JP2011055083A - Method of manufacturing piezoelectric device, and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which keeps an adhesive strength between integrated circuit elements and lead without using a resin package, and has excellent productivity, and to provide a method of manufacturing the piezoelectric device. <P>SOLUTION: The method of manufacturing the piezoelectric device having a lead formed of a leg part, a mount part and an exterior connection part which are prepared on both ends of the lead, includes: an integrated circuit element mounting step of mounting an integrated circuit element on one main surface of the mount part prepared on the lead; a component element mounting step of mounting a component element on the other main surface of the mount part prepared on the lead; and a resin filling step of injecting a resin between the integrated circuit element mounted on the one main surface of the lead and the component element mounted on the lead, and then hardening the resin. The piezoelectric device manufactured by this method is provided. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric device used in an electronic apparatus and a piezoelectric device.

Conventionally, a piezoelectric device is used as one of electronic components that constitute an electronic device such as a portable communication device or an electronic computer.
Here, as a conventional piezoelectric device, a piezoelectric oscillator and a method for manufacturing the piezoelectric oscillator will be described as an example.

  The piezoelectric oscillator mainly includes, for example, a plurality of leads, an integrated circuit element, a resin package, a piezoelectric vibration element, and a lid member.

  For the lead, a conductive material such as metal is used. In addition, the lead is provided with a leg portion and a mounting portion and an external connection portion at both ends of the leg portion. An integrated circuit element and / or a piezoelectric vibration element, which will be described later, are mounted on the mounting portion with a conductive material. The external connection terminal is used for connection to the outside of the piezoelectric oscillator. Here, the piezoelectric oscillator is provided with, for example, four leads.

  The integrated circuit element is mounted on one main surface of the mounting portion provided on the lead. The integrated circuit element is mounted on the lead by flip chip bonding, for example. Further, the integrated circuit element has a function of an oscillation circuit that controls oscillation output based on a signal of a piezoelectric vibration element to be described later.

The resin package seals the integrated circuit element in a state where the other main surface of the mounting portion provided on the lead and the external connection portion provided on the lead are exposed. This resin package is provided by thermosetting resin being injected into a resin molding die and cured.
That is, the resin package plays a role of improving the adhesive strength between the one main surface of the mounting portion provided on the lead and the integrated circuit element by covering the integrated circuit element mounted on the lead.

The piezoelectric vibration element includes a piezoelectric piece made of a piezoelectric material, excitation electrodes provided on both main surfaces of the piezoelectric piece, one end connected to the excitation electrode, and the other end connected to one end of the piezoelectric piece. It is mainly comprised from the routing electrode located in.
The piezoelectric vibration element is mounted on the other main surface of the mounting portion provided on the lead. Here, the piezoelectric vibration element is mounted on the lead, for example, with the routing electrode and the other main surface of the mounting portion fixed by a conductive adhesive. At this time, the mounting portion is provided so that the lead-out electrode of the piezoelectric vibration element and the two predetermined integrated circuit element terminals are electrically connected.
That is, the piezoelectric vibration element is mounted by being fixed to the other main surface of the mounting portion exposed on one main surface of the resin package by the conductive adhesive.

  The lid member is mainly composed of a lid main body portion provided on a rectangular flat plate and a lid wall portion which is a rectangular flat plate and provided in a frame shape. The lid member is provided with a frame-shaped lid wall at the edge of one main surface of the lid main body, so that a concave portion space for component elements is provided on one main surface. Further, the lid member seals a component element mounted on one main surface of the resin package by joining the lid member and the resin package (see, for example, Patent Document 1).

  Such a method for manufacturing a piezoelectric oscillator mainly includes, for example, an integrated circuit element mounting step, an integrated circuit element sealing step, a piezoelectric vibration element mounting step, and a piezoelectric vibration element sealing step.

  The integrated circuit element mounting step is a step of mounting the integrated circuit element on one main surface of the mounting portion provided on the lead. In other words. In the integrated circuit element mounting step, a predetermined integrated circuit element terminal provided on one main surface of the integrated circuit element and one main surface of the mounting portion provided on a predetermined lead are electrically connected. So that it is fixed and mounted. In the integrated circuit element mounting step, the integrated circuit element is mounted on the lead mounting portion by, for example, flip chip bonding.

The integrated circuit element sealing process mainly includes, for example, a cover forming process and a resin package forming process.
The cover forming step is a step of providing a cover on the other main surface, the leg portion, and the external connection portion of the mounting portion.
The resin package forming step is a step of sealing the integrated circuit element mounted on one main surface of the mounting portion with a resin package. At this time, the cover is provided on the other main surface of the mounting portion, the leg portion, and the external connection portion. In this resin package forming process, the integrated circuit element is mounted by placing a lead on which the integrated circuit element is mounted in a tree mold, injecting a thermosetting resin into the resin mold, and curing the resin. A sealed resin package is provided.
In the integrated circuit element sealing step, by providing a resin package for sealing the integrated circuit element, the adhesive strength between the integrated circuit element and one main surface of the mounting portion provided on the lead can be improved. .

The piezoelectric vibration element mounting step is a step of mounting the piezoelectric vibration element on the other main surface of the mounting portion provided on the lead. Here, in the piezoelectric vibration element mounting step, for example, the routing electrode provided in the piezoelectric vibration element is fixed and mounted on the other main surface of the mounting portion provided in the lead by the conductive adhesive. The mounting portion on which the piezoelectric vibration element is mounted has a structure that is electrically connected to two predetermined integrated circuit element terminals provided in the integrated circuit element.
In the piezoelectric vibration element mounting step, the piezoelectric vibration element is mounted on one main surface of the resin package from which the other main surface of the mounting portion may be exposed.

