JP2011065886A - Coaxial substrate edge connector, and substrate being mounted with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coaxial substrate edge connector capable of attaining a connection structure between substrate wiring and the coaxial substrate edge connector which hardly generates parasitic capacity or parasitic inductance, and capable of transmitting between the coaxial substrate edge connector and the substrate wiring up to higher frequency, and to provide a substrate being mounted with the same. <P>SOLUTION: In the coaxial substrate edge connector mounted on an edge of the substrate wherein signal wiring is formed on a surface layer and a GND plane is formed on at least either of an inner layer or a rear surface layer and connecting a core wire of the coaxial cable with the signal wiring and connecting a GND of the coaxial cable with the GND plane, the coaxial substrate edge connector has a signal pin connected with the core wire and the signal wiring, and a GND conductive plate connected with the GND and preparing projections sharpened toward an end face of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a coaxial connector for a substrate end that connects a coaxial cable and a substrate, and a substrate on which the coaxial connector is mounted.

  In the coaxial connector that connects the substrate wiring and the coaxial cable, a type that is attached to the end of the substrate is widely used so that a signal passes up to a higher frequency. The coaxial connector for substrate end with improved high frequency characteristics includes a center contact connected to the first conductive pattern formed on the substrate and an external contact connected to the second conductive pattern formed on the substrate. And the external contact includes a flange portion (GND conductor plate) and a shell portion provided on one surface of the flange portion, and the flange portion includes a second conductive member in the vicinity of the first conductive pattern. A conductive attachment portion connected to the pattern is provided, and the center contact extends on the first conductive pattern provided perpendicularly from the substrate end on the substrate surface (see, for example, Patent Document 1).

  On the other hand, the substrate corresponding to the coaxial connector for the substrate end has a signal wiring including a pad to which a signal pin is connected to the surface layer, a GND plane on the inner layer and / or the back surface layer, and a GND pin of the coaxial cable on the surface layer. It has a GND pad to be connected and a GND through hole that connects the GND pad to the GND plane, and there is a region without a conductor at the end of the substrate (see, for example, Patent Documents 2 and 3).

JP-A-8-203619 JP 2007-165944 A JP 2007-165945 A

However, there are some problems when the board-end coaxial connector is mounted on the end face at the board end. First, when the reference of the signal wiring on the front surface layer of the substrate is the GND plane of the inner layer or the back surface layer, the GND pin of the coaxial connector for the substrate end on both sides of the wiring at the substrate end and the GND pad for conducting to the GND pin are provided. Parasitic capacitance is generated between the wiring and GND.
Even in the case of a coplanar line having a GND plane on the left and right of the same layer as the substrate wiring, it is equivalent to the signal wiring and the GND plane becoming extremely thick, coupled with the signal pin being on the signal wiring, A parasitic capacitance is also generated between the signal wiring and GND. As the dielectric diameter of the coaxial structure is reduced in order to cope with the higher frequency, the distance between the signal pin and the GND pin of the coaxial connector for substrate end becomes closer, and this tendency becomes remarkable.

These parasitic capacitances reduce the impedance of the signal wiring, and when the frequency is increased, the signal pin and GND appear to be short-circuited, and the passing characteristics between the signal wiring and the coaxial cable are deteriorated.
In addition, the GND return current normally flows through the path closest to the signal wiring with respect to the current flowing through the signal wiring. That is, in the case where the signal wiring and the GND plane are in different layers, the return current is most concentrated on the path immediately below or directly above the signal in the GND plane. However, usually, the conductor of the board does not reach the edge of the board. Therefore, the GND return current passes directly under or directly above the signal wiring to the end of the GND body (near the board end) and then electrically passes between the board layers. After passing through the via hole or through hole to be connected, it goes around to the pad of the GND pin of the coaxial connector for board end (generally far from the distance to the GND conductor closest to the signal conductor of the coaxial structure). When such a return current path wraps around, a series parasitic inductance is generated between the signal wiring and the signal conductor of the coaxial structure, and the impedance of the substrate wiring becomes high. When the frequency increases due to this parasitic inductance, the signal appears to be disconnected, and the passing characteristics between the signal wiring and the coaxial cable deteriorate.

As a countermeasure, after leaving the conductor of the board to the end of the board or manufacturing the board, the board is cut to a portion where the board conductor exists, and the surface of the GND conductor plate of the coaxial connector for the board end and the end of the GND conductor of the board are made. Attempts may be made to contact.
However, in this method, the contact between the GND conductor of the substrate and the GND conductor of the coaxial connector for the substrate end tends to be unsatisfactory, and the conduction of GND is not reliable. In the case of a ceramic substrate or the like, there may be brazing between this substrate end surface and the GND conductor plate surface of the coaxial connector for the substrate end. However, in a substrate such as a general printed wiring board, the brazing temperature is high. Too much, this technique cannot be taken.

  Further, when the impedance is lowered due to the parasitic capacitance and the impedance rises continuously due to the return current path, an equivalent LC circuit is formed, forming a low-pass filter, and a signal cannot be passed rapidly from a certain frequency.

  The present invention has been made in order to solve the above-described problems, and can realize a connection structure between a substrate wiring and a coaxial connector for a substrate end that is less likely to generate a parasitic capacitance or a parasitic inductance, and can achieve a higher frequency. An object of the present invention is to obtain a coaxial connector for a substrate end that enables transmission between the coaxial connector for wiring and the substrate wiring, and a substrate on which the coaxial connector is mounted.

  The coaxial connector for substrate end according to the present invention is mounted on the end of the substrate on which the signal wiring is formed on the front surface layer and the GND plane is formed on at least one of the inner layer and the back surface layer, and the core wire of the coaxial cable is connected to the signal wiring. In addition, in the coaxial connector for the substrate end for connecting the GND of the coaxial cable to the GND plane, the signal pin connected to the core wire and connected to the signal wiring, and connected to the GND and connected to the end surface of the substrate And a GND conductor plate provided with a sharp protrusion.

