickup signal output from the image pickup device 2. An image processing unit (not shown), a recording unit (not shown) for recording image data generated in the image processing unit, and a display unit (not shown) for displaying an image based on the image data recorded in the recording unit And an operation unit (not shown) for the user to manually input instruction contents.

  FIG. 1 is a cross-sectional view illustrating a configuration of a holding mechanism for an image sensor 2 that constitutes the imaging apparatus according to the present embodiment. As shown in FIG. 1, the image pickup device 2 configured by a CCD, a CMOS, or the like includes a light receiving surface 2 a that receives subject light transmitted through the photographing lens 4, and the light receiving surface 2 a is a photographing lens of the image pickup device 2. It is formed in parallel with the 4 side surface 2b. The image pickup device 2 is fixed and connected to an electric substrate 6 such as a glass epoxy substrate by ball solder (not shown).

  The photographing lens 4 is accommodated and held in a lens barrel 8, and the lens barrel 8 is attached to the imaging apparatus by being held and fixed to a holding member 10. The holding member 10 is provided with a rectangular opening 10a larger than the rectangular imaging element 2, and the imaging element 2 is installed in the opening 10a. That is, as shown in FIG. 1, the image pickup device 2 has the right side surface of the image pickup device 2 as a reference surface 10 b in the opening portion 10 a and the side surface (not shown) of the image pickup device 2 at the back of the paper surface in the opening portion 10 a. By being placed in contact with a reference surface (not shown) at the back of the paper, it is placed at a predetermined position in the light receiving surface 2a in the opening 10a. That is, the reference surface in the opening 10a is arranged so that the center of the subject light transmitted through the photographing lens 4 is incident on the center of the light receiving surface 2a when the predetermined surface of the image sensor 2 is in contact with the reference surface. Is formed.

  In addition, the light receiving surface 2 a of the image pickup device 2 is disposed on a plane parallel to a plane whose normal is the optical axis of the photographing lens 4. That is, when the photographic lens 4 is held by the holding member 10, the surface 10 c of the holding member 10 on the side on which the photographic lens 4 is mounted is parallel to a plane whose normal is the optical axis of the photographic lens 4. Is formed. Accordingly, as shown in FIG. 1, the light receiving surface 2 a is arranged so that the surface 2 b of the imaging element 2 on the photographing lens 4 side and the surface 10 c of the holding member 10 are arranged on the same plane, so that the light receiving surface 2 a It is arranged on a plane parallel to the plane whose normal is.

  In addition, the light receiving surface 2 a of the imaging device 2 is disposed at a predetermined position in the optical axis direction of the photographing lens 4 with respect to the holding member 10. That is, when the surface 2b of the image sensor 2 and the surface 10c of the holding member 10 are arranged on the same surface, the photographic lens 4 so that the subject light transmitted through the photographic lens 4 forms an image on the light receiving surface 2a. The position is adjusted in advance.

  Then, the imaging device 2 is brought into contact with the reference surface of the holding member 10 so that the light receiving surface 2a is disposed at a predetermined position with respect to the holding member 10, and the surface 2b of the imaging device 2 and the surface 10c of the holding member 10 are 1 are arranged on the same plane, a gap is generated between the holding member 10 and the electric substrate 6 as shown in FIG. Therefore, the light receiving surface 2 a is fixed to a predetermined position with respect to the holding member 10 by fixing the holding member 10 and the electric substrate 6 with the solder 12. The material of the solder 12 is the same as the material of the ball solder that fixes the image pickup device 2 to the electric substrate 6, so that the image pickup device 2 is attached to the electric substrate 6, the holding member 10, the electric substrate 6, and the like. Can be simultaneously fixed.

  According to the imaging apparatus according to this embodiment, the light receiving surface 2a of the imaging element 2 can be easily and reliably fixed to a predetermined position with respect to the holding member 10. That is, in a conventional imaging apparatus, for example, an electric substrate on which an imaging element is mounted with ball solder or the like is fixed to a holding member, and a subject or the like such as a spacer is imaged on a light receiving surface of the imaging element through a photographing lens. The adjustment member is used to adjust the position of the photographic lens and the light receiving surface. However, it takes a long time to adjust the position of the photographic lens and the light receiving surface using this adjustment member. In addition, since the position of the image pickup device with respect to the electric board is not stable, the light receiving surface of the image pickup device may be inclined with respect to the surface having the optical axis of the photographing lens as a normal line, and this inclination can be corrected by the adjustment member. There wasn't. However, in this embodiment, since the electric substrate 6 and the holding member 10 are fixed by the solder 12 after the light receiving surface 2a is arranged at a predetermined position, it is not necessary to use an adjustment member, and the light receiving surface 2a is disposed at a predetermined position. Can be fixed easily and reliably.

  In addition, in the conventional imaging apparatus, the imaging element is fixed to the holding member using, for example, an ultraviolet curable adhesive, but the adhesive has a low heat resistant temperature, and is bonded by heat generated from a heating element such as the imaging element. In some cases, the agent is softened, and the position of the light receiving surface of the image sensor with respect to the holding member deviates from a predetermined position. However, in this embodiment, since the electric substrate 6 and the holding member 10 are fixed using the solder 12 having a heat resistant temperature higher than that of the ultraviolet curable adhesive, the position of the light receiving surface 2a is not shifted due to heat generation. Absent. Moreover, when fixing an image pick-up element to a holding member using an ultraviolet curing adhesive, a flexible substrate with a light mass is used as a board | substrate which mounts an image pick-up element. In this case, since it is necessary to insulate the flexible substrate, a large amount of space is required to arrange each component at an appropriate position, and the size of the imaging device is large. However, according to the imaging apparatus according to this embodiment, a compact apparatus can be manufactured as compared with a conventional imaging apparatus in which an imaging element is fixed to a holding member using an ultraviolet curable adhesive.

  In this embodiment, the surface 2b of the image sensor 2 and the surface 10c of the holding member 10 are arranged such that the light receiving surface 2a is disposed at a predetermined position in the optical axis direction of the photographing lens 4 with respect to the holding member 10. However, it is not necessary to arrange the surface 2b of the imaging device 2 and the surface 10c of the holding member 10 on the same surface, and the surface 2b of the imaging device 2 and the surface 10c of the holding member 10 are arranged. As long as they are arranged parallel to each other.

  DESCRIPTION OF SYMBOLS 2 ... Image pick-up element, 4 ... Shooting lens, 6 ... Electric substrate, 8 ... Lens tube, 10 ... Holding member, 12 ... Solder.

Claims (2)

An image sensor for imaging subject light through the taking lens;
A holding member for holding the photographing lens;
A substrate for fixing the image sensor,
The imaging apparatus, wherein the holding member and the substrate are fixed by solder in a state in which a light receiving surface of the imaging element is disposed at a predetermined position with respect to the holding member.   The image pickup apparatus according to claim 1, wherein the solder material is the same as a ball solder material for fixing the image pickup device to the substrate.

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