The piezoelectric vibration element sealing step is a step of hermetically sealing the piezoelectric vibration element mounted on the resin package with a lid member.
The lid member is provided with a component element recess space on one main surface.
In the piezoelectric vibration element sealing step, one main surface of the lid member and one main surface of the resin package are joined together, and the piezoelectric vibration element is hermetically sealed in the recess space for component elements provided in the lid member. Is done.
Here, in the piezoelectric vibration element sealing step, for example, the lid member and the resin package are joined together by a low melting point glass.

Japanese Patent No.

In a conventional method for manufacturing a piezoelectric device, a resin package is provided to seal an integrated circuit element in order to increase the adhesive strength between a lead and the integrated circuit element.
At this time, the resin package is provided so that the other main surface of the mounting portion provided on the lead and the external connection terminal are exposed, but in order to expose the other main surface of the mounting portion and the external connection portion, the mounting portion With the cover provided on the other main surface and the external connection portion, a thermosetting resin is injected into the resin molding die and cured.
In other words, such a conventional method for manufacturing a piezoelectric device requires a cover forming step in order to provide a resin package in a state where the other main surface of the mounting portion, the leg portion, and the external connection end portion are exposed. Accordingly, in such a conventional method for manufacturing a piezoelectric device, the number of steps increases by the amount of the cover forming step, which may reduce the productivity of the piezoelectric device.

In a conventional piezoelectric device, an integrated circuit element mounted on a lead is sealed in a resin package in order to increase the adhesive strength between the lead and the integrated circuit element. That is, in the conventional piezoelectric device, the resin package is provided so as to contact both the main surface and the side surface of the integrated circuit element, thereby fixing the integrated circuit element and increasing the adhesive strength.
Therefore, the conventional piezoelectric device needs to be provided with a resin package in order to increase the adhesive strength between the lead and the integrated circuit element. For this reason, the conventional piezoelectric device requires a step of providing a resin package, and thus the productivity may be deteriorated.

  Accordingly, it is an object of the present invention to provide a piezoelectric device that can maintain the adhesive strength between an integrated circuit element and a lead without using a resin package, and has high productivity, and a method for manufacturing the piezoelectric device.

  In order to solve the above-described problem, the lead is provided with a mounting portion and an external connection portion on both ends of the leg portion, and an integrated circuit element is provided on one main surface of the mounting portion provided on the lead. An integrated circuit element mounting step to be mounted; a component element mounting step in which a component element is mounted on the other main surface of the mounting portion provided on the lead; and the integration mounted on one main surface of the lead. And a resin filling step of pouring and curing resin between the circuit element and the component element mounted on the lead.

  A plurality of leads provided with a mounting portion and an external connection portion at both ends of the leg portion, the integrated circuit element mounted on one main surface of the mounting portion, and the other main portion of the mounting portion; It comprises a component element mounted on a surface and a resin interposed between the component element and the integrated circuit element.

In such a method of manufacturing a piezoelectric device, a resin is poured and cured between an integrated circuit element mounted on a lead and a component element mounted on the lead to increase the adhesive strength between the integrated circuit element and the lead. Raised. That is, such a piezoelectric device manufacturing method can maintain the adhesive strength between the lead and the integrated circuit element without providing a resin package, unlike the conventional piezoelectric device manufacturing method.
For this reason, in such a method for manufacturing a piezoelectric device, it is not necessary to provide a resin package. Therefore, a cover forming step is not required in the integrated circuit element mounting step, and the productivity of the piezoelectric device can be improved.

Such a piezoelectric device is in a state where a resin is interposed between an integrated circuit element mounted on a lead and a component element mounted on the lead. That is, in such a piezoelectric device, the resin interposed between the lead and the integrated circuit element is in a state where the adhesive strength between the lead and the integrated circuit element is increased.
Therefore, such a piezoelectric device can maintain the adhesive strength between the lead and the integrated circuit element without providing a resin package unlike the conventional piezoelectric device, and can improve productivity.

(A) is a conceptual diagram which shows an example of the piezoelectric device which concerns on 1st embodiment of this invention, (b) is AA sectional drawing of Fig.1 (a). It is a disassembled perspective view which shows an example of the piezoelectric device which concerns on 1st embodiment of this invention. It is a disassembled perspective view of the component element used for the piezoelectric device which concerns on 1st embodiment of this invention. It is a perspective view of the lead used for the piezoelectric device concerning a first embodiment of the present invention. It is a perspective view of the integrated circuit element used for the piezoelectric device which concerns on 1st embodiment of this invention. In the piezoelectric device according to the first embodiment of the present invention, it is a conceptual diagram showing an example of a state in which a lead is mounted on an integrated circuit element. In the piezoelectric device which concerns on 1st embodiment of this invention, it is a conceptual diagram which shows an example in the state in which the lead was mounted in the component element. (A) is a conceptual diagram which shows an example of the state before an integrated circuit element mounting process, (b) is a conceptual diagram which shows an example of the state after an integrated circuit element mounting process. (A) is a conceptual diagram which shows an example of the state before a component element mounting process, (b) is a conceptual diagram which shows an example of the state after a component element mounting process. (A) is sectional drawing which shows an example of the state before a resin filling process, (b) is sectional drawing which shows an example of the state after a resin filling process.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