  Further, another coaxial connector for a substrate end according to the present invention is mounted on the end of the substrate on which the signal wiring is formed on the front surface layer and the GND plane is formed on the inner layer or the back surface layer, and the core wire of the coaxial cable is used for the signal wiring. In the coaxial connector for board end for connecting the GND of the coaxial cable to the GND plane, a signal pin connected to the core wire and connected to the signal wiring, a GND conductor plate connected to the GND, and the GND A protrusion plate that is in contact with the surface of the conductor plate on the substrate side and is provided with a protrusion that sharpens toward the end surface of the substrate.

  Further, another coaxial connector for a substrate end according to the present invention is mounted on the end of the substrate on which the signal wiring is formed on the front surface layer and the GND plane is formed on the inner layer or the back surface layer, and the core wire of the coaxial cable is used for the signal wiring. In the coaxial connector for board end for connecting the GND of the coaxial cable to the GND plane, a signal pin connected to the core wire and connected to the signal wiring, a GND conductor plate connected to the GND, and the GND A surface of the conductor plate facing the substrate side surface is flat and has a protrusion sharpened toward the end surface of the substrate.

  In the coaxial connector for substrate end according to the present invention, since the GND conductor plate connected to the GND of the coaxial cable is directly connected to the GND plane of the inner layer or the back layer via the protrusion, parasitic capacitance and parasitic inductance are hardly generated. A connection structure between the substrate wiring and the coaxial connector for the substrate end can be realized, and the transmission between the coaxial connector for the substrate end and the substrate wiring can be performed up to a higher frequency.

It is a figure which shows the coaxial connector for board | substrate ends concerning Embodiment 1 of this invention. It is a figure which shows a mode that the coaxial connector for board | substrate ends was attached to the board | substrate which concerns on embodiment of this invention. It is a figure which shows the coaxial connector for board | substrate ends concerning Embodiment 2 of this invention. It is a disassembled perspective view of the coaxial connector for board | substrate ends concerning Embodiment 3 of this invention. It is a disassembled perspective view of the coaxial connector for board | substrate ends concerning Embodiment 4 of this invention. It is a disassembled perspective view of the coaxial connector for board | substrate ends concerning Embodiment 5 of this invention. It is a perspective view of the coaxial connector for board | substrate ends concerning Embodiment 6 of this invention. It is a figure which shows a mode that the coaxial connector for board | substrate ends was attached to the board | substrate which concerns on Embodiment 6 of this invention. It is a front view of the GND conductor plate which concerns on Embodiment 7 of this invention. It is a figure which shows a mode that the coaxial connector for board | substrate ends concerning Embodiment 7 of this invention was attached to the board | substrate. It is a front view of the GND conductor plate which concerns on Embodiment 8 of this invention. It is a side view for demonstrating a mode that the coaxial connector for board | substrate ends concerning Embodiment 8 of this invention is attached to a board | substrate. It is sectional drawing of the board | substrate with which the coaxial connector for board | substrate ends concerning Embodiment 9 of this invention was mounted. It is sectional drawing of the board | substrate with which the coaxial connector for board | substrate ends concerning Embodiment 10 of this invention was mounted.

A preferred embodiment of a coaxial connector for substrate end according to the present invention will be described below with reference to the drawings.
Embodiment 1 FIG.
1 is a drawing showing a coaxial connector for substrate end according to Embodiment 1 of the present invention. 1A is a top view, FIG. 1B is a front view, and FIG. 1C is a side view.
A board end coaxial connector 1 according to Embodiment 1 of the present invention includes a connector body 2 having a general structure, a signal pin 3, and an insulator 4.
The connector main body 2 includes a cable connecting cylinder 5 and a GND conductor plate 6 provided with a protrusion 7.
The signal pin 3 is connected to a core wire of a coaxial cable (not shown) in the cable connection cylinder 5.
The GND conductor plate 6 is connected to the cable connection cylinder 5 and connected to the GND of the coaxial cable.
The insulator 4 surrounds the signal pin 3 coaxially and insulates the signal pin 3 and the connector main body 2 in a DC manner.

The protrusions 7 are arranged in parallel so that the central axis is parallel to the surface perpendicular to the direction in which the signal pins 3 of the GND conductor plate 6 extend, that is, the surface facing the end surface of the substrate 10 (hereinafter referred to as “back surface”). The side of the cross section is parallel to the back surface of the GND conductor plate 6 and the point where the other two sides intersect is pointed in the direction in which the signal pin 3 extends. The material of the protrusion 7 is considerably harder than the material of the substrate 10, and the protrusion 7 is embedded in the substrate 10 when the sharp top of the protrusion 7 is pressed against the end surface of the substrate 10.
The two triangular prisms closest to the signal pin 3 are circumscribed on the outer periphery of the insulator 4.

FIG. 2 is a diagram showing a state where the above-described coaxial connector 1 for board end is attached to the board 10 according to Embodiment 1 of the present invention. 1A is a top view, and FIG. 1B is a cross-sectional view taken along the line AA in FIG.
A substrate 10 to which the coaxial connector 1 for substrate end is attached has a signal wiring 11 including a signal pad on a front surface layer and a GND plane 12 on an inner layer and / or a back surface layer, and forms a microstrip line. For this reason, the range of the board | substrate 10 and the range of the GND plane 12 are congruent at least in the vicinity of attaching the coaxial connector 1 for board end. Further, the end portion of the GND plane 12 is exposed at the end surface of the substrate 10.

When the above-described coaxial connector 1 for board end is mounted on the board 10, the signal pin 3 is positioned on the signal wiring 11 on the surface layer of the board 10, and the end face of the board 10 is as shown by the thick arrow in FIG. The GND conductor plate 6 is pressed firmly.
Next, the signal pin 3 is soldered to the signal wiring 11.
As described above, when the GND conductor plate 6 is strongly pressed against the end surface of the substrate 10, the top side of the triangular prism bites into the inside from the end surface of the substrate 10, and the triangular column reliably contacts the GND plane 12.