(First embodiment)
The piezoelectric device according to the first embodiment of the present invention will be described. The piezoelectric device will be described as a piezoelectric vibrator.
Fig.1 (a) is a conceptual diagram which shows an example of the piezoelectric device which concerns on 1st embodiment of this invention. FIG.1 (b) is the AA cross section of Fig.1 (a). FIG. 2 is an exploded perspective view showing an example of the piezoelectric device according to the first embodiment of the present invention. FIG. 3 is an exploded perspective view of the component elements used in the piezoelectric device according to the first embodiment of the present invention.
FIG. 4 is an exploded perspective view of component elements used in the piezoelectric device according to the first embodiment of the present invention. FIG. 5 is a perspective view of an integrated circuit element used in the piezoelectric device according to the first embodiment of the present invention.
FIG. 6 is a conceptual diagram showing an example of a state in which a lead is mounted on an integrated circuit element in the piezoelectric device according to the first embodiment of the present invention. FIG. 7 is a conceptual diagram showing an example of a state in which a lead is mounted on a component element in the piezoelectric device according to the first embodiment of the present invention.

  As shown in FIG. 1A, the piezoelectric device 100 according to the first embodiment of the present invention includes a plurality of leads 111, 112, 113, 114, 115, 116, 117, 118, an integrated circuit element 120, The piezoelectric vibrator 130, which is a component element, and the resin J are mainly configured.

  As shown in FIGS. 2 and 3, the piezoelectric vibrator 130, which is a component element, mainly includes a lid member 131, a piezoelectric vibration element 132, and an element mounting member 133.

For example, as shown in FIGS. 2 and 3, the element mounting member 133 is provided on a rectangular flat plate.
As shown in FIG. 3, the element mounting member 133 is provided with two pairs of piezoelectric vibration element mounting pads P on one main surface. As shown in FIG. 2, the element mounting member 133 is provided with a plurality of component element mounting terminals 134 (134a, 134b, 134c, 134d) on the other main surface.

For example, as shown in FIG. 3, two pairs of piezoelectric vibration element mounting pads P are provided on one main surface of the element mounting member 133 side by side on one short side.
In addition, for example, a piezoelectric vibration element 132 described later is mounted on the two pairs of piezoelectric vibration element mounting pads P by being fixed by a conductive adhesive D.

For example, four component element mounting terminals 134 are provided as shown in FIG. The component element mounting terminals 134 are provided one by one at the four corners of the other main surface of the element mounting member 133.
Here, the predetermined two component element mounting terminals 134a and 134b are electrically connected to the two pairs of piezoelectric vibration element mounting pads P described above.
One other predetermined component element mounting terminal 134c is electrically connected to a lid member 131 to be described later, and when connected to the ground, a ground terminal for setting the lid member 131 to be described later to the same potential as the ground. It has the function of.

  For example, as shown in FIGS. 2 and 3, the piezoelectric vibration element 132 mainly includes a piezoelectric piece 132a, an excitation electrode 132b, and a routing electrode 132c.

  As shown in FIGS. 2 and 3, the piezoelectric piece 132a is provided on a rectangular flat plate.

The excitation electrodes 132b are, for example, a pair of two. The excitation electrode 132b is provided on each main surface of the piezoelectric piece 132a.
One excitation electrode 132b is provided at the center of one main surface of the piezoelectric piece 132a. The other excitation electrode 132b is the other main surface of the piezoelectric piece 132a and is provided at a position facing the one excitation electrode 132b.

The routing electrodes 132c are, for example, a pair of two.
One end of the routing electrode 132c is connected to a predetermined excitation electrode 132b. The other end of the routing electrode 132c is the main surface of the piezoelectric piece 132a facing the main surface on which the predetermined excitation electrode 132b is provided, and is positioned on one short side of the piezoelectric piece 132a. Is provided.
That is, one end portion of one routing electrode 132c is connected to one excitation electrode 132b. One lead-out electrode 132c is provided so that the other end is the other main surface of the piezoelectric piece 132a and is located on one short side of the piezoelectric piece 132a.
The other lead-out electrode 132c has one end connected to the other excitation electrode 132b. The other lead-out electrode 132c is provided so that the other end is one main surface of the piezoelectric piece 132a and is located on one short side of the piezoelectric piece 132a.

  The piezoelectric vibration element 132 is mounted with the routing electrode 132c and the piezoelectric vibration element mounting pad P provided on the element mounting member 133 being fixed by, for example, a conductive adhesive D. In other words, the piezoelectric vibration element 132 includes two predetermined pairs of excitation electrodes 132b and two predetermined component element mounting terminals 134a and 134b via the predetermined piezoelectric vibration element mounting pad P and the conductive adhesive D. Electrically connected.

  For example, as shown in FIGS. 2 and 3, the lid member 131 mainly includes a lid body 131a and a lid wall 131b.

  As shown in FIGS. 2 and 3, the lid main body 131 a is provided on a rectangular flat plate.

  As shown in FIG. 2, the lid wall portion 131b is a rectangular flat plate and is provided in a frame shape.

As shown in FIG. 2, the lid member 131 is provided with a frame-shaped lid member 131b on one main surface of the lid body 131a, and a piezoelectric vibration element recess space 131c on one main surface. . The piezoelectric resonator element recess space 131 c has a bottom surface larger than the main surface of the piezoelectric resonator element 132.
As shown in FIG. 3, the lid member 131 has one main surface joined to one main surface of the element mounting member 133 on which the piezoelectric vibration element 132 is mounted by a brazing material RZ. That is, the lid member 131 is joined to the element mounting member 133, and the piezoelectric vibration element 132 is hermetically sealed in the piezoelectric vibration element recess space 131c.

  In the piezoelectric vibrator 130 as a component element, the lid member 131 and the element mounting member 133 are joined to each other, and the piezoelectric vibration element 132 mounted on one main surface of the element mounting member 133 is a piezoelectric vibration element recess space 131c. It is in a state hermetically sealed inside.

The integrated circuit element 120 has a function of an oscillation circuit that controls an oscillation output based on a signal of the piezoelectric vibrator 130 that is a component element.
For example, as shown in FIG. 5, the integrated circuit element 120 has eight integrated circuit element mounting terminals 121 (121a, 121b, 121c, 121d) and 122 (122a, 122b, 122c, 122d) on one main surface. Is provided.

As shown in FIG. 4, four integrated circuit element mounting terminals 121 and 122 are provided side by side along one long side, and four are provided side by side along the other long side. .
Here, as shown in FIG. 5, the first integrated circuit element mounting terminal 121 has four predetermined integrated circuit element mounting terminals provided one by one at four corners of one main surface of the integrated circuit element 120. 121. Further, the second integrated circuit element mounting terminals 122 are predetermined four other integrated circuit element mounting terminals 122 as shown in FIG.

The first integrated circuit element mounting terminal 121 has a function of an external connection terminal of the electronic device 100 according to the first embodiment of the present invention.
Here, the first integrated circuit element mounting terminal 121 a has a function of a power supply voltage terminal for inputting a voltage for operating the integrated circuit element 120.
The first integrated circuit element mounting terminal 121b has a function of an output terminal.
The first integrated circuit element mounting terminal 121c has a function of a ground terminal connected to the ground.

  The two predetermined second integrated circuit element mounting terminals 122a and 122b have a function of a component element signal terminal to which a signal of the piezoelectric vibrator 130 as a component element is input.

For the leads 111, 112, 113, 114, 115, 116, 117, 118, a conductive material such as metal is used.
Also, eight leads 111, 112, 113, 114, 115, 116, 117, 118 are provided, for example, as shown in FIGS.
Here, the predetermined four leads 111, 112, 113, 114 are external connection leads. The other four predetermined leads 115, 116, 117, and 118 are used as component element connection leads.

As shown in FIG. 4, the lead 111 is mainly composed of a leg portion 111a, a mounting portion 111b, and an external connection portion 111c. As shown in FIG. 4, the lead 111 has a structure in which one end portion of the mounting portion 111b is connected to one end portion of the leg portion 111a.
Further, as shown in FIG. 4, the lead 111 is provided so that the other end of the mounting portion 111b is located on the integrated circuit element 120 side.
In addition, as shown in FIG. 6, the lead 111 has a first integrated circuit element mounting terminal 121a having a function of one power surface of the mounting portion 111b and a power supply voltage terminal fixed by a bump B, for example. It is mounted on the integrated circuit element 120.

As shown in FIG. 4, the lead 112 is mainly composed of a leg portion 112a, a mounting portion 112b, and an external connection portion 112c. As shown in FIG. 4, the lead 112 has a structure in which one end portion of the mounting portion 112b is connected to one end portion of the leg portion 112a.
Further, as shown in FIG. 4, the lead 112 is provided so that the other end of the mounting portion 112b is located on the integrated circuit element 120 side.
In addition, as shown in FIG. 6, the lead 112 has one main surface of the mounting portion 112b and a first integrated circuit element mounting terminal 121b having an output terminal function fixed by, for example, bumps B, and integrated. It is mounted on the circuit element 120.

As shown in FIG. 4, the lead 113 is mainly composed of a leg portion 113a, a mounting portion 113b, and an external connection portion 113c. As shown in FIG. 4, the lead 113 has a structure in which one end portion of the mounting portion 113b is connected to one end portion of the leg portion 113a.
Further, as shown in FIG. 4, the lead 113 is provided so that the other end of the mounting portion 113b is positioned on the integrated circuit element 120 side.
Further, as shown in FIG. 6, the lead 113 has a first integrated circuit element mounting terminal 121c having a function of a ground terminal and one main surface of the mounting portion 113b fixed by a bump B, for example. It is mounted on the circuit element 120.

As shown in FIG. 4, the lead 114 is mainly composed of a leg portion 114a, a mounting portion 114b, and an external connection portion 114c. As shown in FIG. 4, the lead 114 has a structure in which one end portion of the mounting portion 114b is connected to one end portion of the leg portion 114a.
Further, as shown in FIG. 4, the lead 114 is provided so that the other end of the mounting portion 114b is positioned on the integrated circuit element 120 side.
As shown in FIG. 6, the lead 114 is mounted on the integrated circuit element 120 by fixing one main surface of the mounting portion 114 b and the first integrated circuit element mounting terminal 121 d by, for example, bumps B. .

  Here, the external connection leads 111, 112, 113, and 114 have a structure provided such that the other ends of the external connection portions 111c, 112c, 113c, and 114c are located on the integrated circuit element 120 side. However, if the external connection leads 111c, 112c, 113c, 114c are connected to the legs 111a, 112a, 113a, 114a, for example, the other ends of the external connection leads 111, 112, 113, 114 are integrated. The structure may be provided so as to be located on the side opposite to the circuit element 120 side.