  Here, since the signal transmitted through the substrate wiring has the same structure as the conventional one, it is transmitted to the signal conductor of the coaxial connector 1 for substrate end. At this time, since there is no GND structure seen in the conventional structure on the substrate 10 around the signal pad, it is a connection structure in which parasitic capacitance hardly occurs.

  On the other hand, the return current flowing through the GND plane 12 which is the reference of the signal wiring 11 does not pass through the GND through hole of the board and the GND pad of the board edge or the GND pin of the coaxial connector for the board edge as in the prior art. Then, the signal is transmitted directly to the GND plane 12 near the signal pin 3 of the coaxial connector 1 for board end. In other words, since the return current path does not go around, it is a connection structure in which parasitic inductance hardly occurs.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1 and the board end coaxial connector 1 in which parasitic capacitance and parasitic inductance hardly occur, and transmission between the board end coaxial connector 1 and the board wiring up to a higher frequency. Is possible.
In addition, the large GND pin that is used in the conventional board end coaxial connector is not required, the number of conductors in the board end coaxial connector 1 can be reduced, and as a result, the cost of the board end coaxial connector 1 can be reduced.
In addition, since the number of soldered portions of the substrate 10 can be reduced, the amount of solder used when mounting on the substrate 10 can be reduced. In the case of manual attachment, the number of work steps can be further reduced, and both can reduce the board assembly cost.
In the first embodiment of the present invention, the triangular prism is shown as an example of the structure of the protrusion 7 having the sharp side, but it may be a thin plate having one side processed into a blade shape.

Embodiment 2. FIG.
FIG. 3 is a drawing showing a coaxial connector for substrate end according to Embodiment 2 of the present invention. 3A is a top view, FIG. 3B is a front view, and FIG. 3C is a side view.
The board end coaxial connector 1B according to the second embodiment of the present invention is different from the board end coaxial connector 1 according to the first embodiment of the present invention in that the projections 7B are the same. The same reference numerals are given and description thereof is omitted.
In the coaxial connector 1 for substrate end according to Embodiment 1 of the present invention, the GND conductor plate 6 is provided with a plurality of triangular projections 7 so that the projections 7 are electrically connected to the GND plane 12 on the inner layer or the back layer of the substrate 10. However, in the board end coaxial connector 1B according to the second embodiment of the present invention, the GND conductor plate 6 is provided with a plurality of conical protrusions 7B, and the protrusions 7B are formed on the inner layer or the back surface layer of the substrate 10. It is designed to conduct with the GND plane 12.

When the above-described coaxial connector 1B for board end is mounted on the board 10, the GND conductor plate 6 is strongly pressed against the end face of the board 10 while the signal pins 3 are positioned on the signal wirings 11 on the surface layer of the board 10.
Next, the signal pin 3 is soldered to the signal wiring 11.
Thus, when the GND conductor plate 6 is strongly pressed against the end surface of the substrate 10, the apex of the cone bites into the inside from the end surface of the substrate 10, and the cone contacts the GND plane 12 with certainty.

  Here, since the signal transmitted through the board wiring has the same structure as the conventional one, it is transmitted to the signal conductor of the board end coaxial connector 1B. At this time, since there is no GND structure seen in the conventional structure on the substrate around the signal pad, it is a connection structure in which parasitic capacitance hardly occurs.

  On the other hand, the return current flowing through the GND plane 12, which is the reference of the signal wiring 11, passes through the apex of the cone without passing through the GND through hole and the GND pad of the board or the GND pin of the coaxial connector for the board end as in the conventional case. Then, the signal is transmitted directly to the GND plane 12 at a position close to the signal pin 3 of the coaxial connector 1B for board end. In other words, since the return current path does not go around, it is a connection structure in which parasitic inductance hardly occurs.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1B and the board end coaxial connector 1B in which parasitic capacitance and parasitic inductance are less likely to occur, and transmission between the board end coaxial connector 1B and the board wiring up to a higher frequency. Is possible.
In addition, the large GND pin that is used in the conventional board end coaxial connector is not necessary, and the conductor of the board end coaxial connector 1B can be reduced, and as a result, the cost of the board end coaxial connector 1B can be reduced.
In addition, since the number of soldered portions of the substrate 10 can be reduced, the amount of solder used when mounting on the substrate 10 can be reduced. In the case of manual attachment, the number of work steps can be further reduced, and both can reduce the board assembly cost.

  In the second embodiment of the present invention, the conical structure is shown as an example of the cone-shaped protrusion, but it may be a polygonal pyramid structure or a needle shape.

Embodiment 3 FIG.
4 is an exploded perspective view of a coaxial connector for substrate end according to Embodiment 3 of the present invention.
The board end coaxial connector 1C according to the third embodiment of the present invention is different from the board end coaxial connector 1 according to the first embodiment of the present invention in the GND conductor plate 6C, and the insulator 4 is more than the GND conductor plate 6C. A protruding plate 8 provided with protrusions 7 is added except that it protrudes, but the other parts are the same, so the same reference numerals are given to the same parts, and the description is omitted.
In the first and second embodiments of the present invention described above, the plurality of protrusions 7 and 7B are provided on the back surface of the GND conductor plate 6, but in the third embodiment of the present invention, the plurality of protrusions 7 are connected to the GND conductor plate 6C. Are provided on the protruding plate 8 separate from the GND conductor plate 6C.

The GND conductor plate 6C is configured such that the insulator 4 protrudes from the back surface of the GND conductor plate 6C by the thickness of the protruding plate 8.
The protruding plate 8 is provided with a hole 8a into which the insulator 4 protruding from the GND conductor plate 6C is fitted without a gap. That is, the inner diameter of the hole 8 a is the same as the outer diameter of the insulator 4.
The protrusion 7 is composed of a plurality of triangular prisms arranged in parallel so that the central axis is parallel to the surface (hereinafter referred to as “back surface”) facing the end surface of the substrate 10 of the protrusion plate 8, and one side of the cross section Is parallel to the back surface of the protruding plate 8, and the point where the other two sides intersect is pointed in the axial direction of the hole 8a.
The two triangular prisms closest to the hole 8a are circumscribed on the inner periphery of the hole 8a.