As shown in FIG. 4, the lead 115 is provided on a flat plate and has a function of a mounting portion and a function of a leg portion. That is, the lead 115 can be regarded as the mounting portion.
Further, as shown in FIG. 6, the lead 115 has one main surface of the lead 115 and a second integrated circuit element mounting terminal 122a having a function of a component element signal terminal fixed by, for example, a bump B. Mounted on the integrated circuit element 120.
In addition, as shown in FIG. 7, the other main surface of the lead 115 and the component element mounting terminal 134a are fixed and mounted by, for example, a conductive adhesive (not shown).
That is, the second integrated circuit element mounting terminal 122 a and the component element mounting terminal 134 a are electrically connected via the lead 115.
Here, the case where the lead 115 is provided on a flat plate is described. However, if the integrated circuit element mounting terminal 122a and the component element mounting terminal 134a can be electrically connected, for example, The lead 115 may have a structure mainly composed of a mounting portion, a leg portion, and an external connection portion.

As shown in FIG. 4, the lead 116 is provided on a flat plate and has a function of a mounting portion and a function of a leg portion. That is, the lead 116 can be regarded as a mounting portion.
Further, as shown in FIG. 6, the lead 116 has one main surface of the lead 116 and a second integrated circuit element mounting terminal 122b having a function of a component element signal terminal fixed by, for example, a bump B. Mounted on the integrated circuit element 120.
As shown in FIG. 7, the other main surface of the lead 116 and the component element mounting terminal 134 b are fixed and mounted with, for example, a conductive adhesive (not shown).
That is, the second integrated circuit element mounting terminal 122 b and the component element mounting terminal 134 b are electrically connected via the lead 115.
Here, the case where the lead 116 is provided on a flat plate is described. However, if the integrated circuit element mounting terminal 122b and the component element mounting terminal 134b can be electrically connected, for example, The lead 116 may have a structure mainly composed of a mounting portion, a leg portion, and an external connection portion.

As shown in FIG. 4, the lead 117 is provided on a flat plate, and integrally has the function of the mounting portion and the function of the leg portion. That is, the lead 117 can be regarded as a mounting portion.
Further, as shown in FIG. 7, the lead 117 has the other main surface and a component element mounting terminal 134c having the function of a ground terminal fixed and mounted by, for example, a conductive adhesive (not shown). ing.
Further, as shown in FIGS. 4 and 6, the lead 117 is connected to a lead 113 having the same ground terminal function as the lead 117.
Here, the lead 117 is connected to the lead 113 having the same function as the ground terminal. However, for example, the lead 117 may be directly connected to the ground as long as it can be connected to the ground.

As shown in FIG. 4, the lead 118 is provided on a flat plate and integrally has the function of the mounting portion and the function of the leg portion. That is, the lead 118 can be regarded as a mounting portion.
As shown in FIG. 6, the integrated circuit element mounting terminals 122 c and 122 d are fixed to the lead 118 by, for example, a conductive adhesive D and mounted on one main surface.
Further, as shown in FIG. 7, the lead 118 has the other main surface and the component element mounting terminal 134d fixed and mounted by, for example, a conductive adhesive (not shown).
That is, the second integrated circuit element mounting terminals 122 c and 122 d and the component element mounting terminal 134 c are electrically connected via the lead 118.
Here, the lead 118 when the second integrated circuit element mounting terminals 122c and 122d have no function is described, but the second integrated circuit element mounting terminals 122c and 122d have a function. In this case, another independent lead may be provided in addition to the lead 118 in accordance with each function.

The leads 111, 112, 113, 114, 115, 116, 117, 118 are mounted on the integrated circuit element mounting terminals 121, 122 provided on the integrated circuit element 120 by bumps B, for example, as shown in FIG. ing.
The lead 111 is mounted on the first integrated circuit element mounting terminal 121a and has a function of a power supply voltage terminal.
The lead 112 is mounted on the first integrated circuit element mounting terminal 121b and has a function of an output terminal.
The lead 113 is mounted on the first integrated circuit element mounting terminal 121c and has a function of a ground terminal.
In addition, the lead 114 is mounted on the first integrated circuit element mounting terminal 121d and performs a function in accordance with the integrated circuit element 120. For example, the lead 114 has a function of a ground terminal. Alternatively, a voltage control terminal function for controlling the voltage applied to the integrated circuit element 120 is provided.
The lead 115 is mounted on the component element mounting terminal 134a and the second integrated circuit element mounting terminal 122a. That is, the second integrated circuit element mounting terminal 122 a having the function of the component element signal terminal and the component element mounting terminal 134 a are electrically connected through the lead 115.
The lead 116 is mounted on the component element mounting terminal 134b and the second integrated circuit element mounting terminal 122b. That is, the second integrated circuit element mounting terminal 122 b having the function of the component element signal terminal and the component element mounting terminal 134 b are electrically connected via the lead 116.
The lead 117 is mounted on the component element mounting terminal 134 and the first integrated circuit element mounting terminal 121c, and has a function of a ground terminal. The lead 117 is connected to the lead 113 having the same ground terminal function.
The lead 118 is mounted on the component element mounting terminal 134d having no function and the second integrated circuit element mounting terminals 122c and 122d having no function. That is, the lead 118 electrically connects the component element mounting terminal 134d having no function and the integrated circuit element mounting terminals 122c and 122d in order to suppress external influences.

As shown in FIGS. 1A and 1B, the resin J is interposed between the piezoelectric vibrator 130, which is a component element, and the integrated circuit element 120, and the integrated circuit element 120 and the leads 111, 112, The adhesive strength with 113, 114, 115, 116, 117, 118 is increased.
Resin J is, for example, an underfill material.
In addition, the resin J is injected between the piezoelectric vibrator 130 which is a component element and the integrated circuit element 120, and the resin J before being cured is cured, whereby the integrated circuit element 120 and the leads 111, 112, 113, Adhesive strength with 114, 115, 116, 117 is increased.
Here, the case where the resin J is interposed only between the one main surface of the integrated circuit element 120 and the piezoelectric vibrator 130 which is a component element is described. However, the integrated circuit element 120 is formed of the resin J It may be covered with.

Such a piezoelectric device 100 according to the first embodiment of the present invention includes the integrated circuit element 120 mounted on the leads 111, 112, 113, 114, 115, 116, 117, 118 and the leads 111, 112, 113, The resin J is interposed between the piezoelectric vibrators 130 which are component elements mounted on 114, 115, 116, 117 and 118. That is, in the piezoelectric device 100 according to the first embodiment of the present invention, the resin J interposed between the leads 111, 112, 113, 114, 115, 116, 117, 118 and the integrated circuit element 120 is The adhesive strength between the leads 111, 112, 113, 114, 115, 116, 117, 118 and the integrated circuit element 120 is increased.
Therefore, the piezoelectric device 100 according to the first embodiment of the present invention includes the leads 111, 112, 113, 114, 115, 116, 117, 118 and the integrated circuit without providing a resin package unlike the conventional piezoelectric device. Since the adhesive strength with the element 129 can be maintained, productivity can be improved.

Next, a method for manufacturing a piezoelectric device according to the first embodiment of the present invention will be described.
The method for manufacturing a piezoelectric device according to the first embodiment of the present invention mainly includes an integrated circuit element mounting step, a component element mounting step, and a resin filling step.
FIG. 8A is a conceptual diagram showing an example of a state before the integrated circuit element mounting process. FIG. 8B is a conceptual diagram showing an example of a state after the integrated circuit element mounting process. Fig.9 (a) is a conceptual diagram which shows an example of the state before a component element mounting process. FIG. 9B is a conceptual diagram showing an example of a state after the component element mounting process. Fig.10 (a) is sectional drawing which shows an example of the state before a resin filling process. FIG.10 (b) is sectional drawing which shows an example of the state after a resin filling process.

(Integrated circuit element mounting process)
As shown in FIG. 8A, the integrated circuit element mounting process includes legs 111a, 112a, 113a, 114a and mounting parts 111b, 112b, 113b, 114b at both ends of the legs 111a, 112a, 113a, 114a. Leads 111, 112, 113, 114 provided with external connection parts 111c, 112c, 113c, 114c, and the mounting parts 111b, 112b, 113b, provided on the leads 111, 112, 113, 114, In this step, the integrated circuit element 120 is mounted on one main surface 114b.
In the integrated circuit element mounting step, as shown in FIG. 8B, for example, bumps B are used for the integrated circuit element mounting terminals 121 and 122 provided in the integrated circuit element 120, and the leads 111, 112, 113, 114, 115, 116, 117, 118 are mounted.
Here, the case where the leads 111, 112, 113, 114, 115, 116, 117, and 118 are mounted on the integrated circuit element mounting terminals 121 and 122 by the bump B has been described. As long as 112, 113, 114, 115, 116, 117, 118 and the predetermined integrated circuit element mounting terminals 121, 122 can be electrically connected, they may be joined by, for example, conductive adhesive D or wire bonding.

Here, as described above, the predetermined four leads 111, 112, 113, 114 are external connection leads. The external connection leads 111, 112, 113, and 114 have the function of the external connection terminal of the piezoelectric device 100 according to the first embodiment of the present invention.
The other four predetermined leads 115, 116, 117, and 118 are used as component element connection leads.

As shown in FIG. 8A, the lead 111 is mainly composed of a leg portion 111a, a mounting portion 111b, and an external connection portion 111c.
Further, as shown in FIG. 8A, the lead 111 has a mounting portion 111b and an external connection portion 111c connected to both ends of the leg portion 111a. The lead 111 has a structure in which one end portion of the mounting portion 111b is connected to the leg portion 111a and the other end portion is positioned on the integrated circuit element 120 side.
Further, as shown in FIG. 8A, the lead 111 is provided at a position facing one main surface of the mounting portion 111 b and the integrated circuit element mounting terminal 121 a provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 111 is fixed and mounted on the integrated circuit element mounting terminal 121a by, for example, bumps B.

As shown in FIG. 8A, the lead 112 mainly includes a leg portion 112a and a mounting portion 112b and an external connection portion 112c.
Further, as shown in FIG. 8A, the lead 112 has a mounting portion 112b and an external connection portion 112c connected to both ends of the leg portion 112a. The lead 112 has a structure in which one end portion of the mounting portion 112b is connected to the leg portion 112a and the other end portion is located on the integrated circuit element 120 side.
Further, as shown in FIG. 8A, the lead 112 is provided at a position facing one main surface of the mounting portion 112b and the integrated circuit element mounting terminal 121b provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 112 is fixed and mounted on the integrated circuit element mounting terminal 121b by, for example, bumps B.

As shown in FIG. 8A, the lead 113 mainly includes a leg portion 113a and a mounting portion 113b and an external connection portion 113c.
Further, as shown in FIG. 8A, the lead 113 has a mounting portion 113b and an external connection portion 113c connected to both ends of the leg portion 113a. The lead 113 has a structure in which one end portion of the mounting portion 113b is connected to the leg portion 113a and the other end portion is positioned on the integrated circuit element 120 side.
Further, as shown in FIG. 8A, the lead 113 is provided at a position facing one main surface of the mounting portion 113 b and the integrated circuit element mounting terminal 121 c provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 113 is fixedly mounted on the integrated circuit element mounting terminal 121c by, for example, bumps B.