When the above-described coaxial connector 1C for board end is mounted on the board 10, the protruding plate 8 is pressed against the interposed GND conductor plate 6C between the board 10 and the GND conductor plate 6C so that the insulator 4 is fitted into the hole 8a.
Next, when the GND conductor plate 6C is strongly pressed toward the substrate 10 while the signal pin 3 is positioned on the signal wiring 11 on the surface layer of the substrate 10, the protruding plate 8 is strongly pressed against the end surface of the substrate 10. .
Next, the signal pin 3 is soldered to the signal wiring 11.
As described above, when the protruding plate 8 is strongly pressed against the end face of the substrate 10, the top side of the triangular prism is pushed into the inside from the end face of the substrate 10, and the triangular prism is surely in contact with the GND plane 12.

  Here, since the signal transmitted through the board wiring has the same structure as the conventional one, it is transmitted to the signal conductor of the board end coaxial connector 1C. At this time, since there is no GND structure seen in the conventional structure on the substrate around the signal pad, it is a connection structure in which parasitic capacitance hardly occurs.

  On the other hand, the return current flowing through the GND plane 12 which is the reference of the signal wiring 11 does not pass through the GND through hole of the board and the GND pad of the board edge or the GND pin of the coaxial connector for the board edge as in the prior art. Then, the signal is transmitted directly to the GND plane 12 at a position close to the signal pin 3 of the coaxial connector 1C for board end. In other words, since the return current path does not go around, it is a connection structure in which parasitic inductance hardly occurs.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1C and the board end coaxial connector 1C, in which parasitic capacitance and parasitic inductance are less likely to occur, and transmission between the board end coaxial connector 1C and the board wiring up to a higher frequency. Is possible.
In addition, the large GND pin that is used in the conventional board end coaxial connector is not required, and the conductor of the board end coaxial connector 1C can be reduced. As a result, the cost of the board end coaxial connector 1C can be reduced.
In addition, since the number of soldered portions of the substrate 10 can be reduced, the amount of solder used when mounting on the substrate 10 can be reduced. In the case of manual attachment, the number of work steps can be further reduced, and both can reduce the board assembly cost.
Moreover, it is not necessary to use a special connector body in order to obtain these effects. That is, a commercially available connector body can be used. Thereby, the price of the connector can be kept low.

In the third embodiment of the present invention, a triangular prism is shown as an example of the structure of the protrusion 7 having a sharp side, but it may be a thin plate having one side processed into a blade shape.
Further, instead of the projection 7 having a sharp side, a cone-shaped projection structure such as a cone or another polygonal pyramid may be used, or a needle shape may be used.

Embodiment 4 FIG.
FIG. 5 is an exploded perspective view of a coaxial connector for substrate end according to Embodiment 4 of the present invention.
The board end coaxial connector 1D according to the fourth embodiment of the present invention is different from the board end coaxial connector 1C according to the third embodiment of the present invention in that the flat plate 9 instead of the projection plate 8 and the projection 7D are different. Since it is the same, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.
In the above-described coaxial connector 1C for board end according to the third embodiment of the present invention, the protrusion 7 is provided on the back surface of the protruding plate 8, but in the coaxial connector for substrate end 1D according to the fourth embodiment of the present invention, Instead of the projection plate 8, a combination of a flat plate 9 and a projection 7D consisting of only a plurality of triangular prisms is provided.
The flat plate 9 is provided with a hole 9a into which the outer surface of the insulator 4 protruding from the GND conductor plate 6C is fitted without a gap. That is, the inner diameter of the hole 9 a is the same as the outer diameter of the insulator 4.
The protrusion 7D is composed of a plurality of triangular prisms arranged in parallel, and is connected so that the sides of the triangular prisms are connected to the sides of the adjacent triangular prisms. And the edge | side which opposes the continuous side surface is pointed in the perpendicular direction to the side surface.

When the above-described coaxial connector 1D for board end is mounted on the board 10, the flat plate 9 is pressed against the GND conductor plate 6C so that the insulator 4 is fitted into the hole 9a.
Next, the GND conductor plate 6C is disposed in the direction of the substrate 10 while the signal pin 3 is positioned on the signal wiring 11 on the surface layer of the substrate 10 and the projection 7D is interposed between the flat plate 9 and the end surface of the substrate 10. The projection 7 </ b> D is strongly pressed against the end surface of the substrate 10.
Next, the signal pin 3 is soldered to the signal wiring 11.
Thus, when the projection 7D is strongly pressed against the end face of the substrate 10, the top of the triangular prism is pushed into the inside from the end face of the substrate 10, and the triangular prism is surely in contact with the GND plane 12.

  Here, the signal transmitted through the substrate wiring is transmitted to the signal conductor of the coaxial connector for substrate end with the same structure as before. At this time, since there is no GND structure seen in the conventional structure on the substrate around the signal pad, it is a connection structure in which parasitic capacitance hardly occurs.

  On the other hand, the return current flowing through the GND plane 12 which is the reference of the signal wiring 11 does not pass through the GND through hole of the board and the GND pad of the board edge or the GND pin of the coaxial connector for the board edge as in the prior art. Then, the signal is transmitted directly to the GND plane 12 at a position close to the signal pin 3 of the coaxial connector 1D for board end. In other words, since the return current path does not go around, it is a connection structure in which parasitic inductance hardly occurs.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1D and the board end coaxial connector 1D, in which parasitic capacitance and parasitic inductance are less likely to occur, and transmission between the board end coaxial connector 1D and the board wiring up to a higher frequency. Is possible.
In addition, the large GND pin that is required in the conventional board end coaxial connector is not required, the number of conductors of the board end coaxial connector 1D can be reduced, and as a result, the cost of the board end coaxial connector 1D can be reduced.
In addition, since the number of soldered portions of the board can be reduced, the amount of solder used for mounting on the board can be reduced, and in the case of manual mounting, the number of work steps can be further reduced, both of which can reduce the board assembly cost.
Further, it is not necessary to use a special board end coaxial connector in order to obtain these effects. That is, a commercially available coaxial connector for a substrate end can be used. Thereby, the price of the connector can be kept low.

  In the fourth embodiment of the present invention, a triangular prism is shown as an example of the structure of the protrusion 7 having a sharp side, but it may be a thin plate having one side processed into a blade shape.

Embodiment 5 FIG.
6 is an exploded perspective view of a coaxial connector for substrate end according to Embodiment 5 of the present invention.
The board end coaxial connector 1E according to the fifth embodiment of the present invention is a projection instead of the protrusion 7 provided on the GND conductor plate 6 of the board end coaxial connector 1 according to the first embodiment of the present invention. Since the difference is that 7E is added and the rest is the same, the same parts are denoted by the same reference numerals and the description thereof is omitted.
In the above-described coaxial connector 1 for board end according to the first embodiment of the present invention, the plurality of protrusions 7 are provided on the back surface of the GND conductor plate 6, but in the fifth embodiment of the present invention, the GND conductor plate 6C Without providing the protrusions 7, there are two single protrusions 7E.

  The protrusions 7E are composed of a plurality of triangular prisms arranged in parallel, and are connected so that the sides of the triangular prisms are connected to the sides of the adjacent triangular prisms. And the edge | side which opposes the continuous side surface is pointed in the perpendicular direction to the side surface.

When the above-described coaxial connector 1E for board end is mounted on the board 10, the signal pin 3 is positioned on the signal wiring 11 on the surface layer of the board 10, and between the GND conductor plate 6 and the end face of the board 10. When the GND conductor plate 6 is strongly pressed in the direction of the substrate 10 after the two protrusions 7E are interposed, the protrusion 7E is strongly pressed against the end surface of the substrate 10.
Next, the signal pin 3 is soldered to the signal wiring 11.
As described above, when the GND conductor plate 6 is strongly pressed against the end face of the substrate 10, the top side of the triangular prism is pushed into the inside from the end face of the substrate 10, and the triangular prism is surely in contact with the GND plane 12.

  Here, the signal transmitted through the substrate wiring is transmitted to the signal conductor of the coaxial connector for substrate end with the same structure as before. At this time, since there is no GND structure seen in the conventional structure on the substrate around the signal pad, it is a connection structure in which parasitic capacitance hardly occurs.

  On the other hand, the return current flowing through the GND plane 12 which is the reference of the signal wiring 11 does not pass through the GND through hole of the board and the GND pad of the board edge or the GND pin of the coaxial connector for the board edge as in the prior art. Then, the signal is transmitted directly to the GND plane 12 near the signal pin 3 of the coaxial connector 1 for board end. In other words, since the return current path does not go around, it is a connection structure in which parasitic inductance hardly occurs.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1E and the board end coaxial connector 1E, in which parasitic capacitance and parasitic inductance hardly occur, and transmission between the board end coaxial connector 1E and the board wiring up to a higher frequency. Is possible.
In addition, the large GND pin that is used in the conventional board end coaxial connector is not necessary, and the conductor of the board end coaxial connector 1E can be reduced, and as a result, the cost of the board end coaxial connector 1E can be reduced.
In addition, since the number of soldered portions of the board can be reduced, the amount of solder used for mounting on the board can be reduced, and in the case of manual mounting, the number of work steps can be further reduced, both of which can reduce the board assembly cost.
Further, it is not necessary to use a special board end coaxial connector in order to obtain these effects. That is, a commercially available coaxial connector for a substrate end can be used. Thereby, the price of the connector can be kept low.

In the fifth embodiment of the present invention, the triangular prism is shown as an example of the structure of the projection 7E having a sharp side, but it may be a thin plate having one side processed into a blade shape.
Further, instead of the projection 7E having a sharp side, a cone-shaped projection structure such as a cone or another polygonal pyramid may be used, or a needle shape may be used.

Embodiment 6 FIG.
FIG. 7 is a perspective view of a coaxial connector for substrate end according to Embodiment 6 of the present invention.
The coaxial connector for board end 1F according to the sixth embodiment of the present invention is different from the coaxial connector for board edge 1 according to the first embodiment of the present invention in the GND conductor plate 6F. Are denoted by the same reference numerals and description thereof is omitted.
A GND conductor plate 6F according to Embodiment 6 of the present invention is provided with a protrusion 7 and a GND pin 21 on the outside of the protrusion 7.

FIG. 8 is a view showing a state in which the board-end coaxial connector is attached to the board according to Embodiment 6 of the present invention.
A substrate 10F according to the sixth embodiment of the present invention includes a signal wiring 11 including pads to which signal pins 3 are connected to the front surface layer, a GND plane 12 for the inner layer and the rear surface layer, and a substrate end for the front surface layer and the rear surface layer. A GND pad 13 to which the GND pin 21 of the coaxial connector 1F is connected.

When the above-described coaxial connector 1F for board end is mounted on the board 10F, the GND conductor plate 6F is strongly pressed against the end face of the board 10F while the signal pins 3 are positioned on the signal wiring 11 on the surface layer of the board 10F. The protrusion 7 is strongly pressed against the end surface of the substrate 10F.
Next, the signal pin 3 is soldered to the signal wiring 11. Next, the GND pin 21 is soldered to the GND pad 13.
As described above, when the GND conductor plate 6F is strongly pressed against the end face of the substrate 10F, the top side of the triangular prism is pushed into the inside from the end face of the substrate 10F, and the triangular pillar surely contacts the GND plane 12.