As shown in FIG. 8A, the lead 114 mainly includes a leg portion 114a and a mounting portion 114b and an external connection portion 114c.
Further, as shown in FIG. 8A, the lead 114 has a mounting portion 114b and an external connection portion 114c connected to both ends of the leg portion 114a. The lead 114 has a structure in which one end portion of the mounting portion 114b is connected to the leg portion 114a and the other end portion is positioned on the integrated circuit element 120 side.
Further, as shown in FIG. 8A, the lead 114 is provided at a position facing one main surface of the mounting portion 114 b and the integrated circuit element mounting terminal 121 d provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 114 is fixedly mounted on the integrated circuit element mounting terminal 121d by, for example, a bump B.

As shown in FIG. 8A, the lead 115 is provided on a flat plate and has a function of a mounting portion and a function of a leg portion. That is, the lead 115 can be regarded as a mounting portion.
Further, as shown in FIG. 8A, the lead 115 is provided at a position facing one main surface of the lead 115 and the integrated circuit element mounting terminal 122 a provided in the integrated circuit element 120. Further, as shown in FIG. 8B, the lead 115 is fixed and mounted on the integrated circuit element mounting terminal 122a by, for example, bumps B.
The lead 115 serves to electrically connect the component element mounting terminal 134a provided on the piezoelectric vibrator 130, which is a component element, and the integrated circuit element mounting terminal 122a in a component element mounting process described later. Fulfill.

As shown in FIG. 8A, the lead 116 is provided on a flat plate and has a function of a mounting portion and a function of a leg portion. That is, the lead 116 can be regarded as a mounting portion.
Further, as shown in FIG. 8A, the lead 116 is provided at a position facing one main surface of the lead 116 and the integrated circuit element mounting terminal 122b provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 116 is fixedly mounted on the integrated circuit element mounting terminal 122b by, for example, a bump B.
Further, the lead 115 serves to electrically connect the component element mounting terminal 134b and the integrated circuit element mounting terminal 122b provided in the piezoelectric vibrator 130, which is a component element, in a component element mounting process to be described later. Fulfill.

  As shown in FIG. 8A, the lead 117 is provided on a flat plate and connected to the lead 113.

As shown in FIG. 8A, the lead 118 is provided on a flat plate.
Further, as shown in FIG. 8A, the lead 118 is provided at a position facing one main surface of the lead 118 and the integrated circuit element mounting terminals 122 c and 122 d provided in the integrated circuit element 120.
Further, as shown in FIG. 8B, the lead 118 is fixed and mounted on the integrated circuit element mounting terminals 122c and 122d by, for example, bumps B.
The lead 118 electrically connects a component element mounting terminal 134b provided on the piezoelectric vibrator 130, which is a component element, and the integrated circuit element mounting terminals 122c and 122d in a component element mounting process described later. Play a role.

(Component element mounting process)
In the component element mounting step, as shown in FIGS. 9A and 9B, the component element 130 is mounted on the other main surface of the mounting portion provided on the leads 115, 116, 117, and 118. This is a process.

  The component element 130 is, for example, a piezoelectric vibrator. As shown in FIG. 3, the piezoelectric vibrator 130 as a component element seals the piezoelectric vibration element 132, the element mounting member 133 on which the piezoelectric vibration element 132 is mounted, and the piezoelectric vibration element 132 mounted on the element mounting member 133. It is mainly composed of a lid member 131 that stops.

The element mounting member 133 is provided with two pairs of piezoelectric vibration element mounting pads P on one main surface, and one component element mounting terminal 134 at each of the four corners of the other main surface.
The element mounting member 133 is electrically connected to a predetermined piezoelectric vibration element mounting pad P and a predetermined component element mounting terminal 134.

  The piezoelectric vibration element 132 mainly includes a piezoelectric piece 132a formed on a rectangular flat plate, two pairs of excitation electrodes 132b, and two pairs of routing electrodes 132c. In the piezoelectric vibration element 132, two pairs of excitation electrodes 132b are provided on both main surfaces of the piezoelectric piece 132a. In order to vibrate the two pairs of excitation electrodes 132a, one end of the routing electrode 132c is piezoelectric. It is provided so as to be positioned on one short side of the piece 132a.

  The lid member 131 is mainly composed of a lid main body 131a provided on a rectangular flat plate and a rectangular flat plate and a frame-shaped lid wall 131b. That is, the lid member 131 is provided with a frame-shaped lid wall portion 131b on one main surface of the lid body portion 131a, and a piezoelectric vibration element recess space 131c on one main surface.

The piezoelectric vibrator 130 which is a component element has a lead electrode 132c provided on the piezoelectric vibration element 132 on a piezoelectric vibration element mounting pad P provided on one main surface of the element mounting member 133, for example, a conductive adhesive D. It is fixed and mounted by.
In addition, the piezoelectric vibrator 130 which is a component element includes an element mounting member 133 in which the piezoelectric vibration element 132 is mounted on one main surface, and a lid member 131 in which the piezoelectric vibration element recess space 131c is provided on one main surface. Are joined by the brazing material RZ (see FIG. 3). In the piezoelectric vibrator 130 which is a component element, the piezoelectric vibration element 132 is sealed in the piezoelectric vibration element recess space 133c by joining the lid member 131 and the element mounting member 133 to each other.