Further, since the GND pin 21 is soldered to the GND pad 13, the relative position between the board 10F and the board end coaxial connector 1F is more firmly fixed, and the pressure that presses the protrusion 7 of the GND conductor plate 6F against the end face of the board 10F. The risk of falling out is reduced.
Further, since the GND pin 21 is located farther from the protrusion 7 of the GND conductor plate 6F when viewed from the signal pin 3, the coupling between the signal pin 3 and the GND pin 21 is very small. Conversely, even if the GND pin 21 is far from the signal pin 3, the GND return current path does not go around because there is the projection 7 of the GND conductor plate 6 </ b> F in between.

  With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1F and the board end coaxial connector 1F, in which parasitic capacitance and parasitic inductance hardly occur, and transmission between the board end coaxial connector 1F and the board wiring up to a higher frequency. Is possible. Further, after the board end coaxial connector 1F is mounted on the board 10F, this effect continues for a long time.

In the coaxial connector for board end 1F according to the sixth embodiment of the present invention, the triangular prism is shown as an example of the structure of the protrusion having the side with the corner, but it is a thin plate with one side processed into a blade shape. It doesn't matter.
Further, the protrusion structure may be a cone-shaped protrusion structure such as a cone or another polygonal pyramid.
Moreover, it may be needle-shaped.
Further, in the board end coaxial connector 1F according to the sixth embodiment of the present invention, the protrusion 7 is formed directly on the surface of the GND conductor plate 6F of the board end coaxial connector 1F. A protrusion may be provided on the protrusion plate as described above, or only the protrusion may be interposed as in the fourth embodiment of the present invention.

Embodiment 7 FIG.
FIG. 9 is a front view of a GND conductor plate according to Embodiment 7 of the present invention. FIG. 10 is a diagram illustrating a state in which the substrate is pulled toward the GND conductor plate by the holding mechanism. FIG. 10A is a diagram showing a state in which the holding mechanism component is attached to the substrate. (B) is a figure which shows a mode that a GND conductor plate is connected with the board | substrate with which holding mechanism components were attached. (C) is a figure which shows a mode that the board | substrate was drawn near to the GND conductor board.
A coaxial connector 1G for board end according to Embodiment 7 of the present invention is provided with a holding mechanism 30 instead of the GND conductor plate 6G in place of the coaxial connector 1 for board edge and GND conductor plate 6 according to Embodiment 1 of the present invention. However, the other parts are the same, and the same parts are denoted by the same reference numerals and the description thereof is omitted.
The GND conductor plate 6G is formed with four screw holes 33 through which the screws 32 for fixing the holding mechanism components 31 constituting the holding mechanism 30 to the GND conductor plate 6G are passed outside the region where the projections 7 are provided. Yes.

The holding mechanism 30 fastens between the holding mechanism component 31 that is integrated with the GND conductor plate 6G across the front and back surfaces of the substrate 10G, and the holding mechanism component 31 on the front surface side and the holding mechanism component 31 on the back surface side. It is comprised from the volt | bolt 34 and the nut 35, and the screw | thread 32 which draws the board | substrate 10G toward the GND conductor board 6G.
The holding mechanism component 31 is provided with a screw hole 36 into which the screw 32 is screwed and a bolt hole 37 through which the bolt 34 passes. The screw 32, the bolt 34, and the nut 35 are insulators.

  The substrate 10G according to the seventh embodiment of the present invention has a signal wiring 11 including pads to which the signal pins 3 are connected on the front surface layer, a GND plane 12 on the inner layer and / or back layer, and a holding mechanism component 31 with screws 32. And the through hole 38 opened at a position corresponding to the bolt hole 37 opened in the holding mechanism component 31 when the GND conductor plate 6G is firmly pressed against the end surface of the substrate 10G. Have. The holding mechanism component 31 is made of an insulator.

First, one holding mechanism component 31 is positioned on each of the front surface side and the back surface side so that the bolt hole 37 of the holding mechanism component 31 overlaps the through hole 38 of the substrate 10G, and the substrate 10G is lightened by the bolt 34 and the nut 35. tighten.
Next, the holding mechanism component 31 is fixed to the GND conductor plate 6G with screws 32. At this time, when the screw 32 is tightened, the substrate 10G integrated with the holding mechanism component 31 is attracted to the GND conductor plate 6G, and the protrusion 7 bites into the end surface of the substrate 10G.
Next, the signal pin 3 is soldered to the signal wiring 11.

Thereby, the protrusion 7 of the GND conductor plate 6G of the board end coaxial connector 1G is always strongly pressed against the end face of the board 10G, and the relative position between the board 10G and the board end coaxial connector 1G is more firmly fixed. The risk that the pressure that presses the projection 7 of the plate 6G against the end face of the substrate 10G is released is reduced.
Further, since the holding mechanism component 31, the screw 32, the bolt 34, and the nut 35 are insulators, the parasitic capacitance with respect to the signal pin 3 does not increase.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1G and the board end coaxial connector 1G that hardly generates parasitic capacitance and parasitic inductance, and transmission between the board end coaxial connector 1G and the board wiring up to a higher frequency. Is possible.
In addition, after the board end coaxial connector 1G is mounted on the board 10G, this effect continues for a long time.

In the board end coaxial connector 1G according to the seventh embodiment of the present invention, the triangular prism is shown as an example of the structure of the projection having the side with the corner, but it is a thin plate with one side processed into a blade shape. It doesn't matter.
Further, the projection may be a cone-shaped projection structure such as a cone or another polygonal pyramid.
Moreover, it may be needle-shaped.
Further, in the board end coaxial connector 1G according to the seventh embodiment of the present invention, the protrusion 7 is formed directly on the surface of the GND conductor plate 6G of the board end coaxial connector 1G. A protrusion may be provided on the protrusion plate as described above, or only the protrusion may be interposed as in the fourth embodiment of the present invention.

Embodiment 8 FIG.
FIG. 11 is a front view of a GND conductor plate according to Embodiment 8 of the present invention. FIG. 12 is a diagram illustrating a state in which the substrate is pulled toward the GND conductor plate by the holding mechanism. In FIG. 12, the substrate is omitted.
The coaxial connector 1H for board end according to the eighth embodiment of the present invention includes a holding mechanism 30 instead of the GND conductor plate 6H in place of the coaxial connector 1F for board end and the GND conductive plate 6F according to the sixth embodiment of the present invention. However, the other parts are the same, and the same parts are denoted by the same reference numerals and the description thereof is omitted.
In the GND conductor plate 6H, the screw hole 33 through which the screw 32 for fixing the holding mechanism component 31 constituting the holding mechanism 30 to the GND conductor plate 6H passes is outside the region where the projection 7 is provided and inside the GND pin 21. Four are opened.

The holding mechanism 30 includes a holding mechanism component 31 integrated with the GND conductor plate 6H sandwiched between the front surface and the back surface of the substrate, and a bolt that fastens between the holding mechanism component 31 on the front surface side and the holding mechanism component 31 on the back surface side. 34, a nut 35, and a screw 32 that draws the substrate toward the GND conductor plate 6H.
The holding mechanism component 31 is provided with a screw hole 36 into which the screw 32 is screwed and a bolt hole 37 through which the bolt 34 passes. The screw 32, the bolt 34, and the nut 35 are insulators.

  The substrate according to the eighth embodiment of the present invention includes a signal wiring 11 including pads to which signal pins 3 are connected to the front surface layer, a GND plane 12 on the inner layer and the rear surface layer, and a coaxial connector 1H for the substrate end on the front surface layer. When the GND pad 13 to which the GND pin 21 is connected and the holding mechanism component 31 are fixed to the GND conductor plate 6H with the screws 32 and the GND conductor plate 6H is strongly pressed against the end face of the substrate, the holding mechanism component 31 can be opened. And a through hole 38 opened at a position corresponding to the bolt hole 37. The holding mechanism component 31 is made of an insulator.

First, one holding mechanism component 31 is positioned on each of the front surface side and the back surface side so that the bolt hole 37 of the holding mechanism component 31 overlaps the through hole 38 of the substrate, and the substrate is lightly tightened by the bolt 34 and the nut 35.
Next, the holding mechanism component 31 is fixed to the GND conductor plate 6H with screws 32. At this time, when the screw 32 is tightened, the substrate integrated with the holding mechanism component 31 is attracted to the GND conductor plate 6H, and the protrusion 7 bites into the end surface of the substrate.
Next, the signal pin 3 is soldered to the signal wiring 11. Next, the GND pin 21 is soldered to the GND pad 13.

As a result, the projection 7 of the GND conductor plate 6H of the board end coaxial connector 1H is always strongly pressed against the end face of the board, and the relative position between the board and the board end coaxial connector 1H is more firmly fixed. The risk of losing the pressure that presses the projection 7 against the end face of the substrate is reduced.
Further, since the holding mechanism component 31, the screw 32, the bolt 34, and the nut 35 are insulators, the parasitic capacitance with respect to the signal pin 3 does not increase.

With the above structure, it is possible to realize a connection structure between the board wiring coaxial connector 1H and the board end coaxial connector 1H, in which parasitic capacitance and parasitic inductance are unlikely to occur, and transmission between the board end coaxial connector 1H and the board wiring up to a higher frequency. Is possible.
In addition, after the board end coaxial connector 1H is mounted on the board, this effect continues for a long time.

In the substrate end coaxial connector 1H according to the eighth embodiment of the present invention, the triangular prism is shown as an example of the structure of the projection 7 having a corner with a corner, but a thin plate whose one side is processed into a blade shape. It may be in a shape.
Further, the protrusion 7 may be a cone-shaped protrusion structure such as a cone or another polygonal pyramid.
Moreover, it may be needle-shaped.
Further, in the board end coaxial connector 1H according to the eighth embodiment of the present invention, the protrusion 7 is directly formed on the surface of the GND conductor plate 6H of the board end coaxial connector 1H. A protrusion may be provided on the protrusion plate as described above, or only the protrusion may be interposed as in the fourth embodiment of the present invention.

  Further, after the signal pin 3 and the GND pin 21 are soldered to the signal wiring 11 and the GND pad 13, respectively, the holding mechanism component 31, the bolt 34, the nut 35, and the screw 32 may be removed. Since the holding mechanism component 31, the bolt 34, the nut 35, and the screw 32 can be removed as described above, a space around the coaxial connector 1H for the board end can be secured, and a degree of freedom can be given to the design of the board cover (for example, the housing). Can do.

Embodiment 9 FIG.
FIG. 13 is a top view of a substrate on which a substrate end coaxial connector according to Embodiment 9 of the present invention is mounted. In FIG. 13, (b) is a partially enlarged view.
The ninth embodiment of the present invention is the same as the first to eighth embodiments of the present invention until the board end coaxial connector according to the first to eighth embodiments of the present invention is mounted on the board. The difference is that a means for further improving the conduction between the protrusion and the GND plane is added. Only the different parts will be described using the board-end coaxial connector 1 and the board 10 according to the first embodiment of the present invention, but the board-end coaxial connector and board according to the other embodiments 2 to 8 will be described. Even if used, the same effect can be obtained.

In the first embodiment of the present invention, when the GND conductor plate 6 is pressed against the end surface of the substrate 10, the projection 7 is not completely embedded in the end surface of the substrate 10 due to factors such as the hardness of the substrate 10, and is shown in FIG. As described above, there is a gap between the GND conductor plate 6 and the end face of the substrate 10.
In the ninth embodiment of the present invention, the formed gap is filled with solder 39 as a conductor.