In the component element mounting step, for example, predetermined component element mounting terminals 134 (134a, 134b, 134) provided on the predetermined leads 115, 116, 117, and 118 and the element mounting member 133 are formed by a conductive adhesive (not shown). 134c, 134d) are fixed and mounted.
As shown in FIG. 9A and FIG. 9B, the component element mounting terminal 134a is provided at a position facing the other main surface of the lead 115, for example, fixed by a conductive adhesive, Installed.
As shown in FIGS. 9A and 9B, the component element mounting terminal 134b is provided at a position facing the other main surface of the lead 116, and is fixed by, for example, a conductive adhesive. Installed.
As shown in FIGS. 9A and 9B, the component element mounting terminal 134c is provided at a position facing the other main surface of the mounting portion 117 of the lead 117. For example, by a conductive adhesive Fixed and mounted.
As shown in FIG. 9A and FIG. 9B, the component element mounting terminal 134d is provided at a position facing the other main surface of the mounting portion 118 of the lead 118. Fixed and mounted.

(Resin filling and mounting process)
In the resin filling step, as shown in FIGS. 10A and 10B, the integrated circuit mounted on one main surface of the leads 111, 112, 113, 114, 115, 116, 117, 118. In this process, resin J is poured between the element 120 and the component element 130 mounted on the leads 115, 116, 117, 118 and cured.

The resin J is, for example, an underfill material. The resin J has a function of being bonded by being cured.
In the resin filling step, the integrated circuit element 120 mounted on one main surface side of the leads 113, 114, and 116 and the piezoelectric vibrator 130 that is a component element on the other main surface side of the leads 113, 114, and 116 are provided. In the meantime, as shown in FIG. 10B, the resin J before being cured is poured, filled, and then cured.
Here, the case where the resin J before being cured is poured between the piezoelectric vibrator 130 as the component element and the integrated circuit element 120 in the resin filling process is described. For example, the integrated circuit element 120 may be covered with the resin J as long as the adhesive strength between the piezoelectric vibrator 130 and the integrated circuit element 120 can be increased.

Such a method of manufacturing a piezoelectric device according to the first embodiment of the present invention includes the integrated circuit element 120 mounted on the leads 111, 112, 113, 114, 115, 116, 117, 118 and the piezoelectric element that is a component element. The adhesive strength between the integrated circuit element 120 and the leads 111, 112, 113, 114, 115, 116, 117, and 118 is increased by pouring and curing the uncured resin J between the vibrator 130. . That is, the method for manufacturing a piezoelectric device according to the first embodiment of the present invention does not provide the resin package as in the conventional method for manufacturing a piezoelectric device, and leads 111, 112, 113, 114, 115, 116, The adhesive strength between 117 and 118 and the integrated circuit element 120 can be maintained.
For this reason, the piezoelectric device manufacturing method according to the first embodiment of the present invention does not require the provision of a resin package. Therefore, the cover forming step is not required in the integrated circuit element mounting step, and the first method of the present invention Productivity of the piezoelectric device 100 according to the embodiment can be improved.

  In addition, in the method of manufacturing the piezoelectric device according to the first embodiment of the present invention, the piezoelectric vibrator 130 as the component element and the leads 115, 116, 117, and 118 are fixed by, for example, a conductive adhesive. Has been installed. Therefore, since the piezoelectric device manufacturing method according to the first embodiment of the present invention can be mounted with only the piezoelectric vibrator 130 which is a non-defective component element in advance, productivity can be improved.

  Here, in the piezoelectric vibrator which is a component element, a piezoelectric vibration element recess space is provided on one main surface of the lid member, and the piezoelectric vibration element is hermetically sealed in the piezoelectric vibration element recess space. However, the piezoelectric vibration element recess space is formed on one main surface of the element mounting member and / or the lid member so that the piezoelectric vibration element can be hermetically sealed between the element mounting member and the lid member. It may be provided on one main surface.

  Although the case where the component element is a piezoelectric vibrator has been described here, for example, a piezoelectric oscillator may be used.

  Although the case where the component element is a piezoelectric vibrator is described here, for example, the piezoelectric vibration element may be made of a piezoelectric material, and the piezoelectric device may be used as a sensor.

DESCRIPTION OF SYMBOLS 100 Piezoelectric device 111,112,113,114 External connection lead 115,116,117,118 Component element connection lead 120 Integrated circuit element 121,122 Integrated circuit element mounting terminal 130 Piezoelectric vibrator 131 Cover member 132 Piezoelectric vibration element 133 Cover member 134 Component element mounting terminal J Resin D Conductive adhesive B Bump

Claims (2)

An integrated circuit element mounting in which a mounting part and an external connection part are provided at both ends of the leg part and the leg part, and the integrated circuit element is mounted on one main surface of the mounting part provided in the lead Process,
A component element mounting step in which a component element is mounted on the other main surface of the mounting portion provided in the lead;
A resin filling step of pouring and curing a resin between the integrated circuit element mounted on one main surface of the lead and the component element mounted on the lead;
A method of manufacturing a piezoelectric device comprising: A plurality of leads provided with mounting portions and external connection portions at both ends of the leg portions and the leg portions;
An integrated circuit element mounted on one main surface of the mounting portion;
A component element mounted on the other main surface of the mounting portion;
A resin interposed between the component element and the integrated circuit element;
A piezoelectric device comprising:

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