As a result, even if the protrusion 7 of the GND conductor plate 6 of the coaxial connector 1 for board end is not partially indented into the substrate 10, the GND plane 12 of the substrate 10 and the GND conductor plate 6 of the coaxial connector 1 for board end are provided. However, the connectivity is improved by the increased conduction due to the solder 39.
With the above structure, even if a gap is generated between the GND plane 12 of the substrate 10 and the projection 7 of the GND conductor plate 6 of the coaxial connector 1 for substrate end, the substrate wiring is less likely to generate parasitic capacitance or parasitic inductance. And the board-end coaxial connector 1 can be connected, and transmission between the board-end coaxial connector 1 and the board wiring can be performed up to a higher frequency.

Embodiment 10 FIG.
FIG. 14 is a top view of the substrate on which the coaxial connector for substrate end according to Embodiment 10 of the present invention is mounted.
The board end coaxial connector 1S according to the tenth embodiment of the present invention is different from the board end coaxial connector 1 according to the first embodiment of the present invention in the projection 7S, and the other portions are the same. The same reference numerals are given and description thereof is omitted.
The protrusion 7S is made of a material different from that of the protrusion 7 according to the first embodiment of the present invention, and the hardness is softer than the hardness of the substrate 10. Therefore, even if the GND conductor plate 6 is strongly pressed against the end face of the substrate 10, the protrusion 7 </ b> S is not embedded in the substrate 10 but is deformed. When deforming, it follows the irregularities of the substrate 10.

Thereby, even if the end surface of the substrate 10 is not a smooth surface, the protrusion 7S enters the recessed portion, and the connectivity between the GND conductor plate 6 of the substrate end coaxial connector 1S and the GND plane 12 of the substrate 10 is improved. .
Further, the deformation of the projection 7S also fills the gap between the projection 7S and the projection 7S, and the connectivity between the GND conductor plate 6 of the board end coaxial connector 1S and the GND plane 12 of the board 10 is further improved.

  Although the tenth embodiment has been described in relation to the first embodiment, the material of the protrusions according to the second to eighth embodiments is embedded in the substrate when the GND conductor plate is strongly pressed against the end surface of the substrate. Even if it is soft and not embedded, the same effects as described above can be obtained.

  1, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1S Coaxial connector for board end, 2 Connector body, 3 Signal pin, 4 Insulator, 5 Cable connection tube, 6, 6C, 6F, 6G, 6H GND Conductor plate, 7, 7B, 7D, 7E, 7S Protrusion, 8 Protrusion plate, 8a hole, 9 Flat plate, 9a hole, 10, 10F, 10G board, 11 Signal wiring, 12 GND plane, 13 GND pad, 21 GND pin, 30 holding mechanism, 31 holding mechanism component, 32 screw, 33 screw hole, 34 bolt, 35 nut, 36 screw hole, 37 bolt hole, 38 through hole, 39 solder.

Claims (12)

The signal wiring is mounted on the surface layer, and the GND plane is mounted on at least one of the inner layer and the back layer. The coaxial cable is connected to the signal wiring and the GND of the coaxial cable is connected to the GND plane. In the coaxial connector for the board end to be connected to
A signal pin connected to the core wire and connected to the signal wiring;
A GND conductor plate connected to the GND and provided with a sharp protrusion toward the end surface of the substrate;
A coaxial connector for board ends, comprising: The signal wiring is mounted on the surface layer, and the GND plane is mounted on at least one of the inner layer and the back layer. The coaxial cable is connected to the signal wiring and the GND of the coaxial cable is connected to the GND plane. In the coaxial connector for the board end to be connected to
A signal pin connected to the core wire and connected to the signal wiring;
A GND conductor plate connected to the GND;
A protrusion plate that is in contact with the surface of the GND conductor plate on the substrate side and is provided with a sharp protrusion toward the end surface of the substrate;
A coaxial connector for board ends, comprising: The signal wiring is mounted on the surface layer, and the GND plane is mounted on at least one of the inner layer and the back layer. The coaxial cable is connected to the signal wiring and the GND of the coaxial cable is connected to the GND plane. In the coaxial connector for the board end to be connected to
A signal pin connected to the core wire and connected to the signal wiring;
A GND conductor plate connected to the GND;
A protrusion having a flat surface facing the substrate-side surface of the GND conductor plate and sharpened toward the end surface of the substrate;
A coaxial connector for board ends, comprising:   4. The projection according to claim 1, wherein the protrusion includes a triangular prism having a triangle in which one side of the cross section is parallel to the end face of the substrate and a point where the other two sides intersect is projected toward the end face of the substrate. The coaxial connector for board | substrate ends as described in any one of these.   2. The projection according to claim 1, wherein the projection is a pyramid having a triangle in which one side of a longitudinal section is parallel to an end surface of the substrate and a point where the other two sides intersect is projected toward the end surface of the substrate. The coaxial connector for board ends according to any one of 3.   6. The board end coaxial connector according to claim 1, wherein the protrusion bites into the board when the GND conductor plate is pressed against an end face of the board.   6. The coaxial connector for a substrate end according to claim 1, wherein the protrusion fills unevenness on the end surface of the substrate when the GND conductor plate is pressed against the end surface of the substrate. 7. The substrate has at least one GND pad formed on at least one of the front surface layer and the back surface layer,
8. The coaxial connector for a substrate end according to claim 1, wherein the GND conductor plate is provided with a GND pin connected to the GND pad. The substrate has at least one GND pad formed on at least one of the front surface layer and the back surface layer,
The coaxial connector for a substrate end according to claim 2, wherein the protruding plate is provided with a GND pin connected to the GND pad. The substrate is provided with a hole penetrating in the thickness direction,
The GND conductor plate is provided with a hole penetrating in a direction toward the end face of the substrate,
A holding mechanism is provided with a hole through which a bolt inserted into the hole of the substrate passes and a screw hole in which a screw passing through the hole of the GND conductor plate is spiraled, and brings the substrate and the GND conductor plate closer when the screw is screwed in The board end coaxial connector according to claim 1, further comprising a component.   A board comprising the board-end coaxial connector according to any one of claims 1 to 10.   The board | substrate of Claim 11 with which a conductor is filled into the clearance gap between the said protrusion and the said end surface when a protrusion is pressed on an end surface.